Display module and manufacturing method thereof

Abstract

The present invention discloses a display module and a manufacturing method thereof, wherein the display module comprises a circuit board having a first surface and a second surface relative to each other, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a matte layer and a first black layer; the light-emitting chip is conductively connected to the first conductive circuit; the matte layer wraps the surface and exposed side of the light-emitting chip on the first surface; the first black layer is located on the matte layer, and the first black layer is provided with at least one first opening corresponding to the top of the light-emitting chip, exposing the matte layer located above the light-emitting chip. The display module of the present invention solves the inherent contradiction between the high light transmittance of the light-emitting surface and the high black degree of the non-light-emitting surface through the coordinated arrangement of the matte layer, the black layer and the light-emitting chip, thereby greatly improving the contrast and brightness, further reducing the power consumption of the display module, and having simple processing, low cost and good reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of display modules, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] RGB display modules based on semiconductor light-emitting elements have been widely used in indoor and outdoor display fields. With the reduction of pixel size and pixel pitch, high-definition ultra-fine pitch display modules based on miniLED are one of the keys to achieve 8K ultra-high resolution, medium and large-sized TVs and displays.

[0003] Common display module structures such as Figure 1 As shown, it includes a substrate 11, a light emitting element 12 disposed on the substrate 11, and the light emitting element 12 generally includes a bracket 121, a light emitting chip 122 and a light-transmitting layer 123. To achieve RGB display, each light emitting element 12 generally includes at least one red chip, one blue chip and one green chip. Figure 1 It can be seen that since each light-emitting element 12 has a bracket 121, the miniaturization of the light-emitting element 12 is greatly limited. Even if the size of the light-emitting element 12 can be made very small, for example 1mmx1mm, since each light-emitting element 12 includes at least one red light chip, one blue light chip and one green light chip, each light-emitting element 12 includes at least four external solder pads. Since the size of the light-emitting element 12 is too small and the size of the solder pad is limited, the strength of the light-emitting element 12 reflow soldered to the substrate 11 is relatively low, and the flatness and spacing are not easy to control. Thousands of light-emitting elements 12 that are closely arranged and reflow soldered on the substrate 11 are very likely to fall off under the action of external forces such as collision, vibration, extrusion, etc., resulting in a poor display effect. The rework operation is very cumbersome and costly.

[0004] In order to solve the problem of miniaturization of light-emitting components, another common display module is Figure 2 As shown, it includes a substrate 21, a light emitting chip 22 and a light-transmitting layer 23. Figure 2 As described above, the light emitting chip 22 replaces Figure 1 The light emitting element 12 in the embodiment has no bracket and its size can be minimized. The light-transmitting layer 23 can not only protect the gold wire, but also play the role of moisture-proof, dust-proof and collision-proof. The light emitting chip 22 is not easily damaged by external forces.

[0005] when Figure 2 When the display module is used for RGB display, in order to improve the contrast of the displayed image, the reflectivity of the non-light-emitting surface must be reduced. Ideally, the non-light-emitting surface should be completely blackened. Figure 2In order to improve the contrast or contrast of the displayed image, the usual practice is to add colorants into the light-transmitting layer 23 to increase the blackness of the light-transmitting layer 23. At the same time, the light transmittance of the light-transmitting layer 23 will be greatly reduced due to the addition of colorants, resulting in nearly 40% of the light emitted by the light-emitting chip 22 being absorbed by the light-transmitting layer 23. At the same power density, the brightness of the display module will be greatly reduced. If the brightness is increased by increasing the power density, it will bring many burdens to the power supply configuration, drive selection, thermal conductivity and heat dissipation design, and increase costs. Figure 2 It can be seen that there is an irreconcilable contradiction between increasing the ink blackness of the non-light-emitting surface and increasing the light transmittance of the light-transmitting layer. The higher the ink blackness, the lower the light transmittance; or, the higher the light transmittance, the lower the ink blackness. From the display effect, the higher the contrast, the greater the brightness sacrifice; or, the higher the brightness, the lower the contrast.

[0006] Therefore, due to the essential defects and deficiencies of the above display module structure, it is impossible to resolve the contradiction between the high transmittance of the light-emitting surface and the high blackness of the non-light-emitting surface, and it is also impossible to resolve the contradiction between increasing brightness and increasing contrast or contrast. Summary of the invention

[0007] The technical problem to be solved by the present invention is to provide a display module and a manufacturing method thereof that can solve the inherent contradiction between high light transmittance of the light-emitting surface and high blackness of the non-light-emitting surface, and improve contrast and brightness.

[0008] The technical solution adopted by the present invention to solve the technical problem is: providing a display module, including a circuit board having a first surface and a second surface opposite to each other, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a matte layer and a first black layer;

[0009] The light-emitting chip is conductively connected to the first conductive circuit; the matte layer wraps the surface and exposed side surfaces of the light-emitting chip on the first surface;

[0010] The first ink black layer is located on the matte layer, and the first ink black layer is provided with at least one first opening corresponding to above the light emitting chip, exposing the matte layer located above the light emitting chip.

[0011] Preferably, the matte layer is made of silicone or epoxy resin and is doped with one or more combinations of diffusion powder, matte powder and coloring powder;

[0012] The first black ink layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive glue; the silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0013] Preferably, the display module further comprises a second black ink layer;

[0014] The second ink black layer is arranged between the first surface and the matte layer, and the second ink black layer is provided with at least one second opening, and the light emitting chip is located in the second opening.

[0015] Preferably, the inner wall surface of the second opening is in contact with the side surface of the corresponding light-emitting chip; or,

[0016] A gap is left between the inner wall surface of the second opening and the corresponding side surface of the light-emitting chip, and the matte layer fills the gap.

[0017] Preferably, the second black ink layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive glue; the silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0018] Preferably, the display module further includes a second conductive circuit arranged on the second surface of the circuit board, and a conductive path arranged in the circuit board and penetrating the first surface and the second surface; the second conductive circuit is conductively connected to the first conductive circuit through the conductive path.

[0019] Preferably, the display module further comprises an auxiliary circuit board and / or electronic device conductively connected to the second conductive circuit.

