Preparation method of acceleration sensor

Abstract

The embodiment of the present application provides a preparation method of an acceleration sensor. The preparation method of the acceleration sensor comprises the following steps: processing a shell, a sensing part and an inertial part, and assembling the shell, the sensing part, the inertial part and an elastic part. The processing of the sensing part comprises the following steps: processing a first substrate and a second substrate; arranging the first substrate and the second substrate in a first direction; connecting edges of the first substrate and the second substrate; and forming a receiving cavity between the first substrate and the second substrate. One side of the first substrate away from the second substrate is processed to reduce the thickness of the first substrate. When the acceleration sensor has acceleration due to the movement of parts, the support force of the second substrate to the first substrate is small, the thickness of the first substrate is small, the first substrate can rapidly generate actual deformation under the elastic force of the elastic part and the inertial force of the inertial part, the sensing part can rapidly generate actual signals based on the actual deformation, and the corresponding acceleration can be reflected according to the actual signals.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of sensor preparation, and in particular to a method for preparing an acceleration sensor. Background Art

[0002] Accelerometer is a very important inertial sensing and measurement device, widely used in aerospace, vibration monitoring, industrial control, vehicles, geophysical exploration and other fields.

[0003] As the sensitivity of application equipment and products increases, the requirements for the sensitivity of acceleration sensors are also getting higher and higher. Existing acceleration sensors can no longer meet the use needs of high-sensitivity equipment and products. Therefore, the development of high-sensitivity acceleration sensors is an urgent problem to be solved. Summary of the Invention

[0004] In view of the above problems, an embodiment of the present application provides a method for preparing an acceleration sensor to solve the problems of complex structure and low sensitivity of existing acceleration sensors.

[0005] The embodiment of the present application provides a method for preparing an acceleration sensor. The method for preparing the acceleration sensor includes: processing a housing, processing a sensing part and processing an inertia part, and assembling the housing, the sensing part, the inertia part and the elastic part. Processing the sensing part includes: processing a first substrate; processing a second substrate; fixing the first substrate and the second substrate relative to each other along a first direction, connecting the edges of the first substrate and the second substrate, and forming a receiving cavity between the first substrate and the second substrate; wherein the first direction is parallel to the thickness direction of the first substrate; processing a side of the first substrate facing away from the second substrate to reduce the thickness of the first substrate.

[0006] In the embodiment of the present application, a cavity is formed between the first substrate and the second substrate, and the thickness of the first substrate is reduced. This allows the first substrate to rapidly produce a large degree of actual deformation under the action of actual pressure (the combined force of the elastic force of the elastic member and the inertial force of the inertial member) when the acceleration sensor has acceleration as the component moves. This is because, when there is a cavity between the first substrate and the second substrate, the second substrate and the first substrate support each other only at their edges. Therefore, when actual pressure acts on the first substrate, the second substrate provides less support for the first substrate, making it easier for the first substrate to produce actual deformation. When the thickness of the first substrate is small, the stiffness coefficient of the first substrate is relatively small, making it easier for the first substrate to produce actual deformation under the action of actual pressure. In addition, when the second substrate provides less support for the first substrate and the thickness of the first substrate is small, the first substrate is also more likely to produce a large degree of actual deformation due to the small inertial force generated by the inertial member under small acceleration. On the basis that the first substrate can quickly produce a large degree of actual deformation, the sensing element can quickly produce a large value of actual signal based on the actual deformation of the first substrate, so as to facilitate obtaining the actual deformation of the first substrate based on the actual signal, and then calculating the deformation of the first substrate based on the actual deformation and the preset deformation, and then obtaining the acceleration of the inertial element based on the deformation; wherein the preset deformation is the deformation of the first substrate produced under the preset pressure of the inertial element (i.e., the elastic force applied to the inertial element by the elastic element) during assembly. Since the acceleration of the inertial element is generated by the acceleration of the acceleration sensor, and the acceleration of the acceleration sensor is generated by the acceleration of the component, the acceleration of the inertial element is similar to the acceleration of the acceleration sensor and the acceleration of the component using the acceleration sensor. Therefore, on the basis of being able to quickly obtain the acceleration of the inertial element, the acceleration of the acceleration sensor and the acceleration of the component can also be quickly obtained, thereby improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0007] In some embodiments, processing the side of the first substrate facing away from the second substrate includes: placing an etchant on the side of the first substrate facing away from the second substrate; after the etchant reacts with the first substrate, removing the remaining etchant and the corroded and peeled portion of the first substrate; and grinding the side of the first substrate facing away from the second substrate until the thickness of the first substrate is less than or equal to a thickness threshold.

