Semiconductor cleaning apparatus

Abstract

This application discloses a semiconductor cleaning apparatus, including a carrier, a first cleaning arm, a second cleaning arm, and a drive mechanism. The carrier is used to hold a wafer. The first cleaning arm has a first nozzle, through which it sprays a first cleaning medium onto the wafer. The second cleaning arm has a second nozzle, through which it sprays a second cleaning medium onto the wafer. The semiconductor cleaning apparatus has a first operating mode and a second operating mode. In the first operating mode, the output end of the drive mechanism moves to a position capable of driving the first cleaning arm, and the movement trajectory of the first nozzle is at least partially above the carrier. In the second operating mode, the output end of the drive mechanism moves to a position capable of driving the second cleaning arm, and the movement trajectory of the second nozzle is at least partially above the carrier. This design simplifies the structural layout.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor cleaning device. Background Technology

[0002] In the semiconductor chip manufacturing process, wafers undergoing various processes (such as etching and heat treatment) require cleaning to ensure a high degree of cleanliness on their surfaces. Specifically, the cleaning equipment sequentially sprays a cleaning medium (such as ultrapure water) and nitrogen gas onto the wafer. The cleaning medium removes residual impurities, while the nitrogen gas dries the wafer.

[0003] In related technologies, cleaning equipment includes at least two cleaning arms, one for spraying a cleaning medium and the other for spraying nitrogen gas. To ensure uniform spraying, the cleaning equipment also includes a drive mechanism for rotating the cleaning arms, causing the nozzles at the ends of the cleaning arms to reciprocate in an arc trajectory above the wafer, thereby achieving uniform spraying on the wafer surface.

[0004] It is evident that the relevant cleaning equipment is equipped with multiple drive mechanisms, which makes it difficult to meet the ever-increasing demands for structural compactness and space utilization. Summary of the Invention

[0005] This application discloses a semiconductor cleaning apparatus to simplify the structural layout.

[0006] To solve the above problems, this application adopts the following technical solution:

[0007] This application provides a semiconductor cleaning apparatus, including a support, a first cleaning arm, a second cleaning arm, and a drive mechanism, wherein:

[0008] The support is used to place the wafer;

[0009] The first cleaning arm has a first nozzle, through which the first cleaning arm sprays a first cleaning medium onto the wafer; the second cleaning arm has a second nozzle, through which the second cleaning arm sprays a second cleaning medium onto the wafer.

[0010] The semiconductor cleaning equipment has a first working mode and a second working mode. When the semiconductor cleaning equipment is in the first working mode, the output end of the drive mechanism moves to a position that can drive the first cleaning arm, and the movement trajectory of the first nozzle is at least partially located above the support. When the semiconductor cleaning equipment is in the second working mode, the output end of the drive mechanism moves to a position that can drive the second cleaning arm, and the movement trajectory of the second nozzle is at least partially located above the support.

[0011] The technical solution adopted in this application can achieve the following beneficial effects:

[0012] The semiconductor cleaning equipment disclosed in this application has a first operating mode and a second operating mode. In the first operating mode, the output end of the drive mechanism moves to a position capable of driving the first cleaning arm, thereby allowing the first cleaning medium to be sprayed onto the wafer from the first nozzle. In the second operating mode, the output end of the drive mechanism can move to a position capable of driving the second cleaning arm, thereby allowing the second cleaning medium to be sprayed onto the wafer from the second nozzle. Therefore, by switching between different operating modes of the semiconductor cleaning equipment, the drive mechanism of this application can change the position of its output end to drive the corresponding cleaning arm, thereby spraying the required cleaning medium onto the wafer.

[0013] Compared to related technologies, the semiconductor cleaning equipment of this application is equipped with only one drive mechanism while ensuring that it can spray different cleaning media. This undoubtedly simplifies the internal structural layout of the semiconductor cleaning equipment, thereby improving structural compactness and space utilization. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a schematic diagram of the semiconductor cleaning equipment disclosed in the embodiments of this application;

[0016] Figure 2 This is a schematic diagram of the structure of the first cleaning arm, the second cleaning arm, and the drive mechanism disclosed in the embodiments of this application;

[0017] Figure 3 This is a schematic diagram showing the engagement relationship between the drive mechanism and the first cleaning arm as disclosed in an embodiment of this application.

