An in-mold decorative plastic part and circuit integrated product

Abstract

The present invention discloses an in-mold decorative plastic part and circuit integrated product, comprising: an integrally injection-molded surface decorative film, a plastic body and a flexible circuit board, the lower surface of the surface decorative film is printed with functional ink for touch operation, the flexible circuit board comprises a PC substrate, the surface of the PC substrate is printed with transparent conductive ink and conductive silver paste, the surface of the flexible circuit board is integrated with electronic components, and the bottom end of the flexible circuit board is welded with a flexible connecting plug; the present invention also provides a preparation process for the in-mold decorative plastic part and circuit integrated product, through the above method, the present invention can greatly compress the size and weight of the overall component space, and at the same time reduce the dependence on the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of in-mold decoration, and in particular to an in-mold decoration plastic part and circuit integrated product. Background Art

[0002] In-mold decoration, that is, decoration by injection molding of in-mold inserts, is a currently popular surface decoration technology in the world. It is mainly used in functional control panels, instrument panels, decorative surface shells, etc. In order to realize the touch and display functions of the patterns in the in-mold decorative plastic parts, conventional in-mold decorative plastic parts need to be connected with other parts such as circuit boards to be assembled into components.

[0003] In the prior art, components are connected by in-mold decorative plastic parts and traditional circuit boards. Traditional circuit boards occupy a large space, and the overall weight and size of the components increase, which cannot meet the needs of lightweight, miniaturized and intelligent design. In addition, the existing R&D cycle and production cycle for in-mold decorative plastic parts and circuit integration products are long, and the production cost is high. Summary of the invention

[0004] The main technical problem solved by the present invention is to provide an in-mold decorative plastic part and circuit integrated product, which can greatly reduce the size and weight of the overall component space and reduce the dependence on the circuit board.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an in-mold decorative plastic part and circuit integrated product, including: an integrally injection-molded surface decorative film, a plastic body and a flexible circuit board, the lower surface of the surface decorative film is printed with functional ink for touch operation, the flexible circuit board includes a PC substrate, the surface of the PC substrate is printed with transparent conductive ink and conductive silver paste, the surface of the flexible circuit board is integrated with electronic components, and the bottom end of the flexible circuit board is welded with a flexible connecting plug.

[0006] Preferably, the surface of the functional ink is coated with diamond grease, and the curing hardness of the diamond ink is higher than 3H.

[0007] Preferably, the impedance value of the functional ink is between 10 10 ~10 12 ohm.

[0008] Preferably, the surface of the conductive silver paste is coated with diamond grease.

[0009] Preferably, the flexible connecting plug comprises conductive silver paste, anti-interference silver paste, gold fingers and conductive binder which are sequentially arranged in structure.

[0010] Preferably, a protective layer is provided between the gold finger and the conductive binder.

[0011] The present invention also provides a process for preparing an in-mold decorative plastic part and a circuit integrated product, comprising the following preparation steps:

[0012] (1) Making surface decorative films:

[0013] A. Screen print the required pattern and color on it;

[0014] B. Print a layer of functional ink for touch buttons and tracking;

[0015] C. Print another layer of diamond grease for wrapping;

[0016] D. High-pressure blister molding to form a 3D shape, cut off the excess film, and then conduct circuit function testing;

[0017] (2) Making flexible circuit boards:

[0018] E. Screen print transparent conductive ink on the film of PC substrate, which is used in the area where light needs to be transmitted on the surface of the product;

[0019] F. Print a layer of conductive silver paste;

[0020] G. Print another layer of diamond grease for wrapping;

[0021] H. Place the printed flexible circuit board on the equipment that automatically attaches electronic components, and a high-precision robot will perform glue dispensing at each location where electronic components need to be installed;

[0022] I. The automatic bonding machine places the electronic components on each path onto the conductive adhesive according to the programmed program, and leaves them at room temperature for more than 5 hours until the conductive adhesive is completely dry;

[0023] J. Sampling test of the adhesive force of electronic components, with a standard requirement of greater than 10N;

[0024] K. High-pressure blister molding to form a 3D shape, the blister molding pressure is 90~120bar, and the excess diaphragm is cut off, and then the circuit function test is carried out;

[0025] (3) placing the prepared surface decoration film and flexible circuit board into an injection mold for injection molding to obtain an integrally injection-molded surface decoration film, plastic body and flexible circuit board;

[0026] (4) Making a flexible connection plug:

[0027] L. Print conductive silver paste, anti-interference silver paste, gold finger, protective layer and conductive adhesive in sequence;

[0028] M. Cut out the required shape;

[0029] (5) Solder one end of the flexible connection plug to the above-mentioned injection-molded flexible circuit board to perform a circuit function test, and then insert the other end into the power supply to achieve the conductive touch function.

