Automatic patch equipment and automatic patch method

Abstract

The present application provides an automatic patch device and an automatic patch method to solve the problem that lead frame products cannot be automatically mounted in large quantities. The automatic patch device includes: a lead frame feeding mechanism, a carrier feeding mechanism, a mounting mechanism and a controller. The lead frame feeding mechanism includes: a first carrier for placing multiple stacked lead frames, two adjacent lead frames stacked up and down are separated by a protective member; a first mechanical claw for taking a single lead frame or a protective member from the first carrier, and for placing a single lead frame on the second carrier; a weight detection device for detecting the weight data of the object taken by the first mechanical claw; a controller for judging whether the object taken by the first mechanical claw is a lead frame or a protective member according to the weight data; when the object taken by the first mechanical claw is a lead frame, the first mechanical claw is controlled to place the lead frame on the second carrier. The automatic patch method is applied to the automatic patch device.

Description

Technical Field

[0001] The present application relates to an automatic patch device and an automatic patch method. Background Art

[0002] Since the lead frame in traditional packaging does not need to be installed on a certain bearing surface, a plane for attaching the chip already exists in each unit of the lead frame, so it can be used directly alone. When using it, just put it into the chip mounting machine and directly mount the chip.

[0003] The main purpose of the lead frame used in the new fan-out package is to interconnect the two sides of the chip, that is, to connect the front circuit structure of the chip with the back of the chip. It can also play the role of multi-chip interconnection. Therefore, the chip position of this type of lead frame is completely hollowed out, and the lead frame needs to be mounted on a flat carrier for chip installation.

[0004] Currently, in the new fan-out packaging, the lead frames are mostly manually operated, and the operation is completed by a simple marking line positioning and manual placement process. Automated equipment has not yet been used on a large scale.

[0005] Currently, the closest automatic mounting equipment (SMT) is used in the fields of chip mounting, LED mounting, liquid crystal backlight assembly, etc. The closest prior art to the present invention is an automatic liquid crystal screen assembly equipment.

[0006] As shown in Figures 1(a) and 1(b), the automated LCD screen assembly equipment includes a first conveying platform 11', a second conveying platform 12', a first carrier 21', a second carrier 22', and a mounting mechanical claw 31'. The first conveying platform 11' is used to convey the LCD screen to be installed, and the second conveying platform 12' is used to convey the backlight source. The first conveying platform 11' and the second conveying platform 12' are both "three-character" structures with two hollows in the middle. The first carrier 21' and the second carrier 22' are both hollowed in the middle to avoid the middle structure of the corresponding conveying platform.

[0007] After the backlight source and the LCD screen are transported to the designated positions by the first conveyor 11' and the second conveyor 12' respectively, the first carrier 21' and the second carrier 22' are synchronously moved to the bottom of the corresponding conveyor facing the product, and then rise to hold up the product and vacuum adsorb to prevent displacement. The first carrier 21' then transports the LCD screen to the receiving position of the mounting mechanical claw 31' and rises, allowing the mounting mechanical claw 31' to pick up the LCD screen. After the mounting mechanical claw 31' picks up the LCD screen, the first carrier 21' leaves, and the second carrier 22' carries the backlight source to the bottom of the mounting mechanical claw 31' and rises to start product assembly. The installed product is moved by the second carrier 22' and placed on the third conveyor 13' to complete product mounting.

[0008] As described above, in the prior art, when installing the lead frame, since the operation process is basically manual, the operator's operating techniques and process flow have a direct impact on the final quality of the product.

[0009] If similar automated machinery in the field of this technology is used, many unavoidable problems will arise due to different product characteristics. For example, the closest automated LCD screen assembly equipment mentioned above has the following problems:

[0010] Compared with LCD screens, lead frame products are soft, thin, and easily deformed, so they cannot be loaded using the conveyor method. In addition, the incoming lead frame materials are stacked in boxes with a protective layer in between to prevent the pins of the two adjacent lead frames from scratching each other. This makes the above-mentioned mechanical loading method even more unsuitable. Summary of the invention

[0011] One aspect of the present application provides an automatic chip placement device, which is used to place multiple lead frames on corresponding chip placement positions on a carrier board. The automatic chip placement device includes: a lead frame feeding mechanism, a carrier board feeding mechanism, a placement mechanism and a controller. The lead frame feeding mechanism, the carrier board feeding mechanism and the placement mechanism are electrically connected to the controller respectively. The lead frame feeding mechanism is used to provide the lead frame, the carrier board feeding mechanism is used to provide the carrier board, and the placement mechanism is used to sequentially place multiple lead frames on corresponding chip placement positions on the carrier board; wherein,

[0012] The lead frame feeding mechanism comprises: a first carrier, a second carrier, a first mechanical claw and a weight detection device, wherein the second carrier, the first mechanical claw and the weight detection device are all electrically connected to the controller;

