Inductor structure and manufacturing method, electronic packaging and manufacturing method, packaging carrier manufacturing method

Abstract

An inductor structure and manufacturing method, an electronic package and manufacturing method, and a method for manufacturing a package carrier. In the inductor structure, the end face profiles of the first conductive pillar and the second conductive pillar of the inductor body respectively correspond to the end face profiles of the first conductive sheet. This makes the end face profiles of the first and second conductive pillars non-cylindrical, thereby increasing the contact area between the first conductive sheet and the first and second conductive pillars, thereby improving the conductivity quality and inductor performance. Furthermore, by designing the first and second conductive pillars as a multi-layer stacked structure, the cross-sectional area and number of loops are effectively increased, thereby improving the inductance value.

Description

Technical Field

[0001] The present invention relates to an inductor structure, in particular to a three-dimensional coil-type inductor structure that can be embedded in a substrate using packaging substrate technology, a manufacturing method thereof, an electronic package and a manufacturing method thereof, and a manufacturing method of a packaging carrier. Background Art

[0002] In common semiconductor applications, such as communications or high-frequency semiconductor devices, it is often necessary to electrically connect a plurality of radio frequency passive components, such as resistors, inductors, capacitors, and oscillators, to a packaged semiconductor chip in order to enable the semiconductor chip to have specific current characteristics or emit signals.

[0003] Taking SiP (System in Package) semiconductor devices as an example, although most passive components are placed on the surface of the substrate, in order to prevent these passive components from hindering the electrical connection and configuration between the semiconductor chip and the majority of bonding pads, these passive components are traditionally placed at the corners of the substrate or on additional layout areas of the substrate outside the semiconductor chip connection area.

[0004] However, limiting the location of passive components reduces the flexibility of the substrate's circuit layout (routability) and also requires considering the location of solder pads, which limits the number of passive components that can be placed, hindering the trend of highly integrated semiconductor devices. At the same time, the number of passive components placed has increased dramatically with the demand for high-performance semiconductor packages. If existing methods are used to simultaneously accommodate the required number of semiconductor chips and passive components on the substrate surface, the available area of ​​the package substrate will inevitably increase, resulting in a larger package volume. Furthermore, the distance between the passive component (such as an inductor) and the semiconductor chip is increased, resulting in reduced electrical characteristics and performance of the passive component.

[0005] Based on the above problems, there are designs that combine passive components with substrate circuits and manufacture them together, such as the coil-type inductor of Taiwan Patent No. M580254, which aims to solve the above problems. However, it is a separate passive component and still needs to be processed using surface mount technology (SMT) during assembly, so the conductivity of its circuit path is still limited by the wiring design. Figure 1A and Figure 1B As shown, the coil-type inductor 1 of Taiwan Patent No. M580254 is formed by a plurality of inductors 1a arranged along a circular path. The plurality of inductors 1a are enclosed in an insulator 1b of two stacked substrates (as shown in FIG. 17 of Taiwan Patent No. M580254), and each of the inductors 1a is composed of a plurality of lower conductive sheets 11, a plurality of inner conductive pillars 13, a plurality of outer conductive pillars 14, and a plurality of upper conductive sheets 12.

[0006] Specifically, the multiple lower conductive sheets 11 are long and conical, with the inner conductive posts 13 disposed on the small end 11a of the lower conductive sheet 11, and the outer conductive posts 14 disposed on the large end 11b of the lower conductive sheet 11. The upper conductive sheet 12 spans two adjacent lower conductive sheets 11, i.e., the small end 12a of the upper conductive sheet 12 is coupled to the inner conductive posts 13 of one of the lower conductive sheets 11, while the large end 11b of the upper conductive sheet 12 is coupled to the outer conductive posts 14 of the other adjacent lower conductive sheet 11. This results in a staggered arrangement of the multiple lower conductive sheets 11 and the multiple upper conductive sheets 12, so that the multiple inductors 1a form a spiral coil-type inductor 1.

[0007] However, Taiwan Patent No. M580254 uses a semiconductor material as a substrate, forms a lateral inductor and a vertical inductor by etching, and then connects them together with solder to form a three-dimensional toroidal inductor. Therefore, it has the problem of upper and lower alignment, and requires a large alignment space, which limits the number of coil boxes. In addition, the solder material is connected between the lower conductive sheet 11 and the upper conductive sheet 12, which affects the performance of the coil-type inductor 1.

[0008] Furthermore, the conventional method for manufacturing the coil-type inductor 1 requires mechanical drilling or laser drilling to form the circular holes required for the inner conductive posts 13 in the insulator 1b (as shown in FIG. 11 of Taiwan Patent No. M580254). This restricts the inner conductive posts 13 to a cylindrical shape, limiting the distance between the inner conductive posts 13 due to the drilling process. Furthermore, the contours of the inner conductive posts 13 do not correspond to the contours of the small end 11a of the underlying conductive sheet 11. Consequently, the number of loops of the toroidal winding of the coil-type inductor 1 is also limited by the diameter of the circular hole. Consequently, the surface area of ​​the coil-type inductor 1 cannot be increased due to the limited number of loops, preventing further improvement in inductance.

[0009] Furthermore, in the conventional method of manufacturing the coil-type inductor 1 , the formation of the circular hole reduces the copper area of ​​the inner conductive pillar 13 used for electrical conduction, resulting in a higher resistance of the inner conductive pillar 13 . This not only leads to lower inductor efficiency but also increases the likelihood of heat accumulation, affecting the overall performance of the end product.

[0010] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be overcome urgently in the industry. Summary of the Invention

[0011] In view of the deficiencies in the prior art, the present invention provides an inductor structure and manufacturing method, an electronic package and manufacturing method, and a packaging carrier manufacturing method, which can improve the inductance value.

