Medium heat dissipation structure and electronic device

Abstract

The embodiment of the application discloses a medium heat dissipation structure and electronic equipment, relates to the technical field of electronic equipment, and solves the shock absorption and noise reduction problem of the medium heat dissipation structure. The medium heat dissipation structure comprises a support, a sound absorption layer and a gas barrier layer. The support comprises an outermost baffle on the leeward side, and the baffle is used for blocking the outflow of gas from the baffle. The sound absorption layer is at least one and is made of sound absorption material. The sound absorption layer is arranged on the windward side of the baffle, and the outermost windward side of the support must be provided with a sound absorption layer. The gas barrier layer is at least one, and the gas barrier layer is surrounded by the support and the sound absorption layer. The gas barrier layer contains gas. The medium heat dissipation structure of the application is used for heat dissipation, shock absorption and noise reduction in the electronic equipment.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic equipment, and in particular, relate to a medium heat dissipation structure and an electronic equipment. BACKGROUND

[0002] In an electronic equipment, the operation of components generates continuous heat, and the internal part of the electronic equipment needs to be continuously cooled to ensure normal operation of the electronic equipment. At present, most of the heat dissipation adopts the air cooling mode, that is, a fan is used to generate convection air in the internal part of the electronic equipment to carry away heat. However, the fan generates vibration and airflow noise when it works, which affects the performance of the electronic equipment.

[0003] In the related art, in order to reduce vibration and noise, sound-absorbing cotton for heat dissipation and shock absorption is generally arranged between the fan and related components. In order to achieve better shock absorption and noise absorption effect, the thickness of the sound-absorbing cotton needs to be large in area and thickness, which inevitably increases the cost and is not conducive to the layout and overall heat dissipation of the structure. SUMMARY

[0004] Embodiments of the present application provide a medium heat dissipation structure and an electronic equipment, which can improve the shock absorption and noise absorption effect of the heat dissipation structure, facilitate the layout, and not affect the overall heat dissipation.

[0005] In a first aspect, embodiments of the present application provide a medium heat dissipation structure, comprising a support, a sound-absorbing layer, and a gas barrier layer. The support comprises an outermost baffle on the leeward side, and the baffle is used to block the outflow of gas from the baffle. The sound-absorbing layer is at least one and is made of sound-absorbing material. The sound-absorbing layer is arranged on the windward side of the baffle, and the outermost windward side of the support must be provided with a sound-absorbing layer. The gas barrier layer is at least one, and the gas barrier layer is surrounded by the support and the sound-absorbing layer. The gas barrier layer contains gas.

[0006] The medium heat dissipation structure provided by the embodiment of the present application comprises a support, and an acoustic absorption layer and a gas separation layer are arranged on the support, wherein the acoustic absorption layer is made of acoustic absorption material and can be one layer or multiple layers, the support and the acoustic absorption layer can enclose the gas separation layer, and the gas separation layer can be one layer or multiple layers. Moreover, the outermost side of the windward side of the support is necessarily provided with an acoustic absorption layer, and then the gas separation layer is at least on the leeward side of the acoustic absorption layer. In this way, after the airflow passes through the acoustic absorption layer and then enters the gas separation layer, the airflow is changed by the gas separation layer, and especially the support comprises a baffle on the outermost side of the leeward side, which can prevent the airflow from being directly transmitted to the direct leeward side and can only flow out from both ends of the baffle. In this way, the airflow noise can be effectively reduced, and the damping effect is achieved. In addition, through experimental comparison with the related art, it is verified that the damping and noise reduction effects are enhanced. Meanwhile, compared with the related art, the medium heat dissipation structure provided by the embodiment of the present application can achieve the damping and noise reduction effects without increasing the thickness of the acoustic absorption layer, so that the cost is not increased, the layout is convenient, the overall heat dissipation is slightly affected, and the like.

[0007] In a possible implementation manner of the present application, the support comprises a connecting plate, the connecting plate extends along the air inlet direction, and the connecting plate encloses a structure of the gas separation layer along a periphery of the gas separation layer in the air inlet direction.

[0008] In a possible implementation manner of the present application, the connecting plate is provided with a plurality of air outlet holes, and the plurality of air outlet holes are arrayed on the connecting plate.

[0009] In a possible implementation manner of the present application, the connecting plate comprises an air outlet section and a blocking section, the air outlet hole is arranged in the air outlet section, and the blocking section is located at one end of the connecting plate close to the leeward side.

