Multilayer electronic component

Abstract

A multilayer electronic component includes a main body including dielectric layers and first and second internal electrode layers alternately stacked in a stacking direction, and each dielectric layer is interposed between the first and second internal electrode layers. The first internal electrode layer includes a first internal electrode and a second internal electrode disposed with a first spacer interposed therebetween, and the second internal electrode layer includes a third internal electrode and a fourth internal electrode disposed with a second spacer interposed therebetween.

Description

[0001] This application is a divisional application of the patent application "Multilayer Electronic Component" with application number 202010081845.3 and filing date February 6, 2020. TECHNICAL FIELD

[0002] The present disclosure relates to a multilayer electronic component. BACKGROUND

[0003] A multilayer ceramic capacitor (MLCC), which is a kind of multilayer electronic component, can be a chip capacitor for charging in or discharging from various electronic products, such as imaging devices including liquid crystal displays (LCDs), plasma display panels (PDPs), etc., and computers, smartphones, mobile phones, etc., mounted on printed circuit boards.

[0004] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its relatively small size, relatively high capacity, and relatively easy installation. As various electronic devices such as computers, mobile devices, etc. are miniaturized and increased in output, there is an increasing demand for miniaturization and high capacity of multilayer ceramic capacitors.

[0005] In addition, as interest in vehicle electrical / electronic components has recently increased, multilayer ceramic capacitors also need relatively high reliability and relatively high strength to be used in vehicles or infotainment systems.

[0006] In order to secure high capacity in a multilayer ceramic capacitor, the number of layers stacked therein should be increased. However, as the number of layers stacked therein increases, delamination of a capacitance forming part and a protective layer can occur during a manufacturing process, or cracks can occur.

[0007] Therefore, there can be a need to develop a multilayer ceramic capacitor capable of inhibiting the occurrence of delamination of a capacitance forming part and a protective layer, the occurrence of cracks, etc. SUMMARY

[0008] An aspect of the present disclosure is to provide a multilayer electronic component having improved mechanical strength.

[0009] An aspect of the present disclosure is to provide a multilayer electronic component having excellent moisture resistance reliability.

[0010] An aspect of the present disclosure is to inhibit the occurrence of delamination of a capacitance forming part and a covering part, the occurrence of cracks, etc.

[0011] An aspect of the present disclosure is to prevent poor contact between an internal electrode and an external electrode.

[0012] However, the purpose of the present disclosure is not limited to the above description, and the purpose of the present disclosure will be more easily understood in the course of describing specific embodiments of the present disclosure.

[0013] According to an aspect of the present disclosure, a multi-layer electronic component includes a main body including dielectric layers and first and second internal electrode layers alternately stacked in a stacking direction, and each dielectric layer is interposed between the first and second internal electrode layers, and the main body includes first and second surfaces opposite to each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces, respectively, and opposite to each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces, respectively, and opposite to each other; and first and second external electrodes arranged on the third and fourth surfaces, respectively. The first internal electrode layer includes a first internal electrode and a second internal electrode exposed from the third surface and arranged with a first interval portion interposed between the first and second internal electrodes, a first lead portion connected to the first internal electrode and exposed from the third and sixth surfaces, and a second lead portion connected to the second internal electrode and exposed from the third and fifth surfaces, and the second internal electrode layer includes a third internal electrode and a fourth internal electrode exposed from the fourth surface and arranged with a second interval portion interposed between the third and fourth internal electrodes, a third lead portion connected to the third internal electrode and exposed from the fourth and sixth surfaces, and a fourth lead portion connected to the fourth internal electrode and exposed from the fourth and fifth surfaces.

[0014] According to another aspect of the present disclosure, a multilayer electronic component includes a main body including dielectric layers and first and second internal electrode layers alternately stacked in a stacking direction, and each dielectric layer is interposed between the first and second internal electrode layers, and the main body includes first and second surfaces opposite to each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces, respectively, and opposite to each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces, respectively, and opposite to each other, and first and second external electrodes arranged on the third and fourth surfaces, respectively. The first internal electrode layer includes a first internal electrode and a second internal electrode arranged with a first spacing portion interposed therebetween, a first lead portion connected to the first internal electrode and exposed from the third and sixth surfaces, and a second lead portion connected to the second internal electrode and exposed from the fourth and fifth surfaces, and the second external electrode layer includes a third internal electrode and a fourth internal electrode arranged with a second spacing portion interposed therebetween, a third lead portion connected to the third internal electrode and exposed from the fourth and sixth surfaces, and a fourth lead portion connected to the fourth internal electrode and exposed from the third and fifth surfaces. The first and fourth internal electrodes are exposed from the third surface, and the second and third internal electrodes are exposed from the fourth surface. BRIEF DESCRIPTION OF DRAWINGS

[0015] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure.

[0017] Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 .

[0018] Figure 3 is an exploded perspective view schematically illustrating an exploded main body according to an embodiment of the present disclosure.

[0019] Figure 4 is a perspective view illustrating Figure 1 the main body.

[0020] Figure 5 is a perspective view of Figure 4 the main body when viewed from another direction.

[0021] Figure 6is a plan view of a first inner electrode layer according to an embodiment of the present disclosure.

[0022] Figure 7 is a plan view of a second inner electrode layer according to an embodiment of the present disclosure.

