The proximity-contact full-automatic exposure machine has a pre-aligning mechanism for trimming wafers

Abstract

The present invention provides a pre-aligning mechanism for a near-contact full-automatic exposure machine with trimmed wafers, including a wafer lifting assembly, a wafer rotating assembly, and a wafer centering assembly. In order to determine the wafer trimming in the present invention, a microscope is installed directly above the wafer edge. After achieving rough centering and vacuum adsorption, the wafer is lifted by a certain height. At this time, the microscope can clearly observe the appearance characteristics of the wafer edge. The rotating motor rotates to drive the bonding chuck and the wafer to rotate together. When the microscope observes the wafer trimming, the rotating motor stops rotating, the bonding chuck breaks the vacuum, and then two clamping cylinders move to clamp the wafer, precisely determining the position of the wafer trimming. Then, the vacuum of the bonding chuck is turned on to vacuum-adsorb the wafer, the clamping mechanism is opened, and the bonding chuck rises to the upper limit position, waiting for the robot to pick up the positioned wafer. The effect is remarkable. It can achieve precise positioning of wafer trimming, has stable performance, is inexpensive, easy to use, and has a wide range of applications.

Description

Technical Field

[0001] The present invention relates to the technical field of proximity contact full-automatic exposure machine equipment, and particularly to a pre-aligning mechanism for trimmed wafers of a proximity contact full-automatic exposure machine. Background Art

[0002] The proximity contact full-automatic exposure machine is one of the key equipment in semiconductor device manufacturing. The proximity contact full-automatic exposure machine transfers the wafers loaded in the cassette on the wafer loading table to the pre-aligning mechanism through the picking and placing of the manipulator fingers for rough positioning of the wafer positions; then transfers them to the alignment workbench through the picking and placing of the manipulator fingers for exposure after alignment, and the exposed wafers are then taken away by the manipulator fingers and transferred to the cassette; during the process from cassette to cassette, the higher the accuracy during wafer pre-alignment is required, the higher the efficiency of fine alignment on the alignment workbench will be; otherwise, if the accuracy during wafer pre-alignment is low, it will cause a high frequency of misalignment during fine alignment on the alignment workbench, and the alignment effect is completed through manual intervention, greatly reducing the production efficiency; at the same time, for imported pre-aligning mechanisms, in addition to being used, no more functions can be developed, and the selling price is relatively high.

[0003] Since the pre-aligning mechanism is one of the key components of the proximity contact full-automatic exposure machine, high accuracy in wafer pre-alignment will improve the efficiency of fine alignment and reflect the working efficiency of the full-automatic exposure machine; otherwise, the alignment efficiency is low, and it loses its market value; using imported pre-aligning mechanisms has a high cost. Therefore, a pre-aligning mechanism for trimmed wafers of a proximity contact full-automatic exposure machine is proposed. Summary of the Invention

[0004] In view of this, the embodiments of the present invention hope to provide a pre-aligning mechanism for trimmed wafers of a proximity contact full-automatic exposure machine to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiments of the present invention is realized as follows: A pre-aligning mechanism for trimmed wafers of a proximity contact full-automatic exposure machine includes a wafer lifting assembly, a wafer rotating assembly, a wafer centering assembly, a wafer clamping assembly, and a microscope. The wafer lifting assembly includes a lower bottom plate, a motor base, a lifting motor, a first toothed belt pulley, a toothed belt, a second toothed belt pulley, a lead screw support base, a lead screw, a guide rail bottom plate, a lead screw nut, a guide rail slider pair, a connecting block, and a lead screw support.

[0006] The upper surface of the lower base plate is provided with a square through hole, the inner side wall of the square through hole is attached to the outer side wall of the lifting motor, the lower surface of the lower base plate is mounted on the upper surface of the motor base, the inner bottom wall of the motor base is mounted on the lower surface of the lifting motor, the output shaft of the lifting motor penetrates through the inner bottom wall of the motor base and is mounted on the upper surface of the first toothed belt pulley, the outer side wall of the first toothed belt pulley is attached to the inner side wall of the toothed belt, the inner side wall of the toothed belt is attached to the outer side wall of the second toothed belt pulley, the outer side wall of the lead screw is rotatably connected to the inner side wall of the lead screw support seat through a bearing, the outer side wall of the lead screw support seat penetrates through the upper surface of the lower base plate, the bottom end of the lead screw is mounted on the upper surface of the second toothed belt pulley, the upper surface of the lower base plate is mounted on the lower surface of the guide rail base plate, the upper surface of the guide rail base plate is mounted on the lower surface of the lead screw support, the top end of the lead screw is rotatably connected to the lower surface of the lead screw support through a bearing, the inner side wall of the lead screw nut is threadedly connected to the outer side wall of the lead screw, and the outer side wall of the lead screw nut is mounted on the inner side wall of the connecting block;

[0007] The upper surface of the wafer lifting assembly is mounted with a wafer rotating assembly.