[0020] The present invention also provides a method for manufacturing the display module as described in any one of the above, comprising the following steps:

[0021] S1, setting a first conductive circuit on a first surface of the circuit board;

[0022] S2, arranging a light-emitting chip on the first surface of the circuit board, and electrically connecting the light-emitting chip to the first conductive circuit;

[0023] S3, providing a matte layer on the first surface of the circuit board, wherein the matte layer wraps the surface and exposed side surfaces of the light-emitting chip;

[0024] S4. A first ink black layer is disposed on the first surface of the circuit board, and at least one first opening is formed on the first ink black layer. The first opening corresponds to above the light-emitting chip, exposing the matte layer above the light-emitting chip.

[0025] Preferably, step S4 comprises:

[0026] S4.1, providing a first black ink layer on the first surface of the circuit board;

[0027] S4.2, setting a mask on the surface of the first black ink layer;

[0028] S4.3, exposing and curing the first black ink layer not covered by the mask;

[0029] S4.4, removing the mask;

[0030] S4.5, developing and removing the first black ink layer covered by the mask to form a first opening, exposing the matte layer located above the light-emitting chip;

[0031] S4.6, thermally curing the first black ink layer;

[0032] Alternatively, step S4 includes:

[0033] S4.1, providing a first black ink layer on the first surface of the circuit board;

[0034] S4.2, setting a mask on the surface of the first black ink layer;

[0035] S4.3, exposing the first black ink layer not covered by the mask;

[0036] S4.4, removing the mask;

[0037] S4.5, developing and removing the first black ink layer not covered by the mask to form a first opening, exposing the matte layer located above the light-emitting chip;

[0038] S4.6, thermally curing the first black ink layer;

[0039] Alternatively, step S4 includes:

[0040] S4.1. Disposing a mask on the first surface of the circuit board;

[0041] S4.2, providing a first black ink layer on the mask;

[0042] S4.3, removing the mask or removing the mask after pre-curing, forming a first opening on the first black ink layer, exposing the matte layer located above the light-emitting chip;

[0043] S4.4, curing the first black ink layer.

[0044] Preferably, step S2 further comprises the following steps:

[0045] S2.1. A second black ink layer is provided on the first surface of the circuit board, wherein the second black ink layer is provided with at least one second opening, and the light emitting chip is provided in the second opening; an inner wall surface of the second opening is in contact with a side surface of the corresponding light emitting chip or a gap is left;

[0046] In step S3, the matte layer is disposed above the second ink black layer; when a gap is left between the inner wall surface of the second opening and the corresponding side surface of the light-emitting chip, the matte layer fills the gap.

[0047] Preferably, step S2.1 comprises:

[0048] S2.1.1, disposing the second black ink layer on the first surface of the circuit board;

[0049] S2.1.2, heating and curing the second black ink layer;

[0050] Alternatively, step S2.1 comprises:

[0051] S2.1.1. Disposing a mask on the first surface of the circuit board;

[0052] S2.1.2, providing a second black ink layer on the mask;

[0053] S2.1.3, removing the mask or removing the mask after pre-curing, forming a second black ink layer having a second opening on the first surface, and the light-emitting chip is disposed in the second opening;

[0054] S2.1.4, curing the second black ink layer;

[0055] Alternatively, step S2.1 comprises:

[0056] S2.1.1, disposing a second black ink layer on the first surface of the circuit board;

[0057] S2.1.2, providing a mask on the surface of the second black ink layer;

[0058] S2.1.3, exposing and curing the second black ink layer not covered by the mask;

[0059] S2.1.4, removing the mask;

[0060] S2.1.5, developing and removing the second black ink layer covered by the mask to form a second opening, exposing the light emitting chip disposed in the second opening;

[0061] S2.1.6, thermally curing the second black ink layer;

[0062] Alternatively, step S2.1 comprises:

[0063] S2.1.1, disposing the second black ink layer on the first surface of the circuit board;

[0064] S2.1.2, providing a mask on the surface of the second black ink layer;

[0065] S2.1.3, exposing the second black ink layer not covered by the mask;

[0066] S2.1.4, removing the mask;

[0067] S2.1.5, developing and removing the second black ink layer not covered by the mask to form a second opening, exposing the light emitting chip disposed in the second opening;

[0068] S2.1.6. Thermally cure the second black ink layer.

[0069] Preferably, step S1 further includes: providing a conductive channel penetrating the first surface and the second surface of the circuit board, providing a second conductive circuit on the second surface, and conductively connecting the first conductive circuit and the second conductive circuit to the conductive channel respectively.

[0070] Preferably, the method for manufacturing the display module further comprises the following steps:

[0071] S5. Arrange electronic devices on the second surface of the circuit board, and make the electronic devices conductively connected to the second conductive circuit; and / or arrange at least one auxiliary circuit board on the second surface of the circuit board, and make the auxiliary circuit board conductively connected to the second conductive circuit.

[0072] The present invention provides another display module, comprising a circuit board having a first surface and a second surface opposite to each other, a first conductive circuit arranged on the first surface of the circuit board, a light emitting chip, a matte layer and a black layer;

[0073] The light-emitting chip is conductively connected to the first conductive circuit; the matte layer wraps the surface and exposed side surfaces of the light-emitting chip on the first surface;

[0074] The ink black layer is arranged between the first surface and the matte layer, and the ink black layer is provided with at least one opening, and the light emitting chip is located in the opening.

[0075] Preferably, the inner wall surface of the opening is in contact with the side surface of the corresponding light-emitting chip; or,

[0076] A gap is left between the inner wall surface of the opening and the corresponding side surface of the light-emitting chip, and the matte layer fills the gap.

[0077] Preferably, the matte layer is made of silicone or epoxy resin and is doped with one or more combinations of diffusion powder, matte powder and coloring powder;

[0078] The ink black layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive glue; the silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0079] Preferably, the display module further includes a second conductive circuit arranged on the second surface of the circuit board, and a conductive path arranged in the circuit board and penetrating the first surface and the second surface; the second conductive circuit is conductively connected to the first conductive circuit through the conductive path.

[0080] Preferably, the display module further comprises an auxiliary circuit board and / or electronic device conductively connected to the second conductive circuit.

[0081] The present invention also provides a method for manufacturing the display module as described in any one of the above, comprising the following steps:

[0082] S1, setting a first conductive circuit on a first surface of the circuit board;

[0083] S2, arranging a light-emitting chip on the first surface of the circuit board, and electrically connecting the light-emitting chip to the first conductive circuit;

[0084] S3, disposing an ink black layer on the first surface of the circuit board, forming at least one opening on the ink black layer, and disposing the light emitting chip in the opening;

[0085] S4. A matte layer is provided on the first surface of the circuit board, wherein the matte layer wraps the surface and exposed side surfaces of the light-emitting chip and covers the ink black layer.