[0013] The first carrier is used to place a plurality of stacked lead frames, and two adjacent lead frames stacked up and down are separated by a protective member;

[0014] The second carrier is used to transport a single lead frame to a position to be picked up;

[0015] The first mechanical claw is used to take a single lead frame or a protective member from the first carrier, and is used to place the single lead frame on the second carrier, and to place the protective member in a waste box provided next to the first carrier;

[0016] The weight detection device is disposed on the first mechanical claw, and is used to detect weight data of an object picked up by the first mechanical claw, and send the weight data to the controller;

[0017] The controller is used to obtain the weight data, and determine whether the object picked up by the first mechanical claw is the lead frame or the protective part based on the weight data; when the object picked up by the first mechanical claw is the lead frame, the controller controls the first mechanical claw to place the lead frame on the second carrier; when the object picked up by the first mechanical claw is the protective part, the controller controls the first mechanical claw to place the protective part in the waste box.

[0018] Optionally, the second stage is movable along a first direction, a second direction and a third direction that are perpendicular to each other.

[0019] Optionally, the automatic patch device further includes a first camera device, and the first camera device is electrically connected to the controller;

[0020] The first camera device is used to capture the lead frame to obtain a lead frame image before the placement mechanical claw takes the lead frame, and send the lead frame image to the controller;

[0021] The controller is also used to obtain the lead frame image and determine whether the lead frame is a defective product based on the lead frame image; if the lead frame is a defective product, the controller controls the first mechanical claw to place the lead frame into the waste box.

[0022] Optionally, the plate loading mechanism includes: a third carrier, a fourth carrier, and a second mechanical claw, and the third carrier, the fourth carrier and the second mechanical claw are all electrically connected to the controller;

[0023] The third carrier is a conveyor belt, which is used to transfer the carrier to be mounted to a carrier to be grasped position;

[0024] The fourth carrier is used to transport a single carrier to a position to be mounted, and the fourth carrier can move along a first direction, a second direction and a third direction perpendicular to each other, and the surface of the fourth carrier located below the carrier is a plane arranged along the horizontal direction;

[0025] The second mechanical claw is used to take the carrier located at the carrier to be grasped position on the third carrier, and is used to place the carrier on the fourth carrier;

[0026] The mounting mechanism includes a rotatable robotic arm, which is electrically connected to the controller. The rotatable robotic arm includes multiple robotic heads rotating around the same central axis. Each of the robotic heads is provided with a mounting mechanical claw at one end away from the central axis. Each of the mounting mechanical claws is electrically connected to the controller respectively. The multiple mounting mechanical claws are used to sequentially pick up a single lead frame on the second carrier at the position to be picked up, and sequentially mount the lead frames on the patch positions of the carrier on the fourth carrier at the position to be mounted.

[0027] Optionally, the automatic patch device further comprises a second camera device, which is electrically connected to the controller; and a positioning point is provided on the carrier board;

[0028] The second camera device is used for photographing the carrier to obtain a carrier image before the mounting mechanical claw mounts the lead frame on the carrier in sequence, and sending the carrier image to the controller;

[0029] The controller is also used to obtain the carrier image, calculate the position information of the chips to be mounted on the carrier according to the positioning point position information of the positioning point on the carrier image, and control the mounting mechanical claw to mount the lead frame on the positions to be mounted on the carrier in sequence.

[0030] Optionally, each of the mounting mechanical claws is provided with a vacuum adsorption portion, and the lead frame is fixed to the mounting mechanical claw via the vacuum adsorption portion.

[0031] Optionally, a vacuum adsorption device is provided on the second carrier, for fixing the lead frame on the second carrier by vacuum adsorption.

[0032] Optionally, the automatic placement equipment further comprises a vacuum pressing mechanism, which is electrically connected to the controller and is used to perform vacuum pressing on the mounted lead frame and the carrier.

[0033] Optionally, the vacuum pressing mechanism includes a third mechanical claw, a fifth carrier and a vacuum pressing device, and the third mechanical claw, the fifth carrier and the vacuum pressing device are all electrically connected to the controller;

[0034] The third mechanical gripper is used to pick up the mounted carrier and place the carrier on the fifth carrier;

[0035] The fifth carrier is a conveyor belt, which is used to transfer the mounted carrier to a position to be pressed;

[0036] The vacuum pressing device is used to press the mounted carrier at the position to be pressed.

