Optocoupler circuit model construction method

Abstract

The present invention discloses a method for constructing an optocoupler circuit model. The method for constructing an optocoupler circuit model includes: providing multiple electrical parameters of an optocoupler circuit at multiple temperature values; establishing an optocoupler SPICE model circuit at each temperature value according to the electrical parameters of the optocoupler at each temperature value, thereby generating multiple groups of optocoupler non-temperature-affected SPICE model circuits; utilizing voltage-controlled switches and resistor-temperature characteristics to generate multiple temperature-voltage conversion switch circuit components; and connecting multiple temperature-voltage conversion switch circuit components corresponding to multiple temperature values ​​to multiple groups of non-temperature-affected circuits, respectively, to generate an optocoupler temperature simulation circuit model corresponding to the optocoupler.

Description

Technical Field

[0001] The present invention relates to a method for constructing a SPICE circuit model of an optocoupler with temperature characteristics, and in particular to a method for constructing a SPICE circuit model of an optocoupler for simulating a circuit device in a temperature range. Background Art

[0002] An optocoupler is usually composed of a light source driver chip at the input end, a light source chip and a light detection chip at the output end. The input and output ends are electrically isolated (galvanic isolation), and the input and output ends transmit information through light. Simply put, an optocoupler is a package-level multi-chip optical communication system. In the optocoupler package, there are usually two independent and unconnected metal brackets. The input chip is fixed on the input bracket, and the output chip is fixed on the output bracket. The two brackets are separated by packaging materials and the chip and part of the bracket are enclosed by packaging materials. Because of the special packaging structure of the optocoupler, under the same external environment, the chips on both sides of the optocoupler packaging structure will experience different temperature changes. In addition, the light source chip and the detection chip or driver chip use different semiconductor materials, so that they have different temperature characteristics and temperature coefficients. This makes it difficult to construct an optocoupler SPICE circuit model with temperature characteristics. At present, the optocoupler SPICE circuit model does not take into account the situation where the optocoupler parameters change due to changes in ambient temperature.

[0003] Therefore, providing a method for constructing a circuit device simulation device including temperature factors and a method for constructing an optocoupler SPICE circuit model has become one of the important issues that this business wants to solve. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for constructing an optocoupler circuit model in view of the shortcomings of the prior art, which is applicable to an optocoupler, wherein the optocoupler comprises at least two chips, which are respectively arranged on two brackets, and the two brackets and the two chips respectively arranged on the two brackets are not connected to each other. The method for constructing the optocoupler circuit model comprises: providing multiple electrical parameters of the optocoupler circuit at multiple temperature values, including voltage parameters, current parameters, resistance parameters, time parameters, and other parameters. According to the electrical parameters of the optocoupler at each temperature value, a SPICE model circuit of the optocoupler at each temperature value is established, thereby generating multiple groups of SPICE model circuits of the optocoupler that are not affected by temperature; according to the multiple temperature values, a plurality of temperature-voltage conversion switch circuit components are generated by using voltage-controlled switches and resistance-temperature characteristics, and these temperature-voltage conversion switch circuit components are only turned on at corresponding temperature values ​​and turned off at other temperature values; and the input, output and power supply ends of the SPICE model circuit of the optocoupler that is not affected by temperature at each temperature value are respectively connected in series with one end of a temperature-voltage conversion switch circuit component of the corresponding temperature value. The other ends of the switch circuit components with different temperature values ​​are connected in parallel to generate new input, output and power supply terminals. The input terminal grounds of the SPICE model circuits with different temperature values ​​of the optocoupler that are not affected by temperature are connected in parallel to generate a new input terminal ground, and the output terminal grounds of the SPICE model circuits with different temperature values ​​of the optocoupler that are not affected by temperature are connected in parallel to generate a new output terminal ground, so as to construct a SPICE circuit model of an optocoupler with temperature characteristics.

[0005] Preferably, each optocoupler non-temperature-affected SPICE model circuit at least includes an input terminal, an output terminal, an input ground terminal, an output ground terminal and an output power terminal.

[0006] Preferably, a control positive terminal of the temperature-voltage conversion switch circuit component is connected to a temperature-controlled custom voltage source, and the temperature-controlled custom voltage source is set using an IF conditional statement supported by SPICE. A voltage value output by the temperature-controlled custom voltage source varies according to the temperature. When the temperature-controlled custom voltage source is at a corresponding temperature value, the temperature-controlled custom voltage source outputs a voltage value greater than a constant voltage at a control negative terminal of the temperature-voltage conversion switch circuit component, and the temperature-voltage conversion switch circuit component is turned on. At other temperatures, the temperature-controlled custom voltage source will output a voltage value less than the constant voltage at the control negative terminal of the temperature-voltage conversion switch circuit component, and the temperature-voltage conversion switch circuit component will be turned off.

