Lamination forming system and lamination forming method

Abstract

The present invention provides a stacking forming system and a stacking forming method, which can perform stacking forming of stacking formed products well. The stacking forming system (1) includes a vacuum stacking device (12) and a punching device (13, 14), and includes a vacuum stacking device (12) for performing stacking forming in a chamber (C) in a vacuum state, and at least two first punching devices (13) and a second punching device (14) which are arranged in a post-process of the vacuum stacking device (12) and have position control elements and use a servo motor (315) as a driving source and a servo motor (415) as a driving source.

Description

Technical Field

[0001] The present invention relates to a stacking forming system including a vacuum stacking device and a punching device, and a stacking forming method using the vacuum stacking device and the punching device. Background Art

[0002] As a stacking forming system having a vacuum laminating device and a punching device, there are structures having one punching device and two punching devices in the post-process of the vacuum laminating device. As a structure having one punching device in the post-process of the vacuum laminating device, the content described in Patent Document 1 is known. The flattening punching device in the post-process of the vacuum laminating device arranged in Patent Document 1 is equipped with a limit switch and detects the clamping of the intermediate laminated product. In addition, as a structure having two punching devices arranged in the post-process of the vacuum laminating device, the content described in Patent Document 2 and Patent Document 3 is known. In particular, Patent Document 3 records that the second plane punching mechanism 3 can move forward and backward toward the other of at least one of the pair of metal plates through the action of the servo motor. In addition, it is recorded that: the number of revolutions of the servo motor 53 is controlled by a servo amplifier (not shown) based on the command signal from the programmable logic controller (PLC) and the feedback distance information between the pressure blocks 46 and 47.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2005-66967

[0005] Patent Document 2: Japanese Patent Application Publication No. 2002-120100

[0006] Patent Document 3: Japanese Patent Application Publication No. 2020-28980

[0007] However, regarding the above-mentioned patent document 3, there is a situation in which the following problems occur because only the second plane punching mechanism 3 pushes the stacked molded product based on the distance information. That is, in the first plane punching mechanism, since the stacked molded product is pushed only with a predetermined pressure, the stacked molded product transported from the first plane punching mechanism to the second plane punching mechanism will have uneven thickness. Therefore, in a part of the stacked molded products, even if the second plane punching mechanism is used to push at the desired distance, uneven thickness will remain in the final molded product, and as a result of pushing in a manner that barely reaches the desired distance, a pressure exceeding the imaginary pressure will occur, resulting in the stacked (resin) film melting and flowing out to the side of the stacked molded product.

[0008] In addition, when a hydraulic cylinder controlled by a general pressure control valve is used in the first plane press mechanism, there is a problem of poor pressure control responsiveness in the press process. Other issues and new features will be apparent from the description of this specification and the accompanying drawings. Summary of the invention

[0009] In a lamination forming system according to one embodiment, the lamination forming system includes a vacuum lamination device and a press device, wherein the vacuum lamination device for performing lamination forming in a vacuum chamber and at least two continuous press devices provided in a subsequent process of the vacuum lamination device each include a position control element.

[0010] The effects of the present invention are as follows.

[0011] According to the above-mentioned one embodiment, for example, it is applicable to a stacking molding system and the like, and it is possible to provide a stacking molding system that can perform stacking molding of stacking molded products well. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic explanatory diagram of the stacking molding system according to the first embodiment.

[0013] Figure 2 This is a block diagram showing control of the first press device and the second press device according to the first embodiment.

[0014] Figure 3 It is an explanatory diagram showing press forming in a first press step performed by a first press device according to the first embodiment.

[0015] Figure 4 It is an explanatory diagram showing press forming in the second press step performed by the second press device of the first embodiment.

[0016] Figure 5 It is a schematic explanatory diagram of a stacking molding system according to a second embodiment.

[0017] Figure 6 It is a schematic explanatory diagram of a stacking molding system according to a third embodiment.

[0018] In the figure: 1, 2, 3—stacking forming system, 12, 22, 32—vacuum stacking device, 13, 23, 33—first punching device, 14, 24, 34—second punching device, 17—control device, 212, 312, 412, 2312, 2412—upper plate, 213, 314, 414, 2314, 2414—lower plate, 322, 323, 422, 423, 2322, 2323—pressure block, 315, 415, 3411, 3511—servo motor, 317, 417—servo amplifier, 320, 420—load sensor, 321, 421, 2318, 2418—linear scale, A4—primary stacking formed product, A5—secondary stacking formed product, A6—stacking formed product. DETAILED DESCRIPTION

[0019] Regarding the stacking molding system 1 of the first embodiment of the present invention, a part of the stacking molding system 1 is shown with reference to the cross section. Figure 1 The vacuum laminating device 12, the first punching device 13, and the second punching device 14 are described. The laminating forming system 1 is provided with two punching devices 13 and 14, namely, the first punching device 13 and the second punching device 14, in a continuous manner in the post-process of the vacuum laminating device 12. In addition, the laminating forming system 1 is provided with a carrier film conveying device 15 in the pre-process of the vacuum laminating device 12, and is provided with a carrier film winding device 16 in the post-process of the second punching device 14. Furthermore, the laminating forming system 1 is provided with a control device 17. The control device 17 is connected to the vacuum laminating device 12, the first punching device 13, the second punching device 14, the carrier film conveying device 15, and the carrier film winding device 16 to control the entire laminating forming system 1.