[0008] When the side of the first substrate facing away from the second substrate is subjected to etching, since the etching process is performed simultaneously on various portions of the side of the first substrate facing away from the second substrate, the efficiency of thinning the first substrate can be improved, allowing the thickness of the first substrate to quickly reach near the thickness threshold. In addition, since the etching process does not apply a large force to the first substrate compared to other processing methods, defects such as deformation and / or fracture of the first substrate can be avoided. After the etching process, when the side of the first substrate facing away from the second substrate is ground, since the grinding process is more sophisticated, the thickness of the first substrate can be relatively accurately controlled, the flatness of the exposed surface of the first substrate after etching is improved, the contact area between the inertial member and the first substrate is increased, and the force direction of the first substrate during use is ensured to basically meet the set requirements, thereby reducing the possibility of damage to the first substrate.

[0009] In some embodiments, the thickness threshold is 3 mm.

[0010] By setting the thickness of the first substrate to be less than or equal to 3 mm, the stiffness coefficient of the first substrate can be made smaller and the sensitivity to actual pressure can be made higher, thereby making it easier for the first substrate to produce faster and greater actual deformation under the action of actual pressure. The sensing element can quickly generate an actual signal with a larger value based on the actual deformation of the first substrate, which is convenient for obtaining the specific deformation amount of the actual deformation of the first substrate according to the actual signal, and then quickly obtaining the acceleration of the inertial element according to the deformation amount, which is more conducive to improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0011] In some embodiments, processing the first substrate includes: providing a first conductive layer on a first base; forming a first electrode pattern on the first conductive layer; applying a first alignment layer on the first conductive layer, and rubbing the first alignment layer. The first base includes a first main portion and a first protrusion, and the first electrode pattern includes a first electrode terminal, a second electrode terminal, and a first main electrode. The first main electrode is provided on the first main portion, and the first and second electrode terminals are provided on the first protrusion. The first electrode terminal is connected to the first main electrode, and the second electrode terminal is disconnected from the first main electrode.

[0012] Through the above scheme, the first substrate can be made into a plate with a conductive function. When the first substrate is a plate with a conductive function, as the first substrate rapidly produces a large degree of actual deformation under the action of actual pressure, the sensing element can quickly generate an actual voltage signal or an actual current signal with a large value, and output the actual voltage signal or the actual current signal to the outside through the first electrode terminal, so as to quickly obtain the specific deformation amount of the actual deformation of the first substrate according to the actual voltage signal or the actual current signal, and then quickly obtain the acceleration of the inertial element according to the deformation amount. Since the actual voltage signal or the actual current signal is a specific numerical value after quantization, the corresponding acceleration value obtained according to the actual voltage signal or the actual current signal has a higher accuracy, thereby further improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0013] In some embodiments, processing the second substrate includes: providing a second conductive layer on a second base; forming a second electrode pattern on the second conductive layer; applying a second alignment layer on the second conductive layer, and rubbing the second alignment layer. The second base includes a second main portion and a second protrusion, and the second electrode pattern includes a third electrode terminal and a second main electrode. The second main electrode is provided on the second main portion, and the third electrode terminal is provided on the second protrusion, and the third electrode terminal is connected to the second main electrode.

