Microphone and electronic device having the same

Abstract

The present application relates to a microphone and an electronic device having the same. The microphone can include a housing for receiving a sound signal, at least two transducers for generating an electrical signal in response to the sound signal, and a processing circuit for processing the electrical signal. Each of the at least two transducers can provide a unique formant to the microphone.

Description

[0001] Cross-referencing

[0002] This application claims priority to Chinese patent application No. 202010051694.7, filed on January 17, 2020, the contents of which are incorporated herein by reference. Technical Field

[0003] This application generally relates to microphones, and more particularly to microphones having at least two transducers. Background Technology

[0004] Microphones are widely used in everyday communication devices. To achieve good communication quality in various environments, microphones with high signal-to-noise ratios (SNR) and excellent noise immunity are increasingly popular. High-performance microphones typically have a smooth frequency response curve and a high SNR. In existing techniques for smoothing the frequency response curve, the flat region before the resonance peak in the displacement response curve of the microphone's vibrating device is often utilized. The resonant frequency of the vibrating device may need to be set to a large value, which can lead to a decrease in the microphone's SNR or sensitivity, resulting in poor communication quality. Existing methods for improving the microphone's SNR or sensitivity typically set multiple resonant frequencies within the speech frequency band. Because the microphone's vibrating device has a large Q value (or low damping), it picks up a large amount of sound signal near the resonant frequency (the peak value of the frequency response curve), resulting in uneven distribution of the frequency signal across the entire frequency band, low intelligibility, and even distortion of the sound signal. Therefore, there is a desire to provide high-performance microphones, such as those with high sensitivity, a smooth frequency response curve, and wide bandwidth. Summary of the Invention

[0005] One aspect of this application describes a microphone. The microphone may include a housing for receiving sound signals, at least two transducers for generating electrical signals in response to vibrations of the sound signals, and processing circuitry for processing the electrical signals. Each of the at least two transducers may provide a unique resonance peak for the microphone.

[0006] In some embodiments, at least two transducers may be arranged in the housing in a direction parallel to the vibration direction of the at least two transducers.

[0007] In some embodiments, at least two transducers may be arranged in the housing along a direction perpendicular to the vibration direction of the at least two transducers.

[0008] In some embodiments, an electrical signal may be output from one of the at least two transducers, and the remaining transducers of the at least two transducers may transmit vibration to one of the at least two transducers.

[0009] In some embodiments, the remaining transducers of the at least two transducers can be physically connected to one of the at least two transducers by the at least one damping layer.

[0010] In some embodiments, the electrical signals can comprise at least two electrical outputs of the at least two transducers, wherein each of the at least two electrical outputs of the at least two transducers can be outputted from one of the at least two transducers.

[0011] In some embodiments, at least one of the at least two transducers can be connected with the at least one damping layer.

[0012] In some embodiments, the at least two electrical outputs of the at least two transducers can be processed using a positive-negative-negative-positive processing mode. The positive-negative-negative-positive processing mode can comprise adjusting phases of the at least two electrical outputs, and fusing the adjusted at least two electrical outputs.

[0013] In some embodiments, adjusting the phases of the at least two electrical outputs can comprise inverting a phase of one of the at least two electrical outputs, and keeping a phase of another of the at least two electrical outputs unchanged.

[0014] In some embodiments, the at least two electrical outputs can be electrical outputs of adjacent transducers of the at least two transducers ordered in descending or ascending order according to their resonance frequencies.

[0015] In some embodiments, the at least one damping layer can cover at least a portion of at least one surface of the connected transducer.

[0016] In some embodiments, the at least one surface of the connected transducer can comprise at least one of an upper surface, a lower surface, a side surface, or an inner surface of the transducer.

[0017] In some embodiments, the at least one damping layer can be disposed at least one of on an upper surface of the connected transducer, on a lower surface of the connected transducer, on a side surface of the connected transducer, or inside the connected transducer.

[0018] In some embodiments, the at least one damping layer can be disposed on the at least one surface of the connected transducer at a predetermined angle.

[0019] In some embodiments, the predetermined angle can be 30°, 45°, 60°, or 90°.

[0020] In some embodiments, the at least one damping layer can be connected to the housing.

[0021] In some embodiments, the at least one damping layer can include at least two damping layers, and the at least two damping layers can be symmetrically arranged with respect to a center line of one of the at least two transducers.

[0022] In some embodiments, the microphone can further include at least one elastic element connected to one of the at least two transducers through the at least one damping layer.

[0023] In some embodiments, the at least one elastic element and the at least two transducers can be arranged in the housing in a direction parallel to a vibration direction of the at least two transducers.

[0024] In some embodiments, the at least one elastic element and the at least two transducers can be arranged in the housing in a direction perpendicular to a vibration direction of the at least two transducers.

[0025] In some embodiments, the at least one damping layer can cover at least a portion of at least one surface of the at least one elastic element.

[0026] In some embodiments, a width of the at least one damping layer can be different.

[0027] In some embodiments, a thickness of the at least one damping layer can be different.

[0028] In some embodiments, each of the at least two transducers can include at least one of a diaphragm, a piezoelectric ceramic sheet, a piezoelectric film, or an electrostatic film.

[0029] In some embodiments, a structure of each of the at least two transducers can include at least one of a membrane, a cantilever beam, or a plate.

[0030] In some embodiments, the sound signal can be caused by at least one of a gas, a liquid, or a solid.

[0031] In some embodiments, the sound signal can be transmitted from the housing to the at least two transducers according to a non-contact mode or a contact mode.

[0032] According to another aspect of the present application, an electronic device including a microphone is provided. The microphone can include a housing to receive a sound signal, at least two transducers to vibrate in response to the sound signal to generate an electrical signal, and a processing circuit to process the electrical signal. Each of the at least two transducers can provide a unique resonant peak for the microphone.

[0033] Additional features of the application can be described in the following description. Some additional features of the application can be apparent from this description and / or can become apparent with knowledge of the application in general, to those of ordinary skill in the art. Features of the application can be realized and attained by means of the instrumentalities, methods, and combinations described in the detailed examples discussed below. BRIEF DESCRIPTION OF DRAWINGS

[0034] The application will be further described by example. These examples will be described in detail with reference to the drawings. These examples are non-limiting example embodiments in which like numbers in the figures represent similar structures, wherein:

[0035] Figure 1 is a block diagram of an example microphone according to some embodiments of the application;

[0036] Figure 2A is a schematic diagram of an example spring-mass-damper system of a transducer according to some embodiments of the application;

[0037] Figure 2B is a schematic diagram of an example normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the application;

[0038] Figure 3A is a schematic diagram of an example equivalent model of a transducer connected to a damping layer according to some embodiments of the application;

[0039] Figure 3B is a schematic diagram of an example frequency response curve of a transducer, an example frequency response curve of the transducer with a resonance peak shifted forward (i.e., moving the resonance peak to lower frequencies), and an example frequency response curve of the transducer with a damping layer added according to some embodiments of the application;

[0040] Figure 4 is a schematic diagram of example frequency response curves of different transducers according to some embodiments of the application;

[0041] Figure 5A is a schematic diagram of an example frequency response curve of a transducer, an example displacement curve of a spring element, and an example frequency response curve of the transducer when connected to the spring element according to some embodiments of the application;

[0042] Figure 5B is a schematic diagram of example frequency response curves of a transducer connected to different numbers of spring elements according to some embodiments of the application;

[0043] Figure 6Ais a structural schematic of an exemplary microphone according to some embodiments of the application;

[0044] Figure 6B is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0045] Figure 6C is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0046] Figure 7A is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0047] Figure 7B is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0048] Figure 7C is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0049] Figure 8 is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0050] Figure 9A is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0051] Figure 9B is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0052] Figure 9C is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0053] Figure 10A is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0054] Figure 10B is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0055] Fig. 10c is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0056] Figure 10D is a structural schematic of an exemplary microphone according to some embodiments of the application;

[0057] Figure 11 is a schematic of an exemplary frequency response curve of a first transducer and an exemplary frequency response curve of the first transducer connected to a second transducer via a damping layer according to some embodiments of the application;

[0058] Figure 12Ais a structural schematic diagram of an exemplary microphone according to some embodiments of the present application;

[0059] Figure 12B is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application;

[0060] Figure 12C is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application;

[0061] Figure 12D is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application;

[0062] Figure 13 is a schematic diagram of exemplary frequency response curves of a first transducer, a second transducer and a third transducer, an exemplary displacement curve of a resilient element, and exemplary frequency response curves of the first transducer connected to the second transducer, the third transducer and the resilient element, respectively, according to some embodiments of the present application;

[0063] Figure 14 is a block diagram of an exemplary microphone according to some embodiments of the present application;

[0064] Figure 15A is a schematic diagram of a vibration state of a transducer of a microphone operating at a first frequency lower than a first order resonance frequency of the microphone, according to some embodiments of the present application;

[0065] Figure 15B is a schematic diagram of a vibration state of a transducer of a microphone operating at a second frequency greater than a first order resonance frequency of the microphone and less than a second order resonance frequency of the microphone, according to some embodiments of the present application;

[0066] Figure 15C is a schematic diagram of an exemplary curve of a relationship between an electrical output and a frequency of a transducer, an exemplary curve of a relationship between a modulus of the electrical output and the frequency, and an exemplary curve of a relationship between a total signal of the electrical output and the frequency, according to some embodiments of the present application;

[0067] Figure 15D is a schematic diagram of exemplary displacement curves of three transducers, an exemplary frequency response curve of a transducer connected to the other two transducers, and a total frequency response curve of a microphone comprising the three transducers, according to some embodiments of the present application;

[0068] Figure 15E is a schematic diagram of exemplary displacement curves of a resilient element or two transducers, an exemplary frequency response curve of a transducer connected to the other transducer and the resilient element, and a total frequency response curve of a microphone comprising the two transducers and the resilient element, according to some embodiments of the present application;

[0069] Figure 15F is a schematic illustration of exemplary frequency response curves of multiple transducers connected to each other via one or more damping layers and of a total frequency response curve of a microphone comprising the multiple transducers, in accordance with some embodiments of the application;

[0070] Figure 16A is a schematic illustration of an exemplary process for processing at least two electrical outputs of at least two transducers of a microphone, in accordance with some embodiments of the application;

[0071] Figure 16B is a schematic illustration of exemplary curves of a relationship between an electrical output and a frequency of a transducer, of a relationship between a modulus of the electrical output and a frequency, and of a total signal of the electrical output and a frequency, in accordance with some embodiments of the application;

[0072] Figure 17A is a schematic illustration of exemplary frequency response curves of multiple transducers and of a total frequency response curve of a microphone comprising the multiple transducers, in accordance with some embodiments of the application;

[0073] Figure 17B is a schematic illustration of exemplary frequency response curves of multiple transducers having a damping layer and of a total frequency response curve of a microphone comprising the multiple transducers having a damping layer, in accordance with some embodiments of the application;

[0074] Figure 17C is a schematic illustration of exemplary frequency response curves of a first transducer and a second transducer, of exemplary displacement curves of a first elastic element and a second elastic element, and of a total frequency response curve of a microphone comprising the two transducers and the two elastic elements, in accordance with some embodiments of the application;

[0075] Figure 18A is a schematic illustration of a structure of an exemplary microphone, in accordance with some embodiments of the application;

[0076] Figure 18B is a schematic illustration of a structure of an exemplary microphone, in accordance with some embodiments of the application;

[0077] Figure 18C is a schematic illustration of a structure of an exemplary microphone, in accordance with some embodiments of the application;

[0078] Figure 18D is a schematic illustration of a structure of an exemplary microphone, in accordance with some embodiments of the application;

[0079] Figure 19 is a schematic illustration of exemplary frequency response curves of different transducers, in accordance with some embodiments of the application;

[0080] Figure 20A is a structural schematic of an exemplary microphone according to some embodiments of the present application;

[0081] Figure 20B is a structural schematic of an exemplary microphone according to some embodiments of the present application;

[0082] Figure 20C is a structural schematic of an exemplary microphone according to some embodiments of the present application;

[0083] Figure 20D is a structural schematic of an exemplary microphone according to some embodiments of the present application; and

[0084] Figure 20E is a structural schematic of an exemplary microphone according to some embodiments of the present application. DETAILED DESCRIPTION

[0085] The following description is presented to enable any person skilled in the art to make and use the application, and is provided in the context of particular applications and their requirements. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments and applications without departing from the principles and spirit of the application. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.

