Filter components, camera modules and multi-camera modules

Abstract

The present invention relates to a filter assembly, which includes: a bracket, which includes an annular lens seat and a cantilever beam formed by extending inward from the lens seat, and the cantilever beam has a light hole in the center; and a filter, which is adhered to the surface of the cantilever beam by adhesive, and the surface of the cantilever beam has an overlapping area overlapping with the filter; wherein the overlapping area includes a main adhesive area and a stress buffer area, the main adhesive area is used to arrange the adhesive, the stress buffer area is located at the corner of the overlapping area, and the stress buffer area has an adhesive method different from that of the main adhesive area to reduce the stress transmitted from the cantilever beam to the filter. The present invention also provides a corresponding camera module and a multi-camera module. The present invention can reduce the risk of filter fragmentation or bending in a camera module, and is particularly suitable for a camera module using a filter with a large area-to-thickness ratio.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a filter assembly and a corresponding camera module and a multi-camera module. Background Art

[0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have been rapidly developed and improved, and in recent years, camera modules have been widely used in many fields such as medical, security, industrial production, etc. In order to meet the increasingly broad market demand, high pixels, large chips, small sizes, and large apertures are the irreversible development trend of existing camera modules. In particular, with the increasing demand for mobile phone photography, the number of pixels in mobile phone camera modules is increasing, and the area of ​​photosensitive chips is increasing, which leads to the need for the size of the lens holder to be correspondingly larger, and the filter installed on the lens holder also needs to be correspondingly larger, which leads to the increased risk of filter breakage in the existing camera module structure.

[0003] Specifically, Figure 1 A typical cross-sectional diagram of a mobile phone camera module is shown. Figure 1 , the camera module includes a lens assembly 100, a filter assembly 200 and a photosensitive assembly 300. The lens assembly 100 includes an optical lens and its auxiliary structural parts, the filter assembly 200 includes a filter and its auxiliary structural parts, and the photosensitive assembly 300 includes a circuit board 310, a photosensitive chip 320 attached to the surface of the circuit board 310, and electronic components 330 (such as resistors, capacitors, etc.) installed on the surface of the circuit board 310 and surrounding the photosensitive chip 320. The filter is sometimes also called a color filter, which is usually an IR filter, which can be used to filter out infrared bands to improve imaging quality. The filter is usually installed at the rear end of the last lens of the lens group of the optical lens (the rear end refers to the end close to the image side) and the front end of the photosensitive chip (the front end refers to the end close to the object side). At present, the pixels of mobile phone camera modules are increasing, and the area of ​​photosensitive chips is getting larger and larger, so a filter with a larger area is needed. However, on the other hand, people expect the size of the mobile phone camera module to be as small as possible, especially the height of the mobile phone camera module (i.e. the size in the optical axis direction) to be as small as possible to avoid the thickness of the mobile phone being too large. This makes it difficult for the thickness of the filter to increase as its area increases. In other words, the increase in the area of ​​the filter will lead to an increase in the area-to-thickness ratio (i.e. the filter becomes relatively thinner), so the filter is more likely to break or bend. If no corresponding improvements are made, the production yield of the camera module may decrease, which is not conducive to large-scale mass production.

[0004] Therefore, there is an urgent need for a solution that can reduce the risk of filter breakage or bending in camera modules. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a solution that can reduce the risk of filter breakage or bending in a camera module.

[0006] In order to solve the above technical problems, the present invention provides a filter assembly, which is used in a camera module, and the filter assembly includes: a bracket, which includes an annular lens seat and a cantilever beam extending inward from the lens seat, and the center of the cantilever beam has a light hole; and a filter, which is adhered to the surface of the cantilever beam by adhesive, and the surface of the cantilever beam has an overlapping area overlapping with the filter; wherein the overlapping area includes a main adhesive area and a stress buffer area, the main adhesive area is used to arrange the adhesive, the stress buffer area is located at the corner of the overlapping area, and, compared with the main adhesive area, the stress buffer area is suitable for reducing the stress transmitted from the cantilever beam to the filter. For example, the stress buffer area can reduce the stress transmitted from the cantilever beam to the filter by adopting an adhesive method different from that of the main adhesive area.

[0007] Wherein, the adhesive is not arranged in the stress buffer area.

[0008] The adhesive is arranged in the stress buffer area, and the width of the adhesive in the stress buffer area is smaller than the width of the adhesive in the main adhesive distribution area.

[0009] The adhesive comprises a first adhesive and a second adhesive, the first adhesive is arranged in the main adhesive area, the second adhesive is arranged in the stress buffer area, and the elastic modulus of the second adhesive is smaller than that of the first adhesive.

[0010] The overlapping area is in the form of a rectangular ring, the main adhesive area includes four strip areas corresponding to the four sides of the rectangular ring, and the stress buffer area includes at least two corner areas of the rectangular ring.

[0011] Wherein, the stress buffer zone includes four corner areas of the rectangular ring.

[0012] The mirror seat portion has a first side, the first side has a avoidance structure for avoiding motor pins, and the stress buffer zone includes the two corner areas of the rectangular ring located on one side of the first side.

[0013] The mirror seat portion further comprises a second side located on the opposite side of the first side, and a third side and a fourth side intersecting the first side, and the widths of the second side, the third side and the fourth side in a top view are all greater than the first side.

[0014] In which, the mirror seat portion also has a second side located on the opposite side of the first side, and a third side and a fourth side intersecting the first side; in a top view, the width of the second side is greater than the width of the third side, and also greater than the width of the fourth side, and the stress buffer zone includes the four corner areas of the rectangular ring.

[0015] The width of the adhesive in the stress buffer zone is 0.1-0.25 mm, and the width of the adhesive in the main adhesive area is 0.3-0.4 mm.

[0016] Wherein, the top surface of the lens seat portion is suitable for installing a motor or a lens carrier.

[0017] Wherein, the bottom surface of the lens seat portion is suitable for being installed on a photosensitive component.

[0018] The lens seat portion includes a side wall and a support portion formed by bending at the top of the side wall, the top surface of the support portion is suitable for installing a motor or a lens carrier, and the cantilever beam is formed by extending inwardly from the support portion.

[0019] Wherein, the thickness of the cantilever beam is smaller than the thickness of the supporting part.

[0020] According to another aspect of the present application, a camera module is also provided, which includes: any one of the aforementioned color filter components; a lens component; and a photosensitive component, wherein the color filter component is located between the lens component and the photosensitive component.