[0014] Through the above scheme, the second substrate can also become a plate with a conductive function. When the first substrate and the second substrate are both set as plates with a conductive function, the second electrode terminal in the first substrate and the third electrode terminal in the second substrate are connected, so that the sensing element can be used as a capacitor. As the first substrate quickly produces a large degree of actual deformation under the action of actual pressure, the sensing element can quickly output a large value of an actual capacitance signal based on the distance between the first substrate and the second substrate, and output the actual capacitance signal through the first electrode terminal and the second electrode terminal, so as to obtain the acceleration of the inertial element according to the actual capacitance signal. Since the actual capacitance signal is a specific value after quantization, the corresponding acceleration value obtained according to the actual capacitance signal has higher accuracy, thereby further improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0015] In some embodiments, after connecting the edges of the first substrate and the second substrate, the method for preparing the acceleration sensor further includes: placing a medium in the accommodating cavity and sealing the accommodating cavity, wherein the dielectric constant of the medium is greater than or equal to 1 Farad / m.

[0016] When the induction element is used as a capacitor and the dielectric constant of the medium is greater than or equal to 1 farad / meter, the medium has a strong ability to store charge in the electric field of the induction element. When the distance between the first substrate and the second substrate is constant, the larger dielectric constant can generate a larger actual capacitance signal between the first substrate and the second substrate, thereby amplifying the actual capacitance signal. That is, even if the acceleration changes slightly under different states, it can cause a larger change in the actual capacitance signal, which facilitates the reading of the actual capacitance signal and the acquisition of different acceleration values ​​with smaller differences through the actual capacitance signal, thereby improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0017] In some embodiments, the medium includes at least one of liquid crystal, ester oil, or mineral oil.

[0018] Since liquid crystal, ester oil, and mineral oil have large dipole moments, large polarities, and dielectric constants greater than 1 Farad / meter, when the medium includes liquid crystal, ester oil, and mineral oil, the ability of the sensing element to store charge can be increased, thereby improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0019] In some embodiments, processing the inertial member includes: processing one end of the first column to form a force-applying portion; processing the other end of the first column to form a guide portion; wherein an end surface area of ​​the force-applying portion away from the guide portion is smaller than an end surface area of ​​the first substrate.

[0020] By machining the end surface area of ​​the force-applying portion away from the guide portion to be smaller than the end surface area of ​​the first substrate, the inertial member can be brought into contact with the middle portion of the first substrate through the force-applying portion, thereby increasing the pressure applied by the inertial member to the first substrate and causing the first substrate to rapidly produce a greater degree of actual deformation, thereby improving the sensitivity of the acceleration sensor prepared in the embodiment of the present application. At the same time, since the embodiment of the present application does not require the size of the guide portion, in some feasible embodiments, the size of the guide portion can be machined to match the size of the inner cavity of the housing, so that when the inertial member moves toward the first substrate, the guide portion contacts the cavity wall of the inner cavity to guide the inertial member and reduce the possibility of vibration or shaking of the inertial member within the housing. In addition, when the size of the guide portion matches the size of the inner cavity, the overall weight of the inertial member is greater. When the acceleration sensor has acceleration due to the movement of the components, the inertial member can generate a greater inertial force to abut the first substrate, causing the first substrate to rapidly produce a greater degree of deformation, further improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0021] In some embodiments, processing the housing includes: removing material from the second columnar body to form an annular sidewall, wherein the space within the annular portion of the sidewall is configured as an inner cavity; processing a first cover member; and processing a second cover member. Assembling the housing, the sensing member, the inertial member, and the elastic member includes: attaching the first cover member to one end of the sidewall; attaching the sensing member to the inner cavity so that the second substrate abuts the first cover member; attaching the inertial member to the inner cavity so that the force-applying portion abuts the middle portion of the first substrate; attaching the elastic member to the inner cavity so that one end of the elastic member abuts the guide member; and attaching the second cover member to the other end of the sidewall so that the other end of the elastic member abuts the second cover member.

[0022] Through the above-mentioned assembly scheme, the position of the sensing part in the inner cavity can be limited by the first covering part, and the position of the force-applying part abutting against the first substrate, the direction of the inertial part abutting against the sensing part, and the direction of the elastic part abutting against the inertial part can be limited by the side wall, so that the inertial part abuts against the middle part of the first substrate along the thickness direction of the first substrate through the force-applying part, and at the same time, the direction of the elastic force of the elastic part after it is installed in the inner cavity is also along the thickness direction of the first substrate. In this way, when the component generates an acceleration parallel to the thickness direction of the first substrate, the direction of the resultant force generated by the inertial force of the inertial part and the elastic force of the elastic part is parallel to the thickness direction of the first substrate. When the resultant force acts on the first substrate as an actual pressure, the first substrate can quickly produce a large degree of actual deformation under the action of the actual pressure, thereby improving the sensitivity and accuracy of the acceleration sensor of the embodiment of the present application.

