Wafer carrier and semiconductor process equipment

Abstract

The present invention discloses a wafer carrier device and semiconductor process equipment. The disclosed wafer carrier device includes a bracket and a wafer tray module, wherein: the wafer tray module is detachably mounted on the bracket, the wafer tray module includes a plurality of wafer trays spaced apart and a connector connecting the plurality of wafer trays, the wafer tray is provided with a first wafer positioning space, and in the same wafer tray module, the first wafer positioning space of each wafer tray has the same size. The above solution can solve the problem in the related art that in order to perform local inspection and maintenance operations on the wafer carrier device and to carry wafers of different sizes, the entire wafer carrier device needs to be frequently disassembled for inspection, maintenance or replacement, resulting in poor production capacity of semiconductor process equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment design, and in particular to a wafer carrying device and semiconductor process equipment. Background Art

[0002] A wafer boat is a wafer carrier used by semiconductor processing equipment to process wafers. The boat carries the wafers and is transported into the process chamber via a lifting mechanism. As a crucial component of semiconductor processing equipment, the boat is crucial to its efficiency.

[0003] The wafer is a precision device, and the wafer boat, as a component that carries the wafers, needs to be regularly inspected and maintained. In the related art, when inspecting and maintaining a part or the whole of the wafer boat, for example, when inspecting and maintaining the component of the wafer-carrying boat, it is necessary to remove the entire wafer boat from the semiconductor process equipment and perform the corresponding inspection and maintenance. Moreover, the sizes of wafers carried by each wafer boat are different. When the semiconductor processes different types of wafers, it is also necessary to remove the entire wafer boat from the semiconductor process equipment and install other wafer boats. However, the production capacity of semiconductor process equipment is an important indicator for evaluating its performance. The operations of disassembling, installing, and adjusting the installation angle parameters of the wafer boat after installation are relatively cumbersome. Frequent disassembly, installation, and adjustment of the installation angle parameters of the wafer boat after installation will take a lot of time, thereby reducing the time that the semiconductor process equipment can perform the process, resulting in poor production capacity of the semiconductor process equipment. Summary of the Invention

[0004] The present invention discloses a wafer carrier and semiconductor process equipment to solve the problem in the related art that in order to inspect and maintain a part of the wafer carrier and to carry wafers of different sizes, the entire wafer carrier needs to be frequently disassembled for inspection, maintenance or replacement, resulting in poor production capacity of semiconductor process equipment.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, the present application discloses a wafer carrying device, comprising a bracket and a wafer tray module, wherein:

[0007] The wafer tray module can be detachably mounted on the bracket. The wafer tray module includes a plurality of wafer trays distributed at intervals and connectors connecting the plurality of wafer trays. The wafer tray is provided with a first wafer positioning space. In the same wafer tray module, the size of the first wafer positioning space of each wafer tray is equal.

[0008] In a second aspect, the present application further discloses a semiconductor process equipment, comprising the wafer carrier device described in the first aspect.

[0009] The technical solution adopted by the present invention can achieve the following technical effects:

[0010] The embodiment of the present application sets the wafer carrying device as a structure of a bracket and a wafer tray module, and the wafer tray module is detachably connected to the bracket, so that when the wafer tray module carrying the wafers of the wafer carrying device is inspected and maintained, or when the wafer carrying device needs to carry wafers of other sizes, the operator only needs to disassemble the wafer tray module and perform corresponding inspection and maintenance on the wafer tray module, or replace the wafer tray module matching the size of the corresponding wafer without disassembling the bracket, thereby avoiding the disassembly and subsequent installation of the entire wafer carrying device, thereby reducing the corresponding operations and improving the working efficiency. In this way, the downtime of the semiconductor process equipment can be reduced, so that it can have more time for production, thereby effectively solving the problem in the related art that the semiconductor process equipment has a long downtime due to the need to disassemble or replace the entire wafer carrying device in order to perform inspection and maintenance on the wafer carrying components of the wafer carrying device and to carry wafers of different sizes, thereby improving the production capacity of the semiconductor process equipment to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic structural diagram of a first wafer carrier device disclosed in an embodiment of the present invention;

[0012] Figure 2 This is a schematic structural diagram of a second wafer carrier device disclosed in an embodiment of the present invention;

[0013] Figure 3 A cross-sectional view of a wafer carrier device disclosed in an embodiment of the present invention at a first viewing angle;

[0014] Figure 4 This is a schematic structural diagram of the semiconductor process equipment disclosed in an embodiment of the present invention.

