Circuit board measurement method and apparatus, electronic device, and computer-readable storage medium

Abstract

The application provides a circuit board measurement method and device, electronic equipment and computer readable storage medium, comprising: determining coordinate information of a measurement point on a circuit board; determining a first angle set between a detection device and a first component corresponding to the measurement point, the first angle set being used to represent an angle between the detection device and the first component; and determining a second angle set between the detection device and the circuit board, the second angle set being used to represent an angle between the detection device and the circuit board; and measuring an electronic signal on the circuit board based on the coordinate information, the first angle set and the second angle set. The application realizes that a mechanical device replaces manual work to measure a circuit board, and improves the efficiency of circuit board measurement by determining measurement parameters.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board detection, and in particular to a circuit board measurement method and device, an electronic device, and a computer readable storage medium. BACKGROUND

[0002] Currently, the measurement of a circuit board is generally performed manually. However, this approach limits the efficiency of circuit board detection to some extent. In order to improve the detection efficiency, a mechanical device can be used to measure a circuit board. Therefore, when a mechanical device is used to measure a circuit board, how to determine measurement parameters to achieve accurate measurement of the circuit board is a problem that needs to be solved. SUMMARY

[0003] The present application provides a circuit board measurement method and device, an electronic device, and a computer readable storage medium, which can achieve accurate measurement of a circuit board by a mechanical device.

[0004] The technical solution of the present application embodiment is as follows:

[0005] In a first aspect, the present application provides a circuit board measurement method, comprising:

[0006] determining coordinate information of a measurement point on a circuit board;

[0007] determining a first angle set between a detection device and a component corresponding to the measurement point, the first angle set being used to represent an angle between the detection device and the first component; and determining a second angle set between the detection device and the circuit board, the second angle set being used to represent an angle between the detection device and the circuit board;

[0008] measuring an electronic signal on the circuit board based on the coordinate information, the first angle set, and the second angle set.

[0009] In the above solution, the determination of the first angle set between the detection device and the component corresponding to the measurement point, the first angle set being used to represent an angle between the detection device and the first component, comprises:

[0010] determining a first candidate angle set between the detection device and the component based on the coordinate information; wherein the first candidate angle set includes at least one first candidate angle;

[0011] traversing the first candidate angle set to determine a second candidate angle set between the detection device and the circuit board corresponding to the first candidate angle; wherein the second candidate angle set includes a second candidate angle corresponding to each first candidate angle in the first candidate angle set;

[0012] determining the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set; wherein the first angle set comprises a first angle corresponding to a second angle comprised in the second angle set one by one.

[0013] In the above scheme, the determination of the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set comprises:

[0014] traversing the second candidate angle set, if the detection device is blocked by a second component adjacent to the first component, updating the second candidate angle comprised in the second candidate angle set based on the coordinate information;

[0015] determining the second candidate angle set after traversal and update as the second angle set.

[0016] In the above scheme, if the detection device is blocked by a second component, the second candidate angle comprised in the second candidate angle set is updated based on the coordinate information, comprising:

[0017] determining the height of the second component;

[0018] determining the length between the coordinate information and the second component;

[0019] determining a third candidate angle based on the height of the second component and the length between the coordinate information and the second component;

[0020] updating the second candidate angle comprised in the second candidate angle set by using the intersection of the second candidate angle and the third candidate angle.

[0021] In the above scheme, the determination of the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set further comprises:

[0022] traversing the first candidate angle set, if there is no second candidate angle corresponding to the first candidate angle in the second candidate angle set, deleting the first candidate angle in the first candidate angle set;

[0023] determining the first candidate angle set after traversal and update as the first angle set.

[0024] In the above scheme, the determination of the coordinate information of the measurement point on the circuit board comprises:

[0025] determining a first offset of the measurement point relative to the center point of the pad, and a third angle information of a pin of the first component corresponding to the measurement point relative to the first component.

[0026] determine coordinate information of the measurement point on the circuit board based on the first offset, the third angle information and the angle information of the first component.