[0010] In a possible implementation manner of the present application, the air outlet section and the blocking section are both arranged around the gas separation layer along the periphery of the gas separation layer in the air inlet direction, and the width of the blocking section in the air inlet direction is less than or equal to 75% of the width of the connecting plate in the air inlet direction.

[0011] In a possible implementation manner of the present application, the air outlet section and the blocking section are arranged on opposite sides of the gas separation layer in the air inlet direction, and the width of the air outlet section and the blocking section arranged oppositely in the air inlet direction is equal to the width of the connecting plate in the air inlet direction.

[0012] In a possible implementation manner of the present application, the connecting plate has an extension part, and the extension part is telescopic in the air inlet direction to change the width of the connecting plate in the air inlet direction.

[0013] In a possible implementation manner of the present application, the thickness of the gas separation layer in the air inlet direction is 5-50 cm.

[0014] In a possible implementation of the present application, the sound-absorbing layer and the gas barrier layer are one, the sound-absorbing layer is arranged at the outermost side of the windward side of the support, the baffle is arranged in a spaced manner with the sound-absorbing layer, and the gap surrounded by the support and the sound-absorbing layer is the gas barrier layer.

[0015] In a possible implementation of the present application, the sound-absorbing layer and the gas barrier layer are one, the sound-absorbing layer is arranged at the outermost side of the windward side of the support, the baffle is arranged in a spaced manner with the sound-absorbing layer, and the gap surrounded by the support and the sound-absorbing layer is the gas barrier layer.

[0016] In a possible implementation of the present application, the sound-absorbing layer and the gas barrier layer are one, the sound-absorbing layer is arranged at the outermost side of the windward side of the support, the baffle is arranged in a spaced manner with the sound-absorbing layer, and the gap surrounded by the support and the sound-absorbing layer is the gas barrier layer.

[0017] The electronic device provided by the embodiments of the present application can give good logic to the rotation shaft switching of the rotation shaft assembly, adapt to the flipping operation, and prevent the occurrence of component damage. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A structural schematic diagram of the electronic device provided by the embodiments of the present application is shown in FIG. 1.

[0019] Figure 2 A structural schematic diagram of the first implementation of the medium heat dissipation structure provided by the embodiments of the present application is shown in FIG. 2.

[0020] Figure 3 A structural schematic diagram of the second implementation of the medium heat dissipation structure provided by the embodiments of the present application is shown in FIG. 3.

[0021] Figure 4 A structural schematic diagram of the support of the medium heat dissipation structure provided by the embodiments of the present application is shown in FIG. 4.

[0022] Figure 5 A structural schematic diagram of the support of the medium heat dissipation structure provided by the embodiments of the present application is shown in FIG. 4.

[0023] Figure 6 A structural schematic diagram of the support of the medium heat dissipation structure provided by the embodiments of the present application is shown in FIG. 4.

[0024] Figure 7 A structural schematic diagram of the support of the medium heat dissipation structure provided by the embodiments of the present application is shown in FIG. 4.

[0025] Figure 8 Structure diagram of the plurality of grooves on the bracket of the medium heat dissipation structure provided by the embodiment of the present application;

[0026] Figure 9 The exploded structure diagram of the medium heat dissipation structure provided by the embodiment of the present application; Figure 6

[0027] Figure 10 The bracket of the medium heat dissipation structure provided by the embodiment of the present application is shown in the perspective structure section diagram;

[0028] Figure 11 The sound-absorbing cotton of the medium heat dissipation structure provided by the embodiment of the present application is shown in the perspective structure section diagram of being installed into the bracket from the side.

[0029] Reference signs:

[0030] 1 - storage medium; 2 - fan; 3 - medium heat dissipation structure; 31 - bracket; 311 - baffle; 312 - connecting plate; 3121 - air outlet section; 3122 - blocking section; 313 - air outlet hole; 32 - sound-absorbing layer; 33 - gas separation layer; 34 - groove; 35 - blocking piece; 351 - blocking ring; 352 - blocking rod; 36 - fixing part; 37 - cover plate; 4 - shell. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiment of the present application more clear, the specific technical scheme of the present application will be further described in detail below in combination with the drawings in the embodiment of the present application. The following embodiments are used to illustrate the present application, but not to limit the scope of the present application.