[0015] Description of reference numerals:

[0016] 100-wafer carrier,

[0017] 200- bracket, 210- top plate, 230- bottom plate, 240- column, 241- support protrusion, 242- column body, 250- accommodation space,

[0018] 300-wafer tray module, 310-wafer tray, 320-connector,

[0019] 400-furnace body,

[0020] 510-intake pipe, 520-exhaust pipe, 530-thermal insulation, 540-process door. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0023] Please refer to Figures 1 to 4 The present invention discloses a wafer carrier 100 for carrying wafers. During a process, a wafer can be transferred to the wafer carrier 100 by a robot. The wafer carrier 100 then uses a transmission mechanism, such as a lifting mechanism, to transfer the wafer to a reaction chamber for processing.

[0024] The disclosed wafer carrier 100 includes a support 200 and a wafer tray module 300 . The support 200 provides a mounting base for other components of the wafer carrier 100 .

[0025] The wafer tray module 300 can be detachably mounted on the bracket 200. The wafer tray module 300 can be detachably mounted on the bracket 200 by connecting with a connector (such as a threaded connector), or it can be directly connected to the bracket 200 to achieve detachable installation on the bracket 200. Of course, the wafer tray module 300 can also be detachably mounted on the bracket 200 in other ways.

[0026] The wafer tray module 300 includes a plurality of wafer trays 310 spaced apart and connectors 320 connecting the plurality of wafer trays 310. In other words, the plurality of wafer trays 310 included in a wafer tray module 300 can be connected to form a whole via the connectors 320 included in the module (i.e., the same wafer tray module 300), thereby forming a modular structure of the plurality of wafer trays 310 and the connectors 320. The plurality of wafer trays 310 are stacked one on top of the other, with their carrying surfaces facing the same direction. There is space between any two adjacent wafer trays 310 for accommodating wafers, and wafers can be carried on the wafer trays 310.

[0027] The wafer tray 310 is provided with a first wafer positioning space for positioning and supporting the wafer. The first wafer positioning space can be a groove provided on the wafer tray 310, the bottom wall of which can be used to support the wafer. The first wafer positioning space can also be an area surrounded by multiple protrusions on the wafer tray 310. Of course, the first wafer positioning space can also be formed in other ways, and the specific structure of the first wafer positioning space is not limited here.

[0028] In the same wafer tray module 300 , the size of the first wafer positioning space of each wafer tray 310 is equal, that is, the sizes of wafers that can be carried by the same wafer tray module 300 are the same.

[0029] In a specific implementation, when the wafer carrier 100 needs to carry different types of wafers, such as wafers of different sizes, since the wafer tray module 300 is detachably connected to the bracket 200, it is only necessary to remove the wafer tray module 300 from the bracket and then detachably install the wafer tray module 300 for carrying wafers of other sizes on the bracket 200.

[0030] Of course, when inspecting and maintaining the wafer-carrying components of the wafer carrier 100 , it is only necessary to remove the wafer tray module 300 from the bracket 200 and perform the corresponding inspection and maintenance operations without removing the bracket 200 .

