Turntable calibration method, device, electronic equipment and storage medium

Abstract

An embodiment of the present invention provides a turntable calibration method, which performs global temperature calibration on a chip to be calibrated on a turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated, wherein each chip to be calibrated corresponds to a temperature compensation curve, and the global temperature calibration is performed under all temperature conditions; performs local temperature calibration on a product to be calibrated on a turntable to obtain a local fixed deviation of the product to be calibrated, and the local temperature calibration is performed under preset temperature conditions, wherein the number of preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated; and performs calibration on each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain a calibration result for each of the products to be calibrated.

Description

Technical Field

[0001] The present invention relates to the technical field of turntable calibration, and in particular to a turntable calibration method, device, electronic equipment and storage medium. Background Art

[0002] The turntable equipment is an auxiliary equipment that helps inertial measurement device-related products eliminate the fixed deviations that come with the devices when they are shipped. Inertial measurement devices are affected by device characteristics and often have certain fixed deviations. When producing corresponding products, calibration is often required. The calibration process requires calibrating the characteristic curves of the inertial measurement device at different temperatures. The traditional solution is to place the entire product equipped with the inertial measurement device in the turntable equipment and calibrate the inherent deviation of the entire device. Due to differences in product models and appearance, the product often takes up a large space and cannot fully utilize the space of the turntable. At the same time, when calibrating the inertial measurement device, it is necessary to measure its performance at different temperatures. During the calibration process, the temperature difference range of heating and cooling is large, and the time required for heating and cooling is too long, resulting in a slow calibration process for the inertial measurement device, which makes the calibration efficiency of the inertial measurement device low. During the calibration process, the entire product needs to be powered, which increases the energy consumption of production and increases the cost of production. Summary of the invention

[0003] The embodiment of the present invention provides a turntable calibration method, which aims to solve the problem that the temperature difference range of heating and cooling during the calibration process is large, the time required for heating and cooling is too long, resulting in a slow calibration process for the inertial measurement device, thereby making the calibration efficiency of the inertial measurement device low, and the entire product needs to be powered during the calibration process, which increases the energy consumption of production and the cost of production. Under the condition of limited turntable capacity, the global temperature calibration of the chip to be calibrated with a smaller volume is first performed to obtain the temperature compensation curve of the chip to be calibrated under all temperature conditions, and then the chip to be calibrated is installed in the product to be calibrated, and the product to be calibrated is locally calibrated to obtain the local fixed deviation of the product to be calibrated under the preset temperature condition. The calibration result of the product to be calibrated is obtained through the temperature compensation curve and the local fixed deviation. Since the turntable can calibrate more chips to be calibrated at one time, the calibration of the product to be calibrated is limited to the preset temperature condition, thereby reducing the time of the product to be calibrated, improving the calibration efficiency, reducing the energy consumption of production, and reducing the cost of production.

[0004] In a first aspect, an embodiment of the present invention provides a turntable calibration method, comprising the following steps:

[0005] By performing global temperature calibration on the chip to be calibrated on the turntable, a temperature compensation curve corresponding to the chip to be calibrated is obtained, each chip to be calibrated corresponds to a temperature compensation curve, and the global temperature calibration is performed under all temperature conditions;

[0006] The local fixed deviation of the product to be calibrated is obtained by performing local temperature calibration on the product to be calibrated on the turntable, wherein the local temperature calibration is performed under preset temperature conditions, the number of the preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated;

[0007] Based on the temperature compensation curve and the local fixed deviation, each of the products to be calibrated is calibrated to obtain a calibration result of each of the products to be calibrated.

[0008] Furthermore, the step of performing global temperature calibration on the chip to be calibrated on the turntable includes:

[0009] After the calibration circuit board is installed on the turntable, all temperature conditions for global temperature calibration are set, wherein the calibration circuit board is integrated with n chips to be calibrated;

[0010] According to the all temperature conditions, the turntable is controlled to perform global temperature calibration.

[0011] Furthermore, the step of partially calibrating the product to be calibrated on the turntable includes:

[0012] After placing the product to be calibrated on the turntable, setting a preset temperature condition for local temperature calibration;

[0013] According to the preset temperature condition, the turntable is controlled to perform local temperature calibration on the placed product to be calibrated.

[0014] Furthermore, the method further comprises:

[0015] Before rotating the product to be calibrated on the turntable, installing the chip to be calibrated after global temperature calibration into the corresponding product to obtain the product to be calibrated;

[0016] The products to be calibrated are divided into batches, and the products to be calibrated are placed on the turntable in batches.

