bernoulli chuck

Abstract

The present application relates to a kind of bernoulli chuck including chuck body, the middle part of chuck body is equipped with main chuck, and a plurality of auxiliary chuck is equipped on the edge, main chuck cavity is equipped with main chuck core in main chuck, main cavity airflow passage between main chuck core and main chuck cavity is communicated with external high-pressure gas source, and high-pressure gas flow is formed by main high-speed airflow of main cavity airflow passage, and is discharged from the middle part outer ring of chuck body's adsorption surface, and main negative pressure adsorption area is formed in the middle part of chuck body's adsorption surface, auxiliary chuck cavity is equipped with auxiliary cavity airflow passage in auxiliary chuck, auxiliary cavity airflow passage is communicated with external high-pressure gas source, and auxiliary high-speed airflow is formed by auxiliary cavity airflow passage, and is discharged from the edge outer ring of chuck body's adsorption surface, and auxiliary negative pressure adsorption area is formed in the edge of chuck body's adsorption surface.The present application adopts the bernoulli chuck scheme of increasing the auxiliary bernoulli chuck in the edge of chuck body circumferentially to improve the negative pressure of the periphery of chuck body, with the characteristics suitable for larger outer diameter silicon wafer.

Description

Technical Field

[0001] This invention relates to a Bernoulli suction cup, and more particularly to an improved Bernoulli suction cup, belonging to the field of Bernoulli suction cups. Background Technology

[0002] A Bernoulli suction cup is a suction cup that uses compressed air to create a high-speed jet through a small diameter (orifice). This high-speed jet carries away the surrounding air, creating negative pressure to pick up objects. Due to its unique principle and stable performance, it is widely used in the field of photovoltaic silicon wafer manufacturing. As the photovoltaic silicon wafer manufacturing industry continues to develop, the size of silicon wafers is also constantly increasing.

[0003] Due to limitations in the existing Bernoulli chuck design, the volume of the central core cannot be too large. Ignoring the core volume and blindly increasing the maximum outer diameter of the chuck body would reduce the gas flow rate on the outer edges of the chuck, resulting in insufficient negative pressure in these areas. When the negative pressure difference between the central and outer regions of the chuck is too large, it can cause the silicon wafer to vibrate, sag, or even break. For these reasons, the maximum outer diameter of the existing Bernoulli chuck body is limited, thus restricting the maximum outer diameter of the silicon wafers that the chuck can adsorb. Summary of the Invention

[0004] This invention discloses a new solution for a Bernoulli suction cup, which uses an auxiliary Bernoulli suction cup added circumferentially along the edge of the suction cup body to increase the negative pressure around the suction cup body. This solution solves the problem that the maximum outer diameter of the suction cup body in existing similar products is limited, making them unsuitable for silicon wafers with larger outer diameters.

[0005] The Bernoulli suction cup of this invention includes a suction cup body, a main suction cup in the middle of the suction cup body, and a plurality of auxiliary suction cups circumferentially arranged along the edge of the suction cup body. The main suction cup includes a main suction cup cavity, a main suction cup core in the main suction cup cavity, and an airflow channel in the main cavity between the main suction cup core and the main suction cup cavity. The airflow channel in the main cavity is connected to an external high-pressure air source through a main air inlet pipe. The high-pressure airflow forms a main high-speed airflow through the airflow channel in the main cavity. The main high-speed airflow is discharged from the outer ring of the middle of the adsorption surface of the suction cup body. The discharged main high-speed airflow forms a main negative pressure adsorption zone in the middle of the adsorption surface of the suction cup body. The auxiliary suction cups include auxiliary suction cup cavities, an auxiliary airflow channel in the auxiliary suction cup cavity, and an auxiliary high-speed airflow in the auxiliary suction cup cavity. The auxiliary high-speed airflow is connected to an external high-pressure air source. The high-pressure airflow forms an auxiliary high-speed airflow through the airflow channel in the auxiliary cavity. The auxiliary high-speed airflow is discharged from the outer ring of the edge of the adsorption surface of the suction cup body. The discharged auxiliary high-speed airflow forms an auxiliary negative pressure adsorption zone at the edge of the adsorption surface of the suction cup body. The negative pressure in the main negative pressure adsorption zone and the auxiliary negative pressure adsorption zone lifts the workpiece.