[0007] Preferably, the temperature-controlled custom voltage source comprises a first voltage source that varies with temperature or a second voltage source that varies with temperature. The first voltage source that varies with temperature comprises a voltage source, a first impedance and a first temperature-controlled impedance, and the voltage source is connected in parallel with the first impedance and the first temperature-controlled impedance that are connected in series; the second voltage source that varies with temperature comprises a current source and a second temperature-controlled impedance, and the current source is connected in parallel with the second temperature-controlled impedance.

[0008] Preferably, when the optocoupler temperature simulation circuit model performs circuit device simulation according to a simulation program, the multiple temperature-voltage conversion switch circuit components of the optocoupler temperature simulation circuit model are turned on or off according to different temperature values ​​to perform circuit device simulation at different temperature values.

[0009] Preferably, each of the non-temperature-affected circuits includes an input-end non-temperature-affected circuit and an output-end non-temperature-affected circuit, and the plurality of temperature-voltage conversion switch circuit components are respectively connected to the input-end non-temperature-affected circuit and the output-end non-temperature-affected circuit.

[0010] One of the beneficial effects of the present invention is that the circuit device simulation device construction method and the optocoupler circuit device simulation construction method provided by the present invention can construct various parameters of the circuit device into a circuit device simulation device and an optocoupler circuit device simulation device including temperature-affected parameters, and can perform full-range temperature simulation on the optocoupler, thereby effectively improving the integrity of the circuit device simulation.

[0011] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 4 is a flow chart of a method for constructing a SPICE circuit model of an optocoupler according to an embodiment of the present invention.

[0013] Figure 2 This is a schematic diagram of the SPICE circuit model decomposition of an optocoupler.

[0014] Figure 3 Schematic diagram of a voltage source that varies with temperature according to an embodiment of the present invention.

[0015] Figure 4 is a schematic diagram of another voltage source that varies with temperature according to an embodiment of the present invention.

[0016] Figure 5Schematic diagram of a temperature-controlled custom voltage source for a temperature value according to an embodiment of the present invention.

[0017] Figure 6 Schematic diagram of a temperature-controlled custom voltage source at another temperature value according to an embodiment of the present invention.

[0018] Figure 7 Schematic diagram of a temperature-controlled custom voltage source at another temperature value according to an embodiment of the present invention.

[0019] Figure 8 Schematic diagram of a SPICE temperature simulation circuit model of an optocoupler according to an embodiment of the present invention. DETAILED DESCRIPTION

[0020] The following is an explanation of the implementation method of the "SPICE circuit model construction method of an optocoupler with temperature characteristics" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0021] [First embodiment]

[0022] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 , Figure 1 4 is a flow chart of a method for constructing a SPICE circuit model of an optocoupler according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the SPICE circuit model decomposition of an optocoupler. Figure 3 FIG. 4 is a schematic diagram of a temperature-dependent voltage source according to a first embodiment of the present invention. Figure 4 is a schematic diagram of another voltage source that varies with temperature according to an embodiment of the present invention. Figure 5 Schematic diagram of the control voltage source of the temperature voltage conversion switch circuit assembly of the first temperature value of the present invention. Figure 1In this embodiment, a circuit device module device construction method is provided, which is applicable to an optocoupler circuit CRT. The optocoupler circuit CRT includes an input end and an output end. The input end of the optocoupler circuit CRT includes a light source driver chip and a light source chip. The output end of the optocoupler circuit CRT includes a light detection chip, and the input end and the output end of the optocoupler circuit CRT are electrically isolated (galvanic isolation). That is, Figure 2 As shown, the non-temperature-affected circuit NH-CRT may include an input non-temperature-affected circuit NH-CRT-1 and an output non-temperature-affected circuit NH-CRT-2. In this embodiment, the pin positions of the electronic components are described according to the markings. If there is no relevant marking, the left end point of the horizontally arranged electronic component is the first end, and the right end point of the horizontally arranged electronic component is the second end.

