A large current three-pin test probe is provided with a clamp spring machine

By designing a spring clipping machine for high-current three-pin test probes, the simultaneous spring mounting of three semiconductor test probes was achieved, solving the problem of low efficiency in existing technologies and improving production efficiency.

CN114778905BActive Publication Date: 2026-03-03WEINAN MUWANG INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202210383769.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-04-12
Publication Date
2026-03-03
Estimated Expiration
2042-04-12

AI Technical Summary

Technical Problem

In the existing technology, it is difficult to install springs on three semiconductor test probes simultaneously, resulting in low production efficiency and affecting the springs of the already installed probes.

Method used

Design a snap ring clamping machine for high-current three-pin test probes, including a support platform, a positioning mechanism, a snap ring riveting mechanism, and a clamping mechanism. These mechanisms enable the simultaneous clamping, positioning, and spring clamping of three semiconductor test probes.

Benefits of technology

It improves production efficiency, enables simultaneous spring mounting of three semiconductor test probes, reduces the impact on already mounted probes, and has good market prospects.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a large-current three-pin test probe clamp spring machine, which comprises a supporting table, a positioning mechanism and three clamp spring riveting and pressing mechanisms are arranged on the lower side of the supporting table, the three clamp spring riveting and pressing mechanisms are located on the outer side of the positioning mechanism, three clamp spring mounting mechanisms are arranged in the positioning mechanism, and a pressing mechanism is arranged on the upper side of the supporting table. The large-current three-pin test probe clamp spring machine solves the problem that three semiconductor test probes are difficult to simultaneously install springs.
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Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing equipment technology, specifically relating to a snap ring machine for a high-current three-pin test probe. Background Technology

[0002] Semiconductor test probes are a type of miniature connector with a wide range of applications, including medical, microelectronics, and optoelectronic fields.

[0003] Existing semiconductor test probes can be used individually or in combination; for example, it is common to assemble three semiconductor test probes together. When assembling three semiconductor test probes together, three springs need to be installed. Installing them one by one would greatly reduce production efficiency and would also affect the springs on other probes that are already installed. Therefore, designing a spring that can simultaneously install all three probes is essential. Summary of the Invention

[0004] The purpose of this invention is to provide a spring clipping mechanism for a high-current three-pin test probe, which solves the problem that it is difficult to simultaneously install springs on three existing semiconductor test probes.

[0005] To achieve the above objectives, the first technical solution adopted by the present invention is: a snap ring machine for a high-current three-pin test probe, comprising a support platform, a positioning mechanism and three snap ring riveting mechanisms provided on the lower side of the support platform, the three snap ring riveting mechanisms being located outside the positioning mechanism, three snap ring mounting mechanisms being provided inside the positioning mechanism, and a clamping mechanism being provided on the upper side of the support platform.

[0006] As a preferred embodiment of the present invention, the positioning mechanism includes a positioning plate, a connecting plate on the lower side of the positioning plate, an upper chuck on the connecting plate, a connecting shaft on the lower side of the upper chuck, a lower chuck at the lower end of the connecting shaft, three slots on both the upper and lower chucks, a locking strip in each of the three slots of the lower chuck, and a base plate at the lower end of each locking strip; the positioning plate has clamping holes, and the connecting plate has three through holes along its outer edge.

[0007] As a preferred embodiment of the present invention, the snap ring mounting mechanism includes a snap ring limiting plate. The limiting plate has a vertical channel and a horizontal channel located below the vertical channel. A support rod is provided in the vertical channel, and a lever is provided in the horizontal channel. The lever is connected to the lower end of the support rod, and a clamping groove is provided at the lower end of the snap ring limiting plate.

[0008] As a preferred embodiment of the present invention, the positioning mechanism includes a first cylinder, and a punch is mounted on the driving end of the first cylinder. The punch can be extended into the corresponding through hole by being driven by the first cylinder.

[0009] As a preferred embodiment of the present invention, the driving end of the first cylinder is provided with an adjusting block, and the punch is mounted on the adjusting block.

[0010] As a preferred embodiment of the present invention, the snap ring riveting mechanism includes a bracket, on which a second cylinder is mounted, and a pressure block is mounted on the driving end of the second cylinder.

[0011] As a preferred embodiment of the present invention, a plurality of support legs are provided below the support platform.