[0023] In some embodiments, processing the shell further includes: processing a plurality of guide grooves extending along the generatrix direction of the side wall on the inner surface of the side wall; assembling the inertial member in the inner cavity includes: positioning at least a portion of the guide portion in the guide groove.

[0024] By machining a guide groove on the inner surface of the side wall and positioning at least a portion of the guide portion in the guide groove, at least a portion of the guide portion can move in the guide groove. During the movement of the guide portion, at least a portion of the guide portion is restricted by the groove wall of the guide groove, thereby reducing the possibility of rotation or directional deviation of the inertial member when moving toward the first substrate, improving the accuracy of the force-applying portion abutting against the middle portion of the first substrate, and further improving the sensitivity of the first substrate to actual deformation caused by the abutment of the force-applying portion.

[0025] In some embodiments, the guide portion is a cylindrical structure; before assembling the inertial member in the inner cavity, it also includes: processing multiple groups of protrusions linearly arranged along the busbar direction of the guide portion on the circumference of the guide portion; assembling the inertial member in the inner cavity includes: assembling at least part of the protrusion corresponding to the guide groove.

[0026] By machining a plurality of protrusions on the circumferential surface of the guide portion, and assembling at least part of the protrusions into the guide groove, the protrusions can move in the guide groove, and during the movement of the protrusions, the protrusions are limited by the groove walls of the guide groove, thereby limiting the movement of the inertial part, so as to reduce the possibility of rotation or direction deviation when the inertial part moves towards the first substrate.

[0027] In some embodiments, the guide portion is a prismatic structure; and assembling the inertial part into the inner cavity comprises: assembling at least part of the side edges of the prismatic structure into the guide groove.

[0028] By machining the inertial part into a prismatic structure, and assembling at least part of the side edges of the prismatic structure into the guide groove, the side edges can move in the guide groove, and during the movement of the side edges, the side edges are limited by the groove walls of the guide groove, which can reduce the possibility of rotation or direction deviation when the inertial part moves towards the first substrate. At the same time, machining the guide portion into a prismatic structure makes the shape of the guide portion regular, which is more convenient to manufacture. By cooperating between the side edges of the prismatic structure and the guide groove for guiding, the machining step of additional guiding structure is omitted, the manufacturing efficiency of the inertial part is improved, and the processing cost is saved.

[0029] In some embodiments, before assembling the shell, the inductive part, the inertial part and the elastic part, the method further comprises: machining the third columnar body into a ring structure to obtain a positioning part; fixing the positioning part at the middle part of the surface of the first substrate away from the second substrate; and when assembling the inertial part into the inner cavity, the abutting position of the force applying part on the first substrate is located within the range surrounded by the positioning part.

[0030] By machining the positioning part and assembling the positioning part at the middle part of the surface of the first substrate away from the second substrate, the positioning part can limit the force applying part when the inertial part moves towards the first substrate, which reduces the possibility of the force applying part moving in other directions, improves the accuracy of the force applying part abutting at the middle part of the first substrate, and further improves the sensitivity of the first substrate to quickly produce a large degree of actual deformation under the abutment of the force applying part. At the same time, since the ring structure is a relatively common structure, machining the positioning part into a ring structure can also reduce the processing difficulty of the acceleration sensor and improve the processing efficiency of the acceleration sensor.

[0031] The above description is only a summary of the technical solutions of the embodiments of the present application. In order to more clearly understand the technical means of the embodiments of the present application, the embodiments of the present application can be implemented according to the content of the specification, and in order to make the above and other purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 The figure is a flowchart of the steps of the method for preparing the acceleration sensor in some embodiments.