[0020] The carrier film conveying device 15 will be described in order from the previous process. The carrier film conveying device 15, which serves as a conveying device and a tensioning device for the substrate A1 and the laminated film A2, includes a lower unwinding roller 511 and a driven roller 512. The lower carrier film F1 rolled out from the unwinding roller 511 changes direction to a horizontal state at the driven roller 512 portion. A placing table 513 is provided at the portion where the lower carrier film F1 becomes horizontal, on which the substrate A1 and the laminated film A2, which are the materials to be formed and are conveyed in an overlapping manner from the previous process, are placed. In addition, the carrier film conveying device 15 includes an upper unwinding roller 513 and a driven roller 515, and the upper carrier film F2 rolled out from the unwinding roller 514 overlaps on the laminated formed product A3 composed of the substrate A1 and the laminated film A2 at the driven roller 515 portion. The substrate A1 and the laminated film A2 are conveyed while being sandwiched by these carrier films F1 and F2. Furthermore, by laminating and forming via carrier films F1 and F2 in the vacuum laminating device 12, the first punching device 13, and the second punching device 14, the laminating film A2 is prevented from melting and adhering to the device parts. In addition, the use of carrier films F1 and F2 also has the advantage of exerting a certain buffering effect when pressurizing the primary laminating molded product A4 and the secondary laminating molded product A5, especially in the first punching device 13 and the second punching device 14.

[0021] Next, the vacuum laminating device 12 disposed in the post-process of the carrier film conveying device 15 will be described. The vacuum laminating device 12 is a device that pressurizes a laminated molded product A3 composed of a substrate A1 and a laminated film A2 in a vacuum state by a pressurizing body such as a diaphragm 211 to laminate and mold a primary laminated molded product A4. The vacuum laminating device 12 has a lower plate 213 that can be raised and lowered relative to an upper plate 212 that is fixedly disposed by a lifting mechanism 214, and when the lower plate 213 including an outer frame rises and abuts against the upper plate 212, a chamber C can be formed inside. The lifting mechanism 214 is composed of a hydraulic cylinder, but a motor or an air cylinder may be used in the lifting mechanism 214 of the vacuum laminating device 12. When a motor is used in the lifting mechanism 214 of the vacuum lamination device 12 instead of a hydraulic mechanism, the entire lamination forming system 1 is electrified corresponding to the use of the motor as the driving source of the first punching device 13 and the second punching device 14 described later, thereby improving the cleanliness when the lamination forming system 1 is configured in a clean room. The chamber C is connected to a vacuum pump (not shown) that can suck the atmosphere in the internal space to form a vacuum state of the chamber C. In addition, in the present invention, the vacuum state refers to a state where the pressure has been reduced to a predetermined value.

[0022] A heat plate 215 heated by a heater (not shown) is mounted on the lower surface of the center of the upper plate 212, and an elastic thin plate 216 such as a heat-resistant rubber film (not shown) is mounted on the surface of the heat plate 215. On the other hand, a heat plate 217 heated by a heater (not shown) is also mounted on the upper surface of the center of the lower plate 213. In addition, a diaphragm 211 formed of a heat-resistant rubber film as a pressurizing body is mounted on the portion around the heat plate 217 of the lower plate 213 so as to cover the upper surface of the heat plate 217. And, by sending pressurized air to the back side of the diaphragm 211 by a compressor (not shown), the diaphragm 211 expands in the chamber C and pressurizes the substrate A1 and the laminated film A2 between the diaphragm 217 and the heat plate 217. And, the diaphragm 211 of the vacuum laminating device 12 may be mounted on the upper plate 212 and may press the laminated molded product A3 composed of the substrate A1 and the laminated film A2 from the upper plate 212 side. In addition, the vacuum laminating device 12 may be a structure in which rubber is pasted on the flat pressurizing surfaces of the upper and lower pressurizing blocks, and any pressurizing block moves toward the other pressurizing block to push the laminated formed product A3. In the case of a stamping device in which rubber plates are pasted on the flat pressurizing surfaces of the upper and lower pressurizing blocks, the pressurizing mechanism may be a structure using a servo motor or a structure using a hydraulic cylinder. In the case where the stamping device is pressurized by a hydraulic cylinder, in addition to only pressure control, it may also be a control that performs both position control and pressure control, or a control that performs only position control. In addition, in the case of using a motor such as a servo motor in the stamping device, in addition to only pressure control, it may also be a control that performs both position control and pressure control, or a control that performs only position control. In the case of using a motor such as a servo motor for position control in the stamping device, in addition to a rotary encoder installed on the servo motor, a position sensor specially arranged on the stamping device may also be used for position control. In addition, the vacuum laminating device may be a roller-type laminating machine that performs lamination forming between rollers arranged in a vacuum chamber.

[0023] Next, the first punching device 13 arranged in the series direction in the post-process of the above-mentioned vacuum laminating device 12 is described. The first punching device 13 is a device that presses the first laminated formed product A4 formed by the laminated member A1 and the laminated film A2 and having a concave-convex portion formed by the vacuum laminating device 12 again and presses it into a flatter secondary laminated formed product A5. The first punching device 13 has a roughly rectangular chassis 311 arranged below and four tie rods 313 vertically arranged near the four corners of the roughly rectangular fixed plate, that is, the upper plate 312 located above the above-mentioned chassis 311. In addition, the movable plate 314 of the first punching device 13 as a roughly rectangular plate can be lifted and moved between the chassis 311 and the upper plate 312. In addition, the first punching device 13 is a structure that uses a motor such as a servo motor 315 as a driving source, and a servo motor 315 of a pressurizing mechanism is installed on the chassis 311.

[0024] The servo motor 315 has a rotary encoder 316, and is connected to a servo amplifier 317, and the servo amplifier 317 is connected to the control device 17. A ball screw 318 is connected to the drive shaft of the servo motor 315, or the drive shaft itself is a ball screw. On the other hand, a ball screw nut 319 of a ball screw mechanism is fixed to the lower surface of the lower plate 314, and the ball screw 318 is inserted through the ball screw nut 319. Moreover, a load sensor 320 is installed between the lower plate 314 and the ball screw nut 319. Furthermore, the portion where the load sensor 320 is installed is not limited as long as it is a portion that bears the pressure of the stamping process, and as an example, it can be the installation portion of the servo motor 315.