[0021] The top surface of the lens seat is supported and installed on the bottom surface of the lens assembly, and the bottom surface of the lens seat is supported and installed on the top surface of the photosensitive assembly.

[0022] The photosensitive component includes a circuit board and a photosensitive chip installed on the surface of the circuit board, the bottom surface of the mirror seat is installed on the surface of the circuit board, and the mirror seat surrounds the photosensitive chip.

[0023] Among them, the photosensitive component includes a circuit board, a photosensitive chip installed on the surface of the circuit board, electronic components installed on the surface of the circuit board, and a packaging part surrounding the photosensitive chip and covering the electronic components, and the bottom surface of the mirror seat part is installed on the top surface of the packaging part.

[0024] Among them, the lens assembly has a motor, the motor includes a motor pin for electrically connecting to a circuit board, the lens seat portion has a first edge, the first edge has an avoidance structure, the motor pin passes through the avoidance structure from the bottom surface of the motor and is connected to the circuit board, and the stress buffer zone includes the two corner areas of the rectangular ring located on one side of the first edge.

[0025] According to another aspect of the present application, a multi-camera module is provided, comprising: an external bracket having a plurality of accommodating holes; any of the aforementioned camera modules, and the camera modules have a plurality of them, each of the camera modules is placed in one of the accommodating holes, wherein the outer side surface of the lens assembly of at least one of the camera modules is bonded to the external bracket by adhesive.

[0026] According to another aspect of the present application, a multi-camera module is also provided, which includes: an external bracket having multiple accommodating holes; any of the aforementioned camera modules, and the camera modules have multiple ones, each of the camera modules is placed in one of the accommodating holes, wherein the outer side surface of the lens assembly of at least one of the camera modules is bonded to the external bracket by adhesive, and the outer side surface of the lens seat portion of the camera module is also bonded to the external bracket by adhesive.

[0027] Compared with the prior art, the present invention has at least one of the following technical effects:

[0028] 1. This application can reduce the risk of filter breakage or bending in the camera module;

[0029] 2. This application can better adapt to the situation where the area thickness of the filter is relatively large, and significantly reduce the risk of filter breakage or bending. For example, the assembly process of the camera module may need to be processed in high and low temperature environments, and such temperature changes may increase the risk of breakage or bending of filters with a large area thickness ratio. This application can reduce the risk of filter breakage or bending caused by temperature changes during the assembly process of the camera module;

[0030] 3. In some embodiments of the present application, the problem of uneven stress in the filter holder can be solved or suppressed by setting a stress buffer zone, thereby reducing the risk of filter breakage or bending. In some cases, the filter holder (sometimes also called the lens holder) used to install the filter may be asymmetric (for example, one side of the lens holder may need to avoid the motor pins, resulting in a narrower width or complex shape of the lens holder on that side), which may cause asymmetric stress in the filter holder, thereby increasing the risk of filter breakage or bending. The present application can suppress this risk by setting a stress buffer zone;

[0031] 4. The present application can reduce the risk of breakage or bending of filters in multi-camera modules by setting a stress buffer zone. In a multi-camera module, the interaction between the external bracket and the lens holder inside each module may generate stress, which will also increase the risk of breakage or bending of filters with a large area-to-thickness ratio. The present application can reduce the risk of breakage or bending of filters in a multi-camera module by setting a stress buffer zone. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A cross-sectional schematic diagram of a typical mobile phone camera module is shown;

[0033] Figure 2A A schematic top view of a support 210 of an optical filter in one embodiment of the present application is shown;

[0034] Figure 2B A schematic top view of a filter holder 210 with an overlap region 213 marked in one embodiment of the present application is shown;

[0035] Figure 3 A schematic top view of a bracket 210 for mounting a color filter in a conventional camera module is shown;

[0036] Figure 4 A cross-sectional schematic diagram of a camera module having a motor 120 in one embodiment of the present application is shown;

[0037] Figure 5 A schematic top view of a color filter holder 210 having an asymmetric structure in one embodiment of the present application is shown;

[0038] Figure 6 FIG. 2 shows a schematic top view of a color filter holder 210 having an asymmetric structure in a modified embodiment of the present application;

[0039] Figure 7 FIG. 2 shows a schematic top view of a color filter holder 210 having an asymmetric structure in another modified embodiment;

[0040] Figure 8 A cross-sectional schematic diagram of a camera module having a molding portion 340 in another embodiment of the present application is shown;

[0041] Fig. 9 A cross-sectional schematic diagram of a camera module having a molding portion 340 in another embodiment of the present application is shown;

[0042] Fig.10 A cross-sectional schematic diagram of a multi-camera module in one embodiment of the present application is shown;

[0043] Fig.11 A schematic top view of a color filter holder 210 is shown in one embodiment of the present application, which realizes stress buffering by reducing the width of the adhesive;

[0044] Fig.12 Shows Fig.11 An enlarged schematic diagram of a corner area;

[0045] Fig.13 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by reducing the width of the adhesive;

[0046] Fig.14 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by reducing the width of the adhesive;

[0047] Fig.15 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by reducing the width of the adhesive;

[0048] Fig.16 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which uses a soft adhesive material to achieve stress buffering;

[0049] Fig.17 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which uses a soft adhesive material to achieve stress buffering;

[0050] Fig.18 A top view schematically shows a color filter holder 210 that uses a soft adhesive material to achieve stress buffering in another embodiment of the present application. DETAILED DESCRIPTION

[0051] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] It should be noted that in this specification, the expressions of first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of this application, the first subject discussed below can also be referred to as the second subject.

[0053] In the drawings, the thickness, size and shape of objects have been slightly exaggerated for ease of explanation. The drawings are only examples and are not drawn strictly to scale.