[0018] Figure 4 This is a schematic diagram showing the cooperation relationship between the drive mechanism and the second cleaning arm disclosed in the embodiments of this application;

[0019] Figure 5 and Figure 6 These are schematic diagrams of the first and second driving components disclosed in the embodiments of this application from different perspectives.

[0020] Figure 7 This is a schematic diagram of the structure of a second driving component disclosed in an embodiment of this application;

[0021] Figure 8 for Figure 2A sectional view along the CC direction.

[0022] Explanation of reference numerals in the attached figures:

[0023] 110 - Cleaning chamber, 120 - Bottom chamber, 200 - Support seat

[0024] 300 - First cleaning arm, 310 - First nozzle, 400 - Second cleaning arm, 410 - Second nozzle

[0025] P1 - Main body section, P11 - Arm main body, P12 - Transfer pipe, P13 - Flexible inner tube, P14 - Clamping block, P2 - Bending section

[0026] 500-Drive mechanism, 510-First drive assembly, 511-First gear, 512-First drive device, 513-Right-angle gearbox, 520-First transmission assembly, 521-First worm, 522-First worm wheel, 523-Second gear, 530-Second transmission assembly, 531-Second worm, 532-Second worm wheel, 533-Third gear, 540-Second drive assembly, 541-Cylinder block, 542-Drive unit, 501-First base plate, 502-Second base plate, 503-Third base plate, 504-First bearing, 505-First fastener, 506-Limiting plate, 507-Second fastener, 508-Adapter plate,

[0027] 600 - Second bearing, W - Wafer. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0030] In order to solve the technical problem of poor structural compactness and space utilization caused by configuring multiple drive mechanisms in semiconductor cleaning equipment of related technologies, this application provides a semiconductor cleaning equipment.

[0031] Please see Figures 1 to 8 The semiconductor cleaning equipment disclosed in this application includes a support 200, a first cleaning arm 300, a second cleaning arm 400, and a drive mechanism 500.

[0032] The semiconductor cleaning equipment may further include a cleaning chamber 110 and a bottom cavity 120. The cleaning chamber 110 and bottom cavity 120 are the basic components of the semiconductor cleaning equipment, providing a mounting base for other components and also offering some protection. Specifically, the cleaning chamber 110 and bottom cavity 120 are arranged sequentially from top to bottom along the height direction of the semiconductor cleaning equipment. The cleaning chamber 110 provides a dedicated cleaning space for the wafer W, and the support 200 is disposed within the cleaning chamber 110. The bottom cavity 120 can be used to accommodate components such as the drive mechanism 500. In some embodiments, both the first cleaning arm 300 and the second cleaning arm 400 may be located outside the cleaning chamber 110 and the bottom cavity 120.

[0033] The carrier 200 is used to place the wafer W to be processed, thereby supporting the wafer W. Optionally, the carrier 200 may be provided with a chuck for fixing the wafer W, thereby improving the placement reliability of the wafer W.

[0034] The first cleaning arm 300 has a first nozzle 310, through which the first cleaning arm 300 sprays a first cleaning medium onto the wafer W; the second cleaning arm 400 has a second nozzle 410, through which the second cleaning arm 400 sprays a second cleaning medium onto the wafer W. The first cleaning arm 300 and the second cleaning arm 400 are respectively connected to corresponding cleaning medium supply sources, both of which can be used to transport the cleaning medium, which is output from the first nozzle 310 and the second nozzle 410, respectively.

[0035] This embodiment does not limit the specific types of the first cleaning medium and the second cleaning medium. For example, the first cleaning medium and the second cleaning medium can be different types of cleaning solutions, or one can be a cleaning solution and the other can be ultrapure water, or one can be ultrapure water and the other can be a dry gas (e.g., nitrogen).

[0036] Meanwhile, the semiconductor cleaning equipment has a first operating mode and a second operating mode, such as Figure 3 As shown, when the semiconductor cleaning equipment is in the first working mode, the output end of the drive mechanism 500 moves to a position where the first cleaning arm 300 can be driven, and the movement trajectory of the first nozzle 310 is at least partially located above the support 200 to ensure that the spraying range of the first cleaning medium covers the wafer W.

[0037] like Figure 4 As shown, when the semiconductor cleaning equipment is in the second operating mode, the output end of the drive mechanism 500 moves to a position where the second cleaning arm 400 can be driven, and the movement trajectory of the second nozzle 410 is at least partially above the support 200 to ensure that the spray range of the second cleaning medium covers the wafer W. Furthermore, the spray range of the first and second cleaning media can also be adjusted to cover the wafer W by adjusting the orientation of the first nozzle 310 and the second nozzle 410.