[0086] The terminology used in the present application is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used in the present application, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and / or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0087] These and other features, characteristics, and advantages of the present application, along with the methods of operation and functions of the related elements of structure and the combination of parts and economies of manufacture, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification. It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended as a definition of the limits of the application. As such, it should be readily appreciated that the drawings are not necessarily drawn to scale of the objects they represent.

[0088] The flowcharts used herein illustrate the operations performed by systems in accordance with some embodiments disclosed herein. It should be understood that the operations in the flowcharts can not be performed in order. Instead, these operations can be performed in a different order, or concurrently. Also, one or more other operations can be added to these flowcharts. Also, one or more operations can be deleted from these flowcharts.

[0089] One aspect of the present disclosure relates to a microphone and an electronic device having the same. The microphone can include a housing to receive a sound signal, at least two transducers to vibrate in response to the sound signal to generate an electrical signal, and a processing circuit to process the electrical signal. Each of the at least two transducers can provide a unique resonance peak to the microphone, thereby improving the performance of the microphone to achieve, for example, higher sensitivity, smoother frequency response, and / or wider frequency band.

[0090] In some embodiments, the electrical signal can be output from one of the at least two transducers, and the remaining transducers of the at least two transducers can transfer vibrations to the transducer through the at least one damping layer. In this way, the at least one damping layer can transfer vibrations between the at least two transducers to form a vibration system having multiple resonance peaks, while reducing the Q value of each of the at least two transducers to smooth the frequency response of the microphone.

[0091] In some alternative embodiments, the electrical signal can include at least two electrical outputs of the at least two transducers. Each of the at least two electrical outputs of the at least two transducers can be output from one of the at least two transducers. Given that the at least two electrical outputs can be out of phase due to different frequency characteristics of the transducers generating the at least two electrical outputs, the processing circuit can adjust the phase of the at least two electrical outputs (e.g., by inverting the phase of one of the at least two electrical outputs and keeping the phase of the other of the at least two electrical outputs), and fuse the adjusted at least two electrical outputs to obtain the electrical signal representing the sound signal. In this way, by adjusting the phase of different electrical outputs from different transducers, an undesirable reduction in signal strength of the electrical signal due to the at least two electrical outputs canceling each other out when fused can be avoided.

[0092] Additionally, the microphone can further include at least one elastic element. The at least one elastic element can be connected to one of the at least two transducers through the at least one damping layer. The at least one elastic element can provide an additional resonance peak to the microphone, thereby improving the performance of the microphone to achieve, for example, higher sensitivity, smoother frequency response, and / or wider frequency band.

[0093] Figure 1is a block diagram of an example microphone according to some embodiments of the present application. For example, microphone 100 can be a microphone of an electronic device, such as a phone, earpiece, headset, wearable device, smart mobile device, virtual reality device, augmented reality device, computer, laptop, etc. Microphone 100 can include a housing 110, at least two transducers 120 (e.g., transducer 120-1, transducer 120-2, transducer 120-3, transducer 120-n), at least one damping layer 130, and processing circuitry 150.

[0094] Housing 110 can be configured to receive a sound signal. Housing 110 can form one or more enclosed or non-enclosed containment spaces. At least two transducers 120 and at least one damping layer 130 can be arranged in the enclosed or non-enclosed containment spaces of housing 110. In some embodiments, housing 110 can receive a sound signal by contacting or not contacting a sound source. For example, microphone 100 can be a bone conduction microphone, and housing 110 can receive a sound signal by direct contact with a user’s body. For another example, microphone 100 can be an air conduction microphone, and housing 110 can include one or more openings to direct a sound signal into housing 110 by air vibrations, thereby causing each of at least two transducers 120 to vibrate.

[0095] In some embodiments, housing 110 can transfer a sound signal to each of at least two transducers 120 (e.g., transducers 120-1, 120-2, 120-3) in a contact mode or a non-contact mode. For example, in the case that microphone 100 is a bone conduction microphone, transducer 120-1 can be physically connected to housing 110 and vibrate with the vibration of housing 110. For another example, in the case that microphone 100 is an air conduction microphone, transducer 120-1 can be driven by air vibrations in housing 110.

[0096] In some embodiments, at least two transducers 120 can be connected together via at least one damping layer 130. In some embodiments, the connection between at least one damping layer 130 and at least two transducers 120 of microphone 100 can include adhesion, riveting, threaded connection, integral molding, suction connection, etc., or any combination thereof.

[0097] Each transducer 120 can be configured to vibrate in response to a sound signal and / or transfer the vibration to other transducers 120 via at least one damping layer 130. In some embodiments, at least two transducers 120 can be arranged in housing 110 in a particular distribution pattern, for example, in a distribution manner parallel or perpendicular to the vibration direction of at least two transducers 120.

[0098] In some embodiments, each transducer 120 is capable of converting a sound signal into an electrical output through an energy conversion process. The electrical signal to be processed by the processing circuitry 150 can include all or a portion of the electrical output from the transducers 120. For brevity, a transducer that outputs an electrical output to the processing circuitry 150 can be referred to as an output transducer. The output transducer can be configured to receive a sound signal and vibrations imparted onto it by other transducers 120, if any. For example, at least two transducers 120 can include a first transducer and a second transducer connected via a damping layer. The second transducer vibrates in response to a sound signal on one hand, and receives vibrations imparted from the first transducer, which is not electrically connected to the processing circuitry 150, on the other hand. That is, the vibrations of the second transducer are influenced by both the sound signal transmitted through the housing 110 and the vibrations of the first transducer. The vibrations of the second transducer (i.e., the output transducer) can then be converted into an electrical output and transmitted to the processing circuitry 150 for further processing.

[0099] In some embodiments, each transducer 120 can have a unique resonant peak. The coexistence of multiple transducers 120 can provide multiple resonant peaks to the frequency response curve of the microphone 100, thereby improving the performance of the microphone, enabling, for example, higher sensitivity, smoother frequency response, and / or wider frequency band.

[0100] In some embodiments, the signal conversion type of each of the at least two transducers 120 can include electromagnetic (e.g., moving coil, moving iron, etc.), piezoelectric, inverse piezoelectric, electrostatic, electret, planar magnetic, balanced armature, thermoacoustic, etc., or any combination thereof. In some embodiments, each of the at least two transducers 120 can include a diaphragm, a piezoelectric ceramic sheet, a piezoelectric film, an electrostatic film, etc., or any combination thereof. In some embodiments, the shape of each of the at least two transducers 120 can be variable. For example, the shape of each of the at least two transducers 120 can include a circle, a rectangle, a square, an ellipse, etc., or any combination thereof. In some embodiments, the structure of each of the at least two transducers 120 can be variable. For example, the structure of each of the at least two transducers 120 can include a membrane, a cantilever beam, a plate, etc., or any combination thereof.

[0101] The at least one damping layer 130 can be configured to change a complex damping and / or a complex weight of the transducer to adjust a frequency response curve of the microphone 100. For example, the at least one damping layer 130 can be disposed on the transducer 120-1 to adjust a complex damping of the transducer 120-1. Such a disposition can reduce a sharpness of a resonance peak of the transducer 120-1 so that the microphone 100 can have a flatter frequency response curve. In addition, the at least one damping layer 130 can adjust a complex weight of the transducer 120-1, which can shift a resonance peak of the transducer 120-1 forward or backward. In some embodiments, the at least one damping layer 130 can include a film, a block, a composite structure, etc., or any combination thereof. In some embodiments, a material of the at least one damping layer 130 can include a metal, an inorganic nonmetal, a polymer material, a composite material, etc., or any combination thereof.

[0102] In some embodiments, the at least one damping layer 130 can be disposed on any location of the transducer. For example, the at least one damping layer 130 can be disposed on an upper surface of the transducer 120-1, a lower surface of the transducer 120-2, a side surface of the transducer 120-1, an inside of the transducer 120-1, etc., or any combination thereof. In some embodiments, the at least one damping layer 130 can cover at least a portion of a surface of the transducer. For example, the at least one damping layer 130 can cover a portion of the lower surface or the upper surface of the transducer 120-1 (e.g., see the microphone 100 illustrated in Figure 8 As another example, the at least one damping layer 130 can completely cover the lower surface or the upper surface of the transducer 120-1 (e.g., see the microphone 100 illustrated in Figure 6C In some embodiments, the at least one damping layer 130 can be connected to the at least two transducers 120 and the housing 110 (e.g., see the microphone 100 illustrated in Figures 7A-7C In some embodiments, the at least one damping layer 130 can be connected to the at least two transducers 120 without being connected to the housing 110 (e.g., see the microphone 100 illustrated in Figure 8 In some embodiments, the at least one damping layer 130 can be disposed on at least one surface of the transducer at a predetermined angle. For example, the predetermined angle can include 10°, 15°, 30°, 45°, 60°, 70°, 90°, etc. In some embodiments, the at least one damping layer 130 can include two or more damping layers. The two or more damping layers can be symmetrically (e.g., see the microphone 100 illustrated in Figures 10A-10C or asymmetrically (e.g., see the microphone 100 illustrated in Figures 9A-9CThe width of each damping layer 130 can be the same or different in some embodiments. The width of each damping layer can be 10 pm, 20 pm, 30 pm, 40 pm, 50 pm, 60 pm, 70 pm, 80 pm, 90 pm, 100 pm, 500 pm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, etc. The thickness of each damping layer 130 can be the same or different in some embodiments. The thickness of each damping layer can be 0.5 pm, 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 10 pm, 50 pm, 0.1 mm, 0.2 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, etc.

[0103] In some embodiments, the microphone 100 can also include one or more elastic elements 140. The elastic elements can be connected to the transducer 120 (e.g., the output transducer) via one or more damping layers. The elastic elements can be configured to vibrate in response to a sound signal and transmit the vibrations to the transducer to which it is connected in order to provide another resonance peak to the microphone 100. It should be noted that the elastic elements 140 can not be able to directly convert a sound signal to an electrical output as compared to the transducer, which can also provide a resonance peak to the microphone 100. In some embodiments, one or more damping layers can cover at least a portion of a surface of the elastic element 140. For example, one or more damping layers can cover a portion of an upper surface of the elastic element 140 (e.g., see the microphone 100 illustrated in Figure 12C As another example, one or more damping layers can completely cover a lower surface of the elastic element 140 (e.g., see the microphone 100 illustrated in Figure 12A In some embodiments, the transducer 120 and the elastic element 140 can be aligned in the housing 110 in a direction that is parallel or perpendicular to a direction of vibration of the transducer 120.

[0104] The processing circuit 150 can be configured to process the electrical signal. For example, the processing circuit 150 can generate sub-band signals based on the electrical signal according to one or more bandpass filters. As another example, the processing circuit 150 can perform one or more operations on the electrical signal for further processing. Exemplary operations can include amplification, modulation, simple filtering, etc., or any combination thereof.

[0105] It should be noted that the above description of the microphone 100 is provided for illustrative purposes only and is not intended to limit the scope of the present application. Various changes and modifications can be made to the microphone 100 according to the description of the present application by those of ordinary skill in the art. However, these changes and modifications do not depart from the scope of the present application. For example, the damping layer can cover a portion of the surface of the transducer 120 and completely cover the surface of the elastic element 140. As another example, each transducer 120 can be connected to one elastic element accordingly.

[0106] Figure 2A is a schematic diagram of an exemplary spring-mass-damper system of a transducer according to some embodiments of the present application. In a microphone, its transducer can be simplified and equivalent to Figure 2A the spring-mass-damper system shown. When the microphone is working, the spring-mass-damper system can vibrate under the action of an exciting force.

[0107] As Figure 2A shown, the motion of the spring-mass-damper system can be described by the differential equation (1):

[0108] , (1)

[0109] where M represents the mass of the spring-mass-damper system, represents the displacement of the spring-mass-damper system, R represents the damping of the spring-mass-damper system, K represents the spring constant of the spring-mass-damper system, F represents the amplitude of the driving force, and ω represents the circular frequency of the external force.