[0027] In the above solution, the determination of the coordinate information of the measurement point on the circuit board based on the first offset, the third angle information and the angle information of the first component comprises:

[0028] determining the actual offset of the measurement point relative to the center point of the pad in the first direction as the product of the value of the first direction in the first offset and the cosine value of the sum of the third angle information and the angle information of the first component;

[0029] determining the actual offset of the measurement point relative to the center point of the pad in the second direction as the product of the value of the first direction in the first offset and the sine value of the sum of the third angle information and the angle information of the first component;

[0030] determining the first direction coordinate information in the coordinate information of the measurement point as the sum of the actual offset of the first direction and the coordinate of the center point of the pad in the first direction;

[0031] determining the second direction coordinate information in the coordinate information of the measurement point as the sum of the actual offset of the second direction and the coordinate of the center point of the pad in the second direction.

[0032] In a second aspect, an embodiment of the present application provides a circuit board detection device, which comprises:

[0033] a coordinate generation module configured to determine coordinate information of a measurement point on a circuit board;

[0034] an angle determination module configured to determine a first angle set between the detection device and a component corresponding to the measurement point, the first angle set being used to represent an angle between the detection device and the first component, and to determine a second angle set between the detection device and the circuit board, the second angle set being used to represent an angle between the detection device and the circuit board;

[0035] a measurement module configured to measure an electronic signal on the circuit board based on the coordinate information, the first angle set and the second angle set.

[0036] In a third aspect, an embodiment of the present application provides an electronic device, which comprises:

[0037] a memory configured to store executable instructions;

[0038] Processor: for executing the executable instructions stored in the memory, realizing the above-mentioned circuit board measurement method.

[0039] In a fourth aspect, the present application provides a computer readable storage medium, which stores executable instructions for realizing the above-mentioned circuit board measurement method when executed by a processor.

[0040] The circuit board measurement method provided by the embodiments of the present application determines the coordinate information of the measurement point on the circuit board; determines a first angle set between the detection device and the component corresponding to the measurement point, the first angle set being used to represent the angle between the detection device and the first component; and determines a second angle set between the detection device and the circuit board, the second angle set being used to represent the angle between the detection device and the circuit board; and measures the electronic signal on the circuit board based on the coordinate information, the first angle set and the second angle set. In the embodiments of the present application, by determining the coordinate information of the detection device in the circuit board, the angle set between the detection device and the component corresponding to the coordinate information, and the angle set between the detection device and the circuit board, the mechanical equipment can accurately measure the circuit board instead of manual measurement, and compared with the manual measurement method, the measurement efficiency of the circuit board is greatly improved by using the mechanical equipment to measure the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0041] The above and other objects, features and advantages of the example embodiments of the present application will be more apparent from the following detailed description read in conjunction with the accompanying drawings, in which:

[0042] In the drawings, identical or corresponding reference numerals indicate identical or corresponding parts.

[0043] Figure 1 is an optional flowchart of the circuit board measurement method provided by the embodiments of the present application;

[0044] Figure 2 is a side view measurement schematic diagram of the detection device provided by the embodiments of the present application;

[0045] Figure 3 is a top view measurement schematic diagram of the detection device provided by the embodiments of the present application;

[0046] Figure 4 is a top view of the angle between the detection device and the component provided by the embodiments of the present application;

[0047] Figure 5 is a side view of the angle between the detection device and the mainboard when the detection device is blocked by the adjacent second component provided by the embodiments of the present application;

[0048] Figure 6 is a structural schematic diagram of a circuit board detection device provided by an embodiment of the present application.

[0049] Figure 7 is a 3D model visualization schematic diagram of a circuit board component provided by an embodiment of the present application. DETAILED DESCRIPTION

[0050] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings, and the described embodiments should not be regarded as limiting the present application, and all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0051] In the following description, "some embodiments" are described, which describe a subset of all possible embodiments, but it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0052] In the following description, the terms "first\second" are only to distinguish similar objects, and do not represent a specific order of the objects, and it can be understood that "first\second" can be interchanged in a specific order or sequence as allowed, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used herein are only for the purpose of describing the embodiments of the present application, and are not intended to limit the present application.

[0054] An optional processing flow schematic diagram of the circuit board measurement method provided by an embodiment of the present application is described below, which is shown in Figure 1 The steps S101-S103 shown will be described. Figure 1

[0055] Step S101, determining the coordinate information of the measurement point on the circuit board.

[0056] In some embodiments, the coordinate offset information of the measurement point relative to the center point of the pad on the circuit board is obtained. Wherein, the measurement point is a point at which the detection device can stably measure the electronic signal of the circuit board.

