A bonding method, device, computer device, and storage medium for a circuit board

Abstract

The present invention discloses a method, device, computer device and storage medium for bonding circuit boards. The method includes: determining the coordinates of the first marking points and the angle of the first marking edge that match the circuit board and the back picture of the circuit board according to the front picture of the circuit board and the back picture of the circuit board; moving the circuit board above the bottom plate through a driving device, and determining the coordinates of the second marking points and the angle of the second marking edge that match the circuit board and the front picture of the bottom plate according to the front picture of the bottom plate; determining the position compensation of the circuit board according to the coordinates of the first marking points and the angle of the first marking edge, the coordinates of the second marking points and the angle of the second marking edge, and the preset standard back picture of the circuit board and the standard front picture of the bottom plate; and bonding the circuit board with the bottom plate according to the position compensation through the driving device. By using the technical solution of the present invention, the error in the circuit board bonding process can be effectively corrected, and the circuit board bonding accuracy can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical automation, and particularly to a method and device for fitting a circuit board, a computer device, and a storage medium. Background Art

[0002] With the continuous development of society and the continuous progress of technology, mechanical automation production has become a development trend and gradually replaced manual operation, injecting a new power source for the sustainable development of enterprises.

[0003] In automated production, when assembling objects in different coordinate systems, such as press-fitting and mounting, an industrial camera is used to improve the assembly accuracy. In the prior art, an industrial camera based on a 2D planar target is usually used for calibration and guidance. For example, a circuit board is transplanted and fitted onto a bottom plate through an industrial camera based on a 2D planar target. However, in this method, since the circuit board and the bottom plate are in different coordinate systems, the industrial camera will move with the circuit board, but the movement of the camera will interfere with its calibration and guidance work on the circuit board, affecting the fitting accuracy. Summary of the Invention

[0004] The present invention provides a method and device for fitting a circuit board, a computer device, and a storage medium to effectively correct the error in the process of fitting the circuit board and improve the fitting accuracy of the circuit board.

[0005] In a first aspect, an embodiment of the present invention provides a method for fitting a circuit board, the method including:

[0006] Determining the coordinates of a first marked point and the angle of a first marked edge that match the circuit board and the back picture of the circuit board according to the front picture of the circuit board and the back picture of the circuit board;

[0007] Moving the circuit board above the bottom plate through a driving device, and determining the coordinates of a second marked point and the angle of a second marked edge that match the circuit board and the front picture of the bottom plate according to the front picture of the bottom plate;

[0008] Determining the position compensation of the circuit board according to the coordinates of the first marked point and the angle of the first marked edge, the coordinates of the second marked point and the angle of the second marked edge, and a preset standard back picture of the circuit board and a standard front picture of the bottom plate;

[0009] Fitting the circuit board to the bottom plate according to the position compensation through a driving device.

[0010] In a second aspect, an embodiment of the present invention further provides a device for fitting a circuit board, the device including:

[0011] A first marked point coordinate determination module, configured to determine the coordinates of a first marked point and the angle of a first marked edge that match the circuit board and the back picture of the circuit board according to the front picture of the circuit board and the back picture of the circuit board;

[0012] The second marking point coordinate determination module is configured to move the circuit board above the bottom plate through the driving device, and determine the second marking point coordinates and the second marking edge angle of the circuit board matching the front image of the bottom plate according to the front image of the bottom plate;

[0013] The position compensation determination module is configured to determine the position compensation of the circuit board according to the first marking point coordinates and the first marking edge angle, the second marking point coordinates and the second marking edge angle, and the preset standard circuit board back image and the standard bottom plate front image;

[0014] The circuit board fitting module is configured to fit the circuit board to the bottom plate according to the position compensation through the driving device.

[0015] In a third aspect, an embodiment of the present invention further provides a computer device, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the program, it implements the circuit board fitting method as described in any one of the embodiments of the present invention.

[0016] In a fourth aspect, an embodiment of the present invention further provides a storage medium storing computer-executable instructions, and the computer-executable instructions are used to execute the circuit board fitting method as described in any one of the embodiments of the present invention when executed by a computer processor.

[0017] The technical solution of the embodiment of the present invention, by pre-determining the standard circuit board back image and the standard bottom plate front image, when fitting the circuit board, obtaining the front image of the circuit board and the back image of the circuit board, determining the first marking point coordinates and the first marking edge angle of the circuit board matching the back image of the circuit board, moving the circuit board above the bottom plate, obtaining the front image of the bottom plate, determining the second marking point coordinates and the second marking edge angle of the circuit board matching the front image of the bottom plate, determining the position compensation of the circuit board according to the first marking point coordinates and the first marking edge angle, the second marking point coordinates and the second marking edge angle, and the standard circuit board back image and the standard bottom plate front image, and performing circuit board fitting according to the position compensation. It solves the problem that in the prior art, when fitting a circuit board by an industrial camera based on a 2D planar target, the camera moves with the circuit board, thereby affecting the fitting accuracy, and realizes effective correction of the error in the circuit board fitting process and improves the circuit board fitting accuracy.