[0037] A second aspect of the present application provides an automatic patch method, which is applied to the automatic patch device as described above, and comprises the following steps:

[0038] Controlling the lead frame feeding mechanism to provide the lead frame, comprising: taking a single lead frame or the protective member from the first carrier by the first mechanical claw, obtaining weight data of the object taken by the first mechanical claw detected by the weight detection device, and judging whether the object taken by the first mechanical claw is the lead frame or the protective member according to the weight data; in the case where the object taken by the first mechanical claw is the lead frame, controlling the first mechanical claw to place the lead frame on the second carrier; in the case where the object taken by the first mechanical claw is the protective member, controlling the first mechanical claw to place the protective member in the waste box;

[0039] Controlling the carrier feeding mechanism to provide the carrier;

[0040] The mounting mechanism is controlled to mount a plurality of lead frames on corresponding mounting positions on the carrier in sequence.

[0041] The above-mentioned automatic patch equipment and automatic patch method provided in the embodiment of the present application solve the problem that lead frame products cannot be automatically mounted in large quantities, and ensure production efficiency and yield. The automatic patch equipment of the present application can solve the lead frame feeding problem and realize a fully automated protective part removal process by setting a weight detection device in the lead frame feeding mechanism to distinguish between the lead frame and the protective part. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] FIG. 1( a ) is a schematic structural diagram of an automated liquid crystal screen assembly device in the prior art.

[0043] FIG. 1( b ) is a schematic structural diagram of another working state of the automated liquid crystal screen assembly equipment in the prior art.

[0044] Figure 2 It is a schematic diagram of the top view of the structure of an automatic placement device according to an exemplary embodiment of the present application.

[0045] Figure 3 It is a schematic side structural diagram of the first carrier and the third carrier of the automatic placement equipment according to an exemplary embodiment of the present application.

[0046] Figure 4It is a side view structural schematic diagram of a lead frame loading mechanism of an automatic placement device according to an exemplary embodiment of the present application when the second carrier is located below the placement mechanical claw.

[0047] Figure 5 It is a schematic diagram of the top view of the second carrier of the automatic placement equipment according to an exemplary embodiment of the present application.

[0048] Figure 6 It is a flow chart of an automatic patch method proposed according to an exemplary embodiment of the present application.

[0049] Figure 7(a)-Figure 7(i) It is a process flow chart of an automatic patch method proposed according to an exemplary embodiment of the present application.

[0050] Description of Reference Numerals

[0051] Automatic mounting equipment 1

[0052] Lead frame 2

[0053] Lead frame feeding mechanism 10

[0054] The first stage 11

[0055] The first limiting protrusion 111

[0056] The second stage 12

[0057] Vacuum adsorption device 121

[0058] Vacuum generator 122

[0059] Vacuum hole 123

[0060] Pipeline 124

[0061] The first mechanical claw 13

[0062] Weight detection device 14

[0063] Waste box 15

[0064] Carrier 3

[0065] Plate loading mechanism 20

[0066] The third stage 21

[0067] The second limiting protrusion 211

[0068] The fourth platform 22

[0069] Second mechanical claw 23

[0070] Mounting mechanism 30

[0071] Rotatable robotic arm 31

[0072] Middle axis 32

[0073] Mechanical head 33

[0074] Mounting mechanical claw 34

[0075] Vacuum adsorption unit 341

[0076] Vacuum pressing mechanism 40

[0077] First camera device 50

[0078] Second camera device 60

[0079] The third mechanical claw 41

[0080] The fifth platform 42

[0081] Vacuum pressing device 43

[0082] First direction X

[0083] The second direction Z

[0084] The third direction Y DETAILED DESCRIPTION

[0085] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0086] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The words "one" or "one" and the like used in this application specification and claims do not indicate a quantitative limitation, but indicate the existence of at least one. "Multiple" means two or more. "Including" or "including" and the like mean that the elements or objects appearing in front of "including" or "including" include the elements or objects listed after "including" or "including" and their equivalents, and do not exclude other elements or objects. "Connected" or "connected" and the like are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect. "On" and / or "below" and the like are only for the convenience of explanation, and are not limited to a position or a spatial orientation. The singular forms of "one", "said" and "the" used in this application specification and the attached claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0087] Please combine Figure 2 and Figure 3 It can be understood that the present embodiment provides an automatic chip placement device 1. The automatic chip placement device 1 is used to mount multiple lead frames 2 on corresponding chip placement positions on a carrier board 3. When mounting multiple lead frames 2 on the carrier board 3, the multiple lead frames 2 can be mounted on the corresponding chip placement positions on the carrier board 3 in sequence according to a certain order, or multiple lead frames 2 can be mounted on the corresponding chip placement positions on the carrier board 3 in batches at the same time.

