OLED display device

Abstract

The present application provides an OLED display device, which provides a partition groove for at least one of a driving circuit layer and a light-emitting functional layer in a region between a retaining wall and a display region. When the buffer glue layer is subjected to excessive pressure or the volume of the glue is too large, the glue can be filled in the partition groove to avoid glue flushing problems. When the buffer glue layer is unevenly coated, the glue diffuses into the partition groove to form a uniform film surface of the buffer glue layer, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an OLED display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) display devices are widely used due to their advantages such as self-luminescence, wide color gamut, low power consumption, and flexible display. In order to improve the mechanical strength of the rigid substrate and the packaging effect, existing OLED display devices will apply a buffer glue layer to the packaging layer. However, during the coating process of the buffer glue layer, the film thickness of the glue will be uneven, resulting in the Newton ring phenomenon during display, or the glue will be washed out due to the large volume of glue or excessive pressure, affecting the display.

[0003] Therefore, in the coating process of the conventional buffer adhesive layer, there are technical problems of uneven adhesive thickness and / or adhesive flushing problems, which may lead to poor display. Summary of the invention

[0004] The embodiment of the present application provides an OLED display device, which is used to alleviate the technical problem of poor display caused by uneven glue thickness and / or glue flushing problems in the coating process of the existing buffer glue layer.

[0005] An embodiment of the present application provides an OLED display device, the OLED display device comprising:

[0006] substrate;

[0007] A driving circuit layer is arranged on one side of the substrate;

[0008] A light-emitting functional layer is arranged on a side of the driving circuit layer away from the substrate;

[0009] An encapsulation layer is arranged on a side of the light-emitting functional layer away from the driving circuit layer;

[0010] A buffer adhesive layer is arranged on a side of the encapsulation layer away from the light-emitting functional layer;

[0011] A cover plate, arranged on a side of the buffer rubber layer away from the encapsulation layer;

[0012] The OLED display device includes a display area and a non-display area. In the non-display area, a retaining wall is provided between the cover plate and the driving circuit layer. In the area between the retaining wall and the display area, at least one of the driving circuit layer and the light-emitting functional layer is formed with a partition groove, and the buffer rubber layer is filled into the partition groove.

[0013] In some embodiments, the partition groove includes a first partition groove and a second partition groove, and the first partition groove and the second partition groove are arranged on both sides of the encapsulation layer.

[0014] In some embodiments, the retaining wall is disposed around the display area, and in a region between the retaining wall and the display area, the partition groove is disposed around the packaging layer.

[0015] In some embodiments, the partition groove includes a first portion and a second portion, the first portion is separated from the second portion, and the first portion and the second portion have the same depth.

[0016] In some embodiments, the light-emitting functional layer includes:

[0017] A pixel electrode layer is arranged on a side of the driving circuit layer away from the substrate;

[0018] A pixel definition layer, arranged on a side of the pixel electrode layer away from the driving circuit layer;

[0019] A luminescent material layer is disposed in a pixel region defined by the pixel definition layer;

[0020] A common electrode layer, disposed on a side of the light-emitting material layer away from the pixel electrode layer;

[0021] Wherein, in the area between the retaining wall and the display area, the pixel definition layer is provided with a third partition groove.

[0022] In some embodiments, the thickness of the pixel definition layer in the region between the retaining wall and the display region is greater than the thickness of the pixel definition layer in the display region, and the third partition groove penetrates through the pixel definition layer.

[0023] In some embodiments, the driving circuit layer includes:

[0024] Buffer layer;

[0025] An interlayer insulating layer, disposed on a side of the buffer layer away from the substrate;

[0026] A passivation layer, disposed on a side of the interlayer insulating layer away from the buffer layer;

[0027] A planarization layer, disposed on a side of the passivation layer away from the interlayer insulating layer;

[0028] At least one of the interlayer insulating layer, the passivation layer and the planarization layer is provided with a partition groove, and a projection of the third partition groove located in the pixel definition layer on the substrate overlaps with a projection of the partition groove located in the driving circuit layer on the substrate.

[0029] In some embodiments, the planarization layer is provided with a fourth partition groove, there is a distance between the fourth partition groove and the pixel electrode layer, and a projection of the fourth partition groove on the substrate overlaps with a projection of the third partition groove on the substrate.

