Thermoelectric module

Abstract

A thermoelectric module according to one embodiment of the present application includes a heat exchange unit and a thermoelectric element provided on the heat exchange unit, wherein the heat exchange unit includes a case for accommodating a material for heat exchange and a cover covering the case, the thermoelectric element is provided on the cover, and the thermal conductivity of the cover is higher than the thermal conductivity of the case.

Description

Technical Field

[0001] The present invention relates to thermoelectric modules, and more specifically, to the structure of a heat exchange unit included in a thermoelectric module. Background Technology

[0002] The thermoelectric effect is a direct energy conversion between heat and electricity that occurs due to the movement of electrons and holes in a material.

[0003] Thermoelectric devices typically refer to devices that utilize the thermoelectric effect and have the following structure: P-type thermoelectric material and N-type thermoelectric material are disposed between metal electrodes and bonded to the metal electrodes to form PN junction pairs.

[0004] Thermoelectric devices can be categorized into: devices that utilize the change in resistance with temperature; devices that utilize the Seebeck effect (electromotive force generated by a temperature difference); and devices that utilize the Peltier effect (heat absorption or heating caused by electric current). Thermoelectric devices are widely used in household appliances, electronic components, and communication components. For example, they can be used in cooling equipment, heating equipment, and power generation equipment. Therefore, the demand for the thermoelectric performance of thermoelectric devices is gradually increasing.

[0005] The thermoelectric device includes a substrate, electrodes, and thermoelectric legs. Multiple thermoelectric legs are arranged in an array between an upper substrate and a lower substrate. Multiple upper electrodes are disposed between the multiple thermoelectric legs and the upper substrate, and multiple lower electrodes are disposed between the multiple thermoelectric legs and the lower substrate. In this configuration, one of the upper substrate and the lower substrate can be used as a low-temperature section, while the other can be used as a high-temperature section.

[0006] Meanwhile, when thermoelectric devices are used in cooling equipment, heating equipment, power generation equipment, etc., a heat exchange unit can be provided on one surface of the thermoelectric device, and the thermoelectric performance of the thermoelectric device can vary according to the heat exchange efficiency between the thermoelectric device and the heat exchange unit. Summary of the Invention

[0007] [Technical Issues]

[0008] The present invention aims to provide a thermoelectric module with improved heat exchange efficiency.

[0009] [Technical Solutions]

[0010] One aspect of the present invention provides a thermoelectric module comprising a heat exchange unit and a thermoelectric device disposed on the heat exchange unit, wherein the heat exchange unit includes a housing for containing heat exchange material and a cover for covering the housing, the thermoelectric device is disposed on the cover, and the thermal conductivity of the cover is higher than that of the housing.

[0011] The cover may include a first surface disposed toward the exterior of the housing and on which thermoelectric devices are disposed, and a second surface disposed toward the interior of the housing, wherein a plurality of heat sinks may be formed on the second surface.

[0012] The housing may include a first region therein housing a plurality of heat sinks and a second region surrounding the first region and including a connecting member for attaching the housing to a cover.

[0013] The connecting member can have multiple holes, and the housing and cover can be connected in the second region by multiple connecting members.

[0014] The housing and cover can be watertightly connected in the second area.

[0015] The connecting component can be a groove with an annular shape, and an O-ring can be provided in the groove.

[0016] The housing may also include a third region that surrounds the second region and the height of the third region is greater than the height of the second region.

[0017] The bottom surface of the first region and the multiple heat sinks can be spaced apart by a predetermined distance.

[0018] The first region may be provided with at least one guide protruding from the bottom surface, and one end of the guide may be spaced apart from the wall surface of the housing.

[0019] A fluid inlet and a fluid outlet can be formed in the shell.

[0020] The temperature of the fluid introduced through the fluid inlet can be higher than the temperature of the fluid discharged through the fluid outlet.

[0021] The temperature of the fluid introduced through the fluid inlet can be lower than the temperature of the fluid discharged through the fluid outlet.

[0022] The cover may be metal, and the housing may include thermal insulation material.

[0023] [Beneficial Effects]

[0024] According to embodiments of the present invention, a thermoelectric device with improved heat exchange efficiency between the heat exchange unit and the thermoelectric device can be obtained. Furthermore, according to embodiments of the present invention, heat loss from the heat exchange unit can be prevented even without separate insulation material, and therefore, manufacturing costs can be reduced, the manufacturing process can be simplified, and the area occupied by the thermoelectric module can be reduced. Attached Figure Description

[0025] Figure 1 This is a cross-sectional view showing the thermoelectric device.

[0026] Figure 2This is a perspective view showing a thermoelectric device.

[0027] Figure 3 This is a perspective view showing a thermoelectric device including a sealing component.

