Electrical Circuit Installation Detection Method, System, Storage Medium and Electronic Device

Abstract

The present invention discloses an electrical circuit installation detection method, system, storage medium and electronic device, which relates to the field of intelligent detection technology. The method includes: obtaining a three-dimensional scanning model corresponding to a target electrical circuit component installed in a target device; obtaining a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; performing a comparison process on the three-dimensional design model and the three-dimensional scanning model to obtain difference data; and determining the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data. The present invention can effectively improve the detection efficiency and detection accuracy of electrical circuit installation, and further improve the detection reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent detection, and particularly relates to a method, a system, a storage medium and an electronic device for detecting the installation of electrical circuits. Background Art

[0002] Electrical circuit installation is usually carried out in equipment. The reliability of electrical circuit installation has an important impact on the performance of the equipment. Therefore, it is very important to detect the installation of electrical circuits. Taking an aircraft as an example, a large number of electrical circuits are usually installed in an aircraft, and reliable detection is of great significance.

[0003] Currently, the way to detect the installation of electrical circuits is usually manual inspection based on experience. In the current method, the detection efficiency of electrical circuit installation is low and it is easy to make mistakes, and the detection reliability is low. Summary of the Invention

[0004] Embodiments of the present invention provide a solution, which can effectively improve the detection efficiency and detection accuracy of electrical circuit installation, and further improve the detection reliability.

[0005] Embodiments of the present invention provide the following technical solutions:

[0006] According to an embodiment of the present invention, a method for detecting the installation of an electrical circuit includes: obtaining a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device; obtaining a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; comparing the three-dimensional design model with the three-dimensional scan model to obtain difference data; and determining the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data.

[0007] According to an embodiment of the present invention, a system for detecting the installation of an electrical circuit includes: a first obtaining module, configured to obtain a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device; a second obtaining module, configured to obtain a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; a comparison module, configured to compare the three-dimensional design model with the three-dimensional scan model to obtain difference data; and a detection module, configured to determine the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data.

[0008] According to another embodiment of the present invention, a storage medium stores a computer program, and when the computer program is executed by a processor of a computer, the computer is caused to execute the method described in the embodiments of the present invention.

[0009] According to another embodiment of the present invention, an electronic device may include: a memory storing a computer program; and a processor reading the computer program stored in the memory to execute the method described in the embodiments of the present invention.

[0010] In an embodiment of the present invention, a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device is obtained; a three-dimensional design model carrying preset detection information is obtained, and the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; the three-dimensional design model is compared with the three-dimensional scan model to obtain difference data; and according to the preset detection information and the difference data, the installation state of the target electrical circuit component on the target device is determined.

[0011] In this way, for a target electrical circuit component, by obtaining the three-dimensional scan model under its actual installation layout and comparing it with the three-dimensional design model constructed according to the expected installation layout, the difference data between the two can accurately reflect the installation differences of the actual installation layout relative to the expected installation layout. Further, by analyzing the preset detection information carried by the three-dimensional design model and the difference data, the installation state such as whether the installation difference is abnormal or normal (such as whether there is an installation error or omission) can be efficiently and accurately analyzed, which can avoid the deficiencies of the existing empirical detection methods, effectively improve the efficiency and accuracy of electrical circuit installation detection, and enhance the detection reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention, and those skilled in the art can obtain other drawings without creative efforts based on these drawings.

[0013] Figure 1 Shows a flowchart of an electrical circuit installation detection method according to an embodiment of the present invention.

[0014] Figure 2 Shows a schematic diagram of a system to which the embodiments of the present invention can be applied in a scenario.

[0015] Figure 3 Shows another schematic diagram of a system to which the embodiments of the present invention can be applied in a scenario.

[0016] Figure 4 Shows a block diagram of an electrical circuit installation detection system according to an embodiment of the present invention.

[0017] Figure 5 Shows a block diagram of an electronic device according to an embodiment of the present invention. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] In the following description, specific embodiments of the present invention will be described with reference to steps and symbols executed by one or more computers, unless otherwise stated. Therefore, these steps and operations will be mentioned several times as being executed by a computer. What is meant by a computer execution herein includes the operations of a computer processing unit that represents electronic signals in a structured form of data. This operation transforms the data or maintains its position in the memory system of the computer, which can be reconfigured or otherwise changed in a manner well known to those skilled in the art. The data structure maintained by the data is the physical location of the memory, which has specific characteristics defined by the data format. However, the principles of the present invention are described in the above text, which does not represent a limitation. Those skilled in the art will understand that the various steps and operations described below can also be implemented in hardware.

[0020] Figure 1 The flowchart of the electrical circuit installation detection method according to an embodiment of the present invention is schematically shown. The execution subject of the electrical circuit installation detection method can be any device, such as edge devices such as a computer, a tablet computer, a smart phone, etc. In some embodiments, the execution subject can be a server device such as a physical server or a cloud server.

[0021] As Figure 1 shown, the electrical circuit installation detection method may include step S110 to step S140.

[0022] Step S110, obtaining a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device;

[0023] Step S120, obtaining a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component;

[0024] Step S130, comparing the three-dimensional design model with the three-dimensional scan model to obtain difference data;

[0025] Step S140, determining the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data.

[0026] The target device can be any device. In one example, the target device can be an aircraft or other flying vehicle. An electrical circuit component can be installed in the target device, and the electrical circuit component can be composed of at least one circuit installation unit. The circuit installation unit can include electrical circuits (such as wire harnesses and cables, etc.) and their installation parts (such as clamps and brackets, etc.).