[0018] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0020] Figure 1a is a flowchart of a method for bonding circuit boards provided in Embodiment 1 of the present invention;

[0021] Figure 1b is a schematic diagram of a fiducial point and a fiducial edge provided in Embodiment 1 of the present invention;

[0022] Figure 2 is a flowchart of a method for bonding circuit boards provided in Embodiment 2 of the present invention;

[0023] Figure 3 is a schematic structural diagram of a circuit board bonding device provided in Embodiment 3 of the present invention;

[0024] Figure 4 is a schematic structural diagram of a computer device provided in Embodiment 4 of the present invention. Detailed Embodiments

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily need to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0027] Embodiment 1

[0028] Figure 1aThe figure below is a flowchart of a method for bonding a circuit board according to Embodiment 1 of the present invention. This embodiment is applicable to the situation of guiding the transplanting and bonding of a circuit board onto a bottom board. This method can be executed by a circuit board bonding device, which can be implemented in the form of hardware and / or software. The circuit board bonding device can be configured in a computer device and used in cooperation with a circuit board suction device, a driving device, an upper vision guiding device, a lower vision guiding device, etc.

[0029] As Figure 1a shown, the method includes:

[0030] S110. Determine the coordinates of the first marking point and the angle of the first marking edge that match the circuit board and the circuit board back image according to the front image of the circuit board and the back image of the circuit board.

[0031] Among them, the circuit board can be an FPC (Flexible Printed Circuit, flexible circuit board), or other types of circuit boards. This embodiment does not limit the type of the circuit board. In the embodiment of the present invention, the driving device can include a main driving device and a rotary driving device. The main driving device can be an XYZ three-axis driving device, an XZ two-axis driving device, or a robot, etc. This embodiment does not limit the type of the main driving device. The rotary driving device can be a hollow rotary motor, etc. This embodiment also does not limit the type of the rotary driving device. The rotary driving device is connected to the end effector of the main driving device. Specifically, a floating connection method can be adopted. The circuit board suction device can be a vacuum adsorption device. Similarly, this embodiment does not limit the type of the circuit board suction device. The circuit board suction device is connected to the rotary driving device. The upper vision guiding device can include a camera, a lens, and a light source. The light source can supplement light when the light is poor, improve the clarity of the captured image, and thus improve the accuracy of circuit board bonding. The upper vision guiding device is connected to the end effector of the main driving device. The lower vision guiding device can include a camera, a lens, and a light source. The lower vision guiding device is fixedly installed on the ground. Optionally, the lower vision guiding device can be placed horizontally to obtain a horizontal field of view angle. In the embodiment of the present invention, the upper vision guiding device plays a guiding role, enabling the circuit board suction device to better transfer and bond the circuit board. The lower vision guiding device plays a role in correcting the angle, enabling the circuit board suction device to correct the bonding angle of the circuit board.

[0032] The front image of the circuit board is the image obtained by the upper vision guiding device capturing the front of the circuit board before the circuit board suction device sucks the circuit board. The back image of the circuit board is obtained by the lower vision guiding device capturing the back of the circuit board after the circuit board is sucked by the circuit board suction device and transferred to the shooting position of the lower vision guiding device by the driving device.

[0033] The fiducial points are pre-set points on the circuit board, and the fiducial edges are pre-set edges on the circuit board. The fiducial edges need to be two mutually perpendicular edges. When setting the fiducial points and fiducial edges, try to make the fiducial points and fiducial edges be in the middle of the pictures captured by the upper vision guiding device and the lower vision guiding device, and the appearance states of the fiducial points and fiducial edges on the circuit board need to be good, without burrs or other poor appearances. Figure 1b A schematic diagram of the fiducial points and fiducial edges is provided, as Figure 1b shown. The center point of the block diagram is the fiducial point, and the left and bottom raised edges of the circuit board are the standard edges.

[0034] In the embodiment of the present invention, the fiducial points and fiducial edges are recognized in the front picture of the circuit board, and the positional relationship between the fiducial points in the front picture of the circuit board can be obtained. Since the back picture of the circuit board is a picture taken of the back of the circuit board and the fiducial points cannot be recognized, but the fiducial edges can be recognized in the back picture of the circuit board. Therefore, according to the coordinates of the fiducial points in the front picture of the circuit board, the positional relationship between the fiducial points, and the fiducial edges in the back picture of the circuit board, the coordinates of the fiducial points and the angle of the fiducial edges in the back picture of the circuit board can be determined, that is, the first fiducial point coordinates and the first fiducial edge angle.

[0035] S120. Move the circuit board above the bottom plate through the driving device, and determine the second fiducial point coordinates and the second fiducial edge angle that match the circuit board and the front picture of the bottom plate according to the front picture of the bottom plate.

[0036] The bottom plate is the object to which the circuit board is attached. On the premise of keeping the angle of the circuit board not rotated, through the driving device, specifically, through the main driving device, the circuit board is moved above the bottom plate. Since the upper vision guiding device is connected to the end effector of the main driving device, when the circuit board is moved above the bottom plate, the bottom plate is within the visual field range of the upper vision guiding device, and the upper vision guiding device takes pictures of the circuit board and the bottom plate to obtain the front picture of the bottom plate.

[0037] Recognize the fiducial points and fiducial edges from the front picture of the bottom plate, and determine the coordinates of the fiducial points and the angle of the fiducial edges recognized in the front picture of the bottom plate, that is, the second fiducial point coordinates and the second fiducial edge angle.

[0038] Among them, the first fiducial point coordinates and the first fiducial edge angle in the back picture of the circuit board and the second fiducial point coordinates and the second fiducial edge angle in the front picture of the bottom plate are in a mapping relationship.

[0039] S130. Determine the position compensation of the circuit board according to the first fiducial point coordinates and the first fiducial edge angle, the second fiducial point coordinates and the second fiducial edge angle, and the preset standard back picture of the circuit board and the standard front picture of the bottom plate.

