Thermally conductive structure and electronic device

Abstract

The application discloses a heat-conducting structure and an electronic device. The heat-conducting structure comprises a heat-conducting metal layer and a structure layer. The structure layer is arranged on the heat-conducting metal layer, wherein the structure layer is a stack structure formed by a graphene layer and a ceramic material layer, or the structure layer is a graphene mixed ceramic material layer. The application can quickly conduct the heat energy generated by a heat source to the outside, and improves the heat dissipation efficiency of the electronic device.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat conduction structure, in particular to a heat conduction structure and an electronic device capable of improving heat dissipation efficiency. BACKGROUND

[0002] With the development of technology, the design and research of electronic devices are prioritized to be thin and efficient. In the case of requiring high-speed operation and thinness, electronic components of electronic devices will inevitably generate more heat than before, so "heat dissipation" is an indispensable requirement for these components or devices. Especially for high-power components, the heat generated during operation increases significantly, causing the temperature of the electronic product to rise rapidly. When the electronic product is subjected to excessive temperature, it may cause permanent damage to the components or significantly reduce the service life.

[0003] The prior art mostly uses heat dissipation fins, fans, or heat dissipation elements (such as heat pipes) arranged on the components or devices to guide the waste heat generated during operation out. Among them, the heat dissipation fins or heat dissipation sheets generally have a certain thickness and are made of metal materials with high thermal conductivity or inorganic materials with high thermal conductivity. However, although the thermal conductivity of metal materials is very good, the density is large, which increases the overall weight and thickness of the heat dissipation fins or heat dissipation sheets. The structural strength of the polymer composite doped with inorganic materials is not good, which may not be suitable for application in some products.

[0004] Therefore, how to develop a heat conduction structure more suitable for the needs of high-power components or devices, which can be applied to different product fields to meet the needs of thinness, has been one of the goals pursued by related manufacturers. SUMMARY

[0005] The purpose of the present application is to provide a heat conduction structure and an electronic device using the same. The heat conduction structure of the present application can quickly conduct the heat generated by the heat source of the electronic device to the outside, improving the heat dissipation efficiency.

[0006] The heat conduction structure of the present application can be applied to different product fields to meet the needs of thinness.

[0007] The present application provides a heat conduction structure, which includes a heat conduction metal layer and a structure layer. The structure layer is arranged on the heat conduction metal layer; wherein the structure layer is a stack structure formed by a graphene layer and a ceramic material layer; or the structure layer is a graphene mixed ceramic material layer.

[0008] In an embodiment, the heat conduction metal layer includes copper, aluminum, copper alloy, or aluminum alloy.

[0009] In an embodiment, the material of the ceramic material layer includes boron nitride, aluminum oxide, aluminum nitride, or silicon carbide, or a combination thereof.

[0010] In embodiments, the material of the graphene hybrid ceramic material layer comprises graphene and a ceramic material, the ceramic material comprising boron nitride, aluminum oxide, aluminum nitride, or silicon carbide, or a combination thereof.

[0011] In embodiments, the ceramic material layer is disposed between the graphene layer and the thermally conductive metal layer.

[0012] In embodiments, the graphene layer is disposed between the ceramic material layer and the thermally conductive metal layer.

[0013] In embodiments, the ceramic material layer has a plurality of microstructures on a surface thereof distal to the thermally conductive metal layer, the microstructures having a shape that is columnar, spherical, pyramidal, trapezoidal, or irregular, or a combination thereof.

[0014] In embodiments, the ceramic material layer further comprises a filler material and / or a plurality of pores.

[0015] In embodiments, the graphene hybrid ceramic material layer has a plurality of microstructures on a surface thereof distal to the thermally conductive metal layer, the microstructures having a shape that is columnar, spherical, pyramidal, trapezoidal, or irregular, or a combination thereof.

[0016] In embodiments, the graphene hybrid ceramic material layer further comprises a filler material.

[0017] In embodiments, the filler material is aluminum oxide, aluminum nitride, or silicon carbide, boron nitride, or a combination thereof.

[0018] In embodiments, the filler material has a shape that is particulate, flaky, spherical, strip-like, nanotube-like, or irregular, or a combination thereof.

[0019] In embodiments, the thermally conductive structure further comprises a double-sided adhesive layer disposed on a side of the thermally conductive metal layer distal to the structure layer.

