Mounting table structure, substrate processing device, and control method of substrate processing device

Abstract

The present invention relates to a loading platform structure, a substrate processing apparatus, and a control method for a substrate processing apparatus. The cooling efficiency of a substrate is improved. A loading platform structure is provided, comprising: a loading platform for loading a substrate; a refrigeration mechanism for cooling the substrate; a lifting drive unit for raising and lowering the loading platform or the refrigeration mechanism; and a contactor provided at a relative position between the refrigeration mechanism and the loading platform. The contactor is configured to enable the refrigeration mechanism to contact the loading platform via the contactor by utilizing the lifting and lowering of the loading platform or the refrigeration mechanism by the lifting drive unit.

Description

Technical Field

[0001] The present disclosure relates to a mounting table structure, a substrate processing apparatus, and a control method for the substrate processing apparatus. Background Art

[0002] Substrate processing equipment, such as film-forming equipment, sometimes requires extremely low-temperature processing. For example, Patent Document 1 discloses a stage device and processing apparatus capable of rotating a mounted substrate while cooled to an extremely low temperature, exhibiting high cooling performance. In this processing apparatus, cooling gas supplied from outside the processing apparatus is sufficiently cooled and then supplied to the gap between the stage and a refrigerated heat transfer element, thereby cooling the stage to an extremely low temperature.

[0003] Patent Document 2 proposes a holding device for cooling a workpiece while rotatably holding it within a vacuum chamber. The holding device comprises a stage on which the workpiece is placed, a rotation drive unit that rotatably supports the stage, and a cooling unit that cools the stage. The cooling unit comprises a cooling panel positioned below the stage with a gap between the stage's lower surface and the cooling panel; a heat transfer shaft inserted into the rotating shaft and in contact with the lower surface of the cooling panel; and a refrigerator that cools the heat transfer shaft.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2020-72249

[0007] Patent Document 2: Japanese Patent No. 6559347 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] In the indirect method using a refrigerant such as cooling gas, the local contact cooling using a powdery or pasty heat-conductive material, or the cooling method using both, it may take time to control to the target cooling temperature.

[0010] The present disclosure provides a mounting table structure, a substrate processing apparatus, and a control method for the substrate processing apparatus, which are capable of improving cooling efficiency of a substrate.

[0011] Solutions for solving problems

[0012] According to a technical solution disclosed in the present invention, a loading table structure is provided, which comprises: a loading table for loading a substrate, a refrigeration mechanism for cooling the substrate, a lifting drive unit for lifting and lowering the loading table or the refrigeration mechanism, and a contactor provided at a relative position between the refrigeration mechanism and the loading table, and is configured to utilize the lifting and lowering of the loading table or the refrigeration mechanism by the lifting drive unit and to bring the refrigeration mechanism into contact with the loading table via the contactor.

[0013] Effects of the Invention

[0014] According to one technical solution, the cooling efficiency of the substrate can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic cross-sectional view showing an example of a substrate processing apparatus according to one embodiment.

[0016] Figure 2 This is a diagram showing an example of the contactor and its surroundings in the mounting platform structure according to one embodiment.

[0017] Figure 3 This is a diagram showing the periphery of a contactor in a mounting table structure according to one embodiment.

[0018] Figure 4 This is a diagram showing another example of the contactor periphery of the mounting platform structure according to one embodiment.

[0019] Figure 5 This is a diagram showing an example of the operation of the substrate processing apparatus and the state of the contactors according to one embodiment.

[0020] Figure 6 This is a flowchart showing an example of a method for controlling a substrate processing apparatus according to one embodiment. DETAILED DESCRIPTION

[0021] Hereinafter, the embodiment of the present disclosure will be described with reference to the accompanying drawings. In each of the drawings, the same components are denoted by the same reference numerals, and overlapping descriptions may be omitted.

[0022] [Substrate processing equipment]

[0023] First, refer to Figure 1 , an example of a substrate processing apparatus 100 according to an embodiment of the present disclosure is described. Figure 1 It is a longitudinal sectional view showing an example of the substrate processing apparatus 100 according to the embodiment. Figure 1The substrate processing apparatus 100 shown is an apparatus for forming a desired film on a substrate W such as a semiconductor wafer as a substrate to be processed, within a vacuum processing chamber 10 in which a vacuum atmosphere is formed and substrate processing is performed using a process gas. The substrate processing apparatus is a PVD (physical vapor deposition) apparatus.

[0024] The substrate processing apparatus 100 includes a vacuum processing chamber 10, a mounting table 20, a freezing unit 30, a rotating device 40, a first lifting device 77, and a second lifting device 78. The mounting table 20 mounts a substrate W inside the vacuum processing chamber 10. The rotating device 40 rotates the mounting table 20. The first lifting device 77 lifts and lowers the mounting table 20. The second lifting device 78 lifts and lowers the freezing unit 30. The substrate processing apparatus 100 further includes a control unit 80 for controlling various devices such as the freezing unit 30, the rotating device 40, the first lifting device 77, and the second lifting device 78. The illustrated substrate processing apparatus 100 includes two lifting devices: the first lifting device 77 for lifting and lowering the mounting table 20, and the second lifting device 78 for lifting and lowering the freezing unit 30. However, a configuration in which a common lifting device is used to lift and lower the mounting table 20 and the freezing unit 30 may also be employed.

[0025] The refrigerator 31 and the cold link 35 of the refrigeration device 30 described later are examples of a refrigeration mechanism for cooling the substrate W. The rotation device 40 is an example of a rotation drive unit for rotating the substrate W. The first lifting device 77 and the second lifting device 78 are examples of a lifting drive unit for lifting the substrate or the refrigeration mechanism.

[0026] A mounting table 20 is provided at the bottom of the vacuum processing chamber 10. A plurality of target holders 11 are fixed above the mounting table 20 at a predetermined inclination angle θ relative to the horizontal plane. A different type of target T is mounted on the bottom surface of each target holder 11. The inclination angle θ may be 0°, meaning that the target holders 11 may be fixed horizontally.