[0031] The embodiment of the present application sets the wafer carrying device 100 as a structure of a bracket 200 and a wafer tray module 300, and the wafer tray module 300 is detachably connected to the bracket 200, so that when performing inspection and maintenance on the wafer tray module 300 of the wafer carrying device 100, or when the wafer carrying device 100 needs to carry wafers of other sizes, the operator only needs to disassemble the wafer tray module 300 and perform corresponding inspection and maintenance on the wafer tray module 300, or replace the wafer tray module 300 with a wafer size that matches the corresponding wafer without disassembling the bracket 200. 00, thereby avoiding the disassembly and subsequent installation of the entire wafer carrier, thereby reducing the corresponding operations and improving work efficiency, which can reduce the downtime of semiconductor process equipment and allow it to have more time for production, thereby effectively solving the problem in the related art that the semiconductor process equipment has a long downtime due to the need to inspect and maintain the wafer-carrying components of the wafer carrier 100 and to disassemble or replace the entire wafer carrier 100 in order to carry wafers of different sizes, thereby improving the production capacity of semiconductor process equipment to a certain extent.

[0032] The bracket 200 is provided with a receiving space 250 to receive the wafer tray module 300 . The bracket 200 may be provided with an entrance and an exit communicating with the receiving space 250 , and the wafer tray module 300 may enter and exit the receiving space 250 through the entrance and exit.

[0033] As described above, the wafer tray module 300 is detachably mounted on the bracket 200. In an optional solution, the bracket 200 may include a support member located within the accommodating space 250. The support member may be a circular boss fixedly connected to the inner wall of the accommodating space 250. The support member may also include a plurality of support blocks arranged at intervals. Of course, the support member may also be in other forms, which will not be described in detail here. The wafer tray module 300 can be detachably mounted within the accommodating space 250 by overlapping the wafer tray 310 it contains with the support member.

[0034] The embodiment of the present application provides a support member within the accommodation space 250 of the bracket 200, so that the wafer tray module 300 is overlapped on the support member through the wafer tray 310 contained therein, thereby achieving detachable installation of the wafer tray module 300 within the accommodation space. By adopting the method of overlapping the wafer tray 310 of the wafer tray module 300 and the bracket 200 to achieve detachable installation of the wafer tray module 300 and the bracket 200, the existing wafer tray 310 can be fully utilized, and the wafer tray module 300 does not need to be provided with other detachable connection structures. This undoubtedly simplifies the structure. In addition, overlapping is a detachable installation method that is easy to pick up and place, thereby making the detachable installation of the wafer tray module 300 and the bracket 200 easier.

[0035] The support 200 is the framework of the wafer support device and serves to support the wafer tray module 300. In specific implementations, the support 200 structure capable of supporting and detachably connecting the wafer tray module 300 can have various configurations, and this application does not limit the specific structure of the support 200. In an optional embodiment, the support 200 can be a hollow cylindrical body, with a storage space 250 defined within the cylindrical body. The cylindrical body has an inlet and outlet connected to the storage space 250, through which the wafer tray module 300 can enter and exit the storage space 250. Of course, the cylindrical body can also have a gas passage for process gas to pass through, so that the process gas can more easily enter and exit the storage space 250.

[0036] In another optional embodiment, the bracket 200 may include a top plate 210, a bottom plate 230, and a plurality of columns 240 connected between the top plate 210 and the bottom plate 230. The plurality of columns 240 are spaced apart, and the plurality of columns 240, the top plate 210, and the bottom plate 230 enclose a receiving space 250.

[0037] Specifically, the top plate 210 may have a first surface, and the bottom plate 230 may have a second surface. The first and second surfaces may be arranged opposite each other. The first ends of the plurality of pillars 240 may be connected to the first surface, and the second ends of the plurality of pillars 240 may be connected to the second surface, thereby forming the top plate 210, the bottom plate 230, and the plurality of pillars 240 as a whole. The gap formed between at least two adjacent pillars 240 allows the wafer tray module to enter and exit, thereby forming an inlet and outlet.

[0038] In a further technical solution, each of the plurality of columns 240 may include a support protrusion 241, which may extend toward the interior of the accommodating space 250. The support protrusions 241 of the plurality of columns 240 located at the same height constitute a support member. When the wafer tray module 300 is attached to the support member, the edge of a wafer tray in the wafer tray module 300 attaches to the support protrusion 241. The plurality of columns 240 being located at the same height means that the plurality of columns 240 are at the same height along the extension direction thereof.