[0012] The inductor structure of the present invention includes: an insulator having a first side and a second side opposite to each other; a plurality of first conductive sheets in the shape of fan-shaped plates and embedded in the insulator from the first side of the insulator, each of the first conductive sheets having a first end and a second end opposite to each other, and the width of the first end is smaller than the width of the second end; a plurality of first conductive pillars embedded in the insulator and electrically connected to the first end of each of the first conductive sheets, wherein the profile of the end face of each of the first conductive pillars corresponds to the profile of the first end, and each of the first conductive pillars includes a plurality of first pillars stacked on each other; a plurality of second conductive pillars embedded in the insulator and electrically connected to the second end of each of the first conductive sheets, wherein the profile of the end face of each of the second conductive pillars corresponds to the profile of the second end, and each of the second conductive pillars includes a plurality of second pillars stacked on each other; a plurality of second conductive sheets in the shape of curved plates and embedded in the insulator The second side of the insulator is embedded in the insulator, each second conductive sheet has a third end and a fourth end opposite each other, and is correspondingly arranged across two adjacent first conductive sheets, wherein the third end of the second conductive sheet has a contour corresponding to the first end of the first conductive sheet, and the third end is electrically connected to the first conductive post on the first end of one of the two adjacent first conductive sheets, and the fourth end of the second conductive sheet has a contour corresponding to the second end of the first conductive sheet, and the fourth end is electrically connected to the second conductive post on the second end of the other of the two adjacent first conductive sheets; and wherein the first side of the insulator exposes at least a portion of each of two adjacent first conductive sheets, or the second side of the insulator exposes at least a portion of each of two adjacent second conductive sheets, for bonding to an electrode pad, and the electrode pad is electrically connected to the first and / or second conductive sheets. An insulating protective layer may be formed on the insulator and the electrode pad, wherein the insulating protective layer has at least one opening formed to expose a portion of the electrode pad.

[0013] The present invention also provides a method for manufacturing an inductor structure, which adopts a core-less manufacturing technology of an integrated circuit (IC) carrier. The method includes: forming a plurality of first conductive plates on a carrier by a patterning process, wherein each of the first conductive plates has a first end and a second end relative to each other, and the width of the first end is smaller than the width of the second end, so that each of the first conductive plates is in the shape of a fan-shaped plate; electroplating a first conductive column on the first end of each of the first conductive plates by the patterning process, and electroplating a second conductive column on the second end of each of the first conductive plates by the patterning process, wherein the first conductive column is The contour of the end face of a conductive column corresponds to the contour of the first end of the first conductive sheet, and the contour of the end face of the second conductive column corresponds to the contour of the second end of the first conductive sheet. An insulating layer is formed on the carrier, the first conductive column, the second conductive column and the first conductive sheet, and the first conductive column and the second conductive column are exposed. Each of the first conductive columns includes a plurality of first columns stacked on each other, and each of the second conductive columns includes a plurality of second columns stacked on each other. The insulating layer includes a plurality of insulating layers stacked on each other. A plurality of second conductive sheets are formed on the insulating material by a patterning process. Each of the second conductive sheets The second conductive sheet has a third end and a fourth end that are opposite to each other and are correspondingly arranged across two adjacent first conductive sheets, wherein the contour of the third end of the second conductive sheet corresponds to the contour of the first end of the first conductive sheet, and the third end is electrically connected to the first conductive column on the first end of one of the two adjacent first conductive sheets, and the contour of the fourth end of the second conductive sheet corresponds to the contour of the second end of the first conductive sheet, and the fourth end is electrically connected to the second conductive column on the second end of the other of the two adjacent first conductive sheets; an insulating layer is formed on the insulating material and the plurality of The insulating material and the first conductive sheets are formed on the insulating material to cover the plurality of second conductive sheets; the carrier is removed to expose the insulating material and the plurality of first conductive sheets; and another insulating layer is formed on the insulating material and the plurality of first conductive sheets to cover the plurality of first conductive sheets, and each of the insulating layers and the insulating material constitutes an insulator, so that the insulator is defined with a first side and a second side relative to each other, wherein the first side of the insulator exposes at least a portion of each of two adjacent ones of the plurality of first conductive sheets, or the second side of the insulator exposes at least a portion of each of two adjacent ones of the plurality of second conductive sheets for combining with the electrode pad.

[0014] In the aforementioned inductor structure and its manufacturing method, the multiple first conductive plates are arranged in a ring structure, so that the first ends of the multiple first conductive plates constitute the inner ring boundary of the ring structure, and the second ends of the multiple first conductive plates constitute the outer ring boundary of the ring structure relative to the inner ring boundary.

[0015] In the aforementioned inductor structure and manufacturing method thereof, the first ends of the plurality of first conductive sheets are in an arc shape, and the end surface of each of the first conductive pillars disposed thereon is in a knuckle shape.

[0016] In the aforementioned inductor structure and manufacturing method thereof, the first ends of the plurality of first conductive sheets are tapered, and the end surface of each of the first conductive pillars disposed thereon is triangular.

[0017] In the aforementioned inductor structure and manufacturing method thereof, a connection pad is disposed between the plurality of first pillars and / or the plurality of second pillars.

[0018] In the aforementioned inductor structure and manufacturing method thereof, the plurality of first pillars have different widths and / or the plurality of second pillars have different widths.

[0019] In the aforementioned inductor structure and method of manufacturing the same, the insulator comprises a magnetically conductive material. For example, the insulator comprises multiple layers of insulating material, with at least one layer being a magnetically conductive material, and a dielectric material for circuit electroplating is formed on the magnetically conductive material.

[0020] The aforementioned inductor structure and method for manufacturing the same further include patterned electroplating to form at least one magnetically conductive metal layer within the insulator, wherein the magnetically conductive metal comprises one of nickel, zinc, manganese, iron, cobalt, or a combination thereof. For example, the magnetically conductive metal is arranged around a first conductive post at the first end and a second conductive post at the third end, such that the first conductive post at the first end and the second conductive post at the third end are positioned within a loop of the magnetically conductive metal. Alternatively, the magnetically conductive metal may be distributed in the form of at least one layer, at least one miniaturized dot, at least one miniaturized strip, or at least one miniaturized block.

[0021] In the aforementioned inductor structure and manufacturing method thereof, the conductive pillar and the insulating material are manufactured by a coreless layer technology of a carrier board in a layer-by-layer build-up method or a one-time build-up method.

[0022] The present invention also provides an electronic package, comprising: a package carrier having a circuit structure; the aforementioned inductor structure, which is formed in the package carrier and electrically connected to the circuit structure; and at least one electronic component, which is connected to one side of the package carrier and electrically connected to the circuit structure and the inductor structure.

