A printed circuit board press plate structure with laser blind holes, a manufacturing method and its application

Abstract

The present invention belongs to the technical field of printed circuit boards, and discloses a printed circuit board laminate structure with laser blind holes, a manufacturing method and its application. The printed circuit board laminate structure with laser blind holes includes a plurality of substrate composite units from outside to inside; bonding sheets are bonded between different substrate composite units; the substrate composite units located at the outermost layer are all provided with outer blind holes; a plurality of substrate composite units and bonding sheets are provided with outer through holes penetrating the substrate composite units and the bonding sheets; the outer blind holes and the outer through holes are connected to the inner wiring layer to form interconnections. The present invention adopts core-lam type bonding with a blind hole structure to solve the design problems of product signal integrity, stability and multi-channel high-density interconnection.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit boards, and in particular relates to a printed circuit board pressing plate structure with a laser blind hole, a manufacturing method, a first-order 5G optical module printed circuit board, an electrical interface of the optical module, an optical interface carrier, an electrical signal transmission carrier, and a power supply body for electronic equipment components. Background Art

[0002] With the deployment and implementation of the 5G communication 2020 commercial plan, the demand for high-end optical modules in data transmission networks such as backbone networks, access networks, and data centers continues to increase, becoming the core driving force for the development of optical modules, which mainly needs to match the rate development trend in the fields of transmission networks, data centers, security monitoring, and smart grids.

[0003] The printed circuit board (PCB) is the electrical interface of the optical module, the optical interface carrier, the electrical signal transmission carrier, and the device power supply body. One channel of the optical module corresponds to two pairs of differential lines on the PCB. The channels are generally only routed on the top and bottom layers. Multi-channels correspond to high wiring density; the single-channel rate corresponds to the PCB material rate. 5G optical modules are developing towards multi-channels, with 16 channels (32 pairs of differential lines), corresponding to the PCB 3 / 3mil line width / spacing requirements; the increase in the number of channels will inevitably bring about blind buried holes, an increase in the number of board layers, multiple laminations, laser drilling and other requirements. Conventional high-layer board structures and boards can no longer meet the signal transmission requirements of 5G optical module boards.

[0004] Through the above analysis, the problems and defects of the prior art are as follows: The prior art adopts a core lam pressed printed circuit board structure to solve the above-mentioned problems in the signal transmission of the 5G optical module board. However, since the bandwidth requirement of 5G is 10 times that of 4G, the 5G optical module often adopts a multi-channel design to meet the bandwidth, and due to the size limitation of the optical film block, the wiring must be routed using a blind hole structure, and the wiring density is increased by adding layers and blind hole interconnection to meet the multi-channel design. Ordinary through-hole core lam structure printed circuit boards cannot meet the requirements of 5G high-frequency and high-speed transmission, and need to introduce a high-density interconnected printed circuit board structure. This increases the manufacturing cost of the prior art. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the embodiments disclosed in the present invention provide a printed circuit board pressing plate structure with laser blind holes, a manufacturing method, a first-order 5G optical module printed circuit board, an electrical interface of the optical module, an optical interface carrier, an electrical signal transmission carrier, and a power supply provider for electronic equipment devices.

[0006] The technical solution is as follows: the printed circuit board laminate structure with laser blind holes includes a plurality of substrate composite units from outside to inside;

[0007] Adhesive sheets are pressed between different substrate composite units;

[0008] The substrate composite unit located at the uppermost layer and the substrate composite unit located at the lowermost layer are both provided with outer layer blind holes;

[0009] The plurality of substrate composite units and the bonding sheet are provided with outer through holes penetrating the substrate composite units and the bonding sheet;

[0010] The outer layer blind holes and the outer layer through holes are connected with the inner layer wiring layer to form interconnections.

[0011] In one embodiment, the substrate composite unit comprises a substrate, the upper and lower surfaces of the substrate are respectively plated with reverse copper foil layers, and the surface of the reverse copper foil is plated with a copper plating layer.

[0012] In one embodiment, the substrate has a thickness of 0.075 to 0.15 mm; and the copper plating layer has a thickness of 18 μm to 25 μm.

