Power distribution from point-of-load with cooling

Abstract

In one embodiment, a device includes: a substrate including a first surface and a second surface opposite the first surface; an integrated circuit attached to the first surface of the substrate; and a cooling plate attached to the second surface of the substrate, and the cooling plate has an electrical path extending through the cooling plate to transmit power from a power component connected to the cooling plate to the integrated circuit.

Description

Technical Field

[0001] The present disclosure relates generally to power distribution, and more particularly, to power distribution from a point-of-load (POL) with cooling. Background Art

[0002] As ASIC process nodes advance and device power continues to increase, delivering the necessary power becomes more challenging. Higher power delivery also brings additional thermal challenges. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Figure 1 is a block diagram illustrating an example of power distribution through a point-of-load (POL) module.

[0004] Figure 2 is a schematic perspective view of a POL module and a cooling plate including a power delivery block having power vias to deliver power from the POL module according to one embodiment.

[0005] Figure 3 According to an embodiment Figure 2 Schematic perspective view of a POL module and cooling plates, wherein the substrate-die package is inserted between two cooling plates.

[0006] Figure 4 According to an embodiment Figure 3 A cross-sectional schematic diagram of the assembly shown in FIG. 1 , showing additional details.

[0007] Figure 5 Schematically shows an embodiment of the attachment to Figure 2 The cooling plate Figure 4 components.

[0008] Figure 6 Control plane communications transmitted through a POL module and a cooling plate are shown according to one embodiment.

[0009] Figure 7 Control plane communications transmitted through one of the power delivery blocks in a cooling plate independent of the POL module are shown according to another embodiment.

[0010] Figure 8 Optical transmission through a cooling plate is shown according to one embodiment.

[0011] Fig. 9 Details of a power delivery block are shown according to one embodiment.

[0012] Fig.10 is a flow chart illustrating an overview of a process for implementing a power distribution system to deliver power from a POL module through a cooling plate, according to one embodiment.

[0013] Fig.11 is a side view showing an example of temperature distribution through a cooling plate according to one embodiment.

[0014] Fig.12 is a plan view of a cooling plate and a power delivery block according to one embodiment.

[0015] Fig.13 is a schematic perspective view of a cooling plate with a conditioning POL module inserted into the cooling plate according to one embodiment.

[0016] Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings. DETAILED DESCRIPTION

[0017] Overview

[0018] Various aspects of the invention are set out in the independent claims and preferred features are set out in the dependent claims. Features of one aspect may be applicable to each aspect alone or in combination with the other aspects.

[0019] In one embodiment, a device generally includes: a substrate including a first surface and a second surface opposite the first surface; an integrated circuit attached to the first surface of the substrate; and a cooling plate attached to the second surface of the substrate, and the cooling plate has an electrical path extending through the cooling plate to transmit power from a power component connected to the cooling plate to the integrated circuit.

[0020] In one or more embodiments, the cooling plate includes a plurality of electrical pathways to transfer power from the power components to the integrated circuit.

[0021] In one or more embodiments, the power assembly includes a regulated point-of-load (POL) module interconnected with a fixed POL module via an electrical connection.

[0022] In one or more embodiments, the substrate and the integrated circuit include a multi-chip module.

[0023] In one or more embodiments, the integrated circuit comprises an application specific integrated circuit (ASIC) operable to perform network processing functions.

[0024] In one or more embodiments, the apparatus further includes a second cooling plate and a thermal interposer, the thermal interposer being located between the second cooling plate and the integrated circuit.

[0025] In one or more embodiments, the cooling plate includes a power delivery block inserted into the cooling plate, and the electrical path extends through the power delivery block.

[0026] In one or more embodiments, the power delivery block includes a printed circuit board, and the electrical path includes a power via formed in the printed circuit board.

[0027] In one or more embodiments, power is transmitted through the power via at a current of at least 10 amps.

[0028] In one or more embodiments, the cooling plate includes a plurality of printed circuit boards inserted into the cooling plate, each printed circuit board of the plurality of printed circuit boards includes at least one power via to form an electrical path.

[0029] In one or more embodiments, the power component is configured to receive pulsed power.

[0030] In one or more embodiments, at least one component on the substrate is coupled to optical fiber and copper wire connections.