[0057] ​As an example, when an electronic signal measurement is performed on a circuit board by using a detection device, a measurement point that can be measured stably is first determined on the circuit board. The detection device can be a probe stick, a probe, a mechanical arm, etc. Since a component is welded on the pad where the measurement point is located, the detection device cannot directly test the center position of the pad in actual testing, and the actual measurement point will have a certain offset from the center position of the pad. At the same time, since solder exists on the pad, the solder has a certain curvature, in order to avoid the detection device from sliding on the position of the measurement point and being unable to measure stably, the detection device can maintain a certain angle with the corresponding component in actual testing; at the same time, the detection device and the circuit board also need to maintain a certain angle, and the angle between the detection device and the circuit board cannot be too small, so as to avoid the detection device from touching the adjacent component when measuring.

[0058] As an example, when the measurement point is determined, the measurement point should be as close to the component as possible, and the angle between the detection device and the circuit board is close to 90°, which is the best. After the measurement point is determined, the direction of the pad is defined according to the 0° direction of the first component corresponding to the measurement point on the circuit board, and the coordinate offset information of the measurement point from the center point of the pad in the 0° direction of the first component is determined. As an example, Figure 2 、 Figure 3 is a measurement schematic diagram of a component on a circuit board, the component is a 0402 capacitor, and the pad type is ROX22. Among them, Figure 2 is a detection device side measurement schematic diagram, where angle C is the angle between the detection device and the main board, Figure 3 is a top view of the detection device measurement schematic diagram, where angle D is the angle between the detection device and the component. Through measurement, the coordinate offset information of the pad measurement point from the center point of the pad is (5, 15) (unit: mil)

[0059] The angle value of each pin of the first component corresponding to the measurement point relative to the direction of the first component is recorded.

[0060] For the first component, a component spatial data model is established. The specific process of establishing the component spatial data model includes: obtaining the specific structural size of the first component, taking the center point of the pad corresponding to the first pin of the first component as the origin, and taking the component angle value according to the 0° direction of the component on the circuit board to establish the component spatial data model. The first pin is the pin with a label of 1 of the first component. Specifically, the specific structural size of the first component can be obtained through the datasheet of the component. In the first component spatial data model, the coordinates of the center point of the pad corresponding to the first pin of the first component are taken as the origin. The coordinates of the origin can include information in three directions. For example, the origin coordinates can be (0, 0, 0). Further, the establishment method of the spatial data model of any component on the circuit board is the same as in this embodiment.

[0061] For the first component, a 0° direction is defined on the circuit board, and the angle value of the first component relative to the 0° direction of the circuit board is obtained, that is, the angle information of the first component. Specifically, the coordinate value of the pad center point corresponding to the measurement point, the first component position number, the first component model number, and the pin serial number of the first component corresponding to the measurement point can be determined. The component report file is derived from the layout file, and the angle information of the first component is determined by taking the recorded first component position number as the index.

[0062] In some embodiments, based on the above-obtained coordinate offset information, the angle value of the pin of the first component corresponding to the measurement point relative to the 0° direction of the first component, and the angle information of the first component, the coordinate information of the measurement point is determined. The coordinate information of the measurement point includes the first direction coordinate information and the second direction coordinate information of the measurement point.

[0063] In some embodiments, the specific implementation process of determining the first direction coordinate information of the component corresponding to the measurement point is: the sum of the actual offset value of the coordinate offset information in the first direction and the coordinates of the pad center point in the first direction.

[0064] The actual offset value of the first direction is specifically: the product of the cosine value of the sum of the value of the coordinate offset information in the X-axis direction and the angle value of the first component corresponding to the pin of the measurement point relative to the 0° direction of the first component.

[0065] As an example, if the coordinate of the pad center point is (a, b), the value of the coordinate offset information of the measurement point in the X-axis direction is c, the angle information of the first component is specifically 45°, and the angle value of the pin of the first component corresponding to the measurement point relative to the 0° direction of the first component is 0°, then the actual offset value of the measurement point in the X-axis direction is c1 = c*cos(45°+0°), and the coordinate value of the measurement point in the X-axis direction is X = a+c1.