[0008] Further preferably, the wafer rotating assembly includes a vacuum joint, a connecting block, a rotating motor, a rotating motor bracket, and a tab suction cup;

[0009] The upper surface of the connecting block is mounted on the lower surface of the rotating motor bracket, the lower surface of the rotating motor bracket is mounted on the upper surface of the rotating motor, and the hollow output shaft of the rotating motor penetrates through and is mounted at one end of the vacuum joint.

[0010] Further preferably, the upper surface of the wafer rotating assembly is mounted with a wafer centering assembly, and the wafer centering assembly includes a supporting square plate, an upper cover plate, and a centering funnel;

[0011] Four supporting square plates are provided in total. The upper surface of the lower base plate is symmetrically mounted on the lower surfaces of the four supporting square plates. The upper surface of the supporting square plate is mounted on the lower surface of the upper cover plate, and the upper surface of the upper cover plate is mounted on the lower surface of the centering funnel.

[0012] Further preferably, the upper surface of the wafer rotating assembly is mounted with a wafer clamping assembly, and the wafer clamping assembly includes a connecting plate, a cylinder, a rear support plate, a mandrel, a positioning sleeve, a front support plate, a bearing body, and a cylinder base plate;

[0013] There are two cylinder bottom plates in total. The lower surfaces of the two cylinder bottom plates are mounted on the upper surface of the upper cover plate. The upper surface of the cylinder bottom plate is mounted on the lower surface of the cylinder. Two connecting plates are installed on the piston rod of the cylinder. One side of the two adjacent connecting plates is respectively mounted on the mutually repelling sides of the rear support plate and the front support plate. There are four mandrels in total. The upper surfaces of the rear support plate and the front support plate are symmetrically and movably mounted on the bottom ends of the two mandrels respectively. A bearing body is mounted on the outer side wall of the mandrel. The upper surface of the centering funnel is mounted on the lower surface of the positioning sleeve.

[0014] Further preferably, the guide rail of the guide rail slider pair is mounted on one side of the guide rail bottom plate, and the slider of the guide rail slider pair is slidably connected to one side of the connecting block.

[0015] Further preferably, the upper end of the output shaft of the rotary motor penetrates through the lower surface of the upper cover plate and is mounted on the bottom end of the pick-up chuck. A wafer is adsorbed on the upper surface of the pick-up chuck.

[0016] Further preferably, the lower surface of the microscope is mounted with a mounting platform, and the lower surface of the mounting platform is mounted with a fixed frame.

[0017] Further preferably, an upper limit sensor and a lower limit sensor are respectively mounted on the outer side wall of the guide rail bottom plate, and a sensor baffle is mounted on the outer side wall of the connecting block.

[0018] Due to the adoption of the above technical solutions in the embodiments of the present invention, it has the following advantages:

[0019] In order to determine the wafer edge trimming, the present invention installs a microscope directly above the wafer edge. After achieving rough centering and vacuum adsorption, it rises by a certain height. At this time, the microscope can clearly observe the appearance characteristics of the wafer edge. The rotary motor rotates to drive the pick-up chuck and the wafer to rotate together. When the microscope observes the wafer edge trimming, the rotary motor stops rotating, the pick-up chuck breaks the vacuum, and then two clamping cylinders move to clamp the wafer, precisely determining the position of the wafer edge trimming. Then, the vacuum of the pick-up chuck is turned on to vacuum-adsorb the wafer, the clamping mechanism is opened, and the pick-up chuck rises to the upper limit position, waiting for the manipulator to pick up the positioned wafer. The effect is remarkable, which can achieve precise positioning of the wafer edge trimming, with stable performance, low price, convenient use, and wide application range.