[0023] Figure 8 is an exploded perspective view schematically illustrating an exploded main body according to a first variant of the present disclosure.

[0024] Figure 9 is a perspective view of the main body according to the first variant of the present disclosure.

[0025] Figure 10 is a perspective view of the main body when viewed from another direction. Figure 9

[0026] Figure 11 is a plan view of a first inner electrode layer according to a first variant of the present disclosure.

[0027] Figure 12 is a plan view of a second inner electrode layer according to the first variant of the present disclosure.

[0028] Figure 13 is a plan view of a third inner electrode layer included in a second variant of the present disclosure.

[0029] Figure 14 is a plan view of a fourth inner electrode layer included in the second variant of the present disclosure.

[0030] Figure 15 is an exploded perspective view schematically illustrating an exploded main body of a multilayer electronic component according to another embodiment of the present disclosure.

[0031] Figure 16 is a perspective view of the main body of the multilayer electronic component according to another embodiment of the present disclosure.

[0032] Figure 17 is a perspective view of the main body when viewed from another direction. Figure 16

[0033] Figure 18 is a plan view of a first inner electrode layer according to another embodiment of the present disclosure.

[0034] Figure 19 is a plan view of a second inner electrode layer according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] ​​Hereinafter, embodiments of the disclosure will be described with reference to specific examples and accompanying drawings. However, the embodiments of the disclosure can be modified in various other forms, and the scope of the disclosure is not limited to the embodiments described below. In addition, the embodiments of the disclosure can be provided in order to more completely describe the disclosure to one of ordinary skill in the art. Therefore, the shape and size of the elements in the drawings can be exaggerated for clarity of description, and the elements indicated by the same reference numerals in the drawings can be the same elements.

[0036] In the drawings, parts irrelevant to the description will be omitted for the explanation of the disclosure, and the thickness can be exaggerated to clearly show the layers and regions. The same reference numerals will be used to designate the same components. Also, throughout the specification, when an element is referred to as being "comprising" or "including" an element, it means that the element can further include other elements, without excluding other elements, unless otherwise specifically stated.

[0037] In the drawings, the X direction can be defined as the second direction, the L direction, or the length direction, the Y direction can be defined as the third direction, the W direction, or the width direction, and the Z direction can be defined as the first direction, the stacking direction, the T direction, or the thickness direction.

[0038] Multi-layer electronic assembly

[0039] Figure 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the disclosure.

[0040] Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 .

[0041] Figure 3 is an exploded perspective view schematically showing an exploded body according to an embodiment of the disclosure.

[0042] Figure 4 is a perspective view showing the body of Figure 1 .

[0043] Figure 5 is a perspective view of the body of Figure 4 when viewed from another direction.

[0044] Figure 6 is a plan view of a first internal electrode layer according to an embodiment of the disclosure.

[0045] Figure 7 is a plan view of a second internal electrode layer according to an embodiment of the disclosure.

[0046] Hereinafter, a multilayer electronic component 100 according to an embodiment of the disclosure will be described with reference to Figures 1 to 7 .

[0047] The multilayer electronic component 100 according to an embodiment of the disclosure can include a main body 110 including dielectric layers 111 and first and second internal electrode layers alternately stacked in a stacking direction, and each of the dielectric layers is interposed between the first and second internal electrode layers, and the main body 110 includes a first surface 1 and a second surface 2 opposite to each other in the stacking direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and opposite to each other, and a fifth surface 5 and a sixth surface 6 connected to the first to fourth surfaces and opposite to each other, and first and second external electrodes 131 and 132 arranged on the third and fourth surfaces, respectively. The first internal electrode layer includes a first internal electrode 121 and a second internal electrode 122 exposed from the third surface 3 and arranged with a first gap G1 interposed between the first and second internal electrodes 121 and 122, a first lead portion 121a connected to the first internal electrode 121 and exposed from the third surface 3 and the sixth surface 6, and a second lead portion 122a connected to the second internal electrode 122 and exposed from the third surface 3 and the fifth surface 5. The second internal electrode layer includes a third internal electrode 123 and a fourth internal electrode 124 exposed from the fourth surface 4 and arranged with a second gap G2 interposed between the third and fourth internal electrodes 123 and 124, a third lead portion 123a connected to the third internal electrode 123 and exposed from the fourth surface 4 and the sixth surface 6, and a fourth lead portion 124a connected to the fourth internal electrode 124 and exposed from the fourth surface 4 and the fifth surface 5.

[0048] The main body 110 can include the dielectric layers 111 and the first and second internal electrode layers alternately stacked, and each of the dielectric layers 111 is interposed between the first and second internal electrode layers.

[0049] Although the specific shape of the main body 110 is not particularly limited, as illustrated, the main body 110 can have a hexahedral shape or the like. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 can not have a perfect hexahedral shape with completely straight lines, but can have a substantially hexahedral shape as a whole.

[0050] The main body 110 can have the first and second surfaces 1 and 2 opposite to each other in a thickness direction (Z direction), the third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and opposite to each other in a length direction (X direction), and the fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and opposite to each other in a width direction (Y direction).

[0051] Referring to Figure 4The distance between the first surface 1 and the second surface 2 can be defined as the thickness T of the main body, the distance between the third surface 3 and the fourth surface 4 can be defined as the length L of the main body, and the distance between the fifth surface 5 and the sixth surface 6 can be defined as the width W of the main body.