[0012] The beneficial effects of this invention are: the high-current three-pin test probe snap ring machine used in this invention can use three snap ring riveting mechanisms and three snap ring mounting mechanisms to clamp and position three assembled semiconductor test probes, and use a pressing mechanism to squeeze and clamp the springs onto the three semiconductor test probes, thereby greatly improving production efficiency and having good market promotion and application prospects. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0014] Figure 1 This is a bottom view of a snap ring mechanism for a high-current three-pin test probe according to the present invention;

[0015] Figure 2 This is a top view of a snap ring mechanism for a high-current three-pin test probe according to the present invention;

[0016] Figure 3 This is an assembly diagram of the positioning mechanism and the snap ring mounting mechanism in a snap ring machine for a high-current three-pin test probe according to the present invention.

[0017] Figure 4 This is a schematic diagram of the snap ring mounting mechanism in a snap ring machine for a high-current three-pin test probe according to the present invention;

[0018] Figure 5 This is a partial structural schematic diagram of the positioning mechanism in a snap ring machine for a high-current three-pin test probe according to the present invention.

[0019] In the diagram: 1. Support platform, 2. Support leg, 3. First cylinder, 4. Adjusting block, 5. Punch, 6. Chassis, 7. Clamping strip, 8. Base plate, 9. Lower chuck, 10. Upper chuck, 11. Connecting plate, 12. Positioning plate, 13. Second cylinder, 14. Pressing block, 15. Bracket, 16. Product, 17. Support rod, 18. Lever, 19. Connecting shaft. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] like Figure 1 As shown, a snap ring machine for a high-current three-pin test probe according to the present invention includes a support platform 1. A positioning mechanism and three snap ring riveting mechanisms are provided on the lower side of the support platform 1. The three snap ring riveting mechanisms are located outside the positioning mechanism. Three snap ring mounting mechanisms are provided inside the positioning mechanism. A clamping mechanism is provided on the upper side of the support platform 1.

[0024] Combination Figure 2 During operation, the product (the object to be processed, which consists of three semiconductor test probes assembled together) is first placed in the positioning mechanism. Then, the product is clamped and positioned by three snap ring riveting mechanisms and three snap ring mounting mechanisms. Finally, the product is squeezed by the pressing mechanism to clamp the three springs onto the product.

[0025] Combination Figures 3-5In a high-current three-needle test probe snap ring machine of the present invention, the positioning mechanism includes a positioning plate 12, a connecting plate 11 is provided on the lower side of the positioning plate 12, an upper chuck 10 is provided on the connecting plate 11, a connecting shaft 19 is provided on the lower side of the upper chuck 10, a lower chuck 8 is provided at the lower end of the connecting shaft 19, three slots are provided on both the upper chuck 10 and the lower chuck 8, and a retaining strip 7 is provided in each of the three slots of the lower chuck 8, and a base plate 6 is provided at the lower end of the three retaining strips 7; a clamping hole is provided in the positioning plate 12, and three through holes are provided on the outer edge of the connecting plate 11.

[0026] Combination Figure 4 In a snap ring machine for a high-current three-pin test probe according to the present invention, the snap ring mounting mechanism includes a snap ring limiting plate 9. The limiting plate 9 is provided with a vertical channel and a horizontal channel located below the vertical channel. A support rod 17 is provided in the vertical channel, and a lever 18 is provided in the horizontal channel. The lever 18 is connected to the lower end of the support rod 17. The lower end of the snap ring limiting plate 9 is provided with a clamping groove.

[0027] like Figure 1 As shown, in a snap ring machine for a high-current three-pin test probe according to the present invention, the positioning mechanism includes a first cylinder 3, and a punch 5 is mounted on the drive end of the first cylinder 3. The punch 5 can be extended into the corresponding through hole by being driven by the first cylinder 3.

[0028] like Figure 1 As shown, in a snap ring machine for a high-current three-pin test probe according to the present invention, the snap ring riveting mechanism includes a bracket 15, a second cylinder 13 is provided on the bracket 15, and a pressing block 14 is provided at the drive end of the second cylinder 13.