[0027] The vacuum processing chamber 10 is configured such that the interior thereof is depressurized to a vacuum state by operating an exhaust device 13, such as a vacuum pump. A processing gas supply device (not shown) supplies processing gases required for sputtering film formation (e.g., rare gases such as argon (Ar), krypton (Kr), and neon (Ne), and nitrogen (N2) gas) to the vacuum processing chamber 10.

[0028] An AC voltage or a DC voltage is applied to the target holder 11 from a plasma generating power supply (not shown). When the AC voltage is applied from the plasma generating power supply to the target holder 11 and the target T, plasma is generated within the vacuum processing chamber 10, ionizing the noble gas and the like within the vacuum processing chamber 10. The ionized noble gas elements and the like then sputter the target T. The sputtered atoms or molecules of the target T are deposited on the surface of a substrate W held on a mounting table 20 facing the target T.

[0029] By tilting the target T relative to the substrate W, the angle of incidence of sputtered particles from the target T on the substrate W can be adjusted, thereby improving the in-plane uniformity of the thickness of a magnetic film or the like formed on the substrate W. When each target holder 11 within the vacuum processing chamber 10 is set at the same tilt angle θ, the angle of incidence of the sputtered particles on the substrate W can be changed by raising and lowering the stage 20 to change the distance t1 between the target T and the substrate W. Therefore, the stage 20 is raised and lowered to maintain an appropriate distance t1 from each target T for each target T used.

[0030] The number of targets T is not particularly limited, but from the perspective of enabling different types of films formed of different types of materials to be sequentially formed using one substrate processing apparatus 100 , it is preferable that a plurality of different types of targets T exist inside the vacuum processing chamber 10 .

[0031] The refrigeration device 30 includes a refrigerator 31 and a cold link 35, with the cold link 35 stacked on the refrigerator 31. A plurality of contacts 21a are provided on the cold link 35 of the refrigerator 30, and a mounting table 20 is provided across the plurality of contacts 21a. The refrigerator 31 holds the cold link 35 and can cool the upper surface of the cold link 35 to an extremely low temperature of, for example, below -30°C and around -200°C. From the perspective of cooling capacity, the refrigerator 31 preferably utilizes a GM (Gifford-McMahon) cycle.

[0032] The cold link 35 is fixed to the refrigerator 31, and the upper portion of the cold link 35 is housed within the vacuum processing chamber 10. The cold link 35 is formed of a material such as copper (Cu) with high thermal conductivity and has a generally cylindrical shape. The refrigerator 31 and the cold link 35 are arranged so that their centers are aligned with the central axis CL of the mounting table 20.

[0033] A refrigerant supply passage 51 and a refrigerant discharge passage 52 are provided within the cold link 35 and the refrigerator 31. The refrigerant supply passage 51 supplies a refrigerant, which is a heat transfer gas, between the cold link 35 and the mounting table 20. The refrigerant discharge passage 52 discharges the refrigerant that has been heated by heat transfer from the mounting table 20. The refrigerant supply passage 51 and the refrigerant discharge passage 52 are examples of passages provided in the refrigeration mechanism and supplying a temperature control medium such as a refrigerant.

[0034] The refrigerant supply flow path 51 and the refrigerant discharge flow path 52 are respectively fixed to the connection fixing portions 31a and 31b located on the wall surface of the refrigerator 31. The refrigerant supply flow path 51 and the refrigerant discharge flow path 52 are examples of flow paths provided in the refrigeration device 30 for supplying a temperature control medium.

[0035] A temperature-regulating refrigerant (e.g., a first cooling gas) is supplied from a refrigerant supply device (not shown) and circulates in the refrigerant supply channel 51. The top ends of the refrigerant supply channel 51 and the refrigerant discharge channel 52 are open on the upper surface of the cold link 35, and the first cooling gas is supplied to the space between the cold link 35 and the mounting table 20 where the spring 26 is arranged. As the first cooling gas supplied to the space where the spring 26 is arranged, helium (He) gas having high thermal conductivity is preferably used. Alternatively, an inert gas may be used as the first cooling gas in a manner that does not corrode the spring 26 in the space. In this way, the thermal conductivity of the space between the cold link 35 and the mounting table 20 can be improved, thereby improving the cooling efficiency of the substrate W.

[0036] The refrigerant discharged from the space where the spring 26 is arranged flows through the refrigerant discharge flow path 52 and is discharged to a refrigerant discharge device (not shown). The refrigerant supply flow path 51 and the refrigerant discharge flow path 52 may be formed by the same flow path.

[0037] Multiple contacts 21a are provided on the cold link 35 side of the refrigeration unit 30. The multiple contacts 21a are respectively connected to multiple springs 26 and are installed in a manner opposite to the mounting table 20. The multiple springs 26 can also be helical springs such as compression coil springs. The spring 26 is an example of an elastomer. The contact 21a is formed of copper (Cu) with high thermal conductivity. However, it can be formed of any material with high thermal conductivity.

[0038] The mounting table 20 has a stacked structure consisting of an upper mounting portion 25 for mounting a substrate W and a lower contact 21b. The mounting portion 25 and the contact 21b are made of copper (Cu), which has high thermal conductivity. However, any material with high thermal conductivity will suffice. The mounting portion 25 includes an electrostatic chuck having a chuck electrode 32 embedded in a dielectric film. A predetermined potential is applied to the chuck electrode 32 via wiring 33. With this structure, the electrostatic chuck attracts the substrate W, allowing it to be held on the upper surface of the mounting table 20.

[0039] In this embodiment, a plurality of contacts 21a are arranged on the cold link 35 side of the refrigeration unit 30, and a contact 21b is arranged on the loading platform 20 side. The contacts 21a and 21b can be brought into contact and separated by raising and lowering at least one of the first lifting device 77 that raises and lowers the loading platform 20 and the second lifting device 78 that raises and lowers the refrigeration unit 30. In other words, the cold link 35 of the refrigeration unit 30 and the loading platform 20 can contact each other through the plurality of contacts 21a and 21b.