[0028] Figure 4 This is an exploded perspective view showing a thermoelectric device including a sealing member.

[0029] Figure 5 This is a perspective view showing a thermoelectric module according to an embodiment of the present invention.

[0030] Figure 6 This is a perspective view showing a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention.

[0031] Figure 7 This is an exploded perspective view showing a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention.

[0032] Figure 8 It is shown that it includes Figure 7 A perspective view of the cover in the heat exchange unit.

[0033] Figure 9 This is a cross-sectional view showing a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention.

[0034] Figure 10 This is a set of figures illustrating a guide disposed in the housing of a heat exchange unit according to an embodiment of the present invention.

[0035] Figure 11 This is a cross-sectional view showing a thermoelectric module according to an embodiment of the present invention. Detailed Implementation

[0036] In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0037] However, the technical spirit of the present invention is not limited to the embodiments described, and can be implemented using various other embodiments, and at least one component of an embodiment can be selectively connected, replaced and used within the scope of the technical spirit of the present invention.

[0038] Furthermore, unless otherwise explicitly and specifically defined by the context, all terms used herein (including technical and scientific terms) are to be interpreted as having the meaning commonly understood by those skilled in the art, and the meaning of commonly used terms, such as those defined in commonly used dictionaries, will be interpreted by taking into account the contextual meaning of the relevant art.

[0039] Furthermore, the terminology used in the embodiments of this invention is considered to have a descriptive meaning and is not intended to limit the invention.

[0040] In this specification, unless the context clearly indicates otherwise, the singular form includes its plural form, and in the case of describing “at least one (or one or more) of A, B and C”, this may include at least one combination of all possible combinations of A, B and C.

[0041] Furthermore, in the description of the components of the present invention, terms such as "first", "second", "A", "B", "(a)" and "(b)" may be used.

[0042] These terms are only used to distinguish one element from another, and the nature, order, etc. of the elements are not limited by these terms.

[0043] Furthermore, when an element is referred to as “connected” or “coupled” to another element, such a description can include not only cases where the element is directly connected to or coupled to another element, but also cases where the element is connected to or coupled to another element, in which another element is disposed.

[0044] Furthermore, when any element is described as being formed or disposed "above" or "below" another element, such a description includes not only cases where the two elements are formed or disposed in direct contact with each other, but also cases where one or more other elements are formed or disposed between the two elements. Additionally, when an element is described as being disposed "above" or "below" another element, such a description can include cases where one element is disposed on the upper or lower side relative to the other element.

[0045] Figure 1 This is a cross-sectional view showing the thermoelectric device, and Figure 2 This is a perspective view showing a thermoelectric device. Figure 3 This is a perspective view showing a thermoelectric device including a sealing member, and Figure 4 This is an exploded perspective view showing a thermoelectric device including a sealing member.

[0046] Reference Figure 1 and Figure 2 The thermoelectric device 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0047] A lower electrode 120 is disposed between the lower substrate 110 and the lower surfaces of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140, and an upper electrode 150 is disposed between the upper substrate 160 and the upper surfaces of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140. Therefore, a plurality of P-type thermoelectric legs 130 and a plurality of N-type thermoelectric legs 140 are electrically connected through the lower electrode 120 and the upper electrode 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the lower electrode 120 and the upper electrode 150 and electrically connected to each other can form a unit cell.

[0048] As an example, when a voltage is applied to the lower electrode 120 and the upper electrode 150 via leads 181 and 182, due to the Peltier effect, the current flowing through the substrate from the P-type thermocouple 130 to the N-type thermocouple 140 can absorb heat for use as a cooling component, and the current flowing through the substrate from the N-type thermocouple 140 to the P-type thermocouple 130 can be heated for use as a heating component. Alternatively, when the lower electrode 120 and the upper electrode 150 are applied at different temperatures, due to the Seebeck effect, charge can move through the P-type thermocouple 130 and the N-type thermocouple 140, thus generating electricity.

[0049] In this case, each of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be a bismuth telluride (Bi-Te) based thermoelectric leg primarily comprising Bi and Te. The P-type thermoelectric leg 130 can be a Bi-Te based thermoelectric leg comprising at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), Te, Bi, and indium (In). As an example, the P-type thermoelectric leg 130 can comprise Bi-Sb-Te as the main material in 99 to 99.999% by weight based on 100% by weight of the total weight, and at least one of Ni, Al, Cu, Ag, Pb, B, Ga, and In in 0.001 to 1% by weight. The N-type thermoelectric leg 140 can be a Bi-Te based thermoelectric leg comprising at least one of Se, Ni, Al, Cu, Ag, Pb, B, Ga, Te, Bi, and In. As an example, the N-type thermoelectric leg 140 may comprise, based on 100% by weight, Bi-Se-Te as the main material in 99 to 99.999% by weight and at least one material selected from Ni, Al, Cu, Ag, Pb, B, Ga, and In in 0.001 to 1% by weight. Therefore, in this specification, the thermoelectric leg may also be referred to as a semiconductor structure, semiconductor element, semiconductor material layer, conductive semiconductor structure, thermoelectric structure, thermoelectric material layer, etc.