[0030] In some embodiments, the driving circuit layer also includes a source-drain layer, and the source-drain layer is arranged between the passivation layer and the interlayer insulating layer. The passivation layer is provided with a fifth partition groove, and there is a distance between the fifth partition groove and the source-drain layer, and the projection of the fifth partition groove on the substrate overlaps with the projection of the fourth partition groove on the substrate.

[0031] In some embodiments, the interlayer insulating layer is provided with a sixth partitioning trench, and a projection of the sixth partitioning trench on the substrate overlaps with a projection of the fifth partitioning trench on the substrate.

[0032] Beneficial effects: The present application provides an OLED display device, which includes a substrate, a driving circuit layer, a light-emitting functional layer, an encapsulation layer, a buffer adhesive layer and a cover plate, wherein the driving circuit layer is arranged on one side of the substrate, the light-emitting functional layer is arranged on a side of the driving circuit layer away from the substrate, the encapsulation layer is arranged on a side of the light-emitting functional layer away from the driving circuit layer, the buffer adhesive layer is arranged on a side of the encapsulation layer away from the light-emitting functional layer, and the cover plate is arranged on a side of the buffer adhesive layer away from the encapsulation layer, wherein the OLED display device includes a display area and a non-display area, in the non-display area, a retaining wall is arranged between the cover plate and the driving circuit layer, in the area between the retaining wall and the display area, at least one of the driving circuit layer and the light-emitting functional layer is formed with a partition groove, and the buffer adhesive layer is filled into the partition groove. The present application provides a partition groove in the area between the retaining wall and the display area so that at least one of the driving circuit layer and the light-emitting functional layer is provided with a partition groove. When the buffer glue layer is under too much pressure or the volume of the glue is too large, the glue can be filled in the partition groove to avoid the problem of glue flushing. When the buffer glue layer is unevenly coated, the glue diffuses into the partition groove to form a uniform film surface of the buffer glue layer, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0034] Figure 1 It is a schematic diagram of the structure of an existing OLED display device.

[0035] Figure 2 This is a first schematic diagram of an OLED display device provided in an embodiment of the present application.

[0036] Figure 3 This is a second schematic diagram of the OLED display device provided in an embodiment of the present application.

[0037] Figure 4 This is a third schematic diagram of the OLED display device provided in an embodiment of the present application.

[0038] Figure 5 This is a fourth schematic diagram of the OLED display device provided in an embodiment of the present application.

[0039] Figure 6 A first schematic diagram of an OLED display device corresponding to the process of the method for preparing an OLED display device provided in an embodiment of the present application.

[0040] Figure 7 A second schematic diagram of an OLED display device corresponding to the process of the method for preparing an OLED display device provided in an embodiment of the present application.

[0041] Figure 8 A third schematic diagram of an OLED display device corresponding to the process of the method for preparing an OLED display device provided in an embodiment of the present application.

[0042] Fig. 9 A fourth schematic diagram of an OLED display device corresponding to the process of the method for preparing an OLED display device provided in an embodiment of the present application.

[0043] Fig.10 A fifth schematic diagram of an OLED display device corresponding to the process of the method for preparing an OLED display device provided in an embodiment of the present application.

[0044] Fig.11 A sixth schematic diagram of an OLED display device corresponding to the process of the method for preparing an OLED display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0046] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0047] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0050] like Figure 1 As shown, the display device 1 includes a substrate 11 and a cover plate 14 arranged opposite to each other, and a support column 12 is provided between the substrate 11 and the cover plate 14. In order to improve the mechanical strength and packaging effect of the display device 1, glue 13 is coated on the packaging layer. During the coating process of the glue, due to the limitation of the process, problems are likely to occur during the coating of the glue, such as Figure 1 As shown in (a), when the thickness of the glue is uneven, specifically, the thickness of the glue 13 in the middle area is less than the thickness of the glue 13 in the edge area, the thickness of the display device is inconsistent, resulting in a Newton ring phenomenon during display, such as Figure 1 As shown in (b), when the thickness of the glue 13 in the middle area is greater than the thickness of the glue in the edge area, the Newton ring phenomenon may occur during display due to the inconsistent thickness of the display device; and when the volume of the glue 13 is too large or the pressure is too large, such as Figure 1 As shown in (c), the glue flushing phenomenon will occur in the area 15, affecting the display effect. Therefore, in the coating process of the existing buffer glue layer, there are technical problems of uneven glue thickness and / or glue flushing problems that lead to poor display.

