Target material, target material manufacturing method, and display panel

Abstract

The application provides a target material, a target material manufacturing method and a display panel. The target material comprises a solid solution and a strengthening phase. The solid solution comprises a molybdenum element, and the atomic percentage of the molybdenum element is greater than or equal to 50%. The strengthening phase comprises a strengthening metal and a carbon element. The strengthening metal comprises a titanium element and a zirconium element. The titanium element and the carbon element form a titanium-carbon strengthening phase, and the zirconium element and the carbon element form a zirconium-carbon strengthening phase. The technical scheme of the application can improve the firmness of the copper signal transmission layer, thereby reducing the falling of the copper signal transmission layer.

Description

Technical Field

[0001] This application relates to the field of target material technology, and in particular to a target material, a target material manufacturing method, and a display panel. Background Technology

[0002] A signal transmission layer is set on the surface of the display panel to transmit electrical signals. Copper itself has excellent conductivity, so many panel manufacturers use copper instead of aluminum as the signal transmission layer. However, the adhesion between copper and the glass substrate of the display panel is poor. To address this, an adhesive layer is placed between the glass substrate and the copper layer of the display panel. However, current adhesives have poor stability and are prone to causing the copper signal transmission layer to detach.

[0003] The information disclosed in the background section is only intended to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] One objective of this application is to provide a technical solution to improve the robustness of copper signal transmission layers and reduce the shedding of copper signal transmission layers.

[0005] According to one aspect of this application, this application provides a target material, the target material comprising:

[0006] A solid solution containing molybdenum, wherein the atomic percentage of molybdenum is greater than or equal to 50%; and

[0007] The strengthening phase contains a strengthening metal and carbon element. The strengthening metal includes titanium and zirconium elements. The titanium element and the carbon element form a titanium-carbon strengthening phase, and the zirconium element and the carbon element form a zirconium-carbon strengthening phase.

[0008] In one aspect, the solid solution also contains titanium and zirconium, the molybdenum and titanium forming a molybdenum-titanium solid solution, and the molybdenum and zirconium forming a molybdenum-zirconium solid solution.

[0009] In one aspect, the grain size of the solid solution and the reinforcing phase is less than or equal to 120 μm.

[0010] In one aspect, the target material comprises components in a mass ratio of:

[0011] Molybdenum content: 50%-80%;

[0012] Titanium, 0.05%-25%;

[0013] Zirconium, 0.05%-25%;

[0014] Carbon element, 0.01%-1%.

[0015] In one aspect, the zirconium content is 0.7%-4.95% by mass, and the carbon content is 0.05%-0.3% by mass.

[0016] In one aspect, the purity of the molybdenum, titanium, zirconium, and carbon is at least 99.99%.

[0017] To address the aforementioned problems, according to one aspect of this application, this application also provides a method for manufacturing a target material, the method comprising:

[0018] Powders containing molybdenum, carbon, and reinforcing metals are ground and mixed to form a mixed metal powder;

[0019] The mixed metal powder is placed in a sealed environment and a vacuum is drawn. A reducing gas is introduced and the temperature is adjusted to a first preset temperature so that the reducing gas undergoes an oxidation-reduction reaction.

[0020] Metal powder is statically mixed under a first preset pressure to form a rough blank, and the temperature during static pressing is a second preset temperature.

[0021] The billet is statically pressed under a second preset pressure, and the ambient temperature during static pressing is a third preset temperature, wherein the second preset temperature is less than the first preset temperature and the second preset temperature is less than the third preset temperature;

[0022] The statically pressed billet is subjected to at least one round of hot rolling, with the thickness of the billet changing by 25% to 50% in each hot rolling round, wherein each round of hot rolling includes at least one hot rolling.

[0023] Crystallization annealing is performed on the hot-rolled billet.

[0024] In one aspect, prior to the step of subjecting the hydrostatically pressed billet to at least one round of hot rolling, the process includes:

[0025] The statically pressed billet is placed in a protective gas and the temperature is adjusted to a fourth preset temperature, wherein the fourth preset temperature is greater than the second preset temperature.

[0026] In one aspect, the powders of molybdenum, carbon, and reinforcing metal have a diameter of 1µm-100µm.

[0027] To address the aforementioned problems, according to one aspect of this application, this application also provides a display panel, the display panel including a substrate and a metal functional layer formed on the substrate, the display panel further including a transition adhesive layer disposed between the metal functional layer and the substrate, the transition adhesive layer being made of the target material as described above.