[0040] The stage 20 is supported by an outer cylinder 63. The outer cylinder 63 is arranged to cover the outer circumferential surface of the upper portion of the cold link 35. The upper portion of the outer cylinder 63 extends into the interior of the vacuum processing chamber 10, thereby supporting the stage 20 within the vacuum processing chamber 10. The outer cylinder 63 includes a cylindrical portion 61 having an inner diameter slightly larger than the outer diameter of the cold link 35, and a flange portion 62 extending radially outward from the lower surface of the cylindrical portion 61. The cylindrical portion 61 directly supports the stage 20. The cylindrical portion 61 and the flange portion 62 are formed of a metal such as stainless steel.

[0041] A heat insulating member 64 is connected to the lower surface of the flange portion 62. The heat insulating member 64 has a substantially cylindrical shape extending coaxially with the flange portion 62 and is fixed to the lower surface of the flange portion 62. The heat insulating member 64 is formed of a ceramic such as alumina. A magnetic fluid seal 69 is provided on the lower surface of the heat insulating member 64.

[0042] The magnetic fluid seal 69 includes a rotating portion 65, an inner fixing portion 66, an outer fixing portion 67, and a heat source 68. The rotating portion 65 has a generally cylindrical shape, extending coaxially with the heat insulating member 64 and fixed to the lower surface of the heat insulating member 64. In other words, the rotating portion 65 is connected to the outer cylinder 63 via the heat insulating member 64. This structure blocks the transfer of heat and cold from the outer cylinder 63 to the rotating portion 65 by the heat insulating member 64, thereby preventing the temperature drop of the magnetic fluid in the magnetic fluid seal 69, which could degrade the sealing performance and cause condensation.

[0043] The inner fixing portion 66 is provided between the cold link 35 and the rotating portion 65 with the aid of a magnetic fluid. The inner fixing portion 66 has a roughly cylindrical shape with an inner diameter larger than the outer diameter of the cold link 35 and an outer diameter smaller than the inner diameter of the rotating portion 65. The outer fixing portion 67 is provided on the outer side of the rotating portion 65 with the aid of a magnetic fluid. The outer fixing portion 67 has a roughly cylindrical shape with an inner diameter larger than the outer diameter of the rotating portion 65. The heating source 68 is embedded in the interior of the inner fixing portion 66 to heat the entire magnetic fluid sealing portion 69. According to this structure, it is possible to suppress the temperature drop of the magnetic fluid in the magnetic fluid sealing portion 69, which may cause the sealing performance to deteriorate and condensation to occur. According to these structures, in the magnetic fluid sealing portion 69, the rotating portion 65 can rotate freely in an airtight state relative to the inner fixing portion 66 and the outer fixing portion 67. That is, the outer cylinder 63 is supported to rotate freely with the aid of the magnetic fluid sealing portion 69.

[0044] A generally cylindrical bellows 75 is provided between the upper surface of the outer fixing portion 67 and the lower surface of the vacuum processing chamber 10. The bellows 75 is a metal bellows structure that is flexible in the vertical direction. The bellows 75 surrounds the upper portion of the cold link 35, the lower portion of the outer cylinder 63, and the thermal insulation member 64, separating the interior of the vacuum processing chamber 10, where pressure can be freely reduced, from the exterior of the vacuum processing chamber 10.

[0045] A collector ring 73 is provided below the magnetic fluid seal portion 69. The collector ring 73 includes a rotating body 71 including a metal ring and a fixed body 72 including a brush. The rotating body 71 has a roughly cylindrical shape extending coaxially with the rotating portion 65 of the magnetic fluid seal portion 69 and is fixed to the lower surface of the rotating portion 65. The fixed body 72 has a roughly cylindrical shape with an inner diameter slightly larger than the outer diameter of the rotating body 71. The collector ring 73 is electrically connected to a DC power supply (not shown) and supplies power supplied from the DC power supply to the wiring 33 via the brush of the fixed body 72 and the metal ring of the collector 71. According to this structure, a potential can be applied from the DC power supply to the chuck electrode without causing distortion in the wiring 33. The rotating body 71 constituting the collector ring 73 is mounted on the rotating device 40. In addition, the collector ring 73 may also have a structure other than a brush structure, for example, a non-contact power supply structure, a structure having a mercury-free conductive liquid, etc.

[0046] The rotating device 40 is a direct drive motor having a rotor 41 and a stator 45. The rotor 41 has a roughly cylindrical shape extending coaxially with the rotating body 71 of the slip ring 73 and is fixed to the rotating body 71. The stator 45 has a roughly cylindrical shape whose inner diameter is larger than the outer diameter of the rotor 41. According to the above structure, when the rotor 41 rotates, the rotating body 71, the rotating part 65, the outer cylinder 63 and the mounting table 20 rotate relative to the cold link 35 in the X3 direction. In addition, the rotating device may also be in a form other than a direct drive motor, or may be in a form having a servo motor and a transmission belt, etc.

[0047] In addition, a double-layered vacuum insulation structure 74 is provided around the refrigerator 31 and the cold link 35. In the illustrated example, the insulation 74 is provided between the refrigerator 31 and the rotor 41, and between the lower portion of the cold link 35 and the rotor 41. This structure prevents heat and cold from being transferred from the refrigerator 31 and the cold link 35 to the rotor 41.

[0048] The refrigerator 31 is fixed to the upper surface of the first support 70A, which is mounted so that it can be raised and lowered relative to the second lifting device 78. Furthermore, the rotating device 40 and the heat insulator 74 are fixed to the upper surface of the second support 70B, which is mounted so that it can be raised and lowered relative to the first lifting device 77. Furthermore, a substantially cylindrical bellows 76 is provided between the upper surface of the first support 70A and the lower surface of the second support 70B, surrounding the refrigerator 31. Like the bellows 75, the bellows 76 is a metal bellows structure that can be expanded and contracted in the vertical direction.