[0040] Among them, the picture of the back side of the standard circuit board is obtained by previously transferring the calibrated circuit board to the shooting position of the lower vision guiding device through the driving device and shooting the back side of the calibrated circuit board by the lower vision guiding device. After determining the picture of the back side of the standard circuit board, marking points and a standard edge are set on the picture of the back side of the standard circuit board, and the coordinates of the marking points and the angle of the marking edge are recorded.

[0041] The picture of the front side of the standard base plate is obtained by previously moving the calibrated circuit board to the preset base plate fitting position through the driving device while keeping the angle of the calibrated circuit board unchanged and shooting the calibrated circuit board and the base plate by the upper vision guiding device. After determining the picture of the front side of the standard base plate, marking points and a standard edge are set on the picture of the front side of the standard base plate, and the coordinates of the marking points and the angle of the marking edge are recorded. The marking points and the standard edge on the picture of the front side of the standard base plate have a mapping relationship with the marking points and the standard edge on the picture of the back side of the standard circuit board.

[0042] In the embodiment of the present invention, the coordinate error and the angle error of the circuit board can be determined through the coordinates of the first marking points and the angle of the first marking edge for matching the circuit board with the picture of the back side of the circuit board, and the coordinates of the marking points and the angle of the marking edge in the preset picture of the back side of the standard circuit board. The coordinate error and the angle error of the base plate can be determined through the coordinates of the second marking points and the angle of the second marking edge for matching the circuit board with the picture of the front side of the base plate, and the coordinates of the marking points and the angle of the standard edge on the preset picture of the front side of the standard base plate. According to the coordinate error and the angle error of the circuit board, and the coordinate error and the angle error of the base plate, the final coordinate error and angle error between the circuit board and the base plate during this fitting process can be determined.

[0043] S140. Through the driving device, the circuit board is fitted with the base plate according to the position compensation.

[0044] After determining the final position compensation between the circuit board and the base plate, the circuit board can be rotated and adjusted in position according to the position compensation through the driving device, and the circuit board is fitted with the base plate.

[0045] The technical solution of the embodiment of the present invention can still eliminate the error during the fitting process for the case where the fitting object and the fitting target are not in the same plane, reduce the influence of the hardware part on the fitting effect, and improve the fitting accuracy.

[0046] In the technical solution of the embodiment of the present invention, by pre-determining the picture of the back side of the standard circuit board and the picture of the front side of the standard base plate, when attaching the circuit board, the picture of the front side of the circuit board and the picture of the back side of the circuit board are obtained, the coordinates of the first marking points and the angle of the first marking edge that match the circuit board and the picture of the back side of the circuit board are determined, the circuit board is moved above the base plate, the picture of the front side of the base plate is obtained, the coordinates of the second marking points and the angle of the second marking edge that match the circuit board and the picture of the front side of the base plate are determined, according to the coordinates of the first marking points and the angle of the first marking edge, the coordinates of the second marking points and the angle of the second marking edge, as well as the picture of the back side of the standard circuit board and the picture of the front side of the standard base plate, the position compensation of the circuit board is determined, and the circuit board is attached according to the position compensation. It solves the problem that in the prior art, in the method of attaching a circuit board by an industrial camera based on a 2D planar target, the camera moves with the circuit board, thus affecting the attaching accuracy, and realizes the effective correction of the error in the process of attaching the circuit board and improves the attaching accuracy of the circuit board.

[0047] Embodiment 2

[0048] Figure 2 It is a flowchart of a method for attaching a circuit board provided in Embodiment 2 of the present invention. On the basis of the above embodiment, the steps of determining the coordinates of the first marking points and the angle of the first marking edge, the steps of determining the coordinates of the second marking points and the angle of the second marking edge, and the steps of determining the position compensation of the circuit board are further specified, and the process of pre-calibrating the coordinates of the first standard marking points and the angle of the first standard marking edge, the coordinates of the second standard marking points and the angle of the second standard marking edge, and the rotation center coordinates of the driving device is added.

[0049] As Figure 2 shown, the method includes:

[0050] S210. Determine the rotation center coordinates of the driving device.

[0051] The purpose of pre-determining the rotation center coordinates of the driving device is to facilitate the subsequent calculation of the coordinate compensation of the circuit board according to the angle compensation of the circuit board.

[0052] Specifically, through the driving device, the circuit board can be moved to the shooting position of the lower vision guiding device, the lower vision guiding device shoots the circuit board to obtain a sample picture, and determines the coordinates of the marking points in the sample picture. The rotation driving module is rotated to drive the circuit board to rotate a certain angle, and the circuit board is shot again by the lower vision guiding device to obtain a new sample picture, and the coordinates of the marking points in the new sample picture are determined. This is repeated multiple times to obtain a series of marking point coordinates. Preferably, when rotating the circuit board, a larger rotation angle can be selected to improve the accuracy of circle fitting. For the coordinates of each marking point, a circle fitting algorithm is used to calculate the center of the circle, that is, the rotation center of the rotation driving module. The specific type of the circle fitting algorithm in this embodiment is not limited.

[0053] Optionally, after obtaining the rotation center by fitting, it can be determined whether the obtained rotation center is correct by moving the circuit board suction device to the shooting position of the lower vision guiding device and rotating the circuit board suction device, and judging whether the position of the point corresponding to the rotation center remains unchanged.

[0054] It should be noted that before fitting the rotation center of the driving device, it is necessary to pre-calibrate the upper vision guiding device, the lower vision guiding device and the driving device. The calibration algorithm is not limited in this embodiment.

