A multi-chip stacked packaging structure

Abstract

The present invention discloses a multi-chip stacked packaging structure in the field of chip packaging technology, including a main body. On one side inside the main body, a carrier plate and a top plate are fixedly connected. A plurality of top holes are opened at the top of the top plate. Workers can slide the position of the carrier plate to the left to expose the carrier frame on the carrier plate to the outside, and put the substrates required for packaging the chips into the carrier frame. After the workers have put in the substrates, the workers start the pressurizing structure and reset the position of the carrier plate. The pressurizing structure can increase the force of contact between the substrate and the storage frame. When the carrier plate is sliding, the alignment structure works to adjust the positions of the substrates that are in disorder in the storage frame, so that one side of the substrate faces the sliding direction of the carrier plate. After one side of the substrate faces the sliding direction of the carrier plate, the problem that the four corners of the substrate are damaged by the extrusion of the fixing structure when the subsequent fixing structure moves the position of the substrate is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically to a multi-chip stacked packaging structure. Background Art

[0002] Chip packaging can play a role in protecting the chip, which is equivalent to the shell of the chip. It can not only fix and seal the chip, but also enhance its electrothermal performance. The quality of the packaging technology directly affects the performance of the chip itself and the design and manufacturing of the printed circuit board connected to it. However, during the chip packaging process, when it is basically in a state of no external fixation or one-way simple fixation, it is prone to deviation during packaging, which may lead to deviation in the docking between the chip and the substrate, resulting in a decrease in the overall packaging quality of the chip.

[0003] Currently, usually, the substrate is placed in the positioning structure manually, and the substrate is clamped by the clamping plate. Since the substrate is placed manually, although the position of the substrate is between the clamping plates, the four corner positions of the rectangular substrate cannot be guaranteed, and the position of the substrate needs to be adjusted manually. If the substrate is directly clamped by the clamping plate, it may cause the clamping plate to squeeze the corner of the substrate, resulting in damage to the substrate due to force.

[0004] Based on this, the present invention designs a multi-chip stacked packaging structure to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a multi-chip stacked packaging structure to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A multi-chip stacked packaging structure, including a main body. One side inside the main body is fixedly connected with a bearing plate and a top plate. The top of the top plate is provided with a plurality of top holes. The top of the bearing plate is slidably connected with a carrier plate. The two sides of the carrier plate are respectively fixedly connected with limiting strips. The two sides inside the main body are respectively provided with limiting grooves slidably connected with the limiting strips. The top of the carrier plate is provided with a plurality of placement grooves corresponding to the top holes. The bottom of the placement groove is fixedly connected with a placement frame. A alignment structure for adjusting the position of the substrate is arranged inside the placement frame. The alignment structure can orient one side of the substrate towards the sliding direction of the carrier plate. A pressure increasing structure for increasing the frictional resistance between the substrate and the placement frame is arranged at the bottom of the carrier plate. A fixing structure for fixing the position of the substrate is arranged on the placement frame. A top contact structure for moving the carrier plate upward is arranged at the bottom of the bearing plate. The top contact structure can trigger the fixing structure when moving the carrier plate upward.

[0007] The alignment structure includes a plurality of rotating holes provided on one side of the loading plate, the rotating holes passing through the loading plate and the storage frame, a rotating rod rotatably connected in the rotating holes, a plurality of first cavities communicating with the rotating holes provided in the storage frame, a connecting hole communicating with the first cavity provided on the inner bottom surface of the storage frame, a plurality of toggle balls rotatably connected to the outer wall of the rotating rod, the toggle balls are located in the first cavities and vertically correspond to the connecting holes, a plurality of baffles are fixedly connected to the outer wall of the rotating rod, every two of the baffles are located on both sides of the toggle balls, a magnetic block is embedded in a side of the baffle close to the toggle balls, an iron block is embedded in a side of the toggle balls close to the baffles, first gears are fixedly connected to both ends of the rotating rod, a resisting rod is fixedly connected to one side of the first gear, a rack matched with the first gear is fixedly connected to the top of the limiting groove, a lifting rod is fixedly connected to one side of the limiting groove, one end of the lifting rod is trapezoidal, and a plurality of rubber strips are fixedly connected to the outer wall of the toggle ball.