[0050] Each of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be formed in a block or stacked manner. Typically, the block-type P-type thermoelectric leg 130 or the block-type N-type thermoelectric leg 140 can be formed by: heat-treating the thermoelectric material to produce an ingot, grinding and filtering the ingot to obtain powder for the thermoelectric leg, sintering the powder, and cutting the sintered powder. In this case, each of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be a polycrystalline thermoelectric leg. When sintering the powder for the thermoelectric leg to produce a polycrystalline thermoelectric leg, the powder can be compressed at 100 MPa to 200 MPa. As an example, when sintering the P-type thermoelectric leg 130, the powder for the thermoelectric leg can be sintered at 100 MPa to 150 MPa, preferably 110 MPa to 140 MPa, and more preferably 120 MPa to 130 MPa. Furthermore, when sintering the N-type thermoelectric leg 130, the powder used for the thermoelectric leg can be sintered at 150 MPa to 200 MPa, preferably 160 MPa to 195 MPa, and more preferably 170 MPa to 190 MPa. As described above, when each of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 is a polycrystalline thermoelectric leg, the strength of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be increased. The stacked P-type thermoelectric leg 130 or the stacked N-type thermoelectric leg 140 can be formed by applying a slurry containing thermoelectric material onto base members, each having a sheet-like shape, to form unit members, and then stacking and cutting the unit members.

[0051] In this case, the paired P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can have the same shape and volume, or they can have different shapes and volumes. As an example, since the P-type thermoelectric legs 130 and N-type thermoelectric legs 140 have different electrical conductivity characteristics, the height or cross-sectional area of ​​the N-type thermoelectric leg 140 can be different from the height or cross-sectional area of ​​the P-type thermoelectric leg 130.

[0052] In this case, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 can have a cylindrical shape, a polygonal cylindrical shape, an elliptical cylindrical shape, etc.

[0053] Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may also have a stacked structure. As an example, the P-type or N-type thermoelectric leg can be formed by stacking and cutting multiple structures, each having a sheet-like shape, onto a base member to which a semiconductor material is applied. This prevents material loss and improves electrical conductivity. The structure may also include a conductive layer with an open pattern, thus increasing adhesion between structures, reducing thermal conductivity, and increasing electrical conductivity.

[0054] Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have different cross-sectional areas formed in a single thermoelectric leg. As an example, in a thermoelectric leg, the cross-sectional area of ​​the two end portions facing the electrode is larger than the cross-sectional area between the two end portions. Therefore, due to the large temperature difference between the two end portions, thermoelectric efficiency can be improved.

[0055] The performance of a thermoelectric device according to one embodiment of the present invention can be expressed as a thermoelectric figure of merit (ZT). The thermoelectric figure of merit (ZT) can be expressed by Equation 1.

[0056] [Formula 1]

[0057] ZT=α 2 ·σ·T / k

[0058] Here, α represents the Seebeck coefficient [V / K], σ represents the conductivity [S / m], and α 2 σ represents the power factor [W / mK] 2 Furthermore, T represents temperature, and k represents thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, where a represents thermal diffusivity [cm]. 2 / S], cp represents specific heat [J / gK], and ρ represents density [g / cm³]. 3 ].

[0059] In order to obtain the thermoelectric figure of merit (ZT) of a thermoelectric device, a Z-meter is used to measure the Z value (V / K), and the measured Z value can be used to calculate the thermoelectric figure of merit (ZT).

[0060] In this case, each of the lower electrode 120 disposed between the lower substrate 110 and the P-type thermoelectric legs 130 and N-type thermoelectric legs 140, and the upper electrode 150 disposed between the upper substrate 160 and the P-type thermoelectric legs 130 and N-type thermoelectric legs 140, may include at least one of Cu, Ag, Al, and Ni and may have a thickness of 0.01 mm to 0.3 mm. When the thickness of the lower electrode 120 or the upper electrode 150 is less than 0.01 mm, the electrode function deteriorates, and thus the conductivity performance may decrease; when its thickness is greater than 0.3 mm, the resistance increases, and thus the conductivity efficiency may decrease.