[0023] The optocoupler circuit model is simulated by a circuit device simulation program installed in a computer device, such as SPICE. That is, in this embodiment, an optocoupler circuit model is constructed by passing actual test parameters of the actual circuit device under multiple temperature values, and then the simulation can be performed in the circuit device simulation program.

[0024] The optocoupler circuit model construction method includes the following steps:

[0025] Providing a plurality of electrical parameters of the optocoupler at a plurality of temperature values, and establishing a plurality of sets of temperature-independent SPICE model circuits of the optocoupler corresponding to the plurality of temperature values ​​according to the plurality of electrical parameters of the optocoupler corresponding to the plurality of temperature values ​​(step S110);

[0026] generating a plurality of temperature-voltage conversion switch circuit components (step S120); and

[0027] The multiple temperature-voltage conversion switch circuit components corresponding to the multiple temperature values ​​are respectively connected to the multiple groups of optocoupler non-temperature-affected SPICE model circuits, and then, the multiple optocoupler non-temperature-affected SPICE model circuits and the multiple temperature-voltage conversion switch circuit components are connected in parallel to generate an optocoupler temperature simulation circuit model corresponding to the optocoupler (step S130).

[0028] In step S110, firstly, various tests are performed on the optocoupler circuit CRT at multiple temperature values ​​to obtain multiple electrical parameters of the optocoupler circuit CRT at multiple temperature values. The electrical parameters include voltage parameters, current parameters, resistance parameters, time parameters and other parameters. Then, according to the electrical parameters of the optocoupler tested at each temperature value, the SPICE model circuit of the optocoupler at each temperature value is established, thereby generating multiple groups of SPICE model circuits of the optocoupler that are not affected by temperature. In this embodiment, it includes a first optocoupler SPICE model circuit NH-CRT1 that is not affected by temperature, a second optocoupler SPICE model circuit NH-CRT2 that is not affected by temperature, and a third optocoupler SPICE model circuit NH-CRT3 that is not affected by temperature. These optocoupler SPICE model circuits NH-CRT1, NH-CRT2, and NH-CRT3 that are not affected by temperature respectively include an input terminal, an output terminal, an input ground terminal, an output ground terminal, and an output power terminal. In this embodiment, the input power terminal is electrically connected to the input terminal.

[0029] That is, the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1 includes a first input terminal INV1, a first output terminal Vo1, a first input ground terminal INGND1, a first output ground terminal OUTGND1, and a first output power terminal Vcc1. The second optocoupler non-temperature-affected SPICE model circuit NH-CRT2 includes a second input terminal INV2, a second output terminal Vo2, a second input ground terminal INGND2, a second output ground terminal OUTGND2, and a second output power terminal Vcc2. The third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 includes a third input terminal INV3, a third output terminal Vo3, a third input ground terminal INGND3, a third output ground terminal OUTGND3, and a third output power terminal Vcc3.

[0030] Further, the first input terminal INV1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second input terminal INV2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third input terminal INV3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are respectively connected to a temperature-voltage conversion switch circuit component, and then connected to an input terminal Vin.

[0031] The first output terminal Vo1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second output terminal Vo2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third output terminal Vo3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are respectively connected to a temperature-voltage conversion switch circuit component and then connected to an output terminal Vo.

[0032] The first input ground terminal INGND1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second input ground terminal INGND2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third input ground terminal INGND3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are connected to each other and to the ground terminal INGND.

[0033] The first output ground terminal OUTGND1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second output ground terminal OUTGND2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third output ground terminal OUTGND3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are connected to each other and to the ground terminal OUTGND.

[0034] The first output terminal Vo1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second output terminal Vo2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third output terminal Vo3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are respectively connected to a temperature-voltage conversion switch circuit component and then connected to an output terminal Vo.

[0035] In addition, the first input terminal INV1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second input terminal INV2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third input terminal INV3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are respectively connected to a temperature-voltage conversion circuit component and then connected to an input power supply Vin. The first output terminal Vo1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1, the second output terminal Vo2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2, and the third output terminal Vo3 of the third optocoupler non-temperature-affected SPICE model circuit NH-CRT3 are similarly respectively connected to a temperature-voltage conversion circuit component and then connected to each other and to an output terminal Vo.