[0088] The automatic chip placement equipment 1 includes: a lead frame feeding mechanism 10, a substrate feeding mechanism 20, a mounting mechanism 30, a vacuum pressing mechanism 40 and a controller, wherein the lead frame feeding mechanism 10, the substrate feeding mechanism 20, the mounting mechanism 30 and the vacuum pressing mechanism 40 are electrically connected to the controller respectively. The lead frame feeding mechanism 10 is used to provide a lead frame 2, the substrate feeding mechanism 20 is used to provide a substrate 3, and the mounting mechanism 30 is used to sequentially mount a plurality of lead frames 2 on corresponding chip placement positions on the substrate 3. The vacuum pressing mechanism 40 is used to vacuum press the mounted lead frame 2 and the substrate 3.

[0089] Specifically, the lead frame feeding mechanism 10 includes: a first carrier 11, a second carrier 12, a first mechanical claw 13 and a weight detection device 14, and the second carrier 12, the first mechanical claw 13 and the weight detection device 14 are all electrically connected to the controller.

[0090] The first carrier 11 is used to place a plurality of stacked lead frames 2, two adjacent lead frames 2 stacked one above the other are separated by a protective member 4, and the lead frames 2 and the protective member 4 have different weights. A first limiting protrusion 111 is provided on the first carrier 11, and the first limiting protrusion 111 is used to limit the movement of the plurality of stacked lead frames 2.

[0091] The second carrier 12 is used to transport a single lead frame 2 to a position to be picked up. The second carrier 12 can move along a first direction X, a second direction Z, and a third direction Y that are perpendicular to each other, so as to facilitate the placement mechanism 30 to pick up the lead frame 2. Figure 2 In the figure, the first direction X is the left-right direction in the figure, and the second direction Z is the up-down direction in the figure; Figure 3 , the second direction Z is the left-right direction in the figure, and the third direction Y is the up-down direction in the figure, that is, the third direction Y is the vertical direction.

[0092] like Figure 4 and Figure 5 As shown, preferably, a vacuum adsorption device 121 is provided on the second carrier 12, which is used to fix the lead frame 2 on the second carrier 12 by vacuum adsorption. Specifically, the vacuum adsorption device 121 includes a vacuum generator 122, a vacuum hole 123, and a pipeline 124 connected between the vacuum generator 122 and the vacuum hole 123. The vacuum generator 122 is arranged below the second carrier 12 along the third direction Y, and the number of vacuum holes 123 is multiple, and the multiple vacuum holes 123 are located at the positive projection ( Figure 5 The lead frame 2 is placed on the second stage 12 and the vacuum generator 122 is activated. The vacuum holes 123 absorb the lead frame 2 to fix the lead frame 2 on the second stage 12. The lead frame 2 is fixed to the second stage 12 in all directions by the plurality of vacuum holes 123 arranged along the inner periphery of the positive projection of the lead frame 2 on the second stage 12. Figure 4 In the figure, the second direction Z is the left-right direction in the figure, and the third direction Y is the up-down direction in the figure, that is, the third direction Y is the vertical direction; Figure 5 , the first direction X is the left-right direction in the figure, and the second direction Z is the up-down direction in the figure.

[0093] The first mechanical claw 13 is used to take a single lead frame 2 or a protective member 4 from the first stage 11, and to place the single lead frame 2 on the second stage 12, and to place the protective member 4 in a waste box 15 provided next to the first stage 11. Providing the waste box 15 next to the first stage 11 can improve the efficiency of discarding the protective member 4 and unqualified lead frames 2. After judging that the lead frame 2 is a defective product, the movement mode of the first mechanical claw 13 only adds a discarding action of moving upward compared with the normal movement mode, and the movement path is similar, which has very little impact on the working hours.

[0094] The weight detection device 14 is disposed on the first mechanical gripper 13 , and is used to detect the weight data of the object picked up by the first mechanical gripper 13 , and send the weight data to the controller.

[0095] The controller is used to obtain the weight data and determine whether the object picked up by the first mechanical claw 13 is a lead frame 2 or a protective part 4 based on the weight data; when the object picked up by the first mechanical claw 13 is a lead frame 2, the first mechanical claw 13 is controlled to place the lead frame 2 on the second carrier 12; when the object picked up by the first mechanical claw 13 is the protective part 4, the first mechanical claw 13 is controlled to place the protective part 4 in the waste box 15.

[0096] In this way, by providing a weight detection device 14 in the lead frame feeding mechanism 10 to distinguish the lead frame 2 from the protective member 4, the lead frame 2 feeding problem can be solved and a fully automated process of discarding the protective member 4 can be achieved.

[0097] The plate loading mechanism 20 includes: a third carrier 21, a fourth carrier 22, and a second mechanical claw 23. The third carrier 21, the fourth carrier 22, and the second mechanical claw 23 are all electrically connected to the controller.

[0098] The third carrier 21 is a conveyor belt, which is used to transfer the carrier 3 to be mounted to the position where the carrier 3 is to be grasped. A second limiting protrusion 211 is provided on the third carrier 21, and the second limiting protrusion 211 is used to limit the movement of the carrier 3.