[0023] The aforementioned electronic package also includes a packaging material that covers the electronic component.

[0024] The present invention further provides a method for manufacturing a package carrier, which includes simultaneously manufacturing a circuit structure and at least one of the aforementioned inductor structures.

[0025] The present invention further provides a method for manufacturing an electronic package, comprising: providing a package carrier having a circuit structure, wherein the aforementioned inductor structure is formed in the package carrier; and placing at least one electronic component on one side of the package carrier, and electrically connecting the electronic component to the circuit structure and the inductor structure.

[0026] As can be seen from the foregoing, in the inductor structure and method for manufacturing the same, as well as the electronic package and method for manufacturing the same, and the method for manufacturing the package carrier of the present invention, the end face profile of the first conductive pillar of the multi-layer pillar stack corresponds to the profile of the first end, and the end face profile of the second conductive pillar of the multi-layer pillar stack corresponds to the profile of the second end. Therefore, compared to the prior art, the present invention can increase the contact area between the first conductive sheet and the first and second conductive pillars, thereby effectively reducing the resistance of the inductor structure. It can also increase the number of turns and cross-sectional area of ​​the inductor structure's loops, thereby improving the inductance of the inductor structure and thereby increasing the quality factor of the inductor structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A It is a partial three-dimensional schematic diagram of an existing inductor.

[0028] Figure 1B A schematic diagram of a partial top view of an existing inductor is shown in FIG.

[0029] Figure 2 FIG. 4 is a schematic plan view of the first conductive sheet of the inductor structure of the present invention.

[0030] Figure 2-1 for Figure 2 A plan view of another embodiment of the present invention.

[0031] Figure 2-2 FIG. 4 is a partial plan view of the inductor structure of the present invention.

[0032] Figure 2-3 for Figure 2-2 A partial plan view of another embodiment of the present invention.

[0033] Figure 3A FIG. 4 is a cross-sectional schematic diagram of the inductor structure of the present invention.

[0034] Figure 3A-1 for Figure 3A A cross-sectional schematic diagram of another embodiment of the present invention.

[0035] Figure 3B for Figure 3A A cross-sectional schematic diagram of another embodiment of the present invention.

[0036] Figure 3B-1 for Figure 3B A cross-sectional schematic diagram of another embodiment of the present invention.

[0037] Figures 4A to 4F FIG. 4 is a cross-sectional schematic diagram of a method for manufacturing an inductor structure according to the present invention.

[0038] Figure 4F-1 FIG. 1 is a cross-sectional view of another embodiment of the method for manufacturing the inductor structure of the present invention.

[0039] Figure 5ASchematic cross-sectional view of the electronic package of the present invention.

[0040] Figure 5A-1 for Figure 5A A cross-sectional schematic diagram of another embodiment of the present invention.

[0041] Figure 5B for Figure 5A A cross-sectional schematic diagram of another embodiment of the present invention.

[0042] Figure 5B-1 for Figure 5B A cross-sectional schematic diagram of another embodiment of the present invention.

[0043] Figure 6A FIG. 4 is a cross-sectional diagram of another embodiment of the inductor structure of the present invention. Figure 6A-1 for Figure 6A A cross-sectional schematic diagram of another embodiment of the present invention.

[0044] Figure 6B for Figure 6A A cross-sectional schematic diagram of another embodiment of the present invention.

[0045] Figure 6B-1 for Figure 6B A cross-sectional schematic diagram of another embodiment of the present invention.

[0046] The description of the accompanying drawings is as follows:

[0047] 1: Coil type inductor

[0048] 1a: Inductor

[0049] 1b: Insulator

[0050] 11: Lower conductive sheet

[0051] 11a, 12a: small end

[0052] 11b, 12b: Big end

[0053] 12: Upper conductive sheet

[0054] 13: Inner conductive column

[0055] 14: External conductive column

[0056] 2, 2', 6, 6': Inductor structure

[0057] 2a, 2a': Inductor body

[0058] 2b, 3b: Insulator

[0059] 20a: First side

[0060] 20b: Second side

[0061] 200, 201: Opening

[0062] 21, 21': first conductive sheet

[0063] 21a, 21a': first end

[0064] 21b: Second end

[0065] 22, 22': second conductive sheet

[0066] 22a, 22a': third end

[0067] 22b: Fourth end

[0068] 23, 23': first conductive column

[0069] 230, 230': First column

[0070] 231, 241: connection pads

[0071] 24, 24': Second conductive column

[0072] 240, 240': Second column

[0073] 240”: Electrode pads

[0074] 25, 26, 27, 35, 37: Insulation material

[0075] 28, 29, 38, 39: Insulation layer

[0076] 3, 3': Electronic packaging

[0077] 31: Package carrier

[0078] 311: Line structure

[0079] 32: Electronic components

[0080] 33: Packaging materials

[0081] 34: Solder balls

[0082] 60: Magnetic metal

[0083] 61: Insulation protective layer

[0084] 610: Opening

[0085] 80: Bearing

[0086] 80a: Metal materials

[0087] 90, 91: barrier layer

[0088] t: gap

[0089] S: Circular path. DETAILED DESCRIPTION

[0090] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0091] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those familiar with this technology, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the efficacy and purpose of the present invention. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be considered as the scope of the implementation of the present invention without substantially changing the technical content.

[0092] Figure 2 、 Figure 2-2 and Figure 3A Schematic diagram of the inductor structure 2 of the present invention. Figure 2 、 Figure 2-2 and Figure 3A As shown, the inductor structure 2 includes an insulator 2b and an inductor body 2a combined with the insulator 2b. The inductor body 2a includes a plurality of first conductive sheets 21, a plurality of first conductive pillars 23, a plurality of second conductive pillars 24 and a plurality of second conductive sheets 22.

[0093] In this embodiment, Figure 2 for Figure 3A The plan view from below, Figure 2-2 for Figure 3A A floor plan from above.

[0094] The insulator 2b has a first side 20a and a second side 20b opposite to each other. In this embodiment, the insulator 2b is made in a coreless build-up method, so it can include multiple insulating layers (such as Figure 4F shown).