[0034] Figure 2 In some embodiments, Figure 1 Exploded view of an acceleration sensor prepared using the preparation method in FIG.

[0035] Figure 3 The figure is a flow chart of the steps for processing the induction parts in some embodiments.

[0036] Figure 4 In some embodiments, Figure 2 An exploded diagram of an induction component processed through a step-by-step process.

[0037] Figure 5 The present invention is a flow chart of steps for processing a side of a first substrate facing away from a second substrate in some embodiments.

[0038] Figure 6 The figure is a flow chart of steps for processing a first substrate in some embodiments.

[0039] Figure 7 In some embodiments, Figure 6 Exploded view of the first substrate processed in the step flow.

[0040] Figure 8 Schematic diagram of the first substrate and the first conductive layer in some embodiments.

[0041] Figure 9 The figure is a flow chart of steps for disposing a first conductive layer on a first substrate in some embodiments.

[0042] Figure 10 Schematic diagram of the steps of forming a first electrode pattern on the first conductive layer in some embodiments.

[0043] Figure 11 Schematic diagram of the steps of coating an alignment layer on a first conductive layer and performing rubbing alignment on the first alignment layer in some embodiments.

[0044] Figure 12 Schematic diagram of the second substrate and the second conductive layer in some embodiments.

[0045] Figure 13A step flow chart for processing the inertial member in some embodiments.

[0046] Figure 14 A schematic diagram of the inertial member processed according to the step flow in some embodiments. Figure 13

[0047] Figure 15 A step flow chart for processing the housing in some embodiments.

[0048] Figure 16 A schematic diagram of the housing processed according to the step flow in some embodiments. Figure 15

[0049] Figure 17 A step flow chart for assembling the housing, the inductive member, the inertial member and the elastic member in some embodiments.

[0050] Figure 18 A schematic diagram of the acceleration sensor prepared according to the preparation method in some embodiments. Figure 1

[0051] BRIEF DESCRIPTION OF DRAWINGS

[0052] Housing 1, side wall 11, guide groove 110, first cover member 12, second cover member 13; elastic member 2; inertial member 3, guide portion 31, protrusion 311, force applying portion 32; inductive member 4, first substrate 41, first base 411, first main body portion 4110, first protrusion 4111, first conductive layer 412, first main electrode 4120, first electrode terminal 4121, second electrode terminal 4122, first alignment layer 413, dielectric 42, second substrate 43, second base 431, second main body portion 4310, second protrusion 4311, second conductive layer 432, second main electrode 4320, third electrode terminal 4321, second alignment layer 433; positioning member 5;

[0053] First direction Y. DETAILED DESCRIPTION

[0054] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0055] ​​​Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification, claims and drawings of this application are intended to cover non-exclusive inclusions.

[0056] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it necessarily refer to independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0057] The directional terms appearing in the following description refer to the directions shown in the drawings and are not intended to limit the specific structure of this application. For example, in the description of this application, the terms "thickness," "inner," "outer," and "axial" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings. These terms are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0058] In addition, expressions such as the Y direction used to indicate the operation and construction of the various components of this embodiment are not absolute but relative, and although these indications are appropriate when the various components are in the positions shown in the figures, when these positions change, these directions should be interpreted differently to correspond to the changes.

[0059] In addition, the terms "first", "second", etc. in the description and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order, and may explicitly or implicitly include one or more such features.

[0060] In the description of this application, unless otherwise specified, "plurality" means more than two (including two), and similarly, "multiple groups" means more than two (including two).

[0061] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, the "connection" or "connection" of a mechanical structure may refer to a physical connection. For example, the physical connection may be a fixed connection; the physical connection may also be a detachable connection; the physical connection may also be an integral connection.

[0062] Accelerometers are test instruments that convert the pressure generated by physical phenomena such as acceleration, vibration, and shock into a measurable signal. With the advancement of science and technology, the demand for accelerometer sensitivity is increasing in applications such as industrial monitoring, machinery health diagnostics, aviation, aerospace, military, and vehicles. Consequently, the market demand for high-sensitivity accelerometers is also growing.