[0017] Furthermore, the step of controlling the turntable to perform local temperature calibration on the placed product to be calibrated according to the preset temperature condition includes:

[0018] The turntable is controlled to measure the inherent deviation of the placed products to be calibrated under the preset temperature condition, and the local inherent deviation corresponding to each product to be calibrated is recorded.

[0019] Furthermore, the step of calibrating each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain the calibration results of each of the products to be calibrated includes:

[0020] Calculating a local temperature compensation value of each of the products to be calibrated according to the temperature compensation curve of each of the chips to be calibrated and the local fixed deviation corresponding to the product to be calibrated;

[0021] The temperature compensation curve of each of the products to be calibrated is calibrated according to the local temperature compensation value to obtain the temperature compensation curve of each of the products to be calibrated.

[0022] Furthermore, the step of calculating the local temperature compensation value of each product to be calibrated according to the temperature compensation curve of each product to be calibrated and the local fixed deviation includes:

[0023] Calculating the compensation value of each of the products to be calibrated under the preset temperature conditions according to the temperature compensation curve of each of the products to be calibrated;

[0024] The local temperature compensation value of each product to be calibrated is calculated according to the local fixed deviation corresponding to each product to be calibrated and the compensation value of each product to be calibrated under the preset temperature condition.

[0025] In a second aspect, an embodiment of the present invention provides a turntable calibration device, the device comprising:

[0026] A first acquisition module is used to perform global temperature calibration on the chip to be calibrated on the turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated. Each chip to be calibrated corresponds to a temperature compensation curve. The global temperature calibration is performed under all temperature conditions.

[0027] A second acquisition module is used to obtain a local fixed deviation of the product to be calibrated by performing local temperature calibration on the product to be calibrated on the turntable, wherein the local temperature calibration is performed under preset temperature conditions, the number of preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated;

[0028] The calibration module is used to calibrate each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain calibration results of each of the products to be calibrated.

[0029] In a third aspect, an embodiment of the present invention provides an electronic device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the steps in the turntable calibration method provided in the embodiment of the present invention are implemented.

[0030] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps in the turntable calibration method provided in the embodiment of the invention are implemented.

[0031] In an embodiment of the present invention, a global temperature calibration is performed on the chip to be calibrated on the turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated, each chip to be calibrated corresponds to a temperature compensation curve, and the global temperature calibration is performed under all temperature conditions; a local temperature calibration is performed on the product to be calibrated on the turntable to obtain a local fixed deviation of the product to be calibrated, and the local temperature calibration is performed under preset temperature conditions, the number of preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated; based on the temperature compensation curve and the local fixed deviation, each product to be calibrated is calibrated to obtain a calibration result of each product to be calibrated. Under the condition of limited turntable capacity, first perform global temperature calibration on the smaller chip to be calibrated, and obtain the temperature compensation curve of the chip to be calibrated under all temperature conditions. Then, the chip to be calibrated is installed in the product to be calibrated, and local temperature calibration is performed on the product to be calibrated to obtain the local fixed deviation of the product to be calibrated under the preset temperature conditions. The calibration result of the product to be calibrated is obtained through the temperature compensation curve and the local fixed deviation. Since the turntable can calibrate more chips to be calibrated at one time, the calibration of the product to be calibrated is limited to the preset temperature conditions, thereby reducing the time of the product to be calibrated, improving the calibration efficiency, reducing the energy consumption of production, and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 is a flow chart of a turntable calibration method provided by an embodiment of the present invention;

[0034] Figure 2 is a structural schematic diagram of a turntable calibration device provided by an embodiment of the present invention;

[0035] Figure 3 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figure 1 , Figure 1 is a flow chart of a turntable calibration method provided by an embodiment of the present invention. Figure 1 As shown, the turntable calibration method includes the following steps:

[0038] 101. Perform global temperature calibration on the chip to be calibrated on the turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated.

[0039] In the embodiment of the present invention, each chip to be calibrated corresponds to a temperature compensation curve, and the above-mentioned global temperature calibration is performed under all temperature conditions.

[0040] The chip to be calibrated may be an IMU (inertial measurement unit) chip, and the chip to be calibrated that needs global temperature calibration is an IMU chip that is not installed on the product. The inertial measurement device may be an accelerometer or a gyroscope, and the accelerometer or gyroscope may include but is not limited to single-axis, dual-axis, tri-axis and multi-axis measurement devices.