[0061] Furthermore, the lower substrate 110 and upper substrate 160, which are opposite each other, can be metal substrates, and the thickness of each of the lower substrate 110 and upper substrate 160 can be in the range of 0.1 mm to 1.5 mm. When the thickness of the metal substrate is less than 0.1 mm or greater than 1.5 mm, the reliability of the thermoelectric device may deteriorate because the heat dissipation characteristics or thermal conductivity may become too high. In addition, when the lower substrate 110 and upper substrate 160 are metal substrates, a heat insulation layer 170 may be formed between the lower substrate 110 and the lower electrode 120 and between the upper substrate 160 and the upper electrode 150. The heat insulation layer 170 may include a material having a thermal conductivity of 1 to 20 W / K.

[0062] In this case, the dimensions of the lower substrate 110 and the upper substrate 160 can also be different. As an example, the volume, thickness, or area of ​​one of the lower substrate 110 and the upper substrate 160 can be larger than the volume, thickness, or area of ​​the other. Therefore, the heat absorption or dissipation performance of the thermoelectric device can be improved. Preferably, at least any one of the volume, thickness, and area of ​​the lower substrate 110 can be larger than the corresponding one of the volume, thickness, and area of ​​the upper substrate 160. In this case, compared to the case where the lower substrate 110 is applied to a heating region for the Peltier effect or where a sealing member is disposed on the lower substrate 110 to protect the thermoelectric module from external environmental influences as described below, when the lower substrate 110 is disposed in a high-temperature region for the Seebeck effect, at least any one of the volume, thickness, and area of ​​the lower substrate 110 can be larger than the corresponding one of the volume, thickness, and area of ​​the upper substrate 160. In this case, the area of ​​the lower substrate 110 can be 1.2 to 5 times the area of ​​the upper substrate 160. When the area of ​​the current substrate 110 is less than 1.2 times the area of ​​the upper substrate 160, the effect of improving heat transfer efficiency is not significant. However, when the area of ​​the current substrate 110 is more than 5 times the area of ​​the upper substrate 160, the heat transfer efficiency is significantly reduced, and it may be difficult to maintain the basic shape of the thermoelectric module.

[0063] Furthermore, a heat dissipation pattern, such as an uneven pattern, can be formed on the surface of at least one of the lower substrate 110 and the upper substrate 160. Therefore, the heat dissipation performance of the thermoelectric device can be improved. When an uneven pattern is formed on the surface in contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate can be improved. The thermoelectric device 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0064] like Figure 3 and Figure 4As shown, a sealing member 190 may also be provided between the lower substrate 110 and the upper substrate 160. The sealing member may be provided on the side surfaces of the lower electrode 120, P-type thermoelectric leg 130, N-type thermoelectric leg 140, and upper electrode 150 between the lower substrate 110 and the upper substrate 160. Therefore, the lower electrode 120, P-type thermoelectric leg 130, N-type thermoelectric leg 140, and upper electrode 150 can be sealed to prevent external moisture, heat, contamination, etc. In this case, the sealing member 190 may include: a sealing shell 192, which is provided at a predetermined distance from the outermost surfaces of the plurality of lower electrodes 120, the outermost surfaces of the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140, and the outermost surfaces of the plurality of upper electrodes 150; a sealing member 194 provided between the sealing shell 192 and the lower substrate 110; and a sealing member 196 provided between the sealing shell 192 and the upper substrate 160. As described above, the sealing shell 192 can contact the lower substrate 110 and the upper substrate 160 via sealing members 194 and 196. Therefore, the following problem can be prevented: when the sealing shell 192 is in direct contact with the lower substrate 110 and the upper substrate 160, heat conduction occurs through the sealing shell 192, thus reducing the temperature difference between the lower substrate 110 and the upper substrate 160. In this case, each of the sealing members 194 and 196 may include at least one of epoxy resin and silicone resin, or be a strip whose two surfaces are coated with at least one of epoxy resin and silicone resin. Sealing members 194 and 196 can be used to hermetically seal the gaps between the sealing shell 192 and the lower substrate 110 and between the sealing shell 192 and the upper substrate 160, improving the sealing effect of the lower electrode 120, the P-type thermocouple 130, the N-type thermocouple 140, and the upper electrode 150, and can be used interchangeably with finishing materials, finishing layers, waterproof members, waterproof layers, etc. In this case, a sealing member 194 sealing the gap between the sealing shell 192 and the lower substrate 110 can be provided on the upper surface of the lower substrate 110, while a sealing member 196 sealing the gap between the sealing shell 192 and the upper substrate 160 can be provided on the side surface of the upper substrate 160. Therefore, the area of ​​the lower substrate 110 can be larger than the area of ​​the upper substrate 160. Simultaneously, a guide groove G for removing leads 180 and 182 connected to the electrodes can be formed in the sealing shell 192. Therefore, the sealing shell 192 can be an injection-molded part made of plastic or the like, and can be used interchangeably with a sealing cap. However, the above description of the sealing member is merely exemplary, and the sealing member can be changed to any of various forms. Although not shown in the drawings, a heat-insulating material for surrounding the sealing member may also be included. Alternatively, the sealing member may also include a heat-insulating component.