[0020] In embodiments, the double-sided adhesive layer is a thermally conductive double-sided adhesive.

[0021] The present disclosure also provides an electronic device comprising a heat source and the thermally conductive structure of any of the preceding embodiments, the thermally conductive structure being coupled to the heat source.

[0022] In embodiments, the electronic device further comprises a heat dissipation structure disposed on a side of the thermally conductive structure distal to the heat source.

[0023] As described above, in the thermally conductive structure of the present invention, a structural layer is disposed on the thermally conductive metal layer. This structural layer is a stacked structure formed by a graphene layer and a ceramic material layer; alternatively, the structural layer is a design combining graphene and ceramic material layers. When the thermally conductive structure is connected to a heat source of an electronic device, the heat generated by the heat source can be quickly and effectively conducted to the outside, thereby improving the heat dissipation performance of the electronic device. Furthermore, the thermally conductive structure of the present invention can be applied to different product fields, enabling electronic devices to meet the requirements of thinness. In addition, in the embodiments of the present invention, compared to a traditional protective layer made of PI, the ceramic material layer, in addition to providing protection and insulation, also improves thermal conductivity. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the heat-conducting structure according to an embodiment of the present invention.

[0025] Figures 2A to 2G These are schematic diagrams of the heat-conducting structures according to different embodiments of the present invention.

[0026] Figure 3 and Figure 4 These are schematic diagrams of electronic devices according to different embodiments of the present invention. Detailed Implementation

[0027] The following description, with reference to the accompanying drawings, illustrates thermally conductive structures and electronic devices according to some embodiments of the present invention, wherein the same components will be described using the same reference numerals. The components appearing in the following embodiments are only for illustrating their relative relationships and do not represent the actual proportions or dimensions of the components.

[0028] When the heat-conducting structure of this invention is applied to electronic devices, it can improve the heat dissipation efficiency of the electronic devices. The heat source of the electronic device can be its battery, control chip (e.g., central control unit (CPU)), driver chip, memory (e.g., but not limited to SSD solid-state drives), motherboard, display adapter, display panel, or flat light source, or other components, units, or modules that generate heat, and is not limited thereto. Furthermore, the heat-conducting structure of this invention can be applied to different product fields to achieve the requirements of thinner designs.

[0029] Figure 1 This is a schematic diagram of the heat-conducting structure according to an embodiment of the present invention. Figure 1 As shown, the thermally conductive structure 1 in this embodiment may include a thermally conductive metal layer 11 and a structural layer S.

[0030] The thermally conductive metal layer 11 includes a metal sheet, metal foil, or metal film with high thermal conductivity. Its material may include, for example, but is not limited to, copper, aluminum, copper alloys (alloys of copper and other metals), or aluminum alloys (alloys of aluminum and other metals), or combinations thereof. In this embodiment, the thermally conductive metal layer 11 is exemplified by an aluminum metal foil.

[0031] The structure layer S is disposed on the thermally conductive metal layer 11. The structure layer S can be a stack structure of the graphene layer 12 and the ceramic material layer 13, or the structure layer S can be a graphene mixed ceramic material layer. The structure layer S of the present embodiment is taken as an example of the stack structure of the graphene layer 12 and the ceramic material layer 13. In the present embodiment, the graphene layer 12 is disposed between the ceramic material layer 13 and the thermally conductive metal layer 11. Here, the graphene layer 12 includes a plurality of graphene micro-pieces, and since the graphene micro-pieces have extremely high thermal conductivity (thermal conductivity > 5000 W / m-K), the thermally conductive structure 1 can have good thermal conduction effect. In some embodiments, the graphene micro-pieces, solvent (and binder) can be mixed uniformly to form a slurry, and then the slurry is disposed on the thermally conductive metal layer 11 by a process such as coating or printing to form the graphene layer 12 (for example, Graphene Thermal Film, GTF). The above-mentioned solvent can be, for example, but not limited to, methyl ethyl ketone (MEK), water, acetone, ethyl acetate (EAC), 3-methoxy propyl methyl (MMP), toluene, alcohol, or a combination thereof, or other medium-high polarity solvents. In addition, the coating process can be, for example, but not limited to, spray coating or spin coating, and the printing process can be, for example, but not limited to, inkjet printing or screen printing. In some embodiments, the content of graphene micro-pieces in the total content can be greater than 0 and less than or equal to 15% (0 < graphene micro-pieces content < 15%), for example, 1.5%, 3.2%, 5%, 7.5%, 11%, 13%, or other.

