Semiconductor Electronic Component Detection Device and Method

Abstract

The present invention provides a semiconductor electronic component detection device and method, which relates to the technical field of testing equipment and includes a detection platform, a downward pressing test mechanism, and at least one moving pressure bar mechanism; the moving pressure bar mechanism is installed on the detection platform and is used for transporting and pressing the electronic components. The moving pressure bar mechanism has a pressure receiving surface and a first pressing surface for pressing the electronic components, and the first pressing surface is directly below the pressure receiving surface; the downward pressing test mechanism is installed on the detection platform and reciprocates relative to the detection platform. The downward pressing test mechanism has a second pressing surface, and the downward pressing test mechanism is used to apply a downward pressure to the pressure receiving surface of the moving pressure bar mechanism through the second pressing surface, and the pressure on the moving pressure bar mechanism is transmitted along the direction from the pressure receiving surface to the first pressing surface. The semiconductor electronic component detection device provided by the present invention can be applied to a high-speed operation test environment, and the moving pressure bar mechanism will not be subjected to bending moment loads, effectively alleviating the problem of low test yield caused by uneven test pressure.

Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment, and in particular to a semiconductor electronic component detection device and method. Background Art

[0002] With the gradual complexity of the function modules of ICs (Integrated Circuit Chips, microelectronic components), the test pressure and test time of ICs show a gradually increasing trend. For ICs with a long test time, as the number of IC stations tested by the sorter at one time increases, the overall test cost will be correspondingly reduced. Therefore, the demand for multi-station high-pressure test machines has emerged.

[0003] Traditional multi-station test devices usually include two sets of IC test arms with the same mechanism. The test arms are centered, and each set of test arms has its own independent horizontal and vertical drive systems. The vertical drive systems of the two sets of test arms are symmetrically distributed on both sides with the test arms as the symmetry center. The vertical drive systems are equipped with horizontal guide rails, and the horizontal guide rails are connected to the test arms. Different from the vertical drive system, the horizontal drive systems of the two sets of test arms share two double guide rails for guiding. During the entire test process, the horizontal and vertical drive systems cooperate to drive the test arms to move horizontally and vertically in parallel, so that ICs can be picked up and placed and pressed for testing.

[0004] However, the above multi-station test device has the following disadvantages:

[0005] 1), The downward pressure exerted by the test arm on the IC is directly related to the driving force of the vertical drive system. If a large pressure load on the test arm needs to be achieved, it is required that the driver of the vertical drive system has a very high power output, which will cause the volume and weight of the driver to be too large, increase the load of the horizontal drive system, affect the response speed of the horizontal drive system, and reduce the test efficiency.

[0006] 2), Since the vertical drive systems are located on both sides of the test arms, when the test arms press down vertically for testing, they are affected by two forces: the driving force of the side vertical drive system and the reaction force of the tested IC. The two acting forces are not coaxial, and an overall bending moment load is formed, resulting in problems such as structural deformation and inclination of the test arms when testing ICs, causing uneven test pressure on the ICs, affecting the key indicators of IC testing and the test yield.

[0007] 3), The linkage structure between the existing vertical drive system and the test arm is complex. When installing, it is necessary to first debug the accuracy of the lead screws and guide rails of the individual modules of the vertical drive system; then it is necessary to debug the accuracy of the guide rails of the test arms; finally, it is necessary to debug the overall accuracy after connecting the test arms and the vertical drive system. The overall structure is complex and the assembly accuracy is low. Summary of the Invention

[0008] The object of the present invention is to provide a semiconductor electronic component detection device, which can be suitable for high-speed operation test environment, and the moving pressure rod mechanism will not be subjected to bending moment load, effectively alleviating the problem of low test yield caused by uneven test pressure.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] In a first aspect, the present invention provides a semiconductor electronic component testing device, comprising a testing platform, a pressing test mechanism and at least one movable pressing rod mechanism;

[0011] The movable pressure rod mechanism is installed on the detection platform and is used for transporting and pressure testing electronic components. The movable pressure rod mechanism has a pressure-bearing surface and a first pressure-applying surface for pressure testing the electronic components. The first pressure-applying surface is located directly below the pressure-bearing surface.

[0012] The downward pressure testing mechanism is installed on the detection platform and can reciprocate relative to the detection platform. The downward pressure testing mechanism has a second pressure surface. The downward pressure testing mechanism is used to apply downward pressure to the pressure surface of the movable pressure rod mechanism through the second pressure surface. The pressure on the movable pressure rod mechanism is transmitted in the direction from the pressure surface to the first pressure surface.

[0013] Furthermore, one of the end of the downward pressure testing mechanism having the second pressurizing surface and the end of the movable pressure rod mechanism having the pressurized surface is provided with an electromagnetic component, and the other is provided with a magnetic attraction component for adsorbing with the electromagnetic component.

[0014] Furthermore, the downward pressure test mechanism includes a first bracket assembly, a first drive assembly and a pressure rod, the first bracket assembly is installed on the detection platform, the pressure rod is slidably connected to the first bracket assembly in a vertical direction, the bottom end of the pressure rod has the second pressurizing surface, the first drive assembly is installed on the first bracket assembly and connected to the top end of the pressure rod, and the first drive assembly is used to drive the pressure rod to move relative to the first bracket assembly.

[0015] Further, the first driving assembly includes a first power assembly and a first transmission structure;

[0016] The first power assembly is mounted on the first bracket assembly;

[0017] The first transmission structure includes a first rotating rod transmission-connected to the first power assembly, the first rotating rod is rotationally connected to the first bracket assembly and is threadedly connected to the pressure rod.

[0018] Further, a channel is formed between the pressing test mechanism and the detection platform. The moving press rod mechanism is configured to be an even number and is divided into two columns. The two columns of moving press rod mechanisms are symmetrically installed on the detection platform and penetrate through the channel.

[0019] Further, the moving press rod mechanism includes a second driving component, a second bracket component, a third driving component, and a moving member;

[0020] The second driving component is installed on the detection platform;

[0021] The second bracket component is connected to the second driving component, and the second bracket component is slidably connected to the detection platform in parallel;

[0022] The third driving component is installed on the second bracket component and is connected to the moving member;

[0023] The top end of the moving member has the pressure-receiving surface, the bottom end of the moving member has the first pressing surface, the moving member is slidably connected to the second bracket component in the vertical direction, and the third driving component is used to drive the moving member to slide relative to the second bracket component.

[0024] Further, the second driving component includes a second power component and a second transmission structure;

[0025] The second power component is installed on the detection platform;

[0026] The second transmission structure includes a second rotating rod and a second sleeve member threadedly connected to the second rotating rod. The second rotating rod is rotatably connected to the detection platform, and the second sleeve member is fixedly installed on the second bracket component.

[0027] Further, a plurality of slide rails or chutes are longitudinally arranged on the detection platform. The second sleeve member in each moving press rod mechanism is slidably connected to each of the slide rails or the chutes through the second bracket component.