[0006] Furthermore, the top air inlet of the auxiliary suction cup cavity in this solution is provided with an air inlet recess that is connected to an external high-pressure air source. The bottom of the air inlet recess is connected to several transverse teeth. One end of the transverse teeth opposite to the edge of the suction cup body is provided with a sealing screw. The other end of the transverse teeth is connected to the jet hole. The outlet of the jet hole faces the air guide slope in the air outlet groove on the bottom air outlet end of the auxiliary suction cup cavity. The high-pressure airflow forms an auxiliary high-speed airflow through the air inlet recess, transverse teeth, and jet hole. The auxiliary high-speed airflow is discharged from the outer ring of the edge of the suction surface of the suction cup body through the air guide slope.

[0007] Furthermore, the bottom of the auxiliary suction cup cavity of this solution is provided with a connecting eaves plate at the end opposite to the edge of the suction cup body. The connecting eaves plate is provided with a countersunk hole, and a mounting connector is provided in the countersunk hole. The auxiliary suction cup cavity is installed on the edge of the suction cup body through the mounting connector.

[0008] Furthermore, in this design, the diameter of the intake countersunk hole is larger than the diameter of the transverse toothed hole, and the diameter of the transverse toothed hole is larger than the diameter of the jet hole.

[0009] Furthermore, the diameter of the intake countersunk hole in this design is 5mm, the diameter of the transverse toothed hole is 2.5mm, and the diameter of the jet hole is 1mm.

[0010] Furthermore, the main suction cup cavity of this solution is provided with several vacuum breaking holes, which are connected to the vacuum breaking tube.

[0011] Furthermore, the main negative pressure adsorption zone and the auxiliary negative pressure adsorption zone of this solution are equipped with suction cup buffer pads, and the workpieces are picked up and buffered by contact with the suction cup buffer pads.

[0012] Furthermore, the suction cup body of this solution is a disc-shaped structure, and four auxiliary suction cups are equidistantly arranged along the circumferential direction on the upper edge of the suction cup body.

[0013] Furthermore, the outer diameter of the suction cup body in this solution is one of the following values: 150mm, 160mm, 170mm, 180mm, 190mm, or 200mm.

[0014] The Bernoulli chuck of this invention adopts a Bernoulli chuck solution that adds an auxiliary Bernoulli chuck along the circumferential direction of the edge of the chuck body to increase the negative pressure around the chuck body, and has the characteristic of being suitable for silicon wafers with larger outer diameters. Attached Figure Description

[0015] Figure 1 This is a top view diagram of a Bernoulli suction cup.

[0016] Figure 2 This is a schematic diagram of the Bernoulli suction cup from the bottom.

[0017] Figure 3 This is a schematic diagram of the top plane of the Bernoulli suction cup.

[0018] Figure 4 yes Figure 3 Schematic diagram of cross section AA.

[0019] Figure 5 yes Figure 3 Schematic sectional view of section BB.

[0020] Figure 6 yes Figure 5 A magnified view of part C in the middle.

[0021] Figure 7 This is a schematic diagram of the auxiliary suction cup cavity.

[0022] Figure 8 This is a schematic diagram of the interior of the auxiliary suction cup cavity.

[0023] Among them, 100 is the suction cup body, 200 is the main suction cup, 210 is the main suction cup cavity, 220 is the main suction cup core, 230 is the airflow channel in the main cavity, 240 is the main air inlet pipe, 250 is the vacuum breaking pipe, 300 is the auxiliary suction cup, 400 is the auxiliary suction cup cavity, 401 is the airflow channel in the auxiliary cavity, 410 is the air inlet countersunk hole, 420 is the transverse threaded hole, 421 is the sealing screw, 430 is the air jet hole, 440 is the air outlet groove, 441 is the air guide slope, 450 is the connecting eaves plate, 451 is the mounting countersunk hole, 500 is the suction cup buffer pad, and 600 is the workpiece. Detailed Implementation