[0052] The plurality of dielectric layers 111 forming the main body 110 can be in a fired state, and the boundaries between adjacent dielectric layers 111 can not be apparent without using a scanning electron microscope (SEM).

[0053] According to one embodiment of the disclosure, the raw material used to form the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead complex perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include a BaTiO3-based ceramic powder, and examples of the ceramic powder can include BaTiO3, or (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, Ba(Ti 1-y Zr y )O3, or the like, in which Ca or Zr is partially dissolved in BaTiO3.

[0054] According to the purpose of the disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like can be added to the powder of barium titanate (BaTiO3) or the like as a material for forming the dielectric layer 111.

[0055] The main body 110 can include a capacitor forming portion provided in the main body 110 and including a first internal electrode layer and a second internal electrode layer disposed opposite each other, and a dielectric layer 111 interposed between the first internal electrode layer and the second internal electrode layer to form a capacitor, an upper protective layer 112 disposed above the capacitor forming portion, and a lower protective layer 113 disposed below the capacitor forming portion.

[0056] The capacitor forming portion can contribute to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrode layers and a plurality of second internal electrode layers, with the dielectric layer 111 interposed between the first internal electrode layer and the second internal electrode layer.

[0057] The upper protective layer 112 and the lower protective layer 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming portion in the vertical direction, respectively, and can substantially function to prevent damage to the internal electrode due to physical or chemical stress.

[0058] The upper protective layer 112 and the lower protective layer 113 can not include internal electrodes, and can include the same material as that of the dielectric layer 111.

[0059] Referring to Figures 4 to 7 The first internal electrode layer can include: a first internal electrode 121 and a second internal electrode 122, exposed from the third surface 3 and arranged with a first gap G1 interposed between the first internal electrode 121 and the second internal electrode 122; a first lead portion 121a connected to the first internal electrode 121 and exposed from the third surface 3 and the sixth surface 6; and a second lead portion 122a connected to the second internal electrode 122 and exposed from the third surface 3 and the fifth surface 5.

[0060] The second internal electrode layer can include: a third internal electrode 123 and a fourth internal electrode 124, exposed from the fourth surface 4 and arranged with a second gap G2 interposed between the third internal electrode 123 and the fourth internal electrode 124; a third lead portion 123a connected to the third internal electrode 123 and exposed from the fourth surface 4 and the sixth surface 6; and a fourth lead portion 124a connected to the fourth internal electrode 124 and exposed from the fourth surface 4 and the fifth surface 5.

[0061] The first gap G1 and the second gap G2 can serve to improve mechanical strength. In addition, the first gap G1 and the second gap G2 can serve to allow dielectric rather than internal electrodes to control the entire sintering force. Accordingly, the occurrence of delamination and cracks can be effectively suppressed.

[0062] In a conventional multi-layer electronic component having only one internal electrode in one internal electrode layer without the first gap G1 and the second gap G2, there is a problem in that delamination can occur or cracks can occur in a manufacturing process.

[0063] Since the internal electrode and the dielectric layer have different materials from each other and the bonding strength between the internal electrode and the dielectric layer is relatively low, the above-described problems can occur. Due to the limitation of the bonding force between the internal electrode and the dielectric layer, delamination and cracks can occur due to friction of a blade during a cutting process and collision between pieces during a green sheet polishing process.

[0064] Since the first gap G1 and the second gap G2 according to the disclosure are included, the dielectric layers disposed above and below the first internal electrode layer can be connected to each other through the first gap G1, and the dielectric layers disposed above and below the second internal electrode layer can be connected to each other through the second gap G2. Accordingly, the mechanical strength of the piece can be improved by increasing the bonding area between homogenous materials. It can also allow dielectric rather than internal electrodes to control the entire sintering force.

[0065] Further, in the stacking and pressing process, the dielectric layers disposed above and below the first inner electrode layer can be connected to each other through the first spacer G1, and the dielectric layers disposed above and below the second inner electrode layer can be connected to each other through the second spacer G2. Accordingly, the first spacer G1 and the second spacer G2 can include a dielectric. In this case, the dielectric can be disposed in the first spacer G1 and the second spacer G2.

[0066] The width W1 of the first spacer G1 and the width W2 of the second spacer G2 are not particularly limited. For example, the width W1 of the first spacer G1 and the width W2 of the second spacer G2 can be greater than or equal to 5% of the width W of the body and less than or equal to 30% of the width W of the body, respectively.

[0067] When the width W1 of the first spacer G1 and the width W2 of the second spacer G2 are less than 5% of the width W of the body, the effect of improving the bonding force between the dielectric layers can be insufficient. When the width W1 of the first spacer G1 and the width W2 of the second spacer G2 exceed 30% of the width W of the body, the area of the overlap between the inner electrodes can be reduced, thereby making it difficult for the body to secure a high capacity.

[0068] The first lead portion 121a, the second lead portion 122a, the third lead portion 123a, and the fourth lead portion 124a can serve to improve the connectivity between the inner electrodes 121, 122, 123, and 124 and the outer electrodes 131 and 132.

