Power conversion device

By installing insulating components such as insulating transformers and optocouplers on the same circuit board of the power conversion device, the problem of circuit board enlargement caused by the insulation reinforcement boundary spanning multiple circuit boards is solved, thereby achieving circuit board miniaturization and improved cooling performance.

CN114938698BActive Publication Date: 2026-03-24HITACHI IND EQUIP SYST CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-04-20
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

In existing power conversion devices, the insulation reinforcement boundary spans multiple circuit boards, resulting in large circuit boards that are difficult to miniaturize.

Method used

All insulating components, such as insulating transformers and optocouplers, are mounted on the same circuit board, with the insulation reinforcement area completed within the circuit board, thus avoiding a structure where the insulation reinforcement boundary spans multiple circuit boards.

Benefits of technology

This technology enables miniaturization of circuit boards, improves cooling performance and assembly efficiency, and reduces the complexity of connections between circuit boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

To make a power conversion device having a main circuit board, a first circuit board, and a second circuit board small, the main circuit board has a rectifier circuit that rectifies an alternating voltage to output a direct current voltage and an inverter circuit that inverts the direct current voltage to output an alternating power in a strong electric section, the second circuit board has a second circuit disposed in a weak electric section, the first circuit board is connected to the main circuit board and the second circuit board, and the first circuit board includes a first circuit disposed in the strong electric section, an insulation reinforcement region for reinforcing insulation between the strong electric section and the weak electric section, an insulation transformer disposed in the insulation reinforcement region as a component of a power supply circuit that receives the direct current voltage and supplies power to the first circuit and the second circuit, and an insulation element disposed in the insulation reinforcement region that transmits a signal between the first circuit and the second circuit.
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Description

Technical Field

[0001] This invention relates to a power conversion device for supplying alternating current to an electric motor. Background Technology

[0002] The power conversion device for driving an electric motor accepts a system voltage of several hundred volts and outputs power of several hundred watts to several hundred kW, depending on the application. Therefore, it has a circuit section (hereinafter referred to as the high-voltage section) capable of withstanding this voltage and current. On the other hand, commands such as operation / stop of the power conversion device are given externally by the user or an external device such as a PLC (Programmable Logic Controller). Therefore, the power conversion device for driving an electric motor has a circuit section (hereinafter referred to as the low-voltage section) that serves as the interface between the user and the high-voltage section, transmitting various signals between the two sections while simultaneously fulfilling the user's requested actions.

[0003] Here, measures are needed to ensure the safety of personnel involved in the operation of power conversion devices for electric motor drives. Various safety standards (such as IEC and UL standards) define, as part of electrical safety, requirements for electrical insulation reinforcement—a measure to prevent electric shock—between high-voltage components (system voltage and motor voltage) and low-voltage components where there is a possibility of contact. To achieve this insulation reinforcement, the specified insulation distances required by each standard must be set on the mounting circuit board, thus increasing the circuit board area. Therefore, constructing the power conversion device by minimizing the area of ​​the insulation reinforcement boundary is effective in saving circuit board space and miniaturizing the device.

[0004] Patent Document 1 describes a method for strengthening insulation in a power conversion device that includes two types of microcomputers: a microcomputer for current control and a microcomputer for main control. According to Patent Document 1... Figure 1 The power supply circuit for control is located in the drive unit, providing the power supply voltage generated by the power supply circuit to the current control microcomputer and the main control microcomputer. Furthermore, the current control microcomputer and the main control microcomputer are reinforced with insulation using insulating components such as optical couplers installed in the communication circuit.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2007-300694 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] Patent Document 1 incorporates two types of microcomputers: a current control microcomputer is located in the high-voltage section, and a main control microcomputer is located in the low-voltage section, with reinforced insulation between them. Furthermore, a power supply circuit is installed in the drive section. Here, the power circuit output includes power lines for both the high-voltage section (current control microcomputer) and the low-voltage section (main control microcomputer), with the reinforced insulation boundary spanning the drive section, the current control section, and multiple circuit boards. As described above, the reinforced insulation boundary is preferably as small as possible; the existence of a reinforced insulation boundary spanning the circuit boards presents a problem of increasing the size of the circuit boards.