[0008] An annular groove is provided between the moving ball and the rotating rod, and a plurality of rolling balls are arranged in the annular groove.

[0009] A plurality of telescopic outer rods are fixedly connected to the bottom of the first cavity, a telescopic inner rod is slidably connected inside the telescopic outer rod, a limit ring is fixedly connected to the top of the telescopic inner rod, the limit ring is rotatably connected to the rotating rod, and a first spring is fixedly connected between the telescopic inner rod and the telescopic outer rod.

[0010] The boost structure includes an air suction pump arranged on the inner bottom surface of the main body, the air inlet end of the air suction pump is connected to a pipeline, a connection box is fixedly connected to the top of the supporting plate, the connection box is communicated with the pipeline, a plurality of connecting holes are provided on the top of the connection box, a sliding cavity is provided at the bottom of the carrier plate, the connection box is slidably connected to the sliding cavity, a plurality of air inlet holes are provided on the inner bottom surface of the storage frame, and the air inlet holes penetrate the storage frame and are communicated with the sliding cavity.

[0011] The fixing structure includes four second cavities opened at the top of the storage frame. The adjacent angles of each second cavity are 90 degrees. A plurality of groups of chutes are opened at the top of the storage frame. A lead screw is rotatably connected in the chute. One end of the lead screw extends into the second cavity and is fixedly connected to a second gear. First clamping plates are respectively arranged on the left and right sides inside the storage frame, and second clamping plates are respectively arranged on the front and back sides inside the storage frame. A plurality of connection blocks that are slidably connected to the chutes are fixedly connected to the bottoms of the first clamping plate and the second clamping plate. The connection blocks are threadedly connected to the lead screw. Third cavities are respectively opened at both ends of the second clamping plate. A side support rod is slidably connected in the third cavity. A plurality of cross bars are fixedly connected to one side inside the third cavity. One end of the cross bar is slidably connected to the side support rod. A fourth spring is arranged outside the cross bar. Both ends of the fourth spring are fixedly connected to the side support rod and the inner wall of the third cavity respectively. Two slide bars are arranged in the second cavity. A tooth block adapted to the second gear is fixedly connected to the bottom of the slide bar. A fixed rod is fixedly connected to one side inside the second cavity. The slide bar is slidably connected to the fixed rod. A third spring is fixedly connected between one end of the slide bar and one side of the second cavity. A connecting rod is rotatably connected to the top of the slide bar. A pressing plate is arranged on the top of the storage frame. The bottom of the pressing plate is rotatably connected to the top of the connecting rod.

[0012] Damping rollers are respectively rotatably connected to the two ends of the two side support rods away from each other.

[0013] The top contact structure includes a plurality of mounting grooves opened at the bottom of the bearing plate. A cylinder is arranged in the mounting groove. A first rising channel is opened at the top of the limiting groove. A plurality of second rising channels are opened at the top of the first rising channel.

[0014] A handle is fixedly connected to one end of the load-carrying plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. When the staff needs to package the chip, the staff can slide the position of the carrier plate to the left, expose the carrier frame on the carrier plate to the outside, and put the substrate required for the packaged chip into the carrier frame. After the staff puts the substrate, the staff starts the boost structure to reset the position of the carrier plate. The boost structure can increase the contact force between the substrate and the frame. When the carrier plate is sliding, the alignment structure works to adjust the position of each substrate in a messy position in the frame, so that one side of the substrate faces the sliding direction of the carrier plate. The boost structure increases the friction between the substrate and the frame. When the alignment structure works, the problem of the substrate being unable to move under force is avoided. After one side of the substrate faces the sliding direction of the carrier plate, the problem of the four corners of the substrate being squeezed and damaged by the fixed structure when the substrate position is moved by the subsequent fixed structure is avoided. After the carrier plate is reset, the staff starts the top contact structure, which can make the carrier plate move upward with the frame so that the fixed structure contacts the top plate. The fixed structure triggers the position of the substrate to be fixed, which is convenient for the subsequent chip packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the limit strip structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the installation slot structure of the present invention;

[0020] Figure 4 It is a schematic diagram of the pipeline structure of the present invention;

[0021] Figure 5 It is a schematic diagram of the structure of the carrier plate of the present invention;

[0022] Figure 6 is a cross-sectional schematic diagram of the carrier plate structure of the present invention;

[0023] Figure 7 for Figure 6 A schematic diagram of the enlarged local structure at point A in the middle;

[0024] Figure 8 for Figure 6 A magnified schematic diagram of the local structure at B in the middle;

[0025] Figure 9 for Figure 4 A magnified schematic diagram of the local structure at C in the middle;

[0026] Figure 10 It is a cross-sectional schematic diagram of the structure of the shifting ball of the present invention;

[0027] Figure 11 It is a schematic diagram of the structure of the storage frame of the present invention;

[0028] Figure 12 It is a schematic diagram of the sliding rod structure of the present invention.