[0066] In some embodiments, the specific implementation process of determining the second directional coordinate information of the component corresponding to the measurement point is: the sum of the actual offset value of the coordinate offset information in the first direction and the coordinate of the pad center point in the Y-axis direction.

[0067] The actual offset value in the second direction is specifically: the product of the value of the coordinate offset information in the X-axis direction and the sine value of the sum of the angle value of the pin of the first component corresponding to the measurement point relative to the direction of the first component and the angle information of the first component.

[0068] As an example, if the coordinate of the pad center point is (a, b), the value of the coordinate offset information of the measurement point in the X-axis direction is c, the directional angle value of the first component is 45°, and the angle value of the pin of the first component corresponding to the measurement point relative to the 0° direction of the first component is 0°, then the actual offset value of the measurement point in the Y-axis direction is d1 = c*sin(45°+0°), and the coordinate value of the measurement point in the Y-axis direction is Y = b+d1.

[0069] Step S102, determining a first angle set between the detection device and the component corresponding to the measurement point, the first angle set being used to represent the angle between the detection device and the first component; and determining a second angle set between the detection device and the circuit board, the second angle set being used to represent the angle between the detection device and the circuit board.

[0070] In some embodiments, the entire circuit board component 3D data model is established. The specific process of establishing the entire circuit board component 3D data model is: exporting the component pin report file (Symbol PinReport) and the component report file from the layout file, taking the pad center point coordinate corresponding to the first pin of the component as the index, and matching the data with the above-mentioned component data model to establish the entire circuit board component 3D data model. The field types contained in the circuit board component 3D data model can be: component position number, pin serial number, component model, pad center point coordinate, etc. Figure 7 The visualization diagram of the circuit board component 3D data model.

[0071] In some embodiments, the specific process of determining the first candidate angle set is that when the detection device is placed at the measurement point for stable measurement, there is a certain angle between the detection device and the first component corresponding to the detection device, and the angle can be one or more. The angle between the detection device and the first component can represent the first candidate angle set. At the same time, each candidate angle in the first candidate angle set is sequentially sorted in ascending order. Wherein, the angle between the detection device and the first component is specifically the angle between the detection device and the 0° direction of the first component.

[0072] As an example, the angle between the detection device and the component is an angle in the interval (-180°, 180°), and the angle interval is split according to actual needs, for example, split into 720 angle values, and the first candidate angle set saves all 720 angles split according to actual needs.

[0073] For each angle information in the first candidate angle set, determine the angle information in the second candidate angle set. Wherein, each candidate angle information in the second candidate angle set represents the angle between the detection device and the circuit board, and the candidate angle information in the first candidate angle one-to-one corresponds to the candidate angle information in the second candidate angle set.

[0074] As an example, 20° in the first candidate angle set corresponds to the candidate angle information in the second candidate angle set as the angle between the interval [30°, 85°], and 20.5° in the first candidate angle set corresponds to the candidate angle information in the second candidate angle set as the angle between the interval [30°, 85°]. Wherein, each angle information in the first candidate angle set and the second candidate angle set is a one-to-one correspondence, and each candidate angle in the first candidate angle set corresponds to an angle interval in the second candidate angle set.

[0075] As an example, Table 1 shows the partial correspondence between the coordinate offset information of the measurement point and the candidate angle information on the circuit board with the first component type 0402 capacitor and the pad type ROX22. Wherein, the information in set B in Table 1 represents the angle in the first candidate angle set (the angles in set B increase by 0.5° in turn), and the maximum and minimum values of angle A in Table 1 represent the angle information in the second candidate angle.

[0076]

[0077]

[0078] Table 1

[0079] In some embodiments, the first angle set and the second angle set are determined based on the first candidate angle set and the second candidate angle set. The first angle set and the second angle set are angles that can be measured at the measurement point and are not blocked by the adjacent components.

[0080] As an example, in order to avoid the detection device being blocked by the adjacent components during measurement, the angle information of the detection device that is not blocked by the adjacent components is selected from the first candidate angle set and the second candidate angle set, respectively, and is determined as the first angle set and the second angle set. The angle information in the first angle set and the angle in the second angle set are in one-to-one correspondence.