[0028] The technical solution in this application provides a target material containing both a solid solution and a reinforcing phase. The film formed by this target material also includes a solid solution and a reinforcing phase. The solid solution includes molybdenum, with the molybdenum atomic ratio being greater than or equal to 50%. Molybdenum can effectively combine with copper, thus better fixing the copper signal transmission layer. The reinforcing phase includes reinforcing metals and carbon, and the reinforcing phase formed by the reinforcing metals and carbon has high stability. The reinforcing metals include titanium and zirconium; titanium and carbon form a titanium-carbon reinforcing phase, and zirconium and carbon form a zirconium-carbon reinforcing phase. Both the titanium-carbon and zirconium-carbon reinforcing phases include both metals and non-metals. It is understood that the film with this reinforcing phase possesses both metallic and non-metallic properties. Through the metallic properties of the film, the contact stability with copper is significantly improved when the film contacts copper, thereby better fixing the copper signal transmission layer.

[0029] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0030] The above and other objectives, features and advantages of this application will become more apparent from a detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0031] Figure 1 This is a metallographic micrograph of the target material surface magnified 200 times in the first embodiment of this application;

[0032] Figure 2 This is a scanning electron microscope cross-sectional view of the transition bonding layer deposited using the target material described in this application;

[0033] Figure 3 This is a scanning electron microscope cross-sectional image of the transition bonding layer and the metal functional layer deposited using the target material in this application after etching.

[0034] Figure 4 yes Figure 3 A three-dimensional schematic diagram of the structure shown from another perspective;

[0035] Figure 5 This is a schematic flowchart of the target manufacturing method according to the second embodiment of this application;

[0036] Figure 6 This is a schematic flowchart of the target manufacturing method according to the third embodiment of this application;

[0037] Figure 7 This is a schematic diagram of the structure of the display panel according to the fourth embodiment of this application.

[0038] The annotations in the attached figures are explained as follows:

[0039] 1. Substrate; 2. Transition adhesive layer; 3. Metal functional layer; 4. Photoresist. Detailed Implementation

[0040] Although this application can be readily embodied in various forms of implementation, only some specific embodiments are shown in the accompanying drawings and will be described in detail in this specification. It is understood that this specification should be regarded as an exemplary illustration of the principles of this application and is not intended to limit the application to what is described herein.

[0041] Therefore, a feature described in this specification is used to illustrate one feature of one embodiment of this application, and does not imply that every embodiment of this application must have the described feature. Furthermore, it should be noted that this specification describes many features. While certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0042] In the embodiments shown in the accompanying drawings, the directional indications (such as up, down, left, right, front, and back) used to explain the structure and movement of the various elements of this application are relative rather than absolute. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0043] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided to make the description of this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0044] The preferred embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0045] Example 1

[0046] This application provides a sputtering target material, which can be sputtered onto a substrate under appropriate process conditions using magnetron sputtering, multi-arc ion plating, or other types of coating systems to form various functional thin films. Simply put, a target material is the material targeted by high-speed charged particles. There are many types of target materials, such as metal targets, ceramic targets, and alloy targets. The target material in this embodiment is an alloy target material. The target material in this embodiment includes a solid solution and a reinforcing phase. The solid solution and the reinforcing phase are two crystalline substances present in the target material. These two crystalline substances can achieve a solid solution strengthening effect, effectively improving the stability of the deposited film. Furthermore, there are many ways to perform film deposition using the target material of this embodiment, such as physical vapor deposition (PVD). Physical vapor deposition technology refers to a technique that uses physical methods under vacuum conditions to vaporize the surface of the target material into gaseous atoms or molecules, or partially ionize them into ions, and then deposits a thin film on the substrate surface using low-pressure gas (or plasma).

[0047] The solid solution contains molybdenum (Mo), a metallic element. Molybdenum bonds well with copper, improving copper adhesion. To enhance the stability of the copper-coated film, the molybdenum atomic ratio in the target is greater than 50%. The molybdenum atomic ratio refers to the total number of molybdenum atoms in the target divided by the total number of atoms of all elements in the target. Therefore, molybdenum constitutes a significant portion. Because molybdenum improves the bonding with copper, a higher molybdenum content enhances the stability of the copper signal transmission layer.

