Module

Abstract

The present invention provides a module (101) comprising a main substrate (1), a submodule (81) mounted on a first surface (1a) of the main substrate (1), a first component (31) mounted on the first surface (1a) separately from the submodule, and a first sealing resin (6a) formed to cover the first surface (1a) and the first component (31). The submodule (81) comprises a second component (32), a second sealing resin (6c) configured to cover the second component, and a surface that covers at least a portion of the side surface of the second sealing resin (6c) and is not electrically connected to an internal shielding film (9) of the main substrate (1). A ground connection conductor (45) is configured to be electrically connected to the internal shielding film (9), and the ground connection conductor (45) is exposed to the outside.

Description

Technical Field

[0001] The present invention relates to a module. Background Art

[0002] International Publication No. WO2018 / 101384 (Patent Document 1) describes a device called a "high-frequency module." In Patent Document 1, a sealing resin layer is disposed on the surface of a wiring substrate, and a shielding wall is formed to penetrate the sealing resin layer. The shielding wall is connected to a surface electrode disposed on the surface of the wiring substrate. In the invention described in Patent Document 1, a method is employed to form a shielding wall by forming a groove in the sealing resin layer by laser processing and then filling the groove with a conductive paste or the like.

[0003] Patent Document 1: International Publication No. WO2018 / 101384

[0004] In modules with compartmentalized shielding structures, grounding the shielding component placed inside the sealing resin becomes a challenge. The shielding wall described in Patent Document 1 is an example of a shielding component. As described in Patent Document 1, when forming grooves in the sealing resin layer using laser processing, it is necessary to pre-place surface electrodes on the surface of the wiring substrate to prevent laser damage to the wiring substrate. This prevents the laser from being irradiated by the surface electrodes, thus preventing damage to the wiring substrate.

[0005] However, the placement of surface electrodes occupies a certain area on the substrate surface. This reduces the flexibility in the layout of other wiring and components on the substrate surface. Furthermore, when grounding the shield wall via the surface electrodes, wiring for the ground connection must be prepared on or within the substrate, reducing the flexibility in substrate design. Summary of the Invention

[0006] Therefore, an object of the present invention is to provide a module having a cell shielding structure and capable of increasing the degree of freedom in designing the surface and interior of a substrate.

[0007] To achieve the above-mentioned objectives, a module according to the present invention comprises: a main substrate having a first surface and a second surface, the second surface being a surface opposite the first surface; a submodule mounted on the first surface; a first component mounted on the first surface separately from the submodule; and a first sealing resin formed to cover the first surface and the first component. The submodule comprises: a second component; a second sealing resin configured to cover the second component; and an internal shielding film formed to cover at least a portion of a side surface of the second sealing resin and not electrically connected to the main substrate. A ground connection conductor is configured to be electrically connected to the internal shielding film. The ground connection conductor is exposed to the outside of the first sealing resin.

[0008] According to the present invention, the module can be assembled by prefabricating the submodules elsewhere and then installing them. Therefore, there is no need to provide a location to receive the laser used for groove processing. Furthermore, since the ground connection conductor is configured to be electrically connected to the internal shielding film and is exposed to the outside of the first sealing resin, when the module is mounted on a motherboard, etc., the exposed portion of the ground connection conductor can be used to electrically connect the internal shielding film to the ground. Therefore, since the electrical connection path for grounding the internal shielding film can be set without passing through the substrate, a compartmentalized shielding structure can be achieved, and the design freedom of the substrate surface and interior is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a first perspective view of the module in the first embodiment of the present invention.

[0010] Figure 2 This is a second perspective view of the module in the first embodiment of the present invention.

[0011] Figure 3 This is a bottom view of the module in the first embodiment of the present invention.

[0012] Figure 4 It is along Figure 3 Cross-sectional view along line IV-IV.

[0013] Figure 5 This is an explanatory diagram of the first step of the manufacturing method for obtaining the module in the first embodiment of the present invention.

[0014] Figure 6 It is an explanatory diagram of the second step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0015] Figure 7 It is an explanatory diagram of the third step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0016] Figure 8 It is an explanatory diagram of the fourth step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0017] Figure 9 It is an explanatory diagram of the fifth step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0018] Figure 10 yes Figure 9 Bottom view of the submodule shown.

[0019] Figure 11 It is along Figure 10Cross-sectional view along line XI-XI.