[0041] Among them, the above-mentioned accelerometer can be composed of a detection mass (also called sensitive mass), a support, a potentiometer, a spring, a damper and a housing. The detection mass is constrained by the support and can only move along one axis, which is often called the input axis or sensitive axis. When the instrument housing accelerates along the sensitive axis with the carrier, according to Newton's law, the detection mass with a certain inertia tries to keep its original state of motion unchanged. It will produce relative motion with the housing, causing the spring to deform, so the detection mass will accelerate under the action of the spring force. When the spring force is balanced with the inertial force generated by the acceleration of the detection mass, there will be no relative motion between the detection mass and the housing. At this time, the deformation of the spring can reflect the magnitude of the measured acceleration.

[0042] The above-mentioned gyroscope can be understood as a combination of a circular central axis. It is a directional instrument manufactured by utilizing the property that when an object rotates at high speed, its angular momentum is very large and the axis of rotation will always point stably in one direction.

[0043] It should be noted that due to the nature of the process or production, the inertial measurement devices produced will have errors. This part of the error can also be called inherent deviation. The above inherent deviation includes but is not limited to errors such as zero bias and scale factor.

[0044] The above-mentioned turntable is an auxiliary device that helps inertial measurement device related products eliminate the fixed deviation of the device when it leaves the factory. The inherent deviation of the inertial measurement device is measured and compensated by the turntable to eliminate the inertial measurement device. Since its performance at different temperatures needs to be measured during calibration, the measurement and compensation of the inherent deviation of the inertial measurement device is carried out under different temperature conditions.

[0045] Furthermore, before calibration, different temperature conditions are set. During calibration, by applying different temperature conditions, the turntable measures the performance of the inertial measurement device under all temperature conditions, thereby completing the global temperature calibration of the chip to be calibrated and obtaining the temperature compensation curve corresponding to the chip to be calibrated.

[0046] The temperature compensation curve can reflect the error characteristics of the chip to be calibrated or the product to be calibrated at different temperatures, and the chip to be calibrated or the product to be calibrated can be calibrated using the temperature compensation curve.

[0047] 102. Perform local temperature calibration on the product to be calibrated on the turntable to obtain a local fixed deviation of the product to be calibrated.

[0048] In the embodiment of the present invention, the local temperature calibration is performed under preset temperature conditions, the number of preset temperature conditions is less than the number of all temperature conditions, and a corresponding chip to be calibrated is installed in the product to be calibrated.

[0049] It should be noted that the turntable calibration method in the embodiment of the present invention is for calibrating the product to be calibrated, and the product to be calibrated has a chip to be calibrated installed in it. The turntable for local temperature calibration of the product to be calibrated and the turntable for global temperature calibration of the chip to be calibrated can be the same turntable.

[0050] The above-mentioned preset temperature condition can be a single temperature condition or several temperature conditions. For example, if all temperature conditions are 16 calibration temperatures, the preset temperature condition can be one calibration temperature or several calibration temperatures less than 16.

[0051] In the embodiment of the present invention, by performing global temperature calibration on the chip to be calibrated on the turntable, due to the small size of the chip to be calibrated, more chips to be calibrated can be placed on the turntable, so that more temperature compensation curves of the chips to be calibrated can be obtained in one calibration. Performing turntable calibration on the chip to be calibrated can obtain the change trend of the inherent deviation of the chip to be calibrated at different temperatures, and then the chip to be calibrated is installed on the product to obtain the product to be calibrated, which will only be slightly affected by the installation process and the shape of the product, resulting in a slight offset of the fixed deviation, but will not affect its change trend.

[0052] The above-mentioned local fixed deviation is the fixed deviation of the product. The fixed deviation of the product is composed of the fixed deviation of the chip to be calibrated, the product installation process deviation and the product shape deviation. Among them, the fixed deviation of the chip to be calibrated can be represented by the corresponding temperature compensation curve.

[0053] 103. Based on the temperature compensation curve and the local fixed deviation, calibrate each product to be calibrated to obtain the calibration results of each product to be calibrated.