[0086] Preferably, step S3 comprises:

[0087] S3.1, disposing the ink black layer on the first surface of the circuit board;

[0088] S3.2, heating and curing the ink black layer;

[0089] Alternatively, step S3 includes:

[0090] S3.1. Disposing a mask on the first surface of the circuit board;

[0091] S3.2, providing a black ink layer on the mask;

[0092] S3.3, removing the mask or removing the mask after pre-curing, forming an ink black layer with an opening on the first surface, and the light-emitting chip is arranged in the opening;

[0093] S3.4, curing the ink black layer;

[0094] Alternatively, step S3 includes:

[0095] S3.1, providing a black ink layer on the first surface of the circuit board;

[0096] S3.2, providing a mask on the surface of the ink black layer;

[0097] S3.3, exposing and curing the black ink layer not covered by the mask;

[0098] S3.4, removing the mask;

[0099] S3.5, developing and removing the black ink layer covered by the mask to form an opening, exposing the light-emitting chip disposed in the opening;

[0100] S3.6, thermally curing the ink black layer;

[0101] Alternatively, step S3 includes:

[0102] S3.1, disposing the ink black layer on the first surface of the circuit board;

[0103] S3.2, providing a mask on the surface of the ink black layer;

[0104] S3.3, exposing the ink black layer not covered by the mask;

[0105] S3.4, removing the mask;

[0106] S3.5, developing and removing the ink black layer not covered by the mask to form an opening, exposing the light emitting chip disposed in the opening;

[0107] S3.6, thermally curing the ink black layer.

[0108] Preferably, step S1 further includes: providing a conductive channel penetrating the first surface and the second surface of the circuit board, providing a second conductive circuit on the second surface, and conductively connecting the first conductive circuit and the second conductive circuit to the conductive channel respectively.

[0109] Preferably, the method for manufacturing the display module further comprises the following steps:

[0110] S5. Arrange electronic devices on the second surface of the circuit board, and make the electronic devices conductively connected to the second conductive circuit; and / or arrange at least one auxiliary circuit board on the second surface of the circuit board, and make the auxiliary circuit board conductively connected to the second conductive circuit.

[0111] The display module of the present invention solves the inherent contradiction between the high light transmittance of the light-emitting surface and the high degree of blackness of the non-light-emitting surface through the coordinated arrangement of the matte layer, the black layer and the light-emitting chip, thereby greatly improving the contrast and brightness, further reducing the power consumption of the display module, and having simple processing, low cost and good reliability.

[0112] The manufacturing method of the display module of the present invention has a short process, a simple process, and a low manufacturing cost, and is suitable for large-scale industrial production. BRIEF DESCRIPTION OF THE DRAWINGS

[0113] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0114] Figure 1 , Figure 2 They are schematic cross-sectional structures of two display modules in the prior art;

[0115] Figure 3 is a schematic cross-sectional structural diagram of a display module according to a first embodiment of the present invention;

[0116] Figure 4 is a schematic cross-sectional structural diagram of a display module according to a second embodiment of the present invention;

[0117] Figure 5 FIG. 4 is a schematic cross-sectional structural diagram of a display module according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0118] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described in detail with reference to the accompanying drawings.

[0119] like Figure 3 As shown, the display module of the first embodiment of the present invention may include a circuit board 30 , a first conductive circuit 31 , a second conductive circuit 32 , a light emitting chip 33 , a matte layer 34 and a first black layer 35 .

[0120] The circuit board 30 has a first surface and a second surface opposite to each other. The first conductive circuit 31 is disposed on the first surface, and the second conductive circuit 32 is disposed on the second surface and conductively connected to the first conductive circuit 31. Alternatively, a conductive channel 300 penetrating the first surface and the second surface is disposed in the circuit board 30, and the second conductive circuit 32 is conductively connected to the first conductive circuit 31 through the conductive channel 300.

[0121] The circuit board 30 may be, but is not limited to, a ceramic-based circuit board, a glass-based circuit board or a traditional PCB board. The first conductive circuit 31 and the second conductive circuit 32 may be formed by single-layer or multi-layer circuits, respectively.

[0122] The light emitting chip 33 is disposed on the first surface of the circuit board 30 and is conductively connected to the first conductive circuit 31. The connection method may be, but is not limited to, one or more combinations of laser welding, reflow welding, hot pressing welding, and metal wire bonding. The light emitting chip 33 may be one or more. The light emitting chip 33 may be, but is not limited to, one or more combinations of flip chips, face-up chips, and vertical chips.

[0123] The matte layer 34 covers the surface and exposed side surfaces of the light emitting chip 33 on the first surface of the circuit board 30. The matte layer 34 may also cover part or all of the first surface where the light emitting chip 33 is not provided. The upper surface of the matte layer 34 away from the circuit board 30 may be a flat surface (not shown) or a concave-convex surface (such as Figure 3 The concavo-convex surface is formed by the matte layer 34 wrapping the light emitting chip 33.

[0124] The matte layer 34 is made of epoxy resin or silicone, is partially transparent, and is doped with one or more of matte powder, diffusion powder and coloring powder. The matte layer 34 is usually formed by mask spraying, spraying or molding.

[0125] The first black ink layer 35 is disposed on the first surface of the circuit board 30 and forms at least one first opening 350, the first opening 350 corresponding to the top of the light emitting chip 33, exposing the matte layer 34 located above the light emitting chip 33. One first opening 350 may correspond to the top of one or more light emitting chips 33.

[0126] The first black ink layer 35 is black in color and has a glossy or matte surface. It is made of one or more combinations of silicone, epoxy resin, photosensitive ink, and photosensitive adhesive. For silicone or epoxy resin, one or more of diffusion powder, matte powder, and coloring powder are added therein.

[0127] refer to Figure 3 The first ink black layer 35 is opaque black. Since the first opening 350 is left, the ink blackness of the first ink black layer 35 will not affect the transmittance of the light emitted by the light emitting chip 33 through the matte layer 34 above it. At the same time, the adjustment of the transmittance of the matte layer 34 exposed by the first opening 350 will not affect the ink blackness of the first ink black layer 35, thereby well solving the contradiction between the ink blackness and the transmittance. From the display effect point of view, the contrast or contrast can be improved by increasing the ink blackness of the first ink black layer 35 without sacrificing the brightness, and the brightness can be improved by increasing the transmittance of the matte layer 34 without sacrificing the contrast or contrast.