[0032] In the embodiment of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the embodiment of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0033] In addition, in the embodiment of the present application, the orientation terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0034] ​In the embodiments of the present application, unless specifically defined and limited otherwise, the term "connection" should be interpreted broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium.

[0035] In the embodiments of the present application, the terms "comprising", "containing" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including a …" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0036] In the embodiments of the present application, the words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Rather, the use of the words such as "exemplary" or "for example" is intended to present related concepts in a concrete manner.

[0037] The electronic device provided by the embodiments of the present application can be any electronic device, as long as it is an electronic device that needs to use air cooling for medium heat dissipation, which can be included in the scope of the embodiments of the present application. For example: notebook computers, desktop computers, servers, communication devices, etc.

[0038] For the convenience of description, taking a server as an example, referring to Figure 1 , it is a schematic diagram of a server, which includes a plurality of arrayed storage media 1. In order to dissipate heat for these storage media 1, a plurality of fans 2 are provided on one side. When the fans 2 work, air flows from the side of the storage media 1 to the side of the fans 2, thereby taking away the heat of the storage media 1. In order to reduce shock absorption and noise absorption while dissipating heat, a medium heat dissipation structure 3 is arranged between the storage media 1 and the fans 2.

[0039] The new design of the medium heat dissipation structure 3 arranged between the fans 2 and the storage media 1 in the electronic device of the embodiments of the present application can well increase the effect of shock absorption and noise absorption without increasing the cost and affecting the layout and heat dissipation effect. Specifically, referring to Figure 1 , the electronic device provided by the embodiments of the present application includes a housing 4, and a storage medium 1 and a fan 2 arranged in the housing 4. The fan 2 is arranged at a distance from the medium. It also includes the medium heat dissipation structure 3 of any one of the first aspect arranged in the housing 4. The medium heat dissipation structure 3 is arranged between the medium and the fan 2, and is arranged at a distance from both the medium and the fan 2.

[0040] The embodiment of the present application also provides a medium heat dissipation structure 3, which can be arranged in the electronic device described above. It should be noted that the medium heat dissipation structure 3 is only a name, and it can be clearly understood that the structure is originally arranged in the whole structure without medium heat dissipation, and the medium heat dissipation structure 3 can also be well damped and noise-absorbed on the premise of having the heat dissipation function.

[0041] With reference to Figure 2 and Figure 3 The medium heat dissipation structure 3 provided by the embodiment of the present application comprises a support 31, an acoustic absorption layer 32 and a gas separation layer 33, wherein the support 31 comprises an outermost baffle 311 located at a leeward side, the baffle 311 is used for blocking the gas from flowing out from the baffle 311; the acoustic absorption layer 32 is at least one and is made of acoustic absorption material, the acoustic absorption layer 32 is arranged at a windward side of the baffle 311, and the outermost windward side of the support 31 is necessarily provided with one acoustic absorption layer 32; the gas separation layer 33 is at least one, and the gas separation layer 33 is surrounded by the support 31 and the acoustic absorption layer 32, and the gas separation layer 33 contains gas.

[0042] The medium heat dissipation structure 3 provided by the embodiment of the present application comprises a support 31, an acoustic absorption layer 32 and a gas separation layer 33, wherein the support 31 comprises an outermost baffle 311 located at a leeward side, the baffle 311 is used for blocking the gas from flowing out from the baffle 311; the acoustic absorption layer 32 is at least one and is made of acoustic absorption material, the acoustic absorption layer 32 is arranged at a windward side of the baffle 311, and the outermost windward side of the support 31 is necessarily provided with one acoustic absorption layer 32; the gas separation layer 33 is at least one, and the gas separation layer 33 is surrounded by the support 31 and the acoustic absorption layer 32, and the gas separation layer 33 contains gas.

[0043] It should be noted that the material of the acoustic absorption layer 32 can be acoustic absorption cotton; the gas in the gas separation layer 33 is generally air; and the material of the support 31 can be metal or plastic.

[0044] The gas barrier 33 is surrounded by the support 31 and the sound absorbing layer 32. On both sides of the gas barrier 33 along the air flow direction, one side can be the sound absorbing layer 32, and the other side can be the direct baffle 311. However, the periphery of the gas barrier 33 along the air inlet direction is necessarily surrounded by a part of the support 31.