[0054] In the embodiment of the present invention, the temperature compensation curve is the temperature compensation curve of the chip to be calibrated, and the local fixed deviation is the fixed deviation of the product to be calibrated at a preset temperature. On the basis of the temperature compensation curve, the local fixed deviation can be added to obtain the temperature compensation curve of the product to be calibrated, and then the product to be calibrated is calibrated by the temperature compensation curve of the product to be calibrated, so as to obtain the calibration results of each product to be calibrated and obtain the calibrated product.

[0055] It should be noted that in the embodiment of the present invention, the calibration of the product to be calibrated is divided into two stages. The first stage is to perform global temperature calibration on the chip before installing the chip, and the second stage is to perform local temperature calibration on the product after installing the chip. Since the number of chips that can be placed on a turntable is much greater than the number of products that can be placed, the time for performing a global temperature calibration on the turntable can obtain temperature compensation curves corresponding to more chips; for products with installed chips, the time for local temperature calibration under one or several temperature conditions is much less than the time consumption of global temperature calibration, and the turntable calibration of the chip can obtain the change trend of the inherent deviation corresponding to the chip at different temperatures, and then the chip is installed on the product to obtain the product to be calibrated. During this period, it will only be slightly affected by the installation process and the shape of the product, resulting in a slight offset in the fixed deviation of the product, but it will not affect the change trend of the fixed deviation of the product.

[0056] In an embodiment of the present invention, a global temperature calibration is performed on the chip to be calibrated on the turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated, each chip to be calibrated corresponds to a temperature compensation curve, and the global temperature calibration is performed under all temperature conditions; a local temperature calibration is performed on the product to be calibrated on the turntable to obtain a local fixed deviation of the product to be calibrated, and the local temperature calibration is performed under preset temperature conditions, the number of preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated; based on the temperature compensation curve and the local fixed deviation, each product to be calibrated is calibrated to obtain a calibration result of each product to be calibrated. Under the condition of limited turntable capacity, first perform global temperature calibration on the smaller chip to be calibrated, and obtain the temperature compensation curve of the chip to be calibrated under all temperature conditions. Then, the chip to be calibrated is installed in the product to be calibrated, and local temperature calibration is performed on the product to be calibrated to obtain the local fixed deviation of the product to be calibrated under the preset temperature conditions. The calibration result of the product to be calibrated is obtained through the temperature compensation curve and the local fixed deviation. Since the turntable can calibrate more chips to be calibrated at one time, the calibration of the product to be calibrated is limited to the preset temperature conditions, thereby reducing the time of the product to be calibrated, improving the calibration efficiency, reducing the energy consumption of production, and reducing the production cost.

[0057] Optionally, in the step of performing global temperature calibration on the chip to be calibrated on the turntable, all temperature conditions for the global temperature calibration can be set after the calibration circuit board is installed on the turntable, and a number n of chips to be calibrated are integrated on the calibration circuit board; according to all temperature conditions, the turntable is controlled to perform global temperature calibration.

[0058] In an embodiment of the present invention, a chip mounting position is provided on the calibration circuit board, and the chip mounting position is used to integrate the chip to be calibrated into the calibration circuit board. The chip mounting position is connected to the turntable host computer through a signal channel. When the chip to be calibrated is working on the chip mounting position, the working state of the chip to be calibrated can be monitored and analyzed by the turntable host computer, so as to obtain a temperature compensation curve corresponding to the chip to be calibrated.

[0059] Furthermore, the number of chip mounting positions on the calibration circuit board is greater than or equal to n, where n is an integer greater than or equal to 1. When the calibration circuit board is integrated with n chips to be calibrated, the temperature compensation curves corresponding to the n chips to be calibrated can be obtained by rotating the host computer, that is, n temperature compensation curves can be obtained, and each temperature compensation curve corresponds to a chip to be calibrated.

[0060] Specifically, the temperature compensation curve can be f n (t) represents the temperature compensation of the nth chip to be calibrated at temperature t.

[0061] Optionally, in the step of performing local calibration on the product to be calibrated on the turntable, a preset temperature condition for local temperature calibration can be set after the product to be calibrated is placed on the turntable; according to the preset temperature condition, the turntable is controlled to perform local temperature calibration on the placed product to be calibrated.

[0062] In an embodiment of the present invention, the above-mentioned product to be calibrated is placed on a turntable and can be connected to the turntable host computer through a signal channel. When the product to be calibrated is working on the turntable, the working status of the product to be calibrated can be monitored and analyzed by the turntable host computer to obtain the fixed deviation corresponding to the product to be calibrated.