[0110] The differential equation (1) can be solved to obtain the steady-state displacement (2):

[0111] , (2)

[0112] represents the amount of deformation of the spring-mass-damper system when the microphone is working, which is equal to the value of the output electrical signal, , represents the output displacement, represents the mechanical impedance, and θ represents the oscillation phase.

[0113] The normalized displacement amplitude ratio A can be described as equation (3):

[0114] , (3)

[0115] wherein , represents the displacement amplitude at steady state (or the displacement amplitude when ω = 0), , represents the ratio of the external force frequency to the natural frequency, , represents the circular frequency of the vibration, , represents the mechanical quality factor.

[0116] Figure 2B is a schematic diagram of exemplary normalized displacement resonance curves of a spring-mass-damper system according to some embodiments of the present application.

[0117] A transducer in a microphone can generate an electrical output according to the relative displacement between the transducer and the microphone housing. For example, an electret microphone generates an electrical output according to the distance change between a deformed diaphragm transducer and a backplate. For another example, a cantilever beam bone conduction microphone can generate an electrical output according to the inverse piezoelectric effect caused by a deformed cantilever beam transducer. The greater the displacement of the transducer deformation, the greater the electrical output that the microphone can output. Therefore, in a microphone, its transducer can be simplified and equated to a spring-mass-damper system. The displacement resonance curve of the transducer can conform to the displacement resonance curve of the spring-mass-damper system shown in Figure 2B . As shown in Figure 2B , lines 201, 202, 203, 204, 205, and 206 can represent the displacement resonance curves of the spring-mass-damper systems with damping values arranged in ascending order. The smaller the damping value of the transducer (e.g., material damping value, structural damping value, etc.), the greater the sharpness at the resonance peak of the displacement resonance curve, and the narrower the 3dB bandwidth. In some embodiments, the resonance peak can not be set within the voice frequency range of the microphone with excellent performance.

[0118] Figure 3A is a schematic diagram of an exemplary equivalent model of a transducer connected to a damping layer according to some embodiments of the present application. As shown in Figure 3A , R represents the damping of the transducer, K represents the elastic coefficient of the transducer, and R1 represents the damping of the damping layer. In some embodiments, the composite damping of the transducer can be increased by adding the damping layer. The damping of the transducer can be changed.

[0119] Figure 3B is a schematic diagram of an exemplary frequency response curve of a transducer, an exemplary frequency response curve after moving the resonance peak of the transducer forward (i.e., moving the resonance peak to the low frequency region), and an exemplary frequency response curve after adding a damping layer in the transducer according to some embodiments of the present application. As shown in Figure 3B , the dashed line 301 represents the frequency response curve of the transducer, the dashed line 302 represents the frequency response curve after moving the resonance peak of the transducer forward, and the solid line 303 represents the frequency response curve after adding the damping layer in the transducer.

[0120] In some embodiments, as Figure 3BAs shown by dashed lines 301 and 302, to improve the overall sensitivity of the microphone, the transducer's natural frequency can be shifted forward by moving the formant forward within the speech frequency range (e.g., 10 Hz to 7 kHz), thereby increasing the microphone's sensitivity before the formant. The output shift can be determined according to equation (4):

[0121] (4)

[0122] According to equation (4), when hour, If the transducer size is reduced by increasing M and / or decreasing K... This may reduce The corresponding output displacement It may increase. When hour, Decrease or increase the size of the transducer Output displacement It may be constant. When hour, If the transducer size is reduced by increasing M and / or decreasing K... This may increase The corresponding output displacement It may decrease.

[0123] In some embodiments, the resonance peak may appear in the speech frequency range as it moves forward. If multiple signals are picked up near the resonance peak, the communication quality may be poor due to the intense fluctuations around it. In some embodiments, adding a damping layer to the transducer can increase energy loss during vibration, especially near the resonance peak. The reciprocal of the Q value can be described by equation (5):

[0124] (5)

[0125] in, Represents the reciprocal of the Q value. This represents the 3dB bandwidth (i.e., the two frequencies at half the resonant amplitude). , The difference ), This indicates the resonant frequency. It should be noted that the Q value reflects the sharpness of the resonance peak. A larger Q value corresponds to a sharper resonance peak.

[0126] As the damping of the transducer increases, the Q value decreases, the sharpness of the resonance decreases, and the corresponding 3dB bandwidth increases. In some embodiments, the damping of the damping layer can not be constant during the deformation, and can be large at large forces or large amplitudes. Thus, the damping of the non-resonant region amplitude can be less than the damping of the resonant region amplitude. As shown by the dashed line 302 and the solid line 303 in Figure 3B , the sensitivity of the microphone can not decrease significantly in the non-resonant region, while the Q value of the resonant region can decrease sharply by adding a suitable damping layer in the transducer. Thus, by moving the resonance peak forward to the speech frequency range and reducing the Q value at the resonance peak, the frequency response curve of the microphone can be relatively flat, thereby improving the performance of the microphone.

[0127] Figure 4 is a schematic diagram of exemplary frequency response curves of different transducers according to some embodiments of the present application. As shown in Figure 4 , each of the lines 401, 402, and 403 represents a frequency response curve of a single transducer of the three transducers. The line 404 represents a frequency response curve of an output transducer when the three transducers are connected in series through two damping layers. The output transducer can be any one of the three transducers. The frequency response curve of the output transducer (i.e., the line 404) can have three resonance peaks, each corresponding to one of the three transducers (i.e., the lines 401, 402, and 403). That is, each of the three transducers can transfer vibrations to the output transducer, thereby providing the output transducer with a unique resonance peak. Thus, the sensitivity of the output transducer (represented by the line 404) can be higher than the sensitivity of any one of the three transducers (represented by the lines 401, 402, and 403, respectively).

[0128] According to Figure 4 , the number of transducers connected in series can affect the frequency response curve of the output transducer. The more transducers connected in series, the flatter the frequency response curve of the output transducer. In some embodiments, the frequency response range of the output transducer can be adjusted by adjusting the resonance peaks of each single transducer of the transducers connected in series. For example, one or more resonance peaks in the frequency response of the output transducer can be adjusted to the speech frequency range, such as 20Hz to 8kHz, 50Hz to 7kHz, 100Hz to 5kHz, etc.

[0129] Figure 5A is a schematic diagram of exemplary frequency response curves of a transducer, exemplary displacement curves of an elastic element, and exemplary frequency response curves of the transducer when connected to the elastic element according to some embodiments of the present application. As shown in Figure 5AAs shown, line 501 represents the frequency response curve of the transducer without being connected to the elastic element. Dotted line 502 represents the displacement curve of the elastic element. Solid line 503 represents the frequency response curve of the transducer connected to the elastic element through the damping layer. The elastic element connected to the transducer can transfer vibrations to the transducer, thereby providing the transducer with a resonance peak. The frequency response curve of the transducer connected to the elastic element (i.e., line 503) can have two resonance peaks, each corresponding to the resonance peak of the transducer (i.e., line 501) or the elastic element (i.e., dotted line 502). The sensitivity of the transducer connected to the elastic element (represented by line 503) can be higher than the sensitivity of the transducer without being connected to the elastic element (represented by dotted line 502).

[0130] Figure 5B is a schematic diagram of exemplary frequency response curves of transducers connected to different numbers of elastic elements according to some embodiments of the present application. As shown, Figure 5B line 510 represents the frequency response curve of the transducer without being connected to any elastic element. Line 511 represents the frequency response curve of the transducer connected to one elastic element. Line 512 represents the frequency response curve of the transducer connected to two elastic elements. Line 513 represents the frequency response curve of the transducer connected to three elastic elements. The frequency response curve of the transducer connected to three elastic elements (i.e., solid line 513) can have four resonance peaks, each corresponding to the resonance peak of the transducer (i.e., line 510) or one of the three elastic elements. Each elastic element connected to the transducer can transfer vibrations to the transducer, thereby providing the transducer with a resonance peak. The sensitivity of the transducer connected to three elastic elements (represented by solid line 513) can be higher than the sensitivity of the transducer connected to less than three elastic elements (represented by lines 510, 511, or 512).

[0131] According to Figure 5A and 5B The number of elastic elements connected to the transducer can affect the frequency response curve of the transducer (i.e., the output transducer). The more elastic elements connected to the transducer, the flatter the frequency response curve of the transducer, and the higher the sensitivity of the transducer. In some embodiments, one or more resonance peaks in the frequency response of the transducer can be adjusted by adjusting the resonance peak of the transducer or each elastic element connected to the transducer.

[0132] Figure 6A is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 6AAs shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 but not connected to the housing 110. Each of the two transducers 120 can vibrate in response to a sound signal. For example, when being a bone conduction microphone, each of the two transducers 120 can be directly connected to the housing and vibrate with the vibration of the housing 110. When being an air conduction microphone, for example, the transducers 120 and / or the damping layer 130 can form one or more acoustic cavities, the housing 110 can include one or more openings allowing air conduction sound to enter, and each of the two transducers 120 can vibrate in response to air vibration within the housing 110. The two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can cover a lower surface of each of the two transducers 120.

[0133] Figure 6B is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 but not connected to the housing 110. Similar to the microphone 100 shown in FIG. 1, each of the two transducers 120 can vibrate in response to a sound signal. For example, when being a bone conduction microphone, each of the two transducers 120 can be directly connected to the housing and vibrate with the vibration of the housing 110. When being an air conduction microphone, for example, the transducers 120 and / or the damping layer 130 can form one or more acoustic cavities, the housing 110 can include one or more openings allowing air conduction sound to enter, and each of the two transducers 120 can vibrate in response to air vibration within the housing 110. The two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can cover a lower surface of each of the two transducers 120. Figure 6B Figure 6A

[0134] Figure 6C is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 but not connected to the housing 110. Similar to the microphone 100 shown in FIG. 1, each of the two transducers 120 can vibrate in response to a sound signal. For example, when being a bone conduction microphone, each of the two transducers 120 can be directly connected to the housing and vibrate with the vibration of the housing 110. When being an air conduction microphone, for example, the transducers 120 and / or the damping layer 130 can form one or more acoustic cavities, the housing 110 can include one or more openings allowing air conduction sound to enter, and each of the two transducers 120 can vibrate in response to air vibration within the housing 110. The two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can cover a lower surface of each of the two transducers 120. Figure 6C

[0135] Figure 7A is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 but not connected to the housing 110. Similar to the microphone 100 shown in FIG. 1, each of the two transducers 120 can vibrate in response to a sound signal. For example, when being a bone conduction microphone, each of the two transducers 120 can be directly connected to the housing and vibrate with the vibration of the housing 110. When being an air conduction microphone, for example, the transducers 120 and / or the damping layer 130 can form one or more acoustic cavities, the housing 110 can include one or more openings allowing air conduction sound to enter, and each of the two transducers 120 can vibrate in response to air vibration within the housing 110. The two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can cover a lower surface of each of the two transducers 120. Figure 7A Figure 6A ​​​​Similarly, the two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can be connected to the housing 110 by both ends of the damping layer 130. The damping layer 130 can cover a lower surface of each of the two transducers 120.

[0136] Figure 7B is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 and the housing 110. Similarly to Figure 7B , the two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can be connected to the housing 110 by both ends of the damping layer 130. The damping layer 130 can cover an upper surface of each of the two transducers 120. Figure 7A

[0137] Figure 7C is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 and the housing 110. Similarly to Figure 7A , the two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can be connected to the housing 110 by both ends of the damping layer 130. The damping layer 130 can cover an upper surface of each of the two transducers 120. Figure 6C

[0138] Figure 8 is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, the microphone 100 can include a housing 110, two transducers 120, and a damping layer 130 connected to each of the two transducers 120 and the housing 110. Similarly to Figure 8 , the two transducers 120 can be arranged on the same side of the damping layer 130. The damping layer 130 can be connected to the housing 110 by both ends of the damping layer 130. The damping layer 130 can cover an upper surface of each of the two transducers 120. Figure 6C 7C ​​​Similarly, two cantilever beam transducers 120 may be arranged on opposite sides of the damping layer 130. The damping layer 130 may cover at least a portion of the upper surface of one of the two cantilever beam transducers 120 and at least a portion of the lower surface of the other of the two cantilever beam transducers 120. The two cantilever beam transducers 120 and the damping layer 130 may form a sandwich structure. The damping layer 130 may be sandwiched between the two cantilever beam transducers 120.