[0024] like Figures 1-6As shown, the Bernoulli suction cup of the present invention includes a suction cup body, a main suction cup in the middle of the suction cup body, and a plurality of auxiliary suction cups circumferentially arranged along the edge of the suction cup body. The main suction cup includes a main suction cup cavity, a main suction cup core in the main suction cup cavity, and a main cavity airflow channel between the main suction cup core and the main suction cup cavity. The main cavity airflow channel is connected to an external high-pressure air source through a main air inlet pipe. The high-pressure airflow forms a main high-speed airflow through the main cavity airflow channel. The main high-speed airflow is discharged from the outer ring of the middle of the suction surface of the suction cup body. The discharged main high-speed airflow forms a main negative pressure suction zone in the middle of the suction surface of the suction cup body. The auxiliary suction cup includes an auxiliary suction cup cavity, an auxiliary cavity airflow channel in the auxiliary suction cup cavity, and an external high-pressure air source. The high-pressure airflow forms an auxiliary high-speed airflow through the auxiliary cavity airflow channel. The auxiliary high-speed airflow is discharged from the outer ring of the edge of the suction surface of the suction cup body. The discharged auxiliary high-speed airflow forms an auxiliary negative pressure suction zone at the edge of the suction surface of the suction cup body. The negative pressure in the main negative pressure suction zone and the auxiliary negative pressure suction zone lifts the workpiece. The above solution uses an auxiliary Bernoulli chuck added circumferentially along the edge of the chuck body to increase the negative pressure around the chuck body. The auxiliary chuck on the edge of the chuck body is used to balance the negative pressure on the adsorption surface of the chuck body, so that it still has a stable and balanced negative pressure adsorption capacity after the outer diameter of the chuck body is expanded. It can be used for silicon wafers with large radial dimensions, avoids vibration and damage to the silicon wafer during adsorption, and significantly improves the applicability of the Bernoulli chuck.

[0025] To achieve the function of the auxiliary suction cup, this solution discloses an auxiliary suction cup cavity utilizing the Bernoulli suction cup principle, such as... Figure 5 , 6 As shown in Figures 7 and 8, the top air inlet of the auxiliary suction cup cavity is provided with an air inlet countersink that connects to an external high-pressure air source. The bottom of the air inlet countersink connects to several transverse threaded holes. A sealing screw is provided at one end of each transverse threaded hole opposite to the edge of the suction cup body, and the other end of the transverse threaded hole connects to an air jet hole. The outlet of the air jet hole faces the guide slope in the air outlet groove on the bottom air outlet end of the auxiliary suction cup cavity. The high-pressure airflow forms an auxiliary high-speed airflow through the air inlet countersink, transverse threaded holes, and air jet hole. The auxiliary high-speed airflow is discharged from the outer ring of the suction surface of the suction cup body through the guide slope. The guide slope serves to guide the high-speed airflow. The high-speed airflow passing through the guide slope increases the vertical height or width of the negative pressure area, allowing the suction cup to adsorb the workpiece at a higher or farther position. Based on the above scheme, to facilitate the installation of the auxiliary suction cup cavity, such as... Figure 6 As shown, the bottom of the auxiliary suction cup cavity of this solution is provided with a connecting plate at the end opposite to the edge of the suction cup body. The connecting plate is provided with a countersunk hole, and a mounting connector is provided in the countersunk hole. The auxiliary suction cup cavity is installed on the edge of the suction cup body through the mounting connector.

[0026] To enhance the effect of airflow generating negative pressure, such as Figure 6 , 8As shown, in this design, the diameter of the intake countersunk hole is larger than the diameter of the transverse threaded hole, and the diameter of the transverse threaded hole is larger than the diameter of the jet hole. Preferably, the diameter of the intake countersunk hole in this design is 5mm, the diameter of the transverse threaded hole is 2.5mm, and the diameter of the jet hole is 1mm.

[0027] To avoid harmful negative pressure forming inside the main suction cup cavity and affecting gas flow, such as Figure 1 As shown, the main suction cup cavity of this design is equipped with several vacuum breaking holes, which are connected to a vacuum breaking tube. This is to mitigate the collision vibrations generated during workpiece adsorption, such as... Figure 4 , 6 As shown, the main negative pressure adsorption zone and the auxiliary negative pressure adsorption zone of this scheme are equipped with suction cup buffer pads, and the workpieces are picked up and buffered by contact with the suction cup buffer pads.