[0027] The 3D scan model can refer to a set of data points that express the spatial distribution and surface characteristics of an object in a three-dimensional space reference system obtained through scanning. The 3D scan model corresponding to the target electrical circuit component installed in the target device, that is, a set of data points that can express the spatial distribution and surface characteristics when the target electrical circuit component is installed, which also means that this 3D scan model can express the actual installation layout of the target electrical circuit component in the target device.

[0028] The 3D design model, also known as the 3D data model or 3D model, is a polygonal representation of an object. The 3D design model is constructed according to the expected installation layout of the target electrical circuit component. Usually, it can be constructed during the design stage of the target electrical circuit component. The expected installation layout can reflect the standard or compliant installation layout of the target electrical circuit component.

[0029] By comparing the 3D scan model in its actual installation layout with the 3D design model constructed according to the expected installation layout, the difference data between the two can accurately reflect the installation differences of the actual installation layout relative to the expected installation layout.

[0030] The preset detection information is the preset information for installation detection, and the preset detection information can also reflect the expected installation layout. The preset detection information can be the standard or compliant installation layout information of the target electrical circuit component. In one example, the preset detection information can be product manufacturing information (PMI, Product Manufacturing Information). In another example, the preset detection information can be custom inspection information. For example, the preset detection information can include standard or compliant installation layout information corresponding to the outer diameter cylindrical feature and related data of the clamp, the inner diameter size of the clamp, the clamp position information, the clamp orientation information, the electrical wire harness routing, the outer diameter of the electrical wire harness, etc.

[0031] Furthermore, by carrying the preset detection information in the 3D design model, analysis can be performed based on the preset detection information and the difference data, and the installation state such as whether the installation differences reflected by the difference data are abnormal or normal (such as whether there are installation errors and omissions, etc.) can be analyzed efficiently and accurately.

[0032] In this way, based on steps S110 to S140, for the target electrical circuit component, by comparing the three-dimensional scan model of its actual installation layout with the three-dimensional design model constructed according to the expected installation layout, the difference data between the two can accurately reflect the installation differences of the actual installation layout relative to the expected installation layout. Further, by analyzing the three-dimensional design model carrying the preset detection information and the difference data, the installation status such as whether the installation difference is abnormal or normal (such as whether there is an installation error or omission, etc.) can be analyzed efficiently and accurately, which can avoid the deficiencies of the existing empirical detection methods, effectively improve the efficiency and accuracy of electrical circuit installation detection, and enhance the detection reliability.

[0033] The following describes the specific processes of each step when performing electrical circuit installation detection.

[0034] In step S110, obtain the three-dimensional scan model corresponding to the target electrical circuit component installed in the target device.

[0035] The three-dimensional scan model corresponding to the target electrical circuit component can be a preset three-dimensional scan model scanned in advance or a three-dimensional scan model obtained in real time. The three-dimensional scan model can be a scan model formed by three-dimensional point clouds. As described in the following embodiments.

[0036] In one embodiment, step S110, obtaining the three-dimensional scan model corresponding to the target electrical circuit component installed in the target device, includes:

[0037] Determine the component information of the target electrical circuit component; obtain the preset three-dimensional scan model corresponding to the component information from the preset database to obtain the three-dimensional scan model. The preset three-dimensional scan model is generated by scanning the target electrical circuit component in advance.

[0038] The component information can be the unique identification information of the target electrical circuit component, such as the harness number and other information. In one example, the component information can be input by the user; in another example, the component information can be obtained by automatically identifying the image after photographing the target electrical circuit component with the device's built-in camera or an external camera, such as automatically identifying the harness number information in the label in the image.

[0039] The preset database can store the preset three-dimensional scan models collected in advance, and each preset three-dimensional scan model can correspond to a component information. The preset three-dimensional scan model corresponding to the component information determined this time can be obtained from the preset database. The preset three-dimensional scan model is generated by scanning the target electrical circuit component in advance.

[0040] Further, before step S110 of obtaining the three-dimensional scan model corresponding to the target electrical circuit component installed in the target device, it can further include:

[0041] For the electrical circuit components in the target device, use a 3D scanner suitable for the actual electrical circuit components and the environment where the electrical circuit components are located. The environment includes, for example, lighting, space size, color, dimensions, and accuracy requirements of the components to be inspected, etc., to generate a preset 3D scan model corresponding to the scanned electrical circuit components. And the component information of the scanned electrical circuit components can be collected, and the component information of the electrical circuit components is associated and stored in a preset database with the preset 3D scan model.

[0042] Specifically, the manufactured electrical circuit components can be scanned or photographed on the electrical circuit component manufacturing workbench to collect the preset 3D scan model of the electrical circuit components. For repetitive scanning work, a robotic arm can be used for assistance to improve efficiency and reduce manual operations. The two-dimensional image of the label containing the electrical circuit components can be collected through a monocular camera, etc., and two-dimensional image recognition is performed. The component information in the label corresponds one by one to the preset 3D scan model and is stored in the preset database.

[0043] In one embodiment, it further includes: if there is no preset 3D scan model corresponding to the component information in the preset database, point cloud import processing is performed from the target position or the 3D scanner is controlled to scan the target electrical circuit components to obtain a 3D scan model.