[0036] In step S120, a plurality of temperature-voltage conversion switch circuit components will respectively include a control positive terminal + and a control negative terminal -. The conduction or disconnection of the temperature-voltage conversion switch circuit component is determined by the voltage difference between the control positive terminal + and the control negative terminal -. First, the temperature characteristic of the resistor, as well as the voltage source or the current source, is used to convert the temperature change into a voltage change, and a control voltage source Vtp that changes with the temperature is generated. Then, using the custom voltage source and the IF conditional sentence in the SPICE environment, a temperature-controlled custom voltage source VT corresponding to the aforementioned multiple temperature values ​​{T1, T2, ...TN} is generated, such as a custom voltage source VN40 corresponding to a temperature control of -40 degrees, a custom voltage source V25 corresponding to a temperature control of 25 degrees, and a custom voltage source V125 corresponding to a temperature control of 125 degrees. The control voltage source Vtp is a variable in the IF conditional sentence. Then, the control negative terminal - is connected to a constant voltage Ctrlsw, and there is no specific restriction on the selection of the value of the constant voltage Ctrlsw, such as 2V. The control positive terminal + is connected to the temperature-controlled custom voltage source VT to control the opening and closing of the temperature-voltage conversion switch circuit components together with the control negative terminal -. That is, the multiple temperature-voltage conversion switch circuit components TVC1'-TVC9' mentioned above. By appropriately designing the IF condition of the custom voltage source VT, the custom voltage source VT can be greater than the constant voltage Ctrlsw at a predetermined temperature T, so that the temperature-voltage conversion switch circuit components are turned on. These temperature-voltage conversion switch circuit components are only turned on at the corresponding temperature value and are turned off at other temperature values.

[0037] In step S130, first, each input terminal, output terminal, and output power supply terminal of the non-temperature-affected SPICE model circuit of the optocoupler of each temperature value are respectively connected in series with one end of a temperature-voltage conversion switch circuit component of the corresponding temperature value. That is to say, the input terminal is connected in series with a temperature-voltage conversion switch circuit component, the output terminal is connected in series with a temperature-voltage conversion switch circuit component, and the power supply terminal is connected in series with a temperature-voltage conversion switch circuit component. Then, the other ends of the switch circuit components of different temperature values ​​are connected in parallel to generate new input, output and power supply terminals. The input terminals of the non-temperature-affected SPICE model circuits of the optocouplers with different temperature values ​​are connected in parallel to generate new input terminals, and the output terminals of the non-temperature-affected SPICE model circuits of the optocouplers with different temperature values ​​are connected in parallel to generate new output terminals, so as to construct a SPICE circuit model of an optocoupler with temperature characteristics.

[0038] Each temperature voltage conversion switch circuit component TVC1'-TVC9' has two control terminals: a control positive terminal + and a control negative terminal -. Moreover, each temperature voltage conversion switch circuit component will include a temperature-controlled custom voltage source, such as VN40, V25, V125. The voltage value of the temperature-controlled custom voltage source uses the IF conditional statement supported by SPICE. The voltage value output by the temperature-controlled custom voltage source changes with temperature; at a specific temperature, the temperature-controlled custom voltage source outputs 5V, which is greater than the terminal voltage of the control negative terminal - of the temperature voltage conversion switch circuit component, so that the temperature voltage conversion switch circuit component is turned on; at other temperatures, the temperature-controlled custom voltage source output is set to 0V, which is less than the terminal voltage of the control negative terminal - of the temperature voltage conversion switch circuit component, so that the temperature voltage conversion switch circuit component is turned off.

[0039] The IF conditional statement of each temperature-controlled custom voltage source includes a temperature-controlled voltage source Vtp. The circuit that generates the control voltage source Vtp includes a voltage source Vts, a first impedance R1, and a first temperature-controlled impedance RT1. The first temperature-controlled impedance RT1 may include three parameters. The first parameter is the impedance value, the second parameter is the operating temperature value, and the third parameter is the impedance change rate of the first temperature-controlled impedance as the temperature changes.

[0040] For example Figure 3 The first temperature control impedance RT1 is marked (3k, tc1, 0.01). 3k is the impedance value of 3000 ohms. tc1 is the temperature value at which the first temperature control impedance RT1 starts to operate. 0.01 represents the impedance change rate of the first temperature control impedance RT1 as the temperature rises or falls. Node Vtp1 is the voltage output node.

[0041] See also Figure 3Taking the first temperature-varying voltage source TV1 as an example, the voltage source Vts of the first temperature-varying voltage source TV1 is connected in parallel with the first impedance R1 and the first temperature-regulating impedance RT1 which are connected in series.