[0020] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments, and features, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description. Description of the Drawings

[0021] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 Structural diagram of the present invention;

[0023] Figure 2 Right view structural diagram of the present invention;

[0024] Figure 3 Side sectional structural diagram of the present invention;

[0025] Figure 4 Top view structural diagram of the present invention;

[0026] Figure 5 Internal structural diagram of the present invention;

[0027] Figure 6 For the present invention Figure 5 Enlarged structural diagram of area A of;

[0028] Figure 7 For the present invention Figure 5 Enlarged structural diagram of area B of.

[0029] Reference numerals: 1, lower bottom plate; 2, motor base; 3, lifting motor; 4, first toothed belt pulley; 5, toothed belt; 6, second toothed belt pulley; 7, lead screw support seat; 8, lead screw; 9, guide rail bottom plate; 10, vacuum joint; 11, lead screw nut; 12, guide rail slider pair; 13, connecting block; 14, rotating motor; 15, rotating motor bracket; 16, lead screw support; 17, supporting square plate; 18, upper cover plate; 19, connecting plate; 20, cylinder; 21, rear support plate; 22, mandrel; 23, positioning sleeve; 24, tab suction cup; 25, microscope; 26, wafer; 27, front support plate; 28, centering funnel; 29, upper limit sensor; 30, sensor baffle; 31, lower limit sensor; 32, bearing body; 33, cylinder bottom plate; 34, square through hole; 35, fixed frame; 36, installation platform; 40, wafer lifting assembly; 50, wafer rotating assembly; 60, wafer centering assembly; 70, wafer clamping assembly. Detailed implementation manners

[0030] In the following, only some exemplary embodiments are briefly described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0031] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] As Figures 1-7 shown, the embodiment of the present invention provides a pre - alignment mechanism for a close - contact full - automatic exposure machine with a trimmed wafer, including a wafer lifting assembly 40, a wafer rotating assembly 50, a wafer centering assembly 60, a wafer clamping assembly 70, and a microscope 25. The wafer lifting assembly 40 includes a lower base plate 1, a motor base 2, a lifting motor 3, a first toothed belt pulley 4, a toothed belt 5, a second toothed belt pulley 6, a lead screw support base 7, a lead screw 8, a guide rail base plate 9, a lead screw nut 11, a guide rail slider pair 12, a connecting block 13, and a lead screw support 16;

[0033] A square through - hole 34 is formed on the upper surface of the lower base plate 1. The inner side wall of the square through - hole 34 is attached to the outer side wall of the lifting motor 3. The lower surface of the lower base plate 1 is mounted on the upper surface of the motor base 2. The inner bottom wall of the motor base 2 is mounted on the lower surface of the lifting motor 3. The output shaft of the lifting motor 3 penetrates through the inner bottom wall of the motor base 2 and is mounted on the upper surface of the first toothed belt pulley 4. The outer side wall of the first toothed belt pulley 4 is attached to the inner side wall of the toothed belt 5. The inner side wall of the toothed belt 5 is attached to the outer side wall of the second toothed belt pulley 6. The outer side wall of the lead screw 8 is rotatably connected to the inner side wall of the lead screw support base 7 through a bearing. The outer side wall of the lead screw support base 7 penetrates through the upper surface of the lower base plate 1. The bottom end of the lead screw 8 is mounted on the upper surface of the second toothed belt pulley 6. The upper surface of the lower base plate 1 is mounted on the lower surface of the guide rail base plate 9. The upper surface of the guide rail base plate 9 is mounted on the lower surface of the lead screw support 16. The top end of the lead screw 8 is rotatably connected to the lower surface of the lead screw support 16 through a bearing. The inner side wall of the lead screw nut 11 is threadedly connected to the outer side wall of the lead screw 8. The outer side wall of the lead screw nut 11 is mounted on the inner side wall of the connecting block 13;

[0034] The upper surface of the wafer lifting assembly 40 is mounted with a wafer rotating assembly 50.

[0035] In one embodiment, the wafer rotating assembly 50 includes a vacuum connector 10, a connecting block 13, a rotating motor 14, a rotating motor bracket 15, and a pick - up chuck 24;

[0036] The upper surface of the connecting block 13 is mounted on the lower surface of the rotating motor bracket 15. The lower surface of the rotating motor bracket 15 is mounted on the upper surface of the rotating motor 14. The hollow output shaft of the rotating motor 14 penetrates and is mounted at one end of the vacuum connector 10. Through the setting of the rotating motor bracket 15, it is convenient to fix the position of the rotating motor 14.