[0063] The inventors noted that the structural design of existing accelerometers is irrational, preventing their pressure transducer elements from fully and accurately detecting the pressure generated by physical phenomena such as velocity, vibration, and impact, thereby reducing the accuracy of the accelerometers. Furthermore, because the pressure transducer elements themselves are insensitive to pressure, they are unable to quickly and accurately output pressure-based signals, resulting in poor sensitivity.

[0064] In order to solve the problems of poor sensitivity and low precision of acceleration sensors, the inventors have designed a method for preparing an acceleration sensor after in-depth research. The acceleration sensor prepared by this method has the beneficial effects of high sensitivity and high precision.

[0065] In order to fully and accurately understand the method for preparing the acceleration sensor according to the embodiment of the present application, the method for preparing the acceleration sensor according to the embodiment of the present application is explained and illustrated in detail below with reference to the accompanying drawings.

[0066] An embodiment of the present application provides a method for preparing an acceleration sensor.

[0067] See Figures 1 to 2 , Figure 1 This is a flowchart of the steps of the method for preparing the acceleration sensor implemented in some embodiments of the present application. Figure 2 In accordance with this application Figure 1 The exploded view of an acceleration sensor prepared by the preparation method of the embodiment shown in FIG. Figure 1 and Figure 2 As shown, the preparation method of the acceleration sensor is as follows.

[0068] S1: Processing shell 1.

[0069] S2: Processing sensing part 4.

[0070] S3: Processing inertia part 3.

[0071] S4: Assemble the housing 1 , the inductive component 4 , the inertial component 3 and the elastic component 2 .

[0072] See Figures 3 and 4 , Figure 3 This is a flowchart of the steps for processing the induction member 4 in some implementations of this application. Figure 4According to this application Figure 3 The exploded view of a sensor 4 processed by the steps in the embodiment shown. Figure 3 and Figure 4 As shown, processing the induction part 4 includes the following steps.

[0073] S21 : processing the first substrate 41 .

[0074] S22: Processing the second substrate 43.

[0075] S23: Arrange the first substrate 41 and the second substrate 43 opposite to each other along a first direction Y, connect the edges of the first substrate 41 and the second substrate 43, and form a receiving cavity between the first substrate 41 and the second substrate 43; wherein the first direction Y is parallel to the thickness direction of the first substrate 41.

[0076] S24 : processing a surface of the first substrate 41 facing away from the second substrate 43 to reduce the thickness of the first substrate 41 .

[0077] The housing 1 is a hollow, thin-walled component that houses the sensing element 4, the inertial element 3, and the elastic element 2. The housing 1 has an inner cavity, which contains the sensing element 4, the inertial element 3, and the elastic element 2. This allows the multiple components that make up the acceleration sensor to be handled and used as a single unit. Furthermore, the housing 1 provides protection for the sensing element 4, the inertial element 3, or the elastic element 2 within the inner cavity, reducing the likelihood of damage to the sensing element 4, the inertial element 3, or the elastic element 2 from environmental influences, thereby ensuring the accuracy of the acceleration sensor. When machining the housing 1, materials with a certain degree of hardness and strength (such as stainless steel, aluminum alloy, etc.) can be used. This prevents the housing 1 from deforming due to external forces or collisions, reducing the likelihood that deformation of the housing 1 will affect the sensing element 4, the inertial element 3, and the elastic element 2. The housing 1 can also be machined into a variety of shapes, such as a hollow rectangular parallelepiped, a cylinder, or a hexagonal prism.

[0078] Elastic member 2 applies an elastic force to inertial member 3, maintaining contact between inertial member 3 and sensing member 4, and causing inertial member 3 to apply a preset or actual pressure to sensing member 4. Specifically, when the accelerometer is stationary or in constant motion with the component, the accelerometer has no acceleration (i.e., the acceleration is zero). Elastic member 2 applies an elastic force to inertial member 3, maintaining contact between inertial member 3 and sensing member 4, and applies a preset pressure to sensing member 4 under the action of this elastic force. When the accelerometer experiences acceleration due to component motion (i.e., the acceleration is greater than or less than zero), elastic member 2 applies an elastic force to inertial member 3. The combined force of this elastic force and its own inertial force causes inertial member 3 to apply an actual pressure to sensing member 4. Elastic member 2 can be a commercially available spring.