[0042] See also Figure 4 The second temperature-dependent voltage source TV2 includes a current source Its and a second temperature-controlled impedance RT2. Taking the second temperature-dependent voltage source TV2 as an example, the current source Its of the second temperature-dependent voltage source TV2 and the second temperature-controlled impedance TR2 are connected in parallel. Among them, the node Vtp2 is the voltage output node. Figure 3 as well as Figure 4 In the embodiment, the node Vtp1 and the node Vtp2 are both nodes of the output control voltage source.

[0043] See also Figure 5 , Figure 6 as well as Figure 7 , Figure 5 Schematic diagram of a temperature-controlled custom voltage source for a temperature value according to an embodiment of the present invention. Figure 6 Schematic diagram of a temperature-controlled custom voltage source at another temperature value according to an embodiment of the present invention. Figure 7 Schematic diagram of a temperature-controlled custom voltage source at another temperature value according to an embodiment of the present invention.

[0044] Figure 5 , Figure 6 as well as Figure 7 The custom voltage sources for temperature control under different temperature conditions in this embodiment are shown respectively. They are custom voltage sources for temperature control when the temperature values ​​are -40 degrees, 25 degrees and 125 degrees. They respectively control the conduction or disconnection of the temperature voltage conversion switch circuit components TVC1, TVC2, TVC3 at -40 degrees; the temperature voltage conversion switch circuit components TVC4, TVC5, TVC6 at 25 degrees and the temperature voltage conversion switch circuit components TVC7, TVC8, TVC9 at 125 degrees.

[0045] Next, the input, output and power supply ends of the non-temperature-affected SPICE model circuit of the optocoupler of each temperature value are respectively connected in series with one end of a temperature-voltage conversion switch circuit component TVC1-TVC9 of the corresponding temperature value. That is to say, a temperature-voltage conversion switch circuit component is connected in series with the input end, a temperature-voltage conversion switch circuit component is connected in series with the output end, and a temperature-voltage conversion switch circuit component is connected in series with the power supply end. Then, the other ends of the switch circuit components of different temperature values ​​are connected in parallel to generate new input, output and power supply ends. The input ends of the non-temperature-affected SPICE model circuits of the optocouplers with different temperature values ​​are connected in parallel to generate a new input end ground, and the output ends of the non-temperature-affected SPICE model circuits of the optocouplers with different temperature values ​​are connected in parallel to generate a new output end ground, so as to construct a SPICE circuit model of an optocoupler with temperature characteristics.

[0046] In step S130, the temperature voltage conversion switch circuit assembly refers to Figure 5 In this embodiment, a plurality of temperature voltage conversion switch circuit components TVC1-TVC9 or a plurality of temperature voltage conversion switch circuit components corresponding to different temperature values ​​are connected to different non-temperature-affected circuit combinations. That is, a plurality of temperature voltage conversion switch circuit components TVC1-TVC9 corresponding to different temperature values ​​can be respectively connected to the two sides of different non-temperature-affected circuits. As previously mentioned, the non-temperature-affected circuit itself will include circuits arranged in different frames, therefore, a plurality of temperature voltage conversion switch circuit components TVC1-TVC9 corresponding to different temperature values ​​will be respectively connected to the two sides of the non-temperature-affected circuit. Among them, the optocoupler non-temperature-affected circuit includes a first-side non-temperature-affected circuit and a second-side non-temperature-affected circuit. In other embodiments, temperature current conversion switch components corresponding to more temperature values ​​can be used to combine into multiple groups of temperature simulation circuits.

[0047] The second end of the first temperature-voltage conversion switch circuit component TVC1 is connected to the first input end INV1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1. The first end of the first temperature-voltage conversion switch circuit component TVC1 is connected to the first end of the fourth temperature-voltage conversion switch circuit component TVC4 and the first end of the seventh temperature-voltage conversion switch circuit component TVC7.

[0048] The first end of the second temperature-voltage conversion switch circuit component TVC2 is connected to the first output power supply terminal VCC1 of the first optocoupler non-temperature-affected SPICE model circuit NH-CRT1. The second end of the second temperature-voltage conversion switch circuit component TVC2, the second end of the fifth temperature-voltage conversion switch circuit component TVC5, and the second end of the eighth temperature-voltage conversion switch circuit component TVC8 are further connected to a voltage source Vcc.