[0048] The reinforcing phase contains a reinforcing metal and carbon (C). The combination of the reinforcing metal and the non-metallic carbon is a type of metal-non-metal combination, and the resulting reinforcing phase further improves the adhesion of the deposited film. The reinforcing metal can be one type or multiple types; in various cases, each metal can individually combine with carbon to form the reinforcing phase. It should be noted that the reinforcing phase can also be referred to as dispersed particles, and its quantity is relatively small.

[0049] The reinforcing metals include titanium and zirconium. Titanium and carbon form a titanium-carbon reinforcing phase, while zirconium and carbon form a zirconium-carbon reinforcing phase. Both titanium-carbon and zirconium-carbon reinforcing phases contain both metals and non-metals. It can be understood that films with these reinforcing phases possess both metallic and non-metallic properties. In the deposited film, one side contacts the glass substrate, and the other side contacts metallic copper. The non-metallic properties of the film significantly improve contact stability with the glass substrate surface. The metallic properties of the film significantly improve contact stability with the copper. Therefore, the deposited film effectively connects the glass substrate and the copper signal transmission layer, improving the film's stability, enhancing the adhesion of the copper signal transmission layer, and reducing its detachment.

[0050] The technical solution in this application provides a target material containing both a solid solution and a reinforcing phase. The film formed by this target material also includes a solid solution and a reinforcing phase. The solid solution includes molybdenum, with the atomic percentage of molybdenum being greater than or equal to 50%. Molybdenum can effectively combine with copper, thus better fixing the copper signal transmission layer. The reinforcing phase includes a reinforcing metal and carbon. The reinforcing phase formed by the reinforcing metal and carbon has high stability, thereby improving the stability of the deposited film and further better fixing the copper signal transmission layer.

[0051] In the above embodiments, the solid solution also contains titanium and / or zirconium. Titanium (Ti) and zirconium (Zr) are chemical symbols for titanium and zirconium, respectively. In short, there are three possibilities: the solid solution includes titanium, the solid solution includes zirconium, or the solid solution includes both titanium and zirconium. Molybdenum and titanium can form a molybdenum-titanium solid solution, and molybdenum and zirconium can form a molybdenum-zirconium solid solution. That is, the solid solution includes either a molybdenum-titanium solid solution or a molybdenum-zirconium solid solution, or both.

[0052] Furthermore, the strengthening metal includes titanium and / or zirconium, which can be categorized into three cases: the strengthening metal includes titanium, the strengthening metal includes zirconium, or the strengthening metal includes both titanium and zirconium. Titanium and carbon can form a titanium-carbon strengthening phase, and zirconium and carbon can form a zirconium-carbon strengthening phase. In other words, the strengthening phase includes either a titanium-carbon strengthening phase or a zirconium-carbon strengthening phase, or both.

[0053] In a preferred embodiment of this application, the solid solution further contains titanium and zirconium. Molybdenum and titanium form a molybdenum-titanium solid solution, and molybdenum and zirconium form a molybdenum-zirconium solid solution. The strengthening metal includes titanium and zirconium. Titanium and carbon form a titanium-carbon strengthening phase, and zirconium and carbon form a zirconium-carbon strengthening phase. That is, in this embodiment, the solid solution simultaneously includes both a molybdenum-titanium solid solution and a molybdenum-zirconium solid solution, and the strengthening phase simultaneously includes both a titanium-carbon strengthening phase and a zirconium-carbon strengthening phase. Furthermore, the deposited film layer sometimes undergoes high-temperature processing. Titanium can improve the high-temperature resistance of the deposited film layer, and zirconium can improve the adhesion of the film layer. Therefore, the deposited film layer will not decompose or fail even after being subjected to high-temperature environments, effectively improving the stability of the film layer.

[0054] See Figure 1 As shown, Figure 1 When the target material is magnified 200 times, it can be seen that the size of the largest grain in the target material is less than or equal to 120 μm. Figure 1 The grain size can be the surface of the target material or a cross-section within the target material. The grain size of the solid solution and reinforcing phase is less than or equal to 120 μm. This grain size refers to the diameter of the largest grain in the solid solution and reinforcing phase. With a fixed ratio of solid solution and reinforcing phase, the smaller the grain size, the wider the distribution of the solid solution and reinforcing phase, and the more uniform the stability of the deposited film. The grain size can also be 115 μm, 110 μm, 105 μm, 100 μm, 95 μm, 90 μm, etc. Of course, the smaller the grain size, the higher the cost of manufacturing the target material; therefore, the grain size is controlled to be less than 120 μm.

