optoelectronic devices

Abstract

Embodiments of the present disclosure relate to optoelectronic devices. An optoelectronic component is located in a package. The package includes a first optical block and a second optical block attached to each other via a bonding layer. One of the first and second optical blocks is connected to a sidewall of the package via glue. The bonding layer is constructed of a material that causes less stress on the first and second optical blocks than glue.

Description

[0001] Priority claim

[0002] This application claims priority from French patent application No. 2013740, filed on December 18, 2020, the contents of which are incorporated herein by reference in their entirety to the maximum extent permitted by law. Technical Field

[0003] The present disclosure relates generally to optoelectronic devices and, more particularly, to devices including optical diffusers and filters. Background Art

[0004] Optoelectronic devices are known that include an optical diffuser and filter assembly, located opposite a light emitter or detector. An optical diffuser is an optical block configured to modify light, for example by diffusing or polarizing it. A filter is an optical block that provides a way to divide light rays without otherwise affecting their propagation.

[0005] There is a need in the art to overcome all or some of the disadvantages of known devices including optical diffusers and filters. Summary of the Invention

[0006] One embodiment provides a device including an optoelectronic element in a package, the package including a first optical block and a second optical block attached to each other by a bonding element, one of the first and second optical blocks being attached to a sidewall of the package by glue, the bonding element being made of a material such that the bonding element induces less stress than glue during its transition to a solid state.

[0007] Another embodiment provides a method of manufacturing a device, the device including an optoelectronic component located in a package, the method including attaching a first optical block of the package and a second optical block of the package to each other via a bonding element, one of the first optical block and the second optical block being attached to a sidewall of the package via glue, the bonding element being made of a material such that the bonding element causes less stress than the glue when it transitions to a solid state.

[0008] According to one embodiment, the first optical block is an optical diffuser.

[0009] According to one embodiment, the first optical block is a planar chip configured to perform an optical function, such as diffusion, polarization or focusing of light passing through it.

[0010] According to one embodiment, the second optical block comprises at least one optical filter.

[0011] According to one embodiment, the coupling element is made of resin.

[0012] According to one embodiment, the bonding element is made of a material having a linear expansion coefficient in the range of 150 ppm / K to 200 ppm / K.

[0013] According to one embodiment, a sidewall includes a vertical portion and a horizontal portion extending from the vertical portion, one of the first optical block and the second optical block is located on the sidewall, the sidewall is located on the horizontal portion, and the horizontal portion surrounds an opening positioned opposite at least a portion of the optoelectronic component.

[0014] According to one embodiment, the first optical block is located on the horizontal portion and the second optical block is located on the opening.

[0015] According to one embodiment, the bonding element completely covers the surface of the first optical block.

[0016] According to one embodiment, the bonding element completely covers the surface of the second optical block.

[0017] According to one embodiment, the first optical block is separated from the glue by a bonding element.

[0018] According to one embodiment, the bonding element partially covers a surface of the second optical block.

[0019] According to one embodiment, the horizontal dimension of the first optical block is greater than the horizontal dimension of the second optical block, the second optical block being surrounded by elements located on the horizontal portion of the side wall.

[0020] According to one embodiment, the horizontal dimension of the first optical block is substantially equal to the horizontal dimension of the second optical block, the second optical block being located on the horizontal portion of the side wall. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The foregoing features and advantages and other features and advantages will be presented by way of illustration and not limitation in the following description of specific embodiments with reference to the accompanying drawings, in which:

[0022] Figure 1 An embodiment of an optoelectronic device is shown;

[0023] Figure 2 Shows the manufacturing Figure 1 The method of the embodiment;

[0024] Figure 3 Another embodiment of an optoelectronic device is shown; and

[0025] Figure 4 Another embodiment of an optoelectronic component is shown. DETAILED DESCRIPTION

[0026] In the various drawings, the same features are represented by the same reference numerals. In particular, common structural and / or functional features in various embodiments may have the same reference numerals and may be provided with the same structure, dimensions, and material properties.

[0027] For clarity, only the steps and elements that are useful for understanding the embodiments described herein are shown and described in detail.

[0028] Unless otherwise stated, when two elements are referred to as being connected together, this means a direct connection without any intervening elements other than conductors, and when two elements are referred to as being connected together, this means the two elements may be connected or they may be coupled via one or more other elements.

[0029] In the following disclosure, unless otherwise stated, when absolute position qualifiers are mentioned, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative position qualifiers are mentioned, such as the terms "on", "below", "upper", "lower", etc., or orientation qualifiers are mentioned, such as "horizontal", "vertical", etc., it refers to the orientation shown in the figures.