[0038] In this structural layout, when the semiconductor cleaning equipment is in the first working mode, the output end of the drive mechanism 500 moves to a position that can drive the first cleaning arm 300, so that the first cleaning medium can be sprayed onto the wafer W by the first nozzle 310; when the semiconductor cleaning equipment is in the second working mode, the output end of the drive mechanism 500 moves to a position that can drive the second cleaning arm 400, so that the second cleaning medium can be sprayed onto the wafer W by the second nozzle 410. It can be seen that by switching between different working modes of the semiconductor cleaning equipment, the drive mechanism 500 of this embodiment can change the position of its output end to drive the corresponding cleaning arm, thereby spraying the required cleaning medium onto the wafer W.

[0039] Compared to related technologies, the semiconductor cleaning equipment of this application embodiment is equipped with only one drive mechanism 500 while ensuring that it can spray different cleaning media. This undoubtedly simplifies the internal structural layout of the semiconductor cleaning equipment, thereby improving structural compactness and space utilization.

[0040] It should be noted that, in the semiconductor cleaning equipment of this embodiment, the carrier 200 can be configured to be rotatable during the process, thereby driving the wafer W to rotate. In this case, when the cleaning medium is sprayed onto the wafer W through the first cleaning arm 300 or the second cleaning arm 400, the cleaning medium can be sprayed onto different areas of the wafer W, thereby improving the cleaning effect.

[0041] In an optional embodiment, the first cleaning arm 300 and the second cleaning arm 400 can move linearly when spraying the cleaning medium. In another embodiment, such as... Figure 1 As shown, the drive mechanism 500 drives the first cleaning arm 300 to rotate around the first axis A, and the first nozzle 310 to make an arc motion around the first axis A; the drive mechanism 500 drives the second cleaning arm 400 to rotate around the second axis B, and the second nozzle 410 to make an arc motion around the second axis B.

[0042] With this structural layout, the movement trajectories of the first cleaning arm 300 and the second cleaning arm 400 can be circular arc trajectories. In other words, the orthogonal projections of the movement trajectories of the first cleaning arm 300 and the second cleaning arm 400 on the wafer W can both be circular arc trajectories. Compared with straight line trajectories, this can significantly increase the spraying range of the cleaning medium, thereby improving the spraying uniformity.

[0043] In an optional embodiment, the drive mechanism 500 may include a drive motor and a transmission rod, wherein a first bevel gear and a second bevel gear are spaced apart on the transmission rod, a third bevel gear is provided on the first cleaning arm 300, and a fourth bevel gear is provided on the second cleaning arm 400. When the semiconductor cleaning equipment is in a first working mode, the first bevel gear meshes with the third bevel gear, and when the semiconductor cleaning equipment is in a second working mode, the second bevel gear meshes with the fourth bevel gear; the drive motor drives the transmission rod to rotate.

[0044] In another implementation, such as Figures 2-4 As shown, the drive mechanism 500 includes a first drive assembly 510, a first transmission assembly 520, and a second transmission assembly 530. The first transmission assembly 520 may include a first worm 521 and a first worm wheel 522, with the first worm wheel 522 connected to the first cleaning arm 300 and the first worm 521 meshing with the first worm wheel 522. The second transmission assembly 530 may include a second worm 531 and a second worm wheel 532, with the second worm wheel 532 connected to the second cleaning arm 400 and the second worm 531 meshing with the second worm wheel 532. The first drive assembly 510 is used to drive either the first worm 521 or the second worm 531.

[0045] It should be understood that, in this embodiment, the output terminal of the first drive component 510 is the same as the output terminal of the drive mechanism 500. Under this structural layout, as... Figure 3 As shown, when the semiconductor cleaning equipment is in the first working mode, the output end of the first drive component 510 drives the first worm gear 521, and the first worm wheel 522 rotates with the first worm gear 521, thereby driving the first cleaning arm 300 to rotate, so that the first nozzle 310 sprays the first cleaning medium on the wafer W in an arc trajectory; as shown Figure 4 As shown, when the semiconductor cleaning equipment is in the second working mode, the output end of the first drive component 510 drives the second worm gear 531, and the second worm wheel 532 rotates with the second worm gear 531, thereby driving the second cleaning arm 400 to rotate, so that the second nozzle 410 sprays the second cleaning medium on the wafer W in an arc trajectory.