[0030] Preferably, in the above step H, the printing positioning points are captured by a CCD on an automatic laminating machine to position the flexible circuit board, and the position accuracy of the printing positioning points is less than 0.05 mm.

[0031] Preferably, in the above step I, the process of placing the electronic components to bond the conductive adhesive should not exceed 30 seconds.

[0032] Preferably, in the injection mold of step (3) above, the corresponding area where the flexible circuit board is placed is designed as a vacuum suction insert, and the part of the conductive silver paste exposed to the atmosphere needs to be designed with a slider structure on the mold, and a lightning rod is set behind the slider to conduct electricity so that it is fully grounded.

[0033] The beneficial effects of the present invention are:

[0034] The in-mold decorative plastic part and circuit integrated product provided by the present invention can greatly compress the thickness of the overall component and the size of the space occupied by it, effectively reducing the weight, and can meet the market demand for lightweight, intelligent and miniaturized. At the same time, it can effectively reduce the dependence on circuit boards and greatly reduce the overall component cost. The preparation process is simple and easy to execute, which significantly shortens the overall development and production cycle, reduces the cost of the overall component, and has good market promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the exploded structure of an in-mold decorative plastic part and circuit integrated product of the present invention;

[0036] Figure 2 It is the structural design of the vacuum suction insert and the slider in the injection mold of the present invention;

[0037] The markings of the components in the accompanying drawings are as follows:

[0038] 1. Surface decorative film; 2. Plastic body; 3. Flexible circuit board; 4. Flexible connecting plug; 5. Vacuum suction insert; 6. Slider. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present invention are described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention. Example

[0040] like Figure 1As shown, an in-mold decorative plastic part and circuit integrated product includes an integrally injection-molded surface decorative film 1, a plastic body 2 and a flexible circuit board 3, wherein: the lower surface of the surface decorative film 1 is printed with functional ink for touch operation, and the impedance value of the functional ink is between 10 10 ~10 12 Ohm, preferably 10 11 Ohm, the surface of the functional ink is coated with diamond grease, and the curing hardness of the diamond ink is higher than 3H.

[0041] like Figure 1 As shown, the flexible circuit board 3 includes a PC substrate, a transparent conductive ink and a conductive silver paste are printed on the surface of the PC substrate, the surface of the conductive silver paste is wrapped with diamond grease, electronic components are integrated on the surface of the flexible circuit board 3, and a flexible connection plug 4 is welded at the bottom of the flexible circuit board 3. The flexible connection plug 4 includes a conductive silver paste, an anti-interference silver paste, a gold finger, a protective layer and a conductive binder which are sequentially arranged.

[0042] The working principle of the above-mentioned in-mold decorative plastic parts and circuit integrated products is: the surface is a decorative pattern, the bottom is printed with a film of high-impedance ink, the middle is a plastic body, and the bottom is a flexible circuit film printed with conductive ink. The conductive touch function is achieved by welding one end of the flexible connecting plug to the flexible circuit board and inserting the other end into a small circuit board, i.e., the power supply.

[0043] like Figure 1 and Figure 2 As shown, a preparation process of an in-mold decorative plastic part and circuit integrated product includes the following preparation steps:

[0044] (1) Production process of surface decorative film:

[0045] A. First, screen print the required pattern and color on it;

[0046] B. Print a layer of functional ink for touch buttons and tracking;

[0047] C. Print another layer of diamond grease for wrapping;

[0048] D. High-pressure blister molding to form a 3D shape, cut off the excess film, and then conduct circuit function testing;

[0049] (2) The production process of flexible circuit boards:

[0050] E. Screen print transparent conductive ink on the film of PC substrate, which is used in the area where light needs to be transmitted on the surface of the product;

[0051] F. Print a layer of conductive silver paste;

[0052] G. Print another layer of diamond grease for wrapping;

[0053] H. Place the printed flexible circuit board on the equipment for automatic bonding of electronic components. Preferably, the CCD on the automatic bonding machine is used to capture the printing positioning points to position the flexible circuit board. The position accuracy of the printing positioning points should be less than 0.05mm. A high-precision robot is used to dispense glue at each position where electronic components need to be installed. The glue is conductive adhesive.

[0054] I. The automatic bonding machine places the electronic components on each path to the conductive adhesive according to the programmed program. The process of placing the electronic components to the conductive adhesive shall not exceed 30 seconds, and the conductive adhesive shall be left at room temperature for more than 5 hours until it is completely dry.