[0049] The first end of the third temperature-voltage conversion switch circuit component TVC3 is connected to the first output end Vo1 of the first optical coupler non-temperature-affected SPICE model circuit NH-CRT1. The second end of the third temperature-voltage conversion switch circuit component TVC3 is connected to the second end of the sixth temperature-voltage conversion switch circuit component TVC6 and the second end of the ninth temperature-voltage conversion switch circuit component TVC9.

[0050] The second end of the fourth temperature-voltage conversion switch circuit component TVC4 is connected to the second input end INV2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2. The second end of the fifth temperature-voltage conversion switch circuit component TVC5 is connected to the second output power supply end Vcc2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2. The first end of the sixth temperature-voltage conversion switch circuit component TVC6 is connected to the second output end Vo2 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT2.

[0051] The second end of the seventh temperature voltage conversion switch circuit component TVC7 is connected to the second input end INV3 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT3. The second end of the eighth temperature voltage conversion switch circuit component TVC8 is connected to the second output power supply end VCC3 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT3. The first end of the ninth temperature voltage conversion switch circuit component TVC9 is connected to the second output end Vo3 of the second optocoupler non-temperature-affected SPICE model circuit NH-CRT3.

[0052] In other embodiments, a plurality of temperature-voltage conversion switch circuit components TVC1 - TVC9 corresponding to different temperature values ​​may be connected to the same non-temperature-affecting circuit NH-CRT1 - NH-CRT3 .

[0053] Since in this embodiment, the temperature-affecting circuit device is converted into a plurality of temperature-voltage conversion switch circuit components TVC1-TVC9 corresponding to a plurality of temperature values, the plurality of temperature-voltage conversion switch circuit components TVC1-TVC9 corresponding to different temperature values ​​are respectively turned on at different temperature values ​​for operation. For example, when the temperature value is -40 degrees, the temperature-voltage conversion switch circuit components TVC1-TVC3 are turned on. The other temperature-voltage conversion switch circuit components TVC4-TVC9 are turned off.

[0054] In other words, the temperature-voltage conversion switch circuit component TVC1 corresponding to the first temperature value will be turned on at the first temperature value, and the temperature-voltage conversion switch circuit component TVC1 or the temperature-current conversion switch component TCC1 corresponding to the first temperature value will be turned off at other temperature values.

[0055] That is, when the temperature simulation circuit TCRT performs circuit device simulation according to a simulation program, multiple temperature voltage conversion switch circuit components TVC1-TVC3 or multiple temperature current conversion switch components of the temperature simulation circuit TCRT are opened or closed according to different temperature values ​​to perform circuit device simulation at different temperature values.

[0056] When simulating the circuit device, the temperature simulation circuit TCRT1 corresponding to the temperature value of -40 degrees will be turned on at the temperature value of -40 degrees.

[0057] When simulating the circuit device, the temperature simulation circuit TCRT2 corresponding to the temperature value of 25 degrees will be turned on at the temperature value of 25 degrees.

[0058] When simulating the circuit device, the temperature simulation circuit TCRT3 corresponding to the temperature value of 125 degrees will be turned on at the temperature value of 125 degrees.

[0059] In this embodiment, only three temperature simulation circuits are listed. In practice, when constructing a simulation circuit device, a temperature simulation circuit can be constructed every 20 degrees, or even every 5 degrees, to improve the simulation result of the temperature effect when simulating the circuit device. For the various parameter values ​​between different temperature values, the interpolation method can be used to perform proportional calculation to complete the calculation.

[0060] See also Figure 8 , Figure 8 is another schematic diagram of the optocoupler temperature circuit model according to an embodiment of the present invention.

[0061] According to the above steps, we can get Figure 8 The optocoupler temperature simulation circuit model LC-TCRT includes three optocoupler non-temperature-affecting circuits LC1-LC3. The primary side of the first optocoupler non-temperature-affecting circuit LC1 is electrically connected to a first temperature-voltage conversion switch circuit component TVC1. The two connection ends of the secondary side of the first optocoupler non-temperature-affecting circuit LC1 are electrically connected to a second temperature-voltage conversion switch circuit component TVC2 and a third temperature-voltage conversion switch circuit component TVC3'.