[0081] In some embodiments, the process of determining the second angle set is as follows: first, each candidate angle in the second candidate angle set is traversed in sequence, and the corresponding angle information in the first candidate angle set is determined, i.e., the angle between the detection device corresponding to the candidate angle and the first component is determined. Second, the detection device is extended in the direction of the angle between the detection device and the first component, and it is judged whether the extended detection device is blocked by the adjacent components of the first component by using the circuit board component 3D data model established above. If the detection device is blocked, the candidate angle needs to be determined again, and the second candidate angle set needs to be updated. The second candidate angle set that is traversed and updated is determined as the second angle set.

[0082] As an example, in combination with Figure 4 and Figure 5 wherein, Figure 4 is a top view of the angle between the detection device and the component, Figure 5 is a side view of the angle between the detection device and the mainboard when the detection device is blocked by the adjacent second component. If the angle between the detection device and the first component is angle B, at this time, the second candidate angle in the second candidate set corresponding to angle B is A, A is an angle interval, if the detection device is extended in the direction of angle B, in the circuit board component 3D data model, the detection device will be blocked by the adjacent second component, the height of the second component that blocks the detection device is H, the coordinate information of the measurement point is (X, Y), the length from the coordinate of the first measurement point to the second component is L, the calculation method of L is as follows: 2 = (X1-X) 2 -(Y1-Y) 2The angle calculation formula is D=arctan(H / L), the third candidate angle information corresponding to the second candidate angle is confirmed as [90°-D, 90°], the intersection of the candidate second angle and the corresponding third candidate angle information is taken as α=A∩[90°-D, 90°], the second candidate angle α corresponding to the first candidate angle B is obtained, and A in the second candidate angle set is updated as α. The second candidate angle set that is traversed and updated is determined as the second angle set.

[0083] In some embodiments, the process of determining the first angle set is as follows: each candidate angle in the first candidate angle set is traversed in turn, the corresponding angle information in the second angle set is determined, if the corresponding angle information is empty, it means that the detection device is in this candidate angle, and the detection device will be blocked by the adjacent component, so this candidate angle is deleted from the first candidate angle set. The first candidate angle set that is traversed and updated is determined as the first angle set.

[0084] In step S103, the electronic signal on the circuit board is measured based on the coordinate information, the first angle set and the second angle set.

[0085] In this embodiment, the coordinate information of the actual measurement point on the circuit board obtained in steps S101 and S102, the angle set between the detection device and the component corresponding to the coordinate information, and the angle set between the detection device and the circuit board are taken as the parameter information of the circuit board measurement. The detection device measures the electronic signal on the circuit board based on the parameter information, so as to realize automatic detection of the electronic signal on the circuit board by the mechanical equipment (which can also be called the detection device) instead of manual detection. The angle information in the angle set between the detection device and the component corresponds to the angle information in the angle set between the detection device and the circuit board one by one.

[0086] The structure of a circuit board detection device provided in an embodiment of the present application is described below. The structure of the circuit board detection device provided in the embodiment of the present application is described below. Figure 6 The circuit board detection device provided in the embodiment is specifically described.

[0087] Referring to Figure 6 , Figure 6 is a structure diagram of a circuit board detection device provided in an embodiment of the present application. The circuit board detection device can determine three corresponding sets of parameter information required for the measurement of the circuit board: measurement point coordinate information, an angle between the detection device and a first component corresponding to the measurement point, and an angle between the detection device and the circuit board. By determining the parameter information of the circuit board detection device, the accurate measurement of the circuit board by the mechanical equipment instead of manual measurement can be realized, and the measurement efficiency of the circuit board is improved.

[0088] In the circuit board detection device, the input module 601 is used for automatically or manually inputting the center point coordinates (a, b) of the pad corresponding to the measurement point, the component bit number to which the pad belongs, the component model to which the pad belongs, and the pin serial number on the component corresponding to the measurement point.

[0089] The component direction generation module 602 combines the automatically or manually input information and the component report file in the layout file to determine the angle information of the component corresponding to the measurement point by taking the component model in the input information as an index and export to the coordinate generation module 603.

[0090] The coordinate generation module 603 determines the coordinate information of the measurement point according to the coordinate offset data, the component original data, and the angle information of the component output by the component direction generation module 602.