[0020] Figure 12 It is an explanatory diagram of the sixth step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0021] Figure 13 This is an explanatory diagram of the seventh step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0022] Figure 14 This is an explanatory diagram of the eighth step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0023] Figure 15 This is an explanatory diagram of the ninth step of the manufacturing method for obtaining the module in the first embodiment according to the present invention.

[0024] Figure 16 This is a bottom view of a module in accordance with the second embodiment of the present invention.

[0025] Figure 17 It is along Figure 16 Cross-sectional view along line XVII-XVII.

[0026] Figure 18 This is a cross-sectional view of a submodule included in a module according to the second embodiment of the present invention.

[0027] Figure 19 It is an explanatory diagram of the first step of the manufacturing method for obtaining the module in the second embodiment according to the present invention.

[0028] Figure 20 It is an explanatory diagram of the second step of the manufacturing method for obtaining the module in the second embodiment according to the present invention.

[0029] Figure 21 It is an explanatory diagram of the third step of the manufacturing method for obtaining the module in the second embodiment according to the present invention.

[0030] Figure 22 This is a bottom view of a module in accordance with a third embodiment of the present invention.

[0031] Figure 23 It is along Figure 22 Cross-sectional view along line XXIII-XXIII.

[0032] Figure 24 It is an explanatory diagram of the first step of the manufacturing method for obtaining the module in the third embodiment according to the present invention.

[0033] Figure 25It is an explanatory diagram of the second step of the manufacturing method for obtaining the module in the third embodiment according to the present invention.

[0034] Figure 26 It is an explanatory diagram of the third step of the manufacturing method for obtaining the module in the third embodiment according to the present invention.

[0035] Figure 27 It is an explanatory diagram of the fourth step of the manufacturing method for obtaining the module in the third embodiment according to the present invention.

[0036] Figure 28 This is an explanatory diagram of the fifth step of the manufacturing method for obtaining the module in the third embodiment of the present invention.

[0037] Figure 29 It is an explanatory diagram of the sixth step of the manufacturing method for obtaining the module in the third embodiment according to the present invention.

[0038] Figure 30 This is an explanatory diagram of the seventh step of the manufacturing method for obtaining the module in the third embodiment of the present invention.

[0039] Figure 31 This is a bottom view of a module in accordance with a fourth embodiment of the present invention.

[0040] Figure 32 It is along Figure 31 Sectional view along line XXXII-XXXII.

[0041] Figure 33 It is an explanatory diagram of the first step of the manufacturing method for obtaining the module in the fourth embodiment according to the present invention.

[0042] Figure 34 It is an explanatory diagram of the second step of the manufacturing method for obtaining the module in the fourth embodiment according to the present invention.

[0043] Figure 35 This is a cross-sectional view of a modified example of the module in the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0044] The dimensional ratios shown in the drawings may not necessarily be true to reality and may be exaggerated for ease of explanation. In the following description, when the concepts of "up" or "down" are mentioned, they do not necessarily refer to absolute up or down but may refer to relative up or down in the postures shown in the drawings.

[0045] (Implementation 1)

[0046] Reference Figures 1 to 4 , the modules in embodiment 1 of the present invention are described.

[0047] Figure 1 The external appearance of the module 101 in this embodiment is shown. The upper surface and side surfaces of the module 101 are covered with the external shielding film 8 . Figure 2 Shown from Figure 1 Observe the situation of module 101 from the oblique bottom. Figure 3 1 shows a bottom view of module 101. The lower surface of module 101 is not covered by external shielding film 8. One or more external terminals 17 are provided on the lower surface of module 101. In the example shown here, multiple external terminals 17 are arranged annularly along the outer circumference of the lower surface of module 101. Figure 2 and Figure 3 The number, size, and arrangement of the external terminals 17 shown are merely examples. Figure 4 Shown along Figure 3 The cross-sectional view along the IV-IV line in the figure. Figure 3 In FIG. 1 , components built into the module 101 in a resin-sealed state are indicated by dotted lines.

[0048] In the example shown here, the first sealing resin 6a and the second sealing resin 6c are exposed on the bottom surface of the module 101. However, this is merely an example. The bottom surface of the module 101 other than the external terminals 17 and the ground connection conductor 45 may be covered with, for example, a resist film.