[0139] Figures 9A to 9C This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figures 9A to 9C As shown, the microphone 100 may include a housing 110, two cantilever beam transducers 120 (i.e., a first cantilever beam transducer 120-1 and a second cantilever beam transducer 120-2) respectively connected to the housing 110, and three damping layers 130 (i.e., a first damping layer 130-1, a second damping layer 130-2, and a third damping layer 130-3). The first damping layer 130-1 can be connected to the housing 110 at one end and to the first cantilever beam transducer 120-1 at the other end. The second damping layer 130-2 can be connected to each of the two cantilever beam transducers 120 and is not connected to the housing 110. The third damping layer 130-3 can be connected to the housing 110 at one end and to the second cantilever beam transducer 120-2 at the other end. One end (also referred to as the "fixed end") of each of the two cantilever beam transducers 120 can be fixed to the housing 110. In this case, vibrations of the housing 110 can be transmitted to each cantilever beam transducer 120 through the fixed end, causing each cantilever beam transducer 120 to vibrate to generate one or more electrical outputs.

[0140] A first damping layer 130-1 may cover a portion of the upper surface of the first cantilever beam transducer 120-1. A second damping layer 130-2 may cover a portion of the lower surface of the first cantilever beam transducer 120-1 and a portion of the upper surface of the second cantilever beam transducer 120-2. A third damping layer 130-3 may cover a portion of the lower surface of the second cantilever beam transducer 120-2. In some embodiments, each of the three damping layers may be strip-shaped and stretched along the axial direction of the damping layer.

[0141] In some embodiments, the damping layers may be disposed on the transducer at the same or different angles. For example, as... Figure 9AAs shown, each of the three damping layers can be stretched in the vertical direction (i.e., the vibration direction of the first cantilever beam transducer 120-1 and the second cantilever beam transducer 120-2). In other words, each of the three damping layers can be arranged at a 90° angle on the first cantilever beam transducer 120-1 or the second cantilever beam transducer 120-2. As another example, such as Figure 9B As shown, the first damping layer 130-1 can be arranged on the first cantilever beam transducer 120-1 at an angle between 60° and 90°. The second damping layer 130-2 can be arranged on either the first cantilever beam transducer 120-1 or the second cantilever beam transducer 120-2 at an angle of 90°. The third damping layer 130-3 can be arranged on the second cantilever beam transducer 120-2 at an angle between 60° and 90°. As yet another example, such as Figure 9C As shown, the first damping layer 130-1 can be arranged on the first cantilever beam transducer 120-1 at an angle between 60° and 90°. The second damping layer 130-2 can be arranged on the first cantilever beam transducer 120-1 and the second cantilever beam transducer 120-2 at an angle of 90°. The third damping layer 130-3 can be arranged on the second cantilever beam transducer 120-2 at an angle of 90°.

[0142] Figure 10A This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 10A As shown, the microphone 100 may include a housing 110, three transducers 120 (i.e., a first transducer 120-1, a second transducer 120-2, and a third transducer 120-3), and two damping layers 130. One end of each of the two damping layers 130 may be connected to one transducer, and the other end to the other transducer. The three transducers 120 and the two damping layers 130 may form a similar "V" shape within the housing 110. The two damping layers 130 or two of the three transducers 120 (i.e., the first transducer 120-1 and the third transducer 120-3) may be symmetrical with respect to the centerline of the second transducer 120-2. The two damping layers 130 may not be connected to the housing 110.

[0143] Figure 10B This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 10BAs shown, the microphone 100 may include a housing 110, three transducers 120 (i.e., a first transducer 120-1, a second transducer 120-2, and a third transducer 120-3), and four damping layers 130. One end of each of the four damping layers 130 may be connected to a transducer, and the other end to another transducer. The three transducers 120 and the four damping layers 130 may form a similar "V" shape within the housing 110. Two of the four damping layers 130 or two of the three transducers 120 (i.e., the first transducer 120-1 and the third transducer 120-3) may be symmetrical with respect to the centerline of the second transducer 120-2. Two of the four damping layers 130 may not be connected to the housing 110, and the other two of the four damping layers 130 may be connected to the housing, respectively.

[0144] Figure 10C This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 10C As shown, the microphone 100 may include a housing 110, five transducers 120, and four damping layers 130. One end of each of the four damping layers 130 can be connected to a transducer, and the other end can be connected to another transducer. The five transducers 120 and the four damping layers 130 may be formed in a similar "X" shape within the housing 110. Two of the four damping layers 130 or two of the five transducers 120 may be symmetrical with respect to the centerline of the transducers arranged at the center position between the five transducers 120. The four damping layers 130 may not be connected to the housing 110.

[0145] Figure 10D This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 10D As shown, the microphone 100 may include a housing 110, five transducers 120, and eight damping layers 130. One end of each of the eight damping layers 130 may be connected to a transducer, and the other end may be connected to another transducer. The five transducers 120 and the eight damping layers 130 may be formed in a similar "X" shape within the housing 110. Two of the eight damping layers 130 or two of the five transducers 120 may be symmetrical with respect to the centerline of the transducers arranged at the center position between the five transducers 120. Four of the eight damping layers 130 may not be connected to the housing 110, and the other four may be connected to the housing respectively.

[0146] Combination Figures 3A-3B The damping layer described in the text, Figures 6A-6CThe arrangement of the damping layers in 7A-7C, 8, 9A-9C, and 10A-10D can be used to change the composite damping and / or composite weight of the transducers to adjust the frequency response curve of microphone 100. The damping layers can transmit vibrations between transducers, thus shifting the resonance peak of the output transducer (or microphone 100) to a lower frequency range, and reducing the Q value of the output transducer at the resonance peak. Therefore, the sensitivity of the output transducer (or microphone 100) in the frequency band below the resonance frequency can be higher than the sensitivity of each transducer not connected to any other transducer.

[0147] It should be noted that the exemplary microphones described in this application are for illustrative purposes only and are not intended to limit the scope of this application. Various changes and modifications can be made by those skilled in the art based on the description in this application. However, these changes and modifications do not depart from the scope of this application. For example, the housing 110 of the microphone 100 may include one or more openings for introducing sound signals into the housing 110, thereby causing each transducer in the housing 110 to vibrate (e.g., when the microphone 100 is an air-conductive microphone). In this case, the cantilever beam transducer above can be replaced with a diaphragm that is more sensitive to air vibrations. As another example, the microphone 100 may include a housing 110, two transducers 120, and two damping layers 130. Each of the two damping layers 130 may be connected to each of the two transducers 120 but not connected to the housing 110. One of the two damping layers 130 may completely cover the lower surface of each of the two transducers 120. One of the two damping layers 130 may completely cover the upper surface of each of the two transducers 120. Alternatively, the microphone 100 may include a housing 110 having at least two receiving spaces, each receiving space comprising at least two transducers connected by at least one damping layer. Furthermore, the different damping layers may be made of the same or different materials. Each damping layer may optionally be connected to the housing or not. The number of damping layers or transducers is unlimited, and the position of the damping layers relative to the transducers can be adjusted as needed.

[0148] Figure 11 These are schematic diagrams of exemplary frequency response curves of a first transducer according to some embodiments of this application and exemplary frequency response curves of a first transducer connected to a second transducer via a damping layer. Figure 11As shown, line 1101 represents a frequency response curve of the first transducer. Line 1102 represents a frequency response curve of the first transducer when connected to the second transducer through the damping layer. The first transducer connected to the second transducer can be an output transducer. The damping layer can transfer a vibration signal between the first transducer and the second transducer. The frequency response curve of the output transducer (i.e., line 1102) can have two resonance peaks, each corresponding to a resonance peak of the first transducer or the second transducer. Due to the presence of the damping layer, the resonance peaks of the first transducer and the second transducer move to a low frequency region, and the Q value of the output transducer at the resonance peaks can be less than the Q value of the first transducer. Therefore, the sensitivity of the output transducer can be higher than the sensitivity of the first transducer not connected to the second transducer over a frequency band, for example, from 100 Hz to 3000 Hz or from 100 Hz to 2250 Hz.

[0149] Figure 12A is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 12A The microphone 100 can include a housing 110, two transducers 120, an elastic element 140, and a damping layer 130 connected to each of the two transducers 120 and the elastic element 140 respectively and not connected to the housing 110. The two transducers 120 and the elastic element 140 can be disposed on the same side of the damping layer 130. The damping layer 130 can cover the lower surface of each of the two transducers 120 and the elastic element 140. The elastic element 140 can vibrate in response to, for example, air vibration in the housing 110, transfer its vibration to the damping layer 130, and further to the two transducers 120. When one of the two transducers 120 is selected as an output transducer, the vibration of the elastic element 140 and the other of the two transducers 120 can provide two different resonance peaks to the output transducer. Therefore, the sensitivity of the output transducer can be improved. In addition, the damping layer 130 can help to reduce the Q value of the output transducer, thereby making the frequency response of the microphone flatter.

[0150] Figure 12B is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 12BAs shown, the microphone 100 may include a housing 110, two transducers 120, two damping layers 130, and an elastic element 140. Each of the two damping layers 130 can be connected to the housing 110 through both ends of each of the two damping layers 130. The two transducers 120, the elastic element 140, and the damping layers 130 can form a sandwich structure. One of the damping layers 130 can cover the lower surface of one of the two transducers 120 and the upper surface of the other transducer 120. The other damping layer 130 can cover the lower surface of the other transducer 120 and the upper surface of the elastic element 140.

[0151] Figure 12C This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 12C As shown, the microphone 100 may include a housing 110, two cantilever beam transducers 120, two damping layers 130, and an elastic element 140. Each of the two damping layers 130 may not be connected to the housing 110. A cantilever beam transducer or elastic element may be fixed to the housing 110 at one end. The two cantilever beam transducers 120, the elastic element 140, and the damping layers 130 may form a sandwich structure. One of the damping layers 130 may cover the lower surface of one of the cantilever beam transducers 120 and the upper surface of the other cantilever beam transducer 120. The other damping layer 130 may cover the lower surface of the other cantilever beam transducer 120 and the upper surface of the elastic element 140. Each of the two damping layers 130 can be sandwiched between the two cantilever beam transducers 120 and / or the elastic element 140.

[0152] Figure 12D This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 12D As shown, the microphone 100 may include a housing 110, three transducers 120, eight damping layers 130, and two elastic elements 140. One end of each of the eight damping layers 130 may be connected to a transducer or an elastic element, and the other end may be connected to another transducer or elastic element. The three transducers 120, two elastic elements 140, and eight damping layers 130 may be formed in a similar "X" shape within the housing 110. Two of the eight damping layers 130, two of the three transducers 120, or two of the elastic elements 140 may be symmetrical with respect to the centerline of the transducers arranged at a central position between the transducers 120 and / or the elastic elements 140. Four of the eight damping layers 130 may not be connected to the housing 110, and the remaining four damping layers 130 may be connected to the housing respectively.

[0153] It should be noted that the exemplary microphone described in this application is for illustrative purposes only and is not intended to limit the scope of this application. Various changes and modifications can be made to the application described herein, as would be obvious to a person skilled in the art, without departing from the scope of the application. For example, the housing 110 of the microphone 100 can include one or more openings for introducing sound signals into the housing 110 to vibrate each of the transducers in the housing 110 (e.g., when the microphone 100 is an air-conducted microphone). In this case, the above-mentioned transducers can be replaced with diaphragms that are more sensitive to air vibrations. As another example, the microphone 100 can include a housing 110, two transducers 120, an elastic element 140, and a damping layer 130 connected to each of the two transducers 120 and the elastic element 140, respectively, and not connected to the housing 110. The damping layer 130 can cover the upper surface of each of the two transducers 120 and the elastic element 140. As yet another example, the microphone 100 can include a housing 110 having at least two accommodation spaces, at least one of which can include at least two transducers and at least one elastic element connected by at least one damping layer. As still another example, different damping layers can be made of the same or different materials, and the types of transducers can be the same or different. Each damping layer can be optionally connected to the housing or not connected to the housing. The number of damping layers, transducers, or elastic elements can not be limited, and the position of the damping layer relative to the transducer and / or elastic element can be adjusted as needed.