[0049] A second cooling gas supply pipe 34 for supplying a second cooling gas is provided on the mounting table 20. The second cooling gas supply pipe 34 passes through the mounting portion 25 and supplies a second cooling gas such as He gas from the gas hole 34a to the space between the lower surface of the substrate W and the upper surface of the mounting portion 25. The second cooling gas can be a gas different from or the same as the first cooling gas flowing in the refrigerant supply flow path 51. An inert gas can also be used as the second cooling gas. In this way, the thermal conductivity of the space between the lower surface of the substrate W and the upper surface of the mounting portion 25 can be increased, thereby improving the cooling efficiency of the substrate W.

[0050] The control unit 80 is composed of a computer. It includes a CPU (Central Processing Unit), a main storage device, an auxiliary storage device, an input / output interface, and a communication interface, all interconnected via a bus. The main storage device and the auxiliary storage device are computer-readable storage media.

[0051] The CPU controls the entire control unit 80. For example, the CPU expands programs stored in the auxiliary storage device into the main storage device's work area in an executable format. Through program execution, the CPU controls peripheral devices, thereby providing functions consistent with the intended purpose. The main storage device stores computer programs executed by the CPU and data processed by the CPU. Examples of main storage devices include flash memory, RAM (Random Access Memory), and ROM (Read Only Memory). The auxiliary storage device stores various programs and data in a readable and writable storage medium. Examples of auxiliary storage devices include silicon magnetic disks containing non-volatile semiconductor memory, hard disk drives (HDDs), and solid-state drives. Alternatively, the auxiliary storage device may be a removable storage medium such as a CD, DVD, BD, USB (Universal Serial Bus) memory, or SD (Secure Digital) memory card. The communication interface is an interface with the network connected to the control unit 80. The input / output interface is an interface for inputting and outputting data to and from devices connected to the control unit 80. Examples include a keyboard and a touch panel. The control unit 80 receives operation instructions from an operator operating an input device via an input / output interface, and controls the operation of various peripheral devices, including the refrigeration device 30, the rotating device 40, the first lifting device 77, and the second lifting device 78.

[0052] As described above, the substrate processing device 100 has a loading platform structure comprising: a loading platform 20 for loading the substrate W, a refrigeration mechanism for cooling the substrate W, a lifting drive unit for lifting and lowering the loading platform 20 or the refrigeration mechanism, and a contactor provided at a relative position between the refrigeration mechanism and the loading platform 20. The structure is such that the refrigeration mechanism and the loading platform 20 can be brought into contact via the contactor by utilizing the lifting and lowering of the loading platform 20 or the refrigeration mechanism by the lifting and lowering drive unit.

[0053] [Direct contact of contacts]

[0054] Next, refer to Figure 2 , describing the contactor periphery of a mounting table structure according to one embodiment. Figure 2 This is a diagram showing an example of the contactor and its surroundings in the mounting platform structure according to one embodiment.

[0055] exist Figure 1 Among the components of the substrate processing apparatus 100 , the freezing device 30 is configured to be freely raised and lowered by the second lifting device 78 , and the mounting table 20 is configured to be freely raised and lowered by the first lifting device 77 .

[0056] Before the film forming process, the freezing device 30 is raised by the second lifting device 78, so that Figure 2 As shown in (a), the contact 21a and the contact 21b can be brought into direct contact. Alternatively, before the film forming process, the first lifting device 77 is used to lower the mounting table 20, so that Figure 2 As shown in the contact state of (a), the contact 21a and the contact 21b are brought into direct contact.

[0057] In addition, during the film forming process, the first lifting device 77 is used to raise the mounting table 20 in the vacuum processing chamber 10, thereby adjusting the distance t1 between the target T and the substrate W. The adjustment of the distance t1 is appropriately changed according to the type of target T used. Figure 2 As shown in (b), the contact 21a is separated from the contact 21b so that the film can be formed while the carrier 20 is rotated during the film forming process. In this way, it is possible to form a film on the substrate W while the carrier 20 is rotated by the rotating device 40. In addition, when there is no need to adjust the distance t1, the contact 21a and the contact 21b can be separated by lowering the second lifting device 78 instead of raising the first lifting device 77. The contact 21a and the contact 21b can also be separated by synchronous control of the first lifting device 77 and the second lifting device 78. The following example illustrates the use of the second lifting device 78 to raise and lower the freezing device 30.

[0058] Conventional cooling methods that use indirect cooling methods such as cooling gas or other refrigerants, localized contact cooling using powdered or paste-like heat-conductive materials, or a combination of both, can sometimes result in poor thermal conductivity and prolonged cooling. In such cases, it becomes difficult to suppress the temperature rise of the mounting table 20 during repeated heat input during film formation, quickly restore the mounting table 20 to the target cooling temperature, and control the temperature of the substrate W.

[0059] In contrast, in the substrate processing apparatus 100 of this embodiment, except during film formation processing, the cold link 35 of the refrigeration device 30 is in physical contact with the mounting table 20 via the contacts 21a and 21b. Thus, due to the direct contact between the contacts 21a and 21b, the heat conductivity from the refrigeration device 30 to the mounting table 20 is improved, which can shorten the cooling time of the substrate W and improve productivity.

[0060] Reference Figure 3 , continue to further explain the mounting platform structure of this embodiment. Figure 3 This is a diagram showing the periphery of a contactor in a mounting table structure according to one embodiment. Figure 3 (b) means from Figure 3 The surface of the contact 21a viewed in the CC direction in (a) is as follows: Figure 3 (c) means from Figure 3 The arrangement of the spring 26 and the like below the contact 21 a as viewed in the direction DD in (a).

[0061] exist Figure 2 In the embodiment, a structure in which multiple contacts 21a and 21b are in direct contact with each other is described. In this case, since the mounting portion 25 and the contacts 21b are formed of copper (Cu) with high thermal conductivity, the contacts 21b and the mounting portion 25 become the contact portions between the metal workpieces. Figure 2 As shown in (b), a soft and thermally conductive indium sheet 23 is sandwiched between the contact 21b and the mounting portion 25 to avoid contact between metal workpieces and prevent metal contamination. Metal sheets other than the indium sheet 23 may also be used.