[0054] It should also be understood that the terms "comprises", "including", "having", "includes" and / or "comprising", when used in this specification, indicate the presence of the stated features, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0055] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those of ordinary skill in the art.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0057] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0058] According to an embodiment of the present application, a camera module is provided that can reduce the risk of filter breakage or bending. Figure 1In this embodiment, the camera module includes a lens assembly 100, a filter assembly 200 and a photosensitive assembly 300. The lens assembly 100 includes an optical lens and its accessory structural parts (such as a motor 120 or a lens carrier), the filter assembly 200 includes a filter and its accessory structural parts, and the photosensitive assembly 300 includes a circuit board 310, a photosensitive chip 320 attached to the surface of the circuit board 310, and electronic components 330 (such as resistors, capacitors and other electronic components) installed on the surface of the circuit board 310 and surrounding the photosensitive chip 320. The filter is sometimes also referred to as a color filter 220. In a mobile phone camera module, the color filter 220 is usually an IR filter, which can be used to filter out infrared bands to improve imaging quality. In this embodiment, the auxiliary structural member in the filter assembly 200 may be a bracket 210, which may include an annular lens seat 211 and a cantilever beam 212 extending inwardly from the lens seat 211 (inwardly may be understood as a direction toward the optical center of the camera module), and the cantilever beam 212 has a light hole in the center to allow light to pass through and enter the photosensitive chip 320. Further, Figure 2A A schematic top view of a support 210 for an optical filter in one embodiment of the present application is shown. Figure 2B FIG. 2 is a top view of a filter holder 210 with an overlap region 213 marked in one embodiment of the present application. Figure 1 , Figure 2A and Figure 2B It can be seen that the filter can be adhered to the surface of the cantilever beam 212 by an adhesive. Here, the adhesive is used to adhere the IR filter, so it can also be called IR glue. Specifically, the surface of the cantilever beam 212 has an overlapping area 213 that overlaps with the filter. The overlapping area 213 here refers to the area on the surface of the cantilever beam 212 that overlaps with the filter at a top view angle. The overlapping area 213 includes a main adhesive area and a stress buffer area. The main adhesive area is used to arrange the adhesive (i.e., IR glue 230). The stress buffer area is located at the corner of the overlapping area 213 (referred to as corner area 214 herein), and the IR glue 230 may not be arranged in the stress buffer area. Figure 2BAs shown, in this embodiment, the overlapping area 213 is rectangular, has a rectangular through hole in the center, and its outer contour is also rectangular. The four sides of the filter are mounted on the cantilever beam 212 through IR glue 230 (that is, the IR glue 230 is arranged in the main glue area of ​​the overlapping area 213), and no adhesive is arranged in the four corner areas 214 of the overlapping area 213, so that there is a gap between the four corner areas 214 of the filter and the four corner areas 214 of the corresponding cantilever beam 212 surface (that is, the two do not support each other in the four corner areas 214), thereby reducing the stress transmitted from the cantilever beam 212 to the filter. This design can improve the problem of the fragility of the color filter under the trend of increasing photosensitive chips in camera modules.

[0059] Specifically, the inventors have found through research and experiments that, as the photosensitive chip of the camera module becomes larger and larger, the corners of the color filter are more likely to break. The reasons can be summarized as follows: first, the increase in the area of ​​the photosensitive chip leads to a larger area of ​​the required color filter, while the thickness of the color filter remains unchanged or becomes smaller, resulting in a larger area / thickness ratio (i.e., area-to-thickness ratio) of the color filter, which makes the color filter itself more easily deformed and more brittle; second, the breakage of the color filter is caused by the stress it is subjected to and the microcracks on the surface of the color filter. This stress is mainly caused by the mounting bracket 210 (the bracket 210 can serve as a lens holder for supporting the lens assembly 100 and has a cantilever for mounting the color filter). The stress is transmitted from the lens holder 211 to the cantilever beam 212. When the stress acts on the color filter, the micro cracks on the surface of the color filter are aggravated. Furthermore, the CTE (coefficient of thermal expansion) of the mounting bracket 210 of the color filter is relatively large. Under high or low temperature conditions, the color filter bracket 210 is easily deformed and generates stress, especially the stress is more concentrated at the cantilever beam, and the corner of the cantilever beam is where the shape of the cantilever beam suddenly changes, which is more likely to concentrate stress, resulting in stress being more concentrated at the corner of the color filter. Finally, at low temperatures, the IR glue 230 has low elasticity and high hardness, so that the stress generated by the lens holder 211 and the cantilever beam 212 is transmitted to the color filter through the hardened IR glue 230. Based on the above analysis, the inventor designed a main glue area and a stress buffer zone on the surface of the cantilever beam. The stress buffer zone is located at the corner of the cantilever beam (specifically, the corner of the overlapping zone 213). The IR glue may not be arranged in the stress buffer zone, thereby eliminating a large amount of stress. On the other hand, since the IR glue is still arranged on the four sides of the cantilever beam, it can provide sufficient bonding strength to ensure the reliability of assembly. Figure 3 FIG. 2 shows a schematic top view of a bracket 210 for mounting a color filter in a conventional camera module. Figure 3 In a conventional camera module, the glue is usually applied around the central light hole. The difference in the glue application method of this embodiment is that the IR glue 230 at the four corners is eliminated (such as Figure 2AThe design of this embodiment can prevent stress from being transferred from the lens holder 211 and the cantilever beam 212 to the corners of the color filter, thereby preventing the color filter from being broken.

[0060] It should be noted that in the above embodiment, the four corner areas 214 of the overlapping area 213 of the cantilever beam 212 are all set as stress buffer areas, but this is not the only implementation method of the present application. In other embodiments of the present application, two or other numbers of stress buffer areas can also be set. As long as the stress buffer areas are set at the corners, the stress transmitted from the color filter holder 210 to the color filter 220 can be significantly reduced. At the same time, since the cantilever beam 212 has at least four sides where glue can be arranged, problems such as weak bonding or reduced reliability due to too little glue can be avoided.

[0061] Furthermore, in one embodiment, the bracket 210 for mounting the color filter 220 may have an asymmetric structure. Figure 4 A cross-sectional schematic diagram of a camera module having a motor 120 in one embodiment of the present application is shown. Figure 5 FIG. 2 is a top view schematic diagram of a color filter holder 210 with an asymmetric structure in one embodiment of the present application. Figure 4 and Figure 5 In this embodiment, the lens assembly 100 may have a motor 120, which is electrically connected to the circuit board 310 of the photosensitive component 300 through a motor pin 121. The bottom surface of the motor 120 may be supported and attached to the mirror seat 211 of the bracket 210. Since there are more motor pins 121 on one side of the motor 120 to achieve electrical connection with the circuit board 310, in order to leave a space for avoidance, the side of the mirror seat 211 for arranging the motor pins 121 has a narrower width (which can be understood as the width in a top-down perspective), and the shape of the mirror seat on this side will also be relatively complex. In other words, in this embodiment, the mirror seat 211 of the bracket 210 may have three wide sides and one narrow side, and the shape of the narrow side is relatively complex, so the narrow width and the complex shape will cause the stress of the narrow side to be more easily concentrated. Therefore, in this embodiment, the two corner areas 214 located on one side of the narrow side can be set as a stress buffer. The stress buffer avoids the arrangement of IR glue. This design can better adapt to the camera module with a motor, prevent the concentrated stress from being transmitted from the lens holder 211 to a specific corner of the color filter 220, and thus prevent the color filter 220 from breaking. It should be noted that although only two corner areas 214 of the overlapping area 213 are set as stress buffers in this embodiment, the present application is not limited thereto. For example, in another embodiment, the four corner areas 214 of the overlapping area 213 can be set as the stress buffers, and the four corner areas 214 set as stress buffers are not arranged with glue, such as Figure 6 As shown ( Figure 6210 is a top view schematic diagram of a color filter holder 210 with an asymmetric structure in a modified embodiment of the present application). For ease of description, the complex-shaped side with the avoidance structure 219 is sometimes referred to as the first side 215, the side opposite thereto is referred to as the second side 216, and the two sides perpendicular to (or crossing) the first side 215 are referred to as the third side 217 and the fourth side 218, respectively.