[0046] In this embodiment, both the first transmission component 520 and the second transmission component 530 constitute a worm gear mechanism. While achieving separate transmission and driving functions, the worm gear mechanism has a self-locking mechanism. That is, the first worm wheel 522 cannot drive the first worm 521 to rotate in the reverse direction, and the second worm wheel 532 cannot drive the second worm 531 to rotate in the reverse direction. In this case, even if the semiconductor cleaning equipment vibrates during the cleaning process, the locked state of the first worm wheel 522 (or the second worm wheel 532) will prevent the rotation of the first cleaning arm 300 (or the second cleaning arm 400), ensuring that the first cleaning arm 300 (or the second cleaning arm 400) is in a preset position within its rotation stroke, thereby preventing damage caused by excessive rotation due to misalignment.

[0047] In an optional embodiment, the drive mechanism 500 further includes a second drive component 540, which is connected to the first drive component 510 and is used to drive the first drive component 510 to move between a first position and a second position to change the position of the output end of the first drive component 510. When the first drive component 510 is in the first position, the output end of the first drive component 510 is connected to the first worm gear 521. When the first drive component 510 is in the second position, the output end of the first drive component 510 is connected to the second worm gear 531.

[0048] In this structural layout, the semiconductor cleaning equipment can be easily switched between the first and second operating modes via the second drive component 540. When it is necessary to switch the semiconductor cleaning equipment to the first operating mode, the second drive component 540 can drive the first drive component 510 to the first position. At this time, the output end of the first drive component 510 can drive the first worm gear 521, thereby driving the first cleaning arm 300 to rotate through the first worm wheel 522, so as to spray the first cleaning medium onto the wafer W. When it is necessary to switch the semiconductor cleaning equipment to the second operating mode, the second drive component 540 can drive the first drive component 510 to the second position. At this time, the output end of the first drive component 510 can drive the second worm gear 531, thereby driving the second cleaning arm 400 to rotate through the second worm wheel 532, so as to spray the second cleaning medium onto the wafer W.

[0049] The second drive component 540 can be selected from cylinders, linear motors, etc.

[0050] Among the optional solutions, such as Figure 3 and Figure 4As shown, the first drive assembly 510 includes a first gear 511 disposed at its output end, the first transmission assembly 520 includes a second gear 523 disposed on the first worm 521, and the second transmission assembly 530 includes a third gear 533 disposed on the second worm 531; the first gear 511 moves between the second gear 523 and the third gear 533 with the first drive assembly 510; when the first drive assembly 510 is in the first position, the first gear 511 meshes with the second gear 523; when the first drive assembly 510 is in the second position, the first gear 511 meshes with the third gear 533.

[0051] In this structural layout, when the semiconductor cleaning equipment is in different operating modes, the first gear 511 located at the output end of the first drive assembly 510 moves between the second gear 523 and the third gear 533. The first drive assembly 510 can drive the first gear 511 to rotate. When the first drive assembly 510 is in the first position, the first gear 511 can drive the second gear 523 to rotate, and the first worm 521 rotates with the second gear 523. When the first drive assembly 510 is in the second position, the first gear 511 can drive the third gear 533 to rotate, and the second worm 531 rotates with the third gear 533. It should be understood that gear transmission has the advantages of high transmission accuracy, high transmission efficiency, and good reliability.

[0052] In embodiments of the semiconductor cleaning apparatus that include a cleaning chamber 110 and a bottom chamber 120, such as Figures 2-4 As shown, the drive mechanism 500 may further include a first substrate 501, a second substrate 502, and a third substrate 503. The first substrate 501 is disposed on the cavity wall of the bottom cavity 120. The second drive assembly 540, the second substrate 502, and the third substrate 503 are all disposed on the first substrate 501. The second substrate 502 and the third substrate 503 are disposed opposite to each other on both sides of the first cleaning arm 300 and the second cleaning arm 400. The first worm 521 and the second worm 531 can be rotatably passed through the second substrate 502 and the third substrate 503. Specifically, they can be connected to the second substrate 502 and the third substrate 503 through the first bearing 504 to ensure that the first worm 521 and the second worm 531 can rotate smoothly.