[0154] Figure 13 is a schematic diagram of exemplary frequency response curves of a first transducer, a second transducer, and a third transducer, an exemplary displacement curve of an elastic element, and exemplary frequency response curves of the first transducer connected to the second transducer, the third transducer, and the elastic element, respectively, by three damping layers according to some embodiments of the application. As Figure 13As shown, lines 1301, 1302, and 1303 represent frequency response curves of the first transducer, the second transducer, and the third transducer, respectively. Line 1304 represents a displacement curve of the elastic element. Line 1305 represents a frequency response curve of the first transducer when the first transducer is connected to the second transducer, the third transducer, and the elastic element. The first transducer connected to the second transducer, the third transducer, and the elastic element can be an output transducer. In some embodiments, other transducers than the first transducer can also be used as the output transducer. The damping layer can transfer vibration signals between the transducers and the elastic element. The frequency response curve of the output transducer (i.e., line 1305) can have four resonance peaks, each corresponding to a resonance peak of each transducer or the elastic element (i.e., lines 1301, 1302, 1303, or 1304). Due to the presence of the damping layer, the resonance peaks of each transducer and the elastic element are shifted to the low frequency region, and the Q value of the output transducer at the resonance peaks can be less than the Q value of the first transducer. In this way, the sensitivity of the output transducer (represented by line 1305) can be higher than the sensitivity of any of the three transducers alone (represented by lines 1301, 1302, or 1303).

[0155] According to Figure 13 It is known that the number of transducers and / or elastic elements connected in series can affect the frequency response curve of the output transducer. The more transducers and / or elastic elements connected in series, the flatter the frequency response curve of the output transducer.

[0156] Figure 14 is a block diagram of an example microphone according to some embodiments of the present application. For example, the microphone 1400 can be a microphone of an electronic device, such as a phone, earphone, headphone, wearable device, smart mobile device, virtual reality device, augmented reality device, computer, laptop, etc. The microphone 1400 can include a housing 1410, at least two transducers 1420 (e.g., transducer 1420-1, transducer 1420-2, transducer 1420-3, …, transducer 1420-n), and processing circuitry 1450.

[0157] The housing 1410 can be Figure 1 The housing can receive a sound signal by contacting a sound source or not contacting a sound source, as described in the housing 110.

[0158] Each of the at least two transducers 1420 can be configured to output an electrical output in response to a sound signal vibrating and / or transfer vibrations to other transducers through a damping layer. For example, a sound signal can be transferred from the housing 1410 and deform the at least two transducers 1420 to generate an electrical signal. The electrical signal can include two or more electrical outputs of the at least two transducers 1420. Each electrical output can be output from one transducer.

[0159] In some embodiments, a damping layer can be disposed on one transducer to change the complex damping and / or complex weight of the transducer, thereby adjusting the Q-value and frequency response of the transducer. In some embodiments, two or more transducers (e.g., transducers 1420-1 and 1420-2) can be connected to each other by at least one damping layer 1430. The at least one damping layer 1430 can also change the complex damping and / or complex weight of each transducer interconnected thereto, thereby adjusting the Q-value and frequency response of each transducer. In the interconnected transducers, each transducer can receive a sound signal through the housing 1410 while receiving vibrations from the other transducers through the at least one damping layer 1430. Thus, the frequency response curve of each interconnected transducer can include at least two resonance peaks. Further descriptions regarding the at least one damping layer 1430 and the relationship between the damping layer and the transducer can be found elsewhere in this application (e.g., Figure 1 and the description thereof). For example, the at least one damping layer 1430 can be disposed on at least one surface of each of the at least two transducers 1420 at a predetermined angle (e.g., 10°, 15°, 30°, 45°, 60°, 70°, 90°, etc.). As another example, the connection between any two of the at least two transducers 1420 via the at least one damping layer 1430 can include adhesion, riveting, screwing, integral molding, suction connection, etc., or any combination thereof.

[0160] In some embodiments, the microphone 1400 can further include one or more elastic elements 1440. The elastic elements can be configured to vibrate in response to a sound signal and transmit the vibrations to the transducers connected thereto through the one or more damping layers. In some embodiments, as shown in the microphone 1400 shown in Figure 20C each transducer can be connected to the elastic elements through the damping layers. In some embodiments, a portion of the transducers can be connected to the elastic elements, and the remaining portion of the transducers can be connected only to the damping layers or not connected to the damping layers. In some embodiments, as shown in the microphone 1400 shown in Figure 20B the transducers, the damping layers, and the elastic elements can be connected in series. Further descriptions regarding the elastic elements can be found elsewhere in this application (e.g., Figure 1 and the description thereof).

[0161] In some embodiments, each transducer (e.g., transducers 1420-1, 1420-2, 1420-3) can be used as an output transducer to output an electrical output to the processing circuit 1450. As shown in the microphone 1400 shown in Figure 14As shown, transducers 1420-1, 1420-2, 1420-3,... can output electrical outputs 1422-1, 1422-2, 1422-3, respectively, to processing circuitry 1450. Alternatively, a portion of the at least two transducers 1420 can be output transducers that output electrical outputs, while another portion of the at least two transducers 1420 can only transfer vibrations to the output transducers to which they are connected.

[0162] In some embodiments, considering that the two or more electrical outputs can be out of phase due to different frequency characteristics of the transducers that generate the electrical outputs, the phases of the two or more electrical outputs of the at least two transducers 1420 can be adjusted before fusing the two or more electrical outputs. For example, processing circuitry 1450 can adjust the phases of the two or more electrical outputs by a phase adjustment operation. When a particular transducer is connected in a microphone circuit, processing circuitry 1450 can invert the phase of the electrical output of the particular transducer before further processing the electrical output. In other words, the phase processing mode of a particular transducer can be different from other transducers. Take two independently arranged output transducers (e.g., transducers in Figures 18A-18D , for example. Each of the two output transducers can output an electrical output. According to the phase adjustment operation described above, the phase of one electrical output can be inverted, while the phase of the other electrical output can remain unchanged, which can be referred to as a Positive-Negative-Negative-Positive (PNNP) processing mode. Additionally or alternatively, a damping layer can be added to each independently arranged transducer (e.g., transducers in Figure 20D , to reduce the Q value of each transducer.

[0163] In some embodiments, one or more additional transducers that do not output electrical signals and / or one or more elastic elements can also be connected to the at least one independently arranged transducer (e.g., transducers in Figure 20C , to increase the resonance peak of the microphone. In the case where the resonance frequencies provided by the independently arranged transducers do not cross each other, the phase of one electrical output can be inverted, while the phase of the other electrical output can remain unchanged. As described herein, the resonance frequencies provided by the independently arranged transducers do not cross each other means that the maximum resonance frequency provided by one of the independently arranged transducers and the transducers connected thereto is less than the minimum resonance frequency provided by the other independently arranged transducer and the transducers connected thereto. In this way, by adjusting the phases of different electrical outputs from different output transducers, an undesirable reduction in signal strength of the electrical signal due to cancellation of the two or more electrical outputs when fused can be avoided. In some embodiments, the two or more electrical outputs can be the outputs of adjacent transducers in the at least two transducers 1420 arranged in descending or ascending order according to the resonance frequencies.

[0164] In some embodiments, when the at least two output transducers 1420 are connected to each other through one or more damping layers (e.g., transducers in Figures 20A-20B each of the electrical outputs generated from each of the at least two transducers can have the same number of resonance peaks (e.g., at least two resonance peaks for each transducer). The processing circuit 1450 can obtain an electrical signal representing the sound signal by directly superimposing the electrical outputs of the at least two transducers without inverting the phase of either of the two electrical outputs, which can be referred to as a positive-negative-positive (PNP) processing mode. More description of processing electrical signals can be found elsewhere in this application (e.g., Figures 15A-15C and 16A-16B and their descriptions).

[0165] It should be noted that the above description of the microphone 1400 is merely for illustrative purposes and is not intended to limit the scope of the present application. Various changes and modifications can be made to the microphone 1400 according to the description of the present application by those of ordinary skill in the art. However, these changes and modifications do not depart from the scope of the present application. For example, one or more of the at least two transducers 1420 can be connected to one or more elastic elements.

[0166] Figure 15A is a schematic diagram of the vibration states of the transducers of a microphone operating at a first frequency lower than the first-order resonance frequency of the microphone according to some embodiments of the present application. Figure 15B is a schematic diagram of the vibration states of the transducers of a microphone operating at a second frequency greater than the first-order resonance frequency of the microphone and less than the second-order resonance frequency of the microphone according to some embodiments of the present application. For illustrative purposes, a bone conduction microphone is taken as an example to illustrate the vibration states of different transducers. As shown in Figure 15A and 15B The arrow A represents the vibration direction of the microphone housing (e.g., the microphone 1400). The transducers 1521, 1522, 1523, etc. can each be independently fixed on the housing. For convenience, the transducers 1521, 1522, 1523, etc. can be ordered in ascending order according to their resonance frequencies. That is, the transducer 1521 can have the smallest resonance frequency, the transducer 1522 can have the second smallest resonance frequency, and so on. For brevity, the resonance frequency of the transducer 1521 can also be referred to as the first-order resonance frequency of the microphone, the resonance frequency of the transducer 1522 can also be referred to as the second-order resonance frequency of the microphone, and so on.

[0167] Each transducer (e.g., transducers 1521, 1522, or 1523) can receive a sound signal from the housing 1510 and vibrate to generate an electrical output. Generally, the phase of the electrical output of a particular transducer can be related to the vibration state of the particular transducer. For example, different vibration directions of a particular transducer can result in different phases of the electrical output generated by the particular transducer, relative to the vibration direction of the housing. For another example, different vibration displacements (or degrees of deformation) of a particular transducer can result in different intensities of the electrical output generated by the particular transducer.

[0168] To understand the relationship between the vibration state and the electrical output of a particular transducer, the vibration direction of the housing 1510 can be used as a reference. Specifically, if the vibration direction of a particular transducer is the same as the vibration direction of the housing 1510, the phase of the electrical output of the particular transducer (denoted as ) can be considered as . If the vibration direction of a particular transducer is opposite to the vibration direction of the housing 1510, the phase of the electrical output of the particular transducer can be .

[0169] As shown in Figure 15A , when the microphone operates at a first frequency that is lower than the first-order resonance frequency of the microphone, the vibration direction of each transducer can be the same as the vibration direction of the housing 1510 (i.e., the deformation direction of each transducer is also in the direction indicated by the arrow A shown in Figure 15A ). In this case, the electrical output of each transducer can have the same phase, which can be denoted as . However, as shown in Figure 15B , when the microphone operates at a second frequency that is greater than the first-order resonance frequency of the microphone and less than the second-order resonance frequency of the microphone, the vibration direction of the transducer 1521 can be opposite to the vibration direction of the housing 1510, and the vibration direction of each of the remaining transducers (e.g., transducers 1522, 1523, etc.) can be the same as the vibration direction of the housing 1510. In this case, the electrical output of the transducer 1521 can be opposite to the phase of the remaining transducers. That is, the phase of the electrical output of the transducer 1521 can be denoted as , and the phase of the electrical output of each of the remaining transducers can be denoted as .

[0170] For ease of illustration, the electrical outputs of the transducers 1521 and 1522 will be taken as examples. The superposition of the electrical output of the transducer 1521 (simply referred to as “first electrical output”) and the electrical output of the transducer 1522 (simply referred to as “second electrical output”) can be determined according to the following equations (6-8):

[0171] , (6)

[0172] , (7)

[0173] , (8)

[0174] wherein denotes a first electrical output, denotes a second electrical output, denotes a first amplitude of the first electrical output, denotes a second amplitude of the second electrical output, denotes a first phase of the first electrical output, denotes a second phase of the second electrical output, and denotes an amplitude of a total signal of the first electrical output and the second electrical output.