[0049] The first component 31 built into the module 101 may be, for example, an IC (Integrated Circuit). More specifically, the first component 31 may be, for example, an LNA (Low Noise Amplifier). The main substrate 1 may have wiring on the surface or inside. In other words, the main substrate 1 may also be a substrate called a wiring substrate. The main substrate 1 may be either a resin substrate or a ceramic substrate. The main substrate 1 may also be a multi-layer substrate. In other words, the main substrate 1 may be either a resin multi-layer substrate or a ceramic multi-layer substrate. Figure 4 In the example shown, the main substrate 1 is formed by laminating a plurality of insulating layers 2. The insulating layers 2 are, for example, resin layers.

[0050] The module 101 includes a main substrate 1, a submodule 81, a first component 31, and a first sealing resin 6a. The main substrate 1 has a first surface 1a and a second surface 1b, the second surface 1b being the surface opposite the first surface 1a. The submodule 81 is mounted on the first surface 1a. The first component 31 is mounted on the first surface 1a separately from the submodule 81. The first sealing resin 6a is formed to cover the first surface 1a and the first component 31. The submodule 81 is formed to have a smaller area than the main substrate 1.

[0051] The submodule 81 includes a second component 32, a second sealing resin 6c, and an internal shielding film 9. The second sealing resin 6c is configured to cover the second component 32, and the internal shielding film 9 is formed to cover at least one of the side surfaces of the second sealing resin 6c and is not electrically connected to the main substrate 1. The surface of the second sealing resin 6c facing away from the first surface 1a is not covered by the internal shielding film 9. The ground connection conductor 45 is configured to be electrically connected to the internal shielding film 9. The ground connection conductor 45 is exposed to the outside of the first sealing resin 6a. In this embodiment, the ground connection conductor 45 is provided on the first surface 1a of the main substrate 1. That is, the height dimension of the ground connection conductor 45 is substantially the same as the height dimension of the internal shielding film 9.

[0052] like Figure 4 As shown, on the lower surface of the module 101, the internal shielding film 9 is exposed in a relatively thin line shape, and the ground connection conductor 45 is exposed in a somewhat concentrated shape. The shape of the exposed surface of the ground connection conductor 45 is, for example, a rectangle. Figure 4 As shown, in the submodule 81, some components other than the second component 32 may also be built in. Figure 4 In the example shown, the component 34 is integrated into the submodule 81 .

[0053] In the example shown here, components 35, 36, 37, and 38 are mounted on the second surface 1b of the main substrate 1. The second surface 1b and the components 35, 36, 37, and 38 are covered with a third sealing resin 6b. The arrangement, number, and shape of the components 35, 36, 37, and 38 are merely examples and are not intended to be limiting.

[0054] In this embodiment, the module 101 can be assembled by prefabricating the submodule 81 elsewhere and then installing it. Therefore, there is no need to provide a portion that receives the laser for groove processing. In addition, since the ground connection conductor 45 is configured to be electrically connected to the internal shielding film 9 and the ground connection conductor 45 is exposed to the outside of the first sealing resin 6a, when the module 101 is mounted on a motherboard, etc., the exposed portion of the ground connection conductor 45 can be used to perform an electrical connection for grounding the internal shielding film 9. Since the path for the electrical connection for grounding the internal shielding film 9 can be set without passing through the main substrate 1, the design freedom of the surface and interior of the substrate can be increased. The so-called "substrate" here is the main substrate 1.

[0055] As shown in this embodiment, the ground connection conductor 45 is preferably in contact with the first surface 1a and arranged along the inner shielding film 9. This structure allows the ground connection conductor 45 to be formed by attaching a conductor component to the first surface 1a, as described later. This facilitates module fabrication. In this embodiment, the ground connection conductor 45 is a single-piece conductor component.

[0056] As shown in this embodiment, the ground connection conductor 45 is columnar. With respect to the first surface 1a, the height of the ground connection conductor 45 is preferably equal to the height of the second sealing resin 6c. This structure allows the height of the ground connection conductor 45 to be adjusted by attaching the conductor component to the first surface 1a and then polishing it, facilitating module fabrication. Furthermore, by arranging the ground connection conductor 45 so that it contacts the inner shielding film 9 along its entire height, grounding of the inner shielding film 9 can be achieved over a wide range.