[0029] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0030] 100, main body; 101, bearing plate; 102, top plate; 103, top hole; 104, loading plate; 105, handle; 200, limit slot; 201, limit strip; 202, storage slot; 203, storage frame; 204, rotating hole; 205, rotating rod; 206, first cavity; 207, connecting hole; 208, toggle ball; 209, baffle; 210, ring groove; 211, rolling ball; 212, magnetic block; 213, iron block; 214, rubber strip; 300, first gear; 301, rack; 302, lifting rod; 303, contact rod; 304, telescopic outer rod; 305, telescopic inner rod; 306, first spring; 307, limit ring; 4 00, suction pump; 401, pipeline; 402, connecting box; 403, connecting hole; 404, sliding cavity; 405, air inlet; 500, second cavity; 501, sliding groove; 502, screw rod; 503, second gear; 504, first clamping plate; 505, second clamping plate; 506, connecting block; 507, third cavity; 508, side support rod; 509, sliding rod; 510, tooth block; 511, fixing rod; 512, connecting rod; 513, pressure plate; 514, third spring; 515, cross bar; 516, fourth spring; 517, drag reduction roller; 600, mounting groove; 601, cylinder; 602, first rising channel; 603, second rising channel. DETAILED DESCRIPTION

[0031] See also Figure 1-12, the present invention provides a technical solution: a multi-chip stacked packaging structure, including a main body 100. On one side inside the main body 100, a carrier plate 101 and a top plate 102 are fixedly connected. There are multiple top holes 103 on the top of the top plate 102. A carrier plate 104 is slidably connected to the top of the carrier plate 101. Limiting strips 201 are fixedly connected to both sides of the carrier plate 104 respectively. Limiting grooves 200 slidably connected to the limiting strips 201 are respectively opened on both sides inside the main body 100. Multiple placing grooves 202 corresponding to the top holes 103 are opened on the top of the carrier plate 104. A placing frame 203 is fixedly connected to the bottom of the placing groove 202. An alignment structure for adjusting the position of the substrate is provided inside the placing frame 203. The alignment structure can orient one side of the substrate towards the sliding direction of the carrier plate 104. A pressure increasing structure for increasing the frictional resistance between the substrate and the placing frame 203 is provided at the bottom of the carrier plate 104. A fixing structure for fixing the position of the substrate is provided on the placing frame 203. A top contact structure for moving the carrier plate 104 upwards is provided at the bottom of the carrier plate 101. The top contact structure can trigger the fixing structure when moving the carrier plate 104 upwards;

[0032] During operation, when staff need to package chips, the staff can slide the carrier plate 104 to the left to expose the placing frame on the carrier plate 104 to the outside, and put the substrates required for packaging the chips into the placing frame. After the staff have placed the substrates, the staff start the pressure increasing structure and reset the position of the carrier plate 104. The pressure increasing structure can increase the resistance between the substrate and the placing frame 203. During the process of sliding the carrier plate 104, the alignment structure works to adjust the positions of the substrates that are in a messy position inside the placing frame 203, so that one side of the substrate faces the sliding direction of the carrier plate 104. The pressure increasing structure increases the frictional force between the substrate and the placing frame 203, avoiding the problem that the substrate cannot move due to lack of force during the operation of the alignment structure. After orienting one side of the substrate towards the sliding direction of the carrier plate 104, it is possible to avoid the problem that the four corners of the substrate are damaged by the extrusion of the fixing structure when the fixing structure positions the substrate. After the carrier plate 104 is reset, the staff start the top contact structure, which can make the carrier plate 104 drive the placing frame 203 to move upwards so that the fixing structure abuts against the top plate 102, and the fixing structure is triggered to fix the position of the substrate, facilitating subsequent chip packaging; by providing multiple placing frames 203, when the staff package chips, they can position the positions of multiple substrates, improving the packaging efficiency. The fixing structure positions the substrate to the middle position of the placing frame 203 and can stably clamp the substrate, solving the problems that it is prone to deviation during traditional packaging and there are deviations in the docking between the chip and the placement points on the substrate. Before the fixing structure works, the provided alignment structure aligns the position of the substrate, thus avoiding the problem that the substrate is damaged by the fixing structure when the fixing structure fixes the substrate because the four corners of the substrate face the fixing structure when the substrate is placed.