[0055] See Figure 2 As shown, a metal functional layer 2 is deposited on the surface of the substrate 1 using the target material described in this embodiment. The thickness of the metal functional layer 2 is 63.34 nm. It is evident that the surface flatness of the film layer on the substrate 1 is very good, with no gaps between the two layers, indicating good adhesion between the metal functional layer 2 and the substrate 1. The substrate 1 can be a glass substrate or a plastic substrate. The metal functional layer 2 is a copper layer.

[0056] In one aspect, the target material comprises the following components in the following mass ratios: molybdenum, 50%-80%; titanium, 0.05%-25%; zirconium, 0.05%-25%; and carbon, 0.01%-1%. For example, the molybdenum content may be 50%, 55%, 60%, 65%, 70%, 75%, or 80%. The titanium content may be 0.05%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, or 25%. The zirconium content is 0.05%, 0.15%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, and 25%. The carbon content is 0.01%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, and 1%. Controlling the elemental proportions within this range ensures the formation of molybdenum-titanium solid solutions, molybdenum-zirconium solid solutions, as well as titanium-carbon and zirconium-carbon reinforced phases. Furthermore, Table 1 lists the proportions of each element in the three groups. The mass ratio of zirconium can be 0.7%-4.95%, and the mass ratio of carbon can be 0.05%-0.3%. In this embodiment, carbon is a trace element, and the desired reinforcing phase can be formed with trace amounts of C. In the table, at% represents the mass percentage.

[0057] Table 1

[0058]

[0059] During the etching process, the display panel passes through different Cu ion concentrations. The Cu ion concentration gradually increases with each etching cycle. Table 2 shows that the Cu ion concentration increases from 500 ppm to 5000 ppm, and then from 5000 ppm to 10000 ppm. Critical Dimension bias (CD) is a parameter describing the stability of the film. (See also...) Figure 3 and Figure 4 As shown, a metal functional layer 3 is disposed on the surface of the substrate 1, and photoresist 4 is disposed on the upper surface of the metal functional layer 3. θ represents the edge tilt angle of the metal functional layer 3 after etching. The smaller the change in CD bias, the smaller the change in the metal functional layer 3 after etching; the smaller the change in the θ angle, the more stable the metal functional layer 3 is.

[0060] Table 2

[0061]

[0062] Table 2 combined Figure 3 and Figure 4 It can be seen that the MoTiZrC alloy layer deposited on the surface of substrate 1 is 35nm thick, and the Cu layer is 500nm thick. After 94 seconds of etching, the CD bias measured in sequence 1 is 1850nm, the CD bias measured in sequence 2 is 1770nm, and the CD bias measured in sequence 3 is 2131nm. The difference between sequence 1 and sequence 2 is 80nm, and the difference between sequence 2 and sequence 3 is 361nm, indicating that the CD bias fluctuation is <400nm. The angle of sequence 1 is 31°, the angle of sequence 2 is 39°, and the angle of sequence 3 is 29°, indicating that the θ angle change is less than or equal to 10°. The CD bias fluctuation and the range of θ angle change are both small, indicating that the metal functional layer 3 is more stable. Therefore, the transition bonding layer 2 fabricated using the target material of this embodiment can effectively improve the stability of the copper metal functional layer 3.

[0063] Table 3

[0064]

[0065] Refer to Table 3 in conjunction with Figure 3 and Figure 4 It can be seen that the MoTiZrC alloy layer deposited on the surface of substrate 1 is 45nm thick, and the Cu layer is 650nm thick. After 104 seconds of over-etching, the CD bias measured in sequence 1 is 1659nm, the CD bias measured in sequence 2 is 1889nm, and the CD bias measured in sequence 3 is 1790nm. The difference between sequence 1 and sequence 2 is 230nm, and the difference between sequence 2 and sequence 3 is 99nm, indicating that the CD bias fluctuation is <250nm. The angle of sequence 1 is 32°, the angle of sequence 2 is 25°, and the angle of sequence 3 is 33°, indicating that the θ angle change is less than or equal to 10°. The CD bias fluctuation and the range of θ angle change are both small, indicating that the metal functional layer 3 is more stable. Therefore, the transition bonding layer 2 fabricated using the target material of this embodiment can effectively improve the stability of the copper metal functional layer 3.