[0031] In one or more embodiments, the cooling plate further comprises a communication path to transmit communications through the cooling plate.

[0032] In one or more embodiments, the cooling plate further comprises an opening to enable optical transmission through the cooling plate.

[0033] In one or more embodiments, the cooling plate comprises a multi-phase cooling plate.

[0034] In one or more embodiments, the power assembly includes a fixed point of load (POL) module, and the electrical path includes a regulating POL module located within the cooling plate and coupled to the fixed POL module to deliver power from the fixed POL module to the integrated circuit.

[0035] In another embodiment, an apparatus generally includes: a point-of-load (POL) power supply, the POL power supply including a fixed POL, the fixed POL interconnected with a regulating POL, the regulating POL electrically coupled to a substrate-die package; and a cooling plate interposed between the regulating POL and the substrate-die package. Power is transmitted from the regulating POL to the substrate-die package through the cooling plate.

[0036] In another embodiment, an apparatus generally includes a cooling plate including an upper surface configured to receive a point-of-load (POL) module and a lower surface configured to be attached to a substrate having at least one die attached thereto, and a power delivery block inserted into the cooling plate and including at least one power via to deliver power from the POL module to the die attached to the substrate.

[0037] In yet another embodiment, a method includes inserting a power delivery block into a cooling plate, the power delivery block including an electrical path extending from a first surface of the cooling plate to a second surface of the cooling plate; attaching a point of load (POL) module to the first surface of the cooling plate; and attaching a substrate to the second surface of the cooling plate, wherein a die is attached to an opposite side of the substrate. Power is distributed from the POL module to the die through the power delivery block in the cooling plate.

[0038] A further understanding of the features and advantages of the embodiments described herein may be realized by reference to the remainder of the specification and drawings.

[0039] Exemplary Embodiments

[0040] The following description is presented to enable one of ordinary skill in the art to make and use the embodiments. The description of specific embodiments and applications is provided as an example only, and various modifications will be apparent to those skilled in the art. The general principles described herein may be applied to other applications without departing from the scope of the embodiments. Therefore, the embodiments are not limited to those shown, but should be given the widest range consistent with the principles and features described herein. For the sake of clarity, details related to technical materials known in the technical field related to the embodiments are not described in detail.

[0041] The power distribution system can be configured to deliver power from the point of load (POL) to an application-specific integrated circuit (ASIC) or other integrated circuit. As power requirements increase, additional thermal considerations may be required. Packaged optical applications may present additional challenges. For example, optical fiber and copper wire attachment (fiber attachment (array) unit (FAU), copper attachment (array) unit (CAU)) may introduce clearance requirements that affect cooling solutions.

[0042] Embodiments described herein provide a power delivery and cooling arrangement in which a substrate is positioned adjacent to one side of a cooling plate and a POL component is placed on an opposite side of the cooling plate. As described in detail below, an electrical pathway is formed in the cooling plate to allow power to be transferred from the POL to an electronic component (die, integrated circuit, ASIC, chip) coupled to the substrate. The cooling plate may include, for example, a power delivery block (e.g., a printed circuit board PCB) having one or more power vias to transfer power through the cooling plate. In another example, the cooling plate may include a power component (e.g., a regulating POL) to transfer power through the cooling plate.

[0043] In one or more embodiments, a device includes a POL power supply, the POL power supply includes a fixed POL, the fixed POL is interconnected with a regulating POL, the regulating POL is electrically coupled to a substrate-die package; and a cooling plate, the cooling plate is inserted between the regulating POL and the substrate-die package. Power is transmitted from the regulating POL to the substrate-die package through the cooling plate. If additional cooling is required, the substrate-die package can be positioned between two cooling plates. In one or more embodiments, a large amount of current (e.g., ≥500 amps, ≥1000 amps) is transmitted to the substrate-die package, thereby allowing for improved efficiency.

[0044] The embodiments described herein operate in the context of a data communication network including a plurality of network devices. The network may include any number of network devices (e.g., routers, switches, gateways, controllers, edge devices, access devices, aggregation devices, core nodes, intermediate nodes, power supply devices, powered devices, or other network devices) communicating via any number of nodes, which facilitates data transmission within the network. One or more network devices may include one or more power distribution systems described herein. The network device may also include any combination of memory, processor, power supply unit, and network interface.