[0010] Therefore, the object of the present invention is to provide a power conversion device that avoids the structure of the insulation reinforcement boundary spanning multiple circuit boards and realizes the miniaturization of the circuit board.

[0011] Technical solutions for solving the problem

[0012] To address the aforementioned issues, the power conversion device of the present invention comprises a main circuit board, a first circuit board, and a second circuit board. The main circuit board has a rectifier circuit in its high-voltage section that rectifies AC voltage to output DC voltage and an inverter circuit that inverts DC voltage to output AC power. The second circuit board has a second circuit in its low-voltage section. The first circuit board is connected to the main circuit board and the second circuit board, and includes the first circuit in its high-voltage section; an insulation reinforcement region for reinforcing the insulation between the high-voltage and low-voltage sections; an insulation transformer in its insulation reinforcement region that serves as a component of a power supply circuit that receives DC voltage and supplies power to the first and second circuits; and an insulation element in its insulation reinforcement region for transmitting signals between the first and second circuits.

[0013] Invention Effects

[0014] According to the present invention, the structure of the insulation reinforcement boundary spanning multiple circuit boards can be avoided, and the miniaturization of the circuit board can be achieved. Attached Figure Description

[0015] Figure 1 This is a block diagram of the power conversion device in Embodiment 1.

[0016] Figure 2 This is a block diagram of other power conversion devices in Embodiment 1.

[0017] Figure 3 This is a block diagram of other power conversion devices in Embodiment 1.

[0018] Figure 4 This is a perspective view of the power conversion device in Embodiment 1.

[0019] Figure 5This is a bottom view of the power conversion device in Example 1.

[0020] Figure 6 This is a perspective view of the power conversion device in Embodiment 2.

[0021] Figure 7 This is a perspective view of other power conversion devices in Embodiment 2.

[0022] Figure 8 This is a perspective view of the power conversion device in Example 3.

[0023] Figure 9 This is a bottom view of the power conversion device in Example 3.

[0024] Figure 10 This is a block diagram of the power conversion device in Embodiment 4.

[0025] Figure 11 This is a perspective view of the power conversion device with a fourth circuit board added.

[0026] Figure 12 This is a bottom view of the power conversion device with a fourth circuit board added.

[0027] Figure 13 It is a 3D diagram of a power conversion device.

[0028] Figure 14 This is a diagram showing the heat sink fins and module housing.

[0029] Figure 15 This is a diagram showing the main body shell.

[0030] Figure 16 This is a diagram showing the front cover.

[0031] Figure 17 This is a block diagram of an existing power conversion device.

[0032] Figure 18 This is a circuit diagram of a flyback converter used in a power supply circuit. Detailed Implementation

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0034] Figure 17 This is a block diagram of the power conversion device described in Patent Document 1. For example... Figure 17As shown, the existing power conversion device consists of three circuit boards: a main circuit board 101, a first circuit board 102, and a second circuit board 103. The main circuit board 101 houses main circuit components such as a rectifier circuit 111, a smoothing capacitor 112, and an inverter circuit 113, as well as a power supply circuit 123, which supplies drive current to the motor from the terminal block 114. The first circuit board 102 houses a drive circuit 125 that detects the current of the inverter circuit 113 and outputs drive signals to it. The second circuit board 103 houses a communication circuit 131 responsible for communication between external devices and the power conversion device.

[0035] The drive circuit 125 and the communication circuit 131 are reinforced with insulation (the dashed area in the figure), and transmit signals to each other via optocouplers 121 and 122, which are insulating elements. In addition, the power supply circuit 123 receives the voltage Vdc1 across the smoothing capacitor 112, supplies power supply voltage Vdc2 to the drive circuit 125, and supplies power supply voltage Vdc3 to the communication circuit 131.

[0036] exist Figure 18 The diagram shows a circuit diagram of a flyback converter typically used as power supply circuit 123. (See diagram for example.) Figure 18 As shown, the power supply circuit 123 consists of an insulation transformer 124, rectifier diodes 201 and 202, smoothing capacitors 203 and 204, and a MOSFET 205. One terminal of the primary winding 1241 of the insulation transformer 124 is connected to a voltage Vdc1, and the other terminal is connected to the drain terminal of the MOSFET 205. For the primary winding 1241 of the insulation transformer 124, a pulse voltage is input through the switch of the MOSFET 205, and a voltage corresponding to the turns ratio of the insulation transformer 124 is output from the secondary windings 1242 and 1243. The power output from the secondary windings 1242 and 1243 is converted by a voltage conversion circuit as needed and consumed by loads such as the drive circuit 125 and the communication circuit 131. Furthermore, the primary winding 1241 and secondary winding 1242 located in the high-voltage section and the secondary winding 1243 located in the low-voltage section are mutually insulated.