[0013] In one embodiment, the reverse copper foil comprises an upper reverse copper foil and a lower reverse copper foil, and the upper reverse copper foil is arranged on the upper part of the lower reverse copper foil;

[0014] The upper reverse copper foil in the uppermost substrate composite unit is electroplated with an upper copper plating layer; the thickness of the upper reverse copper foil is 18 μm to 50 μm;

[0015] The lower reverse copper foil in the lowermost substrate composite unit is electroplated with a lower copper plating layer, and the thickness of the lower reverse copper foil is 18 μm to 35 μm.

[0016] In one embodiment, the bonding sheet is two sheets, and the thickness of the bonding sheet is 100 μm to 150 μm;

[0017] The aperture of the outer through hole is 200 μm to 600 μm;

[0018] The aperture of the outer layer blind hole is 100 μm to 130 μm.

[0019] Another object of the present invention is to provide a method for manufacturing the printed circuit board laminate structure with laser blind holes, the method for manufacturing the printed circuit board laminate structure with laser blind holes comprising:

[0020] Step 1: the second layer substrate composite unit and the third layer substrate composite unit are transferred by wet film, exposure and etching; and the bonding sheet is pressed between different substrate composite units;

[0021] Step 2: The uppermost substrate composite unit and the lowermost substrate composite unit are laser drilled with blind holes and then filled with reverse copper foil electroplated.

[0022] In one embodiment, the method for manufacturing the printed circuit board laminate structure with laser blind holes specifically comprises the following steps:

[0023] (1) The second and third substrate composite units are first used for inner layer circuits. The top and bottom substrate composite units are also directly used for circuit transfer on the layers inside the board. The top and bottom substrate composite units are used for targets on the edges of the layers outside the board using dummy film to facilitate lamination and alignment. Dummy film is used inside the board to protect the copper surface. The second and third substrate composite units use reverse copper foil as base copper without electroplating. The top and bottom substrate composite units also use reverse copper foil as base copper without electroplating.

[0024] (2) After the uppermost substrate composite unit and the lowermost substrate composite unit are pressed together, the plates are ground using a non-woven 800# brush with a grinding current of 1.5-2A to remove the adhesive powder on the copper surface of the copper-plated layer caused by the pressing;

[0025] (3) Thin copper treatment: the copper layer after thin copper treatment is controlled within the range of 8-10um, and then browning treatment is performed; the amount of browning erosion is controlled within the range of 0.8-1.5um. After browning, laser blind hole drilling, outer through hole drilling, copper deposition, and outer laser blind hole filling and electroplating are performed;

[0026] (4) After the outer blind holes are filled with electroplating, the circuits are made and etched so that the outer circuits are connected to the inner wiring layer through the outer blind holes and the outer through holes to form interconnections.

[0027] Another object of the present invention is to provide a first-order 5G optical module printed circuit board, which is manufactured according to the printed circuit board pressing plate structure with laser blind holes.

[0028] Another object of the present invention is to provide an electrical interface, an optical interface carrier, and an electrical signal transmission carrier of an optical module, wherein the electrical interface, the optical interface carrier, and the electrical signal transmission carrier of the optical module are equipped with the printed circuit board pressing plate structure with laser blind holes.

[0029] Another object of the present invention is to provide a power supply body for an electronic device, wherein the power supply body carrier of the electronic device is equipped with the printed circuit board pressing plate structure with laser blind holes.

[0030] In view of the technical problems existing in the above-mentioned prior art and the difficulty of solving the problems, the technical solutions to be protected by the present invention and the results and data in the research and development process are closely combined to analyze in detail and deeply how the technical solutions of the present invention solve the technical problems, and some creative technical effects brought about after solving the problems. The specific description is as follows: 5G's bandwidth demand is 10 times that of 4G. In order to meet the bandwidth, 5G optical modules often adopt a multi-channel design. However, due to the size limitation of the optical film block, the wiring often adopts a blind hole structure for routing. The wiring density is increased by adding layers and blind hole interconnection to meet the multi-channel design. However, by using the layer-increasing method, the uniformity of the thickness of the dielectric layer after lamination is poor, resulting in low flatness of the outer layer, which affects the integrity of the 5G signal transmission. The present invention adopts a core-lam type lamination with a blind hole structure to reduce the difference in the thickness of the dielectric layer, and improves the outer layer flatness tolerance from + / -0.1mm to + / -0.025mm, solving the integrity and stability problems of the product signal. At the same time, the blind hole design is added by using the outer substrate composite unit to make multi-channel high-density interconnection possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0032] Figure 1 It is a schematic diagram of the structure of a printed circuit board press plate with laser blind holes provided by an embodiment of the present invention;