[0037] In one embodiment, the upper surface of the wafer rotating assembly 50 is mounted with a wafer centering assembly 60. The wafer centering assembly 60 includes a support square plate 17, an upper cover plate 18, and a centering funnel 28;

[0038] There are four supporting square plates 17 in total. The upper surfaces of the lower bottom plate 1 are symmetrically installed on the lower surfaces of the four supporting square plates 17. The upper surfaces of the supporting square plates 17 are installed on the lower surface of the upper cover plate 18. The upper surface of the upper cover plate 18 is installed on the lower surface of the centering funnel 28. The inside of the centering funnel 28 has two conical surfaces and a cylindrical surface, and the three are smoothly connected by arcs. The diameter of the cylindrical surface is 0.2 mm larger than that of the wafer 26. When the wafer 26 passes through the sub-cylindrical surface, it plays a role in centering.

[0039] In one embodiment, a wafer clamping assembly 70 is installed on the upper surface of the wafer rotating assembly 50. The wafer clamping assembly 70 includes a connecting plate 19, a cylinder 20, a rear support plate 21, a core shaft 22, a positioning sleeve 23, a front support plate 27, a bearing body 32, and a cylinder bottom plate 33.

[0040] There are two cylinder bottom plates 33 in total. The lower surfaces of the two cylinder bottom plates 33 are installed on the upper surface of the upper cover plate 18. The upper surfaces of the cylinder bottom plates 33 are installed on the lower surface of the cylinder 20. The piston rod of the cylinder 20 is installed with two connecting plates 19. The adjacent sides of the two connecting plates 19 are respectively installed on the mutually repelling sides of the rear support plate 21 and the front support plate 27. There are four core shafts 22 in total. The upper surfaces of the rear support plate 21 and the front support plate 27 are symmetrically and movably installed on the bottom ends of the two core shafts 22 respectively. The outer side walls of the core shafts 22 are installed with bearing bodies 32. The upper surface of the centering funnel 28 is installed on the lower surface of the positioning sleeve 23. The inner circles of the two positioning sleeves 23 are in contact with the outer circle of the wafer 26. The two cylinders 20 move towards each other under the drive of low-pressure gas. The two positioning sleeves 23 on the rear support plate 21 are in contact with the trimmed edge of the wafer 26, and the two positioning sleeves 23 on the front support plate 27 are in contact with the outer circle of the wafer 26. The four positioning sleeves 23 play a role in accurately positioning the clamping of the wafer 26, and the positioning accuracy is less than 0.1 mm.

[0041] In one embodiment, the guide rail of the guide rail slider pair 12 is installed on one side of the guide rail bottom plate 9, and the slider of the guide rail slider pair 12 is slidably connected to one side of the connecting block 13. Through the setting of the guide rail slider pair 12, it can not only assist the connecting block 13 to move, but also limit the position of the connecting block 13.

[0042] In one embodiment, the upper end of the output shaft of the rotating motor 14 penetrates through the lower surface of the upper cover plate 18 and is installed at the bottom end of the bonding chuck 24. The upper surface of the bonding chuck 24 adsorbs the wafer 26. Through the setting of the bonding chuck 24, it is convenient to place the position of the wafer 26.

[0043] In one embodiment, the lower surface of the microscope 25 is installed with a mounting platform 36, and the lower surface of the mounting platform 36 is installed with a fixed frame 35. Through the setting of the mounting platform 36 and the fixed frame 35, it is convenient to install the microscope 25 above the wafer 26.

[0044] In one embodiment, an upper limit sensor 29 and a lower limit sensor 31 are respectively installed on the outer sidewalls of the guide rail base plate 9, and a sensor baffle 30 is installed on the outer sidewall of the connecting block 13. Through the settings of the sensor baffle 30, the upper limit sensor 29 and the lower limit sensor 31, it is convenient to control the position of the tab suction cup movement 24.