[0128] As required, the display module of this embodiment further includes an auxiliary circuit board 310 and / or an electronic device 320 conductively connected to the second conductive circuit 32. For a display module in which both the auxiliary circuit board 310 and the electronic device 320 are provided, the electronic device 320 can be provided on the auxiliary circuit board 310 and conductively connected to the second conductive circuit 32 via the auxiliary circuit board 310.

[0129] The manufacturing method of the display module of the first embodiment may include the following steps:

[0130] S1. A first conductive circuit 31 is disposed on the first surface of the circuit board 30, a second conductive circuit 32 is disposed on the second surface of the circuit board 30, a conductive channel 300 is disposed on the circuit board 30 that penetrates the first surface and the second surface, and the first conductive circuit 31 and the second conductive circuit 32 are conductively connected to the conductive channel 300 respectively.

[0131] S2 . Arrange a light emitting chip 33 on the first surface of the circuit board 30 , and connect the light emitting chip 33 to the first conductive circuit 31 in a conductive manner.

[0132] S3. A matte layer 34 is disposed on the first surface of the circuit board 30 . The matte layer 34 wraps the surface and exposed side surfaces of the light emitting chip 33 . The matte layer 34 also covers part or all of the first surface where no light emitting chip 33 is disposed.

[0133] S4. A first ink black layer 35 is disposed on the first surface of the circuit board 30. At least one first opening 350 is formed on the first ink black layer 35. The first opening 350 corresponds to the top of the light emitting chip 33, exposing the matte layer 34 located above the light emitting chip 33.

[0134] S5. Arrange an electronic device 320 on the second surface of the circuit board 30, and make the electronic device 320 conductively connected to the second conductive circuit 32; and / or, arrange at least one auxiliary circuit board 310 on the second surface of the circuit board 30, and make the auxiliary circuit board 310 conductively connected to the second conductive circuit 32. The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary circuit board 310.

[0135] Specifically, in the first implementation, step S4 includes:

[0136] S4.1. A first black ink layer 35 is disposed on the first surface of the circuit board. The first black ink layer 35 is usually disposed by printing or spin coating photosensitive ink or photosensitive adhesive.

[0137] S4.2. Set a mask on the surface of the first black ink layer 35.

[0138] S4.3, exposing and curing the first black ink layer 35 not covered by the mask.

[0139] S4.4. Remove the mask.

[0140] S4.5, developing and removing the first black ink layer 35 covered by the mask, forming a first opening 350, exposing the matte layer 34 located above the light emitting chip 33.

[0141] S4.6, thermally curing the first black ink layer 35.

[0142] In a second embodiment, step S4 includes:

[0143] S4.1. A first black ink layer 35 is disposed on the first surface of the circuit board. The first black ink layer 35 is usually disposed by printing or spin coating photosensitive ink or photosensitive adhesive.

[0144] S4.2. Set a mask on the surface of the first black ink layer 35.

[0145] S4.3, exposing the first black ink layer 35 not covered by the mask.

[0146] S4.4. Remove the mask.

[0147] S4.5, developing and removing the first black ink layer 35 not covered by the mask, forming a first opening 350, exposing the matte layer 34 located above the light emitting chip 33.

[0148] S4.6, thermally curing the first black ink layer 35.

[0149] In the third implementation, step S4 includes:

[0150] S4.1. Dispose a mask on the first surface of the circuit board, wherein the opening of the mask corresponds to the first surface where the light emitting chip 33 is not disposed.

[0151] S4.2. A first black ink layer 35 is provided on the mask. The first black ink layer 35 is generally provided by printing or spraying epoxy resin or silicone. The silicone or epoxy resin is mixed with one or more combinations of diffusion powder, matte powder, and coloring powder.

[0152] S4.3, after removing the mask or pre-curing, remove the mask to form a first ink black layer 35 with a first opening 350 .

[0153] S4.4, curing the first ink black layer 35.

[0154] like Figure 4 As shown, the display module of the second embodiment of the present invention may include a circuit board 30 , a first conductive circuit 31 , a second conductive circuit 32 , a light emitting chip 33 , a matte layer 34 , a first ink black layer 35 and a second ink black layer 36 .

[0155] Compared with the first embodiment, the second embodiment adds a second black ink layer 36. The specific configurations of the circuit board 30, the first conductive circuit 31, the second conductive circuit 32, the light emitting chip 33, the matte layer 34 and the first black ink layer 35 can all refer to the first embodiment, and will not be repeated here.

[0156] In this embodiment, the second black ink layer 36 is disposed between the first surface of the circuit board 30 and the matte layer 34. For the first surface portion not covered with the matte layer 34, the second black ink layer 36 can also be disposed between the first black ink layer 35 and the first surface.

[0157] The second black ink layer 36 has at least one second opening 360 , and the light emitting chip 33 is located in the second opening 360 ; one second opening 360 may have one or more light emitting chips 33 .

[0158] The inner wall surface of the second opening 360 is in contact with or has a gap with the side surface of the corresponding light emitting chip 33. If there is a gap, the matte layer 34 fills the gap.

[0159] The matte layer 34 wraps the surface and exposed side of the light emitting chip 33 on the first surface, and covers part or all of the surface of the second black ink layer 36. In addition, the matte layer 34 can also cover part or all of the exposed first surface of the circuit board 30 where no light emitting chip 33 is set and not covered by the second black ink layer 36.

[0160] The second black ink layer 36 is black in color and is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive adhesive, wherein the silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0161] In this embodiment, the presence of the second black layer 36 can reduce or eliminate light crosstalk between the light-emitting chips 33 , reduce the light-guiding effect of the matte layer 34 , and improve the display effect.

[0162] The manufacturing method of the display module of the second embodiment may include the following steps:

[0163] S1. A first conductive circuit 31 is disposed on the first surface of the circuit board 30, a second conductive circuit 32 is disposed on the second surface of the circuit board 30, a conductive channel 300 is disposed on the circuit board 30 that penetrates the first surface and the second surface, and the first conductive circuit 31 and the second conductive circuit 32 are conductively connected to the conductive channel 300 respectively.