[0063] Optionally, before rotating the product to be calibrated on the turntable, the chip to be calibrated after global temperature calibration can be installed in the corresponding product to obtain the product to be calibrated; the product to be calibrated can be divided into batches and placed on the turntable according to the batches.

[0064] In an embodiment of the present invention, a turntable can perform global temperature calibration on n chips to be calibrated. After performing global temperature calibration on the n chips to be calibrated, the chips to be calibrated are installed in corresponding products to obtain n products to be calibrated. The n products to be calibrated can be divided into m batches and placed on the turntable, and connected to the turntable host computer through a signal channel. When each batch of products to be calibrated is working on the turntable, the working status of the batch of products to be calibrated can be monitored and analyzed by the turntable host computer, thereby obtaining fixed deviations corresponding to the n products to be calibrated.

[0065] Optionally, in the step of controlling the turntable to perform local temperature calibration on the placed products to be calibrated according to preset temperature conditions, the turntable can be controlled to measure the inherent deviations of the placed products to be calibrated under the preset temperature conditions, and record the local inherent deviations corresponding to each product to be calibrated.

[0066] In the embodiment of the present invention, the preset temperature condition may be one temperature condition or multiple temperature conditions, and the multiple temperature conditions are multiple temperature conditions among all temperature conditions, and the number of the multiple temperature conditions is less than the number of all temperature conditions. Taking the preset temperature condition as one temperature condition as an example, after n products to be calibrated are divided into m batches and placed on the turntable, the inherent deviation of the products to be calibrated on the turntable can be measured at a certain temperature condition t0, and the data can be recorded to obtain the fixed deviation εn corresponding to the n products to be calibrated under the temperature condition t0.

[0067] Optionally, in the step of calibrating each product to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain the calibration results of each product to be calibrated, the local temperature compensation value of each product to be calibrated can be calculated according to the temperature compensation curve of each chip to be calibrated and the local fixed deviation of the corresponding product to be calibrated; according to the local temperature compensation value, the temperature compensation curve of each product to be calibrated is calibrated to obtain the temperature compensation curve of each product to be calibrated.

[0068] In the embodiment of the present invention, the temperature compensation curve is the temperature compensation curve of the chip to be calibrated, and the local fixed deviation is the fixed deviation of the product to be calibrated at a preset temperature. On the basis of the temperature compensation curve, the local fixed deviation can be added to obtain the local temperature compensation value of each product to be calibrated; after obtaining the local temperature compensation value of each product to be calibrated, the local temperature compensation value of each product to be calibrated is added to the temperature compensation curve of the corresponding chip to be calibrated to obtain the temperature compensation curve of the product to be calibrated, and then the product to be calibrated is calibrated by the temperature compensation curve of the product to be calibrated, so as to obtain the calibration results of each product to be calibrated, and obtain the calibrated product.

[0069] Optionally, in the step of calculating the local temperature compensation value of each product to be calibrated according to the temperature compensation curve of each chip to be calibrated and the corresponding local fixed deviation of the product to be calibrated, the compensation value of each product to be calibrated under preset temperature conditions can be calculated according to the temperature compensation curve of each chip to be calibrated; the local temperature compensation value of each product to be calibrated can be calculated according to the local fixed deviation corresponding to each product to be calibrated and the compensation value of each product to be calibrated under preset temperature conditions.

[0070] In the embodiment of the present invention, the temperature compensation curve of the chip to be calibrated can be f n (t) represents the temperature compensation of the nth chip to be calibrated at temperature t. The preset temperature condition corresponding to the local temperature is temperature t0. The compensation value f of the nth chip to be calibrated at temperature t0 is calculated. n (t0), since the chip to be calibrated is installed in the product to be calibrated, the compensation value f of the nth product to be calibrated at temperature t0 is obtained n (t0), the local fixed deviation of the nth product to be calibrated is εn, then the local temperature compensation value of the nth product to be calibrated is f n (t0)-εn.

[0071] The temperature compensation curve of the above product to be calibrated is f n (t)+f n (t0)-εn.

[0072] In an embodiment of the present invention, by first performing global temperature calibration on a smaller chip to be calibrated when the capacity of the turntable is limited, a temperature compensation curve of the chip to be calibrated under all temperature conditions is obtained, and then the chip to be calibrated is installed in the product to be calibrated, and local temperature calibration is performed on the product to be calibrated to obtain a local fixed deviation of the product to be calibrated under preset temperature conditions. The calibration result of the product to be calibrated is obtained through the temperature compensation curve and the local fixed deviation. Since the turntable can calibrate more chips to be calibrated at one time, the calibration of the product to be calibrated is limited to preset temperature conditions, thereby reducing the time of the product to be calibrated, improving the calibration efficiency, reducing the energy consumption of production, and reducing the production cost.