[0045] Specifically, as shown in Figure 2 and Figure 3 , the support 31 includes a connecting plate 312 extending along the air inlet direction and surrounding the structure of the periphery of the gas barrier 33 along the air inlet direction. The connecting plate 312 can support the components on both sides of the gas barrier 33 to ensure the stability of the entire structure.

[0046] In some embodiments, the connecting plate 312 can be a sealing plate or have many holes. It can be predicted that when the air flow flows from the previous sound absorbing layer 32 into the gas barrier 33, due to the existence of the baffle 311, most of the air flow will still flow out from the periphery of the baffle 311, that is, it is very likely to flow out from the connecting plate 312. In this way, if the connecting plate 312 is a sealing plate, it will prevent the air flow from flowing out from the connecting plate 312 and cause the phenomenon of rotational turbulence at the connecting plate 312. The rotational turbulence is equivalent to forming an air flow barrier, which can reduce vibration and reduce the transmission of noise. Of course, if the connecting plate 312 is completely set as a sealing plate, the air flow barrier will cover the entire gas barrier 33, and experiments have verified that in this way, the air flow at the connecting plate 312 cannot flow out normally, but will generate some noise, and can be detrimental to heat dissipation. Therefore, some holes can be provided on the connecting plate 312 for air outlet.

[0047] For example, referring to Figure 2 , Figure 3 and Figure 4 , the connecting plate 312 is provided with a plurality of air outlet holes 313, and the plurality of air outlet holes 313 are arrayed on the connecting plate 312. In this way, part of the air flow flowing into the gas barrier 33 can flow out from the plurality of air outlet holes 313, ensuring normal heat dissipation and reducing vibration and noise absorption.

[0048] It should be noted that the shape of the air outlet hole 313 can have various implementation manners, for example, a circular hole, a polygonal (rhombus, square, triangle, pentagon, hexagon, etc.) hole, a long strip hole, an arc-shaped hole, etc., which are not limited herein.

[0049] As mentioned earlier, the air flow cannot flow out from the sealing part of the connecting plate 312, and rotational turbulence occurs, forming an air flow barrier. The air flow barrier has good vibration reduction and noise absorption effect within certain limits. And the air flow barrier is on the leeward side of the gas barrier 33. Specifically, referring to Figure 2 , Figure 3 andFigure 5 In some embodiments, the connecting plate 312 comprises an air outlet section 3121 and a blocking section 3122, the air outlet hole 313 is arranged in the air outlet section 3121, and the blocking section 3122 is located at the end of the connecting plate 312 close to the leeward side. That is, the air flow entering the air layer 33 will flow out from the air outlet section 3121, and the blocking section 3122 will form an air flow layer of rotational turbulence, achieving the effect of shock absorption and noise absorption.

[0050] According to whether the air outlet hole 313 is arranged on the connecting plate 312, the connecting plate 312 can be divided into an air outlet section 3121 and a blocking section 3122. In some embodiments, the air outlet hole 313 can be arranged around the circumference of the air layer 33 in the air inlet direction, or can be arranged on one or more side walls of the circumference of the air layer 33 in the air inlet direction, and different designs can have different design effects according to different needs.

[0051] For example, the air outlet hole 313 is arranged around the circumference of the air layer 33 in the air inlet direction, that is, the air outlet section 3121 and the blocking section 3122 are also arranged around the circumference of the air layer 33 in the air inlet direction. After a number of theoretical calculations and experimental verifications, for example, the blocking plate is designed to be symmetrical on the left and right sides, and the design requirements and dimensions with good effects for the blocking section 3122 are as follows: Figure 5 The width (b shown in the figure) of the blocking section 3122 has a minimum value of 5 mm and a maximum value of the width (D2 shown in the figure) of the connecting plate 312 in the air inlet direction, wherein preferably, the width of the blocking section 3122 in the air inlet direction is less than or equal to 75% of the width of the connecting plate 312 in the air inlet direction. D1 shown in the figure is the width of the sound-absorbing cotton.

[0052] For example, in the scheme in which the air outlet hole 313 is arranged on one or more side walls of the circumference of the air layer 33 in the air inlet direction, referring to Figure 6 and Figure 7 The air outlet section 3121 and the blocking section 3122 can be arranged on opposite sides of the air layer 33 in the air inlet direction, respectively, and the width of the air outlet section 3121 and the blocking section 3122 arranged on opposite sides in the air inlet direction is equal to the width of the connecting plate 312 in the air inlet direction.