[0055] Optionally, the checkerboard calibration method can be used to perform non-linear correction on the cameras of the upper vision guiding device and the lower vision guiding device. Specifically, taking the camera of the upper vision guiding device as an example, the checkerboard calibration board can be placed at the position of the circuit board first to ensure that the checkerboard calibration board completely falls within the field of view of the camera of the upper vision guiding device. Then, adjust the focal length, working distance, and brightness of the camera of the upper vision guiding device, and take a picture of the checkerboard calibration board. The frame aspect ratio of the taken picture is 1:1, which is the standard square pixel content. Then, use the checkerboard calibration tool to perform non-linear correction on the camera of the upper vision guiding device.

[0056] Optionally, after using the checkerboard calibration method to perform non-linear correction on the cameras of the upper vision guiding device and the lower vision guiding device, the nine-point calibration method can be used to calibrate the camera of the upper vision guiding device and the driving module, and the camera of the lower vision guiding device and the driving module. Specifically, taking the camera of the upper vision guiding device as an example, the circuit board can be driven by the driving device to move nine points in the image coordinate system of the lower vision guiding device to obtain the coordinates of the nine points. Then, determine the mapping matrix according to the obtained coordinates of the nine points, and substitute the mapping matrix coordinates into the N-point calibration tool for correction.

[0057] S220: Move the calibration circuit board to the shooting position of the back picture of the circuit board through the driving device, and take a picture of the back of the calibration circuit board through the lower vision guiding device to obtain a standard circuit board back picture.

[0058] In the embodiment of the present invention, the back of the calibration circuit board at the shooting position of the lower vision guiding device is photographed through the lower vision guiding device to obtain a standard circuit board back picture. The purpose of taking the standard circuit board back picture is to set the standard marking points and standard marking edges of the lower vision guiding device.

[0059] S230: Determine the coordinates of the first standard marking point and the angle of the first standard marking edge where the calibration circuit board matches the standard circuit board back picture.

[0060] In the picture of the back side of the standard circuit board, set the standard fiducial points and the standard fiducial edge to obtain the coordinates of the first standard fiducial points and the angle of the first standard fiducial edge. The above embodiments have been described, and will not be repeated herein.

[0061] S240. Move the calibration circuit board to the preset bottom board fitting position through the driving device, and take pictures of the calibration circuit board and the bottom board through the upper vision guiding device to obtain a picture of the front side of the standard bottom board.

[0062] On the premise of keeping the angle of the calibration circuit board unchanged, move the calibration circuit board to the preset bottom board fitting position through the driving device, and take a picture of the front side of the standard bottom board through the upper vision guiding device. The purpose of taking the picture of the front side of the standard bottom board is to set the standard fiducial points and the standard fiducial edge of the upper vision guiding device.

[0063] S250. Determine the coordinates of the second standard fiducial points and the angle of the second standard fiducial edge that match between the calibration circuit board and the picture of the front side of the standard bottom board.

[0064] Identify the standard fiducial points and the standard fiducial edge in the picture of the front side of the standard bottom board, and determine the coordinates of the second standard fiducial points and the angle of the second standard fiducial edge. The standard fiducial points in the picture of the front side of the standard bottom board and the picture of the back side of the standard circuit board are the same fiducial points, and the standard fiducial edge in the picture of the front side of the standard bottom board coincides with the standard fiducial edge in the picture of the back side of the standard circuit board.

[0065] S260. Take a picture of the front side of the circuit board through the upper vision guiding device to obtain a picture of the front side of the circuit board.

[0066] S270. Determine the positional relationship between the coordinates of the third fiducial points and the third fiducial edge in the picture of the front side of the circuit board.

[0067] When performing circuit board fitting, before the circuit board suction device sucks the circuit board, the upper vision guiding device takes a picture of the front side of the circuit board. According to the picture of the front side of the circuit board, obtain the fiducial points and the fiducial edge in the picture of the front side of the circuit board, and determine the positional relationship between the coordinates of the fiducial points and the fiducial edge, that is, the positional relationship between the coordinates of the third fiducial points and the third fiducial edge.

[0068] S280. Move the circuit board to the shooting position of the picture of the back side of the circuit board through the driving device, and take a picture of the back side of the circuit board through the lower vision guiding device to obtain a picture of the back side of the circuit board.

[0069] The circuit board suction device sucks the circuit board, and the driving device drives the circuit board to move to the shooting position of the picture of the back side of the circuit board, and the lower vision guiding device takes a picture of the back side of the circuit board to obtain a picture of the back side of the circuit board.

[0070] S290. Determine the first marked edge in the picture of the back side of the circuit board, and determine the coordinates of the first marked point based on the positional relationship between the first marked edge, the coordinates of the third marked point, and the third marked edge.

[0071] By recognizing the picture of the back side of the circuit board, the marked edge in the picture of the back side of the circuit board, that is, the first marked edge, can be recognized. Based on the first marked edge and the positional relationship between the coordinates of the third marked point and the third marked edge in the picture of the front side of the circuit board, the coordinates of the marked point on the back side of the circuit board, that is, the coordinates of the first marked point, can be deduced.

[0072] S2100. Move the circuit board above the bottom plate through the driving device, and take pictures of the circuit board and the bottom plate through the upper vision guiding device to obtain a picture of the front side of the bottom plate.

[0073] Keep the position and angle of the circuit board relative to the circuit board suction device unchanged, move the circuit board above the bottom plate through the driving device, make the bottom plate fall within the field of view of the upper vision guiding device, and take pictures of the circuit board and the bottom plate through the upper vision guiding device to obtain a picture of the front side of the bottom plate.