[0069] Since the inner electrodes 121 and 122 are spaced apart by the spacer G1 and the inner electrodes 123 and 124 are spaced apart by the spacer G2, the contact area between the inner electrodes 121, 122, 123, and 124 and the outer electrodes 131 and 132 can be reduced, thereby deteriorating the connectivity between the inner electrodes 121, 122, 123, and 124 and the outer electrodes 131, 132. According to the present disclosure, since the first lead portion 121a, the second lead portion 122a, the third lead portion 123a, and the fourth lead portion 124a can be connected to each of the inner electrodes and disposed at the corner portions of the body, the connectivity between the inner electrodes 121, 122, 123, and 124 and the outer electrodes 131 and 132 can be improved, and the equivalent series resistance (ESR) can be reduced.

[0070] The first inner electrode 121 and the second inner electrode 122 can be spaced apart from the fourth surface 4 and can be exposed from the third surface 3, and the third inner electrode 123 and the fourth inner electrode 124 can be spaced apart from the third surface 3 and can be exposed from the fourth surface 4.

[0071] The first external electrode 131 can be disposed on the third surface 3 of the main body to be connected to the first and second internal electrodes 121 and 122 and the first and second lead portions 121a and 122a. The second external electrode 132 can be disposed on the fourth surface 4 to be connected to the third and fourth internal electrodes 123 and 124 and the third and fourth lead portions 123a and 124a.

[0072] The first and second internal electrode layers can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0073] Referring to Figure 3 , the main body 110 can be formed by alternately stacking the dielectric layer 111 on which the first internal electrode layer is printed and the dielectric layer 111 on which the second internal electrode layer is printed in the thickness direction (Z direction), and then firing the main body.

[0074] The material for forming the first, second, third, and fourth internal electrodes 121, 122, 123, and 124 is not particularly limited. For example, the first and second internal electrodes 121 and 122 can be formed by using a conductive paste containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0075] As a method of printing the conductive paste, a screen printing method or a gravure printing method can be used, but the present disclosure is not limited thereto.

[0076] As Figures 3 to 5 shown, the first and second gap portions G1 and G2 can be stacked to overlap each other. Also, in order to compensate for a step difference caused by the thickness of the internal electrodes, the first and second gap portions G1 and G2 can also be stacked to partially overlap each other.

[0077] Also, referring to Figure 2 , since the first and second gap portions G1 and G2 are arranged in the central portion in the width direction and stacked to overlap each other, the internal electrodes cannot be observed in a cross-section in the length direction and the thickness direction taken at the central portion in the width direction.

[0078] The first external electrode 131 can be disposed on the third surface 3 of the main body to be connected to the first and second internal electrodes 121 and 122 and the first and second lead portions 121a and 122a. The second external electrode 132 can be disposed on the fourth surface 4 to be connected to the third and fourth internal electrodes 123 and 124 and the third and fourth lead portions 123a and 124a.

[0079] The first external electrode 131 can be provided as a portion extending from the third surface 3 to the fifth surface 5 and the sixth surface 6, and the second external electrode 132 can be provided as a portion extending from the fourth surface 4 to the fifth surface 5 and the sixth surface 6. Also, the first external electrode 131 can be provided as a portion extending from the third surface 3 to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and the second external electrode 132 can be provided as a portion extending from the fourth surface 4 to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0080] In this case, a portion in which the external electrodes 131 and 132 are arranged to extend to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 can be defined as a bent portion of the external electrodes 131 and 132.

[0081] The bent portion of the first external electrode 131 can contact the first lead portion 121a and the second lead portion 122a, and the bent portion of the second external electrode 132 can contact the third lead portion 123a and the fourth lead portion 124a. As a result, the connectivity between the internal electrodes 121, 122, 123, and 124 and the external electrodes 131 and 132 can be improved, and the equivalent series resistance (ESR) can be reduced.

[0082] The external electrodes 131 and 132 can be formed using any material such as metal, as long as they have electrical conductivity. Also, a specific material can be selected as the external electrodes 131 and 132 in consideration of electrical characteristics, structural stability, etc. Also, the external electrodes 131 and 132 can have a multi-layer structure.

[0083] For example, the external electrodes 131 and 132 can be sintered electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0084] Also, the external electrodes 131 and 132 can be formed using an atomic layer deposition (ALD) process, a molecular layer deposition (MLD) process, a chemical vapor deposition (CVD) process, a sputtering process, etc.

[0085] Also, the external electrodes 131 and 132 can be formed by transferring a sheet including a conductive metal on the main body 110.

[0086] Referring to Figure 2 , as a specific example of the external electrodes 131 and 132, the external electrode 131 can include an electrode layer 131a, a conductive resin layer 131b, and a plating layer 131c arranged in order on the main body 110, and the external electrode 132 can include an electrode layer 132a, a conductive resin layer 132b, and a plating layer 132c arranged in order on the main body 110.

[0087] In this case, the electrode layers 131a and 132a can include a conductive metal and glass.

[0088] The conductive metal included in the electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrode to form a capacitor. For example, the conductive metal used for the electrode layers 131a and 132a can be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0089] A glass frit can be added to the conductive metal powder to prepare a conductive paste, and the prepared conductive paste can be subsequently sintered to form the electrode layers 131a and 132a.

[0090] Further, the conductive resin layers 131b and 132b can include a conductive metal and a base resin.

[0091] The conductive metal included in the conductive resin layers 131b and 132b can be used to be electrically connected to the electrode layers 131a and 132a.