[0028] Based on the above solution, this solution also discloses specific examples of Bernoulli suction cups, such as... Figure 1 , 2 As shown in Figure 3, the suction cup body of this design has a disc-shaped structure, with four auxiliary suction cups evenly spaced along the circumferential edge of the suction cup body. The outer diameter of the suction cup body is preferably one of 150mm, 160mm, 170mm, 180mm, 190mm, or 200mm. The suction cup body with the above dimensions well meets the process requirements of silicon wafers with large radial dimensions.

[0029] This solution discloses a Bernoulli chuck for photovoltaic silicon wafer manufacturing. By adding a small protrusion to the four symmetrical corners on the outermost side of the Bernoulli chuck, and installing a miniature Bernoulli device (auxiliary chuck 300) on the protrusion, an adsorption force is generated, thereby achieving the purpose of auxiliary adsorption technology.

[0030] The auxiliary suction cup cavity 400 has an M5 air inlet countersunk hole 410 at its top. At the bottom of the air inlet countersunk hole 410 are two 1.5mm diameter holes communicating with two M2.5 transverse threaded holes 420. The outer ends of the two M2.5 transverse threaded holes 420 communicate with 1mm diameter air jet holes 430. The air jet holes 430 penetrate one side of the workpiece and are directly opposite the air guide slope 441 within the air outlet groove 440 at the bottom of the auxiliary suction cup cavity 400. The air guide slope 441 guides the high-speed airflow. The high-speed airflow passing through the air guide slope 441 increases the vertical height of the negative pressure area, allowing the suction cup to achieve adsorption at a height 600mm above the workpiece. The M2.5 mounting countersunk hole 451 on the connecting eaves plate 450 at the bottom of the auxiliary suction cup cavity 400 is used to fix the auxiliary suction cup cavity 400 onto the suction cup body 100.

[0031] Before installation, the two M2.5 transverse threaded holes 420 on the auxiliary suction cup cavity 400 need to be sealed with sealing screws 421. Sealing screws should be applied with sealant, and the screw length should not exceed the minimum distance from the starting face of the M2.5 transverse threaded hole 420 to the 1.5mm through hole. During installation, the auxiliary suction cup cavity 400 is embedded through the M2.5 threaded hole and mounting groove on the outermost small protrusion of the suction cup body 100. After completing the installation of the auxiliary suction cup cavity 400, the air pipe connector is then installed on the air inlet countersunk hole 410. After installation, suction cup buffer pads 500 need to be attached to the auxiliary suction cup cavity 400 and the bottom of the small protrusion. The buffer pad attached to the auxiliary suction cup cavity 400 is 0.5mm thick. The buffer pads attached to the rest of the small protrusion have the same thickness as the suction cup buffer pads 500 on the suction cup body 100. The suction cup buffer pads 500 on the small protrusion are composed of two symmetrical irregularly shaped buffer pads, leaving the straight area of ​​the longest side of the mounting slot empty.

[0032] In use, the single-line air source is switched to the main air inlet pipe 240 and air inlet counter 410 of the Bernoulli chuck via a three-way air hose connector. Compressed gas generates a strong suction force through the airflow channel 230 in the main chamber, pulling the silicon wafer from its original position and bringing it into contact with the chuck's buffer pad 500. Compressed gas then enters the airflow channel 401 in the auxiliary chamber through the air inlet counter 410, generating a weaker suction force to adhere to the outer edge of the silicon wafer that was not previously held by the Bernoulli chuck, thus providing auxiliary adsorption.

[0033] Based on the above, compared with the existing Bernoulli chuck, this solution, by adding an auxiliary chuck, can significantly improve the stability of the chuck when picking up silicon wafers larger than the maximum outer diameter of the chuck, reduce the wafer breakage rate, and also provide technical guidance for picking up larger silicon wafers in the future.

[0034] Unless otherwise specified, the structures and connections disclosed in this solution can be implemented using common and conventional solutions known in the art. The Bernoulli suction cup of this solution is not limited to the content disclosed in the specific embodiments. The technical solutions appearing in the embodiments can be extended based on the understanding of those skilled in the art, and simple substitutions made by those skilled in the art based on this solution and common knowledge also fall within the scope of this solution.