[0045] Now referring to the drawings, first Figure 1 , a block diagram showing an example of power distribution through a POL power supply located on a board 10 according to one embodiment. Power is delivered from the element 12 to a plurality of POLs (POL modules (circuits), power components) 14a, 14c, 14d, 14e. In one example, pulse power at a voltage greater than 100V (e.g., 108V, 380V) or any other suitable voltage is delivered to the fixed POL 14a. The power supply 12 may also deliver pulse power to the POLs 14c, 14d, and 14e (e.g., fixed POLs). In another example, the power supply 12 delivers 54V DC power to the POL modules 14c, 14d, 14e, or any other suitable voltage (e.g., an intermediate bus voltage level selected based on overall system efficiency, routability, and cost). The fixed POL 14a transmits power (e.g., 54V DC or other voltage) to the regulating POL (POL converter, POL regulator) 14b, which distributes the power to the ASIC 16 (e.g., integrated circuit, die, chip, multi-chip module, etc.). As described below, the fixed POL 14a can be connected to the regulating POL 14b via a busbar interconnect or any other suitable electrical connection. The regulating POL 14b can provide an output of, for example, 150 amps or more. For example, each power connection can include 10 Mbps (or any other data rate) communication. In Figure 1In the example shown, power is delivered via a voltage rail from the regulated POL module 14b to the ASIC 16. For example, power may be provided to the ASIC 16 in a multi-point arrangement.

[0046] It should be understood that the term "POL module" used herein may refer to various types of POL configurations, including, for example, discrete POLs and modules or voltage regulator designs based on power delivery blocks. In addition, it may be noted that a POL may be a single-phase or multi-phase POL that may work together to deliver one or more outputs.

[0047] System components (POL modules, cooling plates, electronic packages (substrate-die packages)) are connected to board 10. Board 10 may include a printed circuit board, or the components may be directly attached to a sheet metal module, line card, or any other suitable support. For example, the line card circuit board may be removed and the electronic packages interconnected by optical fiber and copper connections at the edge of the ASIC.

[0048] As described above, pulse power can be provided to one or more POL modules. As used herein, the term "pulse power" (also referred to as "pulsating power") refers to power delivered in multiple voltage pulses (voltage pulse sequence) 18, wherein the voltage varies between a very small voltage (such as 0V, 3V) during the pulse off period 19a and a larger voltage (such as ≥12V) during the pulse on period 19b. High voltage pulse power (high voltage pulse) (e.g., >56V, ≥60V, ≥300V) can be transmitted from a power supply equipment (PSE) to a powered device (PD) for powering the powered device, while low voltage pulse power (low voltage pulse) (e.g., ~12V, ~24V, ≤30V, ≤56V) can be used for startup (e.g., initialization, synchronization, charging a local energy storage device, powering up a controller, testing, or any combination thereof) in a very short time interval. Pulse power can also be delivered in multiple phases, where pulses compensate each other between phases to provide continuous power. For example, pulsed power can be transmitted through cables, transmission lines, bus bars, backplanes, PCBs, and power distribution systems.

[0049] It should be understood that the voltage, power, and current levels described herein are provided as examples only, and power may be delivered at different levels (volts, amperes, watts) than described herein without departing from the scope of the embodiments. In addition, power may be delivered as Extended Safe Power (ESP) (e.g., pulsed power, multi-phase pulsed power, pulsed power with fault detection and safety protection), Power over Ethernet (PoE), or according to any current or future standard.

[0050] Figure 22 is a schematic perspective view showing the connection between the fixed POL 20 and the regulating POL 22 and the distribution of power through the cooling plate 25 according to one embodiment. The fixed POL module 20 can provide input power to the regulating POL module 22 via electrical connections 24, which include, for example, bus bars, wires, or other interconnects. For simplicity, only one POL module 22 is shown connected to the cooling plate 25, however, any number of POL modules can be connected to the cooling plate. Each POL can provide a single voltage rail or multiple voltage rails, such as Figure 1 shown.