[0099] The fourth carrier 22 is used to transport a single carrier 3 to a position to be mounted. The fourth carrier 22 can move along the first direction, the second direction and the third direction to facilitate the mounting mechanism 30 to mount the lead frame 2 on the carrier 3. The surface of the fourth carrier 22 located below the carrier 3 is a plane set in the horizontal direction. In this way, by setting the surface of the fourth carrier 22 located below the carrier 3 as a plane set in the horizontal direction, it can be ensured that the carrier 3 is in a completely horizontal state, thereby meeting the high-precision installation requirements in the chip industry, and solving the problem that manual loading is difficult due to the large and heavy carrier 3, and the safety problem of personnel is easy to cause.

[0100] Preferably, the material of the carrier plate 3 is metal; a magnetic fixing device is provided on the fourth carrier 22, and the magnetic fixing device is arranged corresponding to the carrier plate 3, and the carrier plate 3 is fixed on the fourth carrier 22 by the magnetic fixing device. In this way, the carrier plate 3 is fixed by magnetic force and the flatness of the carrier plate 3 is maintained.

[0101] The second mechanical gripper 23 is used to take the carrier board 3 located at the carrier board 3 to be grasped position from the third carrier stage 21 , and is used to place the carrier board 3 on the fourth carrier stage 22 .

[0102] The plate loading mechanism 20 of the present embodiment realizes fully automated transfer of the plate 3 through a specific structural setting, thereby achieving automated production while ensuring accuracy.

[0103] The mounting mechanism 30 includes a rotatable mechanical arm 31, which is electrically connected to the controller. The rotatable mechanical arm 31 includes a plurality of mechanical heads 33 rotating around the same central axis 32, and each mechanical head 33 is provided with a mounting mechanical claw 34 at one end away from the central axis 32, and each mounting mechanical claw 34 is electrically connected to the controller, and the plurality of mounting mechanical claws 34 are used to sequentially pick up a single lead frame 2 on the second carrier 12 at the position to be picked up, and sequentially mount the lead frame 2 on the mounting position of the carrier 3 on the fourth carrier 22 at the position to be mounted. By setting the rotatable mechanical arm 31, while realizing batch installation of the lead frame 2 on the carrier 3, when the angle deviation of the object to be installed occurs, the rotatable mechanical arm 31 and the fourth carrier 22 can be coordinated to adjust and correct in time, so as to ensure normal installation. The number of mechanical heads 33 is 2n, where n is an integer greater than 2. The number of mechanical heads 33 can be adjusted according to the actual production requirements, that is, the size of the lead frame 2.

[0104] Please refer to Figure 4 Preferably, each mounting mechanical claw 34 is provided with a vacuum adsorption portion 341, and the lead frame 2 is fixed to the mounting mechanical claw 34 through the vacuum adsorption portion 341. The structure of the vacuum adsorption portion 341 is the same as the structure of the aforementioned vacuum adsorption device 121, and will not be described here. In other embodiments, the vacuum adsorption method can also be replaced by bonding.

[0105] The automatic patch equipment 1 also includes a first camera device 50, which is electrically connected to the controller. The first camera device 50 is used to photograph the lead frame 2 to obtain a lead frame image before the placement mechanical claw 34 takes the lead frame 2, and send the lead frame image to the controller. The controller is also used to obtain the lead frame image, and determine whether the lead frame 2 is a defective product based on the lead frame image; if the lead frame 2 is a defective product, the first mechanical claw 13 is controlled to place the lead frame 2 into the waste box 15. It should be noted that a defective product refers to an unqualified lead frame 2 that is warped, deformed, has foreign matter, is dirty, etc.

[0106] The automatic patch device 1 further comprises a second camera device 60, which is electrically connected to the controller. The carrier board 3 is provided with positioning points.

[0107] The second camera device 60 is used to photograph the carrier board 3 to obtain a carrier board image before the placement mechanical claw 34 sequentially places the lead frame 2 on the carrier board 3, and send the carrier board image to the controller. The controller is also used to obtain the carrier board image, and calculate the position information of the chip to be placed on the carrier board 3 according to the positioning point position information of the positioning point on the carrier board image, and control the placement mechanical claw 34 to sequentially place the lead frame 2 on the chip to be placed position on the carrier board 3.

[0108] The first camera device 50 and the second camera device 60 may be the same camera device.

[0109] The vacuum pressing mechanism 40 includes a third mechanical claw 41 , a fifth carrier 42 and a vacuum pressing device 43 . The third mechanical claw 41 , the fifth carrier 42 and the vacuum pressing device 43 are all electrically connected to the controller.