[0073] For example, assuming that there are 200 IMU products to be produced, the time required for a complete turntable calibration of a single IMU product and an IMU chip is 8 hours. It takes 30 minutes for the turntable to calibrate an IMU product or an IMU chip at a single temperature t. Due to the influence of space on the turntable, the number of IMU products that can be placed is 10, and the number of IMU chips that can be placed is 100. For the traditional solution, the production of 200 products requires 200 / 10=20 complete turntable calibrations, which requires a total of 20*8=160 hours of calibration time. In the turntable calibration method in the embodiment of the present invention, during the chip calibration stage of 200 products, 100 chips can be placed on the turntable due to their small size, and only 200 / 100=2 complete turntable calibrations are required, and 200 / 10=20 turntable calibrations at a single temperature are required for IMU products. A total of 2*8+20*0.5=26 hours of calibration time is required, which is much less than the calibration time required for the traditional solution.

[0074] It should be noted that the turntable calibration method provided in the embodiment of the present invention can be applied to devices such as smart phones, computers, and servers.

[0075] Optional, see Figure 2 , Figure 2 is a schematic diagram of the structure of a turntable calibration device provided by an embodiment of the present invention, such as Figure 2 As shown, the device comprises:

[0076] The first acquisition module 201 is used to perform global temperature calibration on the chip to be calibrated on the turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated. Each chip to be calibrated corresponds to a temperature compensation curve. The global temperature calibration is performed under all temperature conditions.

[0077] The second acquisition module 202 is used to obtain the local fixed deviation of the product to be calibrated by performing local temperature calibration on the product to be calibrated on the turntable, wherein the local temperature calibration is performed under preset temperature conditions, the number of preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated;

[0078] The calibration module 203 is used to calibrate each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain a calibration result of each of the products to be calibrated.

[0079] Furthermore, the first acquisition module 201 includes:

[0080] A first setting submodule is used to set all temperature conditions for global temperature calibration after a calibration circuit board is installed on the turntable, wherein n number of chips to be calibrated are integrated on the calibration circuit board;

[0081] The first control submodule is used to control the turntable to perform global temperature calibration according to all temperature conditions.

[0082] Furthermore, the second acquisition module 202 includes:

[0083] A second setting submodule is used to set a preset temperature condition for local temperature calibration after placing the product to be calibrated on the turntable;

[0084] The second control submodule is used to control the turntable to perform local temperature calibration on the placed product to be calibrated according to the preset temperature condition.

[0085] Furthermore, the device also includes:

[0086] An installation module is used to install the chip to be calibrated after global temperature calibration into the corresponding product before rotating the product to be calibrated on the turntable to obtain the product to be calibrated;

[0087] The batch module is used to divide the products to be calibrated into batches and place the products to be calibrated on the turntable in batches.

[0088] Furthermore, the second control submodule includes:

[0089] The control unit is used to control the turntable to measure the inherent deviation of the placed products to be calibrated under the preset temperature conditions, and record the local inherent deviation corresponding to each product to be calibrated.

[0090] Furthermore, the calibration module 203 includes:

[0091] A calculation submodule, used for calculating a local temperature compensation value of each of the products to be calibrated according to the temperature compensation curve of each of the chips to be calibrated and the local fixed deviation corresponding to the product to be calibrated;

[0092] The calibration submodule is used to calibrate the temperature compensation curve of each of the products to be calibrated according to the local temperature compensation value to obtain the temperature compensation curve of each of the products to be calibrated.

[0093] Furthermore, the computing submodule includes:

[0094] A first calculation unit, configured to calculate a compensation value of each of the products to be calibrated under the preset temperature condition according to the temperature compensation curve of each of the products to be calibrated;

[0095] The second calculation unit is used to calculate the local temperature compensation value of each of the products to be calibrated according to the local fixed deviation corresponding to each of the products to be calibrated and the compensation value of each of the products to be calibrated under the preset temperature condition.

[0096] It should be noted that the turntable calibration device provided in the embodiment of the present invention can be applied to smart phones, computers, servers and other devices that can perform map-level business analysis.