[0030] Unless otherwise indicated, the expressions "about," "approximately," "substantially," and "on the order of" mean within 10%, preferably within 5%.

[0031] Figure 1 An exemplary embodiment of an optoelectronic component 10 is shown.

[0032] Device 10 includes an integrated circuit chip 12. Chip 12 is an optoelectronic device, that is, an electronic component that emits light or interacts with light. For example, chip 12 includes a light emitter and / or a light detector.

[0033] The chip 12 is located in the package. The package includes a support 14. The chip 12 is located on the support 14. The chip is attached to the upper surface of the support 14 using, for example, a bonding layer (such as a glue layer or a metal solder layer).

[0034] Support 14 may include, for example, one or more insulating layers. For example, support 14 may include conductive tracks and conductive vias. In particular, support 14 may include conductive tracks 16 coupled to conductive pads 20 of the chip, for example, via cables 18. Thus, chip 12 may be electrically coupled to support 12 via pads 20, cables 18, and tracks 16.

[0035] The package of device 10 further includes sidewalls 22. Walls 22 are preferably located on support 14. Sidewalls 22 preferably extend continuously around chip 12 and preferably around pads 16. Walls 22 include vertical portions 22a and horizontal portions 22b.

[0036] The portion 22a extends from the support 14. The portion 22a preferably extends in a direction normal to the upper surface of the support 14.

[0037] Portion 22b extends from portion 22a. Portion 22b extends toward chip 12, that is, toward the center of the ring formed by portion 22a. Therefore, portion 22b extends from the surface of portion 22b closest to chip 12. Preferably, portion 22a extends above and below portion 22b. In other words, portion 22a preferably extends from portion 22b in two directions. Portion 22b is positioned at a height greater than the chip height. In other words, the distance between the lower surface of portion 22b (that is, the surface closest to the support member) and the upper surface of support member 14 is greater than the chip height (that is, thickness), more precisely, greater than the distance between the upper surface of chip 12 and the upper surface of support member 14.

[0038] The portion 22b preferably forms a ring extending inside the ring formed by the portion 22a. Thus, the portion 22b forms an opening 24 at the center of the ring formed by the portion 22b. As a variant, the portion 22b extends on both surfaces of the portion 22a, preferably on opposite surfaces.

[0039] The material of the wall 22 is at least partially opaque, preferably at least partially opaque to the wavelengths emitted by the chip 12 or received by the chip 12. Preferably, the material of the wall 22 is completely opaque.

[0040] Opening 24 is positioned opposite a portion of chip 12. More specifically, opening 24 is located opposite a portion of the chip that is configured to emit or receive light.

[0041] The device 10 also includes a first optical block 26 and a second optical block 28 .

[0042] Optical block 26 includes an optical diffuser. Optical block 26 is a planar chip that performs an optical function, such as diffusing, polarizing, or focusing the light passing through it. For example, optical block 26 includes a preferably planar body onto which various layers of antireflector material, and possibly other diffuser layers, have been grown. For example, optical block 26 is formed from a preferably planar body onto which various layers of material, such as the antireflector and possibly other diffuser layers, have been grown. The body is preferably made of glass. Preferably, the antireflective material layers are formed from multiple thin layers deposited on both sides of the glass body. For example, at least one layer is a lens. For example, at least one layer is a diffuser layer. For example, at least one layer is a polarizer layer.

[0043] For example, the optical block 28 comprises, and is preferably formed of, one or more optical filters, ie, one or more layers made of a material that allows certain wavelengths to pass through and blocks other wavelengths.

[0044] Optical blocks 26 and 28 are attached to each other by bonding layer 30 to form an optical assembly. Bonding layer 30 is thus in contact with the lower surface of optical block 26 and the upper surface of optical block 28. More precisely, the lower surface of optical block 26 is attached to the upper surface of optical block 28 by bonding layer 30. Bonding layer 30 is thus in contact with the lower surface of optical block 26 and the upper surface of optical block 28. Thus, optical blocks 26 and 28 are completely separated from each other by layer 30. Layer 30 is made of a material that is at least partially transparent, in particular, at least partially transparent to wavelengths emitted by chip 12 after the light has passed through optical filter 28 or to wavelengths received by chip 12 before passing through optical filter 28.