[0033] Figure 2 It is a flow chart of a method for manufacturing a printed circuit board laminate structure with laser blind holes provided by an embodiment of the present invention;

[0034] Figure 3 1 is a comparison diagram of the prior art build-up blind hole structure provided by Example 10 of the present invention and the Core lam blind hole structure adopted by the present invention;

[0035] Figure 4 This is a rendering of an 8-layer first-order optical module printed circuit board provided by an application embodiment of the present invention;

[0036] In the figure: 1, substrate; 2, bonding sheet; 3, reverse copper foil; 3-1, upper reverse copper foil; 3-2, lower reverse copper foil; 4, copper plating layer; 4-1, upper copper plating layer; 4-2, lower copper plating layer; 5, outer blind hole; 6, outer through hole. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0038] 1. Explanation of the embodiment:

[0039] Example 1

[0040] like Figure 1 As shown, an embodiment of the present invention provides a printed circuit board laminate structure with laser blind holes (core-lam printed circuit board laminate structure with laser blind holes) including a plurality of substrate composite units from outside to inside;

[0041] An adhesive sheet 2 is pressed between different substrate composite units;

[0042] The uppermost substrate composite unit and the lowermost substrate 1 composite unit are both provided with outer blind holes 5;

[0043] The plurality of substrate composite units and the bonding sheet 2 are provided with outer through holes 6 penetrating the substrate composite units and the bonding sheet 2;

[0044] The outer layer blind vias 5 and the outer layer through holes 6 are connected to the inner layer wiring layer to form interconnections.

[0045] Example 2

[0046] Based on the printed circuit board laminate structure with laser blind holes provided in Example 1, Figure 1 As shown, the substrate composite unit comprises: a substrate 1; the upper and lower surfaces of the substrate 1 are covered with reverse copper foil 3, and a copper plating layer 4 is electroplated on the reverse copper foil 3.

[0047] The thickness of the substrate 1 is 0.075 to 0.15 mm. The thickness of the copper plating layer is 18 μm to 25 μm. The thickness of the reverse copper foil 3 is 18 μm to 35 μm.

[0048] The thickness of the outer copper plating layer 4 and the reverse copper foil 3 is 25 μm to 35 μm. Preferably, thin copper treatment is performed here, the thin copper is 8-10 μm, and the copper is 7-9 μm after browning, and the copper plating layer 4 is added, and the total is 8+18=26 μm.

[0049] Example 3

[0050] Based on the printed circuit board laminate structure with laser blind holes provided in Example 1, Figure 1As shown, the thickness of the adhesive in the bonding sheet 2 is 100 μm to 150 μm, so as to ensure that there is no adhesive deficiency or void during pressing.

[0051] Example 4

[0052] Based on the printed circuit board laminate structure with laser blind holes provided in Example 1, Figure 1 As shown, during the copper plating of the copper plating layer 4, the copper plating is completed by outer layer copper deposition and outer layer through hole 6 electroplating.

[0053] Example 4

[0054] Based on the printed circuit board laminate structure with laser blind holes provided in Example 2, Figure 1 As shown, the reverse copper foil 3 includes:

[0055] The upper reverse copper foil 3-1 (including L1, L3, L5 and L7) has a thickness of 18 μm to 50 μm; the upper reverse copper foil 3-1 in the uppermost substrate composite unit is electroplated with an upper copper plating layer 4-1;

[0056] The lower reverse copper foil 3-2 (including L2, L4, L6 and L8) has a thickness of 18 μm to 35 μm; the lower reverse copper foil 3-2 in the lowermost substrate composite unit is electroplated with a lower copper plating layer 4-2.

[0057] Example 5

[0058] Based on the printed circuit board laminate structure with laser blind holes provided in Example 2, Figure 1 As shown, the outer through hole 6 has a diameter of 200 μm to 600 μm. The outer blind hole 5 can be a laser drilled blind hole with a diameter of 75 μm to 150 μm.