[0028] Further, the third driving component includes a third power component, a fifth transmission component, and a sixth transmission component;

[0029] The third power component is installed at the top end of the second bracket component;

[0030] The sixth transmission component is located on the side of the third power component. The sixth transmission component includes a moving rod and a rotating member threadedly connected to the moving rod. The rotating member is rotatably connected to the second bracket component, and the moving rod is fixedly installed on the moving member;

[0031] The fifth transmission component is connected between the third power component and the rotating member, and is configured to transmit the power of the third power component to the rotating member.

[0032] Further, the moving member includes an arm body, an adapter block, and an adapter plate. The moving rod is fixedly connected to the arm body. The arm body has an installation channel. The sixth transmission component and at least a part of the fifth transmission component are located in the installation channel. The bottom end of the arm body is connected to the adapter plate through the adapter block. The bottom surface of the adapter plate is the first pressing surface.

[0033] In a second aspect of the present invention, a method for detecting semiconductor electronic components is provided. The semiconductor electronic component detecting device as described above is adopted. The semiconductor electronic component detecting device includes a plurality of the moving pressure rod mechanisms, including:

[0034] Each of the moving pressure rod mechanisms sequentially transports the electronic component to be tested to the test area. During the test, the downward pressing test mechanism presses down one of the moving pressure rod mechanisms each time.

[0035] Or each of the moving pressure rod mechanisms simultaneously transports the electronic component to be tested to the test area. During the test, the downward pressing test mechanism simultaneously presses down each of the moving pressure rod mechanisms.

[0036] The semiconductor electronic component detecting device and method provided by the present invention can produce the following beneficial effects:

[0037] When using the above-mentioned semiconductor electronic component detecting device, the moving pressure rod mechanism can move, so as to transport the electronic component to be tested to the test area. During the above process, the downward pressing test mechanism can gradually move down until the second pressing surface contacts the pressed surface. Subsequently, the downward pressing test mechanism continuously applies a downward pressure to the pressed surface, and this pressure is transmitted to the first pressing surface along the direction from the pressed surface to the first pressing surface, and the first pressing surface presses down the electronic component for testing.

[0038] Compared with the prior art, on the one hand, the present device is provided with a downward pressing test mechanism. The downward pressing test mechanism can provide a powerful downward pressure for the moving pressure rod mechanism, and can also cooperate with the moving pressure rod mechanism to jointly press the electronic component, realizing high-pressure detection, and having a lower power requirement for the driver in the moving pressure rod mechanism, reducing the load of the moving pressure rod mechanism, and being applicable to a high-speed operation test environment; on the other hand, since the transmission direction of the pressure on the moving pressure rod mechanism is along the direction from the pressed surface to the first pressing surface, during the test, the pressure applied by the downward pressing test mechanism to the moving pressure rod mechanism is coaxial and opposite to the reaction force of the electronic component received by the moving pressure rod mechanism, and the moving pressure rod mechanism will not be subjected to a bending moment load, so that the test pressure acts on the electronic component more uniformly, effectively alleviating the problem of low test yield caused by uneven test pressure.

[0039] The semiconductor electronic component detection method provided in the second aspect of the present invention has two usage states. The downward pressure testing mechanism can apply pressure to each moving pressure rod mechanism one by one or simultaneously to each moving pressure rod mechanism, thereby realizing the individual detection and batch detection of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0041] Figure 1 It is a three-dimensional structure diagram of a semiconductor electronic component detection device provided in an embodiment of the present invention;

[0042] Figure 2 It is a three-dimensional structure diagram of a downward pressure testing mechanism provided in an embodiment of the present invention;

[0043] Figure 3 It is a cross-sectional view of a pressure rod of a downward pressure testing mechanism (without a second support frame) provided in an embodiment of the present invention;

[0044] Figure 4 It is a three-dimensional structure diagram of a second driving component provided in an embodiment of the present invention;

[0045] Figure 5 It is a three-dimensional structure diagram of a moving pressure rod mechanism (without a second driving component) provided in an embodiment of the present invention;

[0046] Figure 6 It is a cross-sectional view of an arm of a moving pressure rod mechanism (without a second driving component) provided in an embodiment of the present invention;

[0047] Figure 7 It is a top view of the initial position when two moving pressure rod mechanisms provided in an embodiment of the present invention take turns to test an electronic component;

[0048] Figure 8 is Figure 7 a three-dimensional structure diagram in the state shown;

[0049] Figure 9 It is a top view of the state where the first moving pressure rod mechanism carries out an electronic component test and the second moving pressure rod mechanism carries an electronic component and waits, provided in an embodiment of the present invention;

[0050] Figure 10 is Figure 9 a three-dimensional structure diagram in the state shown;

[0051] Figure 11 A top view of the second movable pressure rod mechanism carrying an electronic component for testing and the first movable pressure rod mechanism carrying an electronic component in a waiting state provided by an embodiment of the present invention;

[0052] Figure 12 for Figure 11 Schematic diagram of the three-dimensional structure in the state shown;

[0053] Figure 13 A schematic diagram of a three-dimensional structure of a first movable pressure rod mechanism and a second movable pressure rod mechanism provided in an embodiment of the present invention when simultaneously picking up electronic components;

[0054] Figure 14 A schematic diagram of a three-dimensional structure of a state in which a first movable pressing rod mechanism and a second movable pressing rod mechanism provided by an embodiment of the present invention simultaneously press down an electronic component.

[0055] Icons: 1-testing platform; 11-slide rail; 12-motor seat; 13-motor sheet metal; 14-first cushion block; 15-second cushion block; 16-limiting block; 17-supporting block; 2-pressing test mechanism; 21-first bracket assembly; 211-first mounting plate; 212-first supporting frame; 213-second mounting plate; 214-second supporting frame; 215-first fixing plate; 216-limiting member; 217-first bearing; 218-mounting block; 219-slider; 22-pressure rod; 221-second pressure surface; 222-guide rail; 23-first power assembly; 24-first transmission assembly; 241-second driving wheel; 242-second synchronous belt; 243-second driven wheel; 25-first rotating rod; 26-first set; 3-moving pressure rod mechanism; 3a-first moving pressure rod mechanism; 3b-second moving pressure rod mechanism; 31-second driving assembly; 311-second power assembly; 312-third transmission assembly; 313-second rotating rod; 314-second set; 3141-connecting plate; 32-second bracket assembly; 321-fourth mounting plate; 322-slider fixing plate; 323-second fixing plate; 33-third driving assembly; 331-third power assembly; 332-fifth transmission assembly; 3321-first driving wheel; 3322-first synchronous belt; 3323-first driven wheel; 333-moving rod; 334-rotating member; 34-moving member; 341-arm body; 3411-pressure surface; 3412-installation channel; 342-adapter block; 343-adapter plate; 3431-first pressure surface; 4-electromagnetic component; 5-magnetic attraction component; 6-channel; 7-lateral feed assembly; 7a-first lateral feed assembly; 7b-second lateral feed assembly; 8-test area. DETAILED DESCRIPTION

[0056] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0057] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0058] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0059] The following will detail the specific embodiments of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not used to limit the present invention.