[0045] Layer 30 is preferably made of a single material. The material of layer 30 is preferably homogeneous. The material of layer 30 is a low-deformation material. In other words, the material of layer 30 deforms very little during its solid state. The material of layer 30 may, for example, have a viscosity in the range of 400 mPa.s to 500 mPa.s, for example, substantially equal to 450 mPa.s. For example, the material of layer 30 may have a Young's modulus in the range of 2800 MPa to 3200 MPa, for example, substantially equal to 3000 MPa. For example, the coefficient of linear expansion of the material of layer 30 may be in the range of 150 ppm / K to 200 ppm / K, for example, substantially equal to 173 ppm / K. The material of layer 30 is a resin, such as the resin known under the trade name "DELO KATIOBOND VE 128725," or a resin having similar properties.

[0046] Optical blocks 26 and 28 can optionally be attached to each other with a glue layer when forming the optical assembly. However, glue is typically a material that induces significant stress, particularly during drying. When the glue comes into contact with optical block 26, this stress can deform the layers of optical block 26 and alter the properties of optical block 26 in unpredictable ways. The material of layer 30 is therefore selected so that it induces less significant stress than glue during its transition to a solid state.

[0047] The horizontal dimension of layer 30 (ie, in a plane substantially parallel to the upper surface of support 14) is preferably substantially equal to the horizontal dimension of optical block 26. Thus, the lower surface of optical block 26 is preferably completely covered by layer 30.

[0048] At least one horizontal dimension, and preferably all horizontal dimensions, of optical block 28 is smaller than a dimension of optical block 26. Thus, optical block 28 is positioned opposite a portion of optical block 26, preferably at the center or interior of optical block 26. Thus, peripheral portions of optical block 26 are not opposite optical block 28.

[0049] An assembly comprising optical blocks 26 and 28 and layer 30 is attached to sidewall 22 to close opening 24. Optical block 28 is positioned within opening 24. Preferably, optical block 28 does not contact chip 12. Optical block 26 and layer 30 are positioned on portion 22b of sidewall 22. The dimensions of optical block 28 are therefore selected to enable it to be positioned within opening 24. Thus, the horizontal dimension of optical block 28 is smaller than the dimension of opening 24. The horizontal dimension of optical block 26 is larger than the horizontal dimension of opening 24. Preferably, portion 22a extends around optical block 26. Thus, the distance between the upper surface of portion 22a and the upper surface of support 14 is greater than the distance between the upper surface of optical block 26 and the upper surface of support 14.

[0050] The portion of layer 30 not covered by optical block 28 is separated from portion 22b by glue layer 32. Furthermore, the sidewalls of optical block 28 are preferably separated from portion 22b by glue layer 32. Preferably, glue layer 32 does not extend over the sidewalls of optical block 26. Therefore, optical block 26 does not contact glue layer 32.

[0051] Opening 24 is thus closed by optical block 28 and glue 32. Glue 32 is at least partially opaque, preferably at least partially opaque to wavelengths emitted by chip 12 or received by chip 12 before passing through optical block 28. Preferably, glue 32 is completely opaque. Thus, light can only enter or leave the package through optical block 28.

[0052] The package surrounding the chip 12 thus comprises the support 14 , the wall 22 , the assembly comprising the optical blocks 26 and 28 , the layer 30 and the glue layer 32 .

[0053] As a variant, the horizontal dimension of layer 30 can be substantially equal to the horizontal dimension of optical block 28. Thus, layer 30 completely covers the upper surface of optical block 28 and partially covers the lower surface of optical block 26. A peripheral portion of the lower surface of optical block 26 rests on portion 22b. This peripheral portion is then directly attached to portion 22b via glue 32. The contact between optical block 26 and the glue can induce stress in the peripheral portion of optical block 26 and, therefore, deformation of optical block 26. However, this deformation does not significantly extend to the center of optical block 26, i.e., to the portion of optical block 26 located opposite chip 12, i.e., the portion through which most light passes.

[0054] Figure 2 Shows the manufacturing Figure 1 More precisely, Figure 2 A method of fabricating multiple devices 10 simultaneously is shown.

[0055] During a first step 40 (forming the optical block), the optical block 26 is formed. This step preferably comprises depositing and processing layers having optical properties on a core (e.g., a glass core). Preferably, a plate comprising a plurality of optical blocks 26 is manufactured by depositing and processing different layers over an entire wafer.

[0056] During step 41 (deposition of resin), a layer made of the material of layer 30, for example a resin layer, is deposited on the board, preferably over the entire board. In other words, the surface of the board is completely covered with said layer made of the material of layer 30. This layer will form layer 30 of the various devices 10.