[0062] Figure 7 FIG. 2 shows a top view of a color filter holder 210 with an asymmetric structure in another modified embodiment. In this embodiment, the color filter holder 210 has a wide side, two narrow sides, and a complex side having a motor pin 121 avoidance area (i.e., having an avoidance structure 219 for avoiding the motor pin 121). Figure 7 The complex side of the structure is the first side 215). The two narrow sides are opposite to each other (ie, they are parallel to each other, Figure 7 The two narrow sides are the third side 217 and the fourth side 218, respectively. The wide side is perpendicular to (or crosses) the two narrow sides, and the complex side is opposite to the wide side (i.e., the two are parallel to each other. Figure 7 The middle wide side is the second side 216). In this embodiment, the four corner areas 214 of the cantilever beam 212 of the color filter holder 210 can be set as stress buffers. The stress buffers avoid arranging IR glue to significantly reduce the stress transmitted from the lens holder 211 and the cantilever beam 212 to the color filter 220, thereby preventing the color filter 220 from breaking. Figure 6 In the embodiment shown, since the two wide sides are changed into two narrow sides, the stress inside the bracket 210 is greater and the color filter is more likely to break. Therefore, in the embodiment, gaps are retained between the color filter and the cantilever beam at the four corners, that is, stress buffer zones are provided at the positions corresponding to the four corners, thereby effectively preventing the color filter from breaking.

[0063] It should be noted that in other embodiments of the present application, the camera module may also use a color filter holder with other asymmetric structures, for example, the four sides of the color filter holder may all have different widths and shapes, that is, any two sides may have different widths or shapes. In this case, gaps may be left between the color filter and the cantilever beam at the four corners of the overlapping area of ​​the color filter holder, that is, stress buffer zones may be provided at the positions corresponding to the four corners, thereby effectively preventing the color filter from breaking.

[0064] Further, Figure 8 FIG. 3 is a cross-sectional schematic diagram of a camera module having a molding portion 340 in another embodiment of the present application. Figure 8In this embodiment, the photosensitive component 300 includes a circuit board 310, a photosensitive chip 320 installed on the surface of the circuit board 310 (which can be installed by attachment), and an electronic component 330 (the electronic component can be a resistor, a capacitor, etc.) installed on the surface of the circuit board 310, and the electronic component 330 is arranged around the photosensitive chip 320. Further, in this embodiment, the photosensitive component 300 also includes a molding part 340 around the photosensitive chip 320, and a light window is formed in the center of the molding part 340 so that the photosensitive chip 320 receives an imaging light beam. The molding part 340 can be directly formed on the surface of the circuit board 310 based on a molding process. Specifically, the circuit board 310 can be pressed together using an upper mold and a lower mold, wherein the back of the circuit board 310 is supported by the lower mold, the upper mold is pressed on the edge area of ​​the front of the circuit board 310 (the edge area can be called a pressing edge), and the inner surface of the upper mold can form a molding cavity together with the front (i.e., the upper surface) of the circuit board. The liquid molding material is injected into the molding cavity and solidified to form the desired molding part 340. The molding part 340 may not contact the photosensitive chip 320, or may contact the side of the photosensitive chip 320 (or contact the side and the edge area of ​​the upper surface of the photosensitive chip 320, which is usually a non-photosensitive area). Further, the color filter holder 210 in this embodiment is installed on the top surface of the molding part 340. The shape and structure of the color filter holder 210 may be consistent with the above embodiment, that is, the color filter holder 210 may include the lens seat 211 and the cantilever beam 212. The top surface of the lens seat 211 is suitable for supporting and installing the lens assembly 100. The lens assembly 100 may have a motor 120 or may not have a motor (for example, when the camera module is a fixed focus module, its lens assembly may not have a motor). In this embodiment, the color filter 220 is attached to the surface of the cantilever beam 212. The overlapping area 213 between the surface of the cantilever beam 212 and the color filter 220 is rectangular. Specifically, the overlapping area 213 is annular, and its outer contour (refer to Figure 2B, wherein the dotted line frame 213a shows the outer contour of the overlapping area 213) and the inner contour (the inner contour is the contour of the light-through hole) can be both rectangular, and for ease of description, it is referred to as a rectangular ring hereinafter. Among them, the adhesive material (such as IR adhesive 230) used to paste the color filter is arranged on the four sides of the rectangular ring, and the four corner areas 214 of the rectangular ring are not arranged with the adhesive material, so that at the positions of the four corners, there is a gap between the color filter 220 and the surface of the cantilever beam 212, that is, the four corner areas 214 can be used as stress buffers. Since the corner position is the stress concentration point of the color filter holder 210, the design of this embodiment can significantly reduce the stress borne by the color filter 220. At the same time, the four sides of the cantilever beam 212 are all provided with sufficient adhesive material for pasting the color filter, which can effectively ensure the stability and reliability of pasting. It should be noted that in other modified embodiments, the stress buffer can also be set only in two corner areas 214 or other numbers of corner areas. The above-mentioned molding part can also be replaced by other types of packaging parts. For example, the packaging part can be directly formed on the surface of the circuit board 310 based on other processes such as transfer molding or injection molding. The packaging part covers the electronic component 330, and the top surface of the packaging part can be installed (for example, attached) with the color filter holder 210.