[0037] In the power conversion device described in Patent Document 1, optocouplers 121 and 122 are mounted on the first circuit board 102, and in contrast, the power supply circuit 123 is mounted on the main circuit board 101. Therefore, the insulation-reinforced boundary portion is as follows: Figure 17 As shown, it is configured across the main circuit board 101 and the first circuit board 102. Therefore, a complex configuration of the insulation reinforcement boundary is required, which contributes to the increase in the size of the circuit board.

[0038] Example 1

[0039] Figure 1This is a block diagram of the power conversion device in Embodiment 1. Figure 1 As shown, the power conversion device described in Embodiment 1 consists of three circuit boards: a main circuit board 101, a first circuit board 102, and a second circuit board 103. The main circuit board 101 houses main circuit components such as a rectifier circuit 111, a smoothing capacitor 112, and an inverter circuit 113. That is, the main circuit components are located in the high-voltage section. The first circuit board 102 houses a drive circuit 125 that outputs drive signals to the inverter circuit 113, and an insulation transformer 124 that forms part of the power supply circuit 123. Details of the power supply circuit 123 are as follows... Figure 18 As described, the power supply circuit 123 includes an insulation transformer 124. The second circuit board 103 is equipped with a communication circuit 131 responsible for communication between the external device and the drive circuit. That is, the communication circuit 131 is located in the low-voltage section. An insulation-reinforced area is provided on the first circuit board 102. Figure 1 The dotted-line area contains an insulating transformer 124, which serves as a component of a power supply circuit that receives DC voltage and supplies power to various loads, and optocouplers 121 and 122, which are insulating elements that transmit signals between the drive circuit 125 and the communication circuit 131. The insulating reinforced area is formed by separating the high-voltage and low-voltage sections on the first circuit board 102 at a specified distance as defined in each specification.

[0040] Therefore, the insulating transformer 124, optocoupler 121, and 122, which are insulating elements constituting insulation reinforcement, are all mounted on the same circuit board, so the insulation reinforcement is completed within the first circuit board 102.

[0041] Furthermore, either the drive circuit 125 or the communication circuit 131 is preferably configured to include a microcomputer. For example, a microcomputer can be installed in the drive circuit 125, and the communication circuit 131 can process communication signals with external devices, communicating with the microcomputer installed in the drive circuit 125 via optocouplers 121 and 122. Alternatively, a microcomputer can be installed in the communication circuit 131, and after the drive circuit 125 calculates the current of the inverter circuit, it can be transmitted to the microcomputer installed in the communication circuit 131 via optocouplers 121 and 122, from which the microcomputer outputs drive signals to the inverter circuit via optocouplers 121 and 122. Alternatively, similar to Patent Document 1, a microcomputer can be installed in both the drive circuit 125 and the communication circuit 131.

[0042] Furthermore, as long as the features of Embodiment 1 are met, namely the structure of the insulation transformer 124, optocouplers 121 and 122 being provided on the first circuit board, the drive circuit 125 is not limited to being installed on the first circuit board 102; it can be installed anywhere in the high-voltage section. For example, it can also be installed as follows: Figure 2 As shown, it can be mounted on the main circuit board 101, or as... Figure 3 A third circuit board 104, connected to the main circuit board 101, is provided as shown and mounted on the third circuit board 104. Furthermore, although not shown, the communication circuit 131 is not limited to being mounted on the second circuit board 103; it can be mounted anywhere in the low-voltage section.

[0043] As described above, according to Embodiment 1, the insulating transformer 124, optocoupler 121, and 122, which are insulating elements constituting insulation reinforcement, are all mounted on the same circuit board. Therefore, insulation reinforcement is completed within the first circuit board 102, which enables the circuit board to be miniaturized.