[0051] In view of the above technical problems, the embodiments of the present application provide an OLED display device and a method for manufacturing the same to alleviate the above technical problems.

[0052] like Figure 2 As shown, an embodiment of the present application provides an OLED display device, and the OLED display device 2 includes:

[0053] Substrate 21;

[0054] A driving circuit layer 22 is disposed on one side of the substrate 21;

[0055] A light-emitting functional layer 23 is disposed on a side of the driving circuit layer 22 away from the substrate 21;

[0056] The encapsulation layer 24 is disposed on a side of the light-emitting functional layer 23 away from the driving circuit layer 22;

[0057] A buffer adhesive layer 25 is disposed on a side of the encapsulation layer 24 away from the light-emitting functional layer 23;

[0058] A cover plate 26 is disposed on a side of the buffer rubber layer 25 away from the encapsulation layer 24;

[0059] The OLED display device 2 includes a display area 291 and a non-display area 292. In the non-display area 292, a retaining wall 27 is provided between the cover plate 26 and the drive circuit layer 22. In the area between the retaining wall 27 and the display area 291, at least one of the drive circuit layer 22 and the light-emitting functional layer 23 is formed with a partition groove 28 ( Figure 2 2 shows that the driving circuit layer 22 is formed with a partition groove 28 , and the buffer glue layer 25 is filled into the partition groove 28 .

[0060] An embodiment of the present application provides an OLED display device, which provides a partition groove in at least one of the driving circuit layer and the light-emitting function layer in the area between the retaining wall and the display area. When the buffer glue layer is under too much pressure or the volume of the glue is too large, the glue can be filled in the partition groove to avoid the problem of glue flushing. When the buffer glue layer is unevenly coated, the glue diffuses into the partition groove to form a uniform film surface of the buffer glue layer, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer.

[0061] Specifically, Figure 3 As shown, during the glue coating process, when the glue coating is uneven and the thickness is uneven, due to the existence of the partition groove 28, the glue can diffuse to the partition groove 28 as shown by the broken line 31, so that the film-forming buffer glue layer 25 has a uniform and flat film surface; when the volume of the glue is too large or the pressure is too large, similarly, the glue can diffuse to the partition groove 28 as shown by the broken line 31, so that the film-forming buffer glue layer 25 has a uniform and flat film surface, thereby avoiding poor display caused by uneven glue thickness and / or glue punching problems during the coating process of the buffer glue layer.

[0062] In order to solve the problem that the buffering effect of the glue on the side of the packaging layer is poor, a partition groove is provided. Figure 2 As shown, the partition groove 28 includes a first partition groove 281 and a second partition groove 282, and the first partition groove 281 and the second partition groove 282 are arranged on both sides of the encapsulation layer 24. By arranging the first partition groove and the second partition groove on both sides of the encapsulation layer, when uneven thickness or excessive pressure and excessive volume of glue occur during the coating process of glue, the glue can diffuse to both sides, thereby avoiding poor display caused by uneven thickness of glue or excessive pressure and excessive volume of glue.

[0063] When the partition grooves are arranged on both sides of the encapsulation layer, there is still the problem of poor glue diffusion effect. In one embodiment, the retaining wall is arranged around the display area, and the partition groove is arranged around the encapsulation layer in the area between the retaining wall and the display area. By arranging the partition groove around the encapsulation layer, during the glue coating process, when the glue thickness is uneven, the glue is subjected to excessive pressure, or the volume of the glue is too large, the glue can diffuse to the surroundings, so that the glue remains flat, and the membrane surface of the buffer glue layer is flat and uniform, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer.

[0064] In one embodiment, the partition groove includes a first part and a second part, the first part and the second part are separately arranged, and the first part and the second part have the same depth. By making the partition groove include the first part and the second part, the glue can be diffused to the first part and the second part, thereby improving the partition groove's capacity for accommodating glue, and improving the adaptability to the problem of uneven glue thickness and / or glue flushing, so that the glue can be diffused to the first part and the second part, thereby avoiding the problem of uneven glue thickness and / or glue flushing during the coating process of the buffer glue layer, which may cause poor display.

[0065] Specifically, Figure 2 As shown, the first partition groove 281 includes a first part 281a and a second part 281b. By making the first partition groove include the first part and the second part, during the glue coating process, when the glue thickness is uneven, the glue is subjected to excessive pressure, or the volume of the glue is too large, the glue can diffuse to the first part and the second part. Even if the glue completely fills the first part, the glue can still fill the second part, thereby avoiding poor display caused by uneven glue thickness, excessive glue pressure, and excessive glue volume.