[0175] When the microphone operates at the first frequency, the first phase can be the same as the second phase, i.e. Thus, When the microphone operates at the second frequency, the first phase can be opposite to the second phase, i.e. and Thus If the first electrical output of the transducer 1521 and the second electrical output of the transducer 1522 are directly superimposed (i.e., using a PNP processing mode), the total frequency response curve of the microphone can form a deep valley between the resonance peaks of the transducers 1521 and 1522 (i.e., the total signal of the first electrical output and the second electrical output at the valley point can be smaller than one of the first electrical output and the second electrical output), making the total frequency response curve of the microphone more uneven, e.g., as shown in Figure 15C .

[0176] Figure 15C is a schematic diagram of exemplary curves of a relationship between an electrical output of a transducer and a frequency, exemplary curves of a relationship between a modulus of the electrical output and the frequency, and exemplary curves of a relationship between a total signal of the electrical output and the frequency according to some embodiments of the present application. As shown in Figure 15C , each of the lines 1501 and 1502 represents a curve of a relationship between an electrical output of a transducer and a frequency. Each of the lines 1503 and 1504 represents a curve of a relationship between a modulus of the electrical output and the frequency, which can also be referred to as a frequency response curve of the transducer. The line 1505 represents a curve of a relationship between a total signal of the electrical outputs of two transducers and the frequency, which can also be referred to as a total frequency response curve of a microphone comprising the two transducers. The two transducers of the microphone are not connected to each other by any damping layer. The total frequency response curve can be obtained by directly superimposing the electrical outputs (i.e., using a PNP processing mode). According to Figure 15CAs shown, the phase of the electrical output of the transducer can change 180° as the vibration frequency moves from a frequency below a certain transducer resonance frequency to a frequency above the resonance frequency (see line 1501 and line 1502). Each of the two transducers can provide a unique resonance peak for the overall frequency response curve. Due to the deep valley between the two resonance frequencies of the two transducers, the sensitivity of the microphone between the resonance peaks of the two transducers (represented by line 1505) can be lower than the sensitivity of either of the two transducers (represented by line 1503 or line 1504). Therefore, by simply directly superimposing the electrical outputs of the at least two transducers, a relatively deep valley can be formed between any two adjacent resonance frequencies of the microphone with the at least two transducers, resulting in an uneven frequency response curve of the microphone, which severely affects the performance of the microphone.

[0177] Figure 15D is a schematic diagram of exemplary displacement curves of three transducers, an exemplary frequency response curve of a transducer connected with the other two transducers, and an overall frequency response curve of a microphone comprising the three transducers according to some embodiments of the present application. As shown, lines 1411, 1412, and 1413 represent the displacement curves of the three transducers (e.g., a first transducer, a second transducer, and a third transducer), respectively. Line 1414 represents the frequency response curve of a transducer when the transducer is connected to the other two transducers. Line 1415 represents the overall frequency response curve of a microphone comprising the three transducers. The three transducers of the microphone can be physically connected to each other by at least one damping layer. Each transducer herein can be used as an output transducer to output an electrical output to a processing circuit. Due to the presence of the damping layer, each transducer can transfer vibrations to the other transducers, thereby providing resonance peaks for the other transducers. In this way, each transducer can output an electrical output with three resonance peaks (e.g., represented by line 1414), each corresponding to one of the three transducers (e.g., represented by line 1411, 1412, or 1413). The processing circuit can process the electrical outputs of the three transducers using a PNP processing mode to obtain an overall signal corresponding to the overall frequency response curve of the microphone (i.e., line 1415). However, due to the phase of the electrical outputs, a relatively deep valley can be formed between any two adjacent resonance frequencies of the microphone, as shown in Figure 15D . Therefore, in order to obtain a relatively flat overall frequency response curve, the complex damping of each of the three transducers can be adjusted by one or more additional damping layers so that the Q value of each transducer can be significantly reduced. As a result, the sensitivity of the microphone can be improved so that the overall frequency response curve of the microphone can be flatter. Figures 15A to 15C

[0178] Figure 15E ​is a diagram of exemplary displacement curves of two transducers or an elastic element according to some embodiments of the present application, an exemplary frequency response curve of a transducer connected to another transducer and an elastic element, and a total frequency response curve of a microphone including two transducers and an elastic element. As shown, Figure 15E lines 1561, 1562, and 1563 represent displacement curves of two transducers (e.g., a first transducer and a second transducer) and an elastic element, respectively. Line 1564 represents a frequency response curve of a certain transducer when the transducer is connected to another transducer and an elastic element. Line 1565 represents a total frequency response curve of a microphone including two transducers and an elastic element. The two transducers and the elastic element of the microphone can be physically connected to each other by at least one damping layer. Each transducer herein can be used as an output transducer to output an electrical output to a processing circuit. Due to the presence of the damping layer, each transducer and the elastic element can transfer vibrations to the other transducers (i.e., output transducers), thereby providing the output transducers with resonance peaks. In this way, each output transducer can output an electrical output having three resonance peaks (e.g., represented by line 1564), each corresponding to one of the two transducers and the elastic element (e.g., represented by line 1561, 1562, or 1563). Therefore, by directly superimposing the electrical outputs through the processing circuit (i.e., using a PNP processing mode), the sensitivity of the total frequency response curve (i.e., line 1565) can be improved.

[0179] In some embodiments, to make the valleys between any two adjacent resonance frequencies of the microphone shallower, one or more damping layers can be added to each transducer and / or the elastic element to adjust its complex damping. The one or more damping layers can lower the Q value of each transducer and / or the elastic element, thereby resulting in a flatter total frequency response curve. In some alternative embodiments, the complex damping of each transducer and / or the elastic element can be adjusted by the one or more damping layers to make the Q value of each transducer and / or the elastic element relatively high, and therefore, the resonance peaks of the microphone can be sharp. In addition, the resonance frequencies of the microphone can be designed according to actual needs to provide appropriate frequency intervals between two adjacent resonance frequencies of the microphone. In combination Figure 15F with the description of the total signal corresponding to the total frequency response curve being further processed by the processing circuit to improve the performance of the microphone.

[0180] Figure 15F is a diagram of exemplary frequency response curves of a plurality of transducers connected to each other by one or more damping layers and a total frequency response curve of a microphone including the plurality of transducers according to some embodiments of the present application. As shown, Figure 15FAs shown, each of the lines 1571, 1572, 1573, and 1574 represents a frequency response curve of a single transducer (i.e., an output transducer) when connected to one or more other transducers. The line 1575 represents a total frequency response curve of the microphone (including multiple transducers). The multiple transducers of the microphone can be connected to each other through one or more damping layers. Each of the multiple transducers herein can be used as an output transducer to output an electrical output to the processing circuit. The total frequency response curve of the microphone can be obtained by directly superimposing the electrical outputs of the multiple transducers (i.e., using a PNP processing mode). According to some embodiments of the present application, the processing circuit can be configured to process the electrical outputs of the multiple transducers according to a PNP processing mode. In some embodiments, the processing circuit can be configured to process the electrical outputs of the multiple transducers according to a PNP processing mode, and the PNP processing mode can be a PNP processing mode as described above. Figure 15F As can be seen, the lines 1571, 1572, 1573, 1574, and 1575 have the same number of resonance peaks. Each resonance peak can correspond to a transducer. In some embodiments, the complex damping of each of the multiple transducers can be adjusted by one or more additional damping layers, so that the Q value of each of the multiple transducers is relatively high, and thus, the resonance peaks of the microphone can be relatively sharp. In addition, the resonance frequencies of the multiple transducers can be designed as needed to provide appropriate frequency intervals between two adjacent resonance frequencies of the microphone. For example, if the sound to be collected is mainly in a specific frequency band of 500 Hz to 3000 Hz, more transducers having resonance frequencies in the specific frequency band can be provided accordingly, i.e., the frequency interval between two adjacent resonance frequencies in the specific frequency band is relatively small. In this case, the total signal corresponding to the total frequency response curve (i.e., the line 1575) can be further processed by the processing circuit to improve the performance of the microphone. For example, the processing circuit can generate sub-band signals based on the total signal according to one or more bandpass filters, and perform one or more operations (e.g., amplification, modulation, etc.) on the sub-band signals for further processing, so as to improve the sensitivity of the microphone.

[0181] Figure 16A is a schematic diagram of an exemplary process for processing at least two electrical outputs of at least two transducers of a microphone according to some embodiments of the present application. As shown, the transducers 1620-1, 1620-2, 1620-3, …, 1620-n can be sorted in ascending order according to their resonance frequencies. Each transducer can output an electrical output. The processing circuit (e.g., the processing circuit 1450) can selectively invert the phase of a portion of the electrical outputs (e.g., the electrical output of the transducer 1620-2) and maintain the phase of another portion of the electrical outputs (e.g., the electrical outputs of the transducers 1620-1 and / or 1620-3). Figure 16A

[0182] In particular, as shown, a pair of symbols Figure 16A and are marked around each transducer ​The arrangement of the signs can indicate a processing mode for the corresponding electrical outputs, i.e., to maintain or invert the phase of the transducer electrical outputs. For example, the arrangement of the signs marked around transducer 1620-2 is opposite to the arrangement of transducer 1620-1, that is, the electrical output processing mode of transducer 1620-1 can be different from the electrical output processing mode of transducer 1620-2. In other words, if the processing circuitry maintains the phase of the electrical output of transducer 1620-1 unchanged, it can invert the phase of the electrical output of transducer 1620-2. If the processing circuitry maintains the phase of the electrical output of transducer 1620-2 unchanged, it can invert the phase of the electrical output of transducer 1620-1. As described elsewhere in this application, the processing mode of maintaining the phase of part of the electrical outputs unchanged and inverting the phase of part of the other electrical outputs can be referred to as a positive-negative-negative-positive (PNNP) processing mode. In some embodiments, the processing circuitry can invert the phase of the electrical outputs of the transducers arranged in odd positions and maintain the phase of the electrical outputs of the transducers arranged in even positions. The transducers can be arranged in ascending / descending order according to their resonance frequencies. In some embodiments, the processing circuitry can invert any one electrical output (e.g., the electrical output with the largest resonance frequency) and maintain any one other electrical output (e.g., the electrical output with the smallest resonance frequency).

[0183] For ease of illustration, the electrical outputs of transducers 1620-1 and 1620-2 can be used as examples. When the processing circuitry processes the first electrical output of transducer 1620-1 and the second electrical output of transducer 1620-2 using the PNNP processing mode, i.e., the processing circuitry can maintain the phase of the first electrical output and invert the phase of the second electrical output. Specifically, in this case, when the microphone operates at a first frequency less than the first-order resonance frequency of the microphone, the first phase can be represented as and the opposite second phase can be represented as Thus, according to equations (6-8), When the microphone operates at a second frequency greater than the first-order resonance frequency and less than the second-order resonance frequency of the microphone, the first phase can be the same as the inverted second phase, i.e., Thus, It should be noted that the sensitivity of each of transducers 1620-1 and 1620-2 in the frequency band before the first-order resonance frequency can be relatively low compared to the sensitivity at the first-order resonance frequency. When the frequency approaches the first-order resonance frequency, the decisive component of the total signal is Thus, can still be large. After the first-order resonance frequency, the first phase changes to Thus, As a result, when the first electrical output and the second electrical output after being processed using the PNNP processing mode are superimposed, the total frequency response of the microphone can have a shallow valley between the resonance frequencies of the transducers 1620-1 and 1620-2 (i.e., the total signal of the first electrical output and the second electrical output at the valley point can be stronger than either of the first electrical output and the second electrical output), making the total frequency response curve of the microphone more uniform (e.g., as shown in Figure 16B ).