[0062] Similarly, the primary side of the second non-temperature-affected circuit LC2 of the optocoupler is electrically connected to a fourth temperature-voltage conversion switch circuit component TVC4'. The two connection ends of the secondary side of the second non-temperature-affected circuit combination LC2 of the optocoupler are electrically connected to a fifth temperature-voltage conversion switch circuit component TVC5' and a sixth temperature-voltage conversion switch circuit component TVC6'. The primary side of the third non-temperature-affected circuit combination LC3 of the optocoupler is electrically connected to a seventh temperature-voltage conversion switch circuit component TVC7'. The two connection ends of the secondary side of the first non-temperature-affected circuit LC3 of the optocoupler are electrically connected to an eighth temperature-voltage conversion switch circuit component TVC8' and a ninth temperature-voltage conversion switch circuit component TVC9'.

[0063] In this embodiment, the first temperature-voltage conversion switch circuit component TVC1 ′, the second temperature-voltage conversion switch circuit component TVC2 ′ and the third temperature-voltage conversion switch circuit component TVC3 ′ operate at a temperature value of −40 degrees.

[0064] The fourth temperature-voltage conversion switch circuit component TVC4', the fifth temperature-voltage conversion switch circuit component TVC5' and the sixth temperature-voltage conversion switch circuit component TVC6' operate at a temperature value of 25 degrees.

[0065] The seventh temperature-voltage conversion switch circuit component TVC7', the eighth temperature-voltage conversion switch circuit component TVC8' and the ninth temperature-voltage conversion switch circuit component TVC9' operate at a temperature value of 125 degrees.

[0066] When performing a temperature sweep simulation, the temperature sweep command of the SPICE software will increase or decrease the ambient temperature or the temperature of the optocoupler. When the temperature value rises to the opening temperature value of each temperature-voltage conversion switch circuit component, such as during initial operation, the first optocoupler temperature simulation circuit TCRT1' composed of the first temperature-voltage conversion switch circuit component TVC1', the second temperature-voltage conversion switch circuit component TVC2' and the third temperature-voltage conversion switch circuit component TVC3' will be activated, and the first non-temperature-affected circuit device LC1 of the optocoupler is used in combination with the first temperature-voltage conversion switch circuit component TVC1', the second temperature-voltage conversion switch circuit component TVC2' and the third temperature-voltage conversion switch circuit component TVC3' to perform circuit device simulation.

[0067] When the temperature value reaches 25 degrees, the second optocoupler temperature simulation circuit TCRT2' composed of the fourth temperature-voltage conversion switch circuit component TVC4', the fifth temperature-voltage conversion switch circuit component TVC5' and the sixth temperature-voltage conversion switch circuit component TVC6' will be activated, and the circuit device simulation will be performed by the second non-temperature-affecting circuit LC2 of the optocoupler in combination with the fourth temperature-voltage conversion switch circuit component TVC4', the fifth temperature-voltage conversion switch circuit component TVC5' and the sixth temperature-voltage conversion switch circuit component TVC6'.

[0068] When the temperature value reaches 125 degrees, the third optical coupler temperature simulation circuit TCRT3' composed of the seventh temperature-voltage conversion switch circuit component TVC7', the eighth temperature-voltage conversion switch circuit component TVC8' and the ninth temperature-voltage conversion switch circuit component TVC9' will be activated, and the third non-temperature-affecting circuit LC3 of the optical coupler will be used in combination with the seventh temperature-voltage conversion switch circuit component TVC7', the eighth temperature-voltage conversion switch circuit component TVC8' and the ninth temperature-voltage conversion switch circuit component TVC9' to perform circuit device simulation.

[0069] For each parameter between different temperature values, the interpolation method can be used to perform proportional calculation to complete the calculation. In this embodiment, the input end and the output end of each optocoupler temperature simulation circuit are connected with a certain number of temperature voltage conversion switch circuit components. That is, the input end and the output end of the non-temperature-affecting circuit are respectively connected with different temperature voltage conversion switch circuit components or temperature current conversion switch components.

[0070] [Beneficial Effects of Embodiments]

[0071] One of the beneficial effects of the present invention is that the circuit device simulation device construction method and the optocoupler circuit device simulation construction method provided by the present invention can construct various parameters of the circuit device into a circuit device simulation device and an optocoupler circuit device simulation device including temperature-affected parameters, and can perform full-range temperature simulation on the optocoupler, thereby effectively improving the integrity of the circuit device simulation.

[0072] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the claims of the present invention.