[0032] In this embodiment, the ceramic material layer 13 is disposed on the surface of the graphene layer 12 away from the thermally conductive metal layer 11. In some embodiments, the ceramic material layer 13 can be formed on the graphene layer 12 by means of coating or printing, for example, to form the structural layer S. The material of the ceramic material layer 13 may include, for example, but is not limited to, a ceramic material with high thermal conductivity and an adhesive, with the ceramic material mixed in the adhesive. The ceramic material may include, for example, boron nitride (BN), alumina (Al2O3), aluminum nitride (AlN), or silicon carbide (SiC), or combinations thereof, or other ceramic materials with high thermal conductivity (K value). In this embodiment, the material of the ceramic material layer 13 is exemplified by a ceramic material including boron nitride (BN). It is worth noting that, since the graphene layer 12 is conductive, compared to the conventional protective layer made of polyimide (PI), the ceramic material layer 13 of this embodiment not only provides protection (wear resistance) and insulation properties, but also increases thermal conductivity. In other embodiments, the ceramic material layer 13 may be bonded to the upper surface of the graphene layer 12 by, for example, thermally conductive adhesive.

[0033] Continuing from the above, in the thermally conductive structure 1 of this embodiment, a structural layer S is disposed on the thermally conductive metal layer 11, and the structural layer S is a stacked structure formed by a graphene layer 12 and a ceramic material layer 13. When the thermally conductive structure 1 of this embodiment is connected to the heat source of the electronic device, the heat generated by the heat source can be quickly and effectively conducted to the outside, thereby improving the heat dissipation performance of the electronic device. In addition, compared with the traditional protective layer made of PI, the ceramic material layer 13 of this embodiment not only provides protection (wear resistance) and insulation, but also enhances the thermal conductivity. Furthermore, the thermally conductive structure 1 of this embodiment can be applied to different product fields, enabling electronic devices to meet the requirements of thinness.

[0034] In some embodiments, the thermally conductive structure may further include two release layers (not shown), which are correspondingly disposed on the upper and lower sides of the thermally conductive structure (e.g., Figure 1 The thermally conductive structure 1 has two release layers (upper and lower sides). When the thermally conductive structure is to be used, simply remove these two release layers, and then attach the thermally conductive structure to the heat source using double-sided adhesive (e.g., thermally conductive double-sided adhesive). In addition to its adhesive properties, the thermally conductive double-sided adhesive also assists in heat conduction. Furthermore, the material of the release layer can be, for example, but not limited to, paper, cloth, or polyester (e.g., polyethylene terephthalate, PET), or combinations thereof, and is not limited thereto. It should be noted that the upper and lower sides of the thermally conductive structure corresponding to the sides with release layers can also be applied to all the embodiments of the present invention below.

[0035] Please refer to Figures 2A to 2G The figures shown are schematic diagrams of the heat-conducting structures of different embodiments of the present invention.

[0036] like Figure 2AAs shown, the thermal conductive structure 1a of this embodiment has roughly the same component composition and connection relationship as the thermal conductive structure 1 of the previous embodiment. The difference is that the thermal conductive structure 1a of this embodiment also includes a double-sided adhesive layer 14, which is, for example, a thermally conductive double-sided adhesive, and can be disposed on the side of the thermally conductive metal layer 11 away from the structural layer S. In this embodiment, the double-sided adhesive layer 14 is disposed on the lower surface of the thermally conductive metal layer 11 away from the graphene layer 12. By using the double-sided adhesive layer 14 between the thermally conductive metal layer 11 and the heat source, the thermal conductive structure 1a can be attached to the heat source, and the heat energy generated by the heat source can be quickly dissipated to the outside through the conduction of the thermal conductive structure 1a. Of course, a heat dissipation structure (not shown in the figure) can also be provided on the side of the ceramic material layer 13 away from the heat source to accelerate the dissipation of heat energy.