[0039] In the embodiment of the present application, the support 200 is configured to include a top plate 210, a bottom plate 230, and a plurality of columns 240 connected between the top plate 210 and the bottom plate 230. The plurality of columns 240 are spaced apart, and the plurality of columns 240, the top plate 210, and the bottom plate 230 enclose a receiving space 250. This makes the structure of the support 200 relatively simple, and the gap formed between any two adjacent columns 240 helps reduce the weight of the support 200. Furthermore, by combining the support protrusions 241 of the plurality of columns 240 at the same height to form a support member, a relatively simple support structure can be formed. The plurality of support protrusions 241 jointly support the wafer tray 310 for overlap, thereby also improving the stability of the overlap.

[0040] In some embodiments, the wafer tray module 300 can achieve the overlap of the entire wafer tray module 300 by overlapping a wafer tray 310 with a support member. In order to improve the stability of the wafer tray module 300 supported on the support member, the multiple columns 240 can include multiple support protrusions 241 spaced apart in the direction of their extension. The support protrusions 241 of the multiple columns 240 are opposite to each other at the same height and each constitutes a support member. The support member corresponds to the wafer tray 310 one-to-one, and each wafer tray module 300 is detachably installed in the accommodating space 250 by overlapping each wafer tray 310 it contains with the support member one-to-one. By overlapping each wafer tray 310 of the wafer tray module 300 on the corresponding support member one-to-one, each wafer tray 310 is supported, thereby improving the stability of the support of the wafer tray module 300.

[0041] To further enhance the carrying capacity of the wafer carrier 100, the columns 240 may further include column bodies 242, and the support protrusions 241 may be provided on the corresponding column bodies 242. When the wafer tray module 300 is separated from the support 200, each support member and the column bodies 242 of the plurality of columns 240 form a second wafer positioning space, the size of which is larger than the size of the first wafer positioning space. When the wafer tray module 300 is separated from the support 200, each support member and the column bodies 242 of the plurality of columns 240 form a second wafer positioning space, thereby positioning and supporting wafers that fit into the second wafer positioning space. The wafers can be directly supported on the support members. When the wafer tray module 300 is removed from the support 200, the support 200 itself can form a structure for positioning the wafers, making the wafer carrier 100 more functional. Herein, the detachable assembly of the support 200 and the wafer tray module 300 can form a wafer support device, i.e., a wafer boat. In this embodiment, after the wafer tray module 300 is removed, the bracket 200 itself can form a second wafer positioning space, thereby enabling the bracket 200 itself to form another wafer supporting device, that is, another wafer boat.

[0042] In some cases, to ensure wafer processing performance, it is necessary to adjust the spacing between the wafer trays 310 in the wafer tray module 300. If each wafer tray 310 in the wafer tray module 300 is overlapped on a support, it is difficult to adjust the spacing between the wafer trays 310. To facilitate adjustment of the spacing between the wafer trays 310, optionally, within the same wafer tray module 300, at least one of the two wafer trays 310 located at either end of the wafer tray module 300 is overlapped on a support in a one-to-one correspondence, while the other wafer trays 310 are suspended and spaced apart from the support 200, i.e., spaced apart from the support 200. The spacing between the wafer trays 310 in the wafer tray module 300 is adjustable.

[0043] By bridging at least one of the two wafer trays 310 located at either end of the wafer tray module 300 onto a support member in a one-to-one correspondence, and leaving the other wafer trays 310 suspended and spaced from the support 200, the spacing between the suspended wafer trays 310 of the wafer tray module 300 is adjustable, thereby varying the spacing between the wafer trays 310. Because the other wafer trays 310 are suspended and spaced from the support 200, adjustment of the spacing is less susceptible to being affected by the support 200. Consequently, while the wafer tray module 300 is supported, the spacing between the wafer trays 310 can be adjusted more easily.