[0025] According to the above structure, the first punching device 13 raises and lowers the lower plate 314 relative to the upper plate 312 through the action of the servo motor 315. In addition, the ball screw mechanism of the first punching device 13 can be a structure in which a belt is installed between the drive shaft installed on the servo motor 315 and the pulley of the ball screw 318 and the driving force is transmitted through the belt. In addition, the ball screw mechanism of the first punching device 13 can be a structure in which the ball screw nut 319 and the ball screw 318 are freely rotatably installed on the chassis 311 to lift and lower. In addition, by covering the part of the ball screw 318 with a cover, the diffusion of grease can be prevented, which helps to improve the cleanliness in the clean room. In addition, the first punching device 13 can be a device with a multiplier mechanism using a connecting rod mechanism, a crank mechanism, a wedge mechanism, etc., or a similar structure. In addition, in the above example, the first punching device 13 is pressurized by a servo motor 315, but it does not exclude a device that uses more than two servo motors 315 or more than two ball screw mechanisms for pressurization. Furthermore, a linear motor capable of closed-loop control may be used in addition to the servo motor. In addition, the first punching device 13 may be a device that uses any of the above-mentioned mechanisms to raise and lower the upper plate 312 relative to the lower plate 314.

[0026] A linear scale 321 as a position sensor is installed between the side of the upper plate 312 and the side of the lower plate 314. The linear scale 321 has a scale 321a installed on one of the plates, and a slider 321b as a measuring unit installed on the other plate. The position (distance) of the lower plate 314 relative to the upper plate 312 can also be detected by the rotary encoder 316 of the servo motor 315. However, there is a slight gap between the ball screw 318 and the ball screw nut 319, and thermal expansion occurs in the tie rod 313 and the ball screw 318. Therefore, there are many cases where it is desired to directly measure the position (distance) of the lower plate 314 relative to the upper plate 312 by the linear scale 321. As an example, the resolution of the position sensor such as the linear scale 321 is preferably a model below 0.002 mm, and more preferably a model below 0.001 mm and above the minimum resolution unit that can be practically used, such as a resolution of 0.0001 mm and a resolution of 0.000025 mm.

[0027] There may be only one linear scale 321 installed on the first punching device 13, but a total of two, or two in total of four, may be installed on both sides of the upper plate 312 and the lower plate 314 relative to the direction of travel of the carrier films F1 and F2. Moreover, when a total of four position sensors are installed on the sides, the parallelism of the lower plate 314 relative to the upper plate 312 can be detected. Alternatively, the position sensor may be provided at a position where the pressure blocks 322 and 323 are connected, or at a position where the chassis 311 and the lower plate 314 are connected. Moreover, the first punching device 13 is generally provided with a safety switch that can detect the position of a limit switch or proximity switch not shown in the figure for the purpose of ensuring that the position of the lower plate 314 does not exceed the critical point of descent or the critical point of ascent in the mechanical design.

[0028] Pressure blocks 322 and 323 are installed on the opposing surfaces of the upper plate 312 and the lower plate 314 of the first punching device 13, respectively, through a heat insulation plate not shown in the figure. The pressure blocks 322 and 323 are provided with a temperature control mechanism such as a cartridge heater. Since the structures of the pressure surfaces 327 of the pressure blocks 322 and 323 are respectively the same, the pressure surface 327 of one pressure block 322 is described. A cushioning material 325 such as rubber, resin film, fiber sheet, etc. is installed on the surface of the pressure block 323. The thickness of the above-mentioned cushioning material 325 is, as an example, 0.05mm to 3.00mm. In addition, a metal plate 326 made of a material such as stainless steel that is elastically deformable and has a plate thickness of 0.2mm to 3.00mm is installed on the surface of the above-mentioned cushioning material 325. In addition, the surface of the metal plate 326 opposite to the surface in contact with the cushioning material 325 is the pressure surface 327.

[0029] Furthermore, the component constituting the pressurizing surface of the first punching device 13 may be a heat-resistant elastic sheet such as a fluororubber sheet. In this case, the hardness (Shore A hardness) of the elastic sheet is not limited thereto, and as an example, a hardness of 30 to 80 can be used, preferably 40 to 70. In addition, the first punching device 13 does not have a chamber that can be in a vacuum state, but may be a structure that has a chamber that can be in a vacuum state and performs pressurization forming in the vacuum chamber.

[0030] Secondly, refer to Figure 2 A control block diagram of press forming involving the first punching device 13 is described. The first punching device 13 is a device having a position control element. A force command signal output unit 701 and a position command signal output unit 702 are provided in the control device 17. The force command signal output unit 701 and the position command signal output unit 702 are connected to a sequence control unit 703 as a superior control unit, and various forming conditions are transmitted from the sequence control unit 703. In addition, the sequence control unit 703 is connected to a setting input display unit 704 and a storage unit 705.

[0031] In addition, the load sensor 320 of the first punching device 13 is connected to the adder 706 of the control device 17. And the command signal output from the force command signal output unit 701 and the signal output from the load sensor 320 are compared and added in the adder 706. In addition, the linear scale 321 is connected to the adder 707 of the control device 17. And the command signal output from the position command signal output unit 702 and the signal output from the linear scale 321 are compared and added in the adder 707. In addition, the signal output from at least one of the above-mentioned adders 706 and 707 is transmitted to the servo amplifier 317 through the force-position comparison switching unit 708 and the command signal generating unit 709. In addition, the rotary encoder 316 of the servo motor 315 is connected to the servo amplifier 317. And the signal output from the command signal generating unit 709 is added to the signal output from the rotary encoder 316. And, Figure 2 The control block diagram is a conceptual diagram, and in fact, all functions can be provided on the first punching device 13 side, and are not limited to Figure 2 structure.