[0065] As described above, although terms such as "lower substrate 110", "lower electrode 120", "upper electrode 150" and "upper substrate 160" are used, the terms "upper" and "lower" are used arbitrarily for ease of understanding and description only, and their positions can be reversed so that the lower substrate 110 and the lower electrode 120 are disposed on the upper part and the upper electrode 150 and the upper substrate 160 are disposed on the lower part.

[0066] Figure 5 This is a perspective view showing a thermoelectric module according to an embodiment of the present invention. Figure 6 This is a perspective view illustrating a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention. Figure 7 This is an exploded perspective view showing a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention. Figure 8 It is shown that it includes Figure 7 A perspective view of the cover in the heat exchange unit. Figure 9 This is a cross-sectional view showing a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention. Figure 10 This is a set of figures illustrating guides disposed in the housing of a heat exchange unit according to each embodiment of the invention, and Figure 11 This is a cross-sectional view showing a thermoelectric module according to an embodiment of the present invention.

[0067] Reference Figure 5 According to one embodiment of the present invention, a thermoelectric module includes a heat exchange unit 200 and a thermoelectric device 100 disposed on the heat exchange unit 200. The thermoelectric device 100 may be... Figures 1 to 4 Thermoelectric devices.

[0068] When the thermoelectric module according to an embodiment of the present invention is a power generation device that generates electricity by utilizing the temperature difference between the low-temperature portion and the high-temperature portion of the thermoelectric device 100, the heat exchange unit 200 may contact the low-temperature portion of the thermoelectric device 100 and be used to lower the temperature of the low-temperature portion. For this purpose, cooling water for lowering the temperature of the low-temperature portion of the thermoelectric device 100 may flow through the heat exchange unit 200. Alternatively, when the thermoelectric module according to an embodiment of the present invention is a power generation device that generates electricity by utilizing the temperature difference between the low-temperature portion and the high-temperature portion of the thermoelectric device 100, the heat exchange unit 200 may also contact the high-temperature portion of the thermoelectric device 100 and be used to raise the temperature of the high-temperature portion. For this purpose, hot water for raising the temperature of the high-temperature portion of the thermoelectric device 100 may flow through the heat exchange unit 200.

[0069] When the thermoelectric device 100 included in the thermoelectric module according to an embodiment of the present invention is a Peltier device, the heat exchange unit 200 may contact the heat-absorbing surface of the thermoelectric device 100 and be cooled by the heat-absorbing surface of the thermoelectric device 100, or the thermoelectric device 100 may contact the heat-dissipating surface and be heated by the heat-dissipating surface.

[0070] Therefore, the performance of the thermoelectric module according to the embodiment of the present invention can vary depending on the heat transfer efficiency between the heat exchange unit 200 and the thermoelectric device 100.

[0071] Reference Figures 6 to 9 The heat exchange unit 200 includes a housing 210 for containing heat exchange materials and a cover 220 for covering the housing 210.

[0072] In this case, the heat exchange material can be either a cooling fluid or a heating fluid. As an example, when the thermoelectric module is a power generation device, the heat exchange unit 200 can be located on one side of the low-temperature portion of the thermoelectric device 100, and therefore the heat exchange material can be a cooling fluid. The cooling fluid can be introduced through the fluid inlet I of the housing 210, contained within the housing 210, and discharged through the fluid outlet O of the housing 210. In this case, the temperature of the fluid introduced through the fluid inlet I can be lower than the temperature of the fluid discharged through the fluid outlet O. As another example, when the thermoelectric module is a power generation device, the heat exchange unit 200 can be located on one side of the high-temperature portion of the thermoelectric device 100, and therefore the heat exchange material can be a high-temperature fluid. The fluid can be introduced through the fluid inlet I of the housing 210, contained within the housing 210, and discharged through the fluid outlet O of the housing 210. In this case, the temperature of the fluid introduced through the fluid inlet I can be higher than the temperature of the fluid discharged through the fluid outlet O.