[0074] S2110. Determine the coordinates of the second marked point and the angle of the second marked edge that match the picture of the front side of the circuit board and the bottom plate.

[0075] Recognize the picture of the front side of the bottom plate to obtain the coordinates of the second marked point and the angle of the second marked edge.

[0076] S2120. Calculate the position compensation of the marked point on the back side of the circuit board based on the coordinates of the first marked point and the angle of the first marked edge, as well as the coordinates of the first standard marked point and the angle of the first standard marked edge.

[0077] Based on the angle of the first marked edge and the angle of the first standard marked edge, the angle compensation required for the circuit board to move from the current position to the standard preset fitting position can be calculated. Based on the coordinates of the first marked point of the marked point at the current position, the rotation center coordinates of the driving device, and the angle compensation, the coordinates of the new position of the marked point after the angle compensation can be deduced through the sine and cosine functions. Based on the coordinates of the new position of the marked point after the angle compensation and the coordinates of the first standard marked point, the coordinate compensation of the marked point relative to the standard marked point after the angle compensation can be deduced.

[0078] Specifically, the position compensation of the marked point on the back side of the circuit board can be calculated through the following formula:

[0079] ΔA J = A J - A Jt ;

[0080] ΔX J = X J-cosΔA J ×(X Jt -X J0 )+sinΔA J ×(Y Jt -Y J0 )-X J0 ;

[0081] ΔY J =Y J -cosΔA J ×(Y Jt -Y J0 )+sinΔA J ×(X Jt -X J0 )-Y J0 ;

[0082] where ΔA J is the angle compensation of the marking point on the back of the circuit board, A J is the angle of the first standard marking edge, A Jt is the angle of the first marking edge, ΔX J is the abscissa compensation of the marking point on the back of the circuit board, ΔY J is the ordinate compensation of the marking point on the back of the circuit board, (X J , Y J ) is the coordinate of the first standard marking point, (X Jt , Y Jt ) is the coordinate of the first marking point, (X J0 , Y J0 ) is the coordinate of the rotation center of the driving device.

[0083] S2130. Calculate the position compensation of the bottom plate according to the coordinates of the second marking point and the angle of the second marking edge, as well as the coordinates of the second standard marking point and the angle of the second standard marking edge.

[0084] Specifically, calculate the position compensation of the bottom plate through the following formula:

[0085] ΔA F =A Ft -A F ;

[0086] ΔX F =X Ft -X F ;

[0087] ΔY F =Y Ft -Y F ;

[0088] where ΔA F is the angle compensation of the standard point of the bottom plate, AFt is the second marked edge angle, A F is the second standard marked edge angle, ΔX F is the abscissa compensation of the standard point of the bottom plate, ΔY F is the ordinate compensation of the standard point of the bottom plate, (X Ft , Y Ft ) are the coordinates of the second marked point, (X F , Y F ) are the coordinates of the second standard marked point.

[0089] S2140. Take the sum of the position compensation of the marked point on the back of the circuit board and the position compensation of the bottom plate as the position compensation of the circuit board.

[0090] Specifically, ΔA = ΔA F + ΔA J , ΔX = ΔX F + ΔX J , ΔY = ΔY F + ΔY J .

[0091] S2150. Through the driving device, attach the circuit board to the bottom plate according to the position compensation.

[0092] Embodiment III

[0093] Figure 3 is a schematic structural diagram of a circuit board attaching device provided by Embodiment III of the present invention. As Figure 3 shown, the device includes: a first marked point coordinate determination module 310, a second marked point coordinate determination module 320, a position compensation determination module 330, and a circuit board attaching module 340.

[0094] The first marked point coordinate determination module 310 is used to determine the first marked point coordinates and the first marked edge angle that match the circuit board and the circuit board back picture according to the circuit board front picture and the circuit board back picture;

[0095] The second marked point coordinate determination module 320 is used to move the circuit board above the bottom plate through the driving device, and determine the second marked point coordinates and the second marked edge angle that match the circuit board and the bottom plate front picture according to the bottom plate front picture;

[0096] The position compensation determination module 330 is used to determine the position compensation of the circuit board according to the first marked point coordinates and the first marked edge angle, the second marked point coordinates and the second marked edge angle, and the preset standard circuit board back picture and the standard bottom plate front picture;

[0097] The circuit board attaching module 340 is used to attach the circuit board to the bottom plate according to the position compensation through the driving device.

[0098] In the technical solution of the embodiment of the present invention, by pre-determining the picture of the back of the standard circuit board and the picture of the front of the standard base plate, when attaching the circuit board, the picture of the front of the circuit board and the picture of the back of the circuit board are obtained, the coordinates of the first marking points and the angle of the first marking edge that match the circuit board and the picture of the back of the circuit board are determined, the circuit board is moved above the base plate, the picture of the front of the base plate is obtained, the coordinates of the second marking points and the angle of the second marking edge that match the circuit board and the picture of the front of the base plate are determined, and the position compensation of the circuit board is determined according to the coordinates of the first marking points and the angle of the first marking edge, the coordinates of the second marking points and the angle of the second marking edge, and the picture of the back of the standard circuit board and the picture of the front of the standard base plate, and the circuit board is attached according to the position compensation. It solves the problem in the prior art that in the method of attaching a circuit board by an industrial camera based on a 2D planar target, the camera moves with the circuit board, which affects the attachment accuracy, and realizes the effective correction of the error in the process of attaching the circuit board and improves the attachment accuracy of the circuit board.