Claims

1. A method for constructing an optocoupler circuit model, applicable to an optocoupler, wherein the optocoupler comprises at least two chips, which are respectively arranged on two brackets, and the two brackets and the two chips respectively arranged on the two brackets are not connected to each other, characterized in that: The optocoupler circuit model construction method comprises: Providing multiple electrical parameters of the optocoupler circuit at multiple temperature values, including voltage parameters, current parameters, resistance parameters or time parameters, and establishing a SPICE model circuit of the optocoupler at each temperature value according to the electrical parameters of the optocoupler at each temperature value, thereby generating multiple groups of SPICE model circuits of the optocoupler that are not affected by temperature; According to the plurality of temperature values, using voltage-controlled switches and resistance-temperature characteristics, a plurality of temperature-voltage conversion switch circuit components are generated, wherein the temperature-voltage conversion switch circuit components are only turned on at corresponding temperature values ​​and are turned off at other temperature values; and The input end of the non-temperature-affected SPICE model circuit of the optocoupler of each temperature value is respectively connected in series with one end of a temperature-voltage conversion switch circuit component of the corresponding temperature value, the output end of the non-temperature-affected SPICE model circuit of the optocoupler of each temperature value is respectively connected in series with one end of a temperature-voltage conversion switch circuit component of the corresponding temperature value, the power supply end of the non-temperature-affected SPICE model circuit of the optocoupler of each temperature value is respectively connected in series with one end of a temperature-voltage conversion switch circuit component of the corresponding temperature value, and the other ends of the switch circuit components of different temperature values ​​connected to the input end of the non-temperature-affected SPICE model circuit of the optocoupler are connected in parallel to generate A new input terminal is provided, the other terminals of the switch circuit components with different temperature values ​​connected to the output terminal of the SPICE model circuit of the optocoupler without temperature influence are connected in parallel to generate a new output terminal, and the other terminals of the switch circuit components with different temperature values ​​connected to the power terminal of the SPICE model circuit of the optocoupler without temperature influence are connected in parallel to generate a new power terminal, the input terminal grounds of the SPICE model circuit of the optocoupler without temperature influence with different temperature values ​​are connected in parallel to generate a new input terminal ground, and the output terminal grounds of the SPICE model circuit of the optocoupler without temperature influence with different temperature values ​​are connected in parallel to generate a new output terminal ground, so as to construct a SPICE circuit model of an optocoupler with temperature characteristics.

2. The method for constructing an optocoupler circuit model according to claim 1, wherein: Each optocoupler non-temperature-affected SPICE model circuit at least includes an input terminal, an output terminal, an input ground terminal, an output ground terminal and an output power terminal.

3. The method for constructing an optocoupler circuit model as claimed in claim 1, wherein: A control positive terminal of the temperature-voltage conversion switch circuit component is connected to a temperature-controlled custom voltage source. The temperature-controlled custom voltage source is set using the IF conditional statement supported by SPICE. A voltage value output by the temperature-controlled custom voltage source varies according to the temperature. When the temperature-controlled custom voltage source is at a corresponding temperature value, the temperature-controlled custom voltage source outputs a voltage value greater than a constant voltage at a control negative terminal of the temperature-voltage conversion switch circuit component, and the temperature-voltage conversion switch circuit component is turned on. At other temperatures, the temperature-controlled custom voltage source will output a voltage value less than the constant voltage at the control negative terminal of the temperature-voltage conversion switch circuit component, and the temperature-voltage conversion switch circuit component will be turned off.

4. The method for constructing an optocoupler circuit model as claimed in claim 3, wherein: The temperature-controlled custom voltage source includes a first temperature-varying voltage source or a second temperature-varying voltage source, the first temperature-varying voltage source includes a voltage source, a first impedance and a first temperature-regulating impedance, the voltage source is connected in parallel with the first impedance and the first temperature-regulating impedance connected in series; the second temperature-varying voltage source includes a current source and a second temperature-regulating impedance, the current source and the second temperature-regulating impedance are connected in parallel.

5. The method for constructing an optocoupler circuit model as claimed in claim 4, wherein: When the SPICE circuit model of the optocoupler with temperature characteristics performs circuit device simulation according to a simulation program, the multiple temperature-voltage conversion switch circuit components of the SPICE circuit model of the optocoupler with temperature characteristics are turned on or off according to different temperature values ​​to perform circuit device simulation at different temperature values.

6. The method for constructing an optocoupler circuit model as claimed in claim 5, wherein: Each of the optocoupler non-temperature-affected SPICE model circuits includes an input non-temperature-affected circuit and an output non-temperature-affected circuit, and the plurality of temperature-voltage conversion switch circuit components are respectively connected to the input non-temperature-affected circuit and the output non-temperature-affected circuit.

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