[0066] In addition, from Figure 4 It can also be seen that, in this embodiment, the target material and the transition bonding layer 2 deposited on the surface of the substrate 1 leave no residue on the surface of the substrate 1 after etching. This prevents the generation of defective products and is beneficial to improving product yield.

[0067] Furthermore, the purity of molybdenum, titanium, zirconium, and carbon must be at least 99.99%. Controlling the purity of the powder to 99.99% (four nines) ensures even higher purity, thereby reducing impurities in the powder and ensuring that the processed target material better meets application requirements, resulting in higher stability of the copper layer.

[0068] Example 2

[0069] See Figure 5 As shown, according to one aspect of this application, this application also provides a method for manufacturing a target material, the method being used to manufacture the target material as described above, the method comprising:

[0070] Step S10 involves grinding and mixing powders containing molybdenum, carbon, and reinforcing metals to form a mixed metal powder. The grinding process breaks down larger metal powder particles into smaller ones. Stirring is performed simultaneously with the grinding process to improve the uniformity of the mixture of various elemental powders.

[0071] Step S20: Place the mixed metal powder in a sealed environment and evacuate it. Introduce a reducing gas and adjust the temperature to a first preset temperature to induce a redox reaction in the reducing gas. The mixed metal powder contains oxygen atoms, which readily react with other metals within the target material during coating, potentially leading to uncontrollable oxide formation. Evacuation should be maintained at at least 10 °C. -2 Pascal. To reduce the occurrence of this oxide, it is necessary to reduce or even eliminate the oxygen atoms present in the powder. For this purpose, a reducing gas, such as hydrogen, is introduced. The temperature is adjusted to a first preset temperature, which is 400℃-1000℃. For example, the first preset temperature is 400℃, 500℃, 600℃, 700℃, 800℃, 900℃, or 1000℃. Under these conditions, the metal powder is left to stand for 1 hour to 10 hours. This 1-10 hour standing time allows the reducing gas to fully react with the oxygen atoms in the mixed metal powder, further reducing the presence of oxygen atoms. The standing time can be 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, or 10 hours.

[0072] Step S30 involves statically pressing the mixed metal powder under a first preset pressure to form a rough blank. The temperature during static pressing is a second preset temperature. This step is also referred to as cold isostatic pressing. The first preset pressure is 50-400 MPa, under which the mixed metal powder is pressed together. For example, the first preset pressure can be 50 MPa, 100 MPa, 150 MPa, 200 MPa, 250 MPa, 300 MPa, 350 MPa, or 400 MPa. This allows the mixed metal powder to form a preliminarily stable whole, i.e., forming a rough blank. The static pressing time for mixing the metal powder is 10-60 minutes. Static pressing within this time period makes the formed rough blank more robust and stable. For example, the static pressing time can be 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50 minutes, or 60 minutes. It should also be noted that the cold isostatic pressing time can be set as needed. To reduce heat consumption, ambient temperature can be fully utilized; generally, the ambient room temperature is 20°C.

[0073] Step S40: Static pressing of the billet under a second preset pressure. The ambient temperature during static pressing is a third preset temperature, wherein the second preset temperature is lower than the first preset temperature and the third preset temperature. This step is also referred to as hot isostatic pressing. The second preset pressure is 50-300 MPa. Pressure is applied to the surface of the billet under the second preset pressure. For example, the second preset pressure can be 50 MPa, 100 MPa, 150 MPa, 200 MPa, 250 MPa, or 300 MPa. The hot isostatic pressing of the billet lasts 1-8 hours, further improving the density of the billet. The static pressing time can be 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, or 8 hours. The ambient temperature during hot isostatic pressing is 1000℃-1400℃. By setting the ambient temperature within the range of 1000℃-1400℃, the billet's texture is softened, thus facilitating the pressing of the billet during static pressing. The temperature under static pressure can be 1000℃, 1100℃, 1200℃, 1300℃, or 1400℃.