[0044] There are many ways to adjust the spacing between wafer trays 310. For example, the connector 320 can be a telescopic rod, and the extension and retraction of the telescopic rod can drive the wafer trays 310 to adjust the spacing between wafer trays 310. Of course, the connector 320 can also be a deformable member, such as a magneto-deformable member or an electro-deformable member, which can drive the wafer trays 310 to adjust the spacing between wafer trays 310 through deformation. Of course, there are many other ways to adjust the spacing between wafer trays 310, which will not be detailed here.

[0045] Specifically, the two wafer trays 310 at either end of the wafer tray module 300 are overlapped on the support member in a one-to-one correspondence, making the installation of the wafer tray module 300 relatively stable. Since one of the two wafer trays 310 at either end of the wafer tray module 300 is overlapped on the support member, while the other is free, the adjustment of the spacing between the wafer trays 310 is less restricted, thereby increasing the degree of freedom in spacing adjustment.

[0046] When the two wafer trays 310 at both ends of the wafer tray module 300 are overlapped on the support members in a one-to-one correspondence, and the spacing between the wafer trays 310 in each wafer tray module 300 is equal, when it is necessary to replace other wafer tray modules 300 with different spacing between the wafer trays 310, in order to ensure that the wafer trays 310 at both ends of the wafer tray module 300 can still be overlapped on the support members in a one-to-one correspondence after replacing the other wafer tray modules 300 with different spacing between the wafer trays 310, optionally, the spacing between the support members for overlapping the two wafer trays 310 at both ends of the wafer tray module 300 is a constant value a. The spacing between wafer trays 310 in different wafer tray modules 300 is b, c, d... respectively. The relationship between the fixed value a and b, c, d... is a = n[b, c, d...], where n is an integer greater than or equal to 1, and [b, c, d...] is the least common multiple of b, c, d... When designing the wafer tray module 300, the above relationship constraints ensure that the two ends of each wafer tray module 300 can be overlapped on the corresponding support member.

[0047] To further improve the production capacity of semiconductor process equipment, in an optional solution, the wafer tray modules 300 can be arranged in multiple groups, each group of wafer tray modules 300 including at least one wafer tray module 300. Within the same group of wafer tray modules 300, the first wafer positioning spaces of all wafer trays 310 are of equal size. The first wafer positioning spaces of wafer trays 310 in different groups of wafer tray modules 300 are of unequal size. When one of the multiple groups of wafer tray modules 300 is detachably mounted on the bracket 200, the other groups of wafer tray modules 300 are separated from the bracket 200. This allows for the replacement of wafer tray modules 300 when wafers of different sizes need to be loaded, without the need to disassemble the entire wafer support device.

[0048] Specifically, within the same group of wafer tray modules 300, the first wafer positioning spaces of all wafer trays 310 are of equal size. The first wafer positioning spaces of wafer trays 310 in different groups of wafer tray modules 300 may be of different sizes. For example, multiple groups of wafer tray modules 300 may include a first group of wafer tray modules 300, a second group of wafer tray modules 300, and so on. In the first group of wafer tray modules 300, the first wafer positioning spaces of all wafer trays 310 may have a size of A. A may be 200 mm, 300 mm, or other sizes. The first wafer positioning spaces of the wafer trays 310 in the second group of wafer tray modules 300 may have a size of B, which is different from A. That is, when A is 200 mm, B may be 300 mm or another size different from 200 mm. When A is 300 mm, B may be 200 mm or another size different from 300 mm.

[0049] Herein, the sizes of the first wafer positioning space and the second wafer positioning space are unequal, thereby enabling them to position wafers of different sizes. It should be noted that wafers of different sizes can be determined by the maximum size of the outline formed by the edges of the wafers. Of course, if the wafer is a disc-shaped structure, the outline formed by the edges of the wafer is circular, in which case the size of the wafer is the diameter of the circle.

[0050] When one of the multiple groups of wafer tray modules 300 is detachably mounted on the support 200, the other groups of wafer tray modules 300 are separated from the support 200. Specifically, when the wafer tray modules 300 are mounted on the support 200, only the wafer tray modules 300 in the same group can be detachably mounted on the support 200, and the other groups of wafer tray modules 300 need to be separated from the support 200. In other words, when the wafer carrier 100 carries wafers, it can only carry wafers of the same size to enable processing within the semiconductor process equipment. For example, the wafer tray modules 300 mounted on the support may all have a first wafer positioning space size of 200 mm, or all have a first wafer positioning space size of 300 mm, or all have wafer tray modules 300 of other sizes.