[0060] An embodiment of the first aspect of the present invention is to provide a semiconductor electronic component detection device, as Figure 1 shown, which includes a detection platform 1, a downward pressure testing mechanism 2, and at least one moving pressure rod mechanism 3; the moving pressure rod mechanism 3 is installed on the detection platform 1 and is used for transporting and pressure testing electronic components. The moving pressure rod mechanism 3 has a pressure receiving surface 3411 and a first pressure applying surface 3431 for pressure testing electronic components. The first pressure applying surface 3431 is located directly below the pressure receiving surface 3411; the downward pressure testing mechanism 2 is installed on the detection platform 1 and can reciprocate relative to the detection platform 1. The downward pressure testing mechanism 2 has a second pressure applying surface 221. The downward pressure testing mechanism 2 is used to apply a downward pressure to the pressure receiving surface 3411 of the moving pressure rod mechanism 3 through the second pressure applying surface 221, and the pressure on the moving pressure rod mechanism 3 is transmitted along the direction from the pressure receiving surface 3411 to the first pressure applying surface 3431.

[0061] During use, the moving pressure bar mechanism 3 can pick up, transfer to the test area, and lower electronic components through horizontal and vertical movements. The downward pressure testing mechanism 2 applies pressure to the moving pressure bar mechanism 3 through vertical movement to achieve large-pressure testing. As a result, the power requirement for the actuator that enables vertical movement in the moving pressure bar mechanism 3 is relatively low, and it can be configured as a small-sized actuator, which is suitable for high-speed operation test environments. Additionally, since the pressure on the moving pressure bar mechanism 3 is transmitted along the direction from the pressure-receiving surface 3411 to the first pressure-applying surface 3431, the moving pressure bar mechanism 3 does not bend during the downward pressure process, and the test pressure can act evenly on the electronic components, ensuring the test accuracy rate.

[0062] In the above process, the downward pressure testing mechanism 2 and the moving pressure bar mechanism 3 can jointly apply pressure to the electronic components, or the moving pressure bar mechanism 3 can be in a stopped state, and only the downward pressure testing mechanism 2 provides the downward pressure.

[0063] In some embodiments, an electromagnetic member 4 is provided at one end of the downward pressure testing mechanism 2 having the second pressure-applying surface 221 or at one end of the moving pressure bar mechanism 3 having the pressure-receiving surface 3411, and a magnetic member 5 for adsorbing to the electromagnetic member 4 is provided at the other end. When the second pressure-applying surface 221 contacts the pressure-receiving surface 3411, the electromagnetic member 4 and the magnetic member 5 can adsorb to each other, ensuring the connection stability between the downward pressure testing mechanism 2 and the moving pressure bar mechanism 3. Especially when there is a certain height difference between the moving pressure bar mechanism 3 and the test area 8, such as when the actuator for vertical movement in the moving pressure bar mechanism 3 fails and the power is cut off, the adsorption force between the electromagnetic member 4 and the magnetic member 5 can effectively prevent the moving pressure bar mechanism 3 from falling.

[0064] The operator can control whether the electromagnetic member 4 adsorbs the magnetic member 5 by controlling the energized state of the electromagnetic member 4, thereby realizing the quick engagement and separation between the downward pressure testing mechanism 2 and the moving pressure bar mechanism 3.

[0065] According to the adsorption area size and adsorption strength, the electromagnetic member 4 and the magnetic member 5 can be configured as one or more. To reduce the space occupied by the electromagnetic member 4 and the magnetic member 5, the electromagnetic member 4 and the magnetic member 5 can be installed in an embedded manner.

[0066] In at least one embodiment, the electromagnetic member 4 can be an electromagnet, and the magnetic member 5 can be an iron block.

[0067] The following specifically describes the structure of the downward pressure testing mechanism 2:

[0068] In some embodiments, such as Figure 2As shown in the figure, the downward pressing test mechanism 2 includes a first support assembly 21, a first driving assembly, and a pressing rod 22; the first support assembly 21 is installed on the detection platform 1, and the first support assembly 21 serves to support and elevate the first driving assembly and the pressing rod 22; the pressing rod 22 is slidably connected to the first support assembly 21 in the vertical direction, thereby ensuring the stability of the movement process of the pressing rod 22, and the bottom end of the pressing rod 22 has a second pressing surface 221; the first driving assembly is installed on the first support assembly 21 and connected to the top end of the pressing rod 22, and the first driving assembly is used to drive the pressing rod 22 to move relative to the first support assembly 21. The above-mentioned downward pressing test mechanism 2 has a simple structure and can provide a directional downward pressure for the moving pressing rod mechanism.

[0069] Among them, the first support assembly 21 may include a first mounting plate 211, a first support frame 212, a second mounting plate 213, and a second support frame 214. The first mounting plate 211 is located above the second mounting plate 213, and the two are connected by two first support frames 212 arranged at intervals. The top end of the second support frame 214 is connected to the side of the second mounting plate 213 facing away from the first support frame 212, and the bottom end of the second support frame 214 is fixedly installed on the detection platform 1.

[0070] Specifically, the first support frame 212 has a plate-like structure and is vertically arranged. To reduce its weight, it is provided with a hollow structure; the second support frame 214 has a "U" - shaped structure, and to ensure its own structural stability, strengthening plates are installed on both sides.

[0071] It should be noted that any structure that can drive the pressing rod 22 to move relative to the first support assembly 21 can be the first driving assembly mentioned in the above embodiments. For example: the first driving assembly is a linear motion unit such as a hydraulic cylinder or a linear motor, and the first driving assembly can also be a combination of a unit that makes a rotational motion such as a motor and a unit such as a connecting rod or a lead screw nut, and the connecting rod or the lead screw nut and other units can convert the rotational motion of the motor into a linear motion.

[0072] In some embodiments, as Figure 2 shown, the first driving assembly includes a first power assembly 23 and a first transmission mechanism. The first power assembly 23 is installed on the first support assembly 21; the first transmission structure includes a first rotating rod 25 that is in transmission connection with the first power assembly 23. The first rotating rod 25 is rotatably connected to the first support assembly 21 and is threadedly connected to the pressing rod 22. When in use, the first power assembly 23 can drive the first rotating rod 25 to rotate, thereby driving the pressing rod 22 to move relative to the first support assembly 21.

[0073] Among them, the first power component 23 can be a motor, which can be specifically installed on the first fixing plate 215 on the first mounting plate 211. The first fixing plate 215 is fixedly installed on the top surface of the first mounting plate 211. The housing of the first power component 23 extends from the first fixing plate 215 to the lower part of the first mounting plate 211, and the power output shaft of the first power component 23 passes through the first fixing plate 215 and extends above the first mounting plate 211.