[0062] However, the mounting table 20 is not limited to a stack of the mounting portion 25 and the contact 21b. Figure 3 As shown in FIG. 2 (a), the placement portion 25 and the contacts 21b may be integrated into a single plate. In this case, the plurality of contacts 21a and the placement portion 25 (convex portion 25a) are in direct contact with each other.

[0063] In this embodiment, the contact surface of the placement portion 25 that contacts the plurality of contacts 21a is circular and flat. Figure 3 As shown in (b), the contact surface of the plurality of contacts 21a that are in contact with the carrier portion 25 is a shape obtained by dividing a circle having the same diameter as the contact surface of the carrier portion 25 into four parts on the inner circumference and eight parts on the outer circumference. In this way, it is preferable to divide the contact 21a into a plurality of blocks and divide the contact surface of the contact 21a into a plurality of blocks. Figure 3 In the example (b), the contact 21a is divided into 12 blocks and has 12 contact surfaces. More specifically, four contacts 21a having contact surfaces 21a2 with the same contact area are provided on the inner circumference, and eight contacts 21a having contact surfaces 21a1 with the same contact area are provided on the outer circumference. However, the shape of the contact surface of the contact 21a is not limited to this. The shape of the contact surface of the contact 21a can also be circular, square, or other shapes. In addition, the multiple contact surfaces 21a1 and 21a2 formed by the division of the contact 21a are flat.

[0064] If the contact 21a is not divided, the contact surface of the contact 21a is a single surface, so contact with the carrier portion 25 is likely to be partial. In contrast, by dividing the contact 21a into multiple contacts, the contact surface is divided, making it easier for the contact surface of the carrier portion 25 to make surface contact with the contact surfaces 21a1 and 21a2 of the multiple contacts 21a. This increases the contact area between the multiple contacts 21a and the carrier portion 25 compared to a case where the contact surface of the contact 21a is not divided, thereby improving contact efficiency.

[0065] like Figure 3 As shown in the example of FIG (c), a spring 26 is attached to each of the twelve divided contacts 21a. Providing a spring 26 on each of the twelve contacts 21a creates a mechanism that allows the springs 26 to absorb the force applied to each contact 21a and the receiving portion 25 when the contacts 21a come into contact with the receiving portion 25. In other words, by absorbing the force applied during contact, the springs 26 can prevent damage to the contacts 21a and the receiving portion 25.

[0066] When the contact 21a contacts the receiving portion 25, there's a chance that the contact 21a and receiving portion 25 may not abut straight against each other. Therefore, compared to contacting the receiving portion 25 as a single plate, having the contact 21a contact in separate sections allows for more efficient contact and a larger contact area. Furthermore, the provision of multiple springs 26 allows for smooth contact between the contact 21a and receiving portion 25 through elastic force.

[0067] In addition, the spring 26 is preferably arranged in the center of each contact 21a, but is not limited to this. In addition, the spring 26 is an example of an elastic body, and the elastic body can be a compression coil spring, a leaf spring, etc. The multiple contacts 21a are respectively connected to the multiple springs 26, and are installed on the freezing device 30 or the mounting table 20 through the multiple springs 26. Figure 3 In the example shown, twelve contacts 21a are connected to twelve springs 26, respectively, and are mounted on the upper surface of the cold link 35 of the refrigeration device 30 via the twelve springs 26. However, the contact 21a may also be a single plate. If the contact 21a is a single plate, multiple springs 26 may be mounted between the contact 21a and the upper surface of the cold link 35.

[0068] In this embodiment, springs 26, such as compression coil springs, of the same diameter are arranged on the multiple contacts 21a, and the same number of springs 26 are arranged. However, for example, springs 26 of different diameters may be arranged on each of the multiple contacts 21a. This allows for varying the degree to which the contact surfaces 21a1 and 21a2 of each contact 21a are pressed against the receiving portion 25. Furthermore, the number of springs 26 arranged on each of the multiple contacts 21a may be varied. This allows for varying the degree to which the contact surfaces 21a1 and 21a2 of each contact 21a are pressed against the receiving portion 25.

[0069] In addition, if Figure 3 As shown in (c), a copper plate 27 may be provided around the spring 26 to which each contact 21a is attached. Figure 3In the example (c), two copper plates 27 are provided around the spring 26 of each contact 21a. The copper plates 27 are made of a metal with high thermal conductivity such as copper to improve heat conduction from the refrigeration device 30 to the multiple contacts 21a.

[0070] The number of copper plates 27 provided on each contact 21a is not limited to two, and may be one or three or more. The copper plates 27 are arranged on the outside of the spring 26, but are not limited thereto. The copper plates 27 can be provided at a position that does not hinder the expansion and contraction of the spring 26. For example, Figure 3 As shown in (c), the copper plates 27 can be provided on the upper surface and the side surface of the contact 21a. The number of copper plates 27 provided on each of the plurality of contacts 21a may be changed.

[0071] When the substrate W on the mounting portion 25, which is in direct contact with the multiple contacts 21a, is cooled by the cooling device 30 via the springs 26, the springs 26 may reduce the cooling capacity from the cooling device 30 to the multiple contacts 21a. Therefore, multiple copper plates 27 are provided as heat transfer members on the multiple contacts 21a. This improves the thermal conductivity from the cooling device 30 to the multiple contacts 21a, thereby enhancing the cooling efficiency of the mounting table 20 and the substrate W.

[0072] The multiple copper plates 27 are an example of multiple heat transfer components connected to the multiple contacts 21a. The heat transfer components are not limited to copper plates 27; they may also be wires. The copper plates 27 are relatively thin and have high thermal conductivity, so as not to hinder the expansion and contraction force of the springs 26 and to ensure good heat exchange. In other words, the heat transfer components, exemplified by the multiple copper plates 27, preferably have a structure that is highly efficient in heat transfer, does not function as springs, and does not hinder the function of the springs 26. However, if the springs 26 themselves are formed of a material with high thermal conductivity, the copper plates 27 may not be provided.