[0164] S2 . Arrange a light emitting chip 33 on the first surface of the circuit board 30 , and connect the light emitting chip 33 to the first conductive circuit 31 in a conductive manner.

[0165] Step S2 also includes the following steps:

[0166] S2.1. A second ink black layer 36 is disposed on the first surface of the circuit board 30 . The second ink black layer 36 is provided with at least one second opening 360 . The light emitting chip 33 is disposed in the second opening 360 .

[0167] The inner wall surface of the second opening 360 is in contact with the exposed side surface of the corresponding light emitting chip 33 or has a gap therebetween.

[0168] Specifically, in the first embodiment, step S2.1 includes:

[0169] S2.1.1. A second black ink layer 36 is provided on the first surface of the circuit board 30. The second black ink layer 36 can usually be provided by a method of dispensing glue and naturally leveling silica gel or epoxy resin. The silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0170] S2.1.2. Heat and cure the second black ink layer 36 under vacuum or non-vacuum conditions.

[0171] In a second embodiment, step S2.1 includes:

[0172] S2.1.1. A mask is disposed on the first surface of the circuit board 30 , and a portion of the first surface where the light-emitting chip 33 is not disposed is exposed at an opening of the mask.

[0173] S2.1.2. A second black ink layer 36 is provided on the mask. The second black ink layer 36 can usually be provided by printing or spraying silicone or epoxy resin, wherein the silicone or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0174] S2.1.3. Remove the mask or remove the mask after pre-curing, form a second black ink layer 36 on the first surface where the light-emitting chip 33 is not set, and form a second opening 360 at the position where the light-emitting chip 33 is set, so that the light-emitting chip 33 is located in the second opening 360.

[0175] The second opening 360 exposes the surface of the light emitting chip 33 , or exposes the surface of the light emitting chip 33 and a gap formed between the light emitting chip 33 and the second black ink layer 36 .

[0176] S2.1.4. Curing the second black ink layer 36 under vacuum or non-vacuum conditions.

[0177] In a third embodiment, step S2.1 includes:

[0178] S2.1.1. A second black ink layer 36 is disposed on the first surface of the circuit board 30. The second black ink layer 36 is usually disposed by printing or spin coating photosensitive ink or photosensitive adhesive.

[0179] S2.1.2. Set a mask on the surface of the second black ink layer 36.

[0180] The mask opening corresponds to the area above the second black ink layer 36 where no light emitting chip 33 is disposed.

[0181] S2.1.3, exposing and curing the second black ink layer 36 not covered by the mask.

[0182] S2.1.4. Remove the mask.

[0183] S2.1.5, developing and removing the second black ink layer 36 covered by the mask, forming a second opening 360 , exposing the light emitting chip 33 disposed in the second opening 360 .

[0184] The surface of the light emitting chip 33 , or the surface of the light emitting chip 33 and the gap formed between the light emitting chip 33 and the second black ink layer 36 , is exposed in the second opening 360 .

[0185] S2.1.6. Thermally cure the second black ink layer 36.

[0186] In a fourth embodiment, step S2.1 includes:

[0187] S2.1.1. A second black ink layer 36 is disposed on the first surface of the circuit board 30. The second black ink layer 36 is usually disposed by printing or spin coating photosensitive ink or photosensitive adhesive.

[0188] S2.1.2. Set a mask on the surface of the second black ink layer 36.

[0189] The mask opening corresponds to above the light emitting chip 33 and the second black ink layer 36 .

[0190] S2.1.3, exposing the second black ink layer 36 not covered by the mask.

[0191] S2.1.4. Remove the mask.

[0192] S2.1.5, developing and removing the second black ink layer 36 not covered by the mask, forming a second opening 360 , exposing the light emitting chip 33 disposed in the second opening 360 .

[0193] The surface of the light emitting chip 33 , or the surface of the light emitting chip 33 and the gap formed between the light emitting chip 33 and the second black ink layer 36 , is exposed in the second opening 360 .

[0194] S2.1.6. Thermally cure the second black ink layer 36.

[0195] Alternatively, the light emitting chip 33 may be disposed on the first surface of the circuit board 30 first, and then the second black ink layer 36 may be disposed; or the second black ink layer 36 may be disposed on the first surface of the circuit board 30 first, and then the light emitting chip 33 may be disposed on the first surface of the circuit board 30 and located in the second opening 360 of the second black ink layer 36. An appropriate implementation method may be selected according to the order in which the light emitting chip 33 and the second black ink layer 36 are disposed.

[0196] S3 . A matte layer 34 is disposed on the first surface of the circuit board 30 . The matte layer 34 wraps the surface and exposed side surfaces of the light emitting chip 33 .

[0197] The matte layer 34 is disposed above the second ink black layer 36, covering part or all of the surface of the second ink black layer 36. When there is a gap between the inner wall surface of the second opening 360 of the second ink black layer 36 and the side surface of the corresponding light emitting chip 33, the matte layer 34 fills the gap. The matte layer 34 also covers part or all of the exposed first surface of the circuit board 30 where no light emitting chip 33 is disposed and which is not covered by the second ink black layer 36.

[0198] S4. A first ink black layer 35 is disposed on the first surface of the circuit board 30. At least one first opening 350 is formed on the first ink black layer 35. The first opening 350 corresponds to the top of the light emitting chip 33, exposing the matte layer 34 located above the light emitting chip 33.

[0199] The specific configuration of the first ink black layer 35 can refer to the configuration of the first embodiment described above, and will not be described in detail here.

[0200] S5. Arrange an electronic device 320 on the second surface of the circuit board 30, and make the electronic device conductively connected to the second conductive circuit 32; and / or, arrange at least one auxiliary circuit board 310 on the second surface of the circuit board 30, and make the auxiliary circuit board 310 conductively connected to the second conductive circuit 32. The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary circuit board 310.

[0201] like Figure 5 As shown, the display module of the third embodiment of the present invention includes a circuit board 30 , a first conductive circuit 31 , a second conductive circuit 32 , a light emitting chip 33 , a matte layer 34 and a black layer 37 .

[0202] The circuit board 30 has a first surface and a second surface opposite to each other. The first conductive circuit 31 is disposed on the first surface, and the second conductive circuit 32 is disposed on the second surface and conductively connected to the first conductive circuit 31. Alternatively, a conductive channel 300 penetrating the first surface and the second surface is disposed in the circuit board 30, and the second conductive circuit 32 is conductively connected to the first conductive circuit 31 through the conductive channel 300.