[0032] Next, the second punching device 14 connected to the series direction in the post-process of the first punching device 13 is described. The second punching device 14 is a device that presses the secondary stacked formed product A5 stacked in the first punching device 13 again to form a completely flat stacked formed product A6. The structure of the pressurizing mechanism of the second punching device 14 of the stacking forming system 1 of the first embodiment is roughly the same as that of the first punching device 13.

[0033] The second punching device 14 has a generally rectangular chassis 411 disposed below, and four pull rods 413 vertically disposed near the four corners of an upper plate 412 as a fixed plate and a generally rectangular shape located above the chassis 411. In addition, the second punching device 14 can move the lower plate 414 as a rectangular movable plate up and down between the chassis 411 and the upper plate 412. In addition, the second punching device 14 is a structure that uses a motor as a driving source, and a servo motor 415 of a pressurizing mechanism is installed on the chassis 411. In the first embodiment, the servo motor 415 of the second punching device 14 can use a model of the same type as the servo motor 315 of the first punching device 13 in terms of rated output, etc. However, the first punching device 13 can use a large-output servo motor 315, and conversely, the second punching device 14 can also use a large-output servo motor 415.

[0034] The servo motor 415 has a rotary encoder 416, and is connected to a servo amplifier 417, and the servo amplifier 417 is connected to the control device 17. A ball screw 418 is connected to the drive shaft of the servo motor 415, or the drive shaft itself is a ball screw. On the other hand, a ball screw nut 419 of a ball screw mechanism is fixed to the lower surface of the lower plate 414, and the ball screw 418 is inserted through the ball screw nut 419. Moreover, a load sensor 420 is installed between the lower plate 414 and the ball screw nut 419. Therefore, the second punching device 14 raises and lowers the lower plate 414 through the action of the servo motor 415. Moreover, the pressurizing mechanism of the second punching device 14 can also be changed into various styles like the first punching device 13. Assuming that only control including position control elements is performed in the second punching device 14, there is also a situation where the load sensor 420 is not installed. In addition, a linear scale 421 as a position sensor is installed between the side of the upper plate 412 and the side of the lower plate 414 in the same manner as the first punching device 13. The performance of the linear scale 421 is the same as that of the first punching device 13. However, in the case of wanting to more accurately detect only the plate thickness of the final laminated formed product A6, a component with a higher resolution than the linear scale 321 of the first punching device 13 can be used as the linear scale 421 of the second punching device 14. When the position sensor uses the linear scale 321, it is not necessary to select a magnetic induction type, an optical type, an electrostatic capacitance type, etc., but an ultrasonic sensor or the like.

[0035] Pressing blocks 422 and 423 are respectively installed on the opposing surfaces of the upper plate 412 and the lower plate 414 of the second punching device 14. The above-mentioned pressing blocks 422 and 423 are equipped with a temperature control mechanism such as a cartridge heater. Since the structures of the pressing surfaces 427 of the pressing blocks 422 and 423 are respectively the same, the pressing surface 427 of one pressing block 423 will be described. A cushioning material 425 such as rubber, resin film, fiberboard, etc. is installed on the surface of the pressing block 423. The thickness of the above-mentioned cushioning material 425 is 0.02 mm to 2.00 mm as an example.

[0036] The buffering effect of the buffer material 425 of the second punching device 14 is the same as that of the buffer material 325 of the first punching device 13, and preferably smaller. Therefore, when the buffer material 425 is the same material, it is preferred that the buffer material 425 of the second punching device 14 has the same thickness or the thickness is thinned. In addition, when the buffer material 325 of the first punching device 13 is the same as the buffer material thickness of the second punching device 14, it is preferred that the buffer material 425 of the second punching device 14 uses the same material or has a high hardness. And, as an example, a metal plate 426 made of a material such as elastically deformable stainless steel with a plate thickness of 0.2mm to 3.00mm is installed on the surface of the above-mentioned buffer material 325. And, the surface of the metal plate 426 on the opposite side of the surface in contact with the buffer material 425 is a pressurized surface 427. Regarding the control block diagram of the second punching device 14, the above description is cited because it is roughly the same as the control block diagram of the first punching device 13.

[0037] Next, the carrier film winding device 16 provided in the post-process of the second punching device 14 is described. The carrier film winding device 16 is a device that serves as both a conveying device and a tensioning device for the carrier films F1 and F2. The carrier film winding device 16 includes a lower unwinding roller 611 and a driven roller 612, and the lower carrier film F1 is wound by the above-mentioned winding roller 611. In addition, the carrier film winding device 16 includes an upper winding roller 613 and a driven roller 614, and the upper carrier film F2 is peeled off from the laminated molded product A6 at the portion of the above-mentioned driven roller 614, and the upper carrier film F2 is wound around the above-mentioned upper winding roller 613. In addition, a take-out table 615 for the laminated molded product A6 is provided at the portion where only the lower carrier film F1 is conveyed in a horizontal state. In addition, as a conveying device for the carrier films F1 and F2, a transfer device (so-called clamping conveying device) that holds both sides of the carrier films F1 and F2 and stretches them in the post-process can be provided.

[0038] Next, a method for laminating a laminated material A1 and a laminated film A2 using the laminating molding system 1 of the first embodiment will be described. In the laminating molding system 1 during continuous molding, laminating molding can be performed simultaneously and in batches by sequential control of the control device 17 in the diaphragm type vacuum laminating device 12, the first punching device 13, and the second punching device 14. However, here, the molding sequence of the laminated formed product A3 of the laminated material A1 and the laminated film A2 as a batch amount will be described.