[0066] Specifically, Figure 2 As shown, the second partition groove 282 also includes a first portion and a second portion.

[0067] Specifically, when the first part and the second part are set, the depths of the first part and the second part can be made consistent, so that a larger buffer space can be provided for the glue, so that when the thickness of the glue is relatively uneven, or when the pressure is too large and the volume is too large, the first part and the second part of the partition groove can still receive the diffused glue, so that the film-forming buffer glue layer is a flat and uniform film surface. However, the embodiments of the present application are not limited thereto, for example, when the depth of the first part is too large and it will come into contact with the metal, the depths of the first part and the second part can be made different.

[0068] Specifically, Figure 2As shown, the light-emitting functional layer 23 includes a red sub-pixel 231 , a green sub-pixel 232 and a blue sub-pixel 233 . The following embodiments are described with reference to the specific structure of the OLED display device.

[0069] In one embodiment, if Figure 4 As shown, the light-emitting functional layer 23 includes:

[0070] The pixel electrode layer 231 is disposed on a side of the driving circuit layer 22 away from the substrate 21;

[0071] A pixel definition layer 232 is disposed on a side of the pixel electrode layer 231 away from the driving circuit layer 22;

[0072] The light emitting material layer 233 is disposed in the pixel area defined by the pixel definition layer 232;

[0073] The common electrode layer 234 is disposed on a side of the light emitting material layer 233 away from the pixel electrode layer 231;

[0074] The pixel definition layer 232 is provided with a third partition groove 283 in the area between the retaining wall 27 and the display area 291. By providing the third partition groove in the pixel definition layer, when glue is applied on the encapsulation layer, if the glue thickness is uneven, the pressure is too large, or the volume is too large, the glue can diffuse into the third partition groove on the pixel definition layer, so that the film surface of the buffer glue layer is flat and uniform, and poor display caused by uneven glue thickness and / or glue flushing problems during the application of the buffer glue layer is avoided.

[0075] In one embodiment, if Figure 4 As shown, the thickness of the pixel definition layer 232 in the area between the retaining wall 27 and the display area 291 is greater than the thickness of the pixel definition layer 232 in the display area 291, and the third partition groove 283 penetrates the pixel definition layer 232. By making the thickness of the pixel definition layer between the retaining wall and the display area greater than the thickness of the pixel definition layer in the display area, the pixel definition layer in the non-display area can be used for support, thereby preventing the OLED display device from being damaged when the luminescent material is under pressure, and there is a certain distance between the pixel definition layer between the retaining wall and the display area and the pixel electrode layer and the common electrode layer, and the formation of the partition groove on the pixel definition layer will not affect the packaging effect of the OLED display device, and the height of the pixel definition layer is large, so that the third partition groove penetrates the pixel definition layer, and the depth of the third partition groove is large, thereby improving the capacity of the partition groove to accommodate glue, and can improve the adaptability of the OLED display device to the uneven thickness of glue and / glue flushing problems, so that the glue can diffuse to the third partition groove, thereby avoiding the display defects caused by the uneven thickness of glue and / glue flushing problems in the coating process of the buffer glue layer.

[0076] Specifically, Figure 4 As shown, it can be seen that the third partition groove includes a first part and a second part. When the third partition groove is formed on the pixel definition layer, the third partition groove can include the first part and the second part, thereby increasing the volume of the third partition groove and allowing the glue to diffuse into the third partition groove, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer.

[0077] In order to solve the problem that the partition groove formed in the pixel definition layer has insufficient capacity to accommodate glue, in one embodiment, Figure 5 As shown, the driving circuit layer 22 includes:

[0078] Buffer layer 222;

[0079] An interlayer insulating layer 226 is disposed on a side of the buffer layer 222 away from the substrate 21;

[0080] A passivation layer 228 is disposed on a side of the interlayer insulating layer 226 away from the buffer layer 222;

[0081] A planarization layer 229 is disposed on a side of the passivation layer 228 away from the interlayer insulating layer 226;

[0082] Among them, at least one of the interlayer insulating layer 226, the passivation layer 228 and the planarization layer 229 is provided with a partition groove, and the projection of the third partition groove 283 located in the pixel definition layer 232 on the substrate overlaps with the projection of the partition groove located in the drive circuit layer 22 on the substrate 21. By providing a partition groove in at least one of the interlayer insulating layer, the passivation layer and the planarization layer, the partition groove can extend from the pixel definition layer to the drive circuit layer, and the depth of the partition groove is large, which can accommodate the diffused glue, so that the film surface of the buffer glue layer is flat and uniform, and the display defects caused by the uneven glue thickness and / or glue flushing problems in the coating process of the buffer glue layer are avoided.