[0091] The specific process of the coordinate information is as follows: first, the component original data is obtained. The original data includes the coordinate offset data of the measurement point and the pad center point, the first candidate angle set between the detection device and the first component, and the second candidate angle set between the detection device and the circuit board. The coordinate offset data can be determined by manual measurement and calculation. Secondly, the component original data model is obtained according to the structure size in the datasheet of the component. The origin coordinate (0, 0, 0) is the pad coordinate of the first pin of the component, the component angle is valued according to the 0° direction of the component on the circuit board, and the component space data model is established. Then, the coordinate generation module 603 obtains the coordinate offset data, the angle information of the first component, and the direction angle of the pin of the first component relative to the component based on the above process to calculate the coordinate information of the measurement point on the circuit board.

[0092] The 3D data model establishment module 604 imports the component pin report file and the component report file from the layout file to index the pad center point coordinates of each first pin of the component, matches the data with the component space data model obtained above, and establishes the 3D data model of the entire mainboard component. The main fields in the 3D data model are: the bit number of the component, the pin serial number, the component model, the pad center point coordinates, etc.

[0093] The angle determination module 605 determines the first angle set between the detection device and the first component and the second angle set between the detection device and the circuit board based on the above 3D data model, the component original data, the coordinate information of the measurement point on the circuit board, and the angle of the detection device being blocked by the adjacent components in any direction. The angle information in the two angle sets is in a one-to-one correspondence.

[0094] The measurement module 606 outputs the coordinate information of the measurement point on the circuit board, the first angle set between the detection device and the first component, and the second angle set between the detection device and the circuit board as measurement parameters of the circuit board to the mechanical equipment, so as to realize accurate measurement of the circuit board by the mechanical equipment.

[0095] It should be noted that the description of the device of the embodiments of the present application is similar to the description of the above method embodiments, has similar beneficial effects as the method embodiments, and therefore will not be described again. For technical details not described in the circuit board detection device provided by the embodiments of the present application, they can be understood according to the description of any one of the accompanying drawings. Figures 1 to 5

[0096] The embodiments of the present application provide a computer readable storage medium storing executable instructions, wherein the executable instructions are stored, and when the executable instructions are executed by a processor, the processor will execute the circuit board measurement method provided by the embodiments of the present application.

[0097] In some embodiments, the computer readable storage medium can be a memory such as FRAM, ROM, PROM, EPROM, EEPROM, flash memory, magnetic surface memory, optical disc, or CD-ROM; or various devices including one or any combination of the above memories.

[0098] In some embodiments, the executable instructions can be in the form of programs, software, software modules, scripts or codes, written in any form of programming language (including compiled or interpreted languages, or declarative or procedural languages), and can be deployed in any form, including being deployed as independent programs or as modules, components, subroutines or other units suitable for use in a computing environment.

[0099] As an example, the executable instructions can be deployed to execute on one computing device, or on multiple computing devices located in one place, or on multiple computing devices distributed in multiple places and interconnected through a communication network.

[0100] The present application is described with reference to flowcharts and / or block diagrams according to the method, device (system) and computer program product of the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general purpose computer, a special purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device produce a device that implements the flowcharts and / or block diagrams. Figure 1 one flow or multiple flows and / or blocks Figure 1 ​means for performing the function specified by the block or blocks.

[0101] These computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture including instructions which implement the flow Figure 1 flow or flows and / or blocks Figure 1 means for performing the function specified by the block or blocks.

[0102] It should be understood that, in various embodiments of the present application, the sequence number of each implementation procedure does not mean the execution order, and the execution order of each procedure should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation procedures of the embodiments of the present application.

[0103] The above merely describes the embodiments of the present application, and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement and improvement made within the spirit and scope of the present application shall be included in the protection scope of the present application.