[0039] The laminated part A1 placed on the mounting table 513 of the carrier film conveying device 15 is a circuit substrate for construction with a concave-convex part consisting of a convex part having a copper foil portion bonded to the surface of the substrate and a concave part without a copper foil portion. The thickness of the copper foil (relative to the height of the substrate portion) is not limited to this, and is about several μm to several tens of μm, and is basically less than 0.1 mm. The laminated film A2 is overlapped above and below the above-mentioned circuit substrate A1 to form a laminated formed product A3 for structural forming. And, Figure 1 Although only one stacked molded product A3 is described, a plurality of stacked molded products A3 may be placed on the mounting table 513 at the same time to be stacked and molded.

[0040] The stacked product A3 placed on the mounting table 513 is moved together with the upper and lower carrier films F1 and F2 as the winding rollers 611 and 613 are rotated and driven, and is transported and positioned in the chamber C of the vacuum laminating device 12 in an open state. Next, the vacuum laminating device 12 closes the chamber C and decompresses it by a vacuum pump (not shown) to form a vacuum state (decompressed state) in the chamber C. In addition, pressurized air is sent to the back side of the diaphragm 211 to expand the diaphragm 211 into the chamber C, and the stacked product A3 composed of the substrate A1 and the stacked film A2 is pressurized between the elastic sheet 216 of the hot plate 215 installed on the upper plate 212 side. At this time, the pressure (pressure per unit area applied to the laminated product A3) generated by the diaphragm 211 is 0.3 MPa to 1.5 MPa as an example, and the substrate A1 and the laminated film A2 are connected in the form of burying the laminated film A2 in the concave part of the substrate A1, and the laminated product A4 is laminated. However, the surface of the laminated film A2 of the primary laminated product A4 laminated by the vacuum lamination device 12 still imitates the shape of the concave and convex part of the substrate A1 and leaves the concave and convex state. In addition, at this time, when the inorganic material content of the laminated film used is high (for example, a laminated film with SiO2 of 35 to 75% by weight), it is easier to leave the concave and convex due to the low fluidity of the molten resin.

[0041] When the primary laminated product A4 having concavoconvex portions and composed of the laminated material A1 and the laminated film A2 and bonded together is laminated and formed in the vacuum laminating device 12, the chamber C is opened. Then, the primary laminated product A4 is conveyed between the upper plate 312 and the lower plate 314 of the first punching device 13 in the subsequent process by conveying the next carrier films F1 and F2 by the carrier film winding device 16, and stops at a predetermined pressurizing position.

[0042] Secondly, the servo motor 315 of the first punching device 13 is operated, and the lower plate 314 and the pressure block 323 rise to start the first punching process. In the first punching process, pressure control including position control elements is performed. Initially, the lower plate 314 and the pressure block 323 are moved and controlled at high speed by the servo motor 315 before the speed switching position P1 shortly before the pressure surface 327 abuts against the lower carrier film F1, or the position shortly before the upper carrier film F2 abuts against the pressure surface 327 on the upper plate 412 side. However, if the above-mentioned position is reached and detected by the rotary encoder 16, the linear scale 321, or the limit switch, the proximity switch, etc., it is moved and controlled at a low speed by the servo motor 315, and the situation of sudden overload can be reduced when the single-layered molded product A4 is clamped between the pressure surfaces 427, 427. The fact that the primary laminated molded product A4 is sandwiched between the pressurizing surfaces 427 , 427 can be grasped by detecting the torque of the servo motor 315 , or can be estimated by the fact that the primary laminated molded product A4 reaches a preset position P2 .

[0043] If the primary stacked molded product A4 is clamped by the pressurizing surfaces 427, 427, it is transferred to the first pressurizing process PR1 in the first punching process. In the first pressurizing process PR1, the value of the load sensor 320 is detected to perform feedback control by force control. The value of the force command signal output from the force command signal output unit 701 is compared with the value of the force signal detected by the load sensor 320 and added. In addition, since the first pressurizing process PR1 is only force control, the force position comparison switching unit 708 is passed as it is and is sent to the command signal generating unit 709 as a command value for speed control of the servo amplifier 317.

[0044] Furthermore, in the servo amplifier 317, the number of revolutions and the current value of the servo motor 315 are generated and sent to the servo motor 315. Furthermore, as described above, the control of the servo motor 315 is performed by force control, but the force can be converted into a pressure (surface pressure) per unit area applied to the primary stacked formed product A4 and expressed. In the stacking forming method of the present embodiment, the above-mentioned surface pressure is preferably 0.3MPa to 1.5MPa as an example, and in particular, the surface pressure is preferably lower than that of the vacuum stacking device 12. Furthermore, in the first pressurizing process PR1, the lower plate 314 and the pressurizing block 323 further rise to a predetermined position P3 (the same as the distance between the pressurizing surfaces 327 and 327) and are detected by the linear scale 321, or, if a predetermined time has passed, then the second processing process PR2 in the first stamping process is transferred. Alternatively, the detection value of at least one of the linear scale 321 or the rotary encoder 316 is transferred to the second pressurizing process PR2.

[0045] In the second pressurizing process PR2, pressurizing control is performed to make the position control element preferred. The value of the linear scale 321 is detected and feedback control of the position control (or speed control) is performed to the target position P4. The value of the command signal is output from the position command signal output unit 702, compared with the value of the position signal detected by the linear scale 321, and addition is performed. In addition, the value of the load sensor 320 is always detected and sent to the force position comparison switching unit 708 through the adder 706. In addition, a secondary threshold is set as an example in the detection value of the load sensor 320, and a subtraction is performed in the command value of the position control when the detection value of the load sensor 320 exceeds the initial threshold. In addition, when the detection value of the load sensor 320 exceeds the final threshold, the command value of the command signal of the position control is used as the command value subtracted from the previous command value, or the output of the position signal command value is stopped temporarily or before the second stamping process PR2 is completed.

