A high stability patch positioning device

Abstract

The present invention discloses a high-stability patch positioning device, which relates to the field of patch machines, including a vacuum adsorption tube, a hydraulic rod is arranged on the top of the vacuum adsorption tube, a positioning sleeve shell is movably connected to the outside of the vacuum adsorption tube, and multiple groups of positioning rods are rotatably connected to the outside of the positioning sleeve shell. The present invention adsorbs the patch through the vacuum adsorption tube, and drives the vacuum adsorption tube and the positioning rod to move above the patch through an external three-axis positioning arm in conjunction with a visual inspection camera, and further drives the positioning rod to press down, so that the power-on detection piece contacts the top contact of the PCB board. When all the power-on detection pieces are correctly activated, it can be determined that there is no deviation in the position. At this time, the hydraulic rod drives the vacuum adsorption tube to be further pressed down, so that the patch and the pin are installed to the correct position. By adding a detection step on the basis of the visual centering system, the misjudgment caused by stains or light and shadow deviation is avoided when installing the patch, thereby reducing the situation of incomplete solder joints, single-sided solder leakage or desoldering.

Description

Technical Field

[0001] The invention relates to the field of chip placement machines, in particular to a high-stability chip positioning device. Background Art

[0002] The placement machine is also called the placement machine or surface mount system. In the production line, it is configured after the dispensing machine or screen printing machine. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. It is divided into manual and fully automatic types. The fully automatic placement machine is used to achieve high-speed, high-precision and fully automatic placement of components. It is the most critical and complex equipment in the entire SMT production. The placement machine is the main equipment in the SMT production line. The placement machine has developed from the early low-speed mechanical placement machine to the high-speed optical alignment placement machine, and has developed towards multi-functional, flexible connection modularization.

[0003] The component feeder and substrate PCB are fixed, and the patch head is equipped with multiple vacuum suction nozzles, which move back and forth between the feeder and the substrate to take the components out of the feeder, adjust the position and direction of the components, and then place them on the substrate. At present, the visual centering system is widely used. The visual centering system uses digital image processing technology. When the suction nozzle on the patch head picks up the component, in the process of moving to the patch position, the camera fixed on the patch head or fixed on a certain position of the fuselage obtains the image, and detects the optical density distribution of the component through the image. These optical densities are then in digital form through the CCD optical coupling array composed of many small and precise photosensitive elements on the camera. The digitized information is stored, encoded, amplified, sorted and analyzed, and the results are fed back to the control unit, and the processing results are output to the servo system to adjust and compensate for the position deviation of component absorption, and finally the patch operation is completed.

[0004] However, the visual alignment system that the current SMT machines rely on is prone to misjudgment due to stains or light and shadow deviations. At this time, after the patch is installed and fixed, there will be problems such as incomplete solder joints, single-sided solder leakage or desoldering, which will lead to poor contact or falling off of components. In addition, most SMT machines currently use tinning before SMT. When the patch is skewed and needs to be readjusted, the pins are prone to tin, and tin wires are formed as the adjustment occurs, connecting multiple access points to each other, which in turn causes circuit failures, resulting in interconnected solder joints, incomplete solder joints, single-sided solder leakage or desoldering. The above product defects are relatively easy to handle in patches with fewer pins, but are extremely difficult to remedy when dealing with large patches with many pins. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a high-stability patch positioning device to solve the technical problems of deviation and defects caused by adjustment during the bonding of multi-pin patches.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-stability patch positioning device, comprising a vacuum adsorption tube, a hydraulic rod is arranged on the top of the vacuum adsorption tube, a positioning sleeve is movably connected to the outside of the vacuum adsorption tube, a plurality of groups of positioning rods are rotatably connected to the outside of the positioning sleeve, a pair of mutually cooperating power-on detection sheets are arranged at the bottom of the positioning rod, a tin outlet hole is opened at the bottom of the positioning rod, and a spring is connected between the bottom of the hydraulic rod and the positioning sleeve.