[0051] like Figure 2 As shown, the cooling plate 25 includes a plurality of power delivery blocks 26, each of which includes a plurality of power vias (electrical paths) 28 to transmit power from the POL module 22 to the electronic package (substrate-die package) through the cooling plate (hereinafter referred to as Figure 4 Power is supplied from a first side of the cooling plate 25 (e.g., Figure 2 The upper surface 27a shown in FIG. 2 is transferred to a second side of the cooling plate 25 (e.g., as shown in FIG. Figure 2 The lower surface 27b shown is opposite to the first side and is generally parallel to the first side. In one or more embodiments, the power delivery block 26 includes a small (micro) power printed circuit board. Other components may also be inserted into the cooling plate 25, or strategically placed cutouts may also be used, depending on the application.

[0052] It should be noted that the terms lower, upper, bottom, top, below, above, horizontal, vertical, etc. that may be used herein are relative terms that depend on the orientation of the package and components and should not be interpreted in a limiting manner. These terms describe a reference point and do not limit the embodiments to any particular orientation or configuration.

[0053] The power delivery block 26 includes a plurality of through holes (vias) 28 that extend through the entire thickness of the power delivery block (eg, Figure 3 The through holes may be formed using a drilling process and plated with a metal material (e.g., copper or any conductive or metallic layer). The plating may effectively cover the cylindrical inner wall of the hole, thereby forming an electrical path through the cooling plate 25.

[0054] The term "power delivery block" as used herein may refer to any block of thermal and conductive material in which electrical pathways (e.g., power vias) may be formed to allow power to be delivered directly through the cooling plate 25. Although the term "printed circuit board" is used herein as an example of a substrate for the power delivery block 26, in other embodiments, the PCB may be replaced with other substrates (e.g., ceramic circuit boards) or other components. In addition, non-printed circuit boards may also be used for the power delivery block 26. For example, a piece of glass may be laser patterned with waveguides and plated with metal vias to form a combined optical and electrical pathway. In addition, as previously described, other components in addition to or in place of the PCB may be inserted into the cooling plate.

[0055] The cooling plate 25 may include, for example, liquid, gas, or multi-phase (multi-phase cooling plate) based cooling. For example, the power via 28 may deliver 10 amps of current per tube and may be cooled by the cooling plate 25. In one or more embodiments, the cooling plate 25 is formed with one or more openings for inserting one or more power delivery blocks 26. For example, the power delivery block 26 may be pressed into the cooling plate 25 and matched therewith. Epoxy or adhesive filler may be used to press and position the power delivery block 26 within the cooling plate 25. Epoxy may be used taking into account the tolerance between the power delivery block 26 and the cooling plate opening. If the cooling plate 25 uses cooling tubes or reservoirs, these components are routed or positioned around the power delivery block opening. The cooling plate 25 keeps the temperature rise of the power via 28 at a low level, thereby maximizing the current transmission from the POL 22 to the substrate-die package. In one example, the cooling plate 25 is configured with multiple internal areas to keep the optical temperature below 75 degrees Celsius. Fig.11 An example of temperature distribution through a cooling plate is shown, which will be described below. It should be understood that the cooling plates and temperatures described herein are examples only, and other designs may be used to maintain cooling at different temperatures.

[0056] like Figure 3 As shown, the power delivery block 26 and the vias 28 formed therein extend through the cooling plate 25 to provide power to the attached electronic package (substrate-die package) 31. For simplicity, only a portion of the power delivery block 26 and the vias 28 are shown in phantom, which extend through the cooling plate 25. In addition, the electronic package 31 is shown as a single block structure, but it should be understood that the package can include one or more substrates, with any number of components (integrated circuits, ASICs, dies, chips, chiplets, optical engines, FAU / CAU) attached to the substrate, as described below with respect to Figure 4 described.

[0057] In one or more embodiments, an apparatus includes a cooling plate 25 including an upper surface 27a configured to receive a point-of-load (POL) module 22 and a lower surface 27b configured to be attached to a substrate having at least one die (e.g., Figure 4 and a power delivery block 26 that is inserted into the cooling plate and includes power vias 28 to deliver power from the POL module to the die attached to the substrate.

[0058] In one or more embodiments, an additional cooling plate 37 may be used, wherein the electronic package 31 is inserted between the two cooling plates 25, 37 to provide additional cooling to the electronic package. It may be noted that the use of a second cooling plate 37 is optional based on power and cooling requirements. Figure 5 , Figure 6 , Figure 7 and Figure 8 The second cooling plate is not shown in the example of FIG. 3 , but may also be used.