[0044] When there is no preset 3D scan model of the target electrical circuit components in the preset database, in one way, the target position can be a data import position specified by the user, and the 3D scan model can be imported according to the specified target position; in another way, the user can control the 3D scanner to scan the target electrical circuit components through a control interface (such as the UI interface in control software) to generate a 3D scan model.

[0045] In step S120, a 3D design model carrying preset detection information is obtained. The 3D design model is constructed according to the expected installation layout of the target electrical circuit components.

[0046] When obtaining the 3D design model carrying preset detection information, in one example, a 3D design model carrying preset detection information can be constructed through design software, and the 3D design model can be obtained from the design software according to a preset interface; in another example, a 3D design model carrying preset detection information corresponding to the component information can also be obtained from the preset database according to the component information.

[0047] In one embodiment, step S120, obtaining a 3D design model carrying preset detection information, includes:

[0048] Determine component information of the target electrical circuit component; obtain a three-dimensional design model corresponding to the component information and carrying preset detection information, the three-dimensional design model being composed of at least one sub-model corresponding to a circuit installation unit, each sub-model being calibrated with corresponding unit detection information, and the preset detection information including the unit detection information corresponding to each sub-model.

[0049] The line installation unit is a unit that constitutes the target electrical line component. The target electrical line component is usually composed of at least one line installation unit. The obtained three-dimensional design model is composed of at least one sub-model. Each sub-model corresponds to a line installation unit. The line installation unit can be a standard part or a non-standard part.

[0050] By calibrating the corresponding unit test information for each sub-model, the acquired 3D design model can carry the preset test information composed of all the unit test information. This method of calibrating unit test information by unit allows for flexible generation of preset test information carried by the 3D design model when acquiring the corresponding 3D design models for different target electrical circuit components.

[0051] Furthermore, in one embodiment, the circuit installation unit may include electrical circuits (such as cables or wiring harnesses) and mounting components for the electrical circuits (such as clamps). The mounting components are parts used to assist in the installation of the electrical circuits. The electrical circuits (such as cables or wiring harnesses) correspond to sub-model calibrated unit detection information, such as wiring harness direction and wiring harness outer diameter. The mounting components (such as clamps) correspond to sub-model calibrated unit detection information, such as clamp outer diameter cylindrical features and related data, clamp inner diameter size, clamp position, and clamp orientation.

[0052] In step S130 , the 3D design model is compared with the 3D scanned model to obtain difference data.

[0053] The 3D design model and the 3D scan model can be compared at the data level to determine the positional differences of the data points of each part in the 3D design model and the 3D scan model, and obtain the difference data.

[0054] In one embodiment, step S130, comparing the three-dimensional design model with the three-dimensional scan model to obtain difference data, includes: aligning the three-dimensional design model with the three-dimensional scan model to obtain aligned three-dimensional design model and three-dimensional scan model; comparing the aligned three-dimensional design model with the three-dimensional scan model to obtain difference data.

[0055] Alignment processing aligns the 3D design model with the 3D scan model, so that the 3D design model and the 3D scan model overlap and coincide in the same coordinate space, obtaining the aligned 3D design model and 3D scan model, and establishing the constraint relationship between this pair of twin data of the 3D design model and the 3D scan model. Then, it is possible to efficiently and accurately compare the data points at the same positions in the aligned 3D design model and 3D scan model to determine the differential data; for example, it is possible to calculate and determine differential data such as the distance between the data point at position A in the 3D scan model and the data point at position A in the 3D design model.

[0056] In one embodiment, aligning the 3D design model with the 3D scan model to obtain the aligned 3D design model and 3D scan model includes: determining a preset first marker point in the 3D design model; determining a second marker point in the 3D scan model; and aligning the 3D design model and the 3D scan model based on the first marker point and the second marker point to obtain the aligned 3D design model and 3D scan model.

[0057] The first marker point and the second marker point are preset reference points for alignment. For some 3D design models and 3D scan models that are difficult to align, adding marker points can improve the alignment efficiency and accuracy.

[0058] Among them, the first marker point can add a marker point at a specific position X in the 3D design model when constructing the 3D design model; the second marker point can be a marker added at a position in the real installation layout that is intended to be aligned with the specific position X when scanning the 3D scan model, and the second marker point generated by scanning is the data point of the scanned marker.

[0059] In step S140, according to the preset detection information and the differential data, determine the installation state of the target electrical circuit component on the target device.

[0060] The differential data can accurately reflect the installation differences of the real installation layout relative to the expected installation layout. By analyzing the preset detection information and the differential data carried by the 3D design model, it is possible to efficiently and accurately analyze the installation state, such as whether the installation difference is abnormal or normal (such as whether there is an installation error or omission).

[0061] In one embodiment, the target electrical circuit component includes at least one circuit installation unit, the preset detection information includes the unit detection information corresponding to each circuit installation unit, and the differential data includes the unit differential data of each circuit installation unit; step S140, according to the preset detection information and the differential data, determine the installation state of the target electrical circuit component on the target device, including: according to the preset detection information of each circuit installation unit, perform verification processing on the unit differential data of each circuit installation unit to obtain the installation state of each circuit installation unit on the target device.