[0203] The circuit board 30 may be, but is not limited to, a ceramic-based circuit board, a glass-based circuit board, or a traditional PCB board. The first conductive circuit 31 and the second conductive circuit 32 may be formed by single-layer or multi-layer circuits, respectively.

[0204] The light emitting chip 33 is disposed on the first surface of the circuit board 30 and is conductively connected to the first conductive circuit 31. The connection method may be, but is not limited to, one or more combinations of laser welding, reflow welding, hot pressing welding, and metal wire bonding. The light emitting chip 33 may be one or more. The light emitting chip 33 may be, but is not limited to, one or more combinations of flip chips, face-up chips, and vertical chips.

[0205] The matte layer 34 wraps the surface and exposed side of the light emitting chip 33 on the first surface of the circuit board 30. The upper surface of the matte layer 34 away from the circuit board 30 can be a flat surface or a concave-convex surface; the concave-convex surface is formed by the matte layer 34 wrapping the light emitting chip 33.

[0206] The matte layer 34 is made of epoxy resin or silicone, is partially transparent, and is doped with one or more of matte powder, diffusion powder and coloring powder. The matte layer 34 is usually formed by mask spraying, spraying or molding.

[0207] The ink black layer 37 is disposed between the first surface of the circuit board 30 and the matte layer 34. The ink black layer 37 is provided with at least one opening 370. The light emitting chip 33 is located in the opening 370. One opening 370 may contain one or more light emitting chips 33. The ink black layer 37 is ink black and is made of one or more combinations of silicone, epoxy resin, photosensitive ink, and photosensitive glue; the silicone or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0208] The inner wall surface of the opening 370 is in contact with the exposed side surface of the corresponding light emitting chip 33 or has a gap therebetween; if there is a gap, the matte layer 34 fills the gap.

[0209] The matte layer 34 wraps the surface and exposed side of the light emitting chip 33 on the first surface, and covers part or all of the surface of the ink black layer 37. In addition, the matte layer 34 can also cover part or all of the exposed first surface of the circuit board 30 where no light emitting chip 33 is set and not covered by the ink black layer 37.

[0210] The presence of the ink-black layer 37 can reduce or eliminate light crosstalk between the light-emitting chips 33, reduce the light-guiding effect of the matte layer 34, and improve the display effect. More importantly, the presence of the ink-black layer 37 can increase the ink-black degree of the matte layer 34 area that does not cover the light-emitting chip 33. From the display effect point of view, the contrast or contrast can be improved by increasing the ink-black degree of the ink-black layer 37 without sacrificing the brightness, and the brightness can be improved by increasing the light transmittance of the matte layer 34 without sacrificing the contrast or contrast, thereby resolving the contradiction between the high light transmittance of the light-emitting surface and the high ink-black degree of the non-light-emitting surface, and resolving the contradiction between increasing the brightness and increasing the contrast or contrast.

[0211] The display module of this embodiment may further include an auxiliary circuit board 310 and / or an electronic device 320 that are conductively connected to the second conductive circuit 32. For a display module in which both the auxiliary circuit board 310 and the electronic device 320 are provided, the electronic device 320 may be provided on the auxiliary circuit board 310 and conductively connected to the second conductive circuit 32 via the auxiliary circuit board 310.

[0212] The manufacturing method of the display module of the third embodiment may include the following steps:

[0213] S1. A first conductive circuit 31 is disposed on the first surface of the circuit board 30, a conductive path 300 penetrating the first surface and the second surface of the circuit board 30 is disposed, a second conductive circuit 32 is disposed on the second surface, and the first conductive circuit 31 and the second conductive circuit 32 are conductively connected to the conductive path 300 respectively.

[0214] S2 . Arrange a light emitting chip 33 on the first surface of the circuit board 30 , and connect the light emitting chip 33 to the first conductive circuit 31 in a conductive manner.

[0215] S3 . A black ink layer 37 is disposed on the first surface of the circuit board 30 . The black ink layer 37 is provided with at least one opening 370 . The light emitting chip 33 is disposed in the opening 370 .

[0216] The inner wall surface of the opening 370 is in contact with the exposed side surface of the corresponding light emitting chip 33 or has a gap therebetween.

[0217] Specifically, in the first implementation, step S3 includes:

[0218] S3.1. A black ink layer 37 is provided on the first surface of the circuit board 30. The black ink layer 37 can usually be provided by dispensing glue and naturally leveling silica gel or epoxy resin. The silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0219] S3.2. Heat and cure the ink black layer 37 under vacuum or non-vacuum conditions.

[0220] In a second embodiment, step S3 includes:

[0221] S3.1. A mask is disposed on the first surface of the circuit board 30 , and a portion of the first surface where the light-emitting chip 33 is not disposed is exposed at an opening of the mask.

[0222] S3.2. A black ink layer 37 is provided on the mask. The black ink layer 37 can usually be provided by printing or spraying silicone or epoxy resin. The silicone or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

[0223] S3.3, removing the mask or removing the mask after pre-curing, forming an ink black layer 37 having an opening 370 on the first surface, and the light emitting chip 33 is disposed in the opening 370 .

[0224] S3.4. Curing the ink black layer 37 under vacuum or non-vacuum conditions.

[0225] In a third embodiment, step S3 includes:

[0226] S3.1. A black ink layer 37 is disposed on the first surface of the circuit board 30. The black ink layer 37 is usually disposed by printing or spin coating photosensitive ink or photosensitive adhesive.

[0227] S3.2. Set a mask on the surface of the ink black layer 37.

[0228] The mask opening corresponds to the area above the ink black layer 37 where no light emitting chip 33 is provided.

[0229] S3.3, exposing and curing the ink black layer 37 not covered by the mask.

[0230] S3.4. Remove the mask.

[0231] S3.5, developing and removing the black ink layer 37 covered by the mask, forming an opening 370, and exposing the light emitting chip 33 disposed in the opening 370.

[0232] The surface of the light emitting chip 33 , or the surface of the light emitting chip 33 and a gap formed between the light emitting chip 33 and the ink black layer 37 , is exposed in the opening 370 .

[0233] S2.1.6. Thermally curing the black ink layer 37.

[0234] In a fourth embodiment, step S3 includes:

[0235] S3.1. A black ink layer 37 is disposed on the first surface of the circuit board 30. The black ink layer 37 is usually disposed by printing or spin coating photosensitive ink or photosensitive adhesive.