[0033] As a further solution of the present invention, the alignment structure includes a plurality of rotating holes 204 opened on one side of the loading plate 104, the rotating holes 204 pass through the loading plate 104 and the storage frame 203, a rotating rod 205 is rotatably connected in the rotating holes 204, a plurality of first cavities 206 connected to the rotating holes 204 are opened in the storage frame 203, a connecting hole 207 connected to the first cavity 206 is opened on the inner bottom surface of the storage frame 203, a plurality of toggle balls 208 are rotatably connected to the outer wall of the rotating rod 205, the toggle balls 208 are located in the first cavity 206 and correspond vertically to the connecting holes 207, and a plurality of baffles 208 are fixedly connected to the outer wall of the rotating rod 205. 09, every two baffles 209 are located on both sides of the toggle ball 208, a magnetic block 212 is embedded in the side of the baffle 209 close to the toggle ball 208, an iron block 213 is embedded in the side of the toggle ball 208 close to the baffle 209, both ends of the rotating rod 205 are respectively fixedly connected with the first gear 300, one side of the first gear 300 is fixedly connected with the abutment rod 303, the top of the limiting groove 200 is fixedly connected with a rack 301 adapted to the first gear 300, one side of the limiting groove 200 is fixedly connected with a lifting rod 302, one end of the lifting rod 302 is trapezoidal, and a plurality of rubber strips 214 are fixedly connected to the outer wall of the toggle ball 208;

[0034] During operation, before the staff member resets the loading plate 104, the pressurizing structure is activated, so that the substrate in the storage frame 203 generates a downward force, increasing the squeezing force between the substrate and the storage frame 203. When the staff member slides the loading plate 104 to move, the abutment rod 303 moves with it and contacts the lifting rod 302. The abutment rod 303 is forced to drive the first gear 300, the rotating rod 205 and the toggle ball 208 to move upward. The toggle ball 208 moves upward to the connecting hole 207 and contacts the substrate in the storage frame 203. The gear moves upward to contact the rack 301. When the loading plate 104 moves, the rotating rod 205 can be driven to rotate by the first gear 300 and the rack 301. The toggle ball 208 on the rotating rod 205 can follow the rotating rod 200 through the suction force between the magnetic block 212 and the iron block 213. 05 rotation, when the toggle ball 208 rotates, the rubber strip 214 can drive the substrate to move on the storage frame 203. Since the toggle ball 208 is connected to the baffle 209 through the magnet and the magnetic block 212, when one corner of the substrate contacts the fixed structure, the corresponding one or more toggle balls 208 are resisted and no longer rotate. When other parts of one side of the substrate do not contact the fixed structure, the corresponding toggle ball 208 is not resisted and continues to move and adjust the position of the substrate until it fits the fixed structure with one side of the substrate and slides toward the loading plate 104. All toggle balls 208 in contact with the substrate are resisted and do not rotate, thereby achieving the effect of aligning the substrate and solving the problem of damage to the substrate when the fixed structure fixes the substrate because the four corners of the substrate are facing the fixed structure when the substrate is placed.

[0035] As a further solution of the present invention, an annular groove 210 is provided between the moving ball 208 and the rotating rod 205, and a plurality of rolling balls 211 are provided in the annular groove 210;

[0036] During operation, the plurality of rolling balls 211 can limit the position of the moving ball 208 and reduce the friction between the moving ball 208 and the rotating rod 205. Furthermore, the rolling balls 211 limit the position of the moving ball 208, and there is a certain gap between the rolling balls 211 and the baffle 209, thereby avoiding the problem of damage caused by friction between the magnetic block 212 and the iron block 213.