[0057] As shown in this embodiment, module 101 preferably includes a component 36 as a third component mounted on second surface 1b, a third sealing resin 6b arranged to cover second surface 1b and the third component, and an external shielding film 8 formed to cover the side surfaces of first sealing resin 6a, the side surfaces of main substrate 1, and the surface and side surfaces of third sealing resin 6b facing away from second surface 1b. This structure allows for the mounting of more components within the limited area of ​​main substrate 1. Furthermore, by providing external shielding film 8 in addition to internal shielding film 9, shielding performance can be improved.

[0058] Reference Figures 5 to 15 , the manufacturing method of the module 101 in this embodiment is described. Figure 5 As shown, components 32, 34 and component 145 are attached to the surface of carrier tape 12. Component 145 is a conductor component that will later become ground connection conductor 45. Component 145 may be, for example, a metal block or a metal wire.

[0059] like Figure 6 As shown, a second sealing resin 6c is disposed. The second sealing resin 6c is formed by molding. The surface of the component 145 facing away from the carrier tape 12 is exposed from the second sealing resin 6c. Alternatively, the surface of the component 145 facing away from the carrier tape 12 may be temporarily covered with the second sealing resin 6c. In this case, polishing is performed to expose the surface of the component 145 facing away from the carrier tape 12.

[0060] Next, the second sealing resin 6c is cut into the size of a single submodule using a dicer or the like. At this time, the component 145 is also cut. Figure 7 In the example shown here, two ground connection conductors 45 are formed from one component 145. The size of the component 145 is determined in consideration of the width of the portion lost as chips when cut by a cutting machine. Figure 5 The width of the component 145 is greater than Figure 7 twice the width of the ground connection conductor 45 in FIG.

[0061] like Figure 8As shown in FIG. 1 , the internal shielding film 9 is formed by sputtering or the like. The second sealing resin 6 c and the ground connection conductor 45 are covered by the internal shielding film 9. Figure 8 In the figure, the submodule 81 has been formed and is attached to the carrier tape 12. After that, the submodule 81 can be peeled off from the carrier tape 12 to obtain the Figure 9 A single unit of the submodule 81 as shown. Figure 10 FIG. 8 shows the submodule 81 viewed from the bottom surface. Figure 10 In the figure, the terminals and the like are omitted. Figure 11 Shown along Figure 10 Cross-sectional view along line XI-XI.

[0062] like Figure 12 As shown in FIG, a component is made by mounting several components on the main substrate 1 and sealing them with resin. Figure 12 In the figure, the size of the substrate has become a single product, but it can actually be a collective substrate before being cut. Several components are mounted on the second surface 1b of the main substrate 1. The second surface 1b and these components are sealed with a third sealing resin 6b.

[0063] like Figure 13 As shown, the submodule 81 is mounted on the first surface 1a of the main substrate 1. In addition, the columnar conductor 18 is mounted on the first surface 1a. Figure 14 As shown in FIG. 1 , the first sealing resin 6a is configured to cover the first surface 1a and several objects mounted on the first surface 1a. The first sealing resin 6a can be formed by molding. Figure 15 As shown, the lower surface is ground. This grinding removes the portion of the internal shielding film 9 covering the surface of the submodule 81 facing away from the main substrate 1. This grinding exposes the end surface of the ground connection conductor 45 facing away from the main substrate 1. This grinding also removes a portion of the tip of the columnar conductor 18. The end surface newly formed by grinding on the side of the columnar conductor 18 facing away from the main substrate 1 becomes the external terminal 17.

[0064] The outer shielding film 8 is formed by sputtering or the like. Figure 4 Module 101 is shown.

[0065] (Implementation Method 2)

[0066] Reference Figures 16 and 17 , the modules in embodiment 2 of the present invention are described. Figure 16 A bottom view of the module 102 in this embodiment is shown. Figure 17 Shown along Figure 16 The cross-sectional view along the XVII-XVII line in the figure. Figure 16In FIG. 1 , components built into the module 102 in a resin-sealed state are indicated by dotted lines.

[0067] Module 102 includes a main substrate 1, a sub-module 81i, a first component 31 and a first sealing resin 6a, wherein the main substrate 1 has a first surface 1a and a second surface 1b, the second surface 1b is the surface on the opposite side of the first surface 1a, the sub-module 81i is formed to have an area smaller than the main substrate 1 and is installed on the first surface 1a, the first component 31 and the sub-module 81i are installed separately on the first surface 1a, and the first sealing resin 6a is formed to cover the first surface 1a and the first component 31.

