A system and method for testing the shrinkage force of a glue

Abstract

The application discloses a kind of glue solidification shrinkage force test system and method, the system includes glue solidification bearing unit, pressure sensor and support.Two substrates are placed according to different scenes, and the two substrates are connected and fixed with pressure sensor;A certain test amount of glue is injected between the two substrates, to ensure that the glue is uniformly bonded to the two substrates, and the pressure sensor is zeroed;After the glue solidifies or during the solidification process, the measured value of the pressure sensor is read to obtain the solidification shrinkage force of the glue.The application solves the problem that the existing test method is difficult to obtain the solidification shrinkage force of the glue, can evaluate the solidification shrinkage force of the glue, obtain the best solidification condition, select the glue with smaller solidification shrinkage force, and reduce the influence of the solidification shrinkage force of the glue on the product.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of glue performance detection, and particularly relates to a glue curing shrinkage force testing system and method. BACKGROUND

[0002] Glue is a commonly used material in industrial production. However, the state of glue before and after curing is inconsistent. The modulus of glue rapidly increases after changing from a liquid state to a solid state, cross-linking reaction occurs, and shrinkage stress exists, which makes the volume of glue decrease. Shrinkage stress causes the parts connected by glue to warp, deform and other defects, greatly reduces the performance of products, especially the optical performance, and has a certain influence on the fields such as active alignment (AA) process and high-precision optical assembly adjustment. Therefore, it is of great scientific research and engineering significance to measure the glue curing shrinkage force.

[0003] However, in the prior art, there are few related glue curing shrinkage force testing methods, or the influence of glue curing shrinkage force on products is not evaluated in detail. In addition, the glue curing shrinkage force is relatively small, and cannot be tested by using other general mechanical property testing equipment of most materials, such as a universal material testing machine. SUMMARY

[0004] The application aims at the deficiencies of the prior art, and provides a glue curing shrinkage force testing system and method.

[0005] The application aims at the deficiencies of the prior art, and provides a glue curing shrinkage force testing system and method.

[0006] Further, the glue curing bearing unit includes two substrates. One substrate is fixed on the support, and the other substrate is fixed on one force receiving end of the mechanical sensor. The other force receiving end of the mechanical sensor is fixed on the support.

[0007] Further, the glue curing bearing unit includes two substrates. One substrate is fixed on the support, and the other substrate is fixed on one force receiving end of the mechanical sensor. The other force receiving end of the mechanical sensor is fixed on the support.

[0008] Further, the mechanical sensor includes a pressure sensor.

[0009] Further, the maximum range of the mechanical sensor is less than 300g.

[0010] Further, the force receiving end of the mechanical sensor is provided with a carrier plate. The force receiving end of the mechanical sensor is fixedly connected with the substrate or the support through the carrier plate.

[0011] A test method for glue curing shrinkage force, based on the above test system, comprising the following steps:

[0012] (1) Place two substrates, the angle of the two substrates is any angle from 0 degrees to 360 degrees, and the two substrates do not contact;

[0013] (2) Add glue between the two substrates;

[0014] (3) Zero the mechanical sensor;

[0015] (4) Cure the glue;

[0016] (5) Read the measurement value of the mechanical sensor after or during the curing of the glue, and obtain the curing shrinkage force of the glue.

[0017] Further, the minimum gap between the two substrates is less than 0.5 mm and greater than 0.

[0018] Further, the curing method of the glue includes UV curing, thermal curing, moisture curing, or a combination of two or more of the above curing methods; wherein if the curing method of the glue includes UV curing, at least one of the two substrates is a transparent material.

[0019] Further, the glue includes polypropylene resin, polyurethane adhesive, hot melt adhesive, epoxy resin adhesive, and silicone adhesive.

[0020] The present application has the following advantages: the present application solves the problem that the glue curing shrinkage force is difficult to obtain in the prior art, can evaluate the glue curing shrinkage force, optimize the curing conditions, select glue with smaller curing shrinkage force, reduce the influence of glue curing shrinkage force on products, and can also test the change of curing shrinkage force in real time during the curing process. The test method is simple and can be widely used for curing shrinkage force testing of various bonding methods and various bonding structures. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application.

[0022] Figure 1 It is a test schematic diagram for connecting glue with parallel substrates (test horizontal force);

[0023] Figure 2 It is a test schematic diagram for bonding glue with different angle structures (test angle force);

[0024] Figure 3 It is a test schematic diagram for connecting glue with vertical substrates (test vertical connection force);

[0025] In the figure: 1-glue, 2-substrate, 3-iron stand, 4-carrier plate, 5-table top, 6-pressure sensor. DETAILED DESCRIPTION

[0026] To make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application.

[0027] In order to deeply study the influence of glue curing shrinkage on products and optimize the performance of products, the present application provides a glue curing shrinkage force testing system and method, which can be used to evaluate the influence of glue curing shrinkage force on support deformation and stress and strain, optimize curing conditions according to the size of shrinkage force, obtain optimal curing conditions, glue usage and glue model, thereby improving the optical performance of products or reducing the influence of glue shrinkage stress on overall deformation of products.

[0028] The present application provides a glue curing shrinkage force testing system, which comprises a glue curing bearing unit, a mechanical sensor and a support. The glue curing bearing unit comprises two substrates 2. The support comprises an iron stand 3, a table top 5, a wall and the like. The mechanical sensor comprises a pressure sensor 6, and a carrier plate 4 is arranged on the force receiving end of the mechanical sensor. Specifically, one substrate 2 is fixed on the iron stand 3, and the other substrate 2 is fixed on one carrier plate 4 of the pressure sensor 6. The other carrier plate 4 of the pressure sensor 6 is fixed on the table top 5.