[0037] As a further solution of the present invention, a plurality of telescopic outer rods 304 are fixedly connected to the bottom of the first cavity 206, a telescopic inner rod 305 is slidably connected inside the telescopic outer rod 304, a limit ring 307 is fixedly connected to the top of the telescopic inner rod 305, the limit ring 307 is rotatably connected to the rotating rod 205, and a first spring 306 is fixedly connected between the telescopic inner rod 305 and the telescopic outer rod 304;

[0038] During operation, when the rotating rod 205 moves upward, the rotating rod 205 drives the telescopic inner rod 305 to move upward through the rotating ring, and the first spring 306 is stretched to generate potential energy. When the resistance rod 303 is separated from the lifting rod 302, the first spring 306 is reset and can drive the rotating rod 205 to reset through the limiting ring 307, so as to facilitate the positioning of the next batch of substrates.

[0039] As a further solution of the present invention, the boosting structure includes an air pump 400 arranged on the inner bottom surface of the main body 100, the air inlet end of the air pump 400 is connected to a pipe 401, a connection box 402 is fixedly connected to the top of the carrier plate 101, the connection box 402 is connected to the pipe 401, a plurality of connecting holes 403 are provided on the top of the connection box 402, a sliding cavity 404 is provided at the bottom of the carrier plate 104, the connection box 402 is slidably connected to the sliding cavity 404, a plurality of air inlet holes 405 are provided on the inner bottom surface of the storage frame 203, and the air inlet holes 405 penetrate the storage frame 203 and are connected to the sliding cavity 404;

[0040] During operation, the staff starts the suction pump 400, which can absorb the air on the top of the connection box 402. When the carrier plate 104 moves, the connection box 402 remains stationary, and the connection box 402 can absorb the air in the storage frame 203 through the air inlet 405. The substrate in the storage frame 203 is sucked by the suction force to achieve the above-mentioned effect of increasing the contact force between the substrate and the storage frame 203.

[0041] As a further aspect of the present invention, the fixing structure includes four second cavities 500 opened at the top of the storage frame 203, with an adjacent angle of 90 degrees for each second cavity 500. A plurality of groups of chutes 501 are opened at the top of the storage frame 203. A lead screw 502 is rotatably connected in the chute 501. One end of the lead screw 502 extends into the second cavity 500 and is fixedly connected to a second gear 503. First clamping plates 504 are respectively arranged on the left and right sides inside the storage frame 203, and second clamping plates 505 are respectively arranged on the front and back sides inside the storage frame 203. A plurality of connecting blocks 506 that are slidably connected to the chute 501 are fixedly connected to the bottoms of the first clamping plates 504 and the second clamping plates 505. The connecting blocks 506 are threadedly connected to the lead screw 502. Third cavities 507 are respectively opened at both ends of the second clamping plate 505. Side support rods 508 are slidably connected in the third cavities 507. A plurality of cross bars 515 are fixedly connected to one side inside the third cavity 507. One end of the cross bar 515 is slidably connected to the side support rod 508. A fourth spring 516 is arranged outside the cross bar 515. Both ends of the fourth spring 516 are fixedly connected to the side support rod 508 and the inner wall of the third cavity 507 respectively. Two sliding rods 509 are arranged in the second cavity 500. A tooth block 510 adapted to the second gear 503 is fixedly connected to the bottom of the sliding rod 509. A fixed rod 511 is fixedly connected to one side inside the second cavity 500. The sliding rod 509 is slidably connected to the fixed rod 511. A third spring 514 is fixedly connected between one end of the sliding rod 509 and one side of the second cavity 500. A connecting rod 512 is rotatably connected to the top of the sliding rod 509. A pressing plate 513 is arranged on the top of the storage frame 203. The bottom of the pressing plate 513 is rotatably connected to the top of the connecting rod 512;

[0042] During operation, after the staff pushes the carrier plate 104 to reset, the top contact structure is started. The top contact structure moves the carrier plate 104 upward, and the storage frame 203 moves upward accordingly. The pressing plate 513 remains stationary after contacting the top plate 102. The two connecting rods 512 are stressed. The bottoms of the two connecting rods 512 move away from each other and can drive the lead screw 502 to rotate through the tooth block 510 and the second gear 503. The rotation of the lead screw 502 can drive the two first clamping plates 504 and the two second clamping plates 505 to approach each other, so as to push the substrate to the middle position of the storage frame 203 and fix the position of the substrate, achieving the effect of fixing the position of the substrate.