[0065] Further, Fig. 9 FIG. 3 is a cross-sectional schematic diagram of a camera module having a molding portion 340 in another embodiment of the present application. Figure 8 Different from the embodiment shown, in this embodiment, the lens assembly 100 is directly mounted on the top surface of the molding part 340 (or the packaging part). The color filter holder 210 is also mounted on the top surface of the molding part 340 (or the packaging part), and the color filter holder 210 is located on the inner side of the lens assembly supporting area. Here, the lens assembly supporting area refers to the area on the top surface of the molding part 340 (or the packaging part) used to support the lens assembly. In this embodiment, the color filter holder 210 may have a lens seat portion 211 and a cantilever beam 212. It should be noted that in this embodiment, the lens seat portion 211 is only used to support the cantilever beam 212, and is not used as a lens seat of the lens assembly.

[0066] Furthermore, the design concept of the present application can also be applied to a multi-camera module to solve the problem that the color filter in the multi-camera module is easy to break or bend. Fig.10 FIG. 4 is a cross-sectional schematic diagram of a multi-camera module in an embodiment of the present application. In this embodiment, multiple (at least two) camera modules are combined together through a metal outer bracket 400. Fig.10In this embodiment, the multi-camera module includes two camera modules and a metal outer bracket 400. The metal outer bracket 400 has two receiving holes, and the two camera modules are respectively placed in the two receiving holes, and the outer side of each camera module is bonded to the metal outer bracket 400 by adhesive, so as to assemble the multi-camera module. Specifically, in this embodiment, each camera module can include a lens assembly 100, a filter assembly 200 and a photosensitive assembly 300 (which can be combined with reference to Figure 1 and Figure 4 ). The outer side of the lens assembly 100 can be the outer side of the lens carrier or the motor 120, and the optical lens (which includes a lens barrel and a lens group installed in the lens) can be installed in the lens carrier or the motor 120. Among them, a glue material 410 can be arranged between the lens carrier / motor 120 and the metal outer bracket 400, so as to assemble the camera module and the metal outer bracket 400 together. Furthermore, in this embodiment, the filter assembly includes a color filter bracket 210 and a color filter 220, wherein the color filter bracket 210 includes a lens seat portion 211 and a cantilever beam 212. When the camera module adopts the following Figure 1 In the camera module structure shown in FIG. 1 , a glue material (eg Fig.10 In the case of the camera module on the left side in the middle, the gap between the color filter holder 210 and the metal outer holder 400 can be arranged with glue 420) to improve the reliability of the bonding between the camera module and the metal outer holder 400. In this embodiment, there is a gap between at least two corners of the color filter 220 and the cantilever beam 212 (that is, a stress buffer zone is set at at least two corners, and the stress buffer zone avoids the arrangement of IR glue), thereby reducing the influence of the stress generated by the metal outer holder 400 and the color filter holder 210 at high or low temperatures on the color filter, and preventing the color filter from breaking. In a multi-camera module, due to different CTEs, the color filter holder 210 deforms relatively more at high or low temperatures, while the metal outer holder 400 (whose CTE is relatively small) deforms less, which is equivalent to the metal outer holder 400 limiting the deformation of the color filter holder 210, so greater stress may be generated inside the color filter holder 210. In this embodiment, a stress buffer zone is provided at at least two corners of the cantilever beam 212, so as to dissipate a large amount of stress from the color filter holder 210, and prevent the stress from being transmitted to the color filter 220 and causing the color filter 220 to break or bend. Fig.10In the case of the camera module on the right side of the middle image, since the lens assembly is bonded to the color filter holder 210 by the adhesive 430, when the lens assembly adhesive 430 (hereinafter referred to as the lens assembly adhesive 430 for ease of description) hardens at low temperatures, the stress of the metal outer bracket 400 acting on the lens assembly will also be transmitted to the color filter holder 210 through the hardened lens assembly adhesive 430, thereby causing the internal stress of the color filter holder 210 to increase. Therefore, based on the solution of this embodiment, for the camera module bonded to the metal outer bracket 400 only by the lens carrier / motor 120, similarly, a stress buffer zone is provided at at least two corners of the cantilever beam 212, which can also play a role in eliminating more stress from the color filter holder 210, thereby preventing the stress from being transmitted to the color filter and causing the color filter to break or bend. On the other hand, sometimes the lens assembly adhesive 430 will overflow and contact the metal outer bracket 400. When the temperature changes, the metal outer bracket 400 is less deformed and thus forms an inward contraction effect. The contraction of the metal outer bracket 400 (it should be noted that this contraction of the metal outer bracket 400 is a relative contraction relative to the camera module) causes the stress of the metal outer bracket 400 to be transferred to the color filter holder 210 through the overflowed lens assembly adhesive 430 (the adhesive 430 will harden at low temperatures), so that greater stress is generated inside the color filter holder 210. Therefore, by providing a stress buffer zone at at least two corners of the cantilever beam 212, more stress from the color filter holder 210 can be eliminated, and the stress can be prevented from being transferred to the color filter 220 and causing the color filter 220 to break or bend. Furthermore, in one embodiment of the present application, the coating position of the lens assembly adhesive 430 can be retracted inwards to prevent the lens assembly adhesive 430 from overflowing, thereby preventing the lens assembly adhesive 430 from contacting the metal outer bracket 400, thereby reducing the stress of the color filter bracket 210, and preventing the stress from being transmitted to the color filter 220 and causing the color filter 220 to break or bend. Here, retracting the coating position of the lens assembly adhesive 430 inwards means that the lens assembly adhesive 430 is arranged in an area closer to the optical axis, or in other words, the outer side of the lens assembly adhesive 430 is closer to the optical axis than the outer side of the lens assembly and the color filter assembly, wherein the optical axis refers to the optical axis of the camera module.