[0068] The submodule 81i includes a second component 32, a second sealing resin 6c, and an internal shielding film 9. The second sealing resin 6c is configured to cover the second component 32, and the internal shielding film 9 is formed to cover at least one of the side surfaces of the second sealing resin 6c and is not electrically connected to the main substrate 1. The surface of the second sealing resin 6c facing away from the first surface 1a is not covered by the internal shielding film 9. The ground connecting conductor 45i is configured to be electrically connected to the internal shielding film 9. The ground connecting conductor 45i is exposed to the outside of the first sealing resin 6a. The ground connecting conductor 45i does not contact the first surface 1a and is configured further away from the first surface 1a than the end of the internal shielding film 9 facing away from the first surface 1a. In other words, the height dimension of the ground connecting conductor 45i is smaller than the height dimension of the internal shielding film 9.

[0069] In this embodiment, the ground connection conductor 45i is arranged to be electrically connected to the internal shielding film 9, and the ground connection conductor 45i is exposed to the outside of the first sealing resin 6a. Therefore, when the module 102 is mounted on a motherboard, etc., the exposed portion of the ground connection conductor 45i can be used to perform an electrical connection for grounding the internal shielding film 9. Therefore, the same effects as those of the first embodiment can be achieved.

[0070] In the present embodiment, since the ground connection conductor 45i is located away from the first surface 1a, the area occupied by the structure for cell shielding on the first surface 1a can be reduced.

[0071] Reference Figures 18 to 21 , a method for manufacturing the module 102 in this embodiment is described.

[0072] First, make Figure 18 The submodule 81i is shown. Figure 9 The submodule 81 shown differs from the submodule 81 in that it does not include the ground connection conductor 45. The method for manufacturing the submodule 81i is obtained by removing the matters related to the ground connection conductor 45 from the contents described as the method for manufacturing the submodule 81. Those skilled in the art will readily understand this, and therefore a detailed description thereof will not be repeated.

[0073] The submodule 81i is mounted on the first surface 1a of the main substrate 1, a first sealing resin 6a is formed, and the lower surface is polished to obtain a Figure 19 The state shown. That is, the portion of the submodule 81i that covers the top surface of the internal shielding film 9 is removed. The surface of the second sealing resin 6c that is away from the first surface 1a is not covered by the internal shielding film 9 and is exposed. The external terminal 17 is exposed as the end surface of the columnar conductor 18.

[0074] Next, if Figure 20 As shown, a recess 46 is formed. The recess 46 can be formed by, for example, laser processing. The recess 46 is formed so that the internal shielding film 9 is exposed. Figure 21 As shown, the ground connection conductor 45i is inserted into the recess 46. The ground connection conductor 45i may be, for example, a metal block. When the ground connection conductor 45i is inserted, solder may be sandwiched between the inner surface of the recess 46 and the ground connection conductor 45i.

[0075] Thus, we can get Figure 17 Module 102 is shown.

[0076] (Implementation 3)

[0077] Reference Figures 22 and 23 , the modules in embodiment 3 based on the present invention are described. Figure 22 A bottom view of the module 103 in this embodiment is shown. Figure 23 Shown along Figure 22 The sectional view along the line XXIII-XXIII in the figure. Figure 22 In FIG. 1 , components built into the module 103 in a resin-sealed state are shown by dotted lines.

[0078] Module 103 includes a main substrate 1, a sub-module 81j, a first component 31 and a first sealing resin 6a, wherein the main substrate 1 has a first surface 1a and a second surface 1b, the second surface 1b is the surface on the opposite side of the first surface 1a, the sub-module 81j is formed to have an area smaller than the main substrate 1 and is installed on the first surface 1a, the first component 31 and the sub-module 81j are installed separately on the first surface 1a, and the first sealing resin 6a is formed to cover the first surface 1a and the first component 31.

[0079] The submodule 81j includes a second component 32, a second sealing resin 6c, and an internal shielding film 9. The second sealing resin 6c is configured to cover the second component 32, and the internal shielding film 9 is formed to cover at least one of the side surfaces of the second sealing resin 6c and is not electrically connected to the main substrate 1. The surface of the second sealing resin 6c facing away from the first surface 1a is not covered by the internal shielding film 9. The grounding connection conductor 45j is configured to be electrically connected to the internal shielding film 9. The grounding connection conductor 45j is exposed to the outside of the first sealing resin 6a. Furthermore, the grounding connection conductor 45j is provided on the inner side of the submodule 81j relative to the internal shielding film 9 so as to contact the internal shielding film 9. Furthermore, unlike the grounding connection conductor 45 shown in the first embodiment, the height dimension of the grounding connection conductor 45j is smaller than the height dimension of the internal shielding film 9.