[0184] Figure 16B is a diagram of exemplary curves of the relationship between electrical output and frequency of a transducer, exemplary curves of the relationship between the modulus of electrical output and frequency, and exemplary curves of the relationship between the total signal of electrical output and frequency, according to some embodiments of the present application. As shown in Figure 16B , each of the lines 1601 and 1602 represents a curve of the relationship between electrical output and frequency of a transducer. Each of the line 1603 and the line 1604 represents a curve of the relationship between the modulus of electrical output and frequency, which can also be referred to as a frequency response curve of a transducer. The line 1605 represents a curve of the relationship between the total signal of electrical output of two transducers, which can also be referred to as a total frequency response curve of a microphone comprising the two transducers. The two transducers of the microphone are not connected to each other by any damping layer. The total frequency response curve can be obtained using the PNNP processing mode as described in Figure 14 and 16A . As can be known from Figure 16B , the phase of the electrical output of a transducer can change by 180° when the vibration frequency moves from a frequency below the resonance frequency of the transducer to a frequency above the resonance frequency (see the line 1601 and the line 1602). Each of the two transducers can provide a unique resonance peak for the total frequency response curve. Since the PNNP processing mode causes a shallow valley between the two resonance frequencies of the two transducers, the sensitivity of the microphone between the resonance peaks of the two transducers (represented by the line 1605) can be higher than the sensitivity of either of the two transducers (represented by the line 1603 or the line 1604). Therefore, by superimposing the electrical outputs of at least two transducers using the PNNP processing mode, the sensitivity of a microphone comprising the at least two transducers can be improved. For example, by properly setting the resonance frequencies of the at least two transducers, the total signal between the two adjacent resonance frequencies can approach the total signal at one of the adjacent resonance frequencies, making the total frequency response of the microphone extremely sensitive and the frequency response curve flat.

[0185] Figure 17A is a diagram of exemplary frequency response curves of multiple transducers, and a total frequency response curve of a microphone comprising the multiple transducers, according to some embodiments of the present application. As shown in Figure 17AAs shown, lines 1701, 1702, 1703, 1704, 1705, and 1706 represent the frequency response curves of multiple transducers, respectively. Line 1707 represents the overall frequency response curve of the microphone (comprising multiple transducers). The multiple transducers of the microphone are not connected to each other through any damping layer. The overall frequency response curve can be described elsewhere in this application (e.g., Figure 16A The PNNP processing mode (and its description) is obtained. Figure 17A It is known that each of the multiple transducers can provide a unique resonance peak to the total frequency response curve. The sensitivity of the microphone (represented by line 1707) can be higher than that of any one of the multiple transducers (represented by lines 1701, 1702, 1703, 1704, 1705, or 1706). The valley between any two adjacent resonant frequencies of the microphone caused by the PNNP processing mode can be very shallow. In other words, the total frequency response curve can be relatively flat. In some embodiments, a damping layer can be added to at least one of the multiple transducers to reduce the Q value of the respective transducer. Therefore, the total frequency response curve of the microphone can be flatter (e.g., see...). Figure 17B ).

[0186] Figure 17B These are schematic diagrams of exemplary frequency response curves of multiple transducers with damping layers according to some embodiments of this application, and the overall frequency response curve of a microphone including multiple transducers with damping layers. Figure 17B As shown, lines 1711, 1712, 1713, 1714, 1715, and 1716 represent the frequency response curves of multiple transducers with damping layers, respectively. Line 1717 represents the overall frequency response curve of a microphone including multiple transducers with damping layers. Multiple transducers may be connected to each other without any damping layers. Each of the multiple transducers in the microphone may be connected to one or more damping layers. The one or more damping layers can adjust the combined damping of each transducer to reduce the Q value of each transducer. The overall frequency response curve can be described elsewhere in this application (e.g., Figure 16A The PNNP processing mode (and its description) is obtained. The valley between any two adjacent resonant frequencies of the microphone caused by the PNNP processing mode can be very shallow. Therefore, the flatness of the overall frequency response curve can be adjusted by independently adjusting the composite damping of each of the multiple transducers.

[0187] Figure 17C These are schematic diagrams of exemplary frequency response curves of a first and second transducer, exemplary displacement curves of a first and second elastic element, and the overall frequency response curve of a microphone including two transducers and two elastic elements, according to some embodiments of this application. Figure 17CAs shown, lines 1751 and 1753 represent the frequency response curves of the first and second transducers, respectively. Lines 1752 and 1754 represent the displacement curves of the first and second elastic elements, respectively. Line 1755 represents the overall frequency response curve of the microphone containing the two transducers and two elastic elements. The first and second transducers can be independently arranged in the microphone. The first elastic element can be connected to the first transducer through a damping layer, and the second elastic element can be connected to the second transducer through a damping layer. Each elastic element can transfer vibrations to the corresponding transducer, thereby providing a unique resonance peak to the corresponding transducer. In this way, each transducer can output an electrical output having two resonance peaks. Since the resonance frequencies of the electrical outputs of the transducers do not cross each other, the sensitivity of the overall frequency response curve can be improved by using the PNNP processing mode described elsewhere in this application (e.g., the PNNP processing mode described by Figure 16A and its description). In some embodiments, the complex damping of the transducers and / or elastic elements can be adjusted by the damping layer (e.g., the damping layer connecting the transducer and the corresponding elastic element or one or more additional damping layers). The damping layer can lower the Q value of each transducer and / or each elastic element. As a result, the deep valley between the two adjacent resonance frequencies of the electrical outputs of the first and second transducers as described by Figures 18A may be avoided. In other words, the overall frequency response curve can be relatively flat.

[0188] Figure 18A is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 18B the microphone 1400 can include a housing 1410 and three cantilever beam transducers 1420. One end of each of the three cantilever beam transducers 1420 can be connected to the housing 1410. Each cantilever beam transducer can vibrate in response to a sound signal and output an electrical output to a processing circuit 1450. The processing circuit can process the electrical outputs using a PNNP processing mode. In this case, each cantilever beam transducer can provide a unique resonance peak to the microphone 1400. In other words, the frequency response curve of the microphone 1400 can include three resonance peaks, each corresponding to one cantilever beam transducer.

[0189] Figure 18B is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 18AAs shown, the microphone 1400 can include a housing 1410 and three transducers 1420. Each transducer can vibrate in response to a sound signal. For example, in the case of a bone conduction microphone, each of the three transducers 1420 can be directly connected to the housing and vibrate with the housing 1410. In the case of an air microphone, the housing 1410 can include one or more openings that allow air-borne sound to enter, and each of the three transducers 1420 can vibrate in response to air vibrations within the housing 1410. As with Figure 18C each transducer can output an electrical output to the processing circuitry, and the processing circuitry can process the electrical outputs using a PNNP processing mode such that the frequency response curve of the microphone 1400 has resonance peaks corresponding to the three transducers.

[0190] Figure 18C is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 18B the microphone 1400 can include a housing 1410 and three transducers 1420. The housing 1410 can include three accommodation spaces, each of which can accommodate a transducer. Similar to Figure 18D each transducer can output an electrical output in response to a sound signal and transmit the electrical output to the processing circuitry. The processing circuitry can process the electrical outputs using a PNNP processing mode such that the frequency response curve of the microphone 1400 has resonance peaks corresponding to the three transducers.

[0191] Figure 18D is a structural schematic diagram of an exemplary microphone according to some embodiments of the present application. As shown, Figure 19 the microphone 1400 can include a housing 1410 having three accommodation spaces and six transducers 1420 respectively connected to the housing 1410. Each of the three accommodation spaces can correspond to two of the six transducers 1420. Each of the six transducers 1420 can be fixed on the housing 1410 by two ends of each transducer 1420.

[0192] Figure 19 is a schematic diagram of exemplary frequency response curves of different transducers according to some embodiments of the present application. As shown, Figure 16A the lines 1901, 1902, and 1903 represent the frequency response curves of transducer 1, transducer 2, and transducer 3, respectively. The line 1904 represents the total frequency response curve of a microphone containing transducer 1, transducer 2, and transducer 3. The transducer 1, transducer 2, and transducer 3 of the microphone are not connected to each other by any damping layer. Each transducer herein can act as an output transducer and output an electrical output to the processing circuitry. The processing circuitry can process the electrical outputs using a PNNP processing mode such that the frequency response curve of the microphone has resonance peaks corresponding to the three transducers, as with Figure 19The PNP processing mode processes the electrical outputs to generate an overall signal. As such, an overall frequency response curve corresponding to the overall signal can have a resonance peak corresponding to the transducer. According to Figure 20A It can be appreciated that each transducer can provide a unique resonance peak to the overall frequency response curve. The sensitivity of the microphone (indicated by line 1904) can be higher than the sensitivity of any one transducer (indicated by lines 1901, 1902, or 1903). The overall frequency response curve can be flatter than each frequency response curve of the transducers.

[0193] Figure 20A is a structural schematic of an exemplary microphone according to some embodiments of the present application. As shown, Figure 8 the microphone 1400 can include a housing 1410, two cantilever beam transducers 1420 connected with the housing 1410 respectively, and a damping layer 1430 connected with each of the two cantilever beam transducers 1420 but not connected with the housing 1410. With Figure 20B Similarly, the two cantilever beam transducers 1420 can be arranged on opposite sides of the damping layer 1430. The damping layer 1430 can cover an upper surface of one of the two cantilever beam transducers 1420 and a lower surface of the other of the two cantilever beam transducers 1420. One end (also referred to as a "fixed end") of each of the two cantilever beam transducers 1420 can be fixed on the housing 1410. In this case, each cantilever beam transducer can vibrate in response to vibrations of the housing 1410 (through the fixed end) and the other cantilever beam transducer (through the damping layer), so that each cantilever beam transducer 1420 generates an electrical output having two resonance peaks. The sensitivity of a frequency response curve corresponding to an overall signal of the two electrical outputs can be improved by directly superimposing the two electrical outputs (i.e., using a PNP processing mode). In addition, the damping layer 130 can help reduce the Q value of the output transducer, so that the frequency response of the microphone is flatter.

[0194] Figure 20B is a structural schematic of an exemplary microphone according to some embodiments of the present application. As shown, Figure 12C the microphone 1400 can include a housing 1410, two cantilever beam transducers 1420, two damping layers 1430, and an elastic element 1440. With Figure 20CSimilarly, two cantilever beam transducers 1420, an elastic element 1440, and two damping layers 1430 can form a sandwich structure. The elastic element 1440 can vibrate in response to, for example, air vibrations within the housing 1410, transmitting its vibrations to the damping layer 1430 and further to the two transducers 1420. Each transducer in this document can serve as an output transducer, and the vibrations of the elastic element 1440 and the other of the two transducers 1420 can provide two distinct resonance peaks to the output transducer. Therefore, the output transducer can output an electrical output with three resonant frequencies. The sensitivity of the frequency response curve corresponding to the total signal of the two electrical outputs can be improved by directly superimposing the two electrical outputs (i.e., using a PNP processing mode). Furthermore, the damping layer 130 helps to reduce the Q value of the output transducer, thereby flattening the microphone's frequency response.

[0195] Figure 20C This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 20C As shown, the microphone 1400 may include a housing 1410, two cantilever beam transducers 1420, two damping layers 1430, and two elastic elements 1440. Each of the two cantilever beam transducers 1420 and the two elastic elements 1440 may be connected to the housing 1410. Each of the two cantilever beam transducers 1420 may be connected to one of the two elastic elements 1440. Figure 20D As shown, each of the two cantilever beam transducers 1420, along with its corresponding elastic element 1440 and damping layer 1430, can form a sandwich structure. The elastic element can provide a unique resonant peak for its corresponding cantilever beam transducer. Therefore, each cantilever beam transducer can output an electrical output with two resonant frequencies. If the resonant frequencies of the electrical outputs of the two cantilever beam transducers 1420 do not intersect, the sensitivity of the frequency response curve corresponding to the total signal of the two electrical outputs can be improved by using a PNNP processing mode. Alternatively, if the resonant frequencies of the electrical outputs of the two cantilever beam transducers 1420 intersect, the sensitivity of the frequency response curve corresponding to the total signal of the two electrical outputs can be improved by directly superimposing the two electrical outputs without reversing the phase of any of the electrical outputs. Additionally, the damping layer 130 can help reduce the Q value of the output transducer, thereby distorting the frequency response of the microphone.

[0196] Figure 20D This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figure 20EAs shown, the microphone 1400 may include a housing 1410, two cantilever beam transducers 1420, and two damping layers 1430. Each of the two cantilever beam transducers 1420 may be connected to the housing 1410. Each of the two cantilever beam transducers 1420 may be connected to one of the two damping layers 1430. Each damping layer may adjust the composite damping of the corresponding cantilever beam transducer to reduce the Q value of the corresponding cantilever beam transducer. Therefore, after processing using the PNNP processing mode, the frequency response curve of the total signal corresponding to the two electrical outputs of the two cantilever beam transducers may be flatter.