[0099] Based on the above embodiment, the first marking point coordinate determination module 310 includes:

[0100] The front circuit board picture shooting unit is used to shoot the front of the circuit board through the upper vision guiding device to obtain the picture of the front of the circuit board;

[0101] The position relationship determination unit is used to determine the position relationship between the coordinates of the third marking points and the third marking edge in the picture of the front of the circuit board;

[0102] The back circuit board picture shooting unit is used to move the circuit board to the shooting position of the picture of the back of the circuit board through the driving device, and shoot the back of the circuit board through the lower vision guiding device to obtain the picture of the back of the circuit board;

[0103] The first marking point coordinate determination unit is used to determine the first marking edge in the picture of the back of the circuit board, and determine the coordinates of the first marking points according to the first marking edge and the position relationship between the coordinates of the third marking points and the third marking edge.

[0104] Based on the above embodiment, the second marking point coordinate determination module 320 includes:

[0105] The front base plate picture shooting unit is used to move the circuit board above the base plate through the driving device, and shoot the circuit board and the base plate through the upper vision guiding device to obtain the picture of the front of the base plate;

[0106] The second marking point coordinate determination unit is used to determine the coordinates of the second marking points and the angle of the second marking edge that match the circuit board and the picture of the front of the base plate.

[0107] Based on the above embodiment, the device further includes:

[0108] The rotation center coordinate determination module is used to determine the rotation center coordinates of the driving device;

[0109] The standard circuit board back picture shooting module is used to move the calibration circuit board to the shooting position of the circuit board back picture through the driving device, and shoot the back of the calibration circuit board through the lower vision guiding device to obtain the standard circuit board back picture;

[0110] The first standard marking point coordinate determination module is used to determine the first standard marking point coordinates and the first standard marking edge angle that match between the calibration circuit board and the standard circuit board back picture;

[0111] The standard base plate front picture shooting module is used to move the calibration circuit board to the preset base plate fitting position through the driving device, and shoot the calibration circuit board and the base plate through the upper vision guiding device to obtain the standard base plate front picture;

[0112] The second standard marking point coordinate determination module is used to determine the second standard marking point coordinates and the second standard marking edge angle that match between the calibration circuit board and the standard base plate front picture.

[0113] Based on the above embodiments, the position compensation determination module 330 includes:

[0114] The circuit board back marking point position compensation determination unit is used to calculate the position compensation of the marking points on the back of the circuit board according to the first marking point coordinates and the first marking edge angle, and the first standard marking point coordinates and the first standard marking edge angle;

[0115] The base plate position compensation determination unit is used to calculate the position compensation of the base plate according to the second marking point coordinates and the second marking edge angle, and the second standard marking point coordinates and the second standard marking edge angle;

[0116] The circuit board position compensation determination unit is used to take the sum of the position compensation of the marking points on the back of the circuit board and the position compensation of the base plate as the position compensation of the circuit board.

[0117] Based on the above embodiments, the circuit board back marking point position compensation determination unit is specifically used for:

[0118] Calculate the position compensation of the marking points on the back of the circuit board through the following formula:

[0119] ΔA J =A J -A Jt ;

[0120] ΔX J =X J -cosΔA J ×(X Jt -X J0) + sinΔA J ×(Y Jt - Y J0 ) - X J0 ;

[0121] ΔY J = Y J - cosΔA J ×(Y Jt - Y J0 ) + sinΔA J ×(X Jt - X J0 ) - Y J0 ;

[0122] where ΔA J is the angle compensation of the marking point on the back of the circuit board, A J is the angle of the first standard marking edge, A Jt is the angle of the first marking edge, ΔX J is the abscissa compensation of the marking point on the back of the circuit board, ΔY J is the ordinate compensation of the marking point on the back of the circuit board, (X J , Y J ) is the coordinate of the first standard marking point, (X Jt , Y Jt ) is the coordinate of the first marking point, (X J0 , Y J0 ) is the coordinate of the rotation center of the driving device.

[0123] Based on the above embodiments, the bottom plate position compensation determination unit is specifically configured to:

[0124] Calculate the position compensation of the bottom plate through the following formula:

[0125] ΔA F = A Ft - A F ;

[0126] ΔX F = X Ft - X F ;

[0127] ΔY F = Y Ft - Y F ;

[0128] where ΔA F is the angle compensation of the standard point of the bottom plate, A Ft is the angle of the second marking edge, A F is the angle of the second standard marking edge, ΔX F is the abscissa compensation of the standard point of the bottom plate, ΔY FFor the vertical coordinate compensation of the standard point on the bottom plate, (X Ft , Y Ft ) are the coordinates of the second marking point, and (X F , Y F ) are the coordinates of the second standard marking point.

[0129] The bonding device for the circuit board provided by the embodiment of the present invention can execute the circuit board bonding method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0130] Embodiment 4

[0131] Figure 4 As shown in the structural schematic diagram of a computer device provided by Embodiment 4 of the present invention, as Figure 4 shown, the computer device includes a processor 70, a memory 71, an input device 72, and an output device 73; the number of processors 70 in the computer device can be one or more, Figure 4 here, one processor 70 is taken as an example; the processor 70, memory 71, input device 72, and output device 73 in the computer device can be connected through a bus or other means, Figure 4 here, connection through a bus is taken as an example.