[0110] The third mechanical gripper 41 is used to take the mounted substrate 3 from the fourth stage 22 and to place the substrate 3 on the fifth stage 42 .

[0111] The fifth carrier 42 is a conveyor belt, which is used to convey the mounted carrier 3 to the position to be pressed.

[0112] The vacuum pressing device 43 is used to press the mounted carrier 3 at the position to be pressed.

[0113] It should be noted that, since the lead frame 2 has many leads and pins, if it is placed and bonded only by mechanical means, the bonding force between the lead frame 2 and the carrier 3 is low, and some pin positions in the lead frame 2 may not be subjected to the pressure of the mounting mechanical claws 34, but are only lightly placed on the carrier 3. In other words, the mounting mechanical claws 34 cannot press all positions of a piece of lead frame evenly on the carrier, so that it is very easy to be lifted or offset by the plastic packaging material during the subsequent plastic packaging process, resulting in defects such as overflowing glue and deformation. Therefore, this embodiment can ensure the installation strength of the lead frame 2 by setting a vacuum pressing mechanism 40, thereby improving production efficiency and yield.

[0114] Figure 6 1 is a flow chart of the automatic patch method proposed in this embodiment, and the automatic patch method is applied to the automatic patch device as described above. Figure 6 As shown, the automatic patch method comprises the following steps:

[0115] Step 100: Controlling the lead frame feeding mechanism to provide the lead frame, including: taking a single lead frame or the protective member from the first carrier by the first mechanical claw, obtaining weight data of the object taken by the first mechanical claw detected by the weight detection device, and judging whether the object taken by the first mechanical claw is the lead frame or the protective member according to the weight data; in the case where the object taken by the first mechanical claw is the lead frame, controlling the first mechanical claw to place the lead frame on the second carrier; in the case where the object taken by the first mechanical claw is the protective member, controlling the first mechanical claw to place the protective member in the waste box;

[0116] Step 200: Control the carrier feeding mechanism to provide the carrier;

[0117] Step 300: Control the mounting mechanism to sequentially mount a plurality of lead frames on corresponding mounting positions on the carrier;

[0118] Step 400: Control the vacuum pressing mechanism to perform vacuum pressing on the mounted carrier.

[0119] The specific structures of the lead frame loading mechanism, the substrate loading mechanism, the mounting mechanism and the vacuum pressing mechanism in the above steps are as described above and will not be repeated here.

[0120] It should be noted that the incoming lead frames are stacked and placed in an incoming box, and each lead frame is protected by a protective piece (such as separator paper). When the processing starts, the incoming box is placed on the first carrier and the steel plate is placed on the third carrier. The lead frame and the carrier should be placed in a certain direction so that the two match, that is, the placement direction of the lead frame corresponds to the placement direction of the carrier.

[0121] Specifically, Figure 7(a)-Figure 7(i) As shown, the automatic patch method of this embodiment includes:

[0122] In step 100, the controller controls the lead frame loading mechanism to provide the lead frame, including: as shown in Figure 7(a), the first mechanical claw 13 moves to the top of the first carrier 11 where the incoming box (not shown in the figure) is placed, the first mechanical claw 13 moves downward in the vertical direction to pick up a single lead frame 2 or protective member 4 from the first carrier 11, obtains the weight data of the object picked up by the first mechanical claw 13 detected by the weight detection device 14, and determines whether the object picked up by the first mechanical claw 13 is the lead frame 2 or the protective member 4 according to the weight data; as shown in Figure 7(b), when the object picked up by the first mechanical claw 13 is the lead frame 2, the first mechanical claw 13 is controlled to place the lead frame 2 on the second carrier 12; when the object picked up by the first mechanical claw 13 is the protective member 4, the first mechanical claw 13 is controlled to place the protective member 4 in the waste box 15.

[0123] In step 200, the controller controls the carrier loading mechanism to provide the carrier, including: referring to FIG. 7(a), the second mechanical claw 23 moves to the third carrier 21 to pick up the carrier 3 at the position to be picked up; then, referring to FIG. 7(b), the carrier 3 is placed on the fourth carrier 22. A positioning point is provided on the carrier 3.

[0124] Before entering step 300, step 100 and step 200 may be performed successively or simultaneously.

[0125] Before entering step 300, that is, before the mounting mechanical claw 34 takes the lead frame 2, as shown in FIG7(c), the process of inspecting the lead frame 2 is also included: the lead frame 2 located on the second carrier 12 is photographed by the first camera device 50 to obtain a lead frame image, and the lead frame image is sent to the controller. The controller is also used to obtain the lead frame image and determine whether the lead frame 2 is a defective product based on the lead frame image. If the lead frame 2 is a defective product, the first mechanical claw 13 is controlled to place the lead frame 2 into the waste box 15.