[0062] The unit difference data of each line installation unit can be determined by comparing the data of the sub-model corresponding to each line installation unit in the 3D design model with the data points in the 3D scan model. The unit difference data is verified and processed according to the preset detection information. For example, the preset verification information is unit size information and interval information, and the unit difference data can be the unit size difference and the unit distance. According to the unit size information, it can be verified whether the unit size difference is within the error range, and according to the interval information, it can be verified whether the unit distance is compliant, etc., so as to generate the installation status of each line installation unit, such as abnormal or normal (such as whether it is installed incorrectly or missing), etc. The installation status of all units is combined to obtain the installation status of the target electrical line assembly.

[0063] By dividing the line installation units, the target electrical line assembly can be subdivided to ensure the reliability of detection. In one example, dividing the line installation units can be divided into electrical lines and the installation parts of electrical lines. In one example, the division of simple installation units can be based on other division requirements.

[0064] In one embodiment, the line installation unit includes an electrical line and the installation parts of the electrical line; according to the preset detection information of each line installation unit, the unit difference data of each line installation unit is verified and processed to obtain the installation status of each line installation unit on the target device, including:

[0065] According to the preset detection information of the electrical line, the difference data of the electrical line is verified and processed to obtain the installation status of the electrical line on the target device; according to the preset detection information of the installation part, the difference data of the installation part is verified and processed to obtain the installation status of the installation part on the target device.

[0066] The electrical line can include wire harnesses, cables, etc., and the electrical line is usually a flexible non-standard part. Installation parts such as clamps and brackets, and clamps are usually standard parts.

[0067] Verifying the unit difference data according to the preset detection information of the electrical line. For example, the preset detection information of the electrical line includes line interval information, and the unit difference data includes line distance. At this time, according to the line interval information, it can be verified whether the line distance is compliant (such as whether it meets the isolation distance).

[0068] Verify the unit difference data according to the preset detection information of the installation part: For example, the installation part is a clamp, and the preset detection information of the clamp includes installation position information, clamp model information, clamp orientation information, clamp size information, etc. The unit difference data includes clamp installation point difference data, clamp size difference data, clamp orientation difference data, etc.; verifying the clamp installation point difference data according to the installation position information can determine whether the installation position of the clamp is correct; verifying the clamp size difference data according to the clamp model information and clamp size information can determine whether the clamp model installed in the target device is correct and whether the installed clamp model is suitable for the current electrical circuit, etc.; verifying the clamp orientation difference data according to the clamp orientation information can determine whether the clamp orientation is correct.

[0069] In one embodiment, in the foregoing embodiment, the target device includes an aircraft, and the target electrical circuit component includes the electrical circuit component of the Electrical Wiring Interconnection Systems (EWIS) in the aircraft. For an aircraft, especially for the complex electrical circuit installation during flight, based on the foregoing embodiment, the detection efficiency and accuracy of the electrical circuit installation can be effectively improved.

[0070] It can be understood that in some embodiments, the target electrical circuit component may be the overall component formed by all the electrical circuit installations in the target device. At this time, there is 1 target electrical circuit component in the target device. In some embodiments, the target electrical circuit component is the component formed by part of the circuit installations in the target device. At this time, there are multiple target electrical circuit components in the target device.

[0071] According to the method described in the foregoing embodiment, the following will be further described in detail with reference to application scenarios by way of examples. The meanings of the relevant terms in this scenario are the same as those in the foregoing embodiment, and specific descriptions can be referred to in the foregoing embodiment.

[0072] The system architecture for electrical circuit installation detection in this application scenario can refer to Figure 2 And Figure 3 As shown, in this scenario, the foregoing embodiment of the present application is applied to electrical circuit installation detection. Among them, the target device in the foregoing embodiment in this scenario is an airplane, and the target electrical circuit component includes the electrical circuit component of the Electrical Wiring Interconnection Systems (EWIS) in the airplane.

[0073] Refer to Figure 2 In this scenario, the electrical circuit installation detection system may include: a design data preprocessing unit 210, an EWIS manufacturing data acquisition unit 220, and an intelligent processing unit 230.

[0074] Preprocessing Unit 210 of Design Data: It can preprocess the 3D design model and the standard part library for subsequent inspection. In this unit, the 3D design model of the electrical circuit component can be constructed through design software. The 3D design model can include a custom-built sub-model and a sub-model called from the standard part library. In this unit, the sub-models in the 3D design model and the standard part library can be marked with preset inspection information, and the preset inspection information includes product manufacturing information (PMI, Product Manufacturing Information). In this unit, the interface development between the design software of the 3D design model and the intelligent processing unit 230 can be carried out, and the intelligent processing unit 230 can import the 3D design model carrying the preset inspection information from the design software through the interface. In this unit, the designed 3D design model can be associated and stored with the component information in a preset database.

[0075] The work in this unit can enable the electrical circuit component to start from the design data, that is, to give the key information for the inspection of the manufacturing data in the downstream manufacturing site, sub-assembly, and final assembly stages, and form a design mode oriented to manufacturing, installation, and quality inspection.

[0076] EWIS Manufacturing Data Acquisition Unit 220: In this unit, a 3D scanning model of the installed electrical circuit component (which can include electrical circuits and installation parts) can be obtained using a 3D scanner suitable for the scenario and environment, and the component information of the electrical circuit component can be automatically obtained through 2D image recognition, and the component information can be associated and stored with the 3D scanning model in a preset database.