[0073] As described above, the plurality of contacts 21a of this embodiment are mounted on the refrigeration unit 30 via the plurality of springs 26 and the plurality of copper plates 27. Furthermore, by raising and lowering the refrigeration unit 30 using the lifting drive unit, the plurality of contacts 21a can be brought into direct contact with the mounting table 20. This improves heat transfer efficiency, thereby enhancing the cooling efficiency of the substrate W, while also preventing damage to the contact surfaces of the contacts 21a. This provides a substrate processing apparatus 100 that shortens the cooling time of the substrate W.

[0074] [Other structures]

[0075] The contact provided between the cold link 35 and the mounting table 20 may be arranged only on the cold link 35 side, only on the mounting table 20 side, or on both the cold link 35 side and the mounting table 20 side.

[0076] In the substrate processing apparatus 100, each time a film is formed on a substrate W, the contactor is separated from the cold link 35 or the mounting table 20 during the film forming process, and the contactor is brought into contact with the cold link 35 or the mounting table 20 before and after the film forming process. Figure 2 and Figure 3 As shown, the surfaces of contacts 21a and / or 21b are preferably treated with hard silver plating 29 and 24 to ensure that the surfaces of contacts 21a and 21b have both durability and thermal conductivity during contact and separation. Hard silver plating 29 and 24 can suppress wear on the contact surfaces of contacts 21a and 21b during contact and separation, achieving a balance between durability and thermal conductivity. Hard silver plating 29 and 24 can be applied to not only the contact surfaces of contacts 21a and 21b but also to other contact surfaces and the lower surface (contact surface) of the mounting portion 25.

[0077] The contact surfaces of contacts 21a and 21b are flat. They are machined to maintain a flatness of within 0.01 mm and a surface roughness Ra of within 0.4. This further increases the contact area between contacts 21a and 21b, or between contacts 21a and mounting portion 25, improving heat conduction efficiency and further enhancing cooling efficiency.

[0078] The spring 26 and the copper plate 27 connected to the contact 21a may also be as follows. Figure 4 As shown, it is located on the side of the mounting table 20. Figure 4 In the example shown, a spring 26 and a copper plate 27 are connected to a contact 21b below a placement portion 25, and a plurality of contacts 21a are suspended below the spring 26 and copper plate 27. In this example, the plurality of contacts 21a are provided on the placement table 20 side and contact the upper surface of a cold link 35 of a refrigeration unit 30.

[0079] As a contact method, metal seals such as metal O-rings or metal elastic seals (アクチシール) with thermal conductivity and spring properties can be used instead of block-shaped contacts 21a and 21b. However, block-shaped contacts 21a and 21b increase the contact area and provide higher cooling efficiency. Therefore, considering heat exchange, block-shaped contacts are preferred. Metal seals such as metal O-rings and elastic seals can also be installed on the contact surfaces of block-shaped contacts 21a and 21b.

[0080] The refrigeration unit 30, or in other words, the second lifting mechanism 78, can also be driven by a pneumatic cylinder or a motor. A pneumatic cylinder, however, is preferred for ease of control, as it allows the refrigeration unit 30 to be raised and lowered simply by controlling the on / off supply of gas. The refrigeration unit 30 can also be raised and lowered by providing a stopper to control the supply of gas to the cylinder, thereby controlling the stroke of the refrigeration unit 30. The stopper detects when the contact 21a abuts the receiving portion 25 or the contact 21b, thereby stopping the gas supply.

[0081] When using a motor to drive the refrigeration unit 30, a ball screw or the like is required, which requires more space than using a pneumatic cylinder. Furthermore, the motor and refrigeration unit 30 must be coaxially arranged, which results in a larger unit. As described above, using a pneumatic cylinder to drive the refrigeration unit 30 can save space. However, it is also possible to use a motor to drive the refrigeration unit 30.

[0082] like Figures 2 to 4 As shown, a radiation plate 28 may be provided around the refrigeration device 30 and the contacts 21a, 21b.

[0083] As described above, according to the mounting table structure of this embodiment and the substrate processing apparatus 100 having the mounting table structure, the contact structure of the contacts connected to the refrigeration unit 30 can be utilized to improve the heat conductivity from the refrigeration unit 30 to the mounting table 20. This can improve the cooling efficiency of the substrate and shorten the time required to cool the substrate W and return it to normal temperature.

[0084] [Operation of the Substrate Processing Apparatus and Contact / Separation of Contactors]

[0085] Next, refer to Figure 5 , the operation of the substrate processing apparatus 100 and the contact and separation states of the contacts 21 a and 21 b are described. Figure 5 1 and 2 are diagrams showing an example of the operation of the substrate processing apparatus 100 and the state of the contactors according to one embodiment.

[0086] The substrate processing apparatus 100 is configured such that the second lifting mechanism 78 is raised and lowered using an air cylinder, thereby moving the refrigeration unit 30 vertically and bringing the refrigeration unit 30 into contact with and away from the mounting table 20 via the contacts 21a and 21b. This enables contact (direct) cooling using the contacts 21a and 21b in the substrate processing apparatus 100. The following describes the contact and separation states of the contacts 21a and 21b during processing of a substrate W using the substrate processing apparatus 100.

[0087] First, if Figure 5As shown in (1), when the substrate W is brought in, the second lifting device 78 is raised, thereby lifting the freezing device 30 and making the contacts 21a and 21b contact ( Figure 2 At this time, the rotation of the rotating device 40 stops, and the mounting table 20 does not rotate.

[0088] Then, if Figure 5 As shown in (2), a DC voltage is applied to the chuck electrode 32, and the substrate W is cooled while being attracted by the electrostatic chuck. Figure 5 (1), the contacts 21a and 21b are in contact ( Figure 2 At this time, the rotation of the rotating device 40 stops.