[0236] S3.2. Set a mask on the surface of the ink black layer 37.

[0237] The mask opening corresponds to above the light emitting chip 33 and the ink black layer 37 .

[0238] S3.3, exposing the ink black layer 37 not covered by the mask.

[0239] S3.4. Remove the mask.

[0240] S3.5, developing and removing the ink black layer 37 not covered by the mask, forming an opening 370, exposing the light emitting chip 33 disposed in the opening 370.

[0241] The surface of the light emitting chip 33 , or the surface of the light emitting chip 33 and a gap formed between the light emitting chip 33 and the ink black layer 37 , is exposed in the opening 370 .

[0242] S3.6, thermally curing the black ink layer 37.

[0243] Alternatively, steps S2 and S3 may be performed in sequence, or step S3 may be performed before step S2. That is, the light emitting chip 33 may be first disposed on the first surface of the circuit board 30, and then the ink black layer 37 may be disposed; or the ink black layer 37 may be first disposed on the first surface of the circuit board 30, and then the light emitting chip 33 may be disposed on the first surface of the circuit board 30 and in the opening 370 of the ink black layer 37. An appropriate implementation method may be selected according to the sequence of disposing the light emitting chip 33 and the ink black layer 37.

[0244] S4. A matte layer 34 is disposed on the first surface of the circuit board 30 , and the matte layer 34 wraps the surface and exposed side surfaces of the light emitting chip 33 .

[0245] The matte layer 34 is disposed above the ink black layer 37, covering part or all of the surface of the ink black layer 37. When there is a gap between the inner wall surface of the opening 370 of the ink black layer 37 and the side surface of the corresponding light emitting chip 33, the matte layer 34 fills the gap. The matte layer 34 also covers part or all of the exposed first surface of the circuit board 30 where no light emitting chip 33 is disposed and which is not covered by the ink black layer 37.

[0246] S5. Arrange an electronic device 320 on the second surface of the circuit board 30, and make the electronic device conductively connected to the second conductive circuit 32; and / or, arrange at least one auxiliary circuit board 310 on the second surface of the circuit board 30, and make the auxiliary circuit board 310 conductively connected to the second conductive circuit 32. The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary circuit board 310.

[0247] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A display module, characterized in that: The invention comprises a circuit board having a first surface and a second surface opposite to each other, a first conductive circuit, a light emitting chip, a matte layer and a first black ink layer arranged on the first surface of the circuit board; The light emitting chip is conductively connected to the first conductive circuit; The matte layer wraps the surface and exposed side surfaces of the light emitting chip on the first surface; The first ink black layer is located on the matte layer, and the first ink black layer is provided with at least one first opening corresponding to above the light emitting chip, exposing the matte layer located above the light emitting chip; The matte layer is made of silicone or epoxy resin and mixed with matte powder; the first black ink layer is made of one or more combinations of silicone, epoxy resin, photosensitive ink, and photosensitive glue; the silicone or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder; According to the display effect requirements, the contrast or contrast is improved by increasing the blackness of the first black layer, or the brightness is improved by increasing the transmittance of the matte layer.

2. The display module according to claim 1, characterized in that: The display module also includes a second black ink layer; The second ink black layer is arranged between the first surface and the matte layer, and the second ink black layer is provided with at least one second opening, and the light emitting chip is located in the second opening.

3. The display module according to claim 2, characterized in that: The inner wall surface of the second opening is in contact with the side surface of the corresponding light-emitting chip; or, A gap is left between the inner wall surface of the second opening and the corresponding side surface of the light-emitting chip, and the matte layer fills the gap.

4. The display module according to claim 2, characterized in that: The second black ink layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive glue; the silica gel or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder.

5. The display module according to any one of claims 1 to 4, characterized in that: The display module also includes a second conductive circuit disposed on the second surface of the circuit board, and a conductive path disposed in the circuit board and penetrating the first surface and the second surface; the second conductive circuit is conductively connected to the first conductive circuit through the conductive path.

6. The display module according to claim 5, characterized in that: The display module further includes an auxiliary circuit board and / or an electronic device conductively connected to the second conductive circuit.

7. A method for manufacturing a display module according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1, setting a first conductive circuit on a first surface of the circuit board; S2, arranging a light-emitting chip on the first surface of the circuit board, and electrically connecting the light-emitting chip to the first conductive circuit; S3, providing a matte layer on the first surface of the circuit board, wherein the matte layer wraps the surface and exposed side surfaces of the light-emitting chip; S4. A first ink black layer is disposed on the first surface of the circuit board, and at least one first opening is formed on the first ink black layer. The first opening corresponds to above the light-emitting chip, exposing the matte layer above the light-emitting chip.

8. The method for manufacturing a display module according to claim 7, characterized in that: Step S4 includes: S4.1, providing a first black ink layer on the first surface of the circuit board; S4.2, setting a mask on the surface of the first black ink layer; S4.3, exposing and curing the first black ink layer not covered by the mask; S4.4, removing the mask; S4.5, developing and removing the first black ink layer covered by the mask to form a first opening, exposing the matte layer located above the light-emitting chip; S4.6, thermally curing the first black ink layer; Alternatively, step S4 includes: S4.1, providing a first black ink layer on the first surface of the circuit board; S4.2, setting a mask on the surface of the first black ink layer; S4.3, exposing the first black ink layer not covered by the mask; S4.4, removing the mask; S4.5, developing and removing the first black ink layer not covered by the mask to form a first opening, exposing the matte layer located above the light-emitting chip; S4.6, thermally curing the first black ink layer; Alternatively, step S4 includes: S4.

1. Disposing a mask on the first surface of the circuit board; S4.2, providing a first black ink layer on the mask; S4.3, removing the mask or removing the mask after pre-curing, forming a first opening on the first black ink layer, exposing the matte layer located above the light-emitting chip; S4.4, curing the first black ink layer.

9. The method for manufacturing a display module according to claim 7, wherein: Step S2 also includes the following steps: S2.

1. A second black ink layer is provided on the first surface of the circuit board, wherein the second black ink layer is provided with at least one second opening, and the light emitting chip is provided in the second opening; an inner wall surface of the second opening is in contact with a side surface of the corresponding light emitting chip or a gap is left; In step S3, the matte layer is disposed above the second ink black layer; when a gap is left between the inner wall surface of the second opening and the corresponding side surface of the light-emitting chip, the matte layer fills the gap.