[0095] The first conductive sheet 21 is embedded in the first side 20a of the insulator 2b (eg Figure 3A As shown), each of the first conductive sheets 21 has a first end 21a and a second end 21b opposite to each other (as shown Figure 2As shown), and the width of the first end 21a is smaller than the width of the second end 21b, so that the first conductive sheet 21 is fan-shaped, and if the gap t between adjacent first conductive sheets 21 is minimized, it is the optimal embodiment.

[0096] In this embodiment, the plurality of first conductive sheets 21 are arranged in a ring structure, such as Figure 2 As shown, the first ends 21 a of the plurality of first conductive sheets 21 constitute the inner ring boundary of the ring structure, and the second ends 21 b of the plurality of first conductive sheets 21 constitute the outer ring boundary of the ring structure opposite to the inner ring boundary.

[0097] The first conductive pillars 23 are embedded in the insulator 2b and electrically connected to the first end portions 21a of the first conductive sheets 21. The contour of the end surface of each first conductive pillar 23 corresponds to the contour of the first end portion 21a (e.g. Figure 2 shown) and is non-cylindrical.

[0098] The second conductive pillars 24 are embedded in the insulator 2b and electrically connected to the second end portions 21b of the first conductive sheets 21. The contour of the end surface of each second conductive pillar 24 corresponds to the contour of the second end portion 21b (e.g. Figure 2 shown) and is non-cylindrical.

[0099] The second conductive sheet 22 is embedded in the second side of the insulator 2b (eg Figure 3A As shown), each of the second conductive sheets 22 has a third end 22a and a fourth end 22b opposite to each other (as shown Figure 2-2 ), and are correspondingly arranged across two adjacent first conductive sheets 21, wherein the contour of the third end 22a of each second conductive sheet 22 corresponds to the first end 21a of the first conductive sheet 21, and the third end 22a is electrically connected to the first conductive column 23 on the first end 21a of one of the two adjacent first conductive sheets 21, and the contour of the fourth end 22b of the second conductive sheet 22 corresponds to the second end 21b of the first conductive sheet 21, and the fourth end 22b is electrically connected to the second conductive column 24 on the second end 21b of the other of the two adjacent first conductive sheets 21.

[0100] Preferably, the second conductive sheet 22 is in a curved plate shape so that when it is placed across two adjacent first conductive sheets 21 (eg Figure 2-2 As shown in FIG, the third end 22a of the second conductive sheet 22 can completely cover the first conductive column 23 on the first end 21a of the first conductive sheet 21, and the fourth end 22b of the second conductive sheet 22 can completely cover the second conductive column 24 on the second end 21b of the first conductive sheet 21, thereby facilitating improving the electrical conduction efficiency of the inductor body 2a and reducing the impedance.

[0101] Furthermore, the process of manufacturing the first conductive pillar 23 and the insulator 2b may include multiple steps (such as Figure 3A As shown in the figure, there are three first columns 230 stacked on top of each other, and each of the second conductive columns 24 includes a plurality of (such as Figure 3A For example, at the junction of the upper and lower columns, that is, between the plurality of first columns 230 and / or the plurality of second columns 240, at least one connection pad 231, 241 (such as Figure 3A as shown); or Figure 3B In the illustrated inductor structure 2', the widths of the pillars can be different. That is, the widths of the multiple first pillars 230, 230' and / or the widths of the multiple second pillars 240, 240' can be different (e.g., the width of the center first pillar 230' is smaller than the widths of the first pillars 230 above and below it, and / or the width of the center second pillar 240' is smaller than the widths of the second pillars 240 above and below it). This allows the first conductive pillars 23' and the second conductive pillars 24' to have concave-convex circumferential surfaces. Thus, by designing multiple stacked pillars, the surface areas of the first conductive pillars 23, 23' and the second conductive pillars 24, 24' can be increased, effectively increasing the cross-sectional area of ​​the loop and thereby increasing the inductance of the inductor structure 2, 2'.

[0102] In addition, if Figure 3A As shown, a plurality of electrode pads 240" are formed on the two outermost adjacent second conductive sheets 22, so that the plurality of electrode pads 240" are embedded in the insulator 2b and expose the second side 20b of the insulator 2b, and the electrode pads 240" are electrically connected to the two second conductive sheets 22. As required, an insulating protection layer 61 (such as Figure 6B As shown), wherein the insulating protective layer 61 forms a plurality of openings 610 (as shown Figure 6B As shown) to expose the electrode pads 240". Alternatively, in another embodiment, as shown Figure 3B As shown, the second side 20b of the insulator 2b may also be formed with a plurality of openings 201 (eg Figure 4F As shown), to expose at least a portion of the two adjacent second conductive sheets 22 for use as a contact or in conjunction with the electrode pad 240 (as shown) Figure 3B or Figure 4F shown).

[0103] In addition, the first end portion 21a of each first conductive sheet 21 and the third end portion 22a of each second conductive sheet 22 are both arc-shaped, and the end surface of each first conductive column 23, 23' disposed thereon is knuckle-shaped (eg Figure 2 and Figure 2-2As shown), the cross-sectional area of ​​the first conductive pillars 23, 23' is increased, thereby improving the conductive efficiency of the inductive structures 2, 2', reducing impedance and increasing thermal conductivity.

[0104] Alternatively, the first end 21a' of each first conductive sheet 21' and the third end 22a' of each second conductive sheet 22' are both tapered, and the end faces of each first conductive column 23, 23' thereon are triangular (eg Figure 2-1 and Figure 2-3 As shown), it can not only increase the cross-sectional area of ​​the first conductive pillars 23, 23' to improve the efficiency of the inductor structure 2, 2' and reduce the impedance and increase the thermal conductivity, but also effectively reduce the gap t between adjacent first conductive sheets 21', thereby increasing the number of loops of the inductor body 2a' (as shown). Figure 2-1 22 turns as shown) to effectively increase the inductance value.

[0105] The insulator 2b may also be added with a magnetic conductive material such as iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder combined with a resin material, such as Figure 3A-1 and Figure 3B-1 The insulating material 35 of the insulator 3b shown is added with a magnetically conductive material to increase the inductance. Furthermore, because patterned electroplating wiring on this magnetically conductive material is unstable and prone to delamination due to reliability verification, a dielectric material such as ABF, FR5, or PI (as shown in the insulating material 37 ) can be formed on the insulating material 35 to form circuits (such as the first column 230 and the second column 240 ), thereby increasing the number of coil turns.