[0053] In addition, the thickness of the entire air layer 33 also has a better range, generally, the recommended thickness of the air layer 33 is less than or equal to one quarter of the wavelength of the noise source; of course, in actual schemes, there can also be size requirements, for example, the thickness of the air layer 33 in the air inlet direction is 5-50 cm. If low-frequency noise needs to be absorbed, the air layer 33 can be thickened; if high-frequency noise needs to be absorbed, the air layer 33 can be thinned.

[0054] The gas barrier 33 mentioned above can be designed and manufactured with different thicknesses for different frequencies of noise, and can be designed with different specifications or have an adjustable thickness. There are many specific implementation methods.

[0055] For example, the connecting plate 312 has a telescopic portion that can be telescoped in the air inlet direction to change the width of the connecting plate 312 in the air inlet direction. In this way, by changing the width of the connecting plate 312 in the air inlet direction, the thickness of the gas barrier 33 can be changed.

[0056] Alternatively, the connecting plate 312 is provided with a plurality of connecting structures of different heights in the air flow direction, which can be connected to the sound absorbing layer 32. By connecting the sound absorbing layer 32 to the connecting structures of different heights, the thickness of the gas barrier 33 can be adjusted.

[0057] The sound absorbing layer 32 and the gas barrier 33 can both have multiple layers. In the case where the sound absorbing layer 32 and the gas barrier 33 both have multiple layers, the sound absorbing layer 32 and the gas barrier 33 can be arranged alternately in the air flow direction, and the first arrangement on the windward side must be the sound absorbing layer 32.

[0058] For example, two implementation methods are introduced: in the first possible implementation method, as shown in Figure 2 , the sound absorbing layer 32 and the gas barrier 33 are both one, the sound absorbing layer 32 is arranged on the outermost side of the windward side of the support 31, the baffle 311 is arranged in a spaced manner with the sound absorbing layer 32, and the gap surrounded by the support 31 and the sound absorbing layer 32 is the gas barrier 33.

[0059] In the second possible implementation method, as shown in Figure 3 , it includes a first sound absorbing layer 32, a second sound absorbing layer 32 and a gas barrier 33, the first sound absorbing layer 32 is arranged on the outermost side of the windward side of the support 31, the first sound absorbing layer 32 and the second sound absorbing layer 32 are arranged in a spaced manner, and the gap surrounded by the support 31, the first sound absorbing layer 32 and the second sound absorbing layer 32 is the gas barrier 33.

[0060] For the server implemented by the present application, when the medium heat dissipation structure 3 is arranged therein, the sound absorption layer 32 of the medium needs to avoid the air outlet gap between each storage medium 1, so as not to affect the heat dissipation effect, therefore, the medium heat dissipation structure 3 in the server often needs to be arranged separately for each storage medium 1, so as to avoid the air outlet gap between the plurality of storage media 1. In this case, the medium heat dissipation structure 3 can be that each support 31 can be matched with one or a group of sound absorption layers 32, so as to separately arrange a set of support 31 and sound absorption layer 32, gas separation layer 33 structure for each storage medium 1. Of course, a plurality of structures for installing the sound absorption layer 32 can also be arranged in one support 31, that is, one support 31 can correspond to a plurality of storage media 1, and the mounting structure in the support 31 corresponds to each storage medium 1, so that the installation and layout are convenient.

[0061] Specifically, referring to Figure 8 、 Figure 9 and Figure 10 , it is a specific implementation mode of the medium heat dissipation structure 3, wherein a plurality of recesses 34 for installing the sound absorption layer 32 are arranged on the support 31, and each recess 34 corresponds to one storage medium 1, so that the sound absorption layer 32 can be installed in the corresponding recess 34, which is convenient for installation and arrangement.

[0062] Of course, the number of recesses 34 arranged on the support 31 can be the same as the number of a row of storage media 1, so that the installation of the support 31 can complete the installation of the medium heat dissipation structure 3 at one time. Alternatively, the number of a row of storage media 1 is an integer multiple of the number of recesses 34 arranged on the support 31, so that several supports 31 can be flexibly arranged and selected for combination and installation.

[0063] Referring to Figure 10 , the recess 34 on the support 31 is provided with a blocking piece 35, the blocking piece 35 includes a blocking ring 351 located around the recess 34, and a blocking rod 352 located in the middle of the recess 34, when the sound absorption cotton is installed into the recess 34, the blocking piece 35 limits the position of the sound absorption cotton, and then the blocking piece 35 and the baffle 311 form the gas separation layer 33.