[0074] Step S50 involves subjecting the statically pressed billet to at least one round of hot rolling. The thickness variation in each round of hot rolling ranges from 25% to 50%, and each round includes at least one hot rolling operation. The purpose of hot rolling is to improve the density of the billet; after hot rolling, the billet thickness decreases, its overall volume decreases, and its density increases. For example, the thickness variation in each round of hot rolling can be 25%, 30%, 35%, 40%, 45%, or 50%. To make the effect of each round of hot rolling more pronounced, each round can be performed multiple times. For example, each round of hot rolling may include three hot rolling operations, with the thickness variation in each operation ranging from 5% to 25%. The thickness variation in each operation can be 5%, 10%, 15%, 20%, or 25%.

[0075] Step S60: Crystallization annealing is performed on the hot-rolled billet. Crystallization annealing involves heating the cold-deformed metal to above the crystallization temperature and holding it for an appropriate time to generate the desired crystals. Crystallization annealing can also eliminate deformation strengthening and residual stress.

[0076] Example 3

[0077] See Figure 6 As shown, in one aspect, prior to the step of hot rolling the statically pressed billet at least once, the process includes:

[0078] Step S51: Place the statically pressed billet in a protective gas environment and adjust the temperature to a fourth preset temperature, which is higher than the second preset temperature. The protective gas prevents ambient gases from entering the target material and reacting with atoms within it. The protective gas isolates the billet from the external environment; for example, nitrogen is used. Nitrogen is readily available and highly stable, effectively reducing the impact of the external environment on the billet. For instance, the hot isostatically pressed billet is held in a nitrogen environment for 20-60 minutes at an ambient temperature of 1000℃-1400℃. Alternatively, an inert gas can be used as the protective gas, as inert gases offer even greater stability and better protection for the billet. Holding times can be 20, 30, 40, 50, or 60 minutes, and ambient temperatures can be 1000℃, 1100℃, 1200℃, 1300℃, or 1400℃.

[0079] In one aspect, to facilitate target fabrication, the powder diameters of molybdenum, carbon, and reinforcing metals range from 1µm to 100µm. Controlling the powder particle diameter within this range ensures sufficiently small particles, facilitating grinding and reducing grinding time. Examples of powder diameters include 1µm, 10µm, 20µm, 30µm, 40µm, 50µm, 60µm, 70µm, 80µm, 90µm, and 100µm.

[0080] Example 4

[0081] See Figure 7As shown, this application also provides a display panel, which includes a substrate 1 and a metal functional layer 3 formed on the substrate 1. The display panel further includes a transition adhesive layer 2, which is disposed between the metal functional layer 3 and the substrate 1. The transition adhesive layer 2 is formed using a target material. The end face of the transition adhesive layer 2 is flush with the end face of the metal functional layer 3. Of course, depending on the application requirements, the end face of the transition adhesive layer 2 may extend beyond the end face of the metal functional layer 3, that is, the area of ​​the transition adhesive layer 2 is larger than the area of ​​the metal functional layer 3. Alternatively, the end face of the transition adhesive layer 2 may be recessed into the end face of the metal functional layer 3, that is, the area of ​​the transition adhesive layer 2 is smaller than the area of ​​the metal functional layer 3. The display panel can be used in liquid crystal displays (LCDs) and plasma display panels. It can also be used in flat panel display devices such as electrophoretic displays used in electronic paper. It can also be used in the fields of semiconductor devices, thin-film sensors, magnetic heads, and other thin-film electronic components. The substrate 1 can be a glass substrate or a plastic substrate.

[0082] The target material in this embodiment includes a solid solution and a reinforcing phase. The solid solution and the reinforcing phase are two crystalline substances present in the target material. These two crystalline substances can achieve a solid solution strengthening effect, effectively improving the stability of the deposited film. Furthermore, there are many ways to perform film deposition using the target material of this embodiment, such as physical vapor deposition. Physical vapor deposition technology refers to a technique that uses physical methods under vacuum conditions to vaporize the target surface into gaseous atoms or molecules, or partially ionize them into ions, and then deposits a thin film on the substrate surface using low-pressure gas (or plasma). The solid solution contains molybdenum; molybdenum is a metallic element with the chemical symbol Mo. Molybdenum can combine well with copper, improving the adhesion of copper. The reinforcing phase contains a reinforcing metal and carbon, with the chemical symbol C. The combination of the reinforcing metal and the non-metallic carbon element is a combination of metal and non-metal, and the resulting reinforcing phase further improves the adhesion of the deposited film. The reinforcing metal can include one or more elements; in many cases, each metal can combine with carbon to form a reinforcing phase. It should be noted that the strengthening phase can also be called diffuse particles, and its number is relatively small.