[0126] Similarly, preferably, before the placement mechanical claw 34 sequentially places the lead frame 2 on the carrier 3, a process of checking the carrier 3 is also included: the carrier 3 located on the fourth stage 22 is photographed by the second camera device 60 to obtain a carrier image, and the position information of the chips to be placed on the carrier 3 is calculated based on the position information of the positioning points on the carrier image. All positions can be calculated at once according to the maximum number of chips, or repeated grabbing can be performed each time.

[0127] The first camera device 50 and the second camera device 60 may be the same camera device.

[0128] In step 300, the controller controls the mounting mechanism to sequentially mount multiple lead frames on corresponding mounting positions on the carrier, including: multiple mounting mechanical claws 34 sequentially pick up a single lead frame 2 on the second carrier 12 located at the to-be-picked position, and sequentially mount the lead frame 2 on the mounting position of the carrier 3 on the fourth carrier 22 located at the to-be-mounted position.

[0129] Specifically, as shown in FIG. 7( d ), the second stage 12 moves to the bottom of the mounting mechanical claw 34 and is aligned with the vacuum adsorption portion 341 of the mounting mechanical claw 34 . The second stage 12 rises vertically to make the lead frame 2 contact the vacuum adsorption portion 341 , thus completing the pre-installation of a piece of lead frame 2 . During the pre-installation process, the first mechanical claw 13 repeats the above-mentioned lead frame 2 picking steps and waits at the origin position of the second stage 12 .

[0130] As shown in FIG. 7( e ), after the pre-installation is completed, the second carrier 12 retreats to the origin position, and the waiting first mechanical claw 13 puts down the frame and repeats the above-mentioned frame inspection and pre-installation steps until the mounting mechanical claw 34 on each mechanical head 33 of the rotatable mechanical arm 31 is pre-installed with the lead frame 2.

[0131] As shown in FIG7(f), after the mounting mechanical claws 34 on each mechanical head 33 of the rotatable mechanical arm 31 have installed the lead frame 2, the fourth carrier 22 moves to the mounting position, the fourth carrier 22 rises, and the carrier 3 is bonded to the lead frame 2 on the first mechanical claw to complete the first mounting.

[0132] As shown in FIG. 7( g ), after the first patch is completed, the rotatable mechanical arm 31 rotates a mechanical head 33 clockwise to move the lead frame 2 on the second mechanical claw to the fourth carrier 22 for the second patch, and so on. At the same time, the second carrier 12 pre-installs the prepared lead frame 2 on the empty placement mechanical claw 34, so that the rotatable mechanical arm 31 is always fully loaded with lead frames 2, realizing continuous production, greatly improving patch efficiency, and saving processing time.

[0133] In step 400, the vacuum pressing mechanism is controlled to perform vacuum pressing on the mounted substrate, including: as shown in FIG7(h), the mounted substrate 3 is taken from the fourth carrier 22 by the third mechanical claw 41, and then, as shown in FIG7(i), the substrate 3 is placed on the fifth carrier 42. The fifth carrier 42 is a conveyor belt, and the fifth carrier 42 transfers the mounted substrate 3 to the position to be pressed. The mounted substrate 3 is pressed at the position to be pressed by the vacuum pressing device 43 to ensure the bonding strength of the patch and prevent the lead frame 2 from floating during the subsequent plastic sealing.

[0134] In the present application, the structural embodiments and method embodiments may complement each other if they do not conflict.