[0092] The conductive metal included in the conductive resin layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a. For example, the conductive metal included in the conductive resin layers 131b and 132b can be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0093] The base resin included in the conductive resin layers 131b and 132b can function to secure adhesion and absorb impact.

[0094] The base resin included in the conductive resin layers 131b and 132b is not particularly limited as long as it has adhesion and impact absorption properties and can be mixed with the conductive metal powder to form a paste. For example, the base resin can be an epoxy-based resin.

[0095] Further, the type of the plating layers 131c and 132c is not particularly limited. For example, the plating layers 131c and 132c can be plating layers including one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and can be formed with a plurality of layers.

[0096] Figure 8 FIG. 1 is a perspective view schematically illustrating a main body according to a first modification of the present disclosure.

[0097] Figure 9 FIG. 2 is a perspective view of the main body according to the first modification of the present disclosure.

[0098] Figure 10 FIG. 3 is a perspective view when viewed from another directionFigure 9 a perspective view of a body.

[0099] Figure 11 is a plan view of a first internal electrode layer according to the first modification of the disclosure.

[0100] Figure 12 is a plan view of a second internal electrode layer according to the first modification of the disclosure.

[0101] Referring to Figures 8 to 12 , the first and second gap portions G1’ and G2’ can be stacked so as not to overlap each other.

[0102] When the first and second gap portions are stacked so as to overlap each other, the shape of the body can be non-uniform due to a step difference caused by the thicknesses of the internal electrodes overlapping each other. According to the first modification of the disclosure, since the first and second gap portions G1’ and G2’ are stacked so as not to overlap each other, it is possible to compensate for the step difference caused by the thicknesses of the internal electrodes while maintaining the effect of improving the adhesion between the dielectric layers by the gap portions, and prevent the shape of the body 210 from being non-uniform.

[0103] In this case, the width W21 of the first internal electrode 221 and the width W22 of the second internal electrode 222 can be different from each other, and the width W23 of the third internal electrode 223 and the width W24 of the fourth internal electrode 224 can be different from each other. As one example, the width W21 of the first internal electrode 221 can be greater than the width W22 of the second internal electrode 222, and the width W23 of the third internal electrode 223 can be less than the width W24 of the fourth internal electrode 224. As another example, the width W21 of the first internal electrode 221 can be less than the width W22 of the second internal electrode 222, and the width W23 of the third internal electrode 223 can be greater than the width W24 of the fourth internal electrode 224.

[0104] Accordingly, the first and second gap portions G1’ and G2’ can be stacked so as not to overlap each other while maintaining the area in which the first and second internal electrodes 221 and 222 overlap the third and fourth internal electrodes 223 and 224. Accordingly, it is possible to compensate for the step difference caused by the thicknesses of the internal electrodes while maintaining the capacity of the capacitor.

[0105] In this case, the width W21a of the first lead portion, the width W22a of the second lead portion, the width W23a of the third lead portion, and the width W24a of the fourth lead portion can be equal to each other to maximize the area in which the first and second internal electrodes 221 and 222 overlap the third and fourth internal electrodes 223 and 224.

[0106] The length L21a of the first lead portion, the length L22a of the second lead portion, the length L23a of the third lead portion, and the length L24a of the fourth lead portion are not particularly limited as long as the first lead portion to the fourth lead portion do not directly contact each other. For example, the length L21a of the first lead portion, the length L22a of the second lead portion, the length L23a of the third lead portion, and the length L24a of the fourth lead portion can be shorter than the length of the curved portion of the outer electrodes 131 and 132.

[0107] Figure 13 is a plan view of a third internal electrode layer included in the second modification of the disclosure.

[0108] Figure 14 is a plan view of a fourth internal electrode layer included in the second modification of the disclosure.

[0109] Referring to Figure 13 and Figure 14 , the main body 110 according to the second modification of the disclosure can further include at least one of a third internal electrode layer including a fifth internal electrode 125 exposed from the third surface 3 and a fourth internal electrode layer including a sixth internal electrode 126 exposed from the fourth surface 4. Referring to the structure of the main body disclosed above and the structure of the main body to be disclosed below, the fifth internal electrode 125 and the sixth internal electrode 126 can have the shape of the internal electrode included in a conventional multilayer capacitor.

[0110] Since the fifth internal electrode 125 and the sixth internal electrode 126 can be arranged to face each other with the dielectric layer 111 interposed therebetween, the fifth internal electrode 125 and the sixth internal electrode 126 can also serve to increase the capacity of the multilayer electronic assembly according to the disclosure.

[0111] Figure 15 is an exploded perspective view schematically showing an exploded main body of a multilayer electronic assembly according to another embodiment of the disclosure.

[0112] Figure 16 is a perspective view showing a main body of a multilayer electronic assembly according to another embodiment of the disclosure.

[0113] Figure 17 is a perspective view of Figure 16 a main body when viewed from another direction.

[0114] Figure 18 is a plan view of a first internal electrode layer according to another embodiment of the disclosure.

[0115] Figure 19 is a plan view of a second internal electrode layer according to another embodiment of the disclosure.

[0116] Hereinafter, reference will be made to Figures 15 to 19A multilayer electronic component according to another embodiment of the disclosure is described. However, to avoid repetitive description, the same description as the multilayer electronic component 100 according to the embodiment of the disclosure can be omitted.