[0007] By adopting the above technical scheme, the vacuum adsorption tube is set to adsorb the patch, and the vacuum adsorption tube is pushed up and down by the hydraulic rod, thereby driving the positioning sleeve and the positioning rod to move, and the positioning sleeve drives the positioning rod to move, and the positioning rod drives the power-on detection piece to move, and the power-on detection piece contacts the top contact of the PCB board, and then the alignment accuracy is judged according to the activation status of the power-on detection piece, and the solder paste is guided to flow out through the tin outlet hole, and the positioning sleeve is driven to move by the spring.

[0008] The present invention is further configured such that a push plate is slidably connected inside the positioning sleeve, a pneumatic push rod cooperating with the push plate is arranged on the top of the positioning sleeve, and multiple groups of racks cooperating with the positioning rod are arranged on the outer side of the push plate.

[0009] By adopting the above technical solution, the set push plate drives the rack to move, and then drives the positioning rod to move. The push plate is driven to move by the pneumatic push rod, and the rotating gear is driven to rotate by the rack.

[0010] The present invention is further configured such that a plurality of rotating shafts cooperating with the positioning rods are arranged inside the positioning sleeve, and the rotating shafts are spring shaft structures.

[0011] By adopting the above technical solution, the provided rotation axis limits the rotation center of the positioning rod, and the positioning rod can still rotate at a small angle when the rotation axis is fixed through the spring axis.

[0012] The present invention is further configured such that a rotating gear meshing with the rack is provided on the outer side of the rotating shaft near the rack, and a mounting groove cooperating with the rotating shaft, the rotating gear, the rack and the pushing plate is provided inside the positioning sleeve.

[0013] By adopting the above technical solution, the rotating gear drives the rotating shaft to rotate, and then drives the positioning rod to rotate, and the rotating gear, the rack and the push plate are accommodated by the installation groove.

[0014] The present invention is further configured such that a patch is adsorbed on the bottom of the vacuum adsorption tube, and a plurality of groups of pins cooperating with the positioning rod are arranged on the outside of the patch.

[0015] By adopting the above technical solution, the patch is combined with the PCB board to realize the relevant functions of the product, and the patch is connected to the PCB board through pins.

[0016] The present invention is further configured such that the interior of the positioning rod is a hollow structure, and a pair of heating plates that cooperate with each other are arranged inside the positioning rod.

[0017] By adopting the above technical solution, the hollow structure is provided so that the internal solder paste can flow, and the solder paste in the positioning rod is heated by the heating plate.

[0018] The present invention is further configured such that a guide edge is provided at a position of the positioning rod near the pin, the guide edge is in a slope structure, the lower end of the slope structure protrudes, and the upper end is in contact with the outer wall of the positioning rod.

[0019] By adopting the above technical solution, the provided guiding edge can create a certain gap between the pin and the positioning rod, and the slope structure makes it easier for the pin to push the positioning rod.

[0020] The present invention is further configured such that a tin injection port is provided at an upper end of an outer side of the positioning rod, and a PCB board cooperating with the pin is provided below the positioning rod.

[0021] By adopting the above technical solution, the provided tin injection port allows the solder paste to flow out through the positioning rod to the joint between the pin and the PCB board, and connect the circuit of the patch through the PCB board.

[0022] The present invention is further configured such that a top fixing piece is provided on the top of the hydraulic rod, a plurality of groups of visual inspection cameras are provided on the bottom of the top fixing piece, and a through hole cooperating with the vacuum adsorption tube is provided in the middle of the pushing plate and the interior of the positioning sleeve.

[0023] By adopting the above technical solution, the top fixing part is set to connect the equipment with the external three-axis positioning arm, the movement of the external three-axis positioning arm is adjusted by the visual detection camera, and the vacuum adsorption tube can pass through the push plate and the positioning sleeve through the through hole.