[0044] Example 2

[0045] Next, Example 2 will be described. The basic circuit board structure and... Figures 1-3 The same as Embodiment 1 described herein, but in this embodiment... Figures 4-7 A specific example is given for the connection between the main circuit board 101 and the first circuit board 102.

[0046] Figure 4 , Figure 5 This is a basic structural diagram of the power conversion device in this embodiment. Figure 4 yes Figure 1 The diagram shows a 3D view of the circuit board structure. Figure 5 This is a bottom view. Similar to Embodiment 1, the main circuit board 101 primarily performs the power conversion function of receiving system voltage and outputting AC power for motor drive. The system voltage is received by terminal block 114 on the main circuit board 101 and then rectified by circuit 111 (see reference). Figure 5 The smoothing capacitor 112 and the inverter circuit 113 output AC power to the motor from the terminal block 114. The terminal block 114 and the smoothing capacitor 112 are located on the front side of the power conversion device on the main circuit board 101. Figure 4 (the forward direction). Figure 13 The diagram shows a perspective view of the power conversion device, with a display panel having a display section 141 or an operation section 142 serving as the front surface of the power conversion device. Additionally, a rectifier circuit 111 and an inverter circuit 113 are disposed on the rear side of the power conversion device and are engaged with heat sink fins, described later. A drive circuit 125, optocouplers 121 and 122, and an insulating transformer 124, which is a component of the power supply circuit 123, are mounted on the first circuit board 102.

[0047] In the power conversion device described in this embodiment, the main circuit board 101 and the first circuit board 102 are erected approximately vertically. The first circuit board 102 is mounted on the side of the main circuit board 101 opposite to the side where the rectifier circuit 111 and inverter circuit 113 are mounted. That is, the first circuit board 102 is mounted on the side of the main circuit board 101 to ensure space on the front side of the power conversion device where the rectifier circuit 111 and inverter circuit 113 are mounted. In addition, the first circuit board 102 is arranged facing the side of the terminal block 114 of the main circuit board 101. Therefore, compared to the case where the first circuit board 102 is mounted parallel to the main circuit board 101 and overlaps with it, airflow generated by natural convection can be ensured in the space on the front side of the main circuit board 101, thus ensuring the cooling performance of the rectifier circuit 111 and inverter circuit 113.

[0048] The insulation transformer 124 is disposed on the inner side of the power conversion device of the first circuit board 102 and is cooled by the aforementioned natural convection airflow. Alternatively, if it is desired to increase the mounting area of ​​the first circuit board 102, the first circuit board 102 can also be disposed on the side facing the terminal block 114.

[0049] Furthermore, the main circuit board 101 and the first circuit board 102 need to simultaneously transmit the voltage Vdc1 (hundreds of volts) of the smoothing capacitor 112 and the drive signal (several volts) output from the drive circuit 125 to the inverter circuit 113. With these wirings close together, there is a concern that noise superimposed on the low-voltage lines could cause circuit malfunctions. Therefore, it is possible to... Figure 4 As shown, a low-voltage transmission connector 115 and a high-voltage transmission connector 116 are provided, and multiple connectors are configured according to the type of signal.

[0050] in addition, Figure 4 , Figure 5 The main circuit board 101 and the first circuit board 102 are connected by circuit board to circuit board connectors (115, 116). Thus, the power conversion device can be constructed by inserting the first circuit board 102 into the main circuit board 101 from the front (front) side of the power conversion device, eliminating the need for soldering and allowing for easy assembly. However, the structure can be arbitrary as long as the main circuit board 101 and the first circuit board 102 are electrically connected; for example, pin headers can be used for soldering, or the main circuit board 101 and the first circuit board 102 can be directly connected by soldering.

[0051] In addition, such as Figure 4 , Figure 5As shown, the first circuit board 102 is physically connected to the main circuit board 101 via circuit board connectors 115 and 116. However, to further improve shock resistance, circuit board fixing parts 117 and 118 can be provided. Specifically, the circuit board fixing parts 117 and 118 are fixed to the main circuit board 101 by screwing or soldering, and are fixed to the first circuit board 102 by soldering or by clamping the circuit board into the clamps provided on the circuit board fixing parts 117 and 118.