[0106] Therefore, the inductor bodies 2a, 2a' of the inductor structures 2, 2' of the present invention are non-cylindrical mainly because the profile of the end surface of each of the first conductive pillars 23, 23' corresponds to the profile of the first end portions 21a, 21a' and the third end portions 22a, 22a'. Therefore, compared to the number of 12 turns in the prior art, the number of turns of the toroidal winding of the inductor structures 2, 2' of the present invention can be greatly increased according to demand (e.g., Figure 2 The 16 circles shown and Figure 2-1 22 turns as shown), the number of loops of the inductor structure 2, 2' can be effectively increased, and the cross-sectional area of ​​the loop can be effectively increased by designing the first conductive pillars 23, 23' and the second conductive pillars 24, 24' as a plurality of pillars stacked on each other, thereby effectively improving the inductance.

[0107] Furthermore, because the inductor bodies 2a, 2a' of the inductor structures 2, 2' of the present invention can be formed into various non-cylindrical first conductive pillars 23, 23' and second conductive pillars 24, 24' as needed, the copper area used for electrical conduction in the first conductive pillars 23, 23' and second conductive pillars 24, 24' is significantly increased compared to the prior art, resulting in lower resistance of the first conductive pillars 23, 23' and second conductive pillars 24, 24'. This not only improves electrical conductivity but also enhances thermal conductivity, thereby enhancing the overall performance of the end product.

[0108] Figures 4A to 4F The cross-sectional view of the manufacturing method of the inductor structure 2 of the present invention is shown. By using the manufacturing method, a device having at least two layers (such as Figure 4F The inductor structure 2 includes a plurality of first conductive pillars 23 and a plurality of second conductive pillars 24 stacked in three layers (as shown).

[0109] In this embodiment, the inductor structure 2 is manufactured using an IC substrate manufacturing process for manufacturing a circuit structure, such as a patterned build-up circuit manufacturing process.

[0110] like Figure 4A As shown, a resist layer 90 such as a dry film is formed on a carrier 80 , and then a patterning process is performed to form a plurality of first conductive sheets 21 , 21 ′ on the carrier 80 in the resist layer 90 .

[0111] In this embodiment, the carrier 80 is a substrate, such as a composite substrate of an insulating material and a metal material (such as stainless steel, copper, copper alloy, aluminum alloy or a combination thereof), but there is no special limitation. In this embodiment, a composite substrate having separable copper-containing metal materials 80a on both sides is used for illustration.

[0112] Furthermore, the plurality of first conductive sheets 21, 21' are arranged along a circular path S (eg Figure 2 or Figure 2-1 As shown in FIG, the plurality of first conductive sheets 21, 21' are arranged in a ring structure with intervals therebetween, so that the first ends 21a, 21a' of the plurality of first conductive sheets 21, 21' form the inner ring boundary of the ring structure, and the second ends 21b, 21b' form the outer ring boundary of the ring structure. It should be understood that the first conductive sheets 21, 21' can have many shapes, as long as the shapes are narrowed towards the center of the circular path S, and are not limited to the shapes of Figure 2 or Figure 2-1 Sector plate shape shown.

[0113] like Figure 4BAs shown, another resist layer 91 such as a dry film is formed on the resist layer 90 and the plurality of first conductive sheets 21, 21', and then a patterning process is used to electroplate the first layer of first columns 230 and a plurality of second columns 240 in the other resist layer 91 on the plurality of first conductive sheets 21, 21'.

[0114] In this embodiment, each of the first pillars 230 of the first layer is formed on the first end 21a, 21a' of each of the first conductive sheets 21, 21', and each of the second pillars 240 is formed on the second end 21b, 21b' of each of the first conductive sheets 21, 21'. For example, the profile of the end surface of the first pillar 230 corresponds to the profile of the first end 21a, 21a' of the first conductive sheet 21, 21', while the profile of the end surface of the second pillar 240 corresponds to the profile of the second end 21b, 21b' of the first conductive sheet 21, 21'.

[0115] like Figure 4C As shown, the resist layers 90 , 91 are first removed, and then an insulating material 25 is formed on the carrier 80 , so that the insulating material 25 covers the first conductive sheets 21 , 21 ′, the first pillars 230 and the second pillars 240 , and exposes one end surface of the first pillars 230 and the second pillars 240 .

[0116] like Figure 4D As shown, a resist layer such as a dry film (not shown) is formed on the insulating material 25 as required, and a plurality of connection pads 231, 241 that are connected to the end faces of the first column 230 and the end faces of the second column 240 of the first layer are electroplated in the resist layer through a patterning process, and a portion of the surface of the connection pads 231, 241 is exposed; then, another resist layer such as a dry film (not shown) is formed on the resist layer, and a plurality of first columns 230 and second columns 240 of the second layer that are connected to the connection pads 231, 241 are electroplated in the resist layer through a patterning process.

[0117] After the resist layers are removed, another insulating material 26 is formed on the insulating material 25 so that the another insulating material 26 covers the plurality of connection pads 231, 241, the first pillars 230 and the second pillars 240 of the second layer, and exposes one end surface of the first pillars 230 and the second pillars 240 of the second layer.

[0118] Therefore, the above patterning process can be repeated as needed to produce another layer of multiple connection pads 231, 241 and a third layer of multiple first pillars 230 and multiple second pillars 240, and form an insulating material 27 to cover the connection pads 231, 241 and the third layer of multiple first pillars 230 and multiple second pillars 240.

[0119] After the outermost first pillars 230 and second pillars 240 are completed, the stacked first pillars 230 and connection pads 231 constitute the first conductive pillars 23 , and the stacked second pillars 240 and connection pads 241 constitute the second conductive pillars 24 .

[0120] like Figure 4E As shown, a resist layer such as a dry film (not shown) is formed on the outermost insulating material (the third layer of insulating material 27 in this embodiment), and a patterning process is used to electroplate a plurality of second conductive sheets 22, 22' that are connected to the end surfaces of the first conductive pillars 23 and the end surfaces of the second conductive pillars 24 in the resist layer.

