A chip cutting blade

Abstract

The application discloses a chip cutting blade, which comprises a first cutting layer, a second cutting layer and a third cutting layer; the first cutting layer is located on a first surface of the second cutting layer, and the third cutting layer is located on a second surface of the second cutting layer; the first cutting layer, the second cutting layer and the third cutting layer are all composed of diamond particles, c-BN, Cr-N and TiN; wherein the volume ratio of small diamond particles to large diamond particles in the first cutting layer and the third cutting layer is 3:7; the volume ratio of small diamond particles to large diamond particles in the second cutting layer is 1:9; the average particle size of the first cutting layer and the third cutting layer is in the range of 20-50 mu m, and the average particle size of the second cutting layer is in the range of 100-200 mu m. The technical scheme of the application can effectively reduce the cutting chips / cracks generated during chip cutting, so that a better chip cutting surface roughness is obtained.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip cutting tool technical field, especially to a chip cutting blade. BACKGROUND

[0002] With the development of chip technology, the chip is getting smaller and smaller, which puts forward more strict requirements for the chip cutting process. At present, the cutting chip is mostly used by single blade process, even if a very small and thin blade is used, there is no obvious improvement in the chip cutting chip / crack generated when cutting the chip, resulting in poor roughness of the chip cutting surface. SUMMARY

[0003] The technical problem to be solved by the embodiments of the present application is to provide a chip cutting blade that can effectively reduce the cutting chip / crack generated when cutting the chip, thereby obtaining a better chip cutting surface roughness.

[0004] In order to solve the above technical problems, the embodiments of the present application provide a chip cutting blade, which comprises a first cutting layer, a second cutting layer and a third cutting layer; the first cutting layer is located on the first surface of the second cutting layer, and the third cutting layer is located on the second surface of the second cutting layer; the first cutting layer, the second cutting layer and the third cutting layer are all composed of diamond particles, c-BN, Cr-N and TiN; wherein,

[0005] The volume ratio of small diamond particles to large diamond particles in the first cutting layer and the third cutting layer is 3:7; the volume ratio of small diamond particles to large diamond particles in the second cutting layer is 1:9;

[0006] The average particle size of the first cutting layer and the third cutting layer is in the range of 20 μm to 50 μm, and the average particle size of the second cutting layer is in the range of 100 μm to 200 μm.

[0007] Further, the density of the first cutting layer and the third cutting layer is in the range of 5 g / cm 2 ~ 15 g / cm 2 The density of the second cutting layer is in the range of 8 g / cm 2 ~ 15 g / cm 2 .

[0008] Further, the thickness of the first cutting layer and the third cutting layer is 20 μm, and the thickness of the second cutting layer is 80 μm.

[0009] Compared with the prior art, the chip cutting blade provided by the embodiment of the present application comprises a first cutting layer, a second cutting layer and a third cutting layer; the first cutting layer is located on a first surface of the second cutting layer, and the third cutting layer is located on a second surface of the second cutting layer; the first cutting layer, the second cutting layer and the third cutting layer are all composed of diamond particles, c-BN, Cr-N and TiN; wherein the volume ratio of small diamond particles to large diamond particles in the first cutting layer and the third cutting layer is 3:7; the volume ratio of small diamond particles to large diamond particles in the second cutting layer is 1:9; the average particle size of the first cutting layer and the third cutting layer is in the range of 20-50 μm, and the average particle size of the second cutting layer is in the range of 100-200 μm; by using the chip cutting blade, the cutting chips / cracks generated during cutting of the chip can be effectively reduced, so that a better chip cutting surface roughness can be obtained. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a cross-sectional view of a preferred embodiment of the chip cutting blade provided by the present application. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the protection scope of the present application.

[0012] The embodiment of the present application provides a chip cutting blade, referring to Figure 1 is a cross-sectional view of a preferred embodiment of the chip cutting blade provided by the present application. The chip cutting blade comprises a first cutting layer, a second cutting layer and a third cutting layer; the first cutting layer is located on a first surface of the second cutting layer, and the third cutting layer is located on a second surface of the second cutting layer; the first cutting layer, the second cutting layer and the third cutting layer are all composed of diamond particles, c-BN, Cr-N and TiN; wherein,

[0013] the volume ratio of small diamond particles to large diamond particles in the first cutting layer and the third cutting layer is 3:7; the volume ratio of small diamond particles to large diamond particles in the second cutting layer is 1:9;

[0014] the average particle size of the first cutting layer and the third cutting layer is in the range of 20-50 μm, and the average particle size of the second cutting layer is in the range of 100-200 μm.

[0015] Specifically, the chip cutting blade is composed of a first cutting layer, a second cutting layer and a third cutting layer. The first cutting layer is located on a first surface of the second cutting layer, and the third cutting layer is located on a second surface of the second cutting layer, i.e. the second cutting layer is located between the first cutting layer and the third cutting layer. Correspondingly, the first cutting layer is a first surface of the chip cutting blade, and the third cutting layer is a second surface of the chip cutting blade. The first cutting layer, the second cutting layer and the third cutting layer are all composed of diamond particles, c-BN (cubic boron nitride), Cr-N (chromium-nitrogen) and TiN (titanium nitride). The diamond particles include large diamond particles (i.e. large diamond particles) and small diamond particles (i.e. small diamond particles). The volume ratio of the small diamond particles to the large diamond particles in the first cutting layer is 3:7, the volume ratio of the small diamond particles to the large diamond particles in the second cutting layer is 1:9, and the volume ratio of the small diamond particles to the large diamond particles in the third cutting layer is 3:7. The average particle size of the first cutting layer is in the range of 20 μm to 50 μm, the average particle size of the second cutting layer is in the range of 100 μm to 200 μm, and the average particle size of the third cutting layer is in the range of 20 μm to 50 μm.