[0052] Figure 6 , Figure 7 This is a basic structural diagram of the power conversion device in Example 2. Figure 6 yes Figure 2 The diagram shows a 3D view of the circuit board structure. Figure 7 yes Figure 3 A 3D view of the circuit board structure is shown. Figure 6 As shown, in Figure 2 In the circuit board structure shown, with Figure 4 , Figure 5 Similarly, in the structure shown, the first circuit board 102 is erected relative to the main circuit board 101, and the drive circuit 125 is mounted on the main circuit board 101. Additionally, as... Figure 7 As shown, in Figure 3 In the circuit board structure shown, with Figures 4-6 Similarly, in the structure shown, the first circuit board 102 is erected relative to the main circuit board 101, and the third circuit board 104 is erected relative to the main circuit board 101 via the circuit board connector 119. Thus, the drive circuit 125 can be installed in the high-voltage section without reducing the space through which the airflow generated by natural convection passes on the front side of the inverter circuit 113.

[0053] In addition, as long as the circuit board to circuit board connector 119 is electrically connected, the structure can be arbitrary. For example, pin headers can be used for soft soldering, or the main circuit board 101 and the third circuit board 104 can be directly connected by soft soldering.

[0054] According to Embodiment 2, the insulating transformer 124, optocoupler 121, and 122, which are insulating elements constituting insulation reinforcement, are all mounted on the same circuit board. Therefore, insulation reinforcement is completed within the first circuit board 102, which enables the circuit board to be miniaturized.

[0055] In addition, according to Embodiment 2, the first circuit board 102 is connected approximately perpendicularly to the main circuit board 101, which enables heat convection of the rectifier circuit 111 and inverter circuit installed on the main circuit board 101, thereby improving cooling efficiency.

[0056] Example 3

[0057] Next, Example 3 will be described. The basic circuit board structure and... Figures 1-3 The same as Embodiment 1 described herein, but in this embodiment... Figure 8 , Figure 9 A specific example is given for the connection between the first circuit board 102 and the second circuit board 103.

[0058] Figure 8 , Figure 9 This is a basic structural diagram of the power conversion device in Example 3. Figure 8 It's a 3D image. Figure 9 This is the bottom view. (For example...) Figure 8 , Figure 9 As shown, in the power conversion device described in this embodiment, the second circuit board 103 is arranged substantially parallel to the main circuit board 101, and the first circuit board 102 is arranged substantially perpendicular to both the main circuit board 101 and the second circuit board 103.

[0059] The second circuit board 103 is equipped with a communication circuit 131 responsible for communication between the external device and the power conversion device, and a terminal block 132 serving as the interface between the external device and the power conversion device. The user connects the external device to the terminal block 132 with a wire to build the required communication system.

[0060] Here, both the main circuit board 101 and the second circuit board 103 have terminal blocks (114, 132). Therefore, considering the user's work efficiency, it is preferable that both circuit boards are arranged parallel to the front of the product (the front of the power conversion device). In addition, by having the first circuit board 102 handle the signal transmission between the main circuit board 101 and the second circuit board 103, the signal transmission unit between the main circuit board 101 and the second circuit board 103 can be simplified, thus enabling the construction of a compact power conversion device.

[0061] Furthermore, when the user connects the wire to the terminal block 132, external force is applied from the front to the rear of the product. Here, when the main circuit board 101 and the first circuit board 102 are fixed together using the method described in Embodiment 2, and the first circuit board 102 and the second circuit board 103 are fixed together using soldering, pin headers, circuit board to circuit board connectors, etc., this external force is transmitted to the first circuit board 102 and the main circuit board 101 through the second circuit board 103, so there is a concern about damage to the connection between the circuit boards or damage to the circuit boards.

[0062] Therefore, as Figure 9As shown, circuit boards are used to transmit signals between the first circuit board 102 and the second circuit board 103 via cable connectors 126 and 133 and cable 127. Therefore, external forces applied to the second circuit board 103 do not affect the first circuit board 102, thus enabling the construction of a power conversion device with superior durability compared to fixing the first circuit board 102 and the second circuit board 103 together.

[0063] In addition, if the connection between the first circuit board 102 and the second circuit board 103 is a structure that allows external forces to escape, then there is no need to use cables. For example, a circuit board to circuit board movable (floating) connector can be used.