[0080] In this embodiment as well, the same effects as those of the second embodiment can be obtained.

[0081] Reference Figures 24 to 30 , the manufacturing method of the module 103 in this embodiment is described. Figure 24 As shown, components 32 and 34 are attached to the surface of the carrier tape 12. Figure 25 As shown in FIG. 1 , a second sealing resin 6c is configured. The second sealing resin 6c can be formed by molding. Figure 26 As shown in FIG. 4 , a recess 47 is formed in the second sealing resin 6 c. The recess 47 can be formed by, for example, laser processing. Figure 27 As shown, the component 145j is placed in the recess 47. The component 145j may be a block-shaped component prepared in advance. The component 145j may also be formed by filling the recess 47 with solder and solidifying the filler.

[0082] like Figure 28 As shown, the second sealing resin 6c is divided into the size of a single submodule. At this time, the component 145j is also divided to become the ground connection conductor 45j. This division can be performed by a cutting machine, for example. Next, as shown Figure 29 As shown, the internal shielding film 9 is formed. The internal shielding film 9 can be formed by, for example, sputtering. The submodule 81j is obtained on the surface of the carrier tape 12. By peeling the submodule 81j from the carrier tape 12, the Figure 30 The submodule 81j is mounted on the first surface 1a of the main substrate 1 and polished to obtain a Figure 22 as well as Figure 23 Module 103 is shown.

[0083] (Implementation 4)

[0084] Reference Figures 31 and 32 The modules in the fourth embodiment according to the present invention will be described. Figure 31 A bottom view of the module 104 in this embodiment is shown. Figure 32 Shown along Figure 31 The cross-sectional view along the line XXXII-XXXII in the figure. Figure 31 In FIG. 1 , components built into the module 104 in a resin-sealed state are indicated by dotted lines.

[0085] Module 104 includes a main substrate 1, a sub-module 81k, a first component 31 and a first sealing resin 6a, wherein the main substrate 1 has a first surface 1a and a second surface 1b, the second surface 1b is the surface on the opposite side of the first surface 1a, the sub-module 81k is formed to have an area smaller than the main substrate 1 and is installed on the first surface 1a, the first component 31 and the sub-module 81k are installed separately on the first surface 1a, and the first sealing resin 6a is formed to cover the first surface 1a and the first component 31.

[0086] The submodule 81k includes a second component 32, a second sealing resin 6c, and an internal shielding film 9. The second sealing resin 6c is configured to cover the second component 32, and the internal shielding film 9 is formed to cover at least one of the side surfaces of the second sealing resin 6c and is not electrically connected to the main substrate 1. The surface of the second sealing resin 6c facing away from the first surface 1a is not covered by the internal shielding film 9. A ground connection conductor 45k is configured to be electrically connected to the internal shielding film 9. The ground connection conductor 45k is exposed to the outside of the first sealing resin 6a. The ground connection conductor 45k extends in a direction parallel to the surface of the first sealing resin 6a, with a width greater than the thickness of the internal shielding film 9.

[0087] In this embodiment as well, the same effects as those of the second embodiment can be obtained.

[0088] To obtain module 104, first, make Figure 33 The structure shown in Figure 34 As shown, a recess 48 is formed. The recess 48 can be formed by, for example, laser processing. By embedding a solid component in the recess 48 or filling it with a slurry-like material, a Figure 31 as well as Figure 32 Module 104 is shown.

[0089] (Variation)

[0090] As a modification of module 104, it is also considered Figure 35 The module 105 shown in FIG. 1 is a structure similar to that of the module 105. In the module 104, the ground connection conductor 45k is housed in a recessed portion, but in the module 105, no recess is formed, and the ground connection conductor 45k is arranged to cover the end surface of the inner shielding film 9. The ground connection conductor 45k can also be formed by printing, for example.