[0037] The aforementioned thermally conductive double-sided adhesive may include an adhesive material and a thermally conductive material, with the thermally conductive material mixed in the adhesive material. In addition to its adhesive properties, the thermally conductive double-sided adhesive can also assist in heat conduction through the thermally conductive material. The thermally conductive material may include, for example, graphene, reduced graphene oxide, or ceramic materials, or combinations thereof. Ceramic materials are, for example, but not limited to, boron nitride, alumina, aluminum nitride, or silicon carbide, which have high thermal conductivity, or combinations thereof, and are not limited thereto. Furthermore, the adhesive material may be, for example, but not limited to, pressure-sensitive adhesive (PSA), and its material may include, for example, rubber-based, acrylic-based, or silicone-based materials, or combinations thereof; while the chemical composition may be rubber-based, acrylic-based, or silicone-based, or combinations thereof, and this invention is not limited thereto. It should also be noted that the feature of using the double-sided adhesive layer 14 to connect the thermally conductive structure (the thermally conductive metal layer) to the heat source can also be applied to all of the following embodiments.

[0038] In addition, such as Figure 2B As shown, the heat-conducting structure 1b of this embodiment has a component composition and connection relationship of the components that are largely the same as those of the heat-conducting structure 1 of the aforementioned embodiment. The difference lies in that the ceramic material layer 13b of the heat-conducting structure 1b in this embodiment has multiple microstructures 131 on the surface away from the heat-conducting metal layer 11. These microstructures 131 can have shapes such as columnar, spherical, pyramidal, trapezoidal, or irregular shapes, or combinations thereof, and are not limited in shape. In some embodiments, microstructures 131 can be fabricated on the surface of the ceramic material layer 13b using methods such as screen printing, relief printing, or other means to increase the heat dissipation area, thereby improving the heat dissipation effect. The feature of the surface of the ceramic material layer 13b having multiple microstructures 131 can also be applied to the following... Figures 2C to 2E In the embodiments described above.

[0039] In addition, such as Figure 2CAs shown, the heat conduction structure 1c of the present embodiment has substantially the same assembly composition and connection relationship of each component as the heat conduction structure 1 of the previous embodiments. The difference is that the ceramic material layer 13c of the heat conduction structure 1c of the present embodiment can further include a filler material 132, which can be, for example, a ceramic material, and can have a shape of a particle, a sheet, a sphere, a strip, a nanotube, or an irregular shape, or a combination thereof, without limitation. In addition, the size of the filler material 132 can be between 0.5 μm and 10 μm. In some embodiments, the filler material 132 can be, for example, aluminum oxide, aluminum nitride, or silicon carbide, boron nitride, or a combination thereof, thereby increasing the heat dissipation effect of the ceramic material layer 13c. The nanotube-shaped filler material 132 can be, for example, boron nitride nanotubes.

[0040] In addition, as shown in FIG. 1F, the heat conduction structure 1f of the present embodiment can further include a ceramic material layer 13f disposed between the graphene layer 12 and the heat conduction metal layer 11. In addition, the feature of the ceramic material layer 13f of the previous embodiments can also be applied to the present embodiment. Figure 2D As shown, the heat conduction structure 1d of the present embodiment has substantially the same assembly composition and connection relationship of each component as the heat conduction structure 1 of the previous embodiments. The difference is that the ceramic material layer 13d of the heat conduction structure 1d of the present embodiment can further include a plurality of pores 133. In some embodiments, a pore-forming agent can be added in the process of making the ceramic material layer 13d, so that the ceramic material layer 13d can form a plurality of pores 133 to increase the specific surface area and improve the heat radiation effect of heat dissipation. In some embodiments, the pore-forming agent is, for example, a ceramic pore-forming agent.

[0041] In addition, as shown in FIG. 1F, the heat conduction structure 1f of the present embodiment can further include a ceramic material layer 13f disposed between the graphene layer 12 and the heat conduction metal layer 11. In addition, the feature of the ceramic material layer 13f of the previous embodiments can also be applied to the present embodiment. Figure 2E As shown, the heat conduction structure 1e of the present embodiment has substantially the same assembly composition and connection relationship of each component as the heat conduction structure 1 of the previous embodiments. The difference is that the ceramic material layer 13e of the heat conduction structure 1e of the present embodiment includes a filler material 132 and a plurality of pores 133.