[0059] Example 6

[0060] like Figure 2 As shown, taking a four-layer substrate composite unit as an example, an embodiment of the present invention provides a method for manufacturing a printed circuit board laminate structure with a laser blind hole, including:

[0061] S101, the second layer substrate composite unit and the third layer substrate composite unit are transferred by wet film, exposure and etching; and the bonding sheet 2 is pressed between different substrate composite units;

[0062] S102, the uppermost substrate composite unit and the lowermost substrate composite unit are laser drilled blind holes and then filled with electroplated reverse copper foil 3.

[0063] The specific steps include:

[0064] (1) The second and third substrate composite units are first processed with inner-layer circuits, and the top and bottom substrate composite units are also directly processed with circuit transfer on the layers close to the inside of the board. The top and bottom substrate composite units are used to make targets on the edges of the layers close to the outside of the board with dummy film to facilitate pressing and alignment. The dummy film is used to protect the copper surface inside the board. The second and third substrate composite units use reverse copper foil as base copper without electroplating. The top and bottom substrate composite units also use reverse copper foil 3 as base copper without electroplating.

[0065] (2) After the uppermost substrate composite unit and the lowermost substrate composite unit are pressed together, the plates are ground using a non-woven 800# brush at a current of 1.5-2A to remove the adhesive sheet 2 powder caused by the pressing on the copper surface of the copper-plated layer 4;

[0066] (3) Thin copper treatment: the copper plating layer 4 after thin copper treatment is controlled within the range of 8-10um, and then browning treatment is performed; the browning erosion amount is controlled within the range of 0.8-1.5um, and after browning, laser blind hole drilling, outer layer through hole drilling 6, copper deposition, and outer layer laser blind hole 5 filling and electroplating treatment are performed;

[0067] (4) After the outer blind holes 5 are filled with electroplating, circuits are made and etched so that the outer circuits are connected to the inner wiring layer through the outer blind holes 5 and the outer through holes 6 to form interconnections.

[0068] Example 7

[0069] Based on the manufacturing method of the printed circuit board laminated plate structure with laser blind holes provided in Example 6, in step S101, two or more bonding sheets 2 are used to ensure sufficient glue content to ensure that there will be no glue shortage during the lamination process, so as to achieve the purpose of stable signal transmission.

[0070] In step S102, the reverse copper foil 3 is used with the thickness as thin as possible to avoid excessive copper reduction before laser lithography in the upper copper plating layer 4-1 and the lower copper plating layer 4-2 in the uppermost substrate composite unit and the lowermost substrate composite unit, resulting in uneven copper surface and affecting the stability of signal transmission.

[0071] Example 8

[0072] Based on the method for manufacturing a printed circuit board laminate structure with laser blind holes provided in Example 6, the method for manufacturing a printed circuit board laminate structure with laser blind holes specifically includes:

[0073] (1) The second and third substrate composite units are first subjected to reverse copper foil electroplating, and the inner layers of the top and bottom substrate composite units are not first subjected to reverse copper foil electroplating. Only the board edge dummy layers of the top and bottom substrate composite units are subjected to reverse copper foil electroplating to facilitate pressing and alignment. After the second and third substrate composite units are first subjected to reverse copper foil electroplating, the top and bottom substrate composite units are subjected to reverse copper foil electroplating 3;

[0074] (2) After the uppermost substrate composite unit and the lowermost substrate composite unit are pressed together, the plates are ground once to remove prepreg (adhesive sheet 2 ) powder on the copper surface of the copper plating layer 4 caused by the pressing.

[0075] (3) After grinding, the board needs to be treated with thin copper to facilitate the outer layer laser. The copper plating layer 4 is controlled to be 8-10um, and then browning is performed; after browning, laser, through hole drilling (outer layer through hole 6), copper deposition, and hole filling electroplating are performed. Among them, hole filling electroplating is to ensure that the depression of the outer layer blind hole 5 meets the customer's requirements. For this kind of laser board, the smaller the depression, the better the welding reliability;

[0076] (4) After the outer blind hole 5 is electroplated, the hole copper and the surface copper are plated, and then the circuit is made and etched, so that the outer circuit is connected to the inner wiring layer through the outer blind hole 5 and the outer through hole 6 to form an interconnection.