10. The method for manufacturing a display module according to claim 9, characterized in that: Step S2.1 includes: S2.1.1, disposing the second black ink layer on the first surface of the circuit board; S2.1.2, heating and curing the second black ink layer; Alternatively, step S2.1 comprises: S2.1.

1. Disposing a mask on the first surface of the circuit board; S2.1.2, providing a second black ink layer on the mask; S2.1.3, removing the mask or removing the mask after pre-curing, forming a second ink black layer having a second opening on the first surface, and the light-emitting chip is disposed in the second opening; S2.1.4, curing the second black ink layer; Alternatively, step S2.1 comprises: S2.1.1, disposing a second black ink layer on the first surface of the circuit board; S2.1.2, providing a mask on the surface of the second black ink layer; S2.1.3, exposing and curing the second black ink layer not covered by the mask; S2.1.4, removing the mask; S2.1.5, developing and removing the second black ink layer covered by the mask to form a second opening, exposing the light emitting chip disposed in the second opening; S2.1.6, thermally curing the second black ink layer; Alternatively, step S2.1 comprises: S2.1.1, disposing the second black ink layer on the first surface of the circuit board; S2.1.2, providing a mask on the surface of the second black ink layer; S2.1.3, exposing the second black ink layer not covered by the mask; S2.1.4, removing the mask; S2.1.5, developing and removing the second black ink layer not covered by the mask to form a second opening, exposing the light emitting chip disposed in the second opening; S2.1.

6. Thermally cure the second black ink layer.

11. The method for manufacturing a display module according to any one of claims 7 to 10, characterized in that: Step S1 also includes: providing a conductive path penetrating the first surface and the second surface of the circuit board, providing a second conductive circuit on the second surface, and conductively connecting the first conductive circuit and the second conductive circuit to the conductive path respectively.

12. The method for manufacturing a display module according to claim 11, characterized in that: The manufacturing method of the display module further comprises the following steps: S5. Arrange electronic devices on the second surface of the circuit board, and make the electronic devices conductively connected to the second conductive circuit; and / or arrange at least one auxiliary circuit board on the second surface of the circuit board, and make the auxiliary circuit board conductively connected to the second conductive circuit.

13. A display module, characterized in that: The invention comprises a circuit board having a first surface and a second surface opposite to each other, a first conductive circuit arranged on the first surface of the circuit board, a light emitting chip, a matte layer and a black ink layer; The light emitting chip is conductively connected to the first conductive circuit; The matte layer wraps the surface and exposed side surfaces of the light emitting chip on the first surface; The ink black layer is arranged between the first surface and the matte layer, and the ink black layer is provided with at least one opening, and the light emitting chip is located in the opening; The matte layer is made of silicone or epoxy resin and mixed with matte powder; the black ink layer is made of one or more combinations of silicone, epoxy resin, photosensitive ink, and photosensitive glue; the silicone or epoxy resin is mixed with one or more of diffusion powder, matte powder, and coloring powder; According to the display effect requirements, the contrast or contrast is improved by increasing the blackness of the black layer, or the brightness is improved by increasing the light transmittance of the matte layer.

14. The display module according to claim 13, characterized in that: The inner wall surface of the opening is in contact with the side surface of the corresponding light-emitting chip; or, A gap is left between the inner wall surface of the opening and the corresponding side surface of the light-emitting chip, and the matte layer fills the gap.

15. The display module according to any one of claims 13 to 14, characterized in that: The display module also includes a second conductive circuit disposed on the second surface of the circuit board, and a conductive path disposed in the circuit board and penetrating the first surface and the second surface; the second conductive circuit is conductively connected to the first conductive circuit through the conductive path.

16. The display module according to claim 15, characterized in that: The display module further includes an auxiliary circuit board and / or an electronic device conductively connected to the second conductive circuit.

17. A method for manufacturing a display module according to any one of claims 13 to 16, characterized in that: The following steps are involved: S1, setting a first conductive circuit on a first surface of the circuit board; S2, arranging a light-emitting chip on the first surface of the circuit board, and electrically connecting the light-emitting chip to the first conductive circuit; S3, disposing an ink black layer on the first surface of the circuit board, forming at least one opening on the ink black layer, and disposing the light emitting chip in the opening; S4. A matte layer is provided on the first surface of the circuit board, wherein the matte layer wraps the surface and exposed side surfaces of the light-emitting chip and covers the ink black layer.

18. The method for manufacturing a display module according to claim 17, wherein: Step S3 includes: S3.1, disposing the ink black layer on the first surface of the circuit board; S3.2, heating and curing the ink black layer; Alternatively, step S3 includes: S3.

1. Disposing a mask on the first surface of the circuit board; S3.2, providing a black ink layer on the mask; S3.3, removing the mask or removing the mask after pre-curing, forming an ink black layer with an opening on the first surface, and the light-emitting chip is arranged in the opening; S3.4, curing the ink black layer; Alternatively, step S3 includes: S3.1, providing a black ink layer on the first surface of the circuit board; S3.2, providing a mask on the surface of the ink black layer; S3.3, exposing and curing the ink black layer not covered by the mask; S3.4, removing the mask; S3.5, developing and removing the black ink layer covered by the mask to form an opening, exposing the light emitting chip disposed in the opening; S3.6, thermally curing the ink black layer; Alternatively, step S3 includes: S3.1, disposing the ink black layer on the first surface of the circuit board; S3.2, providing a mask on the surface of the ink black layer; S3.3, exposing the ink black layer not covered by the mask; S3.4, removing the mask; S3.5, developing and removing the ink black layer not covered by the mask to form an opening, exposing the light emitting chip disposed in the opening; S3.6, thermally curing the ink black layer.

19. The method for manufacturing a display module according to claim 17, wherein: Step S1 also includes: providing a conductive path penetrating the first surface and the second surface of the circuit board, providing a second conductive circuit on the second surface, and conductively connecting the first conductive circuit and the second conductive circuit to the conductive path respectively.

20. The method for manufacturing a display module according to claim 19, wherein: The manufacturing method of the display module further comprises the following steps: S5. Arrange electronic devices on the second surface of the circuit board, and make the electronic devices conductively connected to the second conductive circuit; and / or arrange at least one auxiliary circuit board on the second surface of the circuit board, and make the auxiliary circuit board conductively connected to the second conductive circuit.

Images