[0046] In the second pressurizing process PR2, the speed control command value is also sent to the servo amplifier 317, and the current value is mainly controlled. The speed control using the rotary encoder 316 is performed between the servo amplifier 417 and the servo motor 415. Thus, in the second stamping process, the position of the lower plate 314 can be accurately controlled based on the value detected by the linear scale 321. And, if the position of the lower plate 314 becomes the target position P4, the servo motor 415 is controlled in a manner to maintain the current position (including servo locking, servo disconnection), and the secondary laminated molded product A5 with the correct plate thickness T1 is pressurized. However, in the case where a large position deviation is generated during position control and the pressurized primary laminated molded product A4 produces a pressure abnormality, the command value of the position is changed to the retreat side according to the above-mentioned force detection and the pressurization is stopped, so that the generation of defective products such as thickness reduction and lateral outflow of molten resin caused by overpressure can be prevented. Furthermore, in the second pressurizing step PR2, even if the target position (command position) cannot be reached (pressing is impossible) in the end, the plate thickness may be within the allowable range.

[0047] Furthermore, if the second pressurizing process PR2 is controlled by using the position control element, a control giving priority to force can be performed. As an example, in the force control in which the value of the load sensor 320 is detected in the same manner as in the first punching process, feedback control of position control can be added at a certain ratio. Alternatively, the speed control element can be added as a forward feedback control signal. The command value of the force signal output from the force command signal output unit 701 can also be changed in accordance with the position detected by the linear scale 321.

[0048] Furthermore, each pressurizing process of the first stamping process is not limited to the above, and can also be a process with more pressurizing processes. In addition, the pressurizing forming using position control elements in each process is also a position control element included in the broad sense even if the method uses the element of speed control for part or all. Moreover, the position control element including speed control can be an element for controlling the servo motor 315 by controlling any one of the control of the current value, the control of the voltage value, and the torque value. In addition, as a device corresponding to scheme 2 of the present invention, the first stamping device 13 using the servo motor 315 as a driving source can be a device that only performs force control in all pressurizing processes. Even in such a case, the force control performed by the first stamping device 13 using the servo motor 315 can perform high-precision pressurization control on a single stacked formed product compared to the pressure control of the stamping device using a hydraulic cylinder controlled by an existing general pressure control valve, and can also reduce thickness unevenness.

[0049] The temperature of the pressing blocks 322 and 323 of the first pressing device 13 at this time varies depending on the materials of the substrate A1 and the laminated film A2, and is not limited thereto, but is preferably controlled to 80°C to 200°C, more preferably 90°C to 150°C.

[0050] Furthermore, if the second pressurizing process PR2 of the first punching device 13 is completed after a predetermined time and the secondary stacked product A5 is stacked, the lower plate 314 descends. Since the surface of the secondary stacked product A5 formed at this time is pressurized by the pressurizing blocks 322 and 323 having an elastic metal plate 326 on the pressurizing surface 327 of the first punching device 13 through the buffer material 325, the concavoconvexities remaining on the surface of the primary stacked product A4 can be processed more flatly. Furthermore, through the next unwinding roller 511 and driven roller 512 performed by the carrier film winding device 16, the conveyance of the carrier film F1 and F2 performed by the unwinding roller 414 and driven roller 515, and the winding of the carrier film F1 and F2 by the winding rollers 611 and 613, the secondary stacked product A5 is transported between the upper plate 412 and the lower plate 414 of the second punching device 14 in the subsequent process of the first punching device 13, and stops at a predetermined pressurizing position.

[0051] Secondly, the servo motor 415 of the second punching device 14 is operated, and the control is the same as that of the first punching device 13. The lower plate 414 and the pressure block 423 rise at high speed, and switch to low speed at the speed switching position P11. Soon, at the contact point P12, the secondary stacked formed product A5 is clamped by the pressure surfaces 427 and 427. Pressurization forming including position control elements can also be performed in the second punching device 14. In the first processing step PR11 of the second punching device 14, a control similar to the second processing step PR2 of the first punching device 13 can be performed. That is, the position control of the servo motor 415 can be performed by detecting the position of the linear scale 421, etc., but the above-mentioned position command control signal (current value, etc.) is limited when the value of the load sensor 320 is detected and exceeds the threshold. In addition, if it is detected that the lower plate 414 or the pressure block 423 reaches the predetermined switching position P13 or it is detected that a predetermined time has passed, the first pressurization process PR11 ends and transfers to the second pressurization process PR12.

[0052] In the second pressurizing process PR12 of the second punching process, only the position of the linear scale 421 is detected to make the servo motor 415 move position control (or speed control). However, since the difference between the plate thickness of the secondary laminated molded product A5 pressurized by the second punching device 14 and the plate thickness of the laminated molded product A6 as the final product is extremely small, there will be no situation where the position deviation is too large even if it is only the position control, and the command signal such as the servo motor 315 is driven with an unexpectedly large force is sent. In addition, since the distance from the switching position P13 from the first pressurizing process PR11 to the second pressurizing process PR12 to the final pressurization end target position P14 becomes extremely small, there is almost no situation where the position deviation is too large even if it is only the position control, and the command signal such as the servo motor 315 is driven with an unexpectedly large force is sent. Therefore, the laminated molded product A6 as the final product can achieve extremely precise thickness accuracy, and can prevent the outflow of molten resin to the side of the laminated molded product A6. However, the second stamping process PR12 can also be set with restrictions such as the torque limit of the servo motor 415. In addition, if the position of the lower plate 314 reaches the final pressurization end target position P14, the servo motor 415 is controlled in a manner to maintain the current position (including servo locking and servo disconnection), and the laminated formed product A6 with the correct plate thickness T2 is pressurized. When the first stamping device reaches the final pressurization end target position and the pressurization ends, the position information of the lower plate detected by the position sensor such as the linear scale 421 is stored in the storage unit of the control device 17. In addition, in the above-mentioned embodiment, since the position sensor is installed between the upper plate and the lower plate, the distance between the upper plate and the lower plate can be measured and stored, but when a position sensor such as a linear scale is installed between the upper pressurization block and the lower pressurization block, the distance between the pressurization blocks is measured and stored. In addition, the distance between the fixed component such as the base side and the lower plate that is lifted and lowered can be detected by the position sensor. The distance between the upper plate and the lower plate, the distance between the upper and lower pressure blocks, and the distance between the fixing member on the base side and the lower plate correspond to the plate thickness of the secondary laminated product A5.