[0117] The external electrodes of the multilayer electronic component according to another embodiment of the disclosure can have the same form as the external electrodes 131 and 132 of the multilayer electronic component 100 according to the embodiment of the disclosure, and the perspective view of the multilayer electronic component according to another embodiment of the disclosure can be the same as that of Figure 1

[0118] The multilayer electronic component according to another embodiment of the disclosure can include a main body 310 including dielectric layers 111 and first and second internal electrode layers alternately stacked in a stacking direction, and each dielectric layer interposed between the first and second internal electrode layers, and the main body 310 including first and second surfaces 1 and 2 opposite to each other in the stacking direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and opposite to each other, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and opposite to each other, and first and second external electrodes 131 and 132 arranged on the third and fourth surfaces, respectively. The first internal electrode layer includes first and second internal electrodes 321 and 322, the first internal electrode 321 being exposed from the third surface, the second internal electrode 322 being exposed from the fourth surface, and the first internal electrode layer being arranged with a first gap G1” interposed between the first and second internal electrodes 321 and 322, a first lead part 321a connected to the first internal electrode and exposed from the third surface 3 and the sixth surface 6, and a second lead part 322a connected to the second internal electrode and exposed from the fourth surface 4 and the fifth surface 5. The second internal electrode layer includes third and fourth internal electrodes 323 and 324, the third internal electrode 323 being exposed from the fourth surface, the fourth internal electrode 324 being exposed from the third surface, and the second internal electrode layer being arranged with a second gap G2” interposed between the third and fourth internal electrodes 323 and 324, a third lead part 323a connected to the third internal electrode and exposed from the fourth surface 4 and the sixth surface 6, and a fourth lead part 324a connected to the fourth internal electrode and exposed from the third surface 3 and the fifth surface 5. The first and fourth internal electrodes 321 and 324 are exposed from the third surface 3, and the second and third internal electrodes 322 and 323 are exposed from the fourth surface 4.

[0119] The first internal electrode layer can include first and second internal electrodes 321 and 322 arranged with a first gap G1” interposed therebetween, a first lead part 321a connected to the first internal electrode 321 and exposed from the third surface 3 and the sixth surface 6, and a second lead part 322a connected to the second internal electrode 322 and exposed from the fourth surface 4 and the fifth surface 5.​

[0120] The first internal electrode 321 can be exposed from the third surface 3 to be connected to the first external electrode 131, and the second internal electrode 322 can be exposed from the fourth surface 4 to be connected to the second external electrode 132.

[0121] Since the first internal electrode 321 and the second internal electrode 322 are arranged with the first gap G1” interposed therebetween, they are not electrically connected to each other, and the first internal electrode 321 and the second internal electrode 322 included in the first internal electrode layer can have different polarities.

[0122] The second internal electrode layer can include a third internal electrode 323 and a fourth internal electrode 324 arranged with a second gap G2” interposed therebetween, a third lead portion 323a connected to the third internal electrode 323 and exposed from the fourth surface 4 and the sixth surface 6, and a fourth lead portion 324a connected to the fourth internal electrode 324 and exposed from the third surface 3 and the fifth surface 5.

[0123] The third internal electrode 323 can be exposed from the fourth surface 4 to be connected to the second external electrode 132, and the fourth internal electrode 324 can be exposed from the third surface 3 to be connected to the first external electrode 131.

[0124] Since the third internal electrode 323 and the fourth internal electrode 324 are arranged with the second gap G2” interposed therebetween, they are not electrically connected to each other, and the third internal electrode 323 and the fourth internal electrode 324 included in the second internal electrode layer can have different polarities.

[0125] In a conventional capacitor, internal electrodes having different polarities can be arranged only above and below other internal electrodes. In the multilayer electronic component according to another embodiment of the disclosure, since internal electrodes having different polarities can be arranged not only above and below other internal electrodes but also on side surfaces of the other internal electrodes, capacity can be improved.

[0126] Referring to Figures 15 to 17 , it can be seen that the third internal electrode 323 having a different polarity can be arranged above and below the first internal electrode 321, and the second internal electrode 322 having a different polarity can be arranged on a side surface of the first internal electrode 321.

[0127] Similarly, the second internal electrode 322 having a different polarity can be arranged above and below the fourth internal electrode 324, and the third internal electrode 323 having a different polarity can be arranged on a side surface of the fourth internal electrode 324.

[0128] The first external electrode 131 can be disposed on the third surface 3 of the main body to be connected to the first and fourth internal electrodes 321 and 324 and the first and fourth lead wire portions 321a and 324a. The second external electrode 132 can be disposed on the fourth surface 4 of the main body to be connected to the second and third internal electrodes 322 and 323 and the second and third lead wire portions 322a and 323a.

[0129] Further, since the bent portions of the first external electrode 131 contact the first and fourth lead wire portions 321a and 324a, and the bent portions of the second external electrode 132 contact the second and third lead wire portions 322a and 323a, the connectivity between the internal electrodes 321, 322, 323, and 324 and the external electrodes 131 and 132 can be improved, and the equivalent series resistance (ESR) can be reduced.

[0130] One of the various effects of the present disclosure is to secure good mechanical strength by providing the spacing portion in the central portion of the internal electrode layer.

[0131] One of the various effects of the present disclosure is to improve the moisture-proof reliability by suppressing delamination and cracking.

[0132] One of the various effects of the present disclosure is to suppress the occurrence of delamination of the capacitor forming portion and the cover portion (i.e., the protective layer), the occurrence of cracks, and the like.