[0064] It should be noted that the connection between the sound absorption cotton and the support 31 can have various implementation modes, such as adhesion, clamping, fastener connection and the like, as long as it can form the sound absorption layer 32 and the gas separation layer 33 of the medium heat dissipation structure 3 of the present application. The above scheme is only one possible implementation mode, and the specific connection structure and mode are not limited herein.

[0065] In addition, Figure 8 、 Figure 9 and Figure 10The sound-absorbing cotton and bracket 31 shown are installed with the sound-absorbing cotton installed in the bracket 31 along the air inlet direction. Of course, in some embodiments, the sound-absorbing cotton can also be installed in the bracket 31 in a direction perpendicular to the air inlet direction. Specifically, refer to... Figure 11 ,for Figure 7 The exploded structural diagram of the embodiment shown illustrates that the bracket 31 has an opening in its side wall parallel to the air inlet direction, allowing the sound-absorbing cotton (sound-absorbing layer 32) to be installed from the side into the bracket. The opening is then covered by a cover plate 37, forming a complete structure. Of course, ventilation holes can be provided on the side wall of the bracket 31 corresponding to the baffle 311 near the windward side, allowing airflow to enter the sound-absorbing layer 32.

[0066] Furthermore, the connection between the entire bracket 31 and the corresponding position on the electronic device can be achieved in various ways, such as snap-fitting, bonding, welding, fastener connection, etc. (See reference...) Figure 8 The bracket 31 is provided with a fixing part 36 for fixing to the corresponding position of the electronic device.

[0067] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A medium heat dissipation structure, comprising: a support, the support comprising an outermost baffle on a leeward side, the baffle being configured to block gas from flowing out of the baffle; at least one sound absorbing layer, the sound absorbing layer being made of sound absorbing material, the sound absorbing layer being disposed on a windward side of the baffle, and the outermost windward side of the support necessarily being provided with one sound absorbing layer; at least one gas barrier, the gas barrier being enclosed by the support and the sound absorbing layer, gas flowing into the gas barrier through the sound absorbing layer, and the gas barrier containing gas; the support comprising a connecting plate, the connecting plate extending in a direction of air inflow and enclosing a structure of the gas barrier in the direction of air inflow, the connecting plate being provided with a plurality of air outlet holes, the connecting plate comprising an air outlet section and a blocking section, the air outlet holes being disposed in the air outlet section, and the blocking section being located at an end of the connecting plate close to the leeward side.

2. The medium heat dissipation structure according to claim 1, wherein the plurality of air outlet holes are arrayed on the connecting plate.

3. The medium heat dissipation structure according to claim 2, wherein the air outlet section and the blocking section are both disposed around the gas barrier in the direction of air inflow, and a width of the blocking section in the direction of air inflow is less than or equal to 75% of a width of the connecting plate in the direction of air inflow.

4. The medium heat dissipation structure according to claim 2, wherein the air outlet section and the blocking section are respectively disposed on opposite sides of the gas barrier in the direction of air inflow, and a width of each of the air outlet section and the blocking section in the direction of air inflow is equal to the width of the connecting plate in the direction of air inflow.

5. The medium heat dissipation structure according to claim 1, wherein the connecting plate has an extension section, the extension section being retractable in the direction of air inflow to change the width of the connecting plate in the direction of air inflow.

6. The medium heat dissipation structure according to any one of claims 1 to 5, wherein the sound absorbing layer and the gas barrier are one, the sound absorbing layer being disposed on the outermost windward side of the support, and the baffle being spaced apart from the sound absorbing layer, a gap enclosed by the support and the sound absorbing layer being the gas barrier.

7. The medium heat dissipation structure according to any one of claims 1 to 5, comprising a first sound absorbing layer, a second sound absorbing layer, and a gas barrier, the first sound absorbing layer being disposed on the outermost windward side of the support, the first sound absorbing layer and the second sound absorbing layer being spaced apart, and a gap enclosed by the support, the first sound absorbing layer, and the second sound absorbing layer being the gas barrier.

8. An electronic device, comprising: comprising: a housing; a medium disposed in the housing; a fan disposed in the housing at a distance from the medium; the medium heat dissipation structure according to any one of claims 1 to 7, disposed between the medium and the fan and spaced apart from both the medium and the fan.

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