[0097] The turntable calibration device provided in the embodiment of the present invention can implement each process implemented by the turntable calibration method in the above method embodiment and can achieve the same beneficial effects. To avoid repetition, it will not be described here.

[0098] See also Figure 3 , Figure 3 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention, such as Figure 3 As shown, it includes: a memory 302, a processor 301, and a computer program of a turntable calibration method stored in the memory 302 and executable on the processor 301, wherein:

[0099] The processor 301 is used to call the computer program stored in the memory 302 and execute the following steps:

[0100] By performing global temperature calibration on the chip to be calibrated on the turntable, a temperature compensation curve corresponding to the chip to be calibrated is obtained, each chip to be calibrated corresponds to a temperature compensation curve, and the global temperature calibration is performed under all temperature conditions;

[0101] The local fixed deviation of the product to be calibrated is obtained by performing local temperature calibration on the product to be calibrated on the turntable, wherein the local temperature calibration is performed under preset temperature conditions, the number of the preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated;

[0102] Based on the temperature compensation curve and the local fixed deviation, each of the products to be calibrated is calibrated to obtain a calibration result of each of the products to be calibrated.

[0103] Further, the step of performing global temperature calibration on the chip to be calibrated on the turntable executed by the processor 301 includes:

[0104] After the calibration circuit board is installed on the turntable, all temperature conditions for global temperature calibration are set, wherein the calibration circuit board is integrated with n chips to be calibrated;

[0105] According to the all temperature conditions, the turntable is controlled to perform global temperature calibration.

[0106] Further, the step of partially calibrating the product to be calibrated on the turntable executed by the processor 301 includes:

[0107] After placing the product to be calibrated on the turntable, setting a preset temperature condition for local temperature calibration;

[0108] According to the preset temperature condition, the turntable is controlled to perform local temperature calibration on the placed product to be calibrated.

[0109] Furthermore, the method executed by the processor 301 further includes:

[0110] Before rotating the product to be calibrated on the turntable, installing the chip to be calibrated after global temperature calibration into the corresponding product to obtain the product to be calibrated;

[0111] The products to be calibrated are divided into batches, and the products to be calibrated are placed on the turntable in batches.

[0112] Further, the step of controlling the turntable to perform local temperature calibration on the placed product to be calibrated according to the preset temperature condition, executed by the processor 301, includes:

[0113] The turntable is controlled to measure the inherent deviation of the placed products to be calibrated under the preset temperature condition, and the local inherent deviation corresponding to each product to be calibrated is recorded.

[0114] Further, the step of calibrating each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain the calibration results of each of the products to be calibrated, performed by the processor 301, includes:

[0115] Calculating a local temperature compensation value of each of the products to be calibrated according to the temperature compensation curve of each of the chips to be calibrated and the local fixed deviation corresponding to the product to be calibrated;

[0116] The temperature compensation curve of each of the products to be calibrated is calibrated according to the local temperature compensation value to obtain the temperature compensation curve of each of the products to be calibrated.

[0117] Further, the step of calculating the local temperature compensation value of each product to be calibrated according to the temperature compensation curve of each product to be calibrated and the local fixed deviation, performed by the processor 301, includes:

[0118] Calculating the compensation value of each of the products to be calibrated under the preset temperature conditions according to the temperature compensation curve of each of the products to be calibrated;

[0119] The local temperature compensation value of each product to be calibrated is calculated according to the local fixed deviation corresponding to each product to be calibrated and the compensation value of each product to be calibrated under the preset temperature condition.

[0120] It should be noted that the electronic device provided in the embodiment of the present invention can be applied to devices such as smart phones, computers, servers, etc. that can perform turntable calibration.

[0121] The electronic device provided in the embodiment of the present invention can implement each process implemented by the turntable calibration method in the above method embodiment and can achieve the same beneficial effect. To avoid repetition, it will not be described here.

[0122] An embodiment of the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the various processes of the turntable calibration method or the application-end turntable calibration method provided in the embodiment of the present invention are implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0123] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc.