[0133] One of the various effects of the present disclosure is to prevent poor contact between the internal electrode and the external electrode.

[0134] However, the various advantageous properties and effects of the present disclosure are not limited to the above description, and the various advantageous properties and effects of the present disclosure can be more easily understood in the course of describing the specific embodiments of the present disclosure.

[0135] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multi-layer electronic component comprising: a main body including dielectric layers and first and second internal electrode layers alternately stacked in a stacking direction, and each of the dielectric layers is interposed between the first and second internal electrode layers, and the main body includes a first surface and a second surface opposite to each other in the stacking direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other, and a fifth surface and a sixth surface connected to the first, second, third, and fourth surfaces and opposite to each other; and first and second external electrodes arranged on the third and fourth surfaces, respectively, the first external electrode extending from the third surface to a portion of the fifth surface and a portion of the sixth surface, the second external electrode extending from the fourth surface to a portion of the fifth surface and a portion of the sixth surface, wherein the first internal electrode layer includes: first and second internal electrodes connected to the first external electrode on the third surface and arranged with a first spacing portion interposed between the first and second internal electrodes, the first spacing portion extending from the third surface to the fourth surface, a first lead portion provided on a side of the first internal electrode close to the sixth surface and connected to the first internal electrode, and connected to the first external electrode on the third and sixth surfaces, and a second lead portion provided on a side of the second internal electrode close to the fifth surface and connected to the second internal electrode, and connected to the first external electrode on the third and fifth surfaces, the second internal electrode layer includes: third and fourth internal electrodes connected to the second external electrode on the fourth surface and arranged with a second spacing portion interposed between the third and fourth internal electrodes, the second spacing portion extending from the third surface to the fourth surface, a third lead portion provided on a side of the third internal electrode close to the sixth surface and connected to the third internal electrode, and connected to the second external electrode on the fourth and sixth surfaces, and a fourth lead portion provided on a side of the fourth internal electrode close to the fifth surface and connected to the fourth internal electrode, and connected to the second external electrode on the fourth and fifth surfaces, wherein the first and second lead portions are spaced apart from each other, and the third and fourth lead portions are spaced apart from each other, and wherein a width of the first spacing portion is greater than or equal to 5% of a width of the main body and less than or equal to 30% of the width of the main body, and a width of the second spacing portion is greater than or equal to 5% of the width of the main body and less than or equal to 30% of the width of the main body.

2. The multilayer electronic assembly of claim 1, wherein, the dielectric layers provided above and below the first internal electrode layer are connected to each other through the first spacing portion, and the dielectric layers provided above and below the second internal electrode layer are connected to each other through the second spacing portion.

3. The multilayer electronic assembly of claim 1, wherein, A dielectric is disposed in the first and second spacers.

4. The multilayer electronic assembly of claim 1, wherein, The first and second spacers are stacked so as not to overlap each other in the stacking direction.

5. The multilayer electronic assembly of claim 1, wherein, The width of the first inner electrode and the width of the second inner electrode are different from each other, and the width of the third inner electrode and the width of the fourth inner electrode are different from each other.

6. A multilayer electronic component, comprising: a main body including dielectric layers and first and second inner electrode layers alternately stacked in a stacking direction, and each dielectric layer is interposed between the first and second inner electrode layers, and the main body includes first and second surfaces opposite to each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and opposite to each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and opposite to each other; and first and second outer electrodes arranged on the third and fourth surfaces, respectively, the first outer electrode extending from the third surface to a portion of the fifth surface and a portion of the sixth surface, the second outer electrode extending from the fourth surface to a portion of the fifth surface and a portion of the sixth surface, wherein the first inner electrode layer includes: first and second inner electrodes connected to the first outer electrode on the third surface and arranged with a first spacer interposed between the first and second inner electrodes, the first spacer extending from the third surface to the fourth surface; a first lead portion provided on a side of the first inner electrode close to the sixth surface and connected to the first inner electrode, and connected to the first outer electrode on the third and sixth surfaces; and a second lead portion provided on a side of the second inner electrode close to the fifth surface and connected to the second inner electrode, and connected to the first outer electrode on the third and fifth surfaces, the second inner electrode layer includes: third and fourth inner electrodes connected to the second outer electrode on the fourth surface and arranged with a second spacer interposed between the third and fourth inner electrodes, the second spacer extending from the third surface to the fourth surface; a third lead portion provided on a side of the third inner electrode close to the sixth surface and connected to the third inner electrode, and connected to the second outer electrode on the fourth and sixth surfaces; and a fourth lead portion provided on a side of the fourth inner electrode close to the fifth surface and connected to the fourth inner electrode, and connected to the second outer electrode on the fourth and fifth surfaces, wherein the first and second lead portions are spaced apart from each other, and the third and fourth lead portions are spaced apart from each other, and wherein the main body further includes a third inner electrode layer and a fourth inner electrode layer, wherein the third inner electrode layer includes a fifth inner electrode connected to the first outer electrode on the third surface, the fourth inner electrode layer includes a sixth inner electrode connected to the second outer electrode on the fourth surface, the fifth inner electrode is the only inner electrode included in the third inner electrode layer, the sixth inner electrode is the only inner electrode included in the fourth inner electrode layer, and the fifth inner electrode and the sixth inner electrode are stacked with each other.