[0057] The layer 30 preferably has a thickness ranging from 20 μm to 80 μm, preferably from 50 to 80 μm.

[0058] In this step, the material of layer 30 is in a liquid or flexible state. The material is deposited on the plate, for example, by means of a syringe.

[0059] During step 42 (placing optical blocks), an optical block 28 is placed on layer 30. More precisely, an optical block 28 is placed on each optical block 26. For example, the optical block 28 originates from a plate comprising a plurality of optical blocks 28, which is divided into a plurality of optical blocks 28 before step 43.

[0060] During step 43 (polymerization), the assembly comprising the plate of optical block 26, optical block 28 and layer 30 is polymerized. Layer 30 then becomes solid. Each optical block 28 is then attached to optical block 26 by hardening layer 30.

[0061] Thus, layer 30 may be a bonding layer for optical blocks 26 and 28, and during the polymerization process, layer 30 is in contact with optical blocks 26 and 28. However, layer 30 may not be used as a bonding layer in the next step.

[0062] During step 44 (single), the optical blocks 26 are singulated. In other words, the plate comprising the optical blocks 26 and the layer 30 is divided to form different optical blocks 26 covered with the layer 30 and the optical blocks 28.

[0063] During step 45 (forming supports), supports 14 are formed. Preferably, a plate comprising a plurality of supports 14 is formed and divided to obtain supports 14.

[0064] The formation of the support member 14 includes, for example, the formation of an insulating layer and / or the formation of conductive traces and conductive vias. In particular, the formation of the support member 14 includes the formation of the conductive traces 16.

[0065] During a step 46 (attach chips), the previously formed chips 12 are attached to each support 14. The connection between each chip and the support to which it is attached is made, for example, by cables 18.

[0066] During step 47 (forming the side walls), the side walls are formed. For example, the side walls are formed independently of the supports, for example by using plastic injection molding, and then the side walls are attached to the supports. As a variant, the side walls of each device can be formed by placing a mold having the shape of the wall 22 on each support 14 and by filling the mold with resin and then curing it.

[0067] Steps 40 to 44 are preferably sequential steps. Similarly, steps 45 to 47 are preferably sequential steps. Steps 40 to 44 are preferably performed independently of steps 45 to 47.

[0068] During step 48 (attachment), following steps 47 and 44, a layer of glue 32 is placed on the portion of each layer 30 not covered by optical block 28. Each assembly, including optical blocks 26 and 28 and layer 30, is then placed on wall 22 of support 14 so that glue 32 is in contact with portion 22b of wall 22. The device is then heated to cure the glue layer.

[0069] As a variant, the glue layer could be provided on portion 22 b instead of layer 30 .

[0070] As a variant, the steps of blocks 43 and 44, i.e., the aggregation of the layers 30 and the singulation of the optical blocks 26, can be performed before the step of block 42, i.e., the placement of the optical blocks 28. In this case, the step of placing the optical blocks 28 comprises forming a preferably at least partially transparent glue layer between each layer 30 and the corresponding optical block 28.

[0071] Figure 3 Another exemplary embodiment of an optoelectronic component 50 is shown.

[0072] Device 50 includes Figure 1 1 . These elements will be denoted by the same reference numerals and will not be described in detail. In particular, device 50 includes chip 12, support member 14, sidewall 22, optical block 26, and optical block 28.

[0073] Device 50 differs from device 10 in that layer 30 is replaced by region 52. Region 52 is formed by Figure 1 Like layer 30, region 52 enables optical blocks 26 and 28 to be attached to each other. Region 52 is completely located between optical blocks 26 and 28. Region 52 is completely located between optical blocks 26 and 28. Thus, region 52 is completely opposite optical blocks 26 and 28. However, in Figure 3 In the embodiment of FIG. 5 , region 52 does not completely cover the upper surface of optical block 28 . Therefore, portions of optical blocks 26 and 28 are not separated from each other by region 52 .

[0074] exist Figure 3 In the example shown, region 52 forms a continuous ring extending over a peripheral portion of the upper surface of optical block 28. Region 52 preferably surrounds an area through which most, and preferably substantially all, light rays pass through optical block 28. Thus, region 52 extends around an area opposite the portion of chip 12 that receives or emits light.

[0075] Cavity 54 is thus formed inside the ring formed by region 52 and by the upper surface of optical block 28 and the lower surface of optical block 26. Cavity 54 is preferably opposite the portion of chip 12 that receives or emits light. Cavity 54 is preferably filled with air. The cavity does not include glue.