[0067] In the above embodiments, the stress transmitted to the color filter is reduced and eliminated by providing a stress buffer zone on the cantilever beam 212 and avoiding the use of IR glue in the stress buffer zone, thereby preventing the color filter from breaking or bending. However, the implementation method of the stress buffering effect is not limited thereto. Fig.11 A schematic top view of a color filter holder 210 is shown in one embodiment of the present application, which realizes stress buffering by reducing the width of the glue. Fig.12 Shows Fig.11 A magnified schematic diagram of a corner area in the reference Fig.11 and Fig.12 In this embodiment, the cantilever beam 212 of the color filter holder 210 has the overlapping area 213 (the overlapping area 213 refers to the area where the cantilever beam 212 overlaps with the color filter 220, and its shape is a rectangular ring). The four corner areas 214 of the overlapping area 213 are stress buffer areas. The stress buffer area is arranged with IR glue 230, and the width A of the IR glue of the stress buffer area is smaller than the width of the IR glue of the main glue area. The width here refers to the width of the glue material at a top-down angle. The four sides of the overlapping area 213 constitute the main glue area. In this embodiment, since the width of the IR glue in the stress buffer area is small, the stress transmitted from the corner of the cantilever beam 212 (referring to the above, the inventor has found that the corner of the cantilever beam 212 is a stress concentration point) to the color filter 220 can be reduced, thereby significantly improving the problem of color filter breakage or bending during the assembly process (or use) of the camera module. In this embodiment, the cross-sectional schematic diagram of the camera module can be referred to Figure 1 , which will not be described here. Further, in one embodiment, the width A of the IR glue of the stress buffer zone can be 0.1-0.25mm, and the width of the IR glue of the main glue cloth zone can be 0.3-0.4mm. When the width of the IR glue is 0.1-0.25mm, the IR glue is prone to failure at high or low temperatures (i.e., its adhesion is significantly reduced). Therefore, for the camera module provided in this embodiment, the IR glue at the cantilever beam corner (i.e., the stress buffer zone) can be separated from the color filter under high or low temperature conditions, so that the stress generated by the color filter holder will not be transmitted to the color filter corner through the IR glue, or, under high or low temperature conditions, due to the significant decrease in the adhesion of the IR corner with a width of 0.1-0.25mm, the stress transmitted from the cantilever beam corner of the color filter holder to the color filter corner can be effectively buffered. Therefore, the camera module provided in this embodiment can effectively avoid the phenomenon of color filter fragmentation or bending.

[0068] Further, Fig.13 FIG. 2 shows a top view of a color filter holder 210 in another embodiment of the present application, which realizes stress buffering by reducing the width of the adhesive. In this embodiment, the cantilever beam 212 of the color filter holder 210 may have three wide sides and one narrow side, wherein the narrow side is a side with a complex structure so as to avoid the motor pin 121. The stress buffer is arranged in two corner areas 214 (such as Fig.13 As shown in FIG. 1 ), the width of the IR glue in the stress buffer is smaller than the width of the IR glue in the main glue area, thereby reducing the stress transmitted from the corner of the cantilever beam 212 on the narrow side (the corner of the cantilever beam 212 on the narrow side in this embodiment is the stress concentration point) to the color filter 220, thereby significantly improving the problem of color filter breakage or bending during the camera module assembly process (or during use). The cross-sectional schematic diagram of the camera module of this embodiment can be compared with Figure 4Further, in one embodiment, the width A of the IR glue in the stress buffer zone may be 0.1-0.25 mm, and the width of the IR glue in the main adhesive cloth zone may be 0.3-0.4 mm.

[0069] Further, Fig.14 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by reducing the width of the glue material. The difference between this embodiment and the previous embodiment is that the four corner areas 214 of the cantilever beam 212 (i.e., the four corner areas 214 of the overlapping area 213) are all configured as stress buffer areas, and the width of the IR glue in the stress buffer area is smaller than the width of the IR glue in the main glue area, thereby reducing the stress transmitted from the corners of the cantilever beam 212 to the color filter 220, thereby significantly improving the problem of color filter breakage or bending during the assembly process (or use) of the camera module. The other structures of this embodiment are consistent with the previous embodiment. The cross-sectional schematic diagram of the camera module of this embodiment can be referred to. Figure 4 Further, in one embodiment, the width A of the IR glue in the stress buffer zone may be 0.1-0.25 mm, and the width of the IR glue in the main adhesive cloth zone may be 0.3-0.4 mm.

[0070] Further, Fig.15 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by reducing the width of the adhesive. The difference between this embodiment and the previous embodiment is that the cantilever beam 212 of the color filter holder 210 has a wide side, two narrow sides and a complex structure side, wherein the two narrow sides are opposite sides to each other (i.e., the two are roughly parallel), the wide side is perpendicular to (or crosses) the two narrow sides, and the complex structure side is opposite sides to the wide side (i.e., the two are roughly parallel). The complex structure side has an avoidance area to avoid the motor pin 121. The four corner areas 214 of the cantilever beam 212 (i.e., the four corner areas 214 of the overlapping area 213) are all set as stress buffer areas, and the width of the IR adhesive of the stress buffer area is smaller than the width of the IR adhesive of the main adhesive area, thereby reducing the stress transmitted from the corner of the cantilever beam 212 to the color filter 220, thereby significantly improving the problem of color filter fragmentation or bending during the assembly process (or use process) of the camera module. The other structures of this embodiment are consistent with those of the previous embodiment. The cross-sectional schematic diagram of the camera module of this embodiment can be referred to Figure 4 Further, in one embodiment, the width A of the IR glue in the stress buffer zone may be 0.1-0.25 mm, and the width of the IR glue in the main adhesive cloth zone may be 0.3-0.4 mm.

[0071] Furthermore, the above-mentioned solution of achieving stress buffering by reducing the width of the adhesive material can also be applied to Figure 8 , Fig. 9 or Fig.10 For the corresponding embodiments and specific principles, please refer to the description of the corresponding embodiments above, which will not be repeated here.

[0072] Further, Fig.15 A schematic top view of a color filter holder 210 in one embodiment of the present application that achieves stress buffering by using a soft adhesive material is shown. In this embodiment, the cantilever beam 212 of the color filter holder 210 has the overlapping area 213 (the overlapping area 213 refers to the area where the cantilever beam 212 overlaps with the color filter 220, and its shape is a rectangular ring). The four corner areas 214 of the overlapping area 213 are stress buffer areas. The four sides of the overlapping area 213 constitute the main adhesive area. IR adhesive is arranged in the stress buffer area, and the material of the IR adhesive in the stress buffer area can be different from the IR adhesive material in the main adhesive area. Specifically, the elastic modulus of the IR adhesive in the stress buffer area can be smaller than the elastic modulus of the IR adhesive in the main adhesive area, that is, the IR adhesive in the stress buffer area can be softer than the IR adhesive in the main adhesive area. In this way, since the stress buffer IR glue is relatively soft, it can better reduce the stress transmitted from the cantilever beam corner (referring to the above, the inventor found that the cantilever beam corner is the stress concentration point) to the color filter, thereby significantly improving the problem of color filter breakage or bending during the camera module assembly process (or during use). Figure 1 , I will not go into details here.