Claims

1. A method of measuring a circuit board, characterized by, The method comprises: determining coordinate information of a measurement point on a circuit board; determining a first angle set between the detection device and the component corresponding to the measurement point, the first angle set being used to represent the angle between the detection device and the first component; and determining a second angle set between the detection device and the circuit board, the second angle set being used to represent the angle between the detection device and the circuit board; measuring an electronic signal on the circuit board based on the coordinate information, the first angle set and the second angle set; wherein the determination of the first angle set between the detection device and the component corresponding to the measurement point, the first angle set being used to represent the angle between the detection device and the first component, comprises: determining a first candidate angle set between the detection device and the component based on the coordinate information; wherein the first candidate angle set comprises at least one first candidate angle; traversing the first candidate angle set to determine a second candidate angle set between the detection device and the circuit board corresponding to the first candidate angle; wherein the second candidate angle set comprises a second candidate angle corresponding to each first candidate angle in the first candidate angle set; determining the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set; wherein the first angle set comprises a first angle corresponding to each second angle in the second angle set; wherein the determination of the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set comprises: traversing the second candidate angle set, and if the detection device is blocked by a second component adjacent to the first component, updating the second candidate angle in the second candidate angle set based on the coordinate information; determining the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set; wherein the first angle set comprises a first angle corresponding to each second angle in the second angle set; 2. The method of claim 1, wherein, wherein the updating of the second candidate angle in the second candidate angle set based on the coordinate information if the detection device is blocked by a second component comprises: determining the height of the second component; determining the length between the coordinate information and the second component; determining a third candidate angle based on the height of the second component and the length between the coordinate information and the second component; updating the second candidate angle in the second candidate angle set using the intersection of the second candidate angle and the third candidate angle.

3. The method of claim 1, wherein, The determination of the first angle and the second angle according to the first candidate angle and the second candidate angle further comprises: traversing the first candidate angle set, and if there is no second candidate angle corresponding to the first candidate angle in the second candidate angle set, deleting the first candidate angle in the first candidate angle set; determining the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set; wherein the first angle set comprises a first angle corresponding to each second angle in the second angle set; 4. The method of claim 1, wherein, determining the first angle set and the second angle set according to the first candidate angle set and the second candidate angle set; wherein the first angle set comprises a first angle corresponding to each second angle in the second angle set; determining a first offset of the measurement point relative to a center point of the pad, and third angle information of a pin corresponding to the measurement point relative to the first component; determining coordinate information of the measurement point on the circuit board based on the first offset, the third angle information, and angle information of the first component.

5. The method of claim 4, wherein, The determination of the coordinate information of the measurement point on the circuit board based on the first offset, the third angle information, and the angle information of the first component comprises: determining an actual offset of the measurement point relative to the center point of the pad in a first direction as a product of a value of the first offset in the first direction and a cosine value of a sum of the third angle information and the angle information of the first component; determining an actual offset of the measurement point relative to the center point of the pad in a second direction as a product of a value of the first offset in the first direction and a sine value of a sum of the third angle information and the angle information of the first component; determining first direction coordinate information in the coordinate information of the measurement point as a sum of the actual offset in the first direction and a coordinate of the center point of the pad in the first direction; determining second direction coordinate information in the coordinate information of the measurement point as a sum of the actual offset in the second direction and a coordinate of the center point of the pad in the second direction.

6. A circuit board inspection apparatus characterized by comprising: The circuit board detection device comprises: a coordinate generation module configured to determine coordinate information of a measurement point on a circuit board; an angle determination module configured to determine a first angle set between a detection device and a component corresponding to the measurement point, the first angle set being used to represent an angle between the detection device and a direction of the first component, and to determine a second angle set between the detection device and the circuit board, the second angle set being used to represent an angle between the detection device and the circuit board; a measurement module configured to measure an electronic signal on the circuit board based on the coordinate information, the first angle set, and the second angle set. The angle determination module is configured to determine a first candidate angle set between the detection device and the component based on the coordinate information, the first candidate angle set comprising at least one first candidate angle; to traverse the first candidate angle set to determine a second candidate angle set between the detection device and the circuit board corresponding to the first candidate angle, the second candidate angle set comprising a second candidate angle corresponding to each first candidate angle in the first candidate angle set; and to determine the first angle set and the second angle set based on the first candidate angle set and the second candidate angle set, the first angle set comprising a first angle corresponding to each second angle in the second angle set. The determination of the first angle set and the second angle set based on the first candidate angle set and the second candidate angle set comprises: traversing the second candidate angle set, and updating a second candidate angle in the second candidate angle set based on the coordinate information if the detection device is blocked by a second component adjacent to the first component. The second candidate angle set after traversal and update is determined as the second angle set.

7. An electronic device, comprising: Comprise: Memory: for storing executable instructions; Processor: for executing the executable instructions stored in the memory, realizing the circuit board measurement method in any one of claims 1-5.

8. A computer storable medium, characterized by Executable instructions are stored, and when executed by a processor, the circuit board measurement method in any one of claims 1-5 is realized.

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