[0135] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An automatic patch device, characterized in that: The automatic chip placement equipment is used to mount multiple lead frames on corresponding chip placement positions on a carrier board. The automatic chip placement equipment includes: a lead frame feeding mechanism, a carrier board feeding mechanism, a mounting mechanism and a controller. The lead frame feeding mechanism, the carrier board feeding mechanism and the mounting mechanism are electrically connected to the controller respectively. The lead frame feeding mechanism is used to provide the lead frame, the carrier board feeding mechanism is used to provide the carrier board, and the mounting mechanism is used to sequentially mount multiple lead frames on corresponding chip placement positions on the carrier board; wherein, The lead frame feeding mechanism comprises: a first carrier, a second carrier, a first mechanical claw and a weight detection device, wherein the second carrier, the first mechanical claw and the weight detection device are all electrically connected to the controller; The first carrier is used to place a plurality of stacked lead frames, and two adjacent lead frames stacked up and down are separated by a protective member; The second carrier is used to transport a single lead frame to a position to be picked up; The first mechanical claw is used to take a single lead frame or a protective member from the first carrier, and is used to place the single lead frame on the second carrier, and to place the protective member in a waste box provided next to the first carrier; The weight detection device is disposed on the first mechanical claw, and is used to detect weight data of an object picked up by the first mechanical claw, and send the weight data to the controller; The controller is used to obtain the weight data, and determine whether the object picked up by the first mechanical claw is the lead frame or the protective member according to the weight data; when the object picked up by the first mechanical claw is the lead frame, the controller controls the first mechanical claw to place the lead frame on the second carrier; when the object picked up by the first mechanical claw is the protective member, the controller controls the first mechanical claw to place the protective member in the waste box; The plate loading mechanism comprises: a third carrier, a fourth carrier, and a second mechanical claw, and the third carrier, the fourth carrier and the second mechanical claw are all electrically connected to the controller; The third carrier is a conveyor belt, which is used to transfer the carrier to be mounted to a carrier to be grasped position; The fourth carrier is used to transport a single carrier to a position to be mounted, and the fourth carrier can move along a first direction, a second direction and a third direction perpendicular to each other, and the surface of the fourth carrier located below the carrier is a plane arranged along the horizontal direction; The second mechanical claw is used to take the carrier located at the carrier to be grasped position on the third carrier, and is used to place the carrier on the fourth carrier; The mounting mechanism includes a rotatable robotic arm, which is electrically connected to the controller. The rotatable robotic arm includes multiple robotic heads rotating around the same central axis. Each of the robotic heads is provided with a mounting mechanical claw at one end away from the central axis. Each of the mounting mechanical claws is electrically connected to the controller respectively. The multiple mounting mechanical claws are used to sequentially pick up a single lead frame on the second carrier at the position to be picked up, and sequentially mount the lead frames on the patch positions of the carrier on the fourth carrier at the position to be mounted.

2. The automatic patch equipment according to claim 1, characterized in that: The second stage is movable along a first direction, a second direction and a third direction which are perpendicular to each other.

3. The automatic patch equipment according to claim 1, characterized in that: The automatic patch device further comprises a first camera device, which is electrically connected to the controller; The first camera device is used for photographing the lead frame to obtain a lead frame image before the first mechanical claw takes the lead frame, and sending the lead frame image to the controller; The controller is also used to obtain the lead frame image and determine whether the lead frame is a defective product based on the lead frame image; if the lead frame is a defective product, the controller controls the first mechanical claw to place the lead frame into the waste box.

4. The automatic patch equipment according to claim 1, characterized in that: The automatic patch equipment further comprises a second camera device, which is electrically connected to the controller; a positioning point is provided on the carrier; The second camera device is used for photographing the carrier to obtain a carrier image before the mounting mechanical claw mounts the lead frame on the carrier in sequence, and sending the carrier image to the controller; The controller is also used to obtain the carrier image, calculate the position information of the chips to be mounted on the carrier according to the positioning point position information of the positioning point on the carrier image, and control the mounting mechanical claw to mount the lead frame on the positions to be mounted on the carrier in sequence.

5. The automatic patch equipment according to claim 1, characterized in that: Each of the mounting mechanical claws is provided with a vacuum adsorption portion, and the lead frame is fixed on the mounting mechanical claw through the vacuum adsorption portion.

6. The automatic patch equipment according to claim 1, characterized in that: The second carrier is provided with a vacuum adsorption device for fixing the lead frame on the second carrier by vacuum adsorption.

7. The automatic patch device according to any one of claims 1 to 6, characterized in that: The automatic patch equipment further comprises a vacuum pressing mechanism, which is electrically connected to the controller and is used for performing vacuum pressing on the mounted lead frame and the carrier.

8. The automatic patch device according to claim 7, characterized in that: The vacuum pressing mechanism comprises a third mechanical claw, a fifth carrier and a vacuum pressing device, and the third mechanical claw, the fifth carrier and the vacuum pressing device are all electrically connected to the controller; The third mechanical gripper is used to pick up the mounted carrier and place the carrier on the fifth carrier; The fifth carrier is a conveyor belt, which is used to transfer the mounted carrier to a position to be pressed; The vacuum pressing device is used to press the mounted carrier at the position to be pressed.

9. An automatic patch method, characterized in that: The automatic patch method is applied to the automatic patch device according to any one of claims 1 to 8, and the automatic patch method comprises the following steps: Controlling the lead frame feeding mechanism to provide the lead frame, comprising: taking a single lead frame or the protective member from the first carrier by the first mechanical claw, obtaining weight data of the object taken by the first mechanical claw detected by the weight detection device, and judging whether the object taken by the first mechanical claw is the lead frame or the protective member according to the weight data; in the case where the object taken by the first mechanical claw is the lead frame, controlling the first mechanical claw to place the lead frame on the second carrier; in the case where the object taken by the first mechanical claw is the protective member, controlling the first mechanical claw to place the protective member in the waste box; Controlling the carrier feeding mechanism to provide the carrier; The mounting mechanism is controlled to mount a plurality of lead frames on corresponding mounting positions on the carrier in sequence.

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