[0043] As a further aspect of the present invention, anti-friction rollers 517 are respectively rotatably connected to the two ends of the two side support rods 508 that are away from each other;

[0044] During operation, the friction between the side support rod 508 and the first clamping plate 504 can be reduced by the provided anti-friction rollers 517.

[0045] As a further solution of the present invention, the top contact structure includes a plurality of mounting grooves 600 opened at the bottom of the carrier plate 101. A cylinder 601 is provided in the mounting groove 600. A first rising channel 602 is opened at the top of the limiting groove 200, and a plurality of second rising channels 603 are opened at the top of the first rising channel 602;

[0046] During operation, when it is necessary to lift the position of the load plate 104, the staff starts the cylinder 601. The telescopic shaft of the cylinder 601 can drive the load plate 104 to move upward, achieving the above-mentioned effect of the load plate 104 moving upward. Through the opened first rising channel 602, the first rising channel 602 can limit the position of the limiting strip 201, and the second rising channel 603 can accommodate the positions of the first gear 300 and the abutting rod 303 when the load plate 104 moves upward.

[0047] As a further solution of the present invention, one end of the load plate 104 is fixedly connected with a handle 105.

[0048] During operation, the provided handle 105 can facilitate the staff to move the position of the load plate 104.

Claims

1. A multi-chip stacking packaging structure, comprising a main body (100), It is characterized in that A carrying plate (101) and a top plate (102) are fixedly connected on one side of the interior of the main body (100); a plurality of top holes (103) are provided on the top of the top plate (102); a loading plate (104) is slidably connected to the top of the carrying plate (101); limiting strips (201) are fixedly connected to both sides of the loading plate (104); limiting grooves (200) slidably connected to the limiting strips (201) are provided on both sides of the interior of the main body (100); a plurality of storage grooves (202) corresponding to the top holes (103) are provided on the top of the loading plate (104); the storage grooves (202) are fixedly connected to the both sides of the loading plate (104); and the storage grooves (202) are fixedly connected to the both sides of the loading plate (104). ) is fixedly connected to the bottom of the loading plate (101), wherein an alignment structure for adjusting the position of the substrate is arranged in the loading frame (203), wherein the alignment structure can turn one side of the substrate toward the sliding direction of the loading plate (104), wherein a pressure-increasing structure for increasing the friction resistance between the substrate and the loading frame (203) is arranged at the bottom of the loading plate (104), wherein a fixing structure for fixing the position of the substrate is arranged on the loading frame (203), wherein a top-contact structure for moving the position of the loading plate (104) upwards is arranged at the bottom of the loading plate (101), wherein the top-contact structure can trigger the fixing structure when the loading plate (104) is moved upwards; The alignment structure comprises a plurality of rotating holes (204) provided on one side of the object carrier (104), the rotating holes (204) passing through the object carrier (104) and the object storage frame (203), a rotating rod (205) rotatably connected in the rotating holes (204), a plurality of first cavities (206) in communication with the rotating holes (204) provided in the object storage frame (203), a connecting hole (207) in communication with the first cavities (206) provided on the inner bottom surface of the object storage frame (203), a plurality of shifting balls (208) rotatably connected to the outer wall of the rotating rod (205), the shifting balls (208) being located in the first cavities (206) and vertically corresponding to the connecting holes (207), a plurality of baffles (209) being fixedly connected to the outer wall of the rotating rod (205), each of which is provided with a plurality of first cavities (206) in communication with the rotating holes (204) and a plurality of first cavities (206) in communication with the first cavities (206) provided on the inner bottom surface of the object storage frame (203), The two baffles (209) are located on both sides of the toggle ball (208); a magnetic block (212) is embedded in the side of the baffle (209) close to the toggle ball (208); an iron block (213) is embedded in the side of the toggle ball (208) close to the baffle (209); both ends of the rotating rod (205) are respectively fixedly connected to the first gear (300); one side of the first gear (300) is fixedly connected to the abutment rod (303); the top of the limiting groove (200) is fixedly connected to a rack (301) adapted to the first gear (300); one side of the limiting groove (200) is fixedly connected to a lifting rod (302); one end of the lifting rod (302) is trapezoidal; and a plurality of rubber strips (214) are fixedly connected to the outer wall of the toggle ball (208).