[0029] The present application provides a glue curing shrinkage force testing method, which specifically comprises the following steps:

[0030] (1) Two substrates 2 are placed according to different use scenarios of glue in products. The angle between the two substrates 2 can be any angle in 0-360 degrees, and the two substrates 2 do not contact.

[0031] As shown in Figure 1 , the two substrates 2 can be placed in parallel.

[0032] As shown in Figure 2 , the two substrates 2 can also be placed at an angle; wherein the two substrates 2 are placed vertically as shown in Figure 3 . It should be noted that the minimum gap between the two substrates 2 is less than 0.5 mm and greater than 0.

[0033] (2) Inject a certain amount of glue 1 between the two substrates 2 to ensure that the glue 1 uniformly bonds the two substrates 2. Specifically, according to different product requirements, different glue amounts and dispensing ranges are set.

[0034] (3) Zero the pressure sensor 6.

[0035] (4) Cure the glue 1. Specifically, the curing methods of the glue include UV curing, thermal curing, moisture curing, or a combination of two or more of the above curing methods. The glue can be a polypropylene resin, a polyurethane adhesive, a hot melt adhesive, an epoxy resin adhesive, a silicone adhesive, or other different component systems.

[0036] If the glue uses a UV curing system, at least one of the two substrates uses a transparent material such as glass, polycarbonate PC, polymethyl methacrylate PMMA, etc. for the transmission of UV light. The UV light intensity can be adjusted to adjust the curing speed to obtain the best curing conditions to minimize the impact of the curing shrinkage force on the product.

[0037] If the glue uses a thermal curing system, place the test system of the application in an oven and adjust the oven temperature to adjust the curing process to minimize the impact of the curing shrinkage force on the product.

[0038] If the glue uses a moisture curing system, place the test system of the application in an environment with controllable temperature and humidity, and the curing shrinkage force at different times can be observed in real time.

[0039] (5) After or during the curing of the glue 1, read the measurement value of the pressure sensor 6 to obtain the curing shrinkage force of the glue 1 in real time. The curing shrinkage force of the glue after curing can be tested, and the real-time curing shrinkage force of the glue during curing can also be tested to adjust the curing conditions and obtain the best curing conditions.

[0040] (6) Repeat the test procedures of steps (1) to (5) at least 3 times, then calculate the average value to obtain the final curing shrinkage force.

[0041] The application can test the shrinkage force in different directions, and the maximum range of the pressure sensor 6 is preferably less than 300g to improve the test accuracy; if necessary, the test glue amount is increased to increase the glue curing shrinkage force to improve the test accuracy; or a sensor with higher accuracy can also be selected.

[0042] Different structures and test principles of sensors are selected, such as a mechanical sensor that is simultaneously fixedly connected to the two substrates, which is more convenient for testing and obtaining the glue curing shrinkage force. With a sensor display control instrument, the relationship between force and time can be output in real time.

[0043] According to the size of the shrinkage force measured by the application, the selection of the glue is carried out, and the size of the shrinkage force is used as a basis for the selection of the glue type. After obtaining the solidification shrinkage force, the influence of the shrinkage force on the stress of the whole product and the deformation of the bonding part can be evaluated, and the amount of glue is adjusted; for the glue with relatively large shrinkage force, the amount of glue is appropriately reduced to reduce the solidification shrinkage force. Through the application, the best amount of glue and the best structure meeting the product requirements can be selected.

[0044] The above is only an embodiment of the application, and does not limit the protection scope of the application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the protection scope of the application.

Claims

1. A system for testing the curing shrinkage force of adhesive, characterized in that, It includes an adhesive curing support unit, a mechanical sensor, and a support; the adhesive curing support unit is fixedly connected to at least one end of the mechanical sensor, and the mechanical sensor is fixedly connected to the support. The adhesive curing support unit includes a first substrate and a second substrate, with a gap between the two substrates; the first substrate is fixed on a first support, the second substrate is fixed on a first force-bearing end above the force sensor, and the second force-bearing end below the force sensor is fixed on the second support. The force-receiving end of the mechanical sensor is provided with a carrier plate. The first force-receiving end of the mechanical sensor is fixedly connected to the second substrate through the first carrier plate, and the second force-receiving end of the mechanical sensor is fixedly connected to the second support through the second carrier plate.

2. The adhesive curing shrinkage test system according to claim 1, characterized in that, The mechanical sensor includes a pressure sensor.

3. The adhesive curing shrinkage test system according to claim 1, characterized in that, The maximum range of the mechanical sensor is less than 300g.

4. A method for testing the curing shrinkage force of adhesive, characterized in that, Based on the testing system according to any one of claims 1 to 3, the steps include: (1) Place two substrates, the angle between the two substrates is any angle from 0 degrees to 360 degrees, and the two substrates do not touch; (2) Apply glue between the two substrates; (3) Zero the force sensor; (4) Curing treatment of the adhesive; (5) After the glue has cured or during the curing process, read the measurement value of the mechanical sensor to obtain the curing shrinkage force of the glue.

5. The method for testing the curing shrinkage force of adhesive according to claim 4, characterized in that, The minimum gap between the two substrates is less than 0.5 mm and greater than 0.

6. The method for testing the curing shrinkage force of adhesive according to claim 4, characterized in that, The curing method of the adhesive includes UV curing, heat curing, moisture curing, or a combination of two or more of the above curing methods; wherein, if the curing method of the adhesive includes UV curing, then at least one of the two substrates is a transparent material.

7. The method for testing the curing shrinkage force of adhesive according to claim 4, characterized in that, Adhesives include polypropylene resin, polyurethane adhesives, hot melt adhesives, epoxy resin adhesives, and silicone adhesives.

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