[0077] In the embodiment of the present invention, since the substrates in the uppermost substrate composite unit and the lowermost substrate composite unit need to be laser-plated, they should not be too thick, and the thickness is 0.075 mm to 0.1 mm.

[0078] The selection of the laser hole size needs to be combined with both the aspect ratio and the control of the hole filling depression in the outer blind hole 5, and the aperture is selected to be 75μm to 150μm.

[0079] Due to the high-density design, the copper of the upper copper plating layer 4-1 and the lower copper plating layer 4-2 should not be too thick when the copper plating is completed, otherwise it is not conducive to etching and ensuring the shape of the circuit. The thickness is 25μm to 35μm.

[0080] In order to ensure the integrity and stability of the signal as much as possible during circuit design, corresponding compensation needs to be made for corners and sparse positions. This is for some sharp corners or corners of the circuit graphics. After compensation, the shape of the original design graphics can be avoided from being changed due to etching, so as to achieve the purpose of ensuring signal integrity.

[0081] When applying solder mask, ensure uniform thickness and only allow one application of ink.

[0082] Example 9

[0083] The method for manufacturing the printed circuit board laminate structure with laser blind holes provided in Example 6 is also applicable to single-layer, two-layer, three-layer substrate composite units and more than four-layer substrate composite units, and the manufacturing principle is the same.

[0084] Example 10

[0085] Based on the printed circuit board laminate structure with laser blind holes recorded in the above embodiments 1-9, the bandwidth requirement of 5G is 10 times that of 4G. In order to meet the bandwidth, the 5G optical module often adopts a multi-channel design. However, due to the size limitation of the optical film block, the wiring often adopts a blind hole structure for routing. The wiring density is increased by adding layers and blind hole interconnection to meet the multi-channel design. However, the prior art adopts the method of adding layers, and the uniformity of the thickness of the dielectric layer after lamination is poor, resulting in low flatness of the outer layer, which affects the integrity of 5G signal transmission.

[0086] The present invention adopts core-lam type lamination with blind hole structure to reduce the difference of dielectric layer thickness and improve the outer layer flatness tolerance from + / -0.1mm to + / -0.025mm, solving the problem of product signal integrity and stability. At the same time, the outer layer substrate composite unit is used to increase the blind hole design, making multi-channel high-density interconnection possible. Figure 3 The comparison effect diagram of the prior art build-up blind hole structure and the Core lam blind hole structure of the present invention is shown in the figure.

[0087] 2. Application examples:

[0088] The specific production process of 8-layer first-order optical module product PCB is as follows:

[0089] Step 1, L3-4&L5-6 layer process:

[0090] Cutting - inner layer wet film (for double-sided circuits, i.e. L3&4 or L5&6) - inner layer acid etching - inner layer AOI - punching - browning;

[0091] Step 2, L1-2 & L7-8 layer process:

[0092] Cutting - inner layer wet film (only L2 or L7 layer circuit, outer layer L1 & L8 layer is used as false layer to protect film, only board edge alignment pattern is made) - inner layer acid etching - inner layer AOI - punching - browning;

[0093] The third step is lamination and outer layer process:

[0094] Stacking, pressing, gong edge, resin grinding, copper reduction, outer blind hole 5, outer through hole 6, baking, copper deposition, board electricity, outer dry film 1, outer acid etching-AOI1, outer dry film 2, thick gold, film stripping-AOI2, impedance test, solder mask plugging, solder mask, text, outer dry film 3, gold deposition, film stripping, V-CUT-electric milling, bevel edge, electrical measurement, final inspection, packaging and shipment.

[0095] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by any technician familiar with the technical field within the technical scope disclosed by the present invention and within the spirit and principles of the present invention should be covered within the protection scope of the present invention.