[0045] When the present invention is in operation: Start the lifting motor 3 to rotate. The output shaft of the lifting motor 3 drives the first toothed belt pulley 4, the toothed belt 5, and the second toothed belt pulley 6 to rotate. The second toothed belt pulley 6 drives the lead screw 8 to rotate, and then makes the lead screw nut 11 move up and down on the lead screw 8. Since the upper end surface of the lead screw nut 11 is provided with a connecting block 13, and the connecting block 13 is connected to the slider of the guide rail slider pair 12 for guide rail guidance, the lead screw nut 11 converts the rotation of the lead screw 8 into a linear up-and-down motion. The lead screw nut 11 drives the connecting block 13 to move synchronously. A wafer rotation assembly 50 is installed on the connecting block 13. When the connecting block 13 drives the sensor baffle 30 to rise to the upper limit sensor 29 position, the pick-up chuck 24 picks up the wafer 26 from the manipulator. At this time, the lifting motor 3 rotates, causing the pick-up chuck 24 and the wafer 26 to descend together. When the pick-up chuck 24 of the wafer 26 passes through the centering funnel 28, since the inside of the centering funnel 28 has two conical surfaces and a cylindrical surface to play a role in centering the wafer 26. When the connecting block 13 drives the sensor baffle 30 to descend to the lower limit sensor 31 position, the centering of the wafer 26 is completed; External vacuum is pumped through the vacuum joint 10 installed at the lower end of the rotating motor 14, so that the centered wafer 26 is vacuum adsorbed and fixed on the upper surface of the pick-up chuck 24. The lifting motor 3 rotates, causing the centered wafer 26 and the pick-up chuck 24 to rise to the working surface of the microscope 25 under vacuum adsorption and fixation. The lifting motor 3 stops rotating; The rotating motor 14 drives the pick-up chuck 24 and the wafer 26 to rotate. When the microscope 25 located directly above the edge of the wafer 26 observes that the appearance feature of the wafer 26 changes from an arc to a straight line and meets the feature requirements, the rotating motor 14 stops rotating, the external vacuum is disconnected, and the pick-up chuck 24 no longer vacuum adsorbs and fixes the wafer 26; The extending ends of the two cylinders 20 of the wafer clamping assembly 70 retract, driving the connecting plate 19 to move towards the center of the centering funnel 28. The two positioning sleeves 23 installed on the front support plate 27 contact the outer circle of the wafer 26 to play a further centering role. The two positioning sleeves 23 installed on the rear support plate 21 contact the trimmed edge of the wafer 26 to play a role in trimming edge positioning. At this time, it plays a role in pre-positioning the position of the wafer 26; The external vacuum is turned on, so that the pick-up chuck 24 vacuum adsorbs the wafer 26 again. The cylinder 20 is opened, and the lifting motor 3 rotates, causing the pick-up chuck 24 and the wafer 26 to rise to the upper limit sensor 29 position, disconnecting the adsorption vacuum of the wafer 26, waiting for the manipulator finger to pick up the wafer 26. The finger picks up the wafer 26, and the lifting motor 3 rotates, causing the pick-up chuck 24 to descend to the initial position, waiting to pick up the next wafer 26.