[0121] In this embodiment, each of the second conductive sheets 22, 22' has a third end 22a, 22a' and a fourth end 22b opposite to each other, and each of the second conductive sheets 22, 22' is correspondingly arranged across two adjacent first conductive sheets 21, 21', so that the third end 22a, 22a' of the second conductive sheet 22, 22' is connected to the first conductive post 23 on one of the first conductive sheets 21, 21', and the fourth end 22b of the second conductive sheet 22, 22' is connected to the second conductive post 24 on the other adjacent first conductive sheet 21, 21'. For example, the contour of the third end 22a, 22a' of the second conductive sheet 22, 22' corresponds to the contour of the first end 21a, 21a' of the first conductive sheet 21, 21' (i.e., as shown in FIG. 1 ). Figure 2-2 or Figure 2-3 As shown), the contour of the fourth end portion 22b of the second conductive sheet 22, 22' corresponds to the contour of the second end portion 21b, 21b' of the first conductive sheet 21, 21' (ie, as shown Figure 2-2 or Figure 2-3 shown).

[0122] Next, after removing the resist layer, an insulating layer 28 is formed on the outermost insulating material 27 and the second conductive sheets 22 , 22 ′, so that the insulating layer 28 covers the second conductive sheets 22 , 22 ′.

[0123] like Figure 4F As shown, the carrier 80 is removed to expose the insulating material 25 and the multiple first conductive sheets 21, 21', and then another insulating layer 29 is formed on the insulating material 25 and the multiple first conductive sheets 21, 21' to cover the multiple first conductive sheets 21, 21', and each of the insulating layers 28, 29 and the insulating materials 25, 26, 27 constitute an insulator 2b, so that the insulator 2b is defined with opposite first sides 20a (lower insulating layer 29) and second sides 20b (upper insulating layer 28).

[0124] In this embodiment, the upper insulating layer 28 forms a plurality of openings 201 to expose at least a portion of two adjacent second conductive sheets 22, 22' for bonding the electrode pad 240 (ie, Figure 3A and Figure 3B shown).

[0125] Furthermore, if Figure 4F-1 As shown, another method for manufacturing the first conductive pillar 23' and the second conductive pillar 24' of the present invention can also be a patterned build-up circuit method, and the production of the connection pads 231, 241 is omitted, and a multi-layer (such as three-layer) stacked stepped pillar structure is formed by an electroplating method. For example, the widths of the first pillars 230 are different and / or the widths of the second pillars 240 are different.

[0126] In one embodiment, the first end portion 21a of each first conductive sheet 21 and the third end portion 22a of each second conductive sheet 22 are both arc-shaped, and the end surface of each first conductive column 23, 23' formed thereon by electroplating is knuckle-shaped (e.g., Figure 2 and Figure 2-2 Alternatively, the first end 21a' of each first conductive sheet 21' and the third end 22a' of each second conductive sheet 22' are both tapered, and the end faces of each first conductive column 23, 23' formed thereon by electroplating are triangular (as shown). Figure 2-1 and Figure 2-3 shown).

[0127] Furthermore, each of the insulating layers 28, 29 and the insulating materials 25, 26, 27 is formed by molding, coating, or lamination, and is made of a dielectric material. The dielectric material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding resin (Epoxy Molding Compound, EMC), etc. The dielectric material may also be a photosensitive dielectric material, such as solder mask and polyimide (PI), but is not limited thereto.

[0128] In addition, the insulating materials 25, 26, 27 used to cover the first and second conductive pillars 23, 23', 24, 24' can also be magnetic conductive materials such as iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder combined with resin materials, but are not limited thereto. Therefore, the materials of the insulating layers 28, 29 and the insulating materials 25, 26, 27 can be different according to needs. For example, Figure 3A-1 and Figure 3B-1In the insulator 3b shown, the insulating material 35 (and / or the insulating layers 38, 39) is a magnetic conductive material, or each of the insulating layers 38, 39 can be a solder mask material to serve as an insulating protective layer, and a dielectric material 37 (such as ABF, BT, FR5, PI, etc.) that can be subjected to circuit electroplating processing can be formed between one side of the insulating material 35 and the insulating layer 38.

[0129] Therefore, compared to the prior art that uses mechanical drilling / laser drilling to form the circular holes required for forming the conductive posts, the manufacturing method of the present invention uses a resist layer such as a dry film to define the shape and position of the first conductive posts 23, 23' and the second conductive posts 24, 24'. This allows the distance between each of the first conductive posts 23, 23' and the second conductive posts 24, 24' to be minimized as needed. Furthermore, various non-cylindrical shapes of the first conductive posts 23, 23' and the second conductive posts 24, 24' can be formed as needed to increase the conductive area and reduce the impedance, thereby increasing the thermal conductivity and ensuring the overall performance of the terminal inductor product.

[0130] Furthermore, by increasing the height and expanding the surface of the first conductive pillars 23, 23' and the second conductive pillars 24, 24' of the multi-layer stacked pillars, the cross-sectional area of ​​the loop of the inductor structure 2, 2' can be effectively increased. By effectively increasing the number of loops of the inductor structure 2, 2', the inductance value of the inductor structure 2, 2' can be greatly improved.

[0131] Furthermore, the inductor structures 2, 2' of the present invention can enhance the inductance of the inductor structures 2, 2' and facilitate the fabrication of conductive circuits by utilizing a design in which at least one of the insulating material 35 and the insulating layers 38, 39 is constructed of a magnetically permeable material and alternately stacked with non-magnetic materials. Furthermore, if the insulating layers 38, 39 are constructed of a magnetically permeable material, they can provide shielding. It should be understood that any one or more layers of the insulator 3b can be constructed of a magnetically permeable material, without particular limitation.

[0132] On the other hand, Figure 5A (and Figure 5A-1 )or Figure 5B (and Figure 5B-1 ) shows an electronic package 3, 3', the inductor structure 2, 2' of the present invention can be embedded in a package carrier 31 having a circuit structure 311 and electrically connected to the circuit structure 311. Thereafter, the package carrier 31 is packaged with at least one electronic component 32, and the electronic component 32 can be optionally covered with a packaging material 33.

[0133] In one embodiment, the inductor structure 2 can be formed simultaneously with the circuit structure 311 of the package carrier 31, such as Figure 5A Alternatively, the inductor structure 2' can be manufactured first and then embedded in the package carrier 31 in a component mode, as shown. Figure 5A-1、 Figure 5B or Figure 5B-1 shown.