[0073] As another example, when the thermoelectric device 100 is a Peltier device, the heat exchange unit 200 can be disposed on the heat-absorbing surface of the thermoelectric device 100, and thus the heat exchange material can be cooled. When the heat exchange material is a fluid, the fluid can be introduced through the fluid inlet I of the housing 210, contained within the housing 210, and discharged through the fluid outlet O of the housing 210. In this case, the temperature of the fluid introduced through the fluid inlet I can be higher than the temperature of the fluid discharged through the fluid outlet O. As yet another example, when the thermoelectric device 100 is a Peltier device, the heat exchange unit 200 can be disposed on the heat-dissipating surface of the thermoelectric device 100, and thus the heat exchange material can be heated. When the heat exchange material is a fluid, the fluid can be introduced through the fluid inlet I of the housing 210, contained within the housing 210, and discharged through the fluid outlet O of the housing 210. In this case, the temperature of the fluid introduced through the fluid inlet I can be lower than the temperature of the fluid discharged through the fluid outlet O.

[0074] In this case, the fluid is not limited to liquids, but can be a material with fluidity.

[0075] According to an embodiment of the present invention, the thermoelectric device 100 may be disposed on the cover 220 of the heat exchange unit 200, and the thermal conductivity of the cover 220 may be higher than that of the housing 210. As an example, the cover 220 may comprise a metal, such as copper, aluminum, or a copper-aluminum alloy. Furthermore, the housing 210 may comprise a heat-insulating material, such as polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), or polyphenylene sulfide (PPS).

[0076] As described above, when the cover 220 disposed on the thermoelectric device 100 comprises a metal with high thermal conductivity, and the housing 210 containing the heat exchange material comprises a heat insulation material with low thermal conductivity, the cover 220 can be an efficient heat transfer medium between the heat exchange material contained in the housing 210 and the thermoelectric device 100, and the housing 210 containing the heat exchange material can isolate the heat exchange material from the outside, thus preventing heat loss of the heat exchange material and improving the heat transfer performance between the thermoelectric device 100 and the heat exchange unit 200.

[0077] Specifically, when the heat exchange material is a fluid, a fluid inlet I and a fluid outlet O can be formed in the housing 210. In this case, when the fluid inlet I and the fluid outlet O comprise an insulating material with a low thermal conductivity similar to that of the housing 210, heat loss of the heat exchange material during the introduction or discharge of the fluid can be prevented.

[0078] Furthermore, similar to embodiments of the present invention, when only the cover 220 of the heat exchange unit 200 is made of metal, and the housing 210 of the heat exchange unit 200 is formed of a plastic material such as PC, ABS or PPS, the material cost and weight of the heat exchange unit 200 can be reduced.

[0079] In this case, refer to Figure 8 and Figure 9 The cover 220 may include a first surface 222 and a second surface 224. The first surface 222 is disposed facing the outside of the housing 210 and a thermoelectric device 100 is disposed thereon. The second surface 224 is disposed facing the inside of the housing 210. Furthermore, a plurality of heat sinks 230 may be formed on the second surface 224 of the cover 220. The plurality of heat sinks 230 may be formed of the same material as the cover 220 and integrally formed with the cover 220.

[0080] As described above, when multiple heat sinks 230 are formed on the second surface 224 of the cover 220, the heat transfer efficiency between the heat exchange unit 200 and the thermoelectric device 100 can be further improved because the contact area between the multiple heat sinks 230 and the heat exchange material in the housing 210 is increased.

[0081] Meanwhile, according to one embodiment of the present invention, the housing 210 of the heat exchange unit 200 may include a first region 212 in which a plurality of heat sinks 230 are disposed and a second region 214 surrounding the first region 212. Heat exchange material may be contained in the first region 212. In this case, the plurality of heat sinks 230 may be spaced apart from each other, and the bottom surface 212-1 of the first region 212 may also be spaced apart from the plurality of heat sinks 230 by a predetermined distance. Therefore, the heat exchange material may flow between the plurality of heat sinks 230 and between the bottom surface 212-1 of the first region 212 and the plurality of heat sinks 230.

[0082] In this case, the height H2 of the second region 214 can be greater than the height H1 of the first region 212. Furthermore, the second surface 224 of the cover 220 can contact the second region 214 of the housing 210. Additionally, the housing 210 and the cover 220 can be connected within the second region 214 of the housing 210 by a plurality of connecting members 240. For this purpose, as... Figure 7 As shown, multiple holes h1 and h2 are formed in the cover 220 and in the second region 214 of the housing 210, and multiple connecting members 240 can pass through the multiple holes h1 and h2 to connect the housing 210 to the cover 220. Therefore, the cover 220 of the heat exchange unit 200 can be stably fixed to the housing 210.

[0083] In this case, the predetermined distance d between the bottom surface 212-1 of the first region 212 and the plurality of heat sinks 230 can be 0.1 to 0.7 times, preferably 0.2 to 0.6 times, and more preferably 0.3 to 0.5 times, the difference between the height H2 of the second region 214 and the height H1 of the first region 212. Therefore, the contact area between the plurality of heat sinks 230 and the heat exchange material is sufficiently ensured, and the plurality of heat sinks 230 do not interfere with the flow of the heat exchange material.