[0089] Then, if Figure 5 As shown in (3), before the process (such as film forming process) is about to be carried out, the second lifting device 78 is lowered, thereby lowering the freezing device 30, and during the process, the contacts 21a and 21b are separated ( Figure 2 (b) state). At this time, Figure 2 The contact between the contacts 21a and 21b shown in (a) becomes Figure 2 (b) is the non-contact (separated) state shown by A, Figure 2 (a) is formed by the spring 26 shown in B. Figure 2 (b) is extended as shown by B. At this time, the rotating device 40 is rotated, and the film forming process is performed on the substrate W while the mounting table 20 is rotated.

[0090] In this embodiment, the cooling structure (including the cooling-side contact 21a) is configured as a block structure with a relatively large volume, thereby improving thermal conductivity during contact. Furthermore, for example, by configuring the mounting platform 20 (the cooled-side contact 21b) as a block structure with a relatively large volume, the cooling efficiency during separation can be improved.

[0091] In addition, the spring 26 is provided on the contact to reduce wear during contact and improve the reproducibility of the contact pressure. The spring 26 can also be provided on the mounting table side, and the pressing pressure during contact can be adjusted by using multiple springs 26.

[0092] Next, the application of the DC voltage to the chuck electrode 32 is stopped, and the substrate W is not attracted to the mounting table 20 by the static elimination process. Figure 5 As shown in (4), the substrate W is sent out. At this time, the rotating device 40 does not rotate, and the mounting table 20 does not rotate. By raising the second lifting device 78, the freezing device 30 is raised, and the contacts 21a and 21b are in contact ( Figure 2(a) status).

[0093] Then, if Figure 5 As shown in (5), in the idle state after the substrate W is sent out (waiting for the substrate W to be sent in), the contacts 21a and 21b are kept in contact ( Figure 2 At this time, the rotation of the rotating device 40 is stopped. When the next substrate W is fed in, the rotation of the rotating device 40 is returned to Figure 5 (1), execute Figure 5 Processing of (1) to (5).

[0094] [Control method of substrate processing apparatus]

[0095] Next, refer to Figure 6 , a control method of the substrate processing apparatus 100 according to one embodiment is described. Figure 6 This is a flowchart showing an example of a control method of the substrate processing apparatus 100 according to one embodiment. Figure 6 The processing is controlled by the control unit 80. The solid arrows indicate the direction of the processing when the temperature of the placement unit 25 for placing the substrate W is normal, and the dotted arrows indicate the direction of the processing when the temperature of the placement unit 25 is abnormal.

[0096] When this process starts, the control unit 80 controls the second lifting device 78 to raise the freezing device 30 so that the contactor contacts the freezing device 30 or the loading portion 25 before processing the substrate W loaded on the loading portion 25 of the loading table 20 (step S1).

[0097] By using the control of step S1, for example, Figure 2 In the example (a), the contact 21a contacts the mounting portion 25 via the contact 21b. Figure 4 In the example, the contact 21a contacts the cold link 35. As a result, the control unit 80 directly cools the loading portion 25 from the refrigeration device 30 (step S2). When the temperature of the loading portion 25 reaches the saturation state and the loading portion 25 is stabilized at a predetermined temperature (step S3), the control unit 80 sends the substrate W in (step S4). In addition, in step S3, when the temperature of the loading portion 25 does not reach the saturation state and the temperature of the loading portion 25 is abnormal, the control unit 80 does not send the substrate W in, but returns to step S2. In step S2, the refrigeration device 30 is used again to cool the loading portion 25, and the processes of steps S2 and S3 are repeated until the temperature of the loading portion 25 reaches the saturation state.

[0098] After the substrate W is loaded in step S4, the control unit 80 controls the application of a DC voltage to the chuck electrode 32, thereby contact cooling the substrate W while the electrostatic chuck holds the substrate W (step S5). Furthermore, the control unit 80 controls the supply of a first cooling gas (e.g., He gas) from the refrigerant supply flow path 51 to the space where the spring 26 is located, and the supply of a second cooling gas (e.g., He gas) from the second cooling gas supply pipe 34 between the lower surface of the substrate W and the upper surface of the mounting portion 25.

[0099] Next, the control unit 80 controls the contact 21a to separate from the mounting portion 25 to perform film forming processing (step S6). Figure 2 As shown in (b), the contact 21a is separated from the mounting portion 25 via the contact 21b. However, when the mounting table 20 is not rotated during the film formation process, the process of step S6 may not be performed and the process may proceed to step S7.

[0100] In step S6, the contact 21a is separated from the mounting portion 25, allowing the mounting portion 25 to rotate. The control unit 80 controls the mounting portion 25 to rotate using the rotation device 40 while performing the desired film formation process on the substrate W (step S7). However, if the film formation process is to be performed without rotating the mounting portion 25, the control unit 80 performs the film formation process on the substrate W after executing step S6 or without executing step S6. After the film formation process is completed on the substrate W, the control unit 80 stops the rotation of the mounting table 20 by the rotation device 40.

[0101] Next, the control unit 80 controls the second lifting device 78 to raise the refrigeration unit 30 so that the contact 21a contacts the placement unit 25 via the contact 21b, and the refrigeration unit 30 cools the placement unit 25 (step S8). The control unit 80 then sends the substrate W out (step S9), ending the process.

[0102] Furthermore, if, in steps S4 to S8, the temperature of the placement portion 25 exceeds a predetermined threshold value and is determined to be abnormal, the control unit 80 terminates the process (step S10) and returns to the process of step S2, which brings the contacts 21a and 21b into contact to cool the placement portion 25. In this case, the control unit 80 executes the process from step S2 onwards again.

[0103] In addition, Figure 6 In the control method of the substrate processing apparatus 100, the second lifting device 78 is used to lift the refrigeration device 30 so that the contactor contacts and separates from the refrigeration device 30 or the mounting table 20. However, the present invention is not limited to this. For example, the first lifting device 77 may be used to lift the mounting table 20 so that the contactor contacts and separates from the refrigeration device 30 or the mounting table 20.