[0124] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A turntable calibration method, characterized in that: The following steps are involved: By performing global temperature calibration on the chip to be calibrated on the turntable, a temperature compensation curve corresponding to the chip to be calibrated is obtained, each chip to be calibrated corresponds to a temperature compensation curve, and the global temperature calibration is performed under all temperature conditions; The local fixed deviation of the product to be calibrated is obtained by performing local temperature calibration on the product to be calibrated on the turntable, wherein the local temperature calibration is performed under preset temperature conditions, the number of the preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated; Based on the temperature compensation curve and the local fixed deviation, calibrate each of the products to be calibrated to obtain a calibration result of each of the products to be calibrated; Wherein, the step of calibrating each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation to obtain the calibration results of each of the products to be calibrated includes: Calculating a local temperature compensation value of each of the products to be calibrated according to the temperature compensation curve of each of the chips to be calibrated and the local fixed deviation corresponding to the product to be calibrated; Calibrate the temperature compensation curve of each of the products to be calibrated according to the local temperature compensation value to obtain the temperature compensation curve of each of the products to be calibrated; The temperature compensation curve of the product to be calibrated is f n (t)+f n (t0)-εn; where f n (t) is the temperature compensation curve of the chip to be calibrated, f n (t0) is the compensation value of the nth chip to be calibrated at temperature t0, and εn is the local fixed deviation of the nth product to be calibrated.

2. The method according to claim 1, characterized in that The step of performing global temperature calibration on the chip to be calibrated on the turntable comprises: After the calibration circuit board is installed on the turntable, all temperature conditions for global temperature calibration are set, wherein the calibration circuit board is integrated with n chips to be calibrated; According to the all temperature conditions, the turntable is controlled to perform global temperature calibration.

3. The method according to claim 2, characterized in that The step of partially calibrating the product to be calibrated on the turntable comprises: After placing the product to be calibrated on the turntable, setting a preset temperature condition for local temperature calibration; According to the preset temperature condition, the turntable is controlled to perform local temperature calibration on the placed product to be calibrated.

4. The method according to claim 3, characterized in that The method further comprises: Before rotating the product to be calibrated on the turntable, installing the chip to be calibrated after global temperature calibration into the corresponding product to obtain the product to be calibrated; The products to be calibrated are divided into batches, and the products to be calibrated are placed on the turntable in batches.

5. The method according to claim 4, characterized in that The step of controlling the turntable to perform local temperature calibration on the placed product to be calibrated according to the preset temperature condition comprises: The turntable is controlled to measure the inherent deviation of the placed products to be calibrated under the preset temperature condition, and the local inherent deviation corresponding to each product to be calibrated is recorded.

6. The method according to claim 5, characterized in that The step of calculating the local temperature compensation value of each of the products to be calibrated according to the temperature compensation curve of each of the products to be calibrated and the local fixed deviation comprises: Calculating the compensation value of each of the products to be calibrated under the preset temperature conditions according to the temperature compensation curve of each of the products to be calibrated; The local temperature compensation value of each product to be calibrated is calculated according to the local fixed deviation corresponding to each product to be calibrated and the compensation value of each product to be calibrated under the preset temperature condition.

7. A turntable calibration device, characterized in that: include: A first acquisition module is used to perform global temperature calibration on the chip to be calibrated on the turntable to obtain a temperature compensation curve corresponding to the chip to be calibrated. Each chip to be calibrated corresponds to a temperature compensation curve. The global temperature calibration is performed under all temperature conditions. A second acquisition module is used to obtain a local fixed deviation of the product to be calibrated by performing local temperature calibration on the product to be calibrated on the turntable, wherein the local temperature calibration is performed under preset temperature conditions, the number of preset temperature conditions is less than the number of all temperature conditions, and the corresponding chip to be calibrated is installed in the product to be calibrated; A calibration module, used for calibrating each of the products to be calibrated based on the temperature compensation curve and the local fixed deviation, and obtaining a calibration result of each of the products to be calibrated; The calibration module is specifically used to implement: Calculating a local temperature compensation value of each of the products to be calibrated according to the temperature compensation curve of each of the chips to be calibrated and the local fixed deviation corresponding to the product to be calibrated; Calibrate the temperature compensation curve of each of the products to be calibrated according to the local temperature compensation value to obtain the temperature compensation curve of each of the products to be calibrated; The temperature compensation curve of the product to be calibrated is f n (t)+f n (t0)-εn; where f n (t) is the temperature compensation curve of the chip to be calibrated, f n (t0) is the compensation value of the nth chip to be calibrated at temperature t0, and εn is the local fixed deviation of the nth product to be calibrated.

8. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps in the turntable calibration method according to any one of claims 1 to 6 when executing the computer program.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the turntable calibration method according to any one of claims 1 to 6 are implemented.

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