Claims

1. A Bernoulli suction cup, characterized in that... The system includes a suction cup body, with a main suction cup located in the center and several auxiliary suction cups arranged circumferentially along the edge of the suction cup body. The main suction cup includes a main suction cup cavity, within which a main suction cup core is located. An internal airflow channel is provided between the main suction cup core and the main suction cup cavity. The internal airflow channel is connected to an external high-pressure air source via a main air inlet pipe. The high-pressure airflow forms a main high-speed airflow through the internal airflow channel, and the main high-speed airflow is discharged from the outer ring of the center of the suction surface of the suction cup body. A main negative pressure adsorption zone is formed in the middle of the adsorption surface of the suction cup body. The auxiliary suction cup includes an auxiliary suction cup cavity. An auxiliary airflow channel is provided in the auxiliary suction cup cavity. The auxiliary airflow channel is connected to an external high-pressure air source. The high-pressure airflow forms an auxiliary high-speed airflow through the auxiliary airflow channel. The auxiliary high-speed airflow is discharged from the outer ring of the edge of the adsorption surface of the suction cup body. The discharged auxiliary high-speed airflow forms an auxiliary negative pressure adsorption zone at the edge of the adsorption surface of the suction cup body. The negative pressure in the main negative pressure adsorption zone and the auxiliary negative pressure adsorption zone picks up the workpiece. The top air inlet of the auxiliary suction cup cavity is provided with an air inlet recess that communicates with an external high-pressure air source. The bottom of the air inlet recess is connected to several transverse teeth. One end of each transverse tooth is provided with a sealing screw opposite to the edge of the suction cup body. The other end of each transverse tooth is connected to an air jet hole. The outlet of the air jet hole faces the air guide slope in the air outlet groove on the bottom air outlet of the auxiliary suction cup cavity. The high-pressure airflow forms an auxiliary high-speed airflow through the air inlet recess, transverse teeth, and air jet hole. The auxiliary high-speed airflow is discharged from the outer ring of the suction surface of the suction cup body through the air guide slope. The bottom of the auxiliary suction cup cavity is provided with a connecting eaves plate at one end opposite to the edge of the suction cup body. The connecting eaves plate is provided with a countersunk hole for mounting. A mounting connector is provided in the countersunk hole for mounting. The auxiliary suction cup cavity is mounted on the edge of the suction cup body through the mounting connector. The main negative pressure adsorption zone and the auxiliary negative pressure adsorption zone are equipped with suction cup buffer pads, and the workpieces picked up are contacted and buffered by the suction cup buffer pads. In use, the single air source is switched to the main air inlet pipe and air inlet counter of the Bernoulli chuck by using the air pipe tee connector. The compressed gas generates a large suction force through the airflow channel in the main chamber, which pulls the silicon wafer from its original position and makes contact with the chuck buffer pad. The compressed gas enters the airflow channel in the auxiliary chamber through the air inlet counter, which generates a smaller suction force to adsorb the outer edge of the silicon wafer that was not originally adsorbed by the Bernoulli chuck, thus playing an auxiliary adsorption role.

2. The Bernoulli suction cup according to claim 1, characterized in that, The diameter of the intake countersunk hole is larger than the diameter of the transverse toothed hole, and the diameter of the transverse toothed hole is larger than the diameter of the jet hole.

3. The Bernoulli suction cup according to claim 2, characterized in that, The diameter of the intake countersunk hole is 5mm, the diameter of the transverse toothed hole is 2.5mm, and the diameter of the jet hole is 1mm.

4. The Bernoulli suction cup according to claim 1, characterized in that, The main suction cup cavity is provided with several vacuum breaking holes, which are connected to the vacuum breaking tube.

5. The Bernoulli suction cup according to claim 1, characterized in that, The suction cup body is a disc-shaped structure, and four auxiliary suction cups are equidistantly arranged along the circumferential direction on the upper edge of the suction cup body.

6. The Bernoulli suction cup according to claim 5, characterized in that, The outer diameter of the suction cup body is one of the following values: 150mm, 160mm, 170mm, 180mm, 190mm, and 200mm.

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