[0053] The temperature of the press blocks 422 and 423 of the second punching device 14 during the secondary press forming is different depending on the materials of the substrate A1 and the laminated film A2, and is not limited thereto, but is preferably controlled at 80° C. to 200° C., more preferably 90° C. to 150° C. It is possible that the temperature is preferably the same as that of the press blocks 322 and 323 of the first punching device 13, or the temperature of the press blocks 422 and 423 of the second punching device 14 is lower.

[0054] When the second punching device 14 reaches the final pressurization end target position P14 after a predetermined time, the lower plate 314 descends. At this time, the plate thickness T2 of the formed laminated molded product A6 becomes the correct thickness by performing the second pressurization by position control. In addition, only when there are concave and convex on the surface of the secondary laminated molded product A5, it can be processed more flatly. In addition, the final laminated molded product A6 is transported to the take-out table 615 of the second punching device 14 in the subsequent process by the carrier film winding device 16, and is transported to the next process by a device not shown in the figure.

[0055] Furthermore, as long as the first punching process and the second punching process performed by the second punching device 14 contain at least a position control element like the second punching process PR2 of the first punching device 13, it can be a process that only performs position control (or speed control) from the beginning, or a process that detects force and is used for control. In addition, regarding the position control of the second punching device 14, the final pressurization end target position of the second punching device can be determined based on the distance between the upper plate and the lower plate of the punching device at the end of the pressurization performed by the first punching device, or the distance between the pressurization blocks, etc. (the plate thickness of the intermediate laminated product A5). In this way, by positionally controlling the second punching device based on the plate thickness of the intermediate laminated product A5, it is possible to directly determine which thickness of the laminated product A6 as the final product is thinner than the plate thickness of the secondary laminated product A5 that ends the pressurization by the first punching device, and it is possible to prevent insufficient pressing and excessive pressing in the second punching device.

[0056] In addition, the stacking forming system 1 of the first embodiment is superior in the following aspects in comparison with a stacking forming system in which a single punching device is provided in the post-process of the vacuum stacking device and has force control (or pressure control) and position control elements. That is, by using a continuous first punching device 13 and a second punching device 14 to perform press forming of the position control element respectively, it is possible to process the desired plate thickness in two stages. Therefore, compared with a stacking forming system in which a single punching device is used to form a desired plate thickness, since press forming can be performed without performing ineffective processing, it is possible to prevent the molten resin from flowing out to the side of the stacked formed product. In addition, in the stacking forming of the substrate, the time required for press forming by the punching device is often longer than the time required for stack forming by the vacuum stacking device 1, but by making the punching device two consecutive punching devices, the time required for press forming by the punching device can be divided into the respective punching devices 13 and 14. Therefore, the cycle time of stack forming for each batch can be shortened.

[0057] In addition, the second punching device 14 is a device corresponding to the second embodiment of the present invention, and it is also possible to perform only the force control of the servo motor 415 in all the pressurizing processes. Even in this case, the force control performed by the second punching device 14 using the servo motor 415 can perform high-precision pressurization control with respect to the secondary laminated molded product A5, and the thickness unevenness is also reduced, compared with the pressure control of the existing punching device using a hydraulic cylinder controlled by a general pressure control valve.

[0058] Next, regarding the stacking molding system 2 of the second embodiment, refer to Figure 5 The explanation will be centered around the differences. The stacking forming system 2 of the second embodiment is common in that it is provided in the post-process of the above-mentioned vacuum stacking device 22 and has at least two continuous process stamping devices with position control elements, a method for conveying stacked formed parts, etc. In addition, the structures of the chassis 2311, the upper plate 2312, the pull rod 2313, and the lower plate 2314 of the first stamping device 23 and the second stamping device 24, and the structures of the pressure blocks 2322 and 2323, etc. are also common. The difference between the first stamping device 13 and the second stamping device 14 of the first embodiment and the first stamping device 23 and the second stamping device 24 of the second embodiment lies in the pressure mechanism.

[0059] In the first stamping device 23, a pressurizing cylinder 2315 that is actuated by hydraulic pressure is provided in the chassis 2311 as a pressurizing mechanism, and a slider 2316 of the pressurizing cylinder 2315 is fixed to the back of the lower plate 2314. Furthermore, the pressurizing cylinder 2315 is connected to a hydraulic device 2317 including a valve that can be closed-loop controlled, such as a servo valve not shown. In addition, the pressurizing cylinder 2315 can detect the pressure of the operating oil through a pressure sensor. Furthermore, the hydraulic device 2317 including the above-mentioned pressure sensor is connected to the control device 17. In addition, a pressure sensor is installed between the upper plate 2312 and the lower plate 2314 of the first stamping device 23. Figure 1 The same linear scale 2318. In addition, the linear scale 2318 is connected to the control device 17 and can detect the distance between the upper plate 2312 and the lower plate 2314.

[0060] In addition, the structure of the second punching device 24 is the same as that of the first punching device 23, and a pressurizing cylinder 2415 that is hydraulically actuated is provided in the chassis 2411 as a pressurizing mechanism, and a slider 2416 of the pressurizing cylinder 2415 is fixed to the back of the lower plate 2414. In addition, the pressurizing cylinder 2415 is connected to a hydraulic device 2417 of a valve that can be closed-loop controlled, including a servo valve not shown in the figure. In addition, the pressurizing cylinder 2415 can detect the operating pressure through a pressure sensor. In addition, the hydraulic device 2417 including the above-mentioned pressure sensor is connected to the control device 17. In addition, a linear scale 2418 that is the same as the first punching device 23 is installed between the upper plate 2412 and the lower plate 2414 of the second punching device 24. In addition, the linear scale 2418 is connected to the control device 17, and can detect the distance between the upper plate 2412 and the lower plate 2414.