[0064] In addition, this embodiment is based on Figure 1 The circuit board structure shown Figure 4 The structures of the main circuit board 101 and the first circuit board 102 shown have been described for the configuration of the third circuit board 104, but for... Figure 2 , Figure 3 The circuit board structure shown Figure 5 , Figure 6 The basic structural diagram shown includes a third circuit board 104, and the same effect can be achieved by arranging it approximately perpendicular to the first circuit board 102.

[0065] Example 4

[0066] Next, for Example 4, using Figures 10-12 Please provide an explanation.

[0067] Figure 10 This is a block diagram of the power conversion device in this embodiment. In the power conversion device described in Embodiment 4, a fourth circuit board 105 having a display unit 141 or an operation unit 142 is added compared to the power conversion devices described in Embodiments 1 to 3.

[0068] The display unit 141 consists of a 7-segment LED displaying data such as frequency and set values, and a running indicator that illuminates when the inverter is running. The operation unit 142 consists of a RUN button pressed to start the inverter and a stop button pressed to slow down / stop the inverter. With the display unit 141 and the operation unit 142, the user's work efficiency is improved.

[0069] Figure 11 , Figure 12 It is relative to Figure 1 , Figure 4 , Figure 5 , Figure 8 , Figure 9 The diagram shown is a basic structural diagram of a power conversion device with a fourth circuit board added. Figure 11 It's a 3D image. Figure 12 This is a bottom view. Considering user efficiency, the display unit 141 and the operation unit 142 are preferably arranged parallel to the front of the product, similar to the main circuit board 101 and the second circuit board 103. Therefore, as... Figure 11 , Figure 12 As shown, the fourth circuit board 105 is connected to the second circuit board 103 in a substantially parallel manner via a circuit board to circuit board connector 134.

[0070] Example 5

[0071] Next, for Example 5, using Figures 13-16 Please provide an explanation.

[0072] Figure 13 This is a structural diagram of the power conversion device in Embodiment 5. In the power conversion device described in this embodiment, compared with the power conversion device described in Embodiment 4, housings 206-208 and heat dissipation fins 209 are added to protect each circuit board 101-105.

[0073] Figure 14 From Figure 13 The diagram illustrates the extraction of heat sink fins 209 and module housing 208. Heat sink fins 209 are configured to dissipate heat generated by the rectifier circuit 111 and inverter circuit 113 mounted on the main circuit board 101; the rectifier circuit 111 and inverter circuit 113 are fixed to the heat sink fins 209. Furthermore, to facilitate easy positioning of the rectifier circuit 111 and inverter circuit 113 when mounting them to the heat sink fins 209, the module housing 208 has pre-formed an opening in the section where the rectifier circuit 111 and inverter circuit 113 are mounted, and is fixed to the heat sink fins 209.

[0074] Here, when the module housing 208 and the heat dissipation fins 209 are fixed together with bolts, the same bolts can be used to fasten them together with other components. For example, when the circuit board fixing parts 117 and 118 described in Embodiment 2 are fixed to the first circuit board by screwing, the number of bolts can be reduced by using the same bolts to fasten the circuit board fixing parts 117 and 118, the first circuit board 102, the module housing 208, and the heat dissipation fins 209.

[0075] in addition, Figure 13 , Figure 14 The figure is not shown, but in order to further improve the heat dissipation performance of the power conversion device, a cooling fan can be added to the heat dissipation fins 209.

[0076] Figure 15 From Figure 13The figure shows the main housing 207 extracted from the module. The main housing 207 protects each circuit board 101 to 103 from the outside and is configured to be connected to the module housing 208 or the heat sink fins 209.

[0077] As described above, the first circuit board 102 and the main circuit board 101 are fixed to each other via circuit board connectors 115, 116 or circuit board fixing parts 117, 118. To further enhance shock resistance, a fixing part 2071 for fixing the first circuit board 102 can be provided on the main housing 207. Specifically, the first circuit board 102 is fixed to the main housing 207 by means of screwing or clamping into the gap provided on the fixing part 2071. Similarly, the second circuit board 103 is fixed to the main housing 207 by means of screwing or clamping into the gap provided on the fixing part 2072.