[0083] In one embodiment, if Figure 5 As shown, the planarization layer 229 is provided with a fourth partition groove 284, and there is a gap between the fourth partition groove 284 and the pixel electrode layer 231, and the projection of the fourth partition groove 284 on the substrate 21 overlaps with the projection of the third partition groove 283 on the substrate 21. By providing the fourth partition groove on the planarization layer, the projections of the fourth partition groove and the third partition groove on the substrate overlap, so that when the glue diffuses, it can diffuse to the third partition groove and the fourth partition groove, so that the partition groove can accommodate the diffused glue, and the film surface of the buffer glue layer is flat and uniform. And there is a gap between the fourth partition groove and the pixel electrode layer, so the pixel electrode layer and the fourth partition groove can be separated by the planarization layer to prevent water and oxygen from invading the pixel electrode layer and damaging the pixel electrode layer.

[0084] In one embodiment, if Figure 5 As shown, the driving circuit layer 22 also includes a source-drain electrode layer 227, and the source-drain electrode layer 227 is arranged between the passivation layer 228 and the interlayer insulating layer 226. The passivation layer 228 is provided with a fifth partition groove 285, and there is a spacing between the fifth partition groove 285 and the source-drain electrode layer 227, and the projection of the fifth partition groove 285 on the substrate 21 overlaps with the projection of the fourth partition groove 284 on the substrate 21. By arranging the fifth partition groove on the passivation layer, the projections of the fifth partition groove and the fourth partition groove on the substrate overlap, so that when the glue diffuses, it can diffuse to the third partition groove, the fourth partition groove and the fifth partition groove, so that the partition groove can accommodate the diffused glue, and the film surface of the buffer glue layer is flat and uniform. And there is a spacing between the fifth partition groove and the source-drain electrode layer, so the source-drain electrode layer and the fifth partition groove can be isolated by the passivation layer to prevent water and oxygen from invading the source-drain electrode layer and damaging the source-drain electrode layer.

[0085] In one embodiment, if Figure 5 As shown, the interlayer insulating layer 226 is provided with a sixth partition groove 286, and the projection of the sixth partition groove 286 on the substrate 21 overlaps with the projection of the fifth partition groove 285 on the substrate 21. By providing the sixth partition groove in the interlayer insulating layer, the projections of the sixth partition groove and the fifth partition groove on the substrate overlap, so that when the glue diffuses, it can diffuse to the third partition groove, the fourth partition groove, the fifth partition groove and the sixth partition groove, so that the partition groove can accommodate the diffused glue, and the film surface of the buffer glue layer is flat and uniform, avoiding the uneven glue thickness and / or glue flushing problems in the coating process of the buffer glue layer. Poor display caused by.

[0086] Specifically, when the sixth isolating groove is provided in the interlayer insulating layer, the sixth isolating groove may also be isolated from the metal, for example Figure 5 In the embodiment, the driving circuit layer 22 also includes a light shielding layer 221, an active layer 223, a gate insulating layer 224, and a gate layer 225. The drain is connected to the light shielding layer 221, so that there is a distance between the sixth partition groove 286 and the gate layer 225 and the source-drain electrode layer 227 to prevent water and oxygen from invading the source-drain electrode layer and the gate layer and damaging the source-drain electrode layer and the gate layer.

[0087] It should be noted that in Figure 4 , Figure 5 In the figure, only the partition groove arrangement on one side of the display area is shown. The partition groove arrangements on the other three sides of the display area can be as follows: Figure 4 , Figure 5 The design method will not be described in detail here, and other design methods can also be adopted, such as not setting the partition groove on the other side.

[0088] The above embodiment is described in detail by taking the planarization layer, the passivation layer and the interlayer insulating layer in the driving circuit layer as an example. For the buffer layer, since water and oxygen may invade from the bottom of the OLED display device, no partition groove is formed on the buffer layer to improve the water and oxygen barrier capability of the OLED display device. However, the embodiments of the present application are not limited thereto. For example, if the water and oxygen barrier capability of the OLED display device is good, or if the water and oxygen barrier capability of the OLED display device is less affected when the partition groove is formed on the buffer layer, the partition groove may also be formed on the buffer layer.