[0074] The first transmission mechanism can include a first transmission component 24 and a second transmission component, where:

[0075] The second transmission component is located on the side of the first power component 23. The second transmission component includes a first rotating rod 25 and a first sleeving part 26 threadedly connected to the first rotating rod 25. The first rotating rod 25 is rotatably connected to the first bracket component 21, and the first sleeving part 26 is fixedly installed on or integrally formed with the pressing rod 22, that is, the first rotating rod 25 is threadedly connected to the pressing rod 22 through the first sleeving part 26. When the first rotating rod 25 rotates relative to the first bracket component 21, the first sleeving part 26 rotates relative to the first rotating rod 25 and moves vertically relative to the first rotating rod 25, thereby realizing the up and down movement of the pressing rod 22.

[0076] Specifically, as Figure 3 shown, a limiting part 216 is installed on the first mounting plate 211, and the top end of the first rotating rod 25 penetrates through the limiting part 216 and is connected to the first transmission component 24. An installation block 218 is fixedly installed on the second mounting plate 213. The installation block 218 penetrates through the pressing rod 22 along the direction perpendicular to the sliding direction of the pressing rod 22, so as to limit the sliding stroke of the pressing rod 22. The bottom end of the first rotating rod 25 can extend into the pressing rod 22 and is rotatably connected to the installation block 218 through a first bearing 217. Since the installation block 218 is fixedly installed on the second mounting plate 213, the setting of the first bearing 217 can reduce the friction between the first rotating rod 25 and the installation block 218 when the first rotating rod 25 rotates, and the above installation block 218 can also cooperate with the limiting part 216 to jointly realize the axial limiting of the first rotating rod 25.

[0077] Specifically, the first sleeving part 26 can be a nut, and the first rotating rod 25 can be a lead screw, and the lead screw is arranged in the middle of the pressing rod 22.

[0078] The first transmission component 24 is connected between the first power component 23 and the first rotating rod 25, and is used to transmit the power of the first power component 23 to the first rotating rod 25, so that the power output shaft of the first power component 23 and the first rotating rod 25 can be arranged non-coaxially, and the installation positions of the first power component 23 and the first rotating rod 25 can be arranged more reasonably. For example Figure 2 shown, the axial dimension of the downward pressing test mechanism 2 is smaller and the structure is more compact.

[0079] It should be noted that any structure that can transmit the power of the first power assembly 23 to the first rotating rod 25 can be the first transmission assembly 24 mentioned in the above embodiment, for example: the first transmission assembly includes a gear transmission unit, a belt transmission unit, a chain transmission unit, etc.

[0080] by Figure 2 Taking an example for specific description, the first transmission component 24 includes a second driving wheel 241, a second synchronous belt 242 and a second driven wheel 243. The second driving wheel 241 is fixedly connected to the power output shaft of the first power component 23, the second driven wheel 243 is fixedly connected to the first rotating rod 25, and the second synchronous belt 242 is connected between the second driving wheel 241 and the second driven wheel 243. When the power output shaft of the first power component 23 rotates, the second driving wheel 241 rotates accordingly and drives the second driven wheel 243 to rotate through the second synchronous belt 242, thereby finally realizing the rotation of the first rotating rod 25.

[0081] The pressure rod 22 can be slidably connected to the second support frame 214 in a variety of ways. In some embodiments, two symmetrically arranged third mounting plates are fixedly mounted on the second support frame 214. One of the third mounting plates and the pressure rod 22 is provided with at least one guide rail 222, and the other is provided with at least one slider 219.

[0082] by Figure 2 Taking an example for specific explanation, two sliders 219 are provided on each third mounting plate, for a total of four sliders 219. The outer surface of the pressure rod 22 is provided with four guide rails 222 which are slidably connected to the four sliders 219 in a one-to-one correspondence. The four guide rails 222 are respectively located on the left and right side surfaces of the pressure rod 22.

[0083] In some embodiments, similar to the compressed state of the movable pressure rod mechanism 3, the pressure exerted by the first set 26 on the pressure rod 22 is transmitted in a direction perpendicular to the second pressure-applying surface 221. When pressing down, the pressure exerted by the first set 26 on the pressure rod 22 is opposite to the reaction force of the pressure surface 3411, so that the pressure rod 22 will not be subjected to bending moment load.

[0084] Specifically, the second pressurizing surface 221 has a geometric center, and the axis of the first rotating rod 25 passes through the geometric center of the second pressurizing surface 221 , so that the second pressurizing surface 221 applies force uniformly to the pressure receiving surface 3411 from the geometric center.

[0085] In addition, if Figure 3 As shown, the second pressurizing surface 221 of the pressure rod 22 is embedded with an electromagnetic component 4 . There are three electromagnetic components 4 . The three electromagnetic components 4 are evenly spaced and linearly distributed, and the electromagnetic component 4 in the middle is located at the geometric center of the second pressurizing surface 221 .

[0086] In some embodiments, Figure 1As shown in the figure, a channel 6 is formed between the downward pressing test mechanism 2 and the detection platform 1. The moving pressure rod mechanisms 3 are configured to be an even number and are divided into two columns. The two columns of moving pressure rod mechanisms 3 are symmetrically installed on the detection platform 1 and penetrate through the channel 6. The above settings enable the downward pressing test mechanism 2 to be erected above the two columns of moving pressure rod mechanisms 3, so that pressure can be applied to the moving pressure rod mechanisms 3 more stably and conveniently.

[0087] During operation, the two moving pressure rod mechanisms 3 can take turns to move directly below the downward pressing test mechanism 2, and the downward pressing test mechanism 2 pressurizes a certain moving pressure rod mechanism 3. Or the two moving pressure rod mechanisms 3 can move directly below the downward pressing test mechanism 2 at the same time, and the downward pressing test mechanism 2 pressurizes the two moving pressure rod mechanisms 3 at the same time. When the moving pressure rod mechanisms 3 are configured as three, four, five, etc., the pressurizing method is the same as above.

[0088] The structure of the moving pressure rod mechanism 3 will be specifically described below:

[0089] In some embodiments, as Figure 1 shown, the moving pressure rod mechanism 3 includes a second driving component 31, a second bracket component 32, a third driving component 33 and a moving member 34; the second driving component 31 is installed on the detection platform 1; the second bracket component 32 is connected to the second driving component 31, and the second bracket component 32 is slidably connected to the detection platform 1 in parallel. The sliding direction can be perpendicular to the downward pressing direction of the downward pressing test mechanism 2. The second driving component 31 is used to drive the second bracket component 32 to slide relative to the detection platform 1 so that the bottom end of the moving member 34 faces the test area 8 or the material taking area; the third driving component 33 is installed on the second bracket component 32 and is connected to the moving member 34; the top end of the moving member 34 has a pressure receiving surface 3411, and the bottom end of the moving member 34 has a first pressure applying surface 3431. The moving member 34 is slidably connected to the second bracket component 32 in the vertical direction. The third driving component 33 is used to drive the moving member 34 to slide relative to the second bracket component 32 so that the moving member 34 can pick and place electronic components.