[0083] The metal functional layer in the display panel provided by the technical solution in this application is used to realize various functions. For example, the metal functional layer can be used as the gate of a transistor, a scan signal line or a common signal line to transmit signals, or it can be used as a shielding structure, etc.

[0084] For example, the functional metal layer can be a copper layer, as copper has excellent signal transmission properties, making it the signal transmission layer. A transition bonding layer is disposed between the functional metal layer and the substrate, and this layer is fabricated using a target deposition process. This target contains both solid solution and reinforcing phase crystals. The film formed using this target also includes a solid solution and a reinforcing phase. The solid solution includes molybdenum, which binds well with copper, thus better securing the copper signal transmission layer. The reinforcing phase includes reinforcing metal and carbon. The reinforcing phase formed by the reinforcing metal and carbon has high stability, thereby improving the stability of the deposited film and further securing the functional metal layer.

[0085] Other embodiments and implementations of the display panel in this application refer to the embodiments of the target material described above, and will not be repeated here.

[0086] Although this application has been described with reference to several typical embodiments, it should be understood that the terminology used is illustrative and exemplary, and not restrictive. Since this application can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A display panel, comprising a substrate and a metal functional layer formed on the substrate, the display panel further comprising a transition adhesive layer provided between the metal functional layer and the substrate, characterized in that, The transition adhesive layer is made of a target material, the target material comprises: a solid solution containing a molybdenum element, the atomic ratio of the molybdenum element being greater than or equal to 50%; and a strengthening phase containing a strengthening metal and a carbon element, the strengthening metal comprising a titanium element and a zirconium element, the titanium element and the carbon element forming a titanium-carbon strengthening phase, the zirconium element and the carbon element forming a zirconium-carbon strengthening phase, the mass ratio of the zirconium element being 0.7%-4.95%, the zirconium element being used to improve the adhesion of the transition adhesive layer to the metal functional layer.

2. The display panel of claim 1, wherein, The solid solution further contains a titanium element and a zirconium element, the molybdenum element and the titanium element forming a molybdenum-titanium solid solution, the molybdenum element and the zirconium element forming a molybdenum-zirconium solid solution.

3. The display panel of claim 1, wherein, The grain size of the solid solution and the strengthening phase is less than or equal to 120um.

4. The display panel of any one of claims 1-3, wherein, The target material comprises components with the following mass ratios: molybdenum element, 50%-80%; titanium element, 0.05%-25%; carbon element, 0.01%-1%.

5. The display panel of claim 4, wherein, The mass ratio of the carbon element is 0.05%-0.3%.

6. The display panel of claim 4, wherein, The purity of the molybdenum element, the titanium element, the zirconium element, and the carbon element is at least 99.99%.

7. A method of making a target, comprising: The target material manufacturing method is used to manufacture a target material for a transition adhesive layer of a display panel as claimed in any one of claims 1 to 6, the target material manufacturing method comprising: grinding and mixing powders containing a molybdenum element, a carbon element, and a strengthening metal into a mixed metal powder; placing the mixed metal powder in a sealed environment, vacuumizing, introducing a reducing gas, and adjusting the temperature to a first preset temperature to cause the reducing gas to undergo a redox reaction; static pressing the mixed metal powder under a first preset pressure to form a rough blank, the temperature during static pressing being a second preset temperature; static pressing the rough blank under a second preset pressure, the ambient temperature during static pressing being a third preset temperature, wherein the second preset temperature is less than the first preset temperature, and the second preset temperature is less than the third preset temperature; performing at least one round of hot rolling on the static pressed rough blank, the thickness change of the rough blank during each hot rolling being 25%-50%, wherein each round of hot rolling includes at least one hot rolling; crystallization annealing the hot rolled rough blank.

8. The target fabrication method of claim 7, wherein Before the step of performing at least one round of hot rolling on the static pressed rough blank, comprising: placing the static pressed rough blank in a protective gas and adjusting the temperature to a fourth preset temperature, wherein the fourth preset temperature is greater than the second preset temperature.

9. The target fabrication method of claim 7, wherein The diameter of the powders of molybdenum, carbon, and strengthening metal is 1um-100um.

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