[0076] As in device 10, optical blocks 26 and 28 of device 50 are attached to portion 22b of sidewall 22 by glue layer 56. Glue layer 56 is attached to the sidewall 22 by glue layer 56. Figure 1 The difference between the adhesive layer 32 and the optical block 26 is that the adhesive layer 56 is in contact with the optical block 26 .

[0077] Layer 56 separates and attaches portion 22b and the peripheral portion of optical block 26. Layer 56 contacts portion 22b and the peripheral portion of optical block 26, i.e., the portion surrounding the portion opposite cavity 54 and region 52. Furthermore, similar to layer 30, layer 56 separates and attaches the sidewalls of the block and portion 22b.

[0078] The advantage of the annular shape of region 52 is that it ensures that the glue of layer 56 does not come into contact with the parts of optical block 26 that are passed through by light emitted or received by chip 12 .

[0079] manufacture Figure 3 Methods of embodiments and with respect to Figure 2 The method described differs in that step 41 is replaced by a step of forming areas 52. More precisely, during the step replacing step 41, areas 52 are formed on each optical block 26, for example using a syringe or with the aid of a template and a shielding blade.

[0080] exist Figure 3 In the embodiment of , layer 30 preferably has a thickness of 20 μm to 80 μm, preferably 20 μm to 30 μm.

[0081] As a variant, make Figure 3 The method of the embodiment may also be different from that of Figure 2 The method described above can be performed in that optical block 26 can be singulated prior to forming regions 52. Thus, step 42 can be performed prior to the step that replaces step 41.

[0082] Figure 4 Another embodiment of an optoelectronic component 60 is shown.

[0083] Device 60 includes Figure 1and 3 1 and 2. The device 60 includes the same elements as those of the embodiment of FIG. 1. These elements will be denoted by the same reference numerals and will not be described in detail again. In particular, the device 60 includes a chip 12, a support member 14, a sidewall 22, an optical block 26, and an optical block 28. The device 60 also includes Figure 1 Layer 30.

[0084] Device 60 differs from device 10 in that optical block 28 is not located in opening 24. Furthermore, in this embodiment, the horizontal dimension of optical block 28 is larger than the dimension of opening 24. Thus, optical block 28 covers opening 24. The peripheral portion of the lower surface of optical block 28 is located on portion 22 b, and the central portion is opposite opening 24.

[0085] like Figure 1 As shown, layer 30 completely covers the lower surface of optical block 26. Figure 1 As shown, the optical block 28 is attached to the center or interior of the lower surface of the layer 30. The device 60 is connected to the Figure 1 Device 10 of FIG. 1 differs in that a peripheral portion of the lower surface of layer 30 , ie, the portion not in contact with optical block 28 , is not in contact with portion 22 b of sidewall 22 .

[0086] Optical block 28 is surrounded by block 62. Block 62 is in contact with layer 30. Block 62 is attached to optical block 26 via layer 30. Block 62 preferably extends vertically from layer 30 to the level of the lower surface of optical block 28. The thickness of block 62 is therefore preferably substantially equal to the thickness of optical block 28. Block 62 preferably extends horizontally from the sidewalls of optical block 28 to the level of the sidewalls of optical block 26. Thus, optical blocks 26, 28, and 62 and layer 30 form an assembly that preferably has a substantially rectangular parallelepiped shape.

[0087] The block 62 is located on the portion 22b. The block 62 is attached to the wall 22 by means of a glue layer 64. The glue layer is located between the side walls of the block 62 and the wall 22, preferably in the cavity formed by the portions 22a and 22b and the block 62.

[0088] Block 62 is made of, for example, an at least partially transparent material, such as glass. A glue layer 64 then preferably extends vertically from portion 22 b to a level below the upper surface of portion 22 a, preferably above the level of the lower surface of layer 30, preferably above the level of the upper surface of layer 30. Thus, all light entering or leaving the package passes through optical blocks 26 and 28.

[0089] Alternatively, block 62 is made of an opaque material. Glue layer 64 then extends, for example vertically, from portion 22b to a level below the upper surface of portion 22a, preferably below the lower surface of optical block 26, for example below the lower surface of layer 30.

[0090] manufacture Figure 4 Methods of embodiments and with respect to Figure 2 The fabrication method described differs in that step 43 of depositing optical blocks 28 on layer 30 also includes depositing regions 62 around each optical block 26. Furthermore, step 48 differs in that the assembly comprising optical blocks 26 and 28, layer 30, and regions 62 is placed on portion 22b before glue is placed between the assembly and portion 22a.