[0061] The primary stacked product A4 stacked in the vacuum stacking device 22 is conveyed to the first punching device 23 and stacked to form a secondary stacked product A5 in the same manner as the stacking system 1 of the first embodiment, and is conveyed to the second punching device 24 and stacked to form a stacked product A6. Since the stacking forming method in the first punching device 23 and the second punching device 24 in the stacking forming system 2 of the second embodiment is the same as the stacking forming method in the stacking forming system 1 of the first embodiment in most parts, the description of the first embodiment is cited. If the difference is recorded, in the first embodiment, the value of the load sensor 320 and the like is detected and the force control of the servo motor 315 is performed, and in the second embodiment, the pressure control of the pressurizing cylinder 2415 is performed in the aspect of detecting the value of the pressure sensor. That is, when a servo valve is used, pressure closed-loop control using the value of the pressure sensor through the servo valve and closed-loop control of the position (or speed) using the linear scale 2418 can be performed.

[0062] In addition, the present invention is a method of mixing the stacking forming system 1 of the first embodiment with the stacking forming system 2 of the second embodiment, and the first punching device can be a punching device that uses a hydraulic pressure cylinder and has a position control element, and the second punching device can be a punching device that uses a servo motor and has a position control element. In addition, the first punching device can be a punching device that uses a servo motor and other motors, and the second punching device can be a punching device that uses a hydraulic pressure cylinder and other fluids.

[0063] Next, regarding the stacking molding system 3 of the third embodiment, refer to Figure 6The explanation will be centered on the differences. The third embodiment is a method of performing a pressurization control including at least a position control element in a stamping device having a final process and a stamping device that is continuous with the previous process of the stamping device of the final process. Specifically, the first stamping device 33 disposed in the subsequent process immediately after the vacuum laminating device 32 is provided with a stamping device that only performs pressure control using a pressurization cylinder 3311 such as hydraulic pressure. The first stamping device 33 may be a structure in which rubber is pasted on the flat pressurization surface of the processing block. In addition, the second stamping device 34 and the third stamping device 35 are provided with stamping devices that use motors such as servo motors 3411, 3511 and have position control elements. Therefore, the "continuous stamping process of the subsequent process of the vacuum laminating device" of the present invention is sufficient as long as the stamping processes performed by the stamping device are continuous as the stamping process of the Nth item and the stamping process of the N+1th item. Therefore, the stamping device of the process that is continuous with the vacuum laminating device 32 immediately after also includes a case where a pressurization control including at least a position control element is not performed. In addition, the “continuous stamping steps” may include steps other than the stamping step between stamping steps.

[0064] Furthermore, the pressure surface of the third punching device 35 is provided with the same buffer material and elastic metal plate as the first punching device 33 and the second punching device 34. In addition, the third punching device 35 can make the thickness of the buffer material thinner than the buffer material of the second punching device 34, make the hardness of the buffer material higher than that of the second punching device 34, and reduce the buffer effect compared with the second punching device 34. In addition, the third punching device 35 can be a structure in which no buffer material is provided, and the metal thin plate is installed on the metal pressure plate or the above-mentioned metal plate, and the metal thin plate becomes the pressure surface. In addition, the third punching device 35 can also be controlled in a manner that the temperature of the pressure plate of the third punching device 35 is lower than the temperature of the pressure plate of the second punching device 34 as a cooling stamping for cooling the stacked formed product in particular.

[0065] Furthermore, when the third punching device 35 is a cooling punching device and only needs to contact the stacked molded product A6 with a slight pressure surface, there is a case where the third punching device 35 does not need a position control element. In this case, the first punching process performed by the first punching device 33 immediately after the vacuum lamination device 32 and the second punching process performed by the second punching device 34 arranged continuously with the first punching device 33 are controlled by at least the position control element.

[0066] The present invention will not be listed one by one, and is not limited to the above-mentioned first and second embodiments. The method of making changes based on the purpose of the present invention by those skilled in the art and the method of combining the contents of the first to third embodiments may also be applicable. The stacked molded products stacked in the stacking molding systems 1, 2, and 3 may be semiconductor wafers or other plate-like bodies in addition to circuit substrates, but are not limited to this. In addition, the surface of the stacking material such as the stacking film may be either a single side of the substrate or a wafer, or both sides. It may also be an LED substrate, etc. According to the present invention, even if the chip (convex portion) height of the substrate is 0.1 mm or more and the thickness of the stacked resin film is 0.15 mm or more, good stacking molding can be performed in many cases.

Claims

1. A stacking forming system comprising a vacuum stacking device and a punching device, wherein the stacking forming system comprises: A vacuum lamination device for producing a laminated molded product in a vacuum chamber; and At least two continuous punching devices having position control elements and arranged in the post-process of the vacuum laminating device, The punching device has: A force detection mechanism that detects the force of the pressure block pressing the laminated molded product; A position detection mechanism, which detects the position of the pressure block; A sequential control unit that performs the following steps in stages: a first pressurizing step of pressing the stacked molded product by force control based on the force detected by the force detection mechanism; and a second pressurizing step that is performed after the first pressurizing step of pressing the stacked molded product by the position control based on the position detected by the position detection mechanism; and A force-position comparison switching unit controls the output of the position control command value to be a command value obtained by subtracting the previous command value, or temporarily stops the output of the position control command value when the force detected by the force detection mechanism exceeds a threshold value.

2. The stacking forming system according to claim 1, characterized in that: The above-mentioned punching device uses a servo motor as a driving source.

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