[0091] Furthermore, although applicable to any embodiment, it is preferred that the ground connection conductor has any shape selected from a dot shape, a line shape, and a frame shape when viewed from a direction perpendicular to the first surface 1a. Figure 3 In the module 101 shown, the ground connection conductor 45 is a short wire. Figure 16 In the module 102 shown, the ground connection conductor 45i is linear. Figure 22 In the module 103 shown, the ground connection conductor 45j is a longer wire. Figure 31 In the illustrated module 104, the ground connection conductor 45k is frame-shaped. If the ground connection conductor is linear, it may extend along the entire length of one side of the submodule. Alternatively, the ground connection conductor may extend along multiple sides of the submodule. For example, the ground connection conductor may extend along two sides of the L-shaped submodule. Alternatively, the ground connection conductor may extend along two opposing parallel sides of the submodule. Alternatively, the ground connection conductor may extend along three of the four sides of the submodule.

[0092] As shown in the above embodiments, the second member 32 is preferably arranged along the surface of the submodule close to the first surface 1a, and the second member 32 is attached to the first surface 1a. This structure can reduce the thickness of the submodule and reduce the height of the entire module.

[0093] In the above embodiments, only one submodule is provided in one module, but a plurality of submodules may be provided in one module. One or more submodules may be mounted on both the first surface 1a and the second surface 1b of the main substrate 1 .

[0094] The first sealing resin 6a and the third sealing resin 6b may be the same type of resin or different types of resins. The first sealing resin 6a and the second sealing resin 6c may be the same type of resin or different types of resins.

[0095] Furthermore, in the above embodiments, the submodule 11 and main substrate 1 are shown in close contact. However, solder or other materials are typically placed between them for electrical connection, resulting in a slight gap between them outside the electrical connection area. For ease of explanation, the submodule 11 and main substrate 1 are shown in close contact. In reality, they can be in close contact or separated by a slight gap.

[0096] Furthermore, a plurality of the above-described embodiments may be appropriately combined and adopted.

[0097] The embodiments disclosed herein are by way of illustration in all points and are not restrictive. The scope of the present invention is indicated by the claims and is intended to encompass all modifications within the scope and meaning equivalent to the claims.

[0098] Description of Reference Numerals

[0099] 1...main substrate; 1a...first surface; 1b...second surface; 2...insulating layer; 6a...first sealing resin; 6b...third sealing resin; 6c...second sealing resin; 8...external shielding film; 9...internal shielding film; 12...carrier tape; 17...external terminal; 18...columnar conductor; 31...first component; 32...second component; 34, 35, 36, 37...component; 45, 45i, 45j, 45k...ground connecting conductor; 46, 47, 48...recess; 81, 81i, 81j, 81k...submodule; 101, 102, 103, 104, 105...module; 145, 145j...component.

Claims

1. A high-frequency module comprising: A main substrate having a first surface and a second surface, wherein the second surface is a surface opposite to the first surface; A submodule is installed on the first surface; A first component is mounted on the first surface separately from the submodule; and A first sealing resin is formed so as to cover the first surface and the first member. The above submodules have: Second component; a second sealing resin configured to cover the second member; and an internal shielding film formed to cover at least a portion of a side surface of the second sealing resin and not electrically connected to the main substrate; The ground connection conductor is configured to be electrically connected to the above-mentioned inner shielding film, The ground connection conductor is exposed to the outside of the first sealing resin.

2. The high-frequency module according to claim 1, wherein The ground connection conductor is in contact with the first surface and is arranged along the inner shielding film.

3. The high-frequency module according to claim 2, wherein: The ground connection conductor has a columnar shape, and a height of the ground connection conductor is equal to a height of the second sealing resin when the first surface is used as a reference.

4. The high-frequency module according to claim 1, wherein The ground connection conductor is not in contact with the first surface, but is arranged further away from the first surface than an end portion of the inner shielding film that is further away from the first surface.

5. The high-frequency module according to any one of claims 1 to 4, wherein When viewed from a direction perpendicular to the first surface, the ground connection conductor has any one shape selected from a dot shape, a line shape, and a frame shape.

6. The high-frequency module according to any one of claims 1 to 4, wherein The second component is arranged along a surface of the submodule that is close to the first surface, and the second component is attached to the first surface.

7. The high-frequency module according to any one of claims 1 to 4, wherein The above modules have: a third component mounted on the second surface; a third sealing resin configured to cover the second surface and the third member; and The external shielding film is formed so as to cover the side surface of the first sealing resin, the side surface of the main substrate, and the surface and side surface of the third sealing resin that are away from the second surface.

Images