[0073] Further, Fig.16 FIG. 2 shows a top view of a color filter holder 210 in another embodiment of the present application, which uses a soft adhesive material to achieve stress buffering. In this embodiment, the cantilever beam 212 of the color filter holder 210 may have three wide sides and one narrow side, wherein the narrow side is a side with a complex structure so as to avoid the motor pin 121. The stress buffer is arranged in two corner areas 214 (such as Fig.16 As shown in the figure, and the elastic modulus of the IR glue in the stress buffer area is smaller than the elastic modulus of the IR glue in the main adhesive area (that is, the IR glue in the stress buffer area is softer than the IR glue in the main adhesive area), thereby reducing the stress transmitted to the color filter by the cantilever beam corner on the narrow side (the cantilever beam corner on the narrow side in this embodiment is the stress concentration point), thereby significantly improving the problem of color filter breakage or bending during the camera module assembly process (or during use). The cross-sectional schematic diagram of the camera module of this embodiment can be compared with Figure 4 The same, no further elaboration here.

[0074] Further, Fig.17A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by using soft adhesive material. The difference between this embodiment and the previous embodiment is that the four corner areas 214 of the cantilever beam (i.e., the four corner areas 214 of the overlapping area 213) are all set as stress buffer areas, and the elastic modulus of the IR adhesive in the stress buffer area is smaller than the elastic modulus of the IR adhesive in the main adhesive area (i.e., the IR adhesive in the stress buffer area is softer than the IR adhesive in the main adhesive area), thereby reducing the stress transmitted from the cantilever beam corner to the color filter, and thus significantly improving the problem of color filter breakage or bending during the assembly process (or use) of the camera module. The other structures of this embodiment are consistent with the previous embodiment. The cross-sectional schematic diagram of the camera module of this embodiment can be referred to. Figure 4 , I will not go into details here.

[0075] Further, Fig.18 A schematic top view of a color filter holder 210 in another embodiment of the present application is shown, which realizes stress buffering by using soft adhesive. The difference between this embodiment and the previous embodiment is that the cantilever beam 212 of the color filter holder 210 has a wide side, two narrow sides and a complex structure side, wherein the two narrow sides are opposite sides to each other (i.e., the two are roughly parallel), the wide side is perpendicular to (or crosses) the two narrow sides, and the complex structure side is opposite sides to the wide side (i.e., the two are roughly parallel). The complex structure side has an avoidance area to avoid the motor pin 121. The four corner areas 214 of the cantilever beam 212 (i.e., the four corner areas 214 of the overlapping area 213) are all set as stress buffer areas, and the elastic modulus of the IR glue in the stress buffer area is smaller than the elastic modulus of the IR glue in the main adhesive area (i.e., the IR glue in the stress buffer area is softer than the IR glue in the main adhesive area), thereby reducing the stress transmitted from the cantilever beam corner to the color filter, thereby significantly improving the problem of color filter fragmentation or bending during the assembly process (or use) of the camera module. The other structures of this embodiment are consistent with those of the previous embodiment. The cross-sectional schematic diagram of the camera module of this embodiment can be referred to Figure 4 , I will not go into details here.

[0076] Furthermore, the above-mentioned solution of achieving stress buffering by using soft rubber material can also be applied to Figure 8 , Fig. 9 or Fig.10 For the corresponding embodiments and specific principles, please refer to the description of the corresponding embodiments above, which will not be repeated here.

[0077] In the above embodiments, the overlapping areas of the cantilever beams are all in the shape of rectangular rings, but the present application is not limited thereto. For example, in some embodiments, the rectangular rings may be replaced by other types of polygonal rings (e.g., polygonal rings with more than four sides). For the overlapping areas of the polygonal rings, the intersection of any two sides constitutes the corner area. The angle area can be set as the stress buffer area, and the multiple sides of the overlapping area can be set as the main adhesive area, and the IR adhesive is arranged in the main adhesive area. IR adhesive is not arranged in the stress buffer area, or the width of the IR adhesive in the stress buffer area is smaller than the width of the IR adhesive in the main adhesive area (the width here refers to the width at a top-down angle), or the elastic modulus of the IR adhesive in the stress buffer area is smaller than the elastic modulus of the IR adhesive in the main adhesive area.

[0078] Further, refer to Figure 1 In one embodiment of the present application, the color filter holder 210 includes a lens seat 211 and a cantilever beam 212. The thickness of the cantilever beam 212 is less than the thickness of the lens seat 211. This design can not only ensure the structural strength of the lens seat 211 so as to stably and reliably provide support for the lens assembly, but also reduce the space occupied by the cantilever beam in the direction of the optical axis, which helps to reduce the height of the camera module (wherein the height refers to the size of the camera module in the direction of its optical axis).

[0079] Further, still refer to Figure 1 In one embodiment of the present application, the mirror base portion 211 includes a side wall 211a and a support portion 211b bent at the top of the side wall 211a, and the top surface of the support portion 211b is suitable for installing a motor or a lens carrier, wherein the cantilever beam 212 is formed by the support portion 211b extending inward. The thickness of the cantilever beam 212 is less than the thickness of the support portion 211b. This design can ensure the structural strength of the mirror base portion 211, and at the same time, a space can be left between the support portion 211b and the circuit board to facilitate the installation of electronic components 330. In this embodiment, the mirror base portion 211 includes a side wall 211a and a support portion 211b, and there is a gap between the support portion 211b and the circuit board, so the stress of the mirror base portion 211 (or the color filter holder 210) may be relatively large. For example, compared to Fig. 9The color filter holder 210 in the illustrated embodiment may have a greater stress. Therefore, for the color filter holder 210 structure adopted in the present embodiment, a stress buffer zone is provided on the cantilever beam 212 (wherein the stress buffer zone has a glue dispensing method different from that of the main glue dispensing area so as to reduce the stress transmitted from the cantilever beam 212 to the filter) to prevent the color filter from breaking or bending, which has a more obvious effect. On the other hand, in the present embodiment, the bottom of the color filter holder 210 is directly mounted on the circuit board. Compared with the molding part, the circuit board is more susceptible to temperature changes and undergoes greater deformation, thereby causing the color filter holder 210 to form a greater stress. In this case, a stress buffer zone is provided on the cantilever beam 212 to prevent the color filter from breaking or bending, which has a more obvious effect. In other words, compared with Figure 8 , Fig. 9 For the embodiment (the embodiment in which the color filter holder 210 is installed on the top surface of the molding part), the effect of preventing the color filter from being broken or bent in this embodiment may be more obvious.