[0024] In summary, the present invention mainly has the following beneficial effects:

[0025] 1. The present invention absorbs the patch through the vacuum adsorption tube, and drives the vacuum adsorption tube and the positioning rod to move above the patch through the external three-axis positioning arm and the visual inspection camera, and further drives the positioning rod to press down, so that the power-on detection piece contacts the top contact of the PCB board. When all the power-on detection pieces are correctly activated, it can be determined that there is no position deviation. At this time, the hydraulic rod drives the vacuum adsorption tube to be further pressed down, so that the patch and the pins are installed to the correct position. By adding the inspection step on the basis of the visual centering system, the misjudgment caused by stains or light and shadow deviation is avoided when installing the patch, thereby reducing the occurrence of incomplete solder joints, single-sided solder leakage or desoldering, etc.

[0026] 2. The present invention uses a vacuum adsorption tube to drive the patch and the pin to be pressed down, which pushes the positioning rod to both sides. After the pin and the contact point of the PCB board are fitted, the solder paste is output through the tin outlet hole, and then the pin and the PCB board are fixed. When the initial alignment deviation occurs, since the pin is not stained with solder paste, the re-alignment will not cause adhesion and wire drawing to cause the solder joints to be interconnected, thereby reducing the occurrence of incomplete solder joints, unilateral solder leakage or desoldering, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a partial cross-sectional view of the present invention;

[0028] Figure 2 For the present invention Figure 1 A detailed enlarged picture of;

[0029] Figure 3 is an internal cross-sectional view of the present invention;

[0030] Figure 4 For the present invention Figure 3 B detail enlarged view;

[0031] Figure 5 It is a structural cross-sectional view of the present invention;

[0032] Figure 6 It is an overall schematic diagram of the present invention;

[0033] Figure 7 It is a bottom schematic diagram of the present invention.

[0034] In the figure: 1. Vacuum adsorption tube; 2. Pin; 3. Patch; 4. Push plate; 5. Spring; 6. Visual inspection camera; 7. Hydraulic rod; 8. Top fixing piece; 9. Positioning sleeve; 10. Positioning rod; 11. PCB board; 12. Power-on detection sheet; 13. Guide edge; 14. Mounting slot; 15. Rotating gear; 16. Rotating shaft; 17. Rack; 18. Pneumatic push rod; 19. Through hole; 20. Heating sheet; 21. Tin outlet hole. DETAILED DESCRIPTION

[0035] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] The following describes an embodiment of the present invention based on its overall structure.

[0037] A high stability patch positioning device, such as Figure 1 and Figure 3 As shown, it includes a vacuum adsorption tube 1. When the PCB board 11 moves to the work station, the visual inspection camera 6 positions the patch 3 at the loading position, and cooperates with the three-axis positioning arm to move the vacuum adsorption tube 1 above the patch 3 to adsorb the patch 3. After adsorption, the patch 3 is moved to above the bonding position of the PCB board 11. A hydraulic rod 7 is arranged on the top of the vacuum adsorption tube 1. The visual inspection camera 6 performs visual alignment on the installation position. After alignment, the hydraulic rod 7 drives the vacuum adsorption tube 1 and the spring 5 to press down. When the spring 5 is pressed down, it drives the positioning sleeve 9 to press down, and then drives the positioning rod 10 to press down. The outer side of the vacuum adsorption tube 1 is movably connected with a positioning sleeve 9. The outer side of the positioning sleeve 9 is rotatably connected with multiple groups of positioning rods 10. When a pair of power-on detection sheets 12 contact the same contact point, the circuit can be connected. At this time, it can be judged that the positioning rod 10 is positioned correctly. When the power-on detection sheets 1 at the bottom of all the positioning rods 10 are 2 are successfully activated, the overall positioning can be determined to be correct. A pair of mutually cooperating power-on detection pieces 12 are provided at the bottom of the positioning rod 10. When the power-on detection pieces 12 at the bottom of the positioning rod 10 are not fully activated, the positioning error can be determined. At this time, the visual centering detection system matched with the visual detection camera 6 can be used for adaptive compensation or manual intervention correction to avoid the appearance of defective products. A tin outlet hole 21 is provided at the bottom of the positioning rod 10. When the outer pin 2 of the patch 3 is fitted with the top contact of the PCB board 11, the internal heating plate 20 of the positioning rod 10 starts to heat the internal solder paste to improve the fluidity of the solder paste and make the solder paste flow out under the pressure of the external pipeline, so that the pin 2 is fixed to the PCB board 11. A spring 5 is connected between the bottom of the hydraulic rod 7 and the positioning sleeve 9. When the spring 5 is pressed down, it drives the positioning sleeve 9 to be pressed down, and then drives the positioning rod 10 to be pressed down.