[0084] Furthermore, according to one embodiment of the present invention, the housing 210 of the heat exchange unit 200 may further include a third region 216 surrounding the second region 214. As described above, when the housing 210 further includes the third region 216 extending outwardly than the second region 214, the heat exchange material contained in the first region 212 can be thermally insulated from the outside. In this case, the width w3 of the third region 216 may be 0.5 to 2 times the width w2 of the second region 214. Therefore, the thermal insulation performance of the heat exchange material contained in the first region 212 can be further improved.

[0085] In this case, the height H3 of the third region 216 can be greater than the height H2 of the second region 214. As an example, the difference between the height H3 of the third region 216 and the height H2 of the second region 214 can be greater than or equal to the thickness D of the cover 220. Preferably, the difference between the height H3 of the third region 216 and the height H2 of the second region 214 can be 1 to 1.2 times the thickness D of the cover 220.

[0086] Therefore, since the third region 216 of the housing 210, which includes heat insulation material, is provided on the side surface of the cover 220, the problem of heat loss of heat exchange material through the side surface of the cover 220 can be prevented, and thus the heat transfer efficiency between the cover 220 and the thermoelectric device 100 can be further improved.

[0087] Furthermore, according to one embodiment of the present invention, the housing 210 and the cover 220 of the heat exchange unit 200 can be watertightly connected in the second region 214. In this case, the housing 210 and the cover 220 of the heat exchange unit 200 can be watertightly connected due to the O-ring.

[0088] For this purpose, a groove 214-1 with an annular shape can be formed in the second region 214 of the housing 210, and an O-ring 250 can be disposed in the groove 214-1. Therefore, the problem of heat exchange material contained in the heat exchange unit 200 leaking to the outside of the heat exchange unit 200 can be prevented.

[0089] Furthermore, according to one embodiment of the invention, at least one guide 260 protruding from the bottom surface 212-1 of the housing 210 may be disposed in the first region 212. The guide 260 can guide the flow of fluid as a heat exchange material. For this purpose, one end of the guide 260 may be spaced apart from the wall surface of the housing 210. Thus, fluid can pass through the space between one end of the guide 260 and the wall surface of the housing 210.

[0090] When a fluid inlet I and a fluid outlet O are formed in one surface of the housing 210, the guide 260 can extend from the surface S1 where the fluid inlet I and fluid outlet O are formed toward the surface S2 opposite to surface S1. Therefore, fluid introduced through the fluid inlet I can flow in the first region 212 of the housing 210 and can be discharged through the fluid outlet O. In this case, a plurality of heat sinks 230 can be arranged to extend in a direction parallel to the extension direction of the guide 260. Therefore, the plurality of heat sinks 230 will not interfere with the flow of fluid.

[0091] According to another embodiment of the present invention, a plurality of guides 260 may be provided, and the plurality of guides 260 may also be provided in various shapes to form a flow path in the first region 212.

[0092] exist Figure 10 The diagram illustrates guide members disposed within the housing of a heat exchange unit according to each embodiment of the invention. (See diagram below.) Figure 10 In A, the guide 260 can extend from the surface S1 on which the fluid inlet I and the fluid outlet O are formed toward the surface S2 opposite to the surface S1, and can be spaced apart from the surface S2. Alternatively, as in Figure 10 In B, multiple guides may be provided. That is, some of the multiple guides, 262 and 264, may extend from the surface S1 on which the fluid inlet I and the fluid outlet O are formed toward the surface S2 opposite to the surface S1 and may be spaced apart from the surface S2, and another guide 266 may extend from the surface S2 toward the surface S1 and may be spaced apart from the surface S1.

[0093] Therefore, the fluid introduced into the heat exchange unit 200 can circulate uniformly in the heat exchange unit 200 and can be discharged from the heat exchange unit 200.

[0094] Reference Figure 11 According to an embodiment of the present invention, the thermoelectric device 100 may be disposed on the heat exchange unit 200. In this case, the width of the substrate 110 of the thermoelectric device 100 may be smaller than the width of the cover 220 of the heat exchange unit 200. As an example, the thermoelectric device 100 may be disposed in a region provided with a plurality of connecting members 240. Therefore, since the separation interval between the thermoelectric device 100 and the heat exchange unit 200 can be minimized, the heat transfer performance between the thermoelectric device 100 and the heat exchange unit 200 can be improved.

