A method for distinguishing package chip PAD and substrate gold finger schematic diagram based on LISP

Abstract

The invention discloses a method for distinguishing a packaged chip PAD and a substrate gold finger schematic diagram based on LISP, belongs to the field of computer program processing, and comprises the following steps: S1: writing CAD-LISP language, establishing a polyline selection set for drawings in a packaged chip process; S2: establishing a straight line selection set; S3: calculating the number of intersections of different sets, locating the coordinates of all intersections; S4: screening out PADs and gold fingers that do not have intersections with welding wires, and filling them; S5: outputting a LISP command with a suffix of .lsp, opening a CAD software to execute the LISP command; S6: box-selecting the entire diagram, inputting a LISP command, and completing the distinction between PADs without welding wires and gold fingers. Combined with the LISP secondary development language in the CAD software, a filling method is used to distinguish PADs and gold fingers, and mistakes such as wrong filling and missing filling will not occur, and the work efficiency is very high; it has strong adaptability and compatibility, and solves the defect that each PAD and gold finger need to be selected by human eye observation.

Description

Technical Field

[0001] The present invention relates to the technical field of computer program processing, and in particular to a method for distinguishing a packaged chip PAD and a substrate gold finger schematic diagram based on LISP. Background Art

[0002] Chips have dozens to thousands of PADs depending on their type, and the substrate also has corresponding multiple gold fingers. When the wire bonding diagram is exported from Cadence or other design software to CAD format, all PADs and gold fingers are in an unfilled state.

[0003] In order to facilitate actual production and ensure that the wire bonding diagram corresponds to the actual object, it is necessary to fill and mark the unbonded PAD and gold finger. In the actual filling operation, manual selection of filling by manual visual inspection will lead to problems such as wrong filling and missing filling, and the error probability is high.

[0004] In the actual production process, in order to ensure that the wire bonding diagram corresponds to the actual object, the PADs and gold fingers that are not actually bonded need to be filled and marked in CAD for production.

[0005] The existing technical solution is to observe the unsoldered PADs and gold fingers manually, select all manually and then fill them in. The existing operation process is cumbersome. It is difficult to select the unsoldered PADs and gold fingers from dozens to thousands of them. It is easy to have problems such as missing or wrong filling, which affects the delivery time of the drawings and even causes product errors. Even if very experienced engineers come to design, they cannot guarantee 100% accuracy after the design is completed, and other personnel need to be arranged for re-inspection. Summary of the invention

[0006] The purpose of the present invention is to solve the defects in the prior art and propose a method for distinguishing the package chip PAD and the substrate gold finger schematic diagram based on LISP.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] A method for distinguishing a package chip PAD and a substrate gold finger schematic diagram based on LISP, comprising the following steps:

[0009] S1: Write CAD-LISP language to create a polyline selection set for the drawings in the chip packaging process;

[0010] S2: Create a straight line selection set;

[0011] S3: Calculate the number of intersections of different sets and locate the coordinates of all intersections;

[0012] S4: Screen out the PADs and gold fingers that have no intersections with the welding wires and fill them;

[0013] S5: Output LISP command with suffix .lsp, open CAD software and execute LISP command;

[0014] S6: Select the entire image and enter the LISP command to distinguish between the PAD without solder wires and the gold finger.

[0015] Furthermore, in step S1, the CAD-LISP language is written to establish a polyline selection set for the drawings in the chip packaging process, which includes PADs and gold fingers.

[0016] Furthermore, in step S2, the establishment of the straight line selection set is mainly for welding line objects.

[0017] Further, in step S3, the step of using different selection set intersections and locating the coordinates of all intersections is used to distinguish whether there is a welding wire.

[0018] Furthermore, in step S5, the CAD software is any adapted CAD software that is compatible with the LISP language, including but not limited to AutoCAD and Haochen CAD.

[0019] Furthermore, in step S6, when automatically searching for PADs and gold fingers without solder wires, whether to fill them is determined by judging the status of the solder wires on the PADs and gold fingers.

[0020] Furthermore, in step S6, after the LISP command is input, all objects are selected at once for automatic filling, and the PAD without solder wires and the gold finger are distinguished by filling.