[0089] At the same time, an embodiment of the present application provides a method for preparing an OLED display device, wherein the method for preparing an OLED display device is used to prepare the OLED display device described in any of the above embodiments, and the method for preparing an OLED display device comprises:

[0090] A light shielding layer is formed on a substrate by using physical vapor deposition, photohydrogen ionization and etching processes; the structure of the OLED display device is as follows Figure 6 As shown in (a);

[0091] A buffer layer is formed by chemical deposition on the light shielding layer; the structure of the OLED display device is as follows Figure 6 As shown in (b);

[0092] The oxide active layer is formed on the buffer layer by physical vapor deposition, photohydrogen ionization and etching processes; the structure of the OLED display device is as follows Figure 6 As shown in (c);

[0093] A gate insulating layer and a gate layer are deposited on the active layer by physical vapor deposition, exposure, development and etching processes; the structure of the OLED display device is as follows Figure 6 As shown in (d);

[0094] An interlayer insulating layer is formed on the gate layer by chemical deposition; the structure of the OLED display device is as follows Figure 7 As shown in (a);

[0095] The interlayer insulating layer is opened by photoresist coating, exposure, development, etching, and film stripping processes, and the source and drain layers are formed by physical vapor deposition, photohydrogen ionization, and etching processes; the structure of the OLED display device is as follows: Figure 7 As shown in (b);

[0096] A passivation layer is formed on the source and drain electrode layers by chemical deposition; the structure of the OLED display device is as follows Figure 7 As shown in (c);

[0097] The pixel electrode layer is formed on the passivation layer by using exposure, development, and dry etching processes; the structure of the OLED display device is as follows Figure 8 As shown in (a);

[0098] A pixel definition layer is deposited on the pixel electrode layer by using photoresist coating, exposure, development, and etching processes, and a partition groove is formed in the area between the retaining wall and the display area; the structure of the OLED display device is as follows Figure 8 As shown in (b);

[0099] The light-emitting material layer is formed by inkjet printing or evaporation on the pixel definition layer; the structure of the OLED display device is as follows Fig. 9 As shown;

[0100] A common electrode layer is formed on the light-emitting material layer by physical vapor deposition; the structure of the OLED display device is as follows Fig.10 As shown;

[0101] The encapsulation layer is formed on the common electrode layer by plasma chemical vapor deposition; the structure of the OLED display device is as follows Fig.11 As shown;

[0102] A buffer adhesive layer is prepared on the encapsulation layer by adhesive coating, vacuum attachment, and ultraviolet light irradiation processes; the structure of the OLED display device is as follows Figure 4 As shown;

[0103] A retaining wall is formed on the buffer adhesive layer and matched with the cover plate; the structure of the OLED display device is as follows Fig. 9 shown.

[0104] An embodiment of the present application provides a method for preparing an OLED display device. The OLED display device prepared by the method for preparing an OLED display device provides a partition groove in the area between the retaining wall and the display area for at least one of the driving circuit layer and the light-emitting function layer. When the buffer glue layer is under too much pressure or the volume of the glue is too large, the glue can be filled in the partition groove to avoid the problem of glue flushing. When the buffer glue layer is unevenly coated, the glue diffuses into the partition groove to form a uniform film surface of the buffer glue layer, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer.

[0105] According to the above embodiments, it can be seen that:

[0106] An embodiment of the present application provides an OLED display device and a preparation method thereof, wherein the OLED display device includes a substrate, a driving circuit layer, a light-emitting functional layer, an encapsulation layer, a buffer adhesive layer and a cover plate, wherein the driving circuit layer is arranged on one side of the substrate, the light-emitting functional layer is arranged on a side of the driving circuit layer away from the substrate, the encapsulation layer is arranged on a side of the light-emitting functional layer away from the driving circuit layer, the buffer adhesive layer is arranged on a side of the encapsulation layer away from the light-emitting functional layer, and the cover plate is arranged on a side of the buffer adhesive layer away from the encapsulation layer, wherein the OLED display device includes a display area and a non-display area, in the non-display area, a retaining wall is arranged between the cover plate and the driving circuit layer, in the area between the retaining wall and the display area, at least one of the driving circuit layer and the light-emitting functional layer is formed with a partition groove, and the buffer adhesive layer is filled into the partition groove. The present application provides a partition groove in the area between the retaining wall and the display area so that at least one of the driving circuit layer and the light-emitting functional layer is provided with a partition groove. When the buffer glue layer is under too much pressure or the volume of the glue is too large, the glue can be filled in the partition groove to avoid the problem of glue flushing. When the buffer glue layer is unevenly coated, the glue diffuses into the partition groove to form a uniform film surface of the buffer glue layer, thereby avoiding poor display caused by uneven glue thickness and / or glue flushing problems during the coating process of the buffer glue layer.