[0077] Intelligent Processing Unit 230: In this unit, an automatic inspection software and related development programs can be used to obtain the 3D scanning model corresponding to the target electrical circuit component installed in the target device, obtain the 3D design model carrying the preset inspection information, and the 3D design model is constructed according to the expected installation layout of the target electrical circuit component. The 3D design model is compared with the 3D scanning model to obtain difference data. According to the preset inspection information and the difference data, the installation state of the target electrical circuit component on the target device is determined, realizing automatic and intelligent electrical circuit installation inspection.

[0078] Further, participate Figure 3 The system architecture of the intelligent processing unit 230 in this scenario can include: Interface (UI) 231, two-dimensional image recognition module 232, 3D scanner operation software interface module 233, digital model import module 234, automatic detection module 23, communication module 236, and database and other systems 237.

[0079] The intelligent processing unit 230 may include: a first acquisition module for acquiring a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device; a second acquisition module for acquiring a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; a comparison module for comparing the three-dimensional design model with the three-dimensional scan model to obtain difference data; and a detection module for determining the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data.

[0080] The first acquisition module may include an interface (UI) 231, a two-dimensional image recognition module 232, a three-dimensional scanner operation software interface module 233, a communication module 236, etc.

[0081] When the first acquisition module acquires a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device, it may: determine the component information of the target electrical circuit component; obtain a preset three-dimensional scan model corresponding to the component information from a preset database, to obtain the three-dimensional scan model, where the preset three-dimensional scan model is generated by pre-scanning the target electrical circuit component; if there is no preset three-dimensional scan model corresponding to the component information in the preset database, perform point cloud import processing from the target location or control a three-dimensional scanner to scan the target electrical circuit component to obtain the three-dimensional scan model.

[0082] The component information may be the unique identification information of the target electrical circuit component, such as a harness number and other information. In one example, the component information may be input by the user through the interface (UI) 231; in another example, the component information may be obtained by the user controlling a device's built-in camera or an external camera to photograph the target electrical circuit component through the interface (UI) 231, and then the two-dimensional image recognition module 232 automatically recognizes the image to obtain the component information, such as automatically recognizing the harness number information on the nameplate in the image.

[0083] When there is no preset three-dimensional scan model of the target electrical circuit component in the preset database (such as the database in the database and other systems 237), in one way, the target location may be a data import location specified by the user (such as the interface of other systems in the database and other systems 237), and the three-dimensional scan model may be imported through the communication module 236 according to the specified target location; in another way, the user may control the three-dimensional scanner to scan the target electrical circuit component through the three-dimensional scanner operation software interface module 233 in the control interface (such as the UI interface in the control software) to generate the three-dimensional scan model.

[0084] The second acquisition module may include an interface (UI) 231, a digital model import module 234, a communication module 236, etc.

[0085] When the second acquisition module acquires a 3D design model carrying preset detection information, it may: determine the component information of the target electrical circuit component; acquire the 3D design model carrying the preset detection information corresponding to the component information, where the 3D design model is composed of sub-models corresponding to at least one circuit installation unit, and each sub-model calibrates the corresponding unit detection information, and the preset detection information includes the unit detection information corresponding to each sub-model.

[0086] When acquiring a 3D design model carrying preset detection information, in one example, it may be to construct a 3D design model carrying preset detection information through design software, and the user obtains the 3D design model from the design software through an interface (UI) 231 according to a preset interface (such as a digital model import module 234); in another example, it may also be to acquire the 3D design model carrying the preset detection information corresponding to the component information from a preset database (such as the database in the database and other systems 237) through the communication module 236 according to the component information.

[0087] The circuit installation unit is the unit that composes the target electrical circuit component. The target electrical circuit component is usually composed of at least one circuit installation unit. The acquired 3D design model is composed of at least one sub-model, and each sub-model corresponds to a circuit installation unit. The circuit installation unit can be a standard part or a non-standard part.

[0088] By calibrating the corresponding unit detection information for each sub-model respectively, after obtaining the 3D design model, it can carry the preset detection information composed of all unit detection information. The method of calibrating the unit detection information by unit can flexibly form the preset detection information carried by the 3D design model when acquiring 3D design models corresponding to different target electrical circuit components.

[0089] The circuit installation unit may include an electrical circuit (such as a cable or a wire harness, etc.) and an installation part of the electrical circuit (such as a clamp, etc.). The installation part is a part used to assist in the installation of the electrical circuit. The unit detection information calibrated by the sub-model corresponding to the electrical circuit (such as a cable or a wire harness, etc.) is, for example, information such as the wire harness direction and the outer diameter of the wire harness. The unit detection information calibrated by the sub-model corresponding to the installation part (such as a clamp, etc.) is, for example, information such as the cylindrical feature and related data of the outer diameter of the clamp, the inner diameter size of the clamp, the position of the clamp, and the orientation of the clamp.

[0090] The comparison module and the detection module may belong to the automatic detection module 235, and the automatic detection module 235 may also include a report generation and output module.

[0091] A comparison module is used to compare a 3D design model with a 3D scanned model to obtain difference data; a detection module is used to determine the installation status of a target electrical circuit component on a target device according to preset detection information and the difference data. A report generation and output module is used to generate a report file according to the determined installation status and can transmit it to a target object in a communication network through a communication module 236.

[0092] Among them, comparing the 3D design model with the 3D scanned model to obtain difference data includes: aligning the 3D design model with the 3D scanned model to obtain the aligned 3D design model and 3D scanned model; comparing the aligned 3D design model with the 3D scanned model to obtain difference data.