[0078] Figure 16 From Figure 13 The diagram illustrates the removal of the front cover 206. The front cover 206 externally protects the fourth circuit board 105, the display unit 141, and the operation unit 142, and is configured to engage with the main housing 207. Furthermore, the fourth circuit board 105 is fixed in contact with the front cover 206, and is configured such that the connector 134 engages when the front cover 206 is engaged with the main housing 207.

[0079] Explanation of reference numerals in the attached figures

[0080] 101, 102, 103, 104, 105: Circuit boards

[0081] 111: Rectifier circuit

[0082] 112: Smoothing Capacitor

[0083] 113: Inverter Circuit

[0084] 114, 132: Terminal blocks

[0085] 115, 116, 119, 126, 133, 134: Interconnection parts between circuit boards

[0086] 117, 118: Fixing parts between circuit boards

[0087] 121, 122: Optical couplers

[0088] 123: Power supply circuit

[0089] 124: Insulation Transformer

[0090] 1241: Primary winding

[0091] 1242, 1243: Secondary windings

[0092] 125: Drive circuit

[0093] 127: Cable

[0094] 131: Communication Circuit

[0095] 141: Display Section

[0096] 142: Operations Department

[0097] 201, 202: Rectifier diodes

[0098] 203, 204: Smoothing capacitors

[0099] 206, 207, 208: Shell

[0100] 209: Heat dissipation fins

[0101] 2071, 2072: Circuit board fixing parts provided in housing 207.

Claims

1. A power conversion device having a main circuit board, a first circuit board, and a second circuit board, characterized by: the power conversion device having a first circuit configured in a strong electric section, the main circuit board having configured in the strong electric section: a rectifier circuit that rectifies an alternating voltage to output a direct current voltage; and an inverter circuit that inverts the direct current voltage to output an alternating electric power, the second circuit board having a second circuit configured in a weak electric section, the first circuit board being connected with the main circuit board and the second circuit board, the first circuit board including: an insulation reinforcement region for reinforcing insulation of the strong electric section and the weak electric section; an insulation transformer configured in the insulation reinforcement region, which is a constituent member of a power supply circuit that receives the direct current voltage and supplies power to the first circuit and the second circuit; and an insulation element configured in the insulation reinforcement region, which transmits a signal between the first circuit and the second circuit, the first circuit that is a drive circuit outputting a drive signal to the inverter circuit being provided to the first circuit board, the first circuit board being provided standing on the main circuit board, the first circuit board and the second circuit board being configured substantially perpendicularly, the second circuit board facing the main circuit board.

2. The power conversion device according to claim 1, characterized in that: the second circuit is a communication circuit that transmits a signal with an external device.

3. The power conversion device according to claim 1, characterized in that: the first circuit board is configured on a side of the main circuit board opposite to a side on which the inverter circuit is mounted.

4. The power conversion device according to claim 1, characterized in that: the main circuit board has a terminal block for receiving the alternating voltage, a side of the first circuit board facing the terminal block.

5. The power conversion device according to claim 1, characterized by: having a first fixing member that contacts both the main circuit board and the first circuit board to fix them to each other.

6. The power conversion device according to claim 1, characterized by: having a fourth circuit board connected substantially horizontally with respect to the second circuit board, the fourth circuit board having at least one of an operation section for operating the inverter circuit and a display section for outputting an operation state of the inverter circuit, having: a heat sink that cools the inverter circuit; and a module housing that is fixed to the heat sink and has an opening section corresponding to a shape of the inverter circuit.

8. The power conversion device according to claim 7, characterized by: having a first fixing member that contacts both the main circuit board and the first circuit board to fix them to each other, any three or more of the heat sink, the module housing, the first fixing member, and the main circuit board being fastened by the same bolt.

9. The power conversion device according to claim 7, characterized by: having a main body housing configured in a manner engaging with the module housing, the main body housing having a second fixing member that fixes the first circuit board. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 7. The power conversion device of claim 1, wherein, ​ ​ ​ ​ ​ ​ ​ ​ ​ 10. The power conversion device of claim 7, wherein, ​ A fourth circuit board that is connected approximately horizontally relative to the second circuit board; The module housing, which is fixed to the heat dissipation fins, has an opening corresponding to the shape of the inverter circuit; The main housing is configured to engage with the module housing; and The front cover is constructed in a manner that engages with the main body housing. The front cover has a third fastener for securing the fourth circuit board.

Citation Information

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