[0038] See also Figure 3 and Figure 4A push plate 4 is slidably connected to the inside of the positioning sleeve 9, and the rack 17 is driven to move by the push plate 4, thereby driving the positioning rod 10 to move. A pneumatic push rod 18 cooperating with the push plate 4 is arranged on the top of the positioning sleeve 9, and multiple groups of racks 17 cooperating with the positioning rod 10 are arranged on the outside of the push plate 4. When the vacuum adsorption tube 1 adsorbs the patch 3, the pneumatic push rod 18 pushes the push plate 4 downward, thereby driving the rack 17 downward, and the rotating gear 15 rotates under the meshing drive of the rack 17, so that the positioning rod 10 is expanded outward to avoid interference with the material taking by the bottom of the positioning rod 10.

[0039] See also Figure 2 A plurality of rotating shafts 16 cooperating with the positioning rod 10 are arranged inside the positioning sleeve 9. The rotation center of the positioning rod 10 is limited by the arranged rotating shafts 16. The rotating shafts 16 are spring shaft structures. Due to the spring shaft structure of the rotating shafts 16, the positioning rod 10 is always attached to the outside of the pin 2, thereby preventing the pin 2 from blocking the tin outlet hole 21.

[0040] See also Figure 2 A rotating gear 15 meshing with the rack 17 is provided on the outside of the rotating shaft 16 near the rack 17. When the vacuum adsorption tube 1 adsorbs the patch 3, the pneumatic push rod 18 pushes the push plate 4 downward, thereby driving the rack 17 downward. The rotating gear 15 rotates under the meshing drive of the rack 17, so that the positioning rod 10 is expanded outward. An installation groove 14 cooperating with the rotating shaft 16, the rotating gear 15, the rack 17 and the push plate 4 is opened inside the positioning sleeve 9. The rotating gear 15, the rack 17 and the push plate 4 are accommodated by the installation groove 14.

[0041] See also Figure 3 and Figure 6 A patch 3 is adsorbed on the bottom of the vacuum adsorption tube 1, and the patch 3 is combined with the PCB board 11 to realize the relevant functions of the product. A plurality of groups of pins 2 cooperating with the positioning rod 10 are arranged on the outside of the patch 3, and the patch 3 is connected to the PCB board 11 through the pins 2.

[0042] See also Figure 5 and Figure 6 The interior of the positioning rod 10 is a hollow structure, and the internal solder paste can flow through the hollow structure. A pair of heating plates 20 that cooperate with each other are arranged inside the positioning rod 10. When the outer pin 2 of the patch 3 is in contact with the top contact of the PCB board 11, the internal heating plate 20 of the positioning rod 10 starts to heat the internal solder paste to improve the fluidity of the solder paste, and makes the solder paste flow out under the pressure of the external pipeline, so that the pin 2 and the PCB board 11 are fixed.

[0043] See also Figure 4 and Figure 5A guide ridge 13 is provided near the pin 2 at the positioning rod 10. When the patch 3 is pressed down, the pin 2 contacts the guide ridge 13 and pushes the guide ridge 13, so that the positioning rod 10 moves outward with the push, thereby leaving a certain gap between the tin outlet hole 21 and the pin 2. At the same time, due to the spring shaft structure of the rotating shaft 16, the positioning rod 10 is always attached to the outside of the pin 2, thereby preventing the pin 2 from blocking the tin outlet hole 21. The guide ridge 13 is a slope structure, the lower end of the slope structure protrudes, and the upper end is in contact with the outer wall of the positioning rod 10. The slope structure makes it easier for the pin 2 to push the positioning rod 10.