[0042] In addition, as shown in FIG. 1F, the heat conduction structure 1f of the present embodiment can further include a ceramic material layer 13f disposed between the graphene layer 12 and the heat conduction metal layer 11. In addition, the feature of the ceramic material layer 13f of the previous embodiments can also be applied to the present embodiment. Figure 2F As shown, the heat conduction structure 1f of the present embodiment has substantially the same assembly composition and connection relationship of each component as the heat conduction structure 1 of the previous embodiments. The difference is that the ceramic material layer 13 of the heat conduction structure 1f of the present embodiment is disposed between the graphene layer 12 and the heat conduction metal layer 11. In addition, the feature of the ceramic material layer of the previous embodiments can also be applied to the present embodiment.

[0043] In addition, as shown in FIG. 1F, the heat conduction structure 1f of the present embodiment can further include a ceramic material layer 13f disposed between the graphene layer 12 and the heat conduction metal layer 11. In addition, the feature of the ceramic material layer 13f of the previous embodiments can also be applied to the present embodiment. Figure 2GAs shown, the thermally conductive structure 1g of this embodiment has a component composition and connection relationship of the components that are largely the same as those of the thermally conductive structure 1 of the aforementioned embodiment. The difference is that the structural layer S of this embodiment is a graphene-ceramic material layer 15. The graphene-ceramic material layer 15 comprises graphene and ceramic materials, and the ceramic materials may be, for example, but not limited to, boron nitride, alumina, aluminum nitride, or silicon carbide, or combinations thereof, which have high thermal conductivity. In some embodiments, the mixing ratio of graphene and ceramic materials may be, for example, 1:9, 3:7, or 5:5, or other ratios, and is not limited thereto. In some embodiments, the graphene-ceramic material layer 15 may also include the aforementioned filler material. Furthermore, the aforementioned microstructure features can also be applied to the graphene-ceramic material layer 15 of this embodiment.

[0044] in addition, Figure 3 and Figure 4 These are schematic diagrams of electronic devices according to different embodiments of the present invention. Figure 3 As shown, the present invention also proposes an electronic device 2, which may include a heat source 21 and a thermally conductive structure 22, the thermally conductive structure 22 being connected to the heat source 21. In some embodiments, the thermally conductive structure 22 may be connected to the heat source 21 via a double-sided adhesive layer 23 (e.g., thermally conductive double-sided adhesive). Here, the thermally conductive structure 22 may be one of the aforementioned thermally conductive structures 1, 1a to 1g, or variations thereof, the specific technical details of which have been described in detail above and will not be elaborated further here. It is understood that if the thermally conductive structure 22 itself has the aforementioned double-sided adhesive layer 14, then the double-sided adhesive layer 23 is not required.

[0045] Electronic device 2 or 2a may be, for example, but not limited to, a flat panel display or a flat light source, such as, but not limited to, a mobile phone, a laptop, a tablet computer, a television, a monitor, a backlight module, or a lighting module, or other flat electronic devices. The heat source may be the electronic device's battery, control chip (e.g., a central control unit (CPU)), driver chip, memory (e.g., but not limited to, an SSD), motherboard, display adapter, display panel, or flat light source, or other components or units that generate heat, without limitation. In some embodiments, when electronic device 2 is a flat panel display, such as, but not limited to, a light-emitting diode (LED) display, an organic light-emitting diode (OLED) display, or a liquid crystal display (LCD), the heat source 21 may be a display panel with a display surface, and the thermally conductive structure 22 may be directly or indirectly (e.g., via thermally conductive double-sided adhesive) attached to the surface opposite the display surface, thereby assisting in heat conduction and dissipation and improving the heat dissipation performance of the flat panel display. In other embodiments, when the electronic device 2 is a planar light source, such as, but not limited to, a backlight module, an LED lighting module, or an OLED lighting module, the heat source 21 can be a light-emitting unit with a light-emitting surface, and the heat-conducting structure 22 can be directly or indirectly (e.g., through an adhesive) attached to the surface opposite the light-emitting surface, thereby assisting in heat conduction and dissipation and improving the heat dissipation performance of the planar light source.