[0107] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0108] The above is a detailed introduction to an OLED display device and a preparation method thereof provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. A person of ordinary skill in the art should understand that the technical solutions recorded in the aforementioned embodiments can still be modified, or some of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. An OLED display device, characterized in that: include: substrate; A driving circuit layer is arranged on one side of the substrate; A light-emitting functional layer is arranged on a side of the driving circuit layer away from the substrate; An encapsulation layer is arranged on a side of the light-emitting functional layer away from the driving circuit layer; A buffer adhesive layer is arranged on a side of the encapsulation layer away from the light-emitting functional layer; A cover plate, arranged on a side of the buffer rubber layer away from the encapsulation layer; The OLED display device includes a display area and a non-display area. In the non-display area, a retaining wall is provided between the cover plate and the driving circuit layer. In the area between the retaining wall and the display area, at least one of the driving circuit layer and the light-emitting functional layer is formed with a partition groove, and the buffer rubber layer is filled into the partition groove.

2. The OLED display device according to claim 1, wherein: The partition groove includes a first partition groove and a second partition groove, wherein the first partition groove is arranged on one side of the encapsulation layer, and the second partition groove is arranged on the other side of the encapsulation layer.

3. The OLED display device according to claim 1, wherein: The retaining wall is arranged around the display area, and the partition groove is arranged around the packaging layer in the area between the retaining wall and the display area.

4. The OLED display device according to claim 3, wherein: The partition groove includes a first portion and a second portion, the first portion is separated from the second portion, and the first portion and the second portion have the same depth.

5. The OLED display device according to claim 1, wherein: The light-emitting functional layer comprises: A pixel electrode layer is arranged on a side of the driving circuit layer away from the substrate; A pixel definition layer, arranged on a side of the pixel electrode layer away from the driving circuit layer; A luminescent material layer is disposed in a pixel region defined by the pixel definition layer; A common electrode layer, disposed on a side of the light-emitting material layer away from the pixel electrode layer; Wherein, in the area between the retaining wall and the display area, the pixel definition layer is provided with a third partition groove.

6. The OLED display device according to claim 5, wherein: The thickness of the pixel definition layer in the area between the retaining wall and the display area is greater than the thickness of the pixel definition layer in the display area, and the third partition groove penetrates through the pixel definition layer.

7. The OLED display device according to claim 5, wherein: The driving circuit layer comprises: Buffer layer; An interlayer insulating layer, disposed on a side of the buffer layer away from the substrate; A passivation layer, disposed on a side of the interlayer insulating layer away from the buffer layer; A planarization layer, disposed on a side of the passivation layer away from the interlayer insulating layer; At least one of the interlayer insulating layer, the passivation layer and the planarization layer is provided with a partition groove, and a projection of the third partition groove located in the pixel definition layer on the substrate overlaps with a projection of the partition groove located in the driving circuit layer on the substrate.

8. The OLED display device according to claim 7, wherein: The planarization layer is provided with a fourth partition groove, there is a distance between the fourth partition groove and the pixel electrode layer, and a projection of the fourth partition groove on the substrate overlaps with a projection of the third partition groove on the substrate.

9. The OLED display device according to claim 8, wherein: The driving circuit layer also includes a source-drain layer, which is arranged between the passivation layer and the interlayer insulating layer. The passivation layer is provided with a fifth partition groove, and there is a distance between the fifth partition groove and the source-drain layer, and the projection of the fifth partition groove on the substrate overlaps with the projection of the fourth partition groove on the substrate.

10. The OLED display device according to claim 9, wherein: The interlayer insulating layer is provided with a sixth partitioning groove, and a projection of the sixth partitioning groove on the substrate overlaps with a projection of the fifth partitioning groove on the substrate.

Images