[0090] In the above moving pressure rod mechanism 3, in the horizontal direction, it can move longitudinally. Therefore, the electronic components can be loaded laterally through the lateral feeding component 7, and there is no need to install a lateral driving mechanism on the detection platform 1, which greatly simplifies the device structure, improves the response rate, and is more suitable for high-speed operation test environments.

[0091] In some embodiments, a plurality of slide rails 11 or chutes are longitudinally arranged on the detection platform 1. The second bracket component 32 in each moving pressure rod mechanism 3 is slidably connected to each slide rail 11 or chute. The slide rails 11 and the chutes can play a guiding role in the movement of the second bracket component 32, so as to ensure the stability of the moving pressure rod mechanism 3 when moving longitudinally.

[0092] In at least one embodiment, two slide rails 11 are longitudinally arranged on the detection platform 1, and two moving press bar mechanisms 3 are configured. The second bracket assembly 32 in each moving press bar mechanism 3 is slidably connected to the two slide rails 11. The two slide rails 11 can stably support the second bracket assembly 32. At the same time, a through hole can be formed in the detection platform 1 between the two slide rails 11, and the two moving press bar mechanisms 3 can extend downward through the through hole to the lower part of the detection platform 1.

[0093] In addition, since the detection device in the above embodiment is provided with a downward pressing test mechanism 2, the downward pressing test mechanism 2 can provide a powerful downward pressure for the moving press bar mechanism 3, so that the driving power requirement for the third driving component 33 in the moving press bar mechanism 3 is relatively low, reducing the load of the moving press bar mechanism 3. At the same time, since the second bracket assembly 32 in the moving press bar mechanism 3 can be slidably connected to multiple slide rails 11 or chutes on the detection platform 1, the weights of the third driving component 33 and the moving member 34 on the second bracket assembly 32 directly act between the multiple slide rails 11 or chutes. The center of gravity of the moving press bar mechanism 3 is stable, the operation is smooth, and the structure of the moving press bar mechanism 3 can be configured to be simpler without the need to additionally configure auxiliary mechanisms.

[0094] The structure of the second driving component 31 will be specifically described below:

[0095] It should be noted that any structure that can drive the second bracket assembly 32 to slide relative to the detection platform 1 can be the second driving component 31 mentioned in the above embodiment. For example, the second driving component 31 is a linear motion unit such as a hydraulic cylinder or a linear motor, and the second driving component 31 can also be a combination of a unit that makes a rotational motion such as a motor and a unit such as a connecting rod or a lead screw nut. The connecting rod or the lead screw nut and other units can convert the rotational motion of the motor into a linear motion.

[0096] In some embodiments, as Figure 4 shown, the second driving component 31 includes a second power component 311 and a second transmission structure. The second power component 311 is installed on the detection platform 1; the second transmission structure includes a second rotating rod 313 and a second sleeve 314 threadedly connected to the second rotating rod 313. The second rotating rod 313 is rotatably connected to the detection platform 1, and the second sleeve 314 is fixedly installed on the second bracket assembly 32. When in use, the second power component 311 drives the second rotating rod 313 to rotate, so that the second sleeve 314 drives the second bracket assembly 32 to slide relative to the detection platform 1.

[0097] Among them, the second power component 311 can be a motor. A motor base 12 is fixedly installed on the detection platform 1, and a motor sheet metal 13 is fixedly installed on the motor base 12. The position of the motor sheet metal 13 relative to the motor base 12 is adjustable in the transverse direction, and the flange surface of the second power component 311 is fixed on the motor sheet metal 13.

[0098] The second transmission structure can include a third transmission component 312 and a fourth transmission component. Among them:

[0099] The fourth transmission component is located on the side of the second power component 311. The fourth transmission component includes a second rotating rod 313 and a second sleeve member 314 threadedly connected to the second rotating rod 313. The second rotating rod 313 is rotatably connected to the detection platform 1, and the second sleeve member 314 is fixedly installed on the second bracket assembly 32. The second sleeve member 314 in each moving pressure rod mechanism 3 can be slidably connected to each slide rail 11 or chute through the second bracket assembly 32. When the second rotating rod 313 rotates relative to the detection platform 1, the second sleeve member 314 rotates relative to the second rotating rod 313 and moves longitudinally relative to the second rotating rod 313, thereby realizing the up and down movement of the second bracket assembly 32.

[0100] In at least one embodiment, a plurality of slide rails 11 are fixedly installed on the detection platform 1. A chute matching with the slide rail 11 can be recessed on the second bracket assembly 32, or a slider can be fixedly installed on the second bracket assembly 32, and a chute matching with the slide rail 11 is recessed on the slider.

[0101] In addition, as Figure 4 shown, a first cushion block 14 and a second cushion block 15 are installed on the detection platform 1. A limiting block 16 is fixedly installed on the first cushion block 14, and a supporting block 17 is fixedly installed on the second cushion block 15. One end of the second rotating rod 313 is inserted into the limiting block 16 and rotatably connected to the limiting block 16. The limiting block can limit the axial position of the second rotating rod 313. The other end of the second rotating rod 313 is inserted into the supporting block 17 and rotatably connected to the supporting block 17. The supporting block 17 mainly plays a role in supporting the second rotating rod 313, thereby ensuring the rotational stability of the second rotating rod 313.

[0102] The second rotating rod 313 can be a lead screw, and the second sleeve member 314 can be a nut. A connecting plate 3141 can be fixedly connected to the nut, and the nut is fixedly connected to the second bracket assembly 32 through the connecting plate 3141.

[0103] The third transmission component 312 is connected between the second power component 311 and the second rotating rod 313, and is used to transmit the power of the second power component 311 to the second rotating rod 313. The structure and function of the third transmission component 312 are similar to those of the first transmission component 24. For the sake of brevity, it will not be elaborated in detail here.

[0104] The structure of the second support assembly 32 will be specifically described below:

[0105] The second support assembly 32 includes a fourth mounting plate 321, a slider fixing plate 322, and a second fixing plate 323. The slider fixing plate 322 is fixedly installed on the bottom surface of the fourth mounting plate 321. There can be two slider fixing plates 322. The second fixing plate 323 is fixedly installed on the top surface of the fourth mounting plate 321. The structure of the third driving assembly 33 will be specifically described below:

[0106] The optional structural types of the third driving assembly 33 are similar to those of the first driving assembly. For the sake of brevity, they will not be exemplified one by one here.