[0055] J. Sampling test of the adhesive force of electronic components, with a standard requirement of greater than 10N;

[0056] K. High-pressure blister molding to form a 3D shape, the blister molding pressure is 90~120bar, and the excess diaphragm is cut off, and then the circuit function test is carried out;

[0057] (3) Place the prepared surface decoration film and flexible circuit board into the injection mold for injection molding. The corresponding area where the flexible circuit board is placed is designed as a vacuum suction insert 5 to completely position the flexible circuit board in the injection mold. At the same time, the part of the conductive silver paste exposed to the atmosphere needs to be designed with a slider 6 on the mold, and a lightning rod is set behind the slider 6 to conduct electricity so that it can play a role in full grounding, and finally obtain an integrally injection-molded surface decoration film 1, plastic body 2 and flexible circuit board 3;

[0058] (4) Making a flexible connection plug:

[0059] L. Print conductive silver paste, anti-interference silver paste, gold finger, protective layer and conductive adhesive in sequence;

[0060] M. Cut out the required shape;

[0061] (5) Weld one end of the flexible connecting plug to the above-mentioned flexible circuit board after injection molding, and insert the other end into the power supply to realize the conductive touch function. This is the preparation process flow of an in-mold decorative plastic part and circuit integrated product of the present invention. The prepared product is miniaturized, lightweight and intelligent.

Claims

1. An in-mold decorative plastic part and circuit integrated product, characterized in that: include: A surface decoration film, a plastic body and a flexible circuit board are integrally injection molded, wherein the lower surface of the surface decoration film is printed with functional ink for touch operation, and the surface of the functional ink is coated with diamond grease, and the curing hardness of the diamond grease is higher than 3H; The flexible circuit board comprises a PC substrate, a surface of the PC substrate is printed with transparent conductive ink and conductive silver paste, the surface of the conductive silver paste is wrapped with diamond grease, the surface of the flexible circuit board is integrated with electronic components, the bottom end of the flexible circuit board is welded with a flexible connection plug, and the flexible connection plug comprises conductive silver paste, anti-interference silver paste, gold fingers and conductive binder which are sequentially arranged in structure; The preparation process of the above-mentioned in-mold decorative plastic parts and circuit integrated products includes the following preparation steps: (1) Making surface decorative films: A. Screen print the required pattern and color on it; B. Print a layer of functional ink for touch buttons and tracking; C. Print another layer of diamond grease for wrapping; D. High-pressure blister molding to form a 3D shape, cut off the excess film, and then conduct circuit function testing; (2) Making flexible circuit boards: E. Screen print transparent conductive ink on the film of PC substrate, which is used in the area where light needs to be transmitted on the surface of the product; F. Print a layer of conductive silver paste; G. Print another layer of diamond grease for wrapping; H. Place the printed flexible circuit board on the equipment that automatically attaches electronic components, and a high-precision robot will perform glue dispensing at each location where electronic components need to be installed; I. The automatic bonding machine places the electronic components on each path onto the conductive adhesive according to the programmed program, and leaves them at room temperature for more than 5 hours until the conductive adhesive is completely dry; J. Sampling test of the adhesive force of electronic components, with a standard requirement of greater than 10N; K. High-pressure blister molding to form a 3D shape, the blister molding pressure is 90-120 bar, and the excess diaphragm is cut off, and then the circuit function test is carried out; (3) placing the prepared surface decoration film and flexible circuit board into an injection mold for injection molding to obtain an integrally injection-molded surface decoration film, plastic body and flexible circuit board; in the injection mold of this step, the corresponding area where the flexible circuit board is placed is designed as a vacuum suction insert, and the part of the conductive silver paste exposed to the atmosphere needs to be designed with a slider structure on the mold, and a lightning rod is set behind the slider for conductivity to ensure that it is fully grounded; (4) Making a flexible connection plug: L. Print conductive silver paste, anti-interference silver paste, gold finger, protective layer and conductive adhesive in sequence; M. Cut out the required shape; (5) One end of the flexible connection plug is welded to the above-mentioned injection-molded flexible circuit board to perform a circuit function test, and then the other end is plugged into a power source to achieve a conductive touch function.

2. The in-mold decorative plastic part and circuit integrated product according to claim 1, characterized in that: The impedance value of the functional ink is between 10 10 ~10 12 ohm.

3. The in-mold decorative plastic part and circuit integrated product according to claim 1, characterized in that: A protective layer is arranged between the gold finger and the conductive binder.

4. The in-mold decorative plastic part and circuit integrated product according to claim 1, characterized in that: In the above step H, the CCD on the automatic bonding machine is used to capture the printing positioning points to position the flexible circuit board, and the position accuracy of the printing positioning points must be less than 0.05mm.

5. The in-mold decorative plastic part and circuit integrated product according to claim 4, characterized in that: In the above step I, the process of placing the electronic components and bonding the conductive adhesive shall not exceed 30 seconds.

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