[0095] Meanwhile, a radiator 300 can also be provided on the thermoelectric device 100. That is, the heat exchange unit 200 can be provided on one side of the thermoelectric device 100, and the radiator 300 can be provided on the other side, and thus, the temperature difference between the high-temperature part and the low-temperature part of the thermoelectric device 100 can be increased.

[0096] Although the invention has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes and modifications may be made to the invention without departing from the spirit and scope of the invention as defined by the following claims.

Claims

1. A thermoelectric module, comprising: Heat exchange unit; as well as Thermoelectric devices installed on the heat exchange unit The heat exchange unit includes a housing for containing heat exchange materials and a cover for covering the housing. The thermoelectric device includes a lower substrate, a lower electrode, a P-type thermoelectric leg, an N-type thermoelectric leg, an upper electrode, an upper substrate, and a sealing component. The sealing member is disposed on the side surface of the lower electrode, the P-type thermoelectric leg, the N-type thermoelectric leg, and the upper electrode between the lower substrate and the upper substrate. The area of ​​the lower substrate is 1.2 to 5 times the area of ​​the upper substrate. The thermoelectric device is mounted on the cover, and The thermal conductivity of the cover is higher than that of the shell.

2. The thermoelectric module according to claim 1, wherein, The cover includes: A first surface facing outwards from the housing and on which the thermoelectric device is disposed; and A second surface facing the interior of the housing. Multiple heat sinks are formed on the second surface.

3. The thermoelectric module according to claim 2, wherein, The housing includes: The first region therein accommodates the plurality of heat sinks; and The first region is surrounded by a second region that includes a connecting portion for attaching the housing to the cover.

4. The thermoelectric module according to claim 3, wherein: The connecting portion includes multiple holes; and The housing and the cover are connected in the second region by a plurality of connecting members disposed in the plurality of holes.

5. The thermoelectric module according to claim 3, wherein: The connecting portion includes a groove with an annular shape; and An O-ring is provided in the groove.

6. The thermoelectric module according to claim 3, wherein, The housing further includes a third region that surrounds the second region and the height of the third region is greater than the height of the second region.

7. The thermoelectric module according to claim 3, wherein, The bottom surface of the first region is spaced apart from the plurality of heat sinks by a predetermined distance.

8. The thermoelectric module according to claim 3, wherein: The first region is provided with at least one guide protruding from the bottom surface; and One end of the guide is spaced apart from the wall surface of the housing.

9. The thermoelectric module according to claim 3, wherein, The housing has a fluid inlet and a fluid outlet.

10. The thermoelectric module according to claim 1, wherein: The cover comprises metal; and The housing includes thermal insulation material.

11. The thermoelectric module according to claim 7, wherein: The height of the second region is higher than the height of the bottom surface of the first region, and The predetermined distance between the bottom surface of the first region and the plurality of heat sinks is 0.1 to 0.7 times the difference between the height of the second region and the height of the bottom surface of the first region.

12. The thermoelectric module according to claim 8, in, The extension direction of the plurality of heat sinks is parallel to the extension direction of the at least one guide.

13. The thermoelectric module according to claim 1, in, The width of the thermoelectric device is smaller than the width of the cover.

14. The thermoelectric module according to claim 1, wherein: The cover includes a first surface disposed facing the exterior of the housing and on which the thermoelectric device is disposed; and a second surface disposed facing the interior of the housing. The housing includes a first region for accommodating the heat exchange material and a second region surrounding the first region and including a connecting portion for connecting the housing to the cover.

15. The thermoelectric module according to claim 14, wherein, The height of the second region is higher than the height of the bottom surface of the first region, and the second surface of the cover is in contact with the second region.

16. The thermoelectric module according to claim 15, wherein, The housing further includes a third region that surrounds the second region and has a height greater than that of the second region, and the third region is disposed on a side surface of the cover.

17. The thermoelectric module according to claim 16, wherein, The width of the third region is 0.5 to 2 times the width of the second region.

18. The thermoelectric module according to claim 14, wherein: A fluid inlet and a fluid outlet are formed on the first surface of the shell. The first region is provided with a guide protruding from the bottom surface. The guide extends from the first surface of the housing toward the second surface of the housing opposite to the first surface of the housing, and The guide is spaced apart from the second surface of the housing.

19. The thermoelectric module according to claim 14, wherein: A fluid inlet and a fluid outlet are formed on the first surface of the shell. The first region is provided with multiple guides protruding from the bottom surface. A portion of the plurality of guides extends from the first surface of the housing toward a second surface of the housing opposite to the first surface of the housing, and is spaced apart from the second surface of the housing. Another portion of the plurality of guides extends from the second surface of the housing toward the first surface of the housing and is spaced apart from the first surface of the housing.

20. The thermoelectric module according to claim 14, wherein, The housing and the cover are watertightly connected in the second region.

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