Claims

1. A printed circuit board laminate structure with laser blind holes, characterized in that: The printed circuit board laminate structure with laser blind holes comprises a plurality of substrate composite units from outside to inside; An adhesive sheet (2) is pressed between different substrate composite units; The substrate composite unit located at the uppermost layer and the substrate composite unit located at the lowermost layer are both provided with outer layer blind holes (5); The plurality of substrate composite units and the bonding sheet (2) are provided with outer through holes (6) penetrating the substrate composite units and the bonding sheet (2); The outer layer blind holes (5) and the outer layer through holes (6) are connected to the inner layer wiring layer to form interconnections; The method for manufacturing the printed circuit board laminate structure with laser blind holes comprises: Step 1: the second layer substrate composite unit and the third layer substrate composite unit are subjected to circuit transfer by wet film, exposure and etching; and a bonding sheet (2) is pressed between different substrate composite units; Step 2: The uppermost substrate composite unit and the lowermost substrate composite unit are laser drilled with blind holes and then filled with reverse copper foil electroplated (3); The method for manufacturing the printed circuit board laminate structure with laser blind holes specifically comprises the following steps: (1) The second and third substrate composite units are first processed with inner-layer circuits, and the top and bottom substrate composite units are also directly processed with circuit transfer on the layers close to the inside of the board. The top and bottom substrate composite units are used to make targets on the edges of the layers close to the outside of the board with dummy film to facilitate pressing and alignment. The dummy film is used to protect the copper surface inside the board. The second and third substrate composite units use reverse copper foil as base copper and are not electroplated. The top and bottom substrate composite units also use reverse copper foil (3) as base copper and are not electroplated first. (2) After the uppermost substrate composite unit and the lowermost substrate composite unit are pressed together, the plates are ground using a non-woven 800# grinding brush with a grinding current of 1.5-2A to remove the adhesive sheet (2) powder caused by the pressing on the copper surface of the copper-plated layer (4); (3) Thin copper treatment, the control range of the copper plating layer (4) after thin copper is 8-10um, and then browning treatment is performed; the browning erosion amount is controlled at 0.8-1.5um, and after browning, laser blind hole drilling, outer layer through hole drilling (6), copper deposition, and outer layer laser blind hole (5) are filled with electroplating treatment; (4) After the outer blind holes (5) are filled with electroplating, circuits are made and etched, so that the outer circuits are connected to the inner wiring layer through the outer blind holes (5) and the outer through holes (6) to form interconnections.

2. The printed circuit board laminate structure with laser blind holes according to claim 1, characterized in that: The substrate composite unit comprises: a substrate (1), wherein the upper and lower surfaces of the substrate (1) are respectively electroplated with reverse copper foil layers (3), and the surface of the reverse copper foil (3) is electroplated with a copper plating layer (4).

3. The printed circuit board laminate structure with laser blind holes according to claim 2, characterized in that: The thickness of the substrate (1) is 0.075 to 0.15 mm; the thickness of the copper plating layer is 18 μm to 25 μm.

4. The printed circuit board laminate structure with laser blind holes according to claim 2, characterized in that: The reverse copper foil (3) comprises an upper reverse copper foil (3-1) and a lower reverse copper foil (3-2), wherein the upper reverse copper foil (3-1) is arranged on the upper part of the lower reverse copper foil (3-2); The upper reverse copper foil (3-1) in the uppermost substrate composite unit is electroplated with an upper copper plating layer (4-1); the thickness of the upper reverse copper foil (3-1) is 18 μm to 50 μm; The lower reverse copper foil (3-2) in the lowermost substrate composite unit is electroplated with a lower copper plating layer (4-2), and the thickness of the lower reverse copper foil (3-2) is 18 μm to 35 μm.

5. The printed circuit board laminate structure with laser blind holes according to claim 1, characterized in that: The bonding sheet (2) consists of two sheets, and the thickness of the bonding sheet (2) is 100 μm to 150 μm; The diameter of the outer layer through hole (6) is 200 μm to 600 μm; The outer layer blind hole (5) has a hole diameter of 100 μm to 130 μm.

6. A first-order 5G optical module printed circuit board, characterized in that: The first-order 5G optical module printed circuit board is manufactured according to the printed circuit board pressing plate structure with laser blind holes according to any one of claims 1 to 5.

7. An electrical interface, an optical interface carrier, and an electrical signal transmission carrier of an optical module, characterized in that: The electrical interface, optical interface carrier, and electrical signal transmission carrier of the optical module are equipped with the printed circuit board laminate structure with laser blind holes as described in any one of claims 1 to 5.

8. A power supply for an electronic device, characterized in that: The power supply carrier of the electronic device device is equipped with a printed circuit board laminate structure with laser blind holes as described in any one of claims 1 to 5.

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