[0044] See also Figure 4 and Figure 7 A tin injection port is provided at the upper end of the outer side of the positioning rod 10, through which the inside of the positioning rod 10 is connected to the external solder paste supply pipeline. A PCB board 11 cooperating with the pin 2 is provided below the positioning rod 10, and the circuit of the patch 3 is connected through the PCB board 11.

[0045] See also Figure 3 and Figure 7 A top fixing part 8 is provided on the top of the hydraulic rod 7, which is connected to the working end of the external three-axis positioning arm through the top fixing part 8. A plurality of visual inspection cameras 6 are provided at the bottom of the top fixing part 8. The visual inspection cameras 6 locate the patch 3 at the loading position and cooperate with the three-axis positioning arm to move the vacuum adsorption tube 1 to above the patch 3. A through hole 19[1] cooperating with the vacuum adsorption tube 1 is provided in the middle of the pushing plate 4 and the positioning sleeve 9. The vacuum adsorption tube 1 can pass through the pushing plate 4 and the positioning sleeve 9 through the through hole 19.

[0046] The working principle of the present invention is as follows: the top fixing part 8 is connected to the working end of the external three-axis positioning arm, and the tin injection port is connected to the external solder paste supply pipeline, and the external loader is overlapped at the same time. When the PCB board 11 moves to the work station, the visual inspection camera 6 positions the patch 3 at the loading position, and cooperates with the three-axis positioning arm to move the vacuum adsorption tube 1 to the top of the patch 3, adsorbs the patch 3, and moves the patch 3 to the top of the PCB board 11 after adsorption. At this time, the visual inspection camera 6 visually aligns the installation position. After alignment, the hydraulic rod 7 drives the vacuum adsorption tube 1 and the spring 5 to press down. When the spring 5 is pressed down, it drives the positioning sleeve 9 to press down, and then drives the positioning rod 10 to press down. When the power-on detection piece 12 at the bottom of the positioning rod 10 contacts the top contact of the PCB board 11, due to each A pair of power-on detection pieces 12 are provided at the bottom of the positioning rod 10, and the contacts are conductive as a whole. When the pair of power-on detection pieces 12 are in contact with the same contact, the circuit can be connected, and at this time, it can be determined that the positioning rod 10 is correctly positioned. When the power-on detection pieces 12 at the bottom of all positioning rods 10 are successfully activated, it can be determined that the overall positioning is correct. At this time, the hydraulic rod 7 drives the patch 3 to continue to descend and squeeze the spring 5. When the outer pin 2 of the patch 3 fits with the top contact of the PCB board 11, the internal heating piece 20 of the positioning rod 10 starts to heat the internal solder paste to improve the fluidity of the solder paste, and makes the solder paste flow out under the pressure of the external pipeline, so that the pin 2 and the PCB board 11 are fixed. After fixing, the hydraulic rod 7 is reset, and drives the vacuum adsorption tube 1 and the positioning rod 10 to reset, waiting for the next batch of processing;

[0047] Furthermore, when the vacuum adsorption tube 1 adsorbs the patch 3, the pneumatic push rod 18 pushes the push plate 4 downward, thereby driving the rack 17 downward, and the rotating gear 15 rotates under the meshing drive of the rack 17, so that the positioning rod 10 is expanded outward to avoid the bottom of the positioning rod 10 interfering with the material removal. When the vacuum adsorption tube 1 adsorbs the patch 3 and resets, the pneumatic push rod 18 is reset together and drives the positioning rod 10 to reset, so that the positioning rod 10 enters the positioning working state;