[0134] In one embodiment, the package carrier 31 may be a coreless type.

[0135] In one embodiment, the upper side of the package carrier 31 can be combined with the electronic component 32 , while the lower side can expose a portion of the circuit structure 311 for combining a plurality of solder balls 34 , so that the electronic package 3 , 3 ′ can be placed on a circuit board (not shown).

[0136] In one embodiment, the electronic component 32 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. For example, the electronic component 32 is a semiconductor chip that is flip-chip mounted on the package carrier 31 via a plurality of conductive bumps, such as solder, and electrically connected to the circuit structure 311; alternatively, the electronic component 32 can be electrically connected to the circuit structure 311 via a plurality of bonding wires (not shown). It should be understood that there are many ways to electrically connect the electronic component 32 to the circuit structure 311, and they are not limited to the above.

[0137] Figure 6A and Figure 6A-1 FIG. 4 is a cross-sectional diagram of another embodiment of the inductor structure 6 of the present invention.

[0138] like Figure 6A and Figure 6A-1 As shown, based on Figure 3A In the inductor structure 2 shown, the inductor structure 6 is formed by pattern-plating at least one magnetic conductive metal 60 in the insulator 2 b.

[0139] In this embodiment, the magnetic conductive metal 60 is in a ring shape and is arranged around the first conductive post 23 on the first end portion 21a and the second conductive post 24 on the third end portion 23a, so that the first conductive post 23 on the first end portion 21a and the second conductive post 24 on the third end portion 23a are located within the ring of the magnetic conductive metal 60. For example, the magnetic conductive metal 60 is arranged corresponding to the connection pads 231 and 241, so that the magnetic conductive metal 60 and the connection pads 231 and 241 are located on the same layer, as shown in FIG. Figure 6A The eight circles of magnetic conductive metal 60 shown or Figure 6A-1 The two circles of magnetic conductive metal 60 are shown. In other embodiments, the magnetic conductive metal 60 and the connection pads 231 and 241 may also be located in different layers.

[0140] Furthermore, the magnetic conductive metal 60 includes nickel (Ni), zinc (Zn), manganese (Mn), iron (Fe), cobalt (Co), or an alloy composed of other appropriate materials to facilitate the function of the inductor structure 6 .

[0141] In addition, in other embodiments, Figure 3B The inductor structure 2' shown in FIG. 1 is further provided with the magnetic conductive metal 60. Figure 6B and Figure 6B-1 For example, the magnetic conductive metal 60 is arranged corresponding to the first column 230' and the second column 240' with a smaller width, so that the magnetic conductive metal 60 and the first column 230' and the second column 240' with a smaller width are located in the same layer. Figure 6B The four circles of magnetic conductive metal 60 shown or Figure 6B-1 A circle of magnetic conductive metal 60 is shown.

[0142] In addition, the preferred unit shape of the magnetic permeable metal 60 is miniaturized multi-point, multi-strip, multi-loop, etc. Since the magnetic properties of the magnetic permeable metal 60 after patterning are better, the Q value performance of the inductor element can be improved.

[0143] It should be understood that there are many types of magnetic conductive metals and they are not limited to the aforementioned ring shape. Therefore, magnetic conductive metals of various embodiments can be arranged according to needs without any particular limitation.

[0144] Therefore, the inductor structures 6, 6' of the present invention can increase their inductance by adding the permeable metal 60. Preferably, the permeable metal 60 is electroplated using two or three elements to achieve various shapes and distributions with excellent dimensional accuracy, thereby achieving more precise inductor quality and accuracy.

[0145] In summary, the inductor structure and its manufacturing method of the present invention significantly increase the number of loops of the toroidal winding of the inductor structure because the contour of the first conductive pillar matches the contour of the first end of the first conductive sheet. Furthermore, by increasing the height and expanding the surface of the first and second conductive pillars in the multi-layer stack, the cross-sectional area of ​​the loops of the inductor structure can be significantly increased, thereby effectively improving the inductance of the inductor structure.

[0146] Furthermore, because the present invention can form various non-cylindrical first and second conductive pillars as required, the copper area used for electrical conduction in the first and second conductive pillars is significantly increased, resulting in lower resistance of the first and second conductive pillars. This not only improves electrical conductivity but also enhances thermal conductivity, thereby ensuring the overall performance of the terminal inductor product.

[0147] The present invention enables the inductor structure to obtain better inductance value and performance by electroplating the magnetic conductive metal.

[0148] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the appended claims.

Claims

1. An inductor structure, characterized in that: include: An insulator having a first side and a second side opposite to each other, wherein the insulator comprises multiple layers of insulating material, at least one layer of the insulating material being a magnetically permeable material; a plurality of first conductive plates in the shape of fan-shaped plates embedded in the insulator from a first side of the insulator, each of the first conductive plates having a first end and a second end opposite to each other, wherein the width of the first end is smaller than the width of the second end, wherein the plurality of first conductive plates are arranged in a ring structure, such that the first ends of the plurality of first conductive plates form an inner ring boundary of the ring structure, and the second ends of the plurality of first conductive plates form an outer ring boundary of the ring structure opposite to the inner ring boundary; a plurality of first conductive posts embedded in the insulator and electrically connected to the first ends of the first conductive sheets, wherein the profile of an end surface of each first conductive post corresponds to the profile of the first end, and each first conductive post comprises a plurality of first posts stacked on each other, so that when the first ends of the plurality of first conductive sheets are arc-shaped, the end surface of each first conductive post disposed thereon is knuckle-shaped, or when the first ends of the plurality of first conductive sheets are tapered, the end surface of each first conductive post disposed thereon is triangular; a plurality of second conductive pillars embedded in the insulator and electrically connected to the second end of each of the first conductive sheets, wherein the contour of the end surface of each of the second conductive pillars corresponds to the contour of the second end, and each of the second conductive pillars comprises a plurality of second pillars stacked on top of each other; a plurality of second conductive sheets in a curved plate shape and embedded in the insulator from the second side of the insulator, each of the second conductive sheets having a third end and a fourth end opposite to each other and correspondingly spanning two adjacent first conductive sheets, wherein the third end of the second conductive sheet has a contour corresponding to the first end of the first conductive sheet, and the third end is electrically connected to the first conductive post on the first end of one of the two adjacent first conductive sheets, and the fourth end of the second conductive sheet has a contour corresponding to the second end of the first conductive sheet, and the fourth end is electrically connected to the second conductive post on the second end of the other of the two adjacent first conductive sheets; and The first side of the insulator exposes at least a portion of two adjacent first conductive sheets, or the second side of the insulator exposes at least a portion of two adjacent second conductive sheets for combining with electrode pads.