[0132] The memory 71, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the modules corresponding to the circuit board bonding method in the embodiment of the present invention (for example, the first marking point coordinate determination module 310, the second marking point coordinate determination module 320, the position compensation determination module 330, and the circuit board bonding module 340 in the circuit board bonding device). The processor 70 executes various functional applications and data processing of the computer device by running the software programs, instructions, and modules stored in the memory 71, that is, implements the above-mentioned circuit board bonding method. The method includes:

[0133] Determine the first marking point coordinates and the first marking side angle that match the circuit board and the circuit board back picture according to the circuit board front picture and the circuit board back picture;

[0134] Move the circuit board above the bottom plate through the driving device, and determine the second marking point coordinates and the second marking side angle that match the circuit board and the bottom plate front picture according to the bottom plate front picture;

[0135] Determine the position compensation of the circuit board according to the first marking point coordinates and the first marking side angle, the second marking point coordinates and the second marking side angle, and the preset standard circuit board back picture and the standard bottom plate front picture;

[0136] Bond the circuit board to the bottom plate according to the position compensation through the driving device.

[0137] The memory 71 may mainly include a program storage area and a data storage area. Among them, the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created according to the use of the terminal, etc. In addition, the memory 71 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage devices. In some instances, the memory 71 may further include a memory remotely provided with respect to the processor 70, and these remote memories may be connected to the computer device through a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0138] The input device 72 can be used to receive input digital or character information, and generate key signal inputs related to user settings and function control of the computer device. The output device 73 may include a display device such as a display screen.

[0139] Embodiment Five

[0140] Embodiment Five of the present invention further provides a storage medium containing computer-executable instructions, and the computer-executable instructions are used to execute a method for bonding a circuit board when executed by a computer processor. The method includes:

[0141] According to the front picture of the circuit board and the back picture of the circuit board, determine the coordinates of the first marking point and the angle of the first marking edge that match the circuit board and the back picture of the circuit board;

[0142] Move the circuit board above the bottom plate through the driving device, and according to the front picture of the bottom plate, determine the coordinates of the second marking point and the angle of the second marking edge that match the circuit board and the front picture of the bottom plate;

[0143] According to the coordinates of the first marking point and the angle of the first marking edge, the coordinates of the second marking point and the angle of the second marking edge, as well as the preset standard back picture of the circuit board and the standard front picture of the bottom plate, determine the position compensation of the circuit board;

[0144] Through the driving device, bond the circuit board to the bottom plate according to the position compensation.

[0145] Of course, the computer-executable instructions of a storage medium provided by an embodiment of the present invention are not limited to the method operations as described above, and can also execute related operations in the method for bonding a circuit board provided by any embodiment of the present invention.

[0146] Through the above description of the embodiments, those skilled in the art can clearly understand that the present invention can be implemented by means of software and necessary general-purpose hardware. Of course, it can also be implemented by hardware, but in many cases the former is a better implementation manner. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as a floppy disk, read-only memory (ROM), random access memory (RAM), flash memory (FLASH), hard disk, or optical disc of a computer, etc., and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in various embodiments of the present invention.

[0147] It should be noted that in the embodiments of the above-described bonding device for a circuit board, the various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of mutual distinction and do not limit the protection scope of the present invention.

[0148] Note that the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for bonding a circuit board, characterized in that, it includes: Determine the rotation center coordinates of the driving device; Move the calibration circuit board to the photographing position of the back side picture of the circuit board by the driving device, and photograph the back side of the calibration circuit board through the lower vision guiding device to obtain a standard back side picture of the circuit board; Determine the coordinates of the first standard marking point and the angle of the first standard marking edge that match between the calibration circuit board and the standard back side picture of the circuit board; Move the calibration circuit board to the preset bottom plate bonding position by the driving device, and photograph the calibration circuit board and the bottom plate through the upper vision guiding device to obtain a standard front side picture of the bottom plate; Determine the coordinates of the second standard marking point and the angle of the second standard marking edge that match between the calibration circuit board and the standard front side picture of the bottom plate; According to the front side picture and the back side picture of the circuit board, determine the coordinates of the first marking point and the angle of the first marking edge that match between the circuit board and the back side picture of the circuit board; Wherein, the marking point is a point preset on the circuit board, the marking edge is an edge preset on the circuit board, and the marking edge needs to be two mutually perpendicular edges; Move the circuit board above the bottom plate by the driving device, and determine the coordinates of the second marking point and the angle of the second marking edge that match between the circuit board and the front side picture of the bottom plate according to the front side picture of the bottom plate; According to the coordinates of the first marking point and the angle of the first marking edge, the coordinates of the second marking point and the angle of the second marking edge, and the preset standard back side picture and standard front side picture of the circuit board, determine the position compensation of the circuit board, including: Calculate the position compensation of the marking point on the back side of the circuit board according to the coordinates of the first marking point and the angle of the first marking edge, and the coordinates of the first standard marking point and the angle of the first standard marking edge; Calculate the position compensation of the bottom plate according to the coordinates of the second marking point and the angle of the second marking edge, and the coordinates of the second standard marking point and the angle of the second standard marking edge; Take the sum of the position compensation of the marking point on the back side of the circuit board and the position compensation of the bottom plate as the position compensation of the circuit board; Bond the circuit board to the bottom plate according to the position compensation through the driving device.

2. The method according to claim 1, characterized in that, According to the front side picture and the back side picture of the circuit board, determining the coordinates of the first marking point and the angle of the first marking edge that match between the circuit board and the back side picture of the circuit board includes: Photograph the front side of the circuit board through the upper vision guiding device to obtain a front side picture of the circuit board; Determine the positional relationship between the coordinates of the third marking point and the third marking edge in the front side picture of the circuit board; Move the circuit board to the photographing position of the back side picture of the circuit board by the driving device, and photograph the back side of the circuit board through the lower vision guiding device to obtain a back side picture of the circuit board; Determine the first marking edge in the back side picture of the circuit board, and determine the coordinates of the first marking point according to the first marking edge and the positional relationship between the coordinates of the third marking point and the third marking edge.