[0046] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various changes or substitutions, and these should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A pre-alignment mechanism for a near-contact full-automatic exposure machine with a trimmed wafer, comprising a wafer lifting assembly (40), a wafer rotating assembly (50), a wafer centering assembly (60), a wafer clamping assembly (70) and a microscope (25). Characterized in that: The wafer lifting assembly (40) includes a lower bottom plate (1), a motor base (2), a lifting motor (3), a first toothed belt pulley (4), a toothed belt (5), a second toothed belt pulley (6), a lead screw support base (7), a lead screw (8), a guide rail bottom plate (9), a lead screw nut (11), a guide rail slider pair (12), a connecting block (13), and a lead screw support (16). A square through hole (34) is formed on the upper surface of the lower bottom plate (1), the inner side wall of the square through hole (34) is attached to the outer side wall of the lifting motor (3), the lower surface of the lower bottom plate (1) is installed on the upper surface of the motor base (2), the inner bottom wall of the motor base (2) is installed on the lower surface of the lifting motor (3), the output shaft of the lifting motor (3) passes through the inner bottom wall of the motor base (2) and is installed on the upper surface of the first toothed belt pulley (4), the outer side wall of the first toothed belt pulley (4) is attached to the inner side wall of the toothed belt (5), the inner side wall of the toothed belt (5) is attached to the outer side wall of the second toothed belt pulley (6), the outer side wall of the lead screw (8) is rotatably connected to the inner side wall of the lead screw support base (7) through a bearing, the outer side wall of the lead screw support base (7) passes through the upper surface of the lower bottom plate (1), the bottom end of the lead screw (8) is installed on the upper surface of the second toothed belt pulley (6), the upper surface of the lower bottom plate (1) is installed on the lower surface of the guide rail bottom plate (9), the upper surface of the guide rail bottom plate (9) is installed on the lower surface of the lead screw support (16), the top end of the lead screw (8) is rotatably connected to the lower surface of the lead screw support (16) through a bearing, the inner side wall of the lead screw nut (11) is threadedly connected to the outer side wall of the lead screw (8), and the outer side wall of the lead screw nut (11) is installed on the inner side wall of the connecting block (13). The wafer rotating assembly (50) is installed on the upper surface of the wafer lifting assembly (40), and the wafer centering assembly (60) is installed on the upper surface of the wafer rotating assembly (50). The wafer centering assembly (60) includes a supporting square plate (17), an upper cover plate (18), and a centering funnel (28). Four supporting square plates (17) are provided. The upper surface of the lower bottom plate (1) is symmetrically installed on the lower surfaces of the four supporting square plates (17). The upper surface of the supporting square plate (17) is installed on the lower surface of the upper cover plate (18). The upper surface of the upper cover plate (18) is installed on the lower surface of the centering funnel (28). The upper surface of the wafer rotating assembly (50) is mounted with a wafer clamping assembly (70). The wafer clamping assembly (70) includes a connecting plate (19), a cylinder (20), a rear support plate (21), a mandrel (22), a positioning sleeve (23), a front support plate (27), a bearing body (32), and a cylinder bottom plate (33). There are two cylinder bottom plates (33) in total. The lower surfaces of the two cylinder bottom plates (33) are mounted on the upper surface of the upper cover plate (18). The upper surface of the cylinder bottom plate (33) is mounted on the lower surface of the cylinder (20). The piston rod of the cylinder (20) is mounted with two connecting plates (19). One side of the two adjacent connecting plates (19) is respectively mounted on the mutually repulsive sides of the rear support plate (21) and the front support plate (27). There are four mandrels (22) in total. The upper surfaces of the rear support plate (21) and the front support plate (27) are symmetrically and movably mounted on the bottom ends of the two mandrels (22) respectively. The outer side wall of the mandrel (22) is mounted with a bearing body (32). The upper surface of the centering funnel (28) is mounted on the lower surface of the positioning sleeve (23).

2. The pre-aligning mechanism for a trimmed wafer of the proximity-contact type full-automatic exposure machine according to claim 1, characterized in that: The wafer rotating assembly (50) includes a vacuum connector (10), a connecting block (13), a rotating motor (14), a rotating motor bracket (15), and a pick-up chuck (24). The upper surface of the connecting block (13) is mounted on the lower surface of the rotating motor bracket (15). The lower surface of the rotating motor bracket (15) is mounted on the upper surface of the rotating motor (14). The hollow output shaft of the rotating motor (14) is penetrated and installed at one end of the vacuum connector (10).

3. The pre-aligning mechanism for a trimmed wafer of the proximity-contact type full-automatic exposure machine according to claim 1, characterized in that: The guide rail of the guide rail slider pair (12) is mounted on one side of the guide rail bottom plate (9). The slider of the guide rail slider pair (12) is slidably connected to one side of the connecting block (13).

4. The pre-aligning mechanism for a trimmed wafer of the proximity-contact type full-automatic exposure machine according to claim 2, characterized in that: The upper end of the output shaft of the rotating motor (14) penetrates through the lower surface of the upper cover plate (18) and is mounted on the bottom end of the pick-up chuck (24). The upper surface of the pick-up chuck (24) adsorbs a wafer (26).

5. The pre-aligning mechanism for a trimmed wafer of the proximity-contact type full-automatic exposure machine according to claim 1, characterized in that: The lower surface of the microscope (25) is mounted with a mounting platform (36). The lower surface of the mounting platform (36) is mounted with a fixed frame (35).

6. The pre-aligning mechanism for a trimmed wafer of the proximity-contact type full-automatic exposure machine according to claim 1, characterized in that: Upper limit sensors (29) and lower limit sensors (31) are respectively mounted on the outer side wall of the guide rail bottom plate (9). A sensor baffle (30) is mounted on the outer side wall of the connecting block (13).

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