2. The multi-chip stacking package structure according to claim 1, It is characterized in that An annular groove (210) is provided between the moving ball (208) and the rotating rod (205), and a plurality of rolling balls (211) are provided in the annular groove (210).

3. The multi-chip stacking package structure according to claim 1, It is characterized in that A plurality of telescopic outer rods (304) are fixedly connected to the bottom of the first cavity (206), a telescopic inner rod (305) is slidably connected inside the telescopic outer rod (304), a limit ring (307) is fixedly connected to the top of the telescopic inner rod (305), the limit ring (307) is rotatably connected to the rotating rod (205), and a first spring (306) is fixedly connected between the telescopic inner rod (305) and the telescopic outer rod (304).

4. The multi-chip stacking package structure according to claim 1, It is characterized in that The pressurization structure comprises an air suction pump (400) arranged on the inner bottom surface of the main body (100), the air inlet end of the air suction pump (400) is connected to a pipeline (401), the top of the supporting plate (101) is fixedly connected to a connecting box (402), the connecting box (402) is connected to the pipeline (401), the top of the connecting box (402) is provided with a plurality of connecting holes (403), the bottom of the loading plate (104) is provided with a sliding cavity (404), the connecting box (402) is slidably connected to the sliding cavity (404), and the inner bottom surface of the storage frame (203) is provided with a plurality of air inlet holes (405), the air inlet holes (405) penetrate the storage frame (203) and are connected to the sliding cavity (404).

5. The multi-chip stacking package structure according to claim 1, It is characterized in that The fixing structure comprises four second cavities (500) opened on the top of the storage frame (203), each of the second cavities (500) being adjacent to each other at an angle of ninety degrees, a plurality of groups of slide grooves (501) being opened on the top of the storage frame (203), a screw rod (502) being rotatably connected in the slide groove (501), one end of the screw rod (502) extending into the second cavity (500) and being fixedly connected to a second gear (503), and first clamping plates (501) being respectively provided on the left and right sides of the interior of the storage frame (203) and the second gear (503). 4), the storage frame (203) is provided with a second clamping plate (505) at the front and rear sides thereof, the bottoms of the first clamping plate (504) and the second clamping plate (505) are fixedly connected with a plurality of connecting blocks (506) slidably connected with the slide groove (501), the connecting blocks (506) are threadedly connected with the screw rod (502), the two ends of the second clamping plate (505) are respectively provided with a third cavity (507), the third cavity (507) is slidably connected with a side support rod (508), the third cavity (507) A plurality of cross bars (515) are fixedly connected to one side of the interior of the third cavity (500), one end of the cross bar (515) is slidably connected to the side support bar (508), a fourth spring (516) is provided on the outside of the cross bar (515), the two ends of the fourth spring (516) are respectively fixedly connected to the side support bar (508) and the inner wall of the third cavity (507), two sliding bars (509) are provided in the second cavity (500), and a tooth block (510) adapted to the second gear (503) is fixedly connected to the bottom of the sliding bar (509). A fixing rod (511) is fixedly connected to one side of the interior of the second cavity (500), the sliding rod (509) is slidably connected to the fixing rod (511), a third spring (514) is fixedly connected between one end of the sliding rod (509) and one side of the second cavity (500), the top of the sliding rod (509) is rotatably connected to a connecting rod (512), a pressing plate (513) is provided at the top of the storage frame (203), and the bottom of the pressing plate (513) is rotatably connected to the top of the connecting rod (512).

6. The multi-chip stacking packaging structure according to claim 5, It is characterized in that The two ends of the two side support rods (508) that are separated from each other are respectively rotatably connected with drag reducing rollers (517).

7. The multi-chip stacking package structure according to claim 1, It is characterized in that The top contact structure comprises a plurality of mounting grooves (600) provided at the bottom of the supporting plate (101), a cylinder (601) being provided in the mounting groove (600), a first rising channel (602) being provided at the top of the limiting groove (200), and a plurality of second rising channels (603) being provided at the top of the first rising channel (602).

8. The multi-chip stacking package structure according to claim 1, It is characterized in that One end of the loading plate (104) is fixedly connected to a handle (105).

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