[0051] In some process environments, the process conditions in different local areas of the process environment are different, such as temperature, gas flow rate, etc. If all local areas use the same wafer tray module 300, then due to different process conditions, there will be differences in the process performance of the wafers. Therefore, in order to adapt to different local areas, different local areas need to install wafer tray modules 300 with the spacing between wafer trays 310 matching the local area according to the actual process conditions. In order to adapt to different local areas in the process environment, optionally, in the same group of wafer tray modules 300, the spacing between the multiple wafer trays 310 of at least one wafer tray module 300 is not equal to the spacing between the multiple wafer trays 310 of other wafer tray modules 300.

[0052] In order to facilitate manufacturing and design, and taking into account that the process conditions of the local environment of the same wafer tray module 300 are not much different, optionally, multiple wafer trays 310 of the same wafer tray module 300 are distributed at equal intervals, which is conducive to ensuring the consistency of the process conditions of multiple wafers carried on the same wafer tray module 300.

[0053] By making the spacing between the multiple wafer trays 310 of at least one wafer tray module 300 in the same group unequal to the spacing between the multiple wafer trays 310 of other wafer tray modules 300, the corresponding wafer tray module 300 can be selected according to different local process conditions. By distributing the multiple wafer trays 310 of the same wafer tray module 300 at equal intervals, the consistency of the process conditions within the same wafer tray module 300 is facilitated.

[0054] Specifically, the connecting member 320 can be a connecting rod, which can extend in the arrangement direction of the multiple wafer trays 310 and be connected to each wafer tray 310 respectively. In the same wafer tray module 300, the connecting rod can be connected to multiple wafer trays 310, thereby realizing indirect connection between the multiple wafer trays 310. Specifically, the connecting rod can be connected to the wafer tray 310 by means of snap connection, connection with a connector (such as a screw), etc. This structure enables the connecting rod to be connected to multiple wafer trays 310 of the same wafer tray module 300 at the same time, which is conducive to ensuring the consistency of the connection and is easier to ensure the connection effect.

[0055] In a further technical solution, each wafer tray module 300 may include multiple connecting rods, which may be spaced apart. This structure allows multiple wafer trays 310 in the same wafer tray module 300 to be connected via multiple spaced apart connecting rods, which helps improve connection stability and balance connection stress, alleviating the problem of deformation of the wafer tray module 300 caused by connection stress.

[0056] Of course, the connector 320 can also have other structures. For example, the connector 320 can include multiple connecting blocks. In the same wafer tray module 300, two adjacent wafer trays 310 are connected via corresponding connecting blocks. Specifically, the connecting blocks can be connected to the corresponding wafer trays 310 by means of a snap connection, a connector (e.g., a threaded connector, a rivet), etc., and this application does not limit this.

[0057] The present application also discloses a semiconductor process equipment, which includes the wafer carrier device 100 described in the above embodiment.

[0058] In an optional solution, the disclosed semiconductor process equipment can be a vertical diffusion furnace. Since the airflow control in the middle area of ​​the vertical diffusion furnace is relatively stable and the temperature control accuracy is relatively high, while the temperature and airflow control at the end of the vertical diffusion furnace is relatively poor, in order to improve the process consistency of the wafers located in the vertical diffusion furnace, the vertical diffusion furnace also includes: a furnace body 400. When the wafer carrier 100 is arranged in the furnace body 400, in the same group of wafer tray modules 300, the spacing between the multiple wafer trays 310 of the wafer tray module 300 located in the middle of the furnace body 400 is a first spacing, and the spacing between the multiple wafer trays 310 of the wafer tray module 300 located at the end of the furnace body 400 is a second spacing. The first spacing is smaller than the second spacing, thereby improving the process consistency of the wafers located in the vertical diffusion furnace.