[0016] If the volume ratio of the small diamond particles to the large diamond particles in the first cutting layer and the third cutting layer is less than 3:7, and the volume ratio of the small diamond particles to the large diamond particles in the second cutting layer is less than 1:9, it means that the cutting speed is relatively fast. If the volume ratio of the small diamond particles to the large diamond particles in the first cutting layer and the third cutting layer is greater than 3:7, and the volume ratio of the small diamond particles to the large diamond particles in the second cutting layer is greater than 1:9, it will cause the phenomenon of slipping during cutting. If the average particle size of the first cutting layer and the third cutting layer is greater than 50 μm, and the average particle size of the second cutting layer is greater than 200 μm, it will form a relatively rough cutting surface during cutting. If the average particle size of the first cutting layer and the third cutting layer is less than 20 μm, and the average particle size of the second cutting layer is less than 100 μm, it will cause the phenomenon of slipping during cutting.

[0017] It should be noted that the two sides of the chip cutting blade are the first cutting layer and the third cutting layer, and the middle is the second cutting layer. According to the above volume ratio and average particle size parameters, the first cutting layer and the third cutting layer are both fine sand layers. Since the volume of the small diamond particles and the large diamond particles in the fine sand layers is not much different, the gap is not large, and the grinding effect is very delicate, and the cutting surface is relatively smooth. The second cutting layer is a large sand layer. Since the volume of the small diamond particles and the large diamond particles in the large sand layer is greatly different, the gap is relatively large, and the cutting surface is relatively rough. However, the large sand layer as the middle layer can maintain the rigidity of the chip cutting blade, and make the blade feeding speed fast, so as to improve the cutting speed.

[0018] As an improvement of the above-mentioned scheme, the density of the first cutting layer and the third cutting layer is in the range of 5g / cm 2 ~15g / cm 2 , and the density of the second cutting layer is in the range of 8g / cm 2 ~15g / cm 2 .

[0019] Specifically, in combination with the above-mentioned embodiment, the density of the first cutting layer of the chip cutting blade is in the range of 5g / cm 2 ~15g / cm 2 , the density of the second cutting layer is in the range of 8g / cm 2 ~15g / cm 2 , and the density of the first cutting layer is in the range of 5g / cm 2 ~15g / cm 2 ; wherein, if the density of the first cutting layer and the third cutting layer is greater than 15g / cm 2 , and the density of the second cutting layer is greater than 15g / cm 2 , it is easy to cause damage during cutting; if the density of the first cutting layer and the third cutting layer is less than 5g / cm 2 , and the density of the second cutting layer is less than 8g / cm 2 , it will result in that the strength of the chip cutting blade is low and the blade is soft.

[0020] As an improvement of the above-mentioned scheme, the thickness of the first cutting layer and the third cutting layer is 20μm, and the thickness of the second cutting layer is 80μm.

[0021] Specifically, in combination with the above-mentioned embodiment, the thickness of the first cutting layer of the chip cutting blade is 20μm, the thickness of the second cutting layer is 80μm, and the thickness of the third cutting layer is 20μm.

[0022] It should be noted that the thickness parameters of the first cutting layer, the second cutting layer and the third cutting layer in the embodiment of the present application are only preferred parameters, and the embodiment of the present application is not specifically limited.

[0023] In summary, the chip cutting blade provided by the embodiment of the present application has fine sand layers on both sides and a coarse sand layer in the middle. The design of the fine sand layers can make the cutting surface of the chip relatively smooth, and the design of the coarse sand layer can maintain the rigidity of the blade and improve the cutting rate. Through the design of the multi-layer blade, the cutting chips / cracks generated during cutting can be effectively reduced when the chip cutting blade is used to cut the chip, so that a better chip cutting surface roughness can be obtained.

[0024] The above merely describes the preferred embodiments of the present application, and it should be pointed out that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.

Claims

1. A chip cutting blade, characterized in that, The first cutting layer, the second cutting layer and the third cutting layer; the first cutting layer is located on the first surface of the second cutting layer, and the third cutting layer is located on the second surface of the second cutting layer; the first cutting layer, the second cutting layer and the third cutting layer are all composed of diamond particles, c-BN, Cr-N and TiN; wherein, The volume ratio of small diamond particles to large diamond particles in the first cutting layer and the third cutting layer is 3:7; the volume ratio of small diamond particles to large diamond particles in the second cutting layer is 1:9; The average particle size of the first cutting layer and the third cutting layer is in the range of 20μm~50μm, and the average particle size of the second cutting layer is in the range of 100μm~200μm; The density of the first and third cutting layers is in the range of 5 g / cm 2 ~15 g / cm 2 The density of the second cutting layer is in the range of 8 g / cm 2 ~15 g / cm 2 ~15 g / cm 2. The chip cutting blade of claim 1, wherein, The thickness of the first cutting layer and the third cutting layer is 20μm, and the thickness of the second cutting layer is 80μm.

Images