[0048] Furthermore, after the positioning is completed, when the patch 3 is pressed down, the pin 2 contacts the guide edge 13 and pushes the guide edge 13, so that the positioning rod 10 moves outward with the push, thereby leaving a certain gap between the tin outlet hole 21 and the pin 2. At the same time, due to the spring shaft structure of the rotating shaft 16, the positioning rod 10 is always attached to the outside of the pin 2, thereby preventing the pin 2 from blocking the tin outlet hole 21. When the tin is discharged, the heating plate 20 stops working, and the pneumatic push rod 18 is slightly pressed down, thereby keeping a certain distance between the positioning rod 10 and the pin 2, thereby preventing the solder paste inside the positioning rod 10 from being connected to the already extruded solder paste after cooling. And because the external tin supply pipeline stops supplying tin, a certain negative pressure is generated inside the positioning rod 10 at this time, preventing the internal solder paste from flowing out when the positioning rod 10 moves;

[0049] Secondly, when the power-on detection piece 12 at the bottom of the positioning rod 10 is not fully activated, the positioning error can be determined. At this time, the visual centering detection system equipped with the visual detection camera 6 can be used to adaptively compensate the difference or manually intervene to avoid the occurrence of defective products.

[0050] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A high-stability patch positioning device, comprising a vacuum adsorption tube (1), characterized in that: A hydraulic rod (7) is arranged at the top of the vacuum adsorption tube (1), a positioning sleeve (9) is movably connected to the outside of the vacuum adsorption tube (1), a plurality of positioning rods (10) are rotatably connected to the outside of the positioning sleeve (9), a pair of mutually cooperating power-on detection sheets (12) are arranged at the bottom of the positioning rod (10), a tin outlet hole (21) is provided at the bottom of the positioning rod (10), a spring (5) is connected between the bottom of the hydraulic rod (7) and the positioning sleeve (9), a patch (3) is adsorbed at the bottom of the vacuum adsorption tube (1), a plurality of pins (2) cooperating with the positioning rod (10) are arranged on the outside of the patch (3), a guide ridge (13) is arranged near the pins (2) of the positioning rod (10), and the guide ridge (13) is in a slope structure, the lower end of the slope structure protrudes, and the upper end is in contact with the outer wall of the positioning rod (10).

2. A high stability patch positioning device according to claim 1, characterized in that: A push plate (4) is slidably connected to the interior of the positioning sleeve (9), a pneumatic push rod (18) cooperating with the push plate (4) is arranged on the top of the positioning sleeve (9), and a plurality of racks (17) cooperating with the positioning rods (10) are arranged on the outside of the push plate (4).

3. A high stability patch positioning device according to claim 2, characterized in that: A plurality of groups of rotating shafts (16) cooperating with the positioning rods (10) are arranged inside the positioning sleeve (9), and the rotating shafts (16) are spring shaft structures.

4. A high stability patch positioning device according to claim 3, characterized in that: A rotating gear (15) meshing with the rack (17) is provided on the outside of the rotating shaft (16) near the rack (17), and a mounting groove (14) cooperating with the rotating shaft (16), the rotating gear (15), the rack (17) and the pushing plate (4) is provided inside the positioning sleeve (9).

5. A high stability patch positioning device according to claim 1, characterized in that: The interior of the positioning rod (10) is a hollow structure, and a pair of mutually matching heating plates (20) are arranged inside the positioning rod (10).

6. A high stability patch positioning device according to claim 1, characterized in that: A tin injection port is provided at the upper outer end of the positioning rod (10), and a PCB board (11) cooperating with the pin (2) is provided below the positioning rod (10).

7. A high stability patch positioning device according to claim 2, characterized in that: A top fixing member (8) is arranged at the top of the hydraulic rod (7), and a plurality of groups of visual detection cameras (6) are arranged at the bottom of the top fixing member (8). A through hole (19) cooperating with the vacuum adsorption tube (1) is provided in the middle of the push plate (4) and the positioning sleeve (9).

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