[0059] Furthermore, it should be understood that the cooling plate may include any number of individual cooling plates. For example, the cooling plate 25 may include two or more smaller cooling plates with one or more power delivery blocks or electrical pathways interposed between the cooling plates.

[0060] Reference now Figure 4 , shows a schematic cross-sectional view of a device, the device comprising: a substrate 41, the substrate 41 having a first surface 41a and a second surface 41b opposite to the first surface; an integrated circuit (one or more dies (chips)) 43, the integrated circuit 43 is attached to the first surface of the substrate; and a cooling plate 45, the cooling plate 45 is attached to the second surface of the substrate, and the cooling plate includes an electrical path (e.g., power via) 48 extending through the cooling plate to transmit power from a power component (e.g., a POL module) 42 to the integrated circuit. As used herein, the term "substrate" may refer to a circuit board, a ceramic board, or an element formed of any other suitable material.

[0061] A bus bar 44 is shown connected to a multi-zone POL 40 (e.g., having a DC power supply to the rail voltage), and a POL module 42 is attached to a cooling plate 45, which is configured to distribute power from the POL module to an electronic package that includes a substrate 41 and an integrated circuit 43 (ASIC, network processing unit NPU, die, chip) and two optical engines (photonic chips) 49 (SerDes (serializer / deserializer) chiplets) attached thereto. An electronic package (also referred to herein as a substrate-die package) may include one or more integrated circuits, ASICs, NPUs, MCMs, dies, chips, chiplets, processors, or electronic components attached to one or more substrates. Figure 4 In the example of FIG. 4 , the substrate-die package includes a substrate 41, an NPU 43, an optical engine 49, and a FAU / CAU 50. It should be understood that this is merely an example, and the substrate-die package may include any number of components in any arrangement. The FAU / CAU 50 may be attached to the lower surface of the optical engine 49 (e.g., Figure 4 As shown) or positioned on the upper surface or side of the optical engine 49. Figure 4 In the example of FIG. 4 , the second cooling plate 47 is thermally coupled to the NPU 43 via a thermal conductor (interposer) 51. The thermal conductor (or multiple thermal conductors) can be positioned on multiple dies. One or more embodiments can also include an optional cover between the multi-chip module and the cooling plate 47.

[0062] As described above, the cooling plate 45 includes one or more power delivery blocks 46 (e.g., PWRPCB) inserted into the cooling plate, in which one or more electrical paths (power vias) 48 are formed. In one or more embodiments, the power delivery blocks 46 are formed separately from the cooling plate 45 and inserted into openings 56 formed in the cooling plate for accommodating these blocks. As discussed above, epoxy or adhesive fillers can be used to press and position the power delivery blocks in the openings 56 of the cooling plate 45.

[0063] The substrate 41 may include traces 53 and pads 55 embedded in or deposited on the substrate for connecting with the power vias 48 and the die 43. As is well known to those skilled in the art, etching, deposition, bonding or other processes may be used to form the traces and pads. As is well known to those skilled in the art, the substrate 41 may be bonded to the cooling plate 45 using a welding process.

[0064] In one example, Figure 4The entire assembly shown in can have a height of less than 50 mm. For example, the POL module 42 can have a height of about 15 mm to 20 mm, the cooling plates 45, 47 can each have a height of about 5 mm to 8 mm, and the optical engine 49 can have a height of about 2 mm to 3 mm. The package can be, for example, 70 mm x 70 mm or larger. It should be understood that Figure 4 The dimensions, components, and arrangements shown in are examples only, and other types or numbers of components having different dimensions and arrangements may be used, or additional components may be used without departing from the scope of the embodiments. For example, one or more integrated circuits may be positioned on the upper surface of the cooling plate 45 (the side opposite to the substrate 41).

[0065] Figure 5 Schematically shows the Figure 2 4. The placement of the substrate-die package (substrate 41, ASIC 43, photonic chip 49, FAU / CAU 50) below the cooling plate 25 shown in FIG. As described above, the substrate 41 may include any number of ASICs 43 operable to receive power from one or more POL modules 22 located on the upper surface of the cooling plate 25, or a single substrate-die package may be located below the cooling plate.