3. The method according to claim 1, characterized in that, Moving the circuit board above the bottom plate by the driving device, and determining the coordinates of the second marking point and the angle of the second marking edge that match between the circuit board and the front side picture of the bottom plate according to the front side picture of the bottom plate includes: The circuit board is moved above the bottom plate by the driving device, and the circuit board and the bottom plate are photographed by the upper vision guiding device to obtain a front picture of the bottom plate; Determine the coordinates of the second marking points and the angle of the second marking edge where the circuit board matches the front picture of the bottom plate.

4. The method according to claim 1, characterized in that, According to the coordinates of the first marking points and the angle of the first marking edge, as well as the coordinates of the first standard marking points and the angle of the first standard marking edge, calculate the position compensation of the marking points on the back of the circuit board, including: Calculate the position compensation of the marking points on the back of the circuit board through the following formula: ΔA J = A J - A Jt ; ΔX J = X J - cosΔA J × (X Jt - X J0 ) + sinΔA J × (Y Jt - Y J0 ) - X J0 ; ΔY J = Y J - cosΔA J × (Y Jt - Y J0 ) + sinΔA J × (X Jt - X J0 ) - Y J0 ; Among them, ΔA J is the angle compensation of the marking point on the back of the circuit board, A J is the first standard marking edge angle, A Jt is the first marking edge angle, ΔX J is the abscissa compensation of the marking point on the back of the circuit board, ΔY J is the ordinate compensation of the marking point on the back of the circuit board, (X J , Y J ) is the first standard marking point coordinate, (X Jt , Y Jt ) is the first marking point coordinate, (X J0 , Y J0 ) is the rotation center coordinate of the driving device.

5. The method according to claim 1, characterized in that, According to the coordinates of the second marking points and the angle of the second marking edge, as well as the coordinates of the second standard marking points and the angle of the second standard marking edge, calculate the position compensation of the bottom plate, including: Calculate the position compensation of the bottom plate through the following formula: ΔA F = A Ft - A F ; ΔX F = X Ft - X F ; ΔY F = Y Ft - Y F ; Among them, ΔA F is the angular compensation of the standard point of the bottom plate, A Ft is the angle of the second marked edge, A F is the angle of the second standard marked edge, ΔX F is the abscissa compensation of the standard point of the bottom plate, ΔY F is the ordinate compensation of the standard point of the bottom plate, (X Ft , Y Ft ) are the coordinates of the second marked point, (X F , Y F ) are the coordinates of the second standard marked point.

6. A bonding device for a circuit board, characterized in that, comprising: A rotation center coordinate determination module for determining the rotation center coordinates of the driving device; A standard circuit board back picture photographing module for moving the calibrated circuit board to the photographing position of the circuit board back picture by the driving device, and photographing the back of the calibrated circuit board by the lower vision guiding device to obtain a standard circuit board back picture; A first standard marking point coordinate determination module for determining the coordinates of the first standard marking points and the angle of the first standard marking edge where the calibrated circuit board matches the standard circuit board back picture; A standard bottom plate front picture photographing module for moving the calibrated circuit board to the preset bottom plate bonding position by the driving device, and photographing the calibrated circuit board and the bottom plate by the upper vision guiding device to obtain a standard bottom plate front picture; A second standard marking point coordinate determination module for determining the coordinates of the second standard marking points and the angle of the second standard marking edge where the calibrated circuit board matches the standard bottom plate front picture; A first marking point coordinate determination module for determining the coordinates of the first marking points and the angle of the first marking edge where the circuit board matches the circuit board back picture according to the circuit board front picture and the circuit board back picture; Wherein, the marking points are points preset on the circuit board, the marking edges are edges preset on the circuit board, and the marking edges need to be two mutually perpendicular edges; A second marking point coordinate determination module for moving the circuit board above the bottom plate by the driving device, and determining the coordinates of the second marking points and the angle of the second marking edge where the circuit board matches the front picture of the bottom plate according to the front picture of the bottom plate; A position compensation determination module for determining the position compensation of the circuit board according to the coordinates of the first marking points and the angle of the first marking edge, the coordinates of the second marking points and the angle of the second marking edge, and the preset standard circuit board back picture and standard bottom plate front picture; The position compensation determination module includes: A circuit board back marking point position compensation determination unit for calculating the position compensation of the marking points on the back of the circuit board according to the coordinates of the first marking points and the angle of the first marking edge, as well as the coordinates of the first standard marking points and the angle of the first standard marking edge; A bottom plate position compensation determination unit for calculating the position compensation of the bottom plate according to the coordinates of the second marking points and the angle of the second marking edge, as well as the coordinates of the second standard marking points and the angle of the second standard marking edge; A circuit board position compensation determination unit, which is configured to use the sum of the position compensation of the marking points on the back of the circuit board and the position compensation of the bottom plate as the position compensation of the circuit board; A circuit board fitting module, which is configured to fit the circuit board to the bottom plate according to the position compensation through a driving device.

7. A computer device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, when the processor executes the program, it implements the circuit board fitting method according to any one of claims 1-5.

8. A storage medium storing computer-executable instructions, characterized in that, when the computer-executable instructions are executed by a computer processor, they are used to execute the circuit board fitting method according to any one of claims 1-5.

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