[0053] In this structural layout, the first substrate 501, the second substrate 502, and the third substrate 503 provide mounting bases for the second drive assembly 540, the first worm gear 521, and the second worm gear 531.

[0054] Furthermore, such as Figure 3 and Figure 4As shown, the drive mechanism 500 may further include a first fastener 505, which is disposed on the second substrate 502 and the third substrate 503 and engages with the first bearing 504 for limiting. Specifically, the first fastener 505 abuts against the outer ring of the first bearing 504 to axially limit the first bearing 504. The drive mechanism 500 may further include a limiting plate 506 and a second fastener 507. The ends of the first worm 521 and the second worm 531 are provided with the limiting plate 506 via the second fastener 507, and the limiting plate 506 also engages with the first bearing 504 for limiting. Specifically, the limiting plate 506 abuts against the inner ring of the first bearing 504, thereby axially limiting the first worm 521 and the second worm 531. Furthermore, as... Figure 3 As shown, in an embodiment where the first worm 521 is provided with a second gear 523 and the second worm 531 is provided with a third gear 533, the limiting plate 506 can also cooperate with the second gear 523 and the third gear 533 to limit the second gear 523 and the third gear 533 axially.

[0055] Among the optional solutions, such as Figure 1 , Figure 5 and Figure 6 As shown, the first drive assembly 510 includes a first drive device 512 and a right-angle gearbox 513. The output end of the first drive device 512 is arranged along the height direction of the semiconductor cleaning equipment. The input end of the right-angle gearbox 513 is connected to the output end of the first drive device 512. The output end of the right-angle gearbox 513 is arranged in a first plane and is used to drive the first worm gear 521 or the second worm gear 531. The first plane is perpendicular to the height direction of the semiconductor cleaning equipment.

[0056] It should be understood that in this embodiment, the output end of the right-angle gearbox 513 is the same as the output end of the drive mechanism 500. The input and output ends of the right-angle gearbox 513 form a 90° angle. In this case, even if the first drive unit 512 and the right-angle gearbox 513 are arranged along the height direction of the semiconductor cleaning equipment, the first drive assembly 510 can still output drive action along the direction of the first plane, without needing to arrange the first drive unit 512 and the gearbox sequentially along the first plane as in related technologies. This reduces the horizontal space occupied by the first drive assembly 510, allowing it to utilize the ample vertical space within the process chamber, thereby improving space utilization.

[0057] like Figures 5-7As shown, in an embodiment where the second drive assembly 540 is a cylinder, it includes a cylinder body 541 and a drive unit 542, which refers to a piston rod. Specifically, the cylinder body 541 is connected to the first base plate 501, and the drive unit 542 is connected to a right-angle gearbox 513 via an adapter plate 508. The extension and retraction of the drive unit 542 drives the right-angle gearbox 513, thereby changing the position of the output end of the first drive assembly 510. Further, in embodiments where the first drive assembly 510 includes a first gear 511, the first transmission assembly 520 includes a second gear 523, and the second transmission assembly 530 includes a third gear 533, the extension and retraction of the drive unit 542 drives the right-angle gearbox 513, which in turn drives the first gear 511 to move between the second gear 523 and the third gear 533.

[0058] In embodiments of the semiconductor cleaning apparatus that include a cleaning chamber 110 and a bottom chamber 120, such as Figure 1 As shown, both the first cleaning arm 300 and the second cleaning arm 400 may include a main body segment P1 and a bent segment P2. The first end of the main body segment P1 is connected to the drive mechanism 500, and the second end of the main body segment P1 extends into the cleaning chamber 110. The first end of the bent segment P2 is connected to the second end of the main body segment P1, and the second end of the bent segment P2 is bent toward the support seat 200.

[0059] In this structural layout, the cleaning chamber 110 provides a cleaning space for the wafer W, while the drive mechanism 500 is located within the bottom chamber 120, avoiding rinsing and corrosion by the cleaning medium. The bent section P2 is bent relative to the main body section P1, ensuring that the first nozzle 310 and the second nozzle 410 above the wafer W are arranged towards the support 200, allowing the first and second cleaning media to be smoothly sprayed onto the wafer W. Further, as... Figure 8 As shown, the semiconductor process equipment also includes a second bearing 600 installed in the process chamber, and the second bearing 600 is coaxially sleeved on the main body section P1. With this configuration, the second bearing 600 can provide support for the main body section P1 to ensure that the first cleaning arm 300 and the second cleaning arm 400 can achieve stable and reliable rotation.