[0079] The inertial element 3 is the component that applies the preset or actual pressure to the sensing element 4. When processing the inertial element 3, a hard material (such as iron, copper, or stainless steel) can be used. This prevents the inertial element 3 from being easily deformed by the reaction force of the sensing element 4 when the preset or actual pressure is applied to the sensing element 4.

[0080] The sensing member 4 is a component that generates a preset deformation under a preset pressure and generates a preset signal based on the preset deformation. It is also a component that generates an actual deformation under actual pressure and generates an actual signal based on the actual deformation. The preset pressure refers to the force applied to the sensing member 4 by the inertial member 3 under the elastic force of the elastic member 2 when the acceleration sensor is assembled or when the acceleration sensor moves with the component without acceleration. The preset deformation refers to the deformation of the sensing member 4 under the preset pressure. The actual pressure refers to the force applied to the sensing member 4 by the inertial member 3 under the combined force of the elastic force of the elastic member 2 and the inertial force of the inertial member 3 itself when the acceleration sensor generates acceleration as the component moves. The actual deformation refers to the deformation of the sensing member 4 under the action of the actual pressure.

[0081] The method of processing the sensing part 4 may be any one or a combination of methods such as turning, milling, grinding or electrochemical corrosion. The present application does not specifically limit the specific processing method of the first substrate 41 and the second substrate 43. When processing the sensing part 4, the first substrate 41 and the second substrate 43 can be processed into square plates, or the first substrate 41 and the second substrate 43 can be processed into circular plates. The embodiment of the present application does not specifically limit the shape of the first substrate 41 and the second substrate 43. When connecting the edge parts of the first substrate 41 and the second substrate 43, for example, a frame glue can be set at the edge part of the first substrate 41 facing the second substrate 43, and the second substrate 43 is covered on the first substrate 41 in the opposite direction of the first direction Y to connect the first substrate 41 and the second substrate 43.

[0082] It should be noted that during the assembly of the housing 1, sensing element 4, inertial element 3, and elastic element 2, the sensing element 4, inertial element 3, and elastic element 2 can be sequentially assembled into the housing 1 along the axis of the housing 1, such that the inertial element 3 abuts the first substrate 41 in the sensing element 4, and the elastic element 2 abuts between the inertial element 3 and the inner wall of the housing 1, thereby being in a pre-compressed state. When the elastic element 2 is in the pre-compressed state, when the accelerometer moves linearly with the component at a uniform speed, the elastic element 2 can apply an elastic force to the inertial element 3 to restore the accelerometer to its normal state, causing the inertial element 3 to abut the first substrate 41, thereby generating a preset deformation of the first substrate 41 and causing the sensing element 4 to generate a preset signal. Furthermore, when the accelerometer experiences acceleration due to the movement of the component, the elastic element 2 can still apply an elastic force to the inertial element 3 to restore the accelerometer to its normal state, causing the inertial element 3 to abut the first substrate 41, thereby generating actual deformation of the first substrate 41 and causing the sensing element 4 to generate an actual signal.

[0083] Furthermore, the preset signal generated by the sensing element 4 can be a preset distance signal between the center of the first substrate 41 and the center of the second substrate 43 after the first substrate 41 is subjected to a preset pressure, or a preset capacitance signal, a preset voltage signal, or a preset current signal generated by the sensing element 4 after the first substrate 41 is subjected to a preset pressure. The actual signal generated by the sensing element 4 can be an actual distance signal between the center of the first substrate 41 and the center of the second substrate 43 after the first substrate 41 is subjected to an actual pressure, or an actual capacitance signal, an actual voltage signal, or an actual current signal generated by the sensing element 4 after the first substrate 41 is subjected to an actual pressure. Exemplarily, when the preset signal generated by the sensing element 4 is a preset distance signal and the actual signal is an actual distance signal, a distance detection element can be provided in the sensing element 4 to detect the preset distance signal or the actual distance signal. Exemplarily, the distance detection element can be a measuring ruler, a distance sensor, or an optical imaging distance detector, etc. The embodiment of the present application does not specifically limit the distance detection element.