[0107] In some embodiments, as Figure 5 shown, the third driving assembly 33 includes a third power assembly 331, a fifth transmission assembly 332, and a sixth transmission assembly, where:

[0108] The third power assembly 331 is installed at the top of the second support assembly 32. Specifically, it can be installed on the fourth mounting plate 321 through the second fixing plate 323. The housing of the third power assembly 331 is located above the second fixing plate 323. The power output shaft of the third power assembly 331 passes through the second fixing plate 323 and is connected to the fifth transmission assembly 332 above the fourth mounting plate 321.

[0109] As Figure 6 shown, the sixth transmission assembly is located on the side of the third power assembly 331. The sixth transmission assembly includes a moving rod 333 and a rotating member 334 threadedly connected to the moving rod 333. The rotating member 334 is rotatably connected to the second support assembly 32. The moving rod 333 is fixedly installed on the moving member 34. When the rotating member 334 rotates relative to the second support assembly 32, the moving rod 333 rotates relative to the rotating member 334 and moves vertically relative to the rotating member 334, thereby realizing the up and down movement of the moving member 34.

[0110] Specifically, the rotating member 334 can be rotatably connected to the fourth mounting plate 321. The rotating member 334 can be a nut, and the moving rod 333 can be a lead screw. The lead screw is centrally arranged on the moving member 34.

[0111] Both the pressure receiving surface 3411 and the first pressing surface 3431 have geometric centers. The axis of the moving rod 333 passes through the geometric centers of the pressure receiving surface 3411 and the first pressing surface 3431, so that the first pressing surface 3431 uniformly applies force to the electronic component from the geometric center, overcoming the problem of low test yield caused by uneven test pressure.

[0112] The fifth transmission component 332 is connected between the third power component 331 and the rotating member 334, and is used to transmit the power of the third power component 331 to the rotating member 334. The arrangement of the fifth transmission component 332 can make the arrangement of the third power component 331 more flexible, thus making the structure of the moving pressure bar mechanism 3 more compact.

[0113] The above-mentioned third drive component 33 adopts a way that the rotating member 334 is rotatably connected to the second bracket component 32, and the moving rod 333 cooperates with the rotating member 334 to move up and down, so as to avoid the top end of the moving member 34, so that the top end of the moving member 34 can contact the downward pressing test mechanism 2. Taking the mounting surface where the third power component 331 is fixedly installed as the base surface, since the top end of the moving member 34 can be higher than the base surface during the movement of the moving member 34, the installation height of the third power component 331 on the detection platform 1 can be set lower, which is convenient for the arrangement of the downward pressing test mechanism 2 above.

[0114] The optional structural type of the fifth transmission component 332 is similar to that of the first transmission component 24. For the sake of brevity, no examples will be given here one by one.

[0115] In some embodiments, such as Figure 5 and Figure 6 shown, the fifth transmission component 332 includes a first driving wheel 3321, a first synchronous belt 3322 and a first driven wheel 3323. The first driving wheel 3321 is fixedly connected to the power output shaft of the third power component 331. The first driven wheel 3323 is fixedly connected to the rotating member 334 and has a through hole for the moving rod 333 to pass through. The first driven wheel 3323 can be located above the rotating member 334. The first synchronous belt 3322 is connected between the first driving wheel 3321 and the first driven wheel 3323. When the power output shaft of the first power component 23 rotates, the first driving wheel 3321 rotates accordingly and drives the first driven wheel 3323 to rotate through the second synchronous belt 242, and finally realizes the rotation of the rotating member 334.

[0116] The moving member 34 can be slidably connected to the slider fixing plate 322 in the second bracket component 32. The sliding connection structure between the moving member 34 and the slider fixing plate 322 is similar to the sliding connection structure between the pressure bar 22 and the first bracket component 21. For the sake of brevity, no detailed description will be given here.

[0117] In some embodiments, such as Figure 6 shown, the moving member 34 includes an arm body 341, an adapter block 342 and an adapter plate 343. The bottom end of the arm body 341 is connected to the adapter plate 343 through the adapter block 342. The bottom surface of the adapter plate 343 is the first pressing surface 3431, and a magnetic attraction member 5 can be embedded on the pressed surface 3411.

[0118] The adapter block 342 can be located on the side of the arm body 341. The side surface of the adapter block 342 can be fixedly connected to the arm body 341 through connecting parts such as bolts, and the top surface of the adapter block 342 can be fixedly connected to the adapter plate 343 through connecting parts such as bolts. Such a setting can facilitate the connection between the adapter plate 343 and the arm body 341.

[0119] The adapter block 342 can include a main board body and support plates extending obliquely downward from the main board body in two directions. The two support plates are symmetrically arranged with respect to the rectangular plate. The side surface of the rectangular plate is fixedly connected to the arm body 341 through a connecting part, and the top surface of the support plate is fixedly connected to the adapter plate 343 through a connecting part.

[0120] On the basis of the above embodiments, to make the structure of the moving pressure bar mechanism 3 more compact, the sixth transmission component is fixedly connected to the arm body 341. The arm body 341 has an installation channel 3412, and the sixth transmission component and at least part of the fifth transmission component 332 are located in the installation channel 3412. Specifically, as Figure 6 shown, the movable rod 333, the rotating member 334 and the first driven wheel 3323 are located in the installation channel 3412.

[0121] The following describes another solution of the semiconductor electronic component detection device:

[0122] In some embodiments, as Figure 1 shown, at least one set of lateral feeding components 7 are arranged below the detection platform 1. The lateral feeding components 7 are in one-to-one correspondence and cooperation with the moving pressure bar mechanism 3, and the feeding direction of the lateral feeding components 7 is perpendicular to the longitudinal direction.

[0123] The lateral feeding component 7 can include a track and a transfer plate for carrying electronic components. Two transfer plates can be slidably connected to the track, so as to realize the continuous feeding of electronic components.

[0124] In at least one embodiment, the lateral feeding components 7 are configured as two groups, and the two groups of lateral feeding components 7 are respectively located on both sides of the test area 8. During operation, the lateral feeding components 7 can move the electronic components to be tested to both sides of the test area 8 or timely remove the electronic components that have completed the test. The moving pressure bar mechanism 3 can transfer the electronic components on the lateral feeding components 7 to the test area 8 or transfer the tested electronic components to the lateral feeding components 7. The two moving pressure bar mechanisms 3 can take turns to test the electronic components or test the electronic components simultaneously.

[0125] In summary, the semiconductor electronic component detection device provided by the above embodiments has the following advantages:

[0126] 1) A downward pressure testing mechanism 2 is provided. The downward pressure testing mechanism 2 can provide a strong downward pressure for the moving pressure rod mechanism 3. At the same time, it can also cooperate with the moving pressure rod mechanism 3 to jointly apply pressure to the electronic component to achieve large-pressure detection, and has a lower power requirement for the driver in the moving pressure rod mechanism 3, reducing the load of the moving pressure rod mechanism 3 and being applicable to a high-speed operation test environment.