[0093] The alignment process is to align the 3D design model with the 3D scanned model so that the 3D design model and the 3D scanned model overlap and coincide in the same coordinate space, obtaining the aligned 3D design model and 3D scanned model, and establishing a constraint relationship between the pair of twin data of the 3D design model and the 3D scanned model. Then, the data points at the same position in the aligned 3D design model and 3D scanned model can be compared efficiently and accurately to determine the difference data. For example, the difference data such as the distance between the data point at position A in the 3D scanned model and the data point at position A in the 3D design model can be calculated and determined.

[0094] Aligning the 3D design model with the 3D scanned model to obtain the aligned 3D design model and 3D scanned model includes: determining a preset first marker point in the 3D design model; determining a second marker point in the 3D scanned model; based on the first marker point and the second marker point, aligning the 3D design model with the 3D scanned model to obtain the aligned 3D design model and 3D scanned model.

[0095] The first marker point and the second marker point are preset reference points for alignment. For some 3D design models and 3D scanned models that are difficult to align, adding marker points can improve the alignment efficiency and accuracy. Among them, the first marker point can be added at a specific position X in the 3D design model when constructing the 3D design model; the second marker point can be a marker added at a position in the real installation layout that wants to be aligned with the specific position X when scanning the 3D scanned model, and the second marker point generated by scanning is the data point of the scanned marker.

[0096] Among them, the target electrical circuit component includes at least one circuit installation unit, the preset detection information includes the unit detection information corresponding to each circuit installation unit, and the difference data includes the unit difference data of each circuit installation unit; determining the installation status of the target electrical circuit component on the target device according to the preset detection information and the difference data includes: performing a verification process on the unit difference data of each circuit installation unit according to the preset detection information of each circuit installation unit to obtain the installation status of each circuit installation unit on the target device.

[0097] The circuit installation unit includes an electrical circuit and a mounting member of the electrical circuit; performing a verification process on the unit difference data of each circuit installation unit according to the preset detection information of each circuit installation unit to obtain the installation status of each circuit installation unit on the target device includes: performing a verification process on the difference data of the electrical circuit according to the preset detection information of the electrical circuit to obtain the installation status of the electrical circuit on the target device; performing a verification process on the difference data of the mounting member according to the preset detection information of the mounting member to obtain the installation status of the mounting member on the target device.

[0098] The electrical circuit may include a wire harness, a cable, etc., and the electrical circuit is usually a flexible non-standard part. Mounting members such as clamps and brackets, etc., and clamps are usually standard parts. Verifying the unit difference data according to the preset detection information of the electrical circuit. For example, the preset detection information of the electrical circuit includes line interval information, and the unit difference data includes line distance. At this time, the line distance can be verified according to the line interval information whether it is compliant (such as whether it meets the isolation distance).

[0099] Verifying the unit difference data according to the preset detection information of the mounting member: For example, the mounting member is a clamp, and the preset detection information of the clamp includes installation position information, clamp model information, clamp orientation information, clamp size information, etc., and the unit difference data includes clamp installation point difference data, clamp size difference data, clamp orientation difference data, etc.; verifying the clamp installation point difference data according to the installation position information can determine whether the installation position of the clamp is correct; verifying the clamp size difference data according to the clamp model information and the clamp size information can determine whether the clamp model installed in the target device is correct and whether the installed clamp model is applicable to the current electrical circuit, etc.; verifying the clamp orientation difference data according to the clamp orientation information can determine whether the clamp orientation is correct.

[0100] In this scenario, by applying the embodiments of the present application, for the complex electrical circuit installation during flight, based on the foregoing embodiments, the detection efficiency and accuracy of the electrical circuit installation can be effectively improved.

[0101] To facilitate the better implementation of the electrical circuit installation detection method provided by the embodiments of the present invention, the embodiments of the present invention also provide an electrical circuit installation detection system based on the above electrical circuit installation detection method. The meanings of the terms are the same as those in the above electrical circuit installation detection method, and the specific implementation details can be referred to the descriptions in the method embodiments. Figure 4 The system of an electrical circuit installation detection device according to an embodiment of the present invention is shown.

[0102] As Figure 4 shown, the electrical circuit installation detection system 300 may include a first acquisition module 310, a second acquisition module 320, a comparison module 330, and a detection module 340.

[0103] The first acquisition module 310 may be configured to acquire a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device; the second acquisition module 320 may be configured to acquire a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; the comparison module 330 may be configured to compare the three-dimensional design model with the three-dimensional scan model to obtain difference data; the detection module 340 may be configured to determine the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data.

[0104] In some embodiments, the comparison module 330 is configured to: align the three-dimensional design model with the three-dimensional scan model to obtain the aligned three-dimensional design model and three-dimensional scan model; compare the aligned three-dimensional design model with the three-dimensional scan model to obtain the difference data.

[0105] In some embodiments, the comparison module 330 is configured to: determine preset first marker points in the three-dimensional design model; determine second marker points in the three-dimensional scan model; based on the first marker points and the second marker points, align the three-dimensional design model with the three-dimensional scan model to obtain the aligned three-dimensional design model and three-dimensional scan model.

[0106] In some embodiments, the target electrical circuit component includes at least one circuit installation unit, the preset detection information includes unit detection information corresponding to each circuit installation unit, and the difference data includes unit difference data of each circuit installation unit; the detection module 340 is configured to: perform verification processing on the unit difference data of each circuit installation unit according to the preset detection information of each circuit installation unit to obtain the installation state of each circuit installation unit on the target device.