[0060] Among the optional solutions, such as Figure 2 and Figure 8 As shown, the main body segment P1 may include an arm body P11, a transfer tube P12, and a flexible inner tube P13. The arm body P11 is connected to and fixedly connected to the transfer tube P12. The flexible inner tube P13 passes through the arm body P11 and the transfer tube P12. The transfer tube P12 is used to connect to the drive mechanism 500.

[0061] In this structural layout, the flexible inner tube P13 is used to transport the cleaning medium. As a continuous pipe, the flexible inner tube P13 effectively prevents leakage of the cleaning medium, and its flexibility allows it to adapt well to the structural layout inside the process chamber. Both the arm body P11 and the transfer pipe P12 protect the flexible inner tube P13. Specifically, the arm body P11 prevents substances in the cleaning chamber 110 from adhering to the surface of the flexible inner tube P13 and causing corrosion. The transfer pipe P12 can replace the flexible inner tube P13 and connect to the drive mechanism 500, making it easier for the drive mechanism 500 to apply a driving action to the cleaning arm.

[0062] In this embodiment, such as Figure 8 As shown, the second bearing 600 is mounted on the adapter pipe P12.

[0063] Furthermore, the main body section P1 may also include a clamping block P14, which can be docked with the adapter pipe P12 to form a stepped hole. The arm body P11 is located on the stepped surface in the stepped hole and is fixed by the clamping block P14 and the inner wall of the adapter pipe P12, thereby optimizing the connection reliability of each structure in the main body section P1.

[0064] Among the optional solutions, such as Figures 2-4 As shown, the first worm 521 and the second worm 531 are arranged symmetrically and parallelly on both sides of the first cleaning arm 300 and the second cleaning arm 400. The meshing area between the first worm 521 and the first worm wheel 522 is located in the plane where the first worm 521 and the second worm 531 are located, and the meshing area between the second worm 531 and the second worm wheel 532 is located in the plane where the first worm 521 and the second worm 531 are located.

[0065] In this structural layout, the meshing areas inside the two worm gear mechanisms are arranged coplanarly with the first worm 521 and the second worm 531. That is, the first worm 521, the second worm 531, the first worm wheel 522, and the second worm wheel 532 are roughly located at the same height. The first worm wheel 522 and the second worm wheel 532 make full use of the space between the first worm 521 and the second worm 531, thereby significantly improving the structural compactness and space utilization.

[0066] Among the optional solutions, such as Figures 1-4The first worm 521 and the second worm 531 both extend in the horizontal plane, and the first worm wheel 522 and the second worm wheel 532 are both arranged vertically. With this arrangement, the first worm 521 and the first worm wheel 522 are roughly perpendicular, and the second worm 531 and the second worm wheel 532 are also roughly perpendicular. This facilitates the installation of the worm gear mechanism and allows the main body segment P1 of the first cleaning arm 300 and the second cleaning arm 400 to extend vertically. This ensures that the first axis A and the second axis B are arranged vertically, thereby facilitating the control of the spray direction and angle of the first nozzle 310 and the second nozzle 410.

[0067] In an optional configuration, the projections of the motion trajectories of both the first nozzle 310 and the second nozzle 410 can pass through the center of the wafer W. With this configuration, the projections of the motion trajectories of the first nozzle 310 and the second nozzle 410 onto the wafer W begin at one edge of the wafer W, pass through the center of the wafer W, and reach the other edge of the wafer W. This ensures that the cleaning medium is sprayed roughly along the central area of ​​the wafer W, thus avoiding significant deviation in the spray area on the wafer W that could lead to poor cleaning quality. Therefore, this structural layout effectively improves the cleaning quality.

[0068] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0069] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application.

Claims

1. A semiconductor cleaning device, characterized in that, It includes a support base, a first cleaning arm, a second cleaning arm, and a drive mechanism, wherein: The support is used to place the wafer; The first cleaning arm has a first nozzle, through which the first cleaning arm sprays a first cleaning medium onto the wafer; the second cleaning arm has a second nozzle, through which the second cleaning arm sprays a second cleaning medium onto the wafer. The semiconductor cleaning equipment has a first working mode and a second working mode. The drive mechanism can change the position of its output end to drive the corresponding cleaning arm, thereby spraying the required cleaning medium onto the wafer. When the semiconductor cleaning equipment is in the first working mode, the output end of the drive mechanism moves to a position that can drive the first cleaning arm to move, and the movement trajectory of the first nozzle is at least partially above the support. When the semiconductor cleaning equipment is in the second working mode, the output end of the drive mechanism moves to a position that can drive the second cleaning arm to move, and the movement trajectory of the second nozzle is at least partially above the support.