[0080] In the above embodiments, the color filter is bonded to the upper surface of the cantilever beam of the color filter holder through its bottom surface, that is, the adhesive area of ​​the cantilever beam is located on its upper surface, but it should be noted that the present application is not limited to this. For example, in other embodiments, the color filter can be bonded to the lower surface of the cantilever beam of the color filter holder through its top surface.

[0081] Furthermore, in the above embodiment, the color filter holder has a portion that supports and mounts the lens assembly and / or the photosensitive assembly, and this portion can be regarded as the lens seat portion, and the color filter holder also has a cantilever beam formed by extending inward from the lens seat portion, and the cantilever beam can be used to mount the color filter. The surface of the cantilever beam (which can be the upper surface or the lower surface) has an overlapping area that overlaps with the color filter (referring to overlapping when looking down or looking up), and the outer contour of the overlapping area is consistent with the outer contour of the color filter. The corners of the overlapping area can directly correspond to the corners of the color filter. For example, when the color filter is roughly rectangular, the color filter has four corners, and the overlapping area also has four corresponding corners. In the above embodiments, the corners of the overlapping area are sometimes referred to as corner areas.

[0082] The above embodiments provide three specific ways to reduce the stress transmitted from the cantilever beam to the filter in the stress buffer, which are: no IR glue is arranged; or the width of the IR glue in the stress buffer is smaller than the width of the IR glue in the main glue area (the width here refers to the width at a top-down angle); or the elastic modulus of the IR glue in the stress buffer is smaller than the elastic modulus of the IR glue in the main glue area. It should be noted that the above three implementation methods are not exhaustive. In other embodiments of the present application, the stress buffer can be implemented by other deformed glue methods, as long as these deformed glue methods are different from the glue methods in the main glue area and can reduce the stress transmitted from the cantilever beam to the filter relative to the glue methods in the main glue area.

[0083] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

Claims

1. A filter assembly, used in a camera module, characterized in that: The filter assembly comprises: A bracket, comprising an annular mirror seat portion and a cantilever beam extending inwardly from the mirror seat portion, wherein the cantilever beam has a light-through hole in the center, wherein the mirror seat portion has a first side, the first side has a avoidance structure for avoiding a motor pin, the mirror seat portion further has a second side located on a side opposite to the first side, and a third side and a fourth side intersecting the first side, wherein the widths of the second side, the third side and the fourth side in a top view angle are all greater than the first side; and A filter is adhered to the surface of the cantilever beam by adhesive, and the surface of the cantilever beam has an overlapping area overlapping with the filter; wherein the overlapping area includes a main adhesive area and a stress buffer area, the main adhesive area is used to arrange the adhesive, and the stress buffer area is located at the corner of the overlapping area, the overlapping area is in the form of a rectangular ring, the main adhesive area includes four strip areas corresponding to the four sides of the rectangular ring and two corner areas of the rectangular ring located on the second side of the rectangular ring, the stress buffer area is only located at the two corner areas of the rectangular ring located on the first side of the rectangular ring, and in the stress buffer area, there is a gap between the filter and the surface of the cantilever beam, wherein the gap is defined by the filter and the surface of the cantilever beam.

2. The filter assembly according to claim 1, characterized in that: The adhesive is not arranged in the stress buffer zone.

3. The filter assembly according to claim 1, characterized in that: The adhesive is arranged in the stress buffer area, and the width of the adhesive in the stress buffer area is smaller than the width of the adhesive in the main adhesive distribution area.

4. The filter assembly according to claim 1, characterized in that: The adhesive comprises a first adhesive and a second adhesive. The first adhesive is arranged in the main adhesive area; the second adhesive is arranged in the stress buffer area, and the elastic modulus of the second adhesive is smaller than that of the first adhesive.

5. The filter assembly according to claim 3, characterized in that: The width of the adhesive in the stress buffer zone is 0.1-0.25 mm, and the width of the adhesive in the main adhesive distribution zone is 0.3-0.4 mm.

6. The filter assembly according to claim 1, characterized in that: The top surface of the lens seat portion is suitable for mounting a motor or a lens carrier.

7. The filter assembly according to claim 1, characterized in that: The bottom surface of the lens seat portion is suitable for being installed on a photosensitive component.

8. The filter assembly according to claim 1, characterized in that: The lens seat portion includes a side wall and a support portion formed by bending at the top of the side wall, the top surface of the support portion is suitable for mounting a motor or a lens carrier, wherein the cantilever beam is formed by extending inwardly from the support portion.

9. The filter assembly according to claim 8, characterized in that: The thickness of the cantilever beam is smaller than the thickness of the supporting portion.

10. A camera module, characterized in that: include: The filter assembly according to any one of claims 1 to 9; Lens assembly; as well as The photosensitive component is located between the lens component and the photosensitive component.

11. The camera module according to claim 10, characterized in that: The top surface of the lens seat portion is supported and installed on the bottom surface of the lens assembly, and the bottom surface of the lens seat portion is supported and installed on the top surface of the photosensitive assembly.

12. The camera module according to claim 11, characterized in that: The photosensitive component includes a circuit board and a photosensitive chip installed on the surface of the circuit board. The bottom surface of the mirror seat is installed on the surface of the circuit board, and the mirror seat surrounds the photosensitive chip.

13. The camera module according to claim 11, characterized in that: The photosensitive component includes a circuit board, a photosensitive chip mounted on the surface of the circuit board, electronic components mounted on the surface of the circuit board, and a packaging part surrounding the photosensitive chip and covering the electronic components, and the bottom surface of the lens seat part is mounted on the top surface of the packaging part.

14. The camera module according to claim 12, characterized in that: The lens assembly has a motor, which includes a motor pin for electrically connecting to a circuit board. The lens seat has a first edge, which has an avoidance structure. The motor pin passes through the avoidance structure from the bottom surface of the motor and is connected to the circuit board. The overlapping area is a rectangular ring.

15. A multi-camera module, characterized in that: include: An outer bracket having a plurality of receiving holes; The camera module described in any one of claims 10-14, and the camera module is multiple, each of the camera modules is placed in one of the receiving holes, wherein the outer side surface of the lens assembly of at least one of the camera modules is bonded to the external bracket by adhesive.

16. A multi-camera module, characterized in that: include: An outer bracket having a plurality of receiving holes; The camera module described in any one of claims 10 to 14, and the camera module is provided with a plurality of them, each of which is placed in one of the receiving holes, wherein the outer side surface of the lens assembly of at least one of the camera modules is bonded to the outer bracket by adhesive material, and the outer side surface of the lens seat portion of the camera module is also bonded to the outer bracket by adhesive material.

Images