[0029] The retaining spring limiting plate 9 is fitted into a pair of corresponding slots on the upper chuck 10 and the lower chuck 8. The product 16 is placed in the clamping hole of the positioning plate 12, and the lower end of the product 16 rests on the clamping slots on the three retaining spring limiting plates 9. The support rod 17 can press the product 16 from below. The three first cylinders 3 drive the three punches 5 to extend into the corresponding three through holes to press and clamp the sides of the product. Then, the second cylinder 13 drives the pressure block 14 to move down and squeeze the product 16, so that the spring on it is pre-tightened and clamped, thus completing the spring encapsulation operation.

[0030] Combination Figure 1 In a high-current three-needle test probe snap ring machine of the present invention, the drive end of the first cylinder 3 is provided with an adjustment block 4, and the punch 5 is assembled on the adjustment block 4.

[0031] By controlling the depth of the punch 5 inserted into the adjusting block 4, the pre-tightening degree of the punch 5 on the product 16 can be ensured, so that the product will not be damaged due to excessive force, and the product will not be effectively clamped due to insufficient force. When the pressure block 14 is pressed down later, it is easy to shake, causing the spring to tilt and increasing the product defect rate.

[0032] Combination Figure 1 In a high-current three-needle test probe snap ring machine of the present invention, a plurality of support legs 2 are provided below the support platform 1.

[0033] The support leg 2 supports the support platform 1, ensuring that it will not shake during operation and affect the processing of the product.

[0034] Therefore, compared with the prior art, the high-current three-pin test probe snap ring machine of the present invention can use three snap ring riveting mechanisms and three snap ring mounting mechanisms to clamp and position three assembled semiconductor test probes, and use a pressing mechanism to squeeze and snap the springs onto the three semiconductor test probes, thereby greatly improving production efficiency and having good market promotion and application prospects.

[0035] The foregoing description illustrates and describes several preferred embodiments of the invention. However, as previously stated, it should be understood that the invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the invention should be within the protection scope of the appended claims.

Claims

1. A snap ring clamping mechanism for a high-current three-pin test probe, characterized in that, The application relates to a support table (1) provided with a positioning mechanism and three clamping spring riveting mechanisms on the lower side, three clamping spring riveting mechanisms are arranged on the outer side of the positioning mechanism, three clamping spring mechanisms are arranged in the positioning mechanism, a pressing mechanism is arranged on the upper side of the support table (1). The positioning mechanism comprises a positioning plate (12), the lower side of the positioning plate (12) is provided with a connecting plate (11), the connecting plate (11) is provided with an upper chuck (10), the lower side of the upper chuck (10) is provided with a connecting shaft (19), the lower end of the connecting shaft (19) is provided with a lower chuck (8), the upper chuck (10) and the lower chuck (8) are both provided with three clamping grooves, a clamping strip (7) is arranged in each of the three clamping grooves of the lower chuck (8), the lower ends of the three clamping strips (7) are provided with a base plate (6), and the positioning plate (12) is provided with clamping holes, and the outer edge of the connecting plate (11) is provided with three through holes. The clamping spring mechanism comprises a clamping spring limiting plate (9), the clamping spring limiting plate (9) is provided with a vertical channel and a horizontal channel arranged below the vertical channel, a supporting rod (17) is arranged in the vertical channel, a pushing rod (18) is arranged in the horizontal channel, the pushing rod (18) is connected with the lower end of the supporting rod (17), and the upper end of the clamping spring limiting plate (9) is provided with a clamping groove.

2. The large current three-pin test probe spring clip machine of claim 1, wherein, The positioning mechanism comprises a first air cylinder (3), a punch pin (5) is arranged on the driving end of the first air cylinder (3), and the punch pin (5) can be driven by the first air cylinder (3) to extend into the corresponding through hole.

3. The large current three-pin test probe spring clip machine of claim 2, wherein, The driving end of the first air cylinder (3) is provided with an adjusting block (4), and the punch pin (5) is arranged on the adjusting block (4).

4. The machine for springing the large-current three-pin test probe according to claim 3, characterized in that, The clamping spring riveting mechanism comprises a support (15), a second air cylinder (13) is arranged on the support (15), and a pressing block (14) is arranged on the driving end of the second air cylinder (13).

5. The machine for springing the large-current three-pin test probe according to claim 4, characterized in that, A plurality of supporting legs (2) are arranged below the support table (1).

Citation Information

Patent Citations

  • Micro probe assembly device for semiconductor chips and machining method thereof

    CN109895026A