7. A multilayer electronic component, comprising: a main body including dielectric layers and first and second inner electrode layers alternately stacked in a stacking direction, and each of the dielectric layers is interposed between the first and second inner electrode layers, and the main body includes a first surface and a second surface opposite to each other in the stacking direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other, and a fifth surface and a sixth surface connected to the first, second, third, and fourth surfaces and opposite to each other; and first and second outer electrodes arranged on the third and fourth surfaces, respectively, the first outer electrode extending from the third surface to a portion of the fifth surface and a portion of the sixth surface, the second outer electrode extending from the fourth surface to a portion of the fifth surface and a portion of the sixth surface, wherein the first inner electrode layer includes: first and second inner electrodes arranged with a first spacing portion interposed therebetween, the first spacing portion extending from the third surface to the fourth surface; a first lead portion provided on a side of the first inner electrode close to the sixth surface and connected to the first inner electrode, and connected to the first outer electrode on the third and sixth surfaces; and a second lead portion provided on a side of the second inner electrode close to the fifth surface and connected to the second inner electrode, and connected to the second outer electrode on the fourth and fifth surfaces, the second inner electrode layer includes: third and fourth inner electrodes arranged with a second spacing portion interposed therebetween, the second spacing portion extending from the third surface to the fourth surface; a third lead portion provided on a side of the third inner electrode close to the sixth surface and connected to the third inner electrode, and connected to the second outer electrode on the fourth and sixth surfaces; and a fourth lead portion provided on a side of the fourth inner electrode close to the fifth surface and connected to the fourth inner electrode, and connected to the first outer electrode on the third and fifth surfaces, wherein the first and fourth inner electrodes are connected to the first outer electrode on the third surface, the second and third inner electrodes are connected to the second outer electrode on the fourth surface, wherein the first lead portion and the second lead portion are spaced apart from each other, and the third lead portion and the fourth lead portion are spaced apart from each other, and wherein a width of the first spacing portion is greater than or equal to 5% of a width of the main body and less than or equal to 30% of the width of the main body, and a width of the second spacing portion is greater than or equal to 5% of the width of the main body and less than or equal to 30% of the width of the main body.

8. The multilayer electronic assembly of claim 7, wherein, the dielectric layers disposed above and below the first inner electrode layer are connected to each other through the first spacing portion, and the dielectric layers disposed above and below the second inner electrode layer are connected to each other through the second spacing portion.

9. The multilayer electronic assembly of claim 7, wherein, A dielectric is disposed in the first spacing portion and the second spacing portion.

10. The multilayer electronic assembly of claim 7, wherein, The first spacing portion and the second spacing portion are stacked so as not to overlap each other in the stacking direction.

11. The multilayer electronic assembly of claim 7, wherein, The width of the first inner electrode and the width of the second inner electrode are different from each other, and the width of the third inner electrode and the width of the fourth inner electrode are different from each other.

12. A multilayer electronic component, comprising: a main body including dielectric layers and first inner electrode layers and second inner electrode layers alternately stacked in a stacking direction, and each dielectric layer is interposed between the first inner electrode layer and the second inner electrode layer, and the main body includes a first surface and a second surface opposite to each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other; and a first outer electrode and a second outer electrode arranged on the third surface and the fourth surface, respectively, the first outer electrode extending from the third surface to a portion of the fifth surface and a portion of the sixth surface, the second outer electrode extending from the fourth surface to a portion of the fifth surface and a portion of the sixth surface, wherein the first inner electrode layer includes: a first inner electrode and a second inner electrode arranged with a first spacing portion interposed between the first inner electrode and the second inner electrode, the first spacing portion extending from the third surface to the fourth surface; a first lead portion provided on a side of the first inner electrode close to the sixth surface and connected to the first inner electrode, and connected to the first outer electrode on the third surface and the sixth surface; and a second lead portion provided on a side of the second inner electrode close to the fifth surface and connected to the second inner electrode, and connected to the second outer electrode on the fourth surface and the fifth surface, The second inner electrode layer includes: a third inner electrode and a fourth inner electrode disposed with a second space portion interposed between the third inner electrode and the fourth inner electrode, the second space portion extending from the third surface to the fourth surface; a third lead portion provided on a side of the third inner electrode close to the sixth surface and connected to the third inner electrode, and connected to the second outer electrode on the fourth surface and the sixth surface; and a fourth lead portion provided on a side of the fourth inner electrode close to the fifth surface and connected to the fourth inner electrode, and connected to the first outer electrode on the third surface and the fifth surface, wherein the first inner electrode and the fourth inner electrode are connected to the first outer electrode on the third surface, the second inner electrode and the third inner electrode are connected to the second outer electrode on the fourth surface, wherein the first lead portion and the second lead portion are spaced apart from each other, and the third lead portion and the fourth lead portion are spaced apart from each other, and wherein the main body further includes a third inner electrode layer and a fourth inner electrode layer, wherein the third inner electrode layer includes a fifth inner electrode connected to the first outer electrode on the third surface, the fourth inner electrode layer includes a sixth inner electrode connected to the second outer electrode on the fourth surface, the fifth inner electrode is the only inner electrode included in the third inner electrode layer, the sixth inner electrode is the only inner electrode included in the fourth inner electrode layer, and the fifth inner electrode and the sixth inner electrode are superposed on each other.

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