[0107] In some embodiments, the circuit installation unit includes an electrical circuit and a mounting member for the electrical circuit; the detection module 340 is configured to: verify the difference data of the electrical circuit according to the preset detection information of the electrical circuit to obtain the installation state of the electrical circuit on the target device; verify the difference data of the mounting member according to the preset detection information of the mounting member to obtain the installation state of the mounting member on the target device.

[0108] In some embodiments, the first acquisition module 310 is configured to: determine the component information of the target electrical circuit component; obtain the preset three-dimensional scan model corresponding to the component information from a preset database to obtain the three-dimensional scan model, where the preset three-dimensional scan model is generated by pre-scanning the target electrical circuit component.

[0109] In some embodiments, the first acquisition module 310 is configured to: if there is no preset three-dimensional scan model corresponding to the component information in the preset database, control a three-dimensional scanner to scan the target electrical circuit component to obtain the three-dimensional scan model.

[0110] In some embodiments, the first acquisition module 320 is configured to: determine the component information of the target electrical circuit component; obtain a three-dimensional design model carrying preset detection information corresponding to the component information, where the three-dimensional design model is composed of sub-models corresponding to at least one circuit installation unit, and each sub-model calibrates corresponding unit detection information, and the preset detection information includes the unit detection information corresponding to each sub-model.

[0111] In some embodiments, the target device includes an aircraft, and the target electrical circuit component includes an electrical circuit component of an electrical circuit interconnection system in the aircraft.

[0112] In this way, based on the electrical circuit installation detection system 300, for the target electrical circuit component, by comparing the three-dimensional scan model in its actual installation layout with the three-dimensional design model constructed according to the expected installation layout, the difference data between the two can accurately reflect the installation differences of the actual installation layout relative to the expected installation layout. Further, by analyzing the preset detection information and difference data carried by the three-dimensional design model, the installation state such as whether the installation difference is abnormal or normal (such as whether there is an installation error or omission, etc.) can be analyzed efficiently and accurately, which can avoid the deficiencies of the existing empirical detection methods, effectively improve the efficiency and accuracy of electrical circuit installation detection, and enhance the detection reliability.

[0113] It should be noted that although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present invention, the features and functions of two or more of the above-described modules or units can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0114] In addition, an embodiment of the present invention further provides an electronic device, which can be a terminal or a server. For example, Figure 5 as shown, it shows a schematic structural diagram of the electronic device involved in the embodiments of the present invention. Specifically:

[0115] The electronic device may include a processor 401 with one or more processing cores, a memory 402 with one or more computer-readable storage media, a power supply 403, an input unit 404, and other components. Those skilled in the art can understand that Figure 5 the structure of the electronic device shown in does not constitute a limitation on the electronic device, and it may include more or fewer components than shown in the figure, or combine certain components, or have different component arrangements. Among them:

[0116] The processor 401 is the control center of the electronic device, connecting various parts of the entire computer device through various interfaces and lines. By running or executing software programs and / or modules stored in the memory 402, and calling data stored in the memory 402, it executes various functions of the computer device and processes data, thereby monitoring the electronic device as a whole. Optionally, the processor 401 may include one or more processing cores; preferably, the processor 401 may integrate an application processor and a modem processor. Among them, the application processor mainly processes the operating system, user interfaces, and application programs, etc., and the modem processor mainly processes wireless communications. It can be understood that the above-mentioned modem processor may not be integrated into the processor 401.

[0117] The memory 402 can be used to store software programs and modules. The processor 401 executes various functional applications and data processing by running the software programs and modules stored in the memory 402. The memory 402 mainly includes a program storage area and a data storage area. Among them, the program storage area can store an operating system, application programs required for at least one function (such as a sound playback function, an image playback function, etc.); the data storage area can store data created according to the use of the computer device. In addition, the memory 402 may include high-speed random access memory and may also include non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage devices. Correspondingly, the memory 402 may also include a memory controller to provide the processor 401 with access to the memory 402.

[0118] The electronic device further includes a power supply 403 for powering each component. Preferably, the power supply 403 can be logically connected to the processor 401 through a power management system, so as to implement functions such as management of charging, discharging, and power consumption management through the power management system. The power supply 403 may also include any components such as one or more DC or AC power supplies, a recharge system, a power failure detection circuit, a power converter or inverter, and a power status indicator.

[0119] The electronic device may further include an input unit 404, which can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function controls.

[0120] Although not shown, the electronic device may further include a display unit, etc., which will not be elaborated here. Specifically, in this embodiment, the processor 401 in the electronic device will load the executable files corresponding to the processes of one or more computer programs into the memory 402 according to the following instructions, and the processor 401 will run the computer programs stored in the memory 402 to implement various functions in the foregoing embodiments of the present invention. For example, the processor 401 may execute the following steps:

[0121] Obtain a three-dimensional scan model corresponding to the target electrical circuit component installed in the target device; obtain a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; compare the three-dimensional design model with the three-dimensional scan model to obtain difference data; determine the installation status of the target electrical circuit component on the target device according to the preset detection information and the difference data.

[0122] Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by a computer program or by controlling relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium and loaded and executed by a processor.

[0123] For this reason, an embodiment of the present invention also provides a storage medium storing a computer program that can be loaded by a processor to execute the steps in any one of the methods provided by the embodiments of the present invention.