[0104] The mounting table structure, substrate processing apparatus, and substrate processing apparatus control method disclosed herein are illustrative in all respects and are not intended to be limiting. The embodiments may be modified and improved in various forms without departing from the scope of the appended claims and their gist. The matters described in the various embodiments described above may also adopt other configurations within the scope of non-inconsistency and may be combined within the scope of non-inconsistency.

Claims

1. A mounting platform structure, wherein: The mounting platform structure has: a mounting table on which a substrate is mounted; a refrigeration mechanism that cools the substrate; a lifting drive unit that lifts the mounting table or the freezing mechanism; and A plurality of contacts are provided at relative positions between the freezing mechanism and the mounting table, The plurality of contacts include a plurality of first contacts disposed on the freezing mechanism side and a second contact disposed on the mounting table side. The plurality of first contacts are configured to come into contact with and separate from the second contacts by the lifting and lowering of the mounting table or the refrigeration mechanism by the lifting drive unit. The contact surfaces of the plurality of first contacts that come into contact with the second contacts are planes, The refrigeration mechanism is configured to be able to contact the mounting table via the plurality of first contacts and the second contacts by raising and lowering the mounting table or the refrigeration mechanism by the lifting drive unit. The plurality of first contacts are respectively connected to a plurality of elastic bodies and are installed on the freezing mechanism via the plurality of elastic bodies. The contact surfaces of the plurality of first contacts that come into contact with the second contacts are divided into a plurality of parts in the radial direction.

2. The mounting platform structure according to claim 1, wherein: The plurality of first contacts are respectively connected to a plurality of heat transfer members, and are attached to the freezing mechanism via a plurality of elastic bodies and a plurality of heat transfer members.

3. The mounting table structure according to claim 1 or 2, wherein: The refrigeration mechanism has a flow path for supplying a temperature regulating medium. The distal end of the flow path opens into a space between the refrigeration mechanism and the mounting table, and a temperature control medium is supplied from the flow path to the space.

4. The mounting table structure according to claim 3, wherein: The mounting table structure also includes a rotation drive unit for rotating the substrate. The rotation drive unit rotates the substrate in a state in which the plurality of first contacts are separated from the second contacts.

5. The mounting table structure according to claim 1 or 2, wherein: At least the surfaces of the plurality of first contacts that are in contact with the second contacts are surface-treated with plating, or at least the surfaces of the second contacts that are in contact with the plurality of first contacts are surface-treated with plating.

6. The mounting table structure according to claim 1 or 2, wherein: The contact surfaces of the plurality of first contacts with the second contacts are shaped by dividing a circle into four parts on the inner circumference and into eight parts on the outer circumference, or the contact surfaces of the second contacts with the plurality of first contacts are circular.

7. A substrate processing apparatus comprising a processing container and a mounting table structure, wherein: The mounting platform structure has: a mounting table for mounting a substrate in the processing container; a refrigeration mechanism that cools the substrate; a lifting drive unit that lifts the mounting table or the freezing mechanism; and A plurality of contacts are provided at relative positions between the freezing mechanism and the mounting table, The plurality of contacts include a plurality of first contacts disposed on the freezing mechanism side and a second contact disposed on the mounting table side. The plurality of first contacts are configured to come into contact with and separate from the second contacts by the lifting and lowering of the mounting table or the refrigeration mechanism by the lifting drive unit. The contact surfaces of the plurality of first contacts that come into contact with the second contacts are planes, The refrigeration mechanism is configured to be able to contact the mounting table via the plurality of first contacts and the second contacts by raising and lowering the mounting table or the refrigeration mechanism by the lifting drive unit. The plurality of first contacts are respectively connected to a plurality of elastic bodies and are installed on the freezing mechanism via the plurality of elastic bodies. The contact surfaces of the plurality of first contacts that come into contact with the second contacts are divided into a plurality of parts in the radial direction.

8. The substrate processing apparatus according to claim 7, wherein: The substrate processing apparatus includes a control unit. The control unit controls the lifting and lowering drive unit so that the plurality of first contacts come into contact with the second contacts before processing the substrate placed on the mounting table.

9. The substrate processing apparatus according to claim 8, wherein: The control unit controls the plurality of first contacts to be separated from the second contacts while processing the substrate.

10. The substrate processing apparatus according to claim 9, wherein: The substrate processing apparatus includes a rotation drive unit for rotating the substrate. The control unit controls the substrate to be rotated by the rotation drive unit after the plurality of first contacts are separated from the second contacts.

11. The substrate processing apparatus according to claim 10, wherein: The control unit controls so that, after processing the substrate, the rotation of the mounting table by the rotation drive unit is stopped and the plurality of first contacts are brought into contact with the second contacts by the elevation drive unit.

12. The substrate processing apparatus according to any one of claims 7 to 11, wherein: The lifting drive unit raises and lowers the mounting table or the refrigeration mechanism using an air cylinder or a motor.

13. A method for controlling a substrate processing apparatus, the substrate processing apparatus comprising a processing container and a mounting table, wherein: The mounting platform structure has: a mounting table for mounting a substrate in the processing container; a refrigeration mechanism that cools the substrate; a lifting drive unit that lifts the mounting table or the freezing mechanism; and A plurality of contacts are provided at relative positions between the freezing mechanism and the mounting table, The plurality of contacts include a plurality of first contacts disposed on the freezing mechanism side and a second contact disposed on the mounting table side. The plurality of first contacts are configured to come into contact with and separate from the second contacts by the lifting and lowering of the mounting table or the refrigeration mechanism by the lifting drive unit. The contact surfaces of the plurality of first contacts that come into contact with the second contacts are planes, The refrigeration mechanism is controlled so as to be brought into contact with the mounting table via the plurality of first contacts and the second contacts by the lifting and lowering of the mounting table or the refrigeration mechanism by the lifting and lowering drive unit. The plurality of first contacts are respectively connected to a plurality of elastic bodies and are installed on the freezing mechanism via the plurality of elastic bodies. The contact surfaces of the plurality of first contacts that come into contact with the second contacts are divided into a plurality of parts in the radial direction.

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