2. The inductor structure according to claim 1, wherein: A connection pad is provided between the plurality of first columns stacked on each other, and / or a connection pad is provided between the plurality of second columns stacked on each other.

3. The inductor structure according to claim 1, wherein: The plurality of first columns stacked on each other have different widths, and / or the plurality of second columns stacked on each other have different widths.

4. The inductor structure according to claim 1, wherein: The inductor structure further includes at least one magnetic conductive metal formed in the insulator by electroplating, and the magnetic conductive metal includes one of nickel, zinc, manganese, iron, cobalt or a combination thereof.

5. The inductor structure according to claim 4, wherein: The magnetic conductive metal is wound around the first conductive column on the first end and the second conductive column on the third end, so that the first conductive column on the first end and the second conductive column on the third end are located in the ring of the magnetic conductive metal.

6. The inductor structure according to claim 4, wherein: The magnetic conductive metal is distributed in at least one layer, at least one micronized point, at least one micronized block or at least one micronized strip.

7. An electronic package, characterized in that: include: A package carrier having a circuit structure; The inductor structure according to any one of claims 1 to 6, formed in the package carrier and electrically connected to the circuit structure; as well as At least one electronic component is mounted on one side of the package carrier and is electrically connected to the circuit structure and the inductor structure.

8. The electronic package according to claim 7, wherein: The electronic package also includes a packaging material for covering the electronic component.

9. A method for manufacturing an inductor structure using a coreless manufacturing technology for an integrated circuit (IC) substrate, characterized in that: The method includes: A plurality of first conductive plates are formed on a carrier by a patterning process, wherein each first conductive plate has a first end and a second end opposite to each other, and the width of the first end is smaller than the width of the second end, so that each first conductive plate has a fan-shaped plate shape. The plurality of first conductive plates are arranged in a ring structure, wherein the first ends of the plurality of first conductive plates constitute an inner ring boundary of the ring structure, and the second ends of the plurality of first conductive plates constitute an outer ring boundary of the ring structure opposite to the inner ring boundary; forming a first conductive pillar on the first end of each of the first conductive sheets by the patterning process, and forming a second conductive pillar on the second end of each of the first conductive sheets by the patterning process, wherein a profile of an end surface of the first conductive pillar corresponds to a profile of the first end of the first conductive sheet, and a profile of an end surface of the second conductive pillar corresponds to a profile of the second end of the first conductive sheet, and each of the first conductive pillars comprises a plurality of first pillars stacked on each other, and each of the second conductive pillars comprises a plurality of second pillars stacked on each other, so that when the first ends of the plurality of first conductive sheets are arc-shaped, the end surface of each of the first conductive pillars disposed thereon is knuckle-shaped, or when the first ends of the plurality of first conductive sheets are tapered, the end surface of each of the first conductive pillars disposed thereon is triangular; An insulating material is formed on the carrier to cover the plurality of first conductive sheets, the first conductive posts, and the second conductive posts, and to expose a portion of the first conductive posts and a portion of the second conductive posts. The insulating material includes a magnetic conductive material, and a dielectric material for circuit electroplating is formed on each of the magnetic conductive materials. A plurality of second conductive sheets are formed on the dielectric material on the insulating material by a patterning process, each of the second conductive sheets having a third end and a fourth end opposite to each other, and correspondingly spanning two adjacent first conductive sheets, wherein the contour of the third end of the second conductive sheet corresponds to the contour of the first end of the first conductive sheet, and the third end is electrically connected to the first conductive post on the first end of one of the two adjacent first conductive sheets, and the contour of the fourth end of the second conductive sheet corresponds to the contour of the second end of the first conductive sheet, and the fourth end is electrically connected to the second conductive post on the second end of the other of the two adjacent first conductive sheets; forming an insulating layer on the insulating material and the plurality of second conductive sheets to cover the plurality of second conductive sheets; removing the carrier to expose the insulating material and the plurality of first conductive sheets; and forming another insulating layer on the insulating material and the plurality of first conductive sheets to cover the plurality of first conductive sheets, and each insulating layer and the insulating material constitute an insulator, so that the insulator is defined with a first side and a second side opposite to each other, The first side of the insulator exposes at least a portion of two adjacent first conductive sheets, or the second side of the insulator exposes at least a portion of two adjacent second conductive sheets for combining with electrode pads.

10. The method for manufacturing an inductor structure according to claim 9, wherein: A connection pad is provided between the plurality of first columns stacked on each other, and / or a connection pad is provided between the plurality of second columns stacked on each other.

11. The method for manufacturing an inductor structure according to claim 9, wherein: The plurality of first columns stacked on each other have different widths, and / or the plurality of second columns stacked on each other have different widths.

12. The method for manufacturing an inductor structure according to claim 9, wherein: The manufacturing method further comprises pattern-plating at least one magnetic conductive metal in the insulator.

13. The method for manufacturing an inductor structure according to claim 9, wherein: The conductive column and the insulating material are manufactured by adopting a core-less layer technology of a carrier plate and a layer-by-layer build-up method or a one-time layer-build-up method.

14. A method for manufacturing a packaging carrier, characterized in that: The manufacturing method includes simultaneously manufacturing a circuit structure and at least one inductor structure according to any one of claims 1 to 6 and an inductor structure manufactured according to the manufacturing method of the inductor structure according to any one of claims 9 to 13.

15. A method for manufacturing an electronic package, characterized in that: include: Providing a package carrier having a circuit structure, wherein the inductor structure according to any one of claims 1 to 6 is formed on the package carrier; as well as At least one electronic component is placed on one side of the package carrier, and the electronic component is electrically connected to the circuit structure and the inductor structure.

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