[0021] Compared with the prior art, the beneficial effects of the present invention are: combining the LISP secondary development language in the CAD software, determining whether to fill by judging the state of the solder wires on the PAD and the gold finger;

[0022] After entering the command, you can select all objects at once to achieve automatic filling. Use the filling method to distinguish PAD and gold fingers, and there will be no mistakes such as wrong filling and missing filling, and the work efficiency is very high;

[0023] In addition, the LISP language is compatible with a variety of CAD software, such as AutoCAD, Haochen CAD, etc. It can be used directly in multiple CAD software. It has strong adaptability and compatibility, and solves the defect that each PAD and gold finger needs to be selected by human visual observation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0025] Figure 1 A flowchart of the steps of the method for distinguishing the package chip PAD and the substrate gold finger schematic diagram based on LISP proposed by the present invention;

[0026] Figure 2 It is a logic diagram of the method for distinguishing the package chip PAD and the substrate gold finger schematic diagram based on LISP proposed by the present invention;

[0027] Figure 3 A schematic diagram of a packaged chip, a PAD, and gold fingers of a substrate provided in an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of a PAD without a wire bond and a gold finger in an unfilled state according to an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of a PAD without a wire bonded to it and a gold finger in a filled state according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] Reference Figure 1-2 , a method for distinguishing a package chip PAD and a substrate gold finger schematic diagram based on LISP, comprising the following steps:

[0032] S1: Write CAD-LISP language to create a polyline selection set for the drawings in the chip packaging process;

[0033] S2: Create a straight line selection set;

[0034] S3: Calculate the number of intersections of different sets and locate the coordinates of all intersections;

[0035] S4: Screen out the PADs and gold fingers that have no intersections with the welding wires and fill them;

[0036] Specifically, the CAD software program automatically determines whether there are welding wires on the PAD and the gold finger, and automatically fills them.

[0037] S5: Output LISP command with suffix .lsp, open CAD software and execute LISP command;

[0038] S6: Select the entire image and enter the LISP command to distinguish between the PAD without solder wires and the gold finger.

[0039] Reference Figure 3-4In a specific embodiment of the present application, in step S1, the CAD-LISP language is written to establish a polyline selection set for the drawings in the chip packaging process, wherein the polyline selection set includes PAD and gold fingers.

[0040] Specifically, the LISP language is used to simplify the drawing processing in the chip packaging process.

[0041] In a specific embodiment of the present application, in step S2, the establishment of the straight line selection set is mainly for welding line objects.

[0042] In a specific embodiment of the present application, in step S3, the step of using different selection set intersections and locating the coordinates of all intersections is used to distinguish whether there is a welding wire.

[0043] In a specific embodiment of the present application, in step S5, the CAD software is any adapted CAD software that is compatible with the LISP language, including but not limited to AutoCAD and Haochen CAD.

[0044] Specifically, LISP language commands can be directly used in multiple CAD software, and LISP language commands can be directly opened using CAD software.

[0045] Reference Figure 5 In a specific embodiment of the present application, in step S6, when automatically searching for a PAD and a gold finger without a solder wire, whether to fill the PAD and the gold finger is determined by judging the solder wire status on the PAD and the gold finger;

[0046] After entering the LISP command, all objects are selected at once for automatic filling, and the pads without solder wires and gold fingers are distinguished through filling.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for distinguishing packaged chip PAD and substrate gold finger schematic diagram based on LISP, characterized in that: The following steps are involved: S1: Write CAD-LISP language to create a polyline selection set for the drawings in the chip packaging process; S2: Create a straight line selection set; S3: Calculate the number of intersections of different sets and locate the coordinates of all intersections; S4: Screen out the PADs and gold fingers that have no intersections with the welding wires and fill them; S5: Output LISP command with suffix .lsp, open CAD software and execute LISP command; S6: Select the entire image and enter the LISP command to distinguish between the PAD without solder wires and the gold finger; In step S1, the CAD-LISP language is written to establish a polyline selection set for the drawings in the chip packaging process, which includes PAD and gold finger; In step S2, the establishment of the straight line selection set is for the welding line object; In step S3, using different selection set intersections, the step of locating the coordinates of all intersections is used to distinguish whether there is a weld wire; In step S5, the CAD software is any CAD software compatible with the LISP language, including AutoCAD and Haochen CAD; In step S6, when automatically searching for PADs and gold fingers without solder wires, whether to fill them is determined by judging the solder wire status on the PADs and gold fingers; In step S6, after the LISP command is input, all objects are selected at once for automatic filling, and the pads without solder wires and gold fingers are distinguished by filling.

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