[0059] Specifically, the vertical diffusion furnace can also include an air inlet pipe 510, an exhaust pipe 520, an insulation member 530 and a process door 540. The process door 540 is used to close or open the opening of the furnace body 400 for the transmission of the wafer carrier 100. The insulation member 530 is used to isolate the wafer carrier 100 from the process door 540. The air inlet pipe is used to pass the process gas into the furnace body 400. The exhaust pipe 520 is used to discharge the process gas in the furnace body 400. The air inlet pipe 510, the furnace body 400 and the exhaust pipe 520 form a passage for the process gas.

[0060] Of course, the semiconductor process equipment in the present application is not limited to the vertical diffusion furnace, but may also be other types of conventional semiconductor processing furnaces.

[0061] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0062] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A wafer carrying device, characterized in that: It comprises a support (200) and a wafer tray module (300), wherein: The wafer tray module (300) comprises a plurality of wafer trays (310) distributed at intervals and a connector (320) connecting the plurality of wafer trays (310), the wafer trays (310) being provided with a first wafer positioning space, and in the same wafer tray module (300), the first wafer positioning space of each wafer tray (310) has the same size; The bracket (200) includes a top plate (210), a bottom plate (230), and a plurality of columns (240) connected between the top plate (210) and the bottom plate (230), wherein the plurality of columns (240) are spaced apart, and the plurality of columns (240), the top plate (210), and the bottom plate (230) enclose a receiving space (250), and the plurality of columns (240) each include a supporting protrusion (241), and the supporting protrusions (241) of the plurality of columns (240) located at the same height constitute a supporting member; In the same wafer tray module (300), at least one of the two wafer trays (310) located at both ends of the wafer tray module (300) is overlapped on the support member in a one-to-one correspondence to achieve detachable installation in the accommodating space (250), and the other wafer trays (310) are suspended and spaced apart from the bracket (200), so that the spacing between the suspended wafer trays (310) of the wafer tray module (300) is adjustable, thereby changing the spacing between the wafer trays (310).

2. The wafer carrier device according to claim 1, wherein: The plurality of columns (240) each include a plurality of support protrusions (241) spaced apart in the extension direction thereof; the support protrusions (241) of the plurality of columns (240) are opposed to each other at the same height and each constitutes the support member.

3. The wafer carrier device according to claim 2, wherein: The column (240) also includes a column body (242), and the supporting protrusion (241) is provided on the corresponding column body (242). When the wafer tray module (300) is separated from the bracket (200), each support member and the column body (242) of the plurality of columns (240) form a second wafer positioning space, and the size of the second wafer positioning space is larger than the size of the first wafer positioning space.

4. The wafer carrier device according to claim 1, wherein: The connecting member (320) is a connecting rod. In each wafer tray module (300), there are multiple connecting rods, which are arranged at intervals. Each connecting rod extends in the arrangement direction of the multiple wafer trays (310) and is fixedly connected to each wafer tray (310).

5. The wafer carrying device according to claim 1, wherein: The wafer tray modules (300) are arranged in multiple groups, each group of the wafer tray modules (300) includes at least one wafer tray module (300), and in the same group of the wafer tray modules (300), the sizes of the first wafer positioning spaces of all the wafer trays (310) are equal; The first wafer positioning space sizes of the wafer trays (310) between different groups of wafer tray modules (300) are unequal; When one group of the plurality of groups of wafer tray modules (300) is detachably mounted on the support (200), the other groups of the wafer tray modules (300) are separated from the support (200).

6. The wafer carrying device according to claim 5, characterized in that: In the wafer tray modules (300) of the same group, the spacing between the multiple wafer trays (310) of at least one wafer tray module (300) is not equal to the spacing between the multiple wafer trays (310) of other wafer tray modules (300).

7. The wafer carrying device according to claim 5, characterized in that: The plurality of wafer trays (310) of the same wafer tray module (300) are distributed at equal intervals.

8. A semiconductor process equipment, characterized in that: include: The wafer carrying device (100) according to any one of claims 1 to 7.

Images