[0127] 2) Since the transmission direction of the pressure on the moving pressure rod mechanism 3 is along the direction from the pressure-receiving surface 3411 to the first pressure-applying surface 3431, the transmission direction of the pressure exerted by the first sleeve member 26 on the pressure rod 22 is perpendicular to the second pressure-applying surface 221. During the test, neither the downward pressure testing mechanism 2 nor the moving pressure rod mechanism 3 will be subjected to bending moment loads, so that the test pressure acts more uniformly on the electronic component, solving the problem of low test yield caused by uneven test pressure.

[0128] 3) There is no fixed side plate structure on the detection platform 1 of the semiconductor electronic component detection device provided in the above embodiment. The first rotating rod 25 is centrally arranged on the pressure rod 22, and the moving rod 333 is centrally arranged on the moving member 34. The horizontal guide rail connecting the vertical drive system and the test arm in the existing test device is cancelled, and the lead screw is directly connected to the moving member 34 and the pressure rod 22. In this way, on the one hand, the original side plate structure components can be reduced, the number of guide rails can be reduced, and the workload can be reduced; on the other hand, in the existing test device, each module needs to be assembled separately and then transported to the basic frame of the entire test module, and finally the cooperation accuracy between the modules needs to be adjusted continuously. In the semiconductor electronic component detection device provided in the above embodiment, since the lead screw is directly connected to the moving member 34 and the pressure rod 22, the lead screw, the moving member 34 and the pressure rod 22 are integrated. After assembling a single module, it can be directly installed on the basic frame, which has the advantages of simple structure and convenient assembly, and helps to improve the overall assembly accuracy.

[0129] An embodiment of the second aspect of the present invention provides a method for detecting semiconductor electronic components, including:

[0130] Each moving pressure rod mechanism 3 sequentially transports the electronic component to be tested to the test area. During the test, the downward pressure testing mechanism 2 presses down one moving pressure rod mechanism 3 each time.

[0131] Or each moving pressure rod mechanism 3 simultaneously transports the electronic component to be tested to the test area. During the test, the downward pressure testing mechanism 2 simultaneously presses down each moving pressure rod mechanism 3.

[0132] The method for detecting semiconductor electronic components provided by the embodiment of the second aspect of the present invention has two usage states. The downward pressure testing mechanism 2 can press each moving pressure rod mechanism 3 one by one or press each moving pressure rod mechanism 3 simultaneously, so as to realize the individual detection and batch detection of electronic components.

[0133] The operation process of the semiconductor electronic component detection device will be described in detail below.

[0134] The process of the single-arm pressing down in turn is as follows:

[0135] The first step: Each component moves to the initialization position.

[0136] Before the entire testing device is started, the first moving pressure bar mechanism 3a and the second moving pressure bar mechanism 3b move upward to the vertical initialization position. Then, the first horizontal feeding component 7a and the second horizontal feeding component 7b move horizontally to their respective initialization positions, which are respectively called the feeding position of the first horizontal feeding component and the feeding position of the second horizontal feeding component, and the pressing test mechanism 2 waits to be started. The initialization positions are as shown in Figure 7 and Figure 8 shown.

[0137] The second step: The second moving pressure bar mechanism 3b carries the electronic component to be tested for testing.

[0138] The first horizontal feeding component 7a moves to the discharging position. Then, the second moving pressure bar mechanism 3b moves vertically downward to suck the electronic component to be tested on the second horizontal feeding component 7b. Then, after the moving member 34 of the second moving pressure bar mechanism 3b moves vertically upward to the safe height, the second driving component 31 in the second moving pressure bar mechanism 3b starts to move, horizontally moves the second moving pressure bar mechanism 3b to align with the test area 8, and then the second moving pressure bar mechanism 3b starts to move down to the test area 8. While moving horizontally, the pressing test mechanism 2 moves vertically downward. After the second moving pressure bar mechanism 3b and the pressing test mechanism 2 come into contact, the test starts. During the process of the second moving pressure bar mechanism 3b moving horizontally to align with the test area 8, the second horizontal feeding component 7b will move to the initial feeding position to wait for materials. At the same time, the first moving pressure bar mechanism 3a will complete the action of sucking the electronic component to be tested from the first horizontal feeding component 7a and stay above the first horizontal feeding component 7a to wait for the second moving pressure bar mechanism 3b to complete the electronic component test. The schematic diagram of the test process is as shown in Figure 9 and Figure 10 shown.

[0139] The third step: The first moving pressure bar mechanism 3a carries the electronic component to be tested for testing.

[0140] After the test of the second moving pressure bar mechanism 3b is completed, the pressing test mechanism 2 moves upward in the vertical direction. At the same time, the second moving pressure bar mechanism 3b also rises, carrying the tested electronic components away from the test area 8, moving horizontally above the second transverse feeding component 7b and descending to place the tested electronic components. The second transverse feeding component 7b transports the tested electronic components to the discharging position, and at the same time transports the next round of electronic components to be tested directly below the second moving pressure bar mechanism 3b. At the same time, the first moving pressure bar mechanism 3a carries the electronic components to be tested to the test area 8 for testing, and the second moving pressure bar mechanism 3b sucks the electronic components to be tested from the second transverse feeding component 7b and waits for the second round of electronic component testing. The test process is as Figure 11 shown in Figures 12

[0141] Step 4: Repeat the above second and third steps to perform cyclic testing.

[0142] The process of pressing down with both arms and testing is as follows:

[0143] Step 1: Each component moves to the initial position.

[0144] Before the entire test device is started, the first moving pressure bar mechanism 3a and the second moving pressure bar mechanism 3b move upward to the vertical initial position. Then, the first transverse feeding component 7a and the second transverse feeding component 7b move horizontally to their respective initial positions, which are respectively called the feeding position of the first transverse feeding component and the feeding position of the second transverse feeding component. At this time, the first moving pressure bar mechanism 3a is directly above the first transverse feeding component 7a, and the second moving pressure bar mechanism 3b is directly above the second transverse feeding component 7b. The initial position is as Figure 7 and Figure 8 shown.

[0145] Step 2: The first moving pressure bar mechanism 3a and the second moving pressure bar mechanism 3b simultaneously pick up the electronic components and simultaneously move to the test area 8 for pressing and testing.