2. The semiconductor cleaning equipment according to claim 1, characterized in that, The drive mechanism drives the first cleaning arm to rotate around the first axis, and the first nozzle to perform an arc motion around the first axis; the drive mechanism drives the second cleaning arm to rotate around the second axis, and the second nozzle to perform an arc motion around the second axis.

3. The semiconductor cleaning equipment according to claim 2, characterized in that, The drive mechanism includes a first drive assembly, a first transmission assembly, and a second transmission assembly, wherein: The first transmission assembly includes a first worm and a first worm wheel, the first worm wheel being connected to the first cleaning arm and the first worm meshing with the first worm wheel; the second transmission assembly includes a second worm and a second worm wheel, the second worm wheel being connected to the second cleaning arm and the second worm meshing with the second worm wheel; the first drive assembly is used to drive the first worm or the second worm.

4. The semiconductor cleaning equipment according to claim 3, characterized in that, The driving mechanism further includes a second driving component, which is connected to the first driving component and is used to drive the first driving component to move between a first position and a second position to change the position of the output end of the first driving component. When the first drive component is in the first position, the output end of the first drive component is connected to the first worm gear; when the first drive component is in the second position, the output end of the first drive component is connected to the second worm gear.

5. The semiconductor cleaning equipment according to claim 4, characterized in that, The first drive assembly includes a first gear disposed at its output end, the first transmission assembly includes a second gear disposed on the first worm, and the second transmission assembly includes a third gear disposed on the second worm; The first gear moves between the second gear and the third gear along with the first drive assembly, and when the first drive assembly is in the first position, the first gear meshes with the second gear; When the first drive component is in the second position, the first gear meshes with the third gear.

6. The semiconductor cleaning equipment according to claim 3, characterized in that, The first drive assembly includes a first drive device and a right-angle gearbox. The output end of the first drive device is arranged along the height direction of the semiconductor cleaning equipment. The input end of the right-angle gearbox is connected to the output end of the first drive device. The output end of the right-angle gearbox is arranged in a first plane and is used to drive the first worm gear or the second worm gear. The first plane is perpendicular to the height direction of the semiconductor cleaning equipment.

7. The semiconductor cleaning equipment according to claim 2, characterized in that, The semiconductor cleaning equipment further includes a cleaning chamber and a bottom chamber arranged along its height direction, the support is disposed in the cleaning chamber, and the drive mechanism is disposed in the bottom chamber; the first cleaning arm and the second cleaning arm each include a main body section and a bent section, the first end of the main body section is connected to the drive mechanism, the second end of the main body section extends into the cleaning chamber, the first end of the bent section is connected to the second end of the main body section, and the second end of the bent section is bent toward the support.

8. The semiconductor cleaning equipment according to claim 4, characterized in that, The semiconductor cleaning equipment further includes a cleaning chamber and a bottom chamber arranged along its height direction, the support seat is disposed in the cleaning chamber, and the driving mechanism is disposed in the bottom chamber; The driving mechanism further includes a first substrate, a second substrate, and a third substrate. The first substrate is disposed on the cavity wall of the bottom cavity. The second driving component, the second substrate, and the third substrate are all disposed on the first substrate. The second substrate and the third substrate are disposed opposite to each other on both sides of the first cleaning arm and the second cleaning arm. The first worm and the second worm can be rotatably passed through the second substrate and the third substrate.

9. The semiconductor cleaning equipment according to claim 3, characterized in that, The first worm and the second worm are arranged symmetrically and parallel to each other on both sides of the first cleaning arm and the second cleaning arm. The meshing area between the first worm and the first worm wheel is located in the plane containing the first worm and the second worm, and the meshing area between the second worm and the second worm wheel is located in the plane containing the first worm and the second worm.

10. The semiconductor cleaning equipment according to claim 4, characterized in that, Both the first worm and the second worm extend in a horizontal plane, and the axes of both the first worm wheel and the second worm wheel are arranged in a vertical direction.

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