[0197] Figure 20E This is a schematic diagram of the structure of an exemplary microphone according to some embodiments of this application. For example... Figures 6A-6C As shown, microphone 1400 may include a housing 1410, two cantilever beam transducers 1420 (e.g., a first transducer and a second transducer), an elastic element 1440, and four damping layers 1430. Each of the two cantilever beam transducers 1420 and the elastic element 1440 may be connected to the housing 1410, respectively. One of the two cantilever beam transducers 1420 (e.g., the first transducer) may be connected to the elastic element 1440 via a damping layer (e.g., a first damping layer). The elastic element 1440 may vibrate in response to, for example, air vibrations within the housing 1410, to transmit its vibrations to the first damping layer and further to the first transducer. The vibration of the elastic element 1440 may provide a unique resonance peak to the first transducer. Each transducer herein may serve as an output transducer. Thus, the first transducer may output a first electrical output having two resonant frequencies, and the second transducer may output a second electrical output having one resonant frequency. Furthermore, the four damping layers can adjust the composite damping of the corresponding cantilever beam transducer and elastic element 1440 to reduce the Q value of the corresponding cantilever beam transducer and elastic element 1440. Therefore, when the resonant frequencies of the electrical outputs of the two cantilever beam transducers 1420 do not intersect, the sensitivity of the frequency response curve of the total signal corresponding to the two electrical outputs of the two cantilever beam transducers can be improved after processing using the PNNP processing mode.

[0198] It should be noted that the example microphone 1400 described in this application is for illustrative purposes only and is not intended to limit the scope of the present application. Various changes and modifications can be made to the example microphone 1400 according to the description of the present application by those of ordinary skill in the art. However, these changes and modifications do not depart from the scope of the present application. For example, the housing 1410 of the microphone 1400 can include one or more openings for directing sound signals into the housing 1410 to cause any transducers in the housing 1410 to vibrate to output an electrical output (e.g., when the microphone 1400 is an air conduction microphone). In this case, the diaphragm above can be replaced with a diaphragm that is more sensitive to air vibrations. As another example, the microphone 1400 can include the same structure as the microphone 100 (e.g., the structure shown in Figs. 7A-7C, 8, 9A-9C, 10A-10D, 12A-12D, etc.). Each transducer included in the microphone 1400 can output an electrical output. As a further example, the different transducers can be of different types. The transducers in the microphone 1400 can include bone conduction transducers, air conduction transducers, or a combination thereof. As yet another example, the different damping layers can be made of the same or different materials. Each damping layer can be optionally connected to the housing or not connected to the housing. The number of damping layers, transducers, and / or elastic elements can not be limited, and the position of the damping layers relative to the transducers and / or elastic elements can be adjusted as desired. ​

[0199] The foregoing description has been described with regard to the basic concepts. It is clear to those of ordinary skill in the art after reading this application that the above-described disclosure of the application is only as an example and does not constitute a limitation on the present application. Although it is not explicitly stated here, those of ordinary skill in the art can make various modifications, improvements and corrections to the present application. Such modifications, improvements and corrections are suggested in the present application, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present application.

[0200] Meanwhile, specific words are used in the present application to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and understood that two or more references to "embodiments", "one embodiment" or "alternative embodiments" in various portions of the specification are not necessarily all referring to the same embodiment. In addition, a particular feature, structure or characteristic can be incorporated in one or more embodiments of the present application.

[0201] ​Moreover, as will be appreciated by persons skilled in the art, the present aspects can be embodied in a variety of other forms; all of which have been contemplated to be within the scope of the present disclosure. In addition, the various aspects of the present disclosure may

[0202] Computer readable signal media can include a propagated data signal with computer program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal can take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. Computer readable signal media can be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate or transport program code there within for implementation by or to estimate an instruction execution system, apparatus, or device. Program code embodied on a computer readable signal medium can be transmitted using any appropriate medium, including but not limited to wireless, wire line, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0203] Computer program code for carrying out operations of aspects of the present disclosure can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, or conventional procedural programming languages, such as the "C" programming language, Visual Basic, Fortran 1703, Perl, COBOL 1702, PHP, ABAP, dynamic programming languages, such as Python, Ruby and Groovy, or other programming languages. The program code can execute entirely on the user's computer, or partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, through the Internet using an Internet Service Provider) or in a cloud computing environment or offered as a service such as a software as a service (SaaS).

[0204] Furthermore, the order of the processing elements and sequences described in this application does not itself reflect an limitation on the scope of the process and method aspects of the application, except where expressly stated to the contrary. Although the above discussion discloses various exemplary embodiments of the application, it should be apparent that those skilled in the art will be able to devise various arrangements that, although perhaps not explicitly set forth or described herein, embody the principles of the application. For example, although the implementation of various components described above can be embodied in hardware, it can also be embodied as software, e.g., installed on existing servers or mobile devices.

[0205] Similarly, it is to be noticed that the term "comprising", used in the description, should not be interpreted as being restricted to the means listed thereafter; it does not exclude other elements or steps. It is thus to be interpreted as specifying the presence of the stated features, integers, steps or components as referred to, but does not preclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. Moreover, it is understood that the word "a" or "an" as used herein when used in the context of "comprising a feature" does not exclude the presence of two or more such features. That is, it means "one or more".

[0206] In some embodiments, numbers expressing quantities or properties should be understood to include numerical values that are approximately the same as the stated values, unless otherwise indicated. For example, "about", "approximately", or "substantially" as used herein will be understood to refer to a value that is within ±20% of the stated value, unless otherwise indicated. Accordingly, in some embodiments, the numerical parameters included in the detailed description and claims are approximations that can vary depending upon the desired properties sought to be obtained by the embodiments. In some embodiments, the numerical parameters should be considered in the context of the other disclosure of this application. Although the numerical ranges and parameters setting forth the broadest scope of the embodiments of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values set forth in the specific examples are provided to be as precise as reasonably possible. However, some variations may occur depending on the implementation desired.

[0207] All patents, patent applications, publications, and other documents (e.g., papers, books, specifications, manuals, brochures, white papers, and / or the like) referred to in this document are hereby incorporated by reference in their entirety for all purposes to the same extent as if each individual document was specifically and individually indicated to be incorporated by reference in its entirety for all purposes. Any document submitted individually or with a claim priority document after the filing date of this document in the examination of an application for patent herewith can be designated as cumulative information in the Amendment and / or the Specification. For example, there can be an inconsistency or conflict between the description, definitions and / or usage of a term associated with any incorporated material and a term associated with this document, and the description, definitions and / or usage of the term in this document shall control.

[0208] Finally, it should be understood that the embodiments described herein are merely exemplary of the principles of the application. Other embodiments can fall within the scope of the application. Therefore, as piainly seen, the embodiments of the present application lend themselves to alternative configurations that are consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to that precisely as shown and described.

Claims

1. A microphone, characterized by The microphone comprises: a housing for receiving a sound signal; at least two transducers for generating an electrical signal in response to vibration of the sound signal, each of the at least two transducers providing a unique formant to the microphone; and processing circuitry for processing the electrical signal; wherein the microphone further comprises at least one of three schemes: Scheme A, Scheme B, and Scheme C; Scheme A: the at least two transducers are arranged to be connected via at least one damping layer for vibration transmission among the at least two transducers through the damping layer; Scheme B: the electrical signal comprises all or part of electrical outputs of the at least two transducers, a part of the at least two transducers being output transducers outputting the electrical outputs, and another part of the at least two transducers transmitting vibration to the output transducers; Scheme C: the microphone further comprises at least one elastic element arranged to be connected to one of the at least two transducers via at least one damping layer.

2. The microphone of claim 1, wherein, The at least two transducers are arranged in the housing in a direction parallel to a vibration direction of the at least two transducers.

3. The microphone of claim 1, wherein, The at least two transducers are arranged in the housing in a direction perpendicular to a vibration direction of the at least two transducers.

4. The microphone according to any one of claims 1-3, characterized in that, The electrical signal is output from one of the at least two transducers, and the remaining transducers of the at least two transducers transmit vibration to the one of the at least two transducers.

5. The microphone of claim 4, wherein, The remaining transducers of the at least two transducers are physically connected to the one of the at least two transducers via at least one damping layer.

6. The microphone according to any one of claims 1-3, wherein, The electrical signal comprises at least two electrical outputs of the at least two transducers, wherein each of the at least two electrical outputs of the at least two transducers is output from one of the at least two transducers.

7. The microphone of claim 6, wherein, The at least two electrical outputs of the at least two transducers are processed via a positive-negative-negative-positive processing mode, wherein the positive-negative-negative-positive processing mode comprises: adjusting phases of the at least two electrical outputs; and fusing the adjusted at least two electrical outputs.

8. The microphone of claim 7, wherein, The adjusting of the at least two electrical outputs comprises: inverting a phase of one of the at least two electrical outputs, and keeping a phase of another of the at least two electrical outputs unchanged.

9. The microphone of claim 6, wherein, The at least two electrical outputs are from adjacent transducers of the at least two transducers arranged in descending or ascending order according to a formant frequency.

10. The microphone according to claim 5 or 7, characterized in that, The at least one damping layer covers at least part of at least one surface of a transducer connected thereto.

11. The microphone of claim 10, wherein, The at least one surface of the connected transducer comprises at least one of an upper surface, a lower surface, a side surface, or an inner surface.

12. The microphone of claim 10, wherein, The at least one damping layer is arranged at at least one of an upper surface of the connected transducer, a lower surface of the connected transducer, a side surface of the connected transducer, or an inner surface of the connected transducer.

13. The microphone of claim 10, wherein, The at least one damping layer is arranged on the at least one surface of the connected transducer at a predetermined angle.

14. The microphone of claim 13, wherein, The predetermined angle is 30°, 45°, 60°, or 90°.

15. The microphone of claim 10, wherein, The at least one damping layer is connected to the housing.

16. The microphone of claim 10, wherein, The at least one damping layer comprises at least two damping layers, and the at least two damping layers are symmetrically arranged relative to a center line of one of the at least two transducers.

17. The microphone of claim 1, wherein, The at least one elastic element and the at least two transducers are arranged in the housing in a direction parallel to a vibration direction of the at least two transducers.

18. The microphone of claim 1, wherein, The at least one elastic element and the at least two transducers are arranged in the housing in a direction perpendicular to a vibration direction of the at least two transducers.

19. The microphone of any one of claims 1, wherein, The at least one damping layer covers at least a portion of at least one surface of the at least one elastic element.

20. The microphone according to any one of claims 1-3, 5, 7-9, 11-19, characterized in that, The at least one damping layer has different widths.

21. The microphone according to any one of claims 1-3, 5, 7-9, 11-19, characterized in that, The at least one damping layer has different thicknesses.

22. The microphone according to any one of claims 1-3, 5, 7-9, 11-19, characterized in that, Each of the at least two transducers comprises at least one of a diaphragm, a piezoelectric ceramic sheet, a piezoelectric film, or an electrostatic film.

23. The microphone according to any one of claims 1-3, 5, 7-9, 11-19, characterized in that, A structure of each of the at least two transducers comprises at least one of a membrane, a cantilever beam, or a plate.

24. The microphone according to any one of claims 1-3, 5, 7-9, 11-19, characterized in that, The sound signal is caused by at least one of a gas, a liquid, or a solid.

25. The microphone according to any one of claims 1-3, 5, 7-9, 11-19, characterized in that, The sound signal is transmitted from the housing to the at least two transducers according to a non-contact mode or a contact mode.

26. An electronic device, comprising: The microphone comprises: a housing for receiving a sound signal; at least two transducers for generating an electrical signal in response to vibration of the sound signal, each of the at least two transducers providing a unique resonance peak to the microphone; and processing circuitry for processing the electrical signal; wherein the microphone further comprises at least one of three schemes: Scheme A, Scheme B, and Scheme C; Scheme A: the at least two transducers are arranged to be connected via at least one damping layer to transmit vibration among the at least two transducers through the damping layer; Scheme B: the electrical signal comprises all or part of electrical outputs of the at least two transducers, a portion of the at least two transducers being output transducers outputting the electrical outputs, and another portion transmitting vibration to the output transducers; Scheme C: the microphone further comprises at least one elastic element arranged to be connected to one of the at least two transducers via at least one damping layer.

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