[0146] The first transverse feeding component 7a and the second transverse feeding component 7b carry the electronic components to be tested to the picking positions of the two sets of moving pressure bar mechanisms. The first moving pressure bar mechanism 3a and the second moving pressure bar mechanism 3b simultaneously descend to suck the electronic components, then lift up, and then are respectively driven by two second driving components 31 to move to the pressure testing position. During the horizontal movement of the two sets of moving pressure bar mechanisms, the pressing test mechanism 2 first descends, and then the second moving pressure bar mechanism 3b and the first moving pressure bar mechanism 3a start to descend. When the two sets of moving pressure bar mechanisms reach the pressure testing position, the pressing test mechanism 2 just completes the docking with the two sets of pressure bar components and presses and tests the electronic components. At the same time, the first transverse feeding component 7a and the second transverse feeding component 7b simultaneously return to their respective initial positions to pick up materials and receive the electronic components waiting for the test to be completed. The schematic diagram is asFigure 13 and Figure 14 as shown

[0147] Step 3: The first moving pressure bar mechanism 3a and the second moving pressure bar mechanism 3b simultaneously carry the tested electronic components onto the first lateral feeding assembly 7a and the second lateral feeding assembly 7b, and pick up new electronic components to be tested.

[0148] After that, the steps of the second step to the third step are repeated as a whole for cyclic testing.

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor electronic component detection device, characterized in that, It comprises a detection platform (1), a downward pressure testing mechanism (2) and at least one movable pressure rod mechanism (3); The movable pressure rod mechanism (3) is installed on the detection platform (1) and is used for transporting and pressure testing electronic components. The movable pressure rod mechanism (3) has a pressure-bearing surface (3411) and a first pressure-applying surface (3431) for pressure testing the electronic components. The first pressure-applying surface (3431) is located directly below the pressure-bearing surface (3411); The downward pressure testing mechanism (2) is installed on the detection platform (1) and can reciprocate relative to the detection platform (1), the downward pressure testing mechanism (2) has a second pressure surface (221), and the downward pressure testing mechanism (2) is used to apply downward pressure to the pressure surface (3411) of the movable pressure rod mechanism (3) through the second pressure surface (221), and the pressure on the movable pressure rod mechanism (3) is transmitted in the direction from the pressure surface (3411) to the first pressure surface (3431); The downward pressure testing mechanism (2) comprises a first bracket assembly (21), a first driving assembly and a pressure rod (22); the first bracket assembly (21) is mounted on the detection platform (1); the pressure rod (22) is slidably connected to the first bracket assembly (21) in a vertical direction; the bottom end of the pressure rod (22) has the second pressure surface (221); the first driving assembly is mounted on the first bracket assembly (21) and connected to the top end of the pressure rod (22); the first driving assembly is used to drive the pressure rod (22) to move relative to the first bracket assembly (21).

2. The semiconductor electronic component detection device according to claim 1, characterized in that, One of the end of the second pressurizing surface (221) of the downward pressure testing mechanism (2) and the end of the pressurizing surface (3411) of the movable pressure rod mechanism (3) is provided with an electromagnetic component (4), and the other is provided with a magnetic attraction component (5) for adsorbing the electromagnetic component (4).

3. The semiconductor electronic component detection device according to claim 2, wherein The first driving assembly comprises a first power assembly (23) and a first transmission structure; The first power assembly (23) is mounted on the first bracket assembly (21); The first transmission structure comprises a first rotating rod (25) transmission-connected to the first power assembly (23); the first rotating rod (25) is rotationally connected to the first bracket assembly (21) and is threadedly connected to the pressure rod (22).

4. The semiconductor electronic component detection device according to claim 1, characterized in that, A channel (6) is formed between the downward pressure test mechanism (2) and the detection platform (1); the movable pressure rod mechanisms (3) are configured in an even number and are divided into two rows; the two rows of movable pressure rod mechanisms (3) are symmetrically mounted on the detection platform (1) and pass through the channel (6).

5. The semiconductor electronic component detection device according to claim 1, wherein The movable pressure rod mechanism (3) comprises a second driving assembly (31), a second bracket assembly (32), a third driving assembly (33) and a movable member (34); The second driving component (31) is installed on the detection platform (1); The second bracket assembly (32) is connected to the second driving assembly (31), and the second bracket assembly (32) is connected to the detection platform (1) in a parallel sliding manner; The third driving assembly (33) is mounted on the second bracket assembly (32) and connected to the moving member (34); The top end of the movable member (34) has the pressure surface (3411), the bottom end of the movable member (34) has the first pressure surface (3431), the movable member (34) is slidably connected to the second bracket assembly (32) in the vertical direction, and the third driving assembly (33) is used to drive the movable member (34) to slide relative to the second bracket assembly (32).

6. The semiconductor electronic component detection device according to claim 5, characterized in that, The second driving assembly (31) comprises a second power assembly (311) and a second transmission structure; The second power assembly (311) is installed on the detection platform (1); The second transmission structure comprises a second rotating rod (313) and a second sleeve (314) threadedly connected to the second rotating rod (313); the second rotating rod (313) is rotatably connected to the detection platform (1); and the second sleeve (314) is fixedly mounted on the second bracket assembly (32).

7. The semiconductor electronic component detection device according to claim 6, characterized in that, A plurality of slide rails (11) or slide grooves are arranged on the detection platform (1) in the longitudinal direction, and the second set member (314) in each of the movable pressure rod mechanisms (3) is slidably connected to each of the slide rails (11) or the slide grooves via the second bracket assembly (32).

8. The semiconductor electronic component detection device according to claim 5, characterized in that, The third driving assembly (33) comprises a third power assembly (331), a fifth transmission assembly (332) and a sixth transmission assembly; The third power assembly (331) is installed on the top end of the second bracket assembly (32); The sixth transmission assembly is located on the side of the third power assembly (331), and comprises a moving rod (333) and a rotating member (334) threadedly connected to the moving rod (333), the rotating member (334) being rotatably connected to the second bracket assembly (32), and the moving rod (333) being fixedly mounted on the moving member (34); The fifth transmission assembly (332) is connected between the third power assembly (331) and the rotating member (334), and is used to transmit the power of the third power assembly (331) to the rotating member (334).

9. The semiconductor electronic component detection device according to claim 8, characterized in that, The movable member (34) includes an arm body (341), an adapter block (342) and an adapter plate (343); the movable rod (333) is fixedly connected to the arm body (341); the arm body (341) has an installation channel (3412); the sixth transmission assembly and at least a portion of the fifth transmission assembly (332) are located in the installation channel (3412); the bottom end of the arm body (341) is connected to the adapter plate (343) through the adapter block (342); and the bottom surface of the adapter plate (343) is the first pressure surface (3431).

10. A method for detecting a semiconductor electronic component, which uses the semiconductor electronic component detecting device according to any one of claims 1-9, wherein the semiconductor electronic component detecting device includes a plurality of the moving pressure rod mechanisms (3). include: Each of the movable pressure rod mechanisms (3) sequentially transports the electronic components to be tested to the test area, and during the test, the pressing test mechanism (2) presses down one of the movable pressure rod mechanisms (3) each time; Alternatively, each of the moving pressure rod mechanisms (3) simultaneously transports the electronic component to be tested to the test area, and when testing, the downward pressure testing mechanism (2) simultaneously presses down on each of the moving pressure rod mechanisms (3).

Images