[0066] In addition to power being delivered through the power delivery block 26, communications (e.g., control plane communications) may also be delivered through the power delivery block. In one or more embodiments, control communications for regulating the POL and for the ASIC to the system FPGA (field programmable gate array) may be through the cooling plate 25 or through a ribbon cable.

[0067] Figure 6 An example is shown where control plane communications are passed through the POL circuitry (POL modules 60, 62 and interconnects) and through communications vias 68 formed in the power delivery block 66 along with the power vias 28. Figure 6 In the example shown, control plane communications pass through fixed POL 60 via path 64a, through the interconnect at 64b, and through regulation POL 62 at path 64c. In addition to power vias 28, power delivery block 66 also includes communication vias 68 to provide an electrical and communication path through cooling plate 25 to substrate-die package 31. In one example, lower speed communications are transmitted through the POLs (e.g., 200 Mbps range). Cooling plate 25 can include any combination of power delivery blocks with power vias, communication vias, or both power vias and communication vias.

[0068] Figure 7Another example of providing control plane communications is shown through separate communication elements 70, 71 (e.g., via a ribbon cable or other means) that can be used to move control communications into and out of the package. The communication module 71 interfaces with a communication block 76 (e.g., a PCB) inserted into the cooling plate 25. The communication block 76 includes one or more communication pathways (vias) 78 formed therein. In one or more embodiments, full-speed PCIe (Peripheral Component Interconnect Express) or faster can be used. The cooling plate 25 can be connected to any number of POL modules 22 and communication modules (COMM 71) or their combination.

[0069] In one or more embodiments, optical transmission may also pass through the cooling plate and substrate so that both power and optical connections are at the POL and bus bar. Figure 8 An example is shown in which a channel is formed to allow light to pass through the cooling plate 85 and the packaging substrate to reach the optical engine (photonic die) 49. For example, the channel 80 can be configured for light, laser-written glass waveguides, free space optics, or optical fibers. Cutouts can be made in the cooling plate 85 and the substrate 81, and the channel 80 can be inserted into the cutout to connect the POL module 82 and the bus bar 24 to the photonic chip 49. The channel 80 can include, for example, one or more waveguides that define an optical component, or include an opening for accommodating an optical fiber. As shown in FIG. Figure 8 As shown, the channel structure 80 can be aligned to and exposed to the photonic die 49 and the power bridge (power component), or can be interconnected by, for example, connectors with interlocking features. The channel 80 can be attached to the die using an active or passive alignment process and an adhesive (e.g., an index matching epoxy). In addition, as described above, the optical pathway can be combined with the electrical pathway. For example, a piece of glass can be laser patterned with a waveguide and plated with metal vias to form a combined optical pathway and electrical pathway. In addition, more than one channel 80 can be formed in the cooling plate 85 and the substrate 81 to communicate with one or more photonic dies 49.

[0070] In one or more embodiments, the channel structure 80 for the optical device can be part of a dedicated cutout for a light path separated from the electronic device. Figure 7 In the embodiments described above for communication in FIG. 1 , one or more of the power delivery blocks 26 may be replaced with an optical channel structure.

[0071] Fig. 9 is a perspective view of a power delivery block 96 according to one embodiment. As described above, the power delivery block 96 may include a printed circuit board or other substrate, such substrate including multiple layers 90a, 90b, 90c, 90d. The inner plane layers 90b, 90c may provide greater current density. Planes may be added to provide power filtering shapes to provide LC (inductor capacitor) filtering in the power delivery structure. Fig. 9 In the example shown, two PCBs are used, and components 94 (e.g., capacitors, inductors, POL components, field effect transistors FETs, controllers, etc.) are inserted between the two PCBs. It should be understood that the power delivery block can include any number of layers, a single block, multiple blocks with components mounted therebetween, and any number of vias 92 for power or communication.

[0072] Fig.10 1 is a flow chart showing an overview of a process for implementing a power distribution and cooling system according to one embodiment. At step 100, the power delivery block 46 is inserted into the cooling plate 45 ( Figure 4 and 10 As described above, the power delivery block may include a PCB or other substrate having one or more electrical pathways (power vias) extending therethrough. For example, the power delivery block 46 may be pressed into the cooling plate 45 and secured in place with an epoxy or adhesive filler. The POL module 42 is attached to the first surface of the cooling plate ( Figure 4 The upper surface of the cooling plate (step 102), and the substrate 41 with the die 43 is attached to the second surface of the cooling plate ( Figure 4 The power is distributed from the POL module to the die through a power delivery block in the cooling plate (step 106).