[0046] In addition, such as Figure 4 As shown, the electronic device 2a in this embodiment may further include a heat dissipation structure 24, which is disposed on the side of the heat-conducting structure 22 away from the heat source 21. Therefore, in the electronic device 2a, the heat dissipation structure 24 can be connected to the heat source 21 via the heat-conducting structure 22, allowing the heat generated by the heat source 21 to be quickly conducted to the heat dissipation structure 24 with the assistance of the heat-conducting structure 22. The heat dissipation structure 24 then dissipates the heat generated by the electronic device 2a to the outside, improving the heat dissipation effect. In some embodiments, the heat dissipation structure 24 may be, for example, a heat dissipation film, such as, but not limited to, a graphene thermal conductive film (GTF); or the heat dissipation structure 24 may be a conventional heat dissipation device or structure, such as including a fan, fins, thermal paste, heat sink, radiator, or other forms of heat dissipation components, heat dissipation units, or heat dissipation devices, or combinations thereof. This invention is not limited to these embodiments. In some embodiments, the heat dissipation structure 24 and the heat-conducting structure 22 may be connected by, for example, thermally conductive double-sided adhesive.

[0047] In addition, in the comparative experiments of the control group 1 of the aluminum metal sheet layer, the control group 2 of the aluminum metal sheet layer plus the graphene layer, and the heat conduction structure 1, the heat conduction structure 1f and the heat conduction structure 1g of the application, under the condition of the same heat source, the temperature of the surface of the heat conduction structure 1 far from the heat source can be about 12.5℃ lower than that of the control group 1; the temperature of the surface of the heat conduction structure 1f far from the heat source can be about 13.21℃ lower than that of the control group 1; the temperature of the surface of the heat conduction structure 1g far from the heat source can be about 10.32℃ lower than that of the control group 1; the temperature of the surface of the heat conduction structure 1 far from the heat source can be about 5.06℃ lower than that of the control group 2; the temperature of the surface of the heat conduction structure 1f far from the heat source can be about 5.77℃ lower than that of the control group 2; and the temperature of the surface of the heat conduction structure 1g far from the heat source can be about 2.88℃ lower than that of the control group 2 at the highest, proving that the application can indeed effectively and quickly conduct the heat generated by the heat source to the outside, thereby improving the heat dissipation efficiency.

[0048] In summary, in the heat conduction structure of the application, the structure layer is arranged on the heat conduction metal layer, wherein the structure layer is a stack structure formed by the graphene layer and the ceramic material layer; or the structure layer is a structure design of the graphene mixed ceramic material layer. When the heat conduction structure is connected with the heat source of the electronic device, the heat generated by the heat source can be quickly and effectively conducted to the outside, thereby improving the heat dissipation efficiency of the electronic device. In addition, the heat conduction structure of the application can be applied to different product fields so that the electronic device can meet the demand for thinness. In addition, in the embodiment of the application, compared with the protective layer of the conventional material PI, the ceramic material layer can not only provide protection and insulation effect, but also improve the heat conduction effect.

[0049] The above is only exemplary and is not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the application shall be included in the scope of the appended claims.

Claims

1. A thermally conductive structure, comprising: Thermally conductive metal layer; as well as A structural layer is disposed on the thermally conductive metal layer; The structural layer is a stacked structure formed by a graphene layer and a ceramic material layer; The ceramic material layer comprises ceramic material and adhesive material, wherein the ceramic material is mixed in the adhesive material; the ceramic material layer also includes a plurality of pores, wherein the pores are formed by adding a pore-forming agent during the manufacturing process of the ceramic material layer; The graphene layer is disposed between the ceramic material layer and the thermally conductive metal layer; The surface of the ceramic material layer away from the thermally conductive metal layer has multiple microstructures, and the microstructures are columnar, spherical, pyramidal, trapezoidal, or irregular in shape, or a combination thereof. The ceramic material layer further includes a filler material, which is alumina, aluminum nitride, silicon carbide, boron nitride, or a combination thereof, and the filler material is in the form of granules, flakes, spheres, strips, nanotubes, or irregular shapes, or a combination thereof.

2. The thermally conductive structure as claimed in claim 1, wherein the thermally conductive metal layer comprises copper, aluminum, copper alloy, or aluminum alloy.

3. The thermally conductive structure of claim 1, wherein the material of the ceramic material layer includes boron nitride, alumina, aluminum nitride, or silicon carbide or a combination thereof.

4. The thermally conductive structure according to any one of claims 1 to 3, further comprising: A thermally conductive double-sided adhesive layer is disposed on the side of the thermally conductive metal layer away from the structural layer.

5. An electronic device comprising: Heat source; as well as The heat-conducting structure as described in any one of claims 1 to 4, wherein the heat-conducting structure is connected to the heat source.

6. The electronic device of claim 5, further comprising: A heat dissipation structure is disposed on the side of the heat-conducting structure away from the heat source.

Images