[0091] As a variant, optical block 28 may cover the entire layer 30. In other words, region 62 is replaced by optical block 28. In other words, the device comprises a stack of optical block 28, layer 30, and optical block 26, which have substantially the same horizontal dimensions. Thus, layer 30 is completely located between optical block 26 and optical block 28.

[0092] Optical block 28 may be attached to the lower surface of portion 22b, for example, via a glue layer, and optical block 26 may be attached to the upper surface of portion 22b, for example, via a glue layer. The upper surface of optical block 28 and the lower surface of optical block 26 are thus separated by the thickness of the two glue layers and the thickness of portion 22b, which is thicker than the thickness of the resin layer. Specifically, to support optical blocks 26 and 28, the thickness of portion 22b must be greater than the thickness of layer 30.

[0093] An advantage of the described embodiments is that they enable a more compact package.

[0094] Another advantage of the described embodiment is that the optical block 26, in particular the portion opposite the chip 12, is not degraded by the glue.

[0095] Various embodiments and variations have been described. Those skilled in the art will appreciate that certain features of these various embodiments and variations may be combined, and those skilled in the art will recognize other variations.

[0096] Finally, based on the functional indications given above, the actual implementation of the described embodiments and variants is within the capabilities of a person skilled in the art.

Claims

1. An optoelectronic device comprising: substrate; an optoelectronic component mounted to the substrate; as well as A package is mounted on the substrate and is located above the optoelectronic component, the package comprising: a sidewall comprising a vertical portion and a horizontal portion, the horizontal portion extending from the vertical portion to define an opening disposed above the optoelectronic component; a first optical block having a lower surface; a second optical block having an upper surface; a resin bonding material between the lower surface and the upper surface to attach the first optical block and the second optical block to each other and form an optical assembly; and an adhesive material configured to secure the optical assembly to at least the horizontal portion of the sidewall and close the opening; The stress caused by the resin bonding material on the optical component is smaller than the stress caused by the glue material on the optical component. 2 . The optoelectronic device according to claim 1 , wherein the resin bonding material has a linear expansion coefficient in the range of 150 ppm / K to 200 ppm / K. The optoelectronic device according to claim 1 , wherein the first optical block is an optical diffuser. 4 . The optoelectronic device according to claim 1 , wherein the first optical block is a planar chip configured to perform one or more of the following optical functions: diffusion, polarization, or focusing. The optoelectronic device according to claim 1 , wherein the second optical block comprises at least one optical filter. 6 . The optoelectronic device according to claim 1 , wherein the second optical block is positioned within the opening, and a peripheral region of the lower surface of the first optical block is supported by an upper surface of the horizontal portion surrounding the sidewall of the opening.

7. The optoelectronic device of claim 6 , wherein the resin bonding material is positioned on the peripheral area of ​​the lower surface of the first optical block, and wherein the glue material attaches the resin bonding material to the upper surface of the horizontal portion of the sidewall surrounding the opening.

8. The optoelectronic device of claim 6 , wherein the resin bonding material is not positioned on the peripheral area of ​​the lower surface of the first optical block, and wherein the glue material attaches the periphery of the lower surface of the first optical block to the upper surface of the horizontal portion of the sidewall surrounding the opening.

9. The optoelectronic device of claim 8 , wherein the resin bonding material is formed into a ring shape surrounding a central portion of the lower surface of the first optical block and a central portion of the upper surface of the second optical block, the ring shape of the resin bonding material defining a cavity between the first optical block and the second optical block in the optical assembly. 10 . The optoelectronic device according to claim 1 , wherein the second optical block is positioned to extend above the opening, and a peripheral area of ​​a bottom surface of the second optical block is supported by an upper surface of the horizontal portion of the sidewall surrounding the opening.

11. The optoelectronic device of claim 10 , further comprising a support block surrounding the second optical block, and wherein the resin bonding material is positioned between the lower surface of the first optical block and the upper surface of the support block to attach the first optical block and the support block to each other in the optical assembly. 12 . The optoelectronic device of claim 11 , wherein the glue material is configured to secure the support block of the optical assembly to at least the horizontal portion of the sidewall. 13 . The optoelectronic device according to claim 1 , wherein a distance between a lower surface of the horizontal portion of the sidewall and an upper surface of the substrate is greater than a thickness of the optoelectronic element mounted to the upper surface of the substrate.

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