[0073] It should be understood that Fig.10 The processes shown in and described above are merely examples, and the steps may be added, modified, combined, or reordered without departing from the scope of the embodiments. For example, if optical channel 80 is used, the channel may be attached to the die / optical engine first.

[0074] Fig.11 is a side view showing an example of a cooling plate temperature distribution according to one embodiment. As described above, the POL module 122 is mounted on a first cooling plate 125 including a power via 128. The substrate-die package 131 is disposed on the opposite side of the first cooling plate 125 and is inserted between the first cooling plate 125 and the second cooling plate 137. As described above, a thermal conductor may be positioned between the die and the second cooling plate 137. The flow direction through the cooling plates 125 and 137 is indicated by arrows on the cooling plates. Fig.11 The temperature profile example shown is for an inlet temperature of 20 degrees Celsius and a flow rate of 5.0 LPM (2 x 2.5 LPM) in an 1800 W package.

[0075] Fig.121 is a plan view of a cooling plate 125 and a power delivery block 126 according to one embodiment. As shown by the arrows, the flow direction is from the inlet manifold 127 to the exhaust manifold 129. Four power delivery blocks 126 with power vias 128 are inserted into the cooling plate 125. In one example, the cooling plate 125 has a variable fin density to obtain uniform flow at a given cross section. For example, the cooling plate 125 may include low-density fin rows 140 along the outer edge of the cooling plate and high-density fin rows 142 along the central portion of the cooling plate. In one example, the second cooling plate 137 ( Fig.11 ) can have uniform fin density. Fin pitch, thickness, number of fins, and manifold channel size can be optimized to minimize pressure drop and obtain nearly uniform flow for both cooling plates.

[0076] Fig.13 Another embodiment of a power distribution system is shown. Fig.13 In the example shown, the regulating POL modules 152 are inserted directly into openings formed in the cooling plate 155. As described above, the regulating POL modules 152 can each be connected to the fixed POL modules 150 for delivering power from the fixed POL to the substrate-die package attached to the opposite side of the cooling plate (not shown). In this embodiment, the regulating POL modules 152 define an electrical path from the fixed POL module 150 coupled to the regulating POL module through the connection 154. A thermal interface or heat transfer path can be provided for the embedded POL modules 152.

[0077] As can be seen from the above, one or more embodiments described herein provide advantages over conventional systems. For example, one or more embodiments allow large amounts of current to be efficiently delivered to an electronic package (e.g., ≥ 1000 amps). In one or more embodiments, the arrangement of the cooling plate (or multiple cooling plates), substrate, and die allows for improved thermal efficiency. A power delivery block inserted into the cooling plate allows cooling of the power vias while providing an electrical path from the power component directly through the cooling plate to the integrated circuit.

[0078] In summary, in one embodiment, a device includes: a substrate including a first surface and a second surface opposite the first surface; an integrated circuit, the integrated circuit attached to the first surface of the substrate; and a cooling plate, the cooling plate attached to the second surface of the substrate, and the cooling plate has an electrical path extending through the cooling plate for transmitting power from a power component connected to the cooling plate to the integrated circuit.

[0079] Although the apparatus and method have been described according to the illustrated embodiments, it will be readily appreciated by those skilled in the art that changes may be made to the embodiments without departing from the scope of the embodiments. Therefore, all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative rather than limiting.

Claims

1. A device for power distribution, comprising: a substrate comprising a first surface and a second surface opposite to the first surface; an integrated circuit attached to the first surface of the substrate; as well as a cooling plate attached to the second surface of the substrate and having an electrical pathway extending through the cooling plate for transmitting power from a power component connected to the cooling plate to the integrated circuit, wherein the cooling plate includes a power delivery block inserted into the cooling plate, the electrical path extending through the power delivery block, and Wherein, the power delivery block includes a printed circuit board, and the electrical path includes a power via formed in the printed circuit board.

2. The device according to claim 1, wherein: The cooling plate includes a plurality of electrical pathways for transferring the power from the power component to the integrated circuit.