[0124] Among them, the storage medium may include: read-only memory (ROM, Read Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk, etc.

[0125] Since the computer program stored in the storage medium can execute the steps in any one of the methods provided by the embodiments of the present invention, the beneficial effects achievable by the methods provided by the embodiments of the present invention can be realized. For details, see the previous embodiments and will not be elaborated here.

[0126] After considering the specification and practicing the disclosed embodiments here, those skilled in the art will readily conceive of other embodiments of the present invention. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include known common knowledge or conventional technical means in the technical field not disclosed by the present invention.

[0127] It should be understood that the present invention is not limited to the embodiments described above and shown in the drawings, but various modifications and changes can be made without departing from its scope.

Claims

1. An electrical circuit installation detection method, characterized in that, Including: Obtain a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device; Obtain a three-dimensional design model carrying preset detection information, where the three-dimensional design model is constructed according to the expected installation layout of the target electrical circuit component; Compare the three-dimensional design model with the three-dimensional scan model to obtain difference data; the step of comparing the three-dimensional design model with the three-dimensional scan model to obtain difference data includes: Align the three-dimensional design model with the three-dimensional scan model to obtain the aligned three-dimensional design model and three-dimensional scan model; Compare the aligned three-dimensional design model with the three-dimensional scan model to obtain the difference data; the step of aligning the three-dimensional design model with the three-dimensional scan model to obtain the aligned three-dimensional design model and three-dimensional scan model includes: Determine a preset first marking point in the three-dimensional design model; Determine a second marking point in the three-dimensional scan model; Based on the first marking point and the second marking point, align the three-dimensional design model with the three-dimensional scan model to obtain the aligned three-dimensional design model and three-dimensional scan model; Determine the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data; the installation state includes a normal installation state and an abnormal installation state.

2. The method according to claim 1, characterized in that, The target electrical circuit component includes at least one circuit installation unit, the preset detection information includes unit detection information corresponding to each circuit installation unit, and the difference data includes unit difference data of each circuit installation unit; The step of determining the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data includes: Verify the unit difference data of each circuit installation unit according to the preset detection information of each circuit installation unit to obtain the installation state of each circuit installation unit on the target device.

3. The method according to claim 2, characterized in that The circuit installation unit includes an electrical circuit and a mounting member of the electrical circuit; The step of verifying the unit difference data of each circuit installation unit according to the preset detection information of each circuit installation unit to obtain the installation state of each circuit installation unit on the target device includes: Verify the difference data of the electrical circuit according to the preset detection information of the electrical circuit to obtain the installation state of the electrical circuit on the target device; Verify the difference data of the mounting member according to the preset detection information of the mounting member to obtain the installation state of the mounting member on the target device.

4. The method according to claim 1, characterized in that The step of obtaining a three-dimensional scan model corresponding to a target electrical circuit component installed in a target device includes: Determine the component information of the target electrical circuit component; Obtain a preset three-dimensional scan model corresponding to the component information from a preset database to obtain the three-dimensional scan model, where the preset three-dimensional scan model is generated by pre-scanning the target electrical circuit component.

5. The method according to claim 4, wherein The method further includes: If there is no preset 3D scanning model corresponding to the component information in the preset database, control the 3D scanner to scan the target electrical circuit component to obtain the 3D scanning model.

6. The method according to claim 1, wherein The obtaining of the 3D design model carrying preset detection information includes: Determine the component information of the target electrical circuit component; Obtain the 3D design model corresponding to the component information and carrying preset detection information. The 3D design model is composed of sub-models corresponding to at least one circuit installation unit, and each sub-model calibrates the corresponding unit detection information. The preset detection information includes the unit detection information corresponding to each sub-model.

7. The method according to any one of claims 1 to 6, characterized in that The target device includes an aircraft, and the target electrical circuit component includes the electrical circuit component of the electrical circuit interconnection system in the aircraft.

8. An electrical circuit installation detection system, characterized in that, Including: A first obtaining module, configured to obtain a 3D scanning model corresponding to a target electrical circuit component installed in a target device; A second obtaining module, configured to obtain a 3D design model carrying preset detection information, where the 3D design model is constructed according to the expected installation layout of the target electrical circuit component; A comparison module, configured to compare the 3D design model with the 3D scanning model to obtain difference data; the comparing the 3D design model with the 3D scanning model to obtain difference data includes: aligning the 3D design model with the 3D scanning model to obtain the aligned 3D design model and 3D scanning model; comparing the aligned 3D design model with the 3D scanning model to obtain the difference data; the aligning the 3D design model with the 3D scanning model to obtain the aligned 3D design model and 3D scanning model includes: determining a preset first marker point in the 3D design model; determining a second marker point in the 3D scanning model; based on the first marker point and the second marker point, aligning the 3D design model with the 3D scanning model to obtain the aligned 3D design model and ३D scanning model; A detection module, configured to determine the installation state of the target electrical circuit component on the target device according to the preset detection information and the difference data; the installation state includes a normal installation state and an abnormal installation state.

9. A computer-readable storage medium, characterized in that, It stores a computer program, and when the computer program is executed by a processor of a computer, the computer executes the method according to any one of claims 1 to 7.

10. An electronic device, characterized in that, Including: A memory, storing a computer program; A processor, reading the computer program stored in the memory to execute the method according to any one of claims 1 to 7.

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