3. The device according to claim 1 or 2, wherein: The power assembly includes a regulating point-of-load (POL) module interconnected with a fixed POL module via an electrical connection.

4. The device according to claim 1 or 2, wherein: The substrate and the integrated circuit comprise a multi-chip module.

5. The device according to claim 1 or 2, wherein: The integrated circuit comprises an application specific integrated circuit ASIC operable to perform network processing functions, and wherein at least one optical engine is attached to the substrate.

6. The device according to claim 1 or 2, further comprising: A second cooling plate and a thermal interposer are provided, the thermal interposer being positioned between the second cooling plate and the integrated circuit.

7. The device according to claim 6, wherein: The power is transmitted through the power via at a current of at least 10 amperes.

8. The device according to claim 1 or 2, wherein: The cooling plate includes a plurality of printed circuit boards inserted into the cooling plate, each of the plurality of printed circuit boards including at least one power via forming the electrical path.

9. The device according to claim 1 or 2, wherein: The power component is configured to receive pulsed power.

10. The device according to claim 1 or 2, wherein: At least one component on the substrate is coupled to an optical fiber and a copper connection.

11. The device according to claim 1 or 2, wherein: The cooling plate also includes a communication path for transmitting communications through the cooling plate.

12. The device according to claim 1 or 2, wherein: The cooling plate and the base plate further include openings for optical transmission through the cooling plate and the base plate.

13. The device according to claim 1 or 2, wherein: The power assembly includes a fixed POL module, and the power assembly includes a regulating POL module located within the cooling plate and coupled to the fixed POL module for delivering power from the fixed POL module to the integrated circuit.

14. A device for power distribution, comprising: a point-of-load (POL) power supply including a fixed POL interconnected with a regulating POL electrically coupled to a substrate-die package; as well as a cooling plate interposed between the conditioning POL and the substrate-die package, wherein the cooling plate includes a plurality of electrical pathways for transmitting power from the conditioning POL to the substrate-die package; wherein power is transmitted from the conditioning POL to the substrate-die package via the cooling plate, wherein the cooling plate includes a power delivery block inserted into the cooling plate, the electrical path extending through the power delivery block, and Wherein, the power delivery block includes a printed circuit board, and the electrical path includes a power via formed in the printed circuit board.

15. The apparatus of claim 14, wherein the substrate-die package comprises at least one optical engine and an application specific integrated circuit (ASIC) operable to perform network processing functions.

16. The device according to claim 14 or 15, further comprising: A second cooling plate, wherein the substrate-die package is interposed between the cooling plate and the second cooling plate.

17. The device according to claim 14 or 15, wherein: The fixed POL is operable to receive pulsed power.

18. A device for power distribution, comprising: a cooling plate comprising an upper surface configured to receive a point-of-load (POL) module and a lower surface configured to be attached to a substrate having at least one die attached thereto; as well as a power delivery block inserted into the cooling plate and including power vias for delivering power from the POL module to a die attached to the substrate, Wherein, the power delivery block comprises a printed circuit board.

19. The device according to claim 18, wherein: The apparatus includes a plurality of power delivery blocks, each of the plurality of power delivery blocks including a plurality of power vias.

20. The device according to claim 18 or 19, wherein: The power delivery block also includes a via for transmitting communications through the via.

21. The device according to claim 18 or 19, wherein: The cooling plate also includes openings for optical transmission therethrough.

22. A method for power distribution, comprising: inserting a power delivery block into the cooling plate, the power delivery block comprising an electrical pathway extending from a first surface of the cooling plate to a second surface of the cooling plate; attaching a point-of-load (POL) module to the first surface of the cooling plate; as well as attaching a substrate to the second surface of the cooling plate, wherein the die is attached to an opposite side of the substrate, wherein power is distributed from the POL module to the die through the power delivery block in the cooling plate, Wherein, the power delivery block includes a printed circuit board, and the electrical path includes power vias for transmitting power through the cooling plate.

23. The method according to claim 22, wherein: A plurality of chips are attached to the substrate, at least one chip of the plurality of chips comprising a photonic chip, and the method further includes forming an opening in the cooling plate for optical transmission therethrough.

24. The method according to claim 22 or 23, further comprising: The die is thermally coupled to a second cooling plate.

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