[0084] After the housing 1, the inductive element 4, the inertial element 3 and the elastic element 2 are assembled, the following Figure 2 The accelerometer shown.

[0085] In order to more clearly understand the principle of detecting acceleration by the acceleration sensor manufactured using this method, an exemplary explanation is given below.

[0086] Assume that the stiffness coefficient of the elastic member 2 is K, and the stiffness coefficient of the first substrate 41 in the sensing member 4 is K′, wherein both K and K′ are related to the properties of the material itself and are constant values.

[0087] When the acceleration sensor has no acceleration (the acceleration a of the inertial member 3 is 0), the elastic member 2 has a preset deformation X1 compared to the natural state, and the first substrate 41 in the sensing member 4 has a preset deformation H1 compared to the natural state. At this time, according to Hooke's law, the elastic force of the elastic member 2 is: F1 = KX1, and the force on the first substrate 41 is F2 = K'H1. When the acceleration a is 0, F1 = F2, that is, KX1 = K'H1.

[0088] When the acceleration sensor has an acceleration a (the acceleration a of the inertial part 3 is not 0), the elastic part 2 has an actual deformation amount X1+Δd compared with the natural state, wherein Δd is a deformation amount of the elastic part 2 caused by the inertial force of the inertial part 3 on the basis of the preset deformation amount. The deformation space of the deformation amount Δd of the elastic part 2 is almost completely caused by the deformation of the first substrate 41, so the first substrate 41 in the sensing part 4 has an actual deformation amount H1+Δd compared with the natural state, that is, when the acceleration sensor has an acceleration, the elastic part 2 and the first substrate 41 both increase the deformation amount Δd compared with the preset state; wherein the preset state of the elastic part 2 is the state of having the preset deformation amount X1, and the preset state of the first substrate 41 is the state of having the preset deformation amount H1. At this time, according to the formula of the inertial force, the inertial force of the inertial part 3 is F3=am; according to Hooke's law, the elastic force of the elastic part is F4=K(X1+Δd), and the force of the first substrate 41 is F5=K'(H1+Δd). It can be known by force analysis that the force F5 of the first substrate 41 mainly comes from two parts, the first part is the inertial force F3 of the inertial part 3, and the second part is the elastic force F4 of the elastic part 2, so in this case, F5=F3+F4, that is, K'(H1+Δd)=am+K(X1+Δd), and because KX1=K'H1, finally the deformation is obtained as a=(K'-K)Δd / m.

[0089] According to the above calculation formula of the acceleration, in the case that K, K' and m are all constant values, the acceleration a of the acceleration sensor and the component moving together is proportional to the deformation amount Δd of the first substrate 41, wherein the deformation amount Δd refers to the deformation amount of the first substrate 41 at the time when the actual acceleration a is generated compared with the preset state.

[0090] Therefore, when the acceleration sensor manufactured by the manufacturing method of the acceleration sensor in the embodiments of the present application is used, as long as the deformation amount Δd of the first substrate 41 in the sensing part 4 at a certain time is measured, the acceleration of the acceleration sensor and the component at this time can be obtained.

[0091] Because the thickness of the first substrate 41 is thinned in the step S24 of the embodiments of the present application, the first substrate 41 can generate the measurable deformation amount Δd more quickly under the same acceleration. In addition, because the accommodating cavity is arranged between the first substrate 41 and the second substrate 43 in the step S23 of the embodiments of the present application to reduce the supporting force of the second substrate 43 on the first substrate 41, the first substrate 41 can generate the measurable deformation amount Δd more quickly under the same acceleration. Therefore, the acceleration sensor manufactured by the manufacturing method of the acceleration sensor in the embodiments of the present application has higher sensitivity and higher precision, and is more suitable for the devices and scenes such as automobiles and aerospace equipment which have higher requirements for the precision of the acceleration sensor.

[0092] Based on the foregoing, since the actual signal of the sensing element 4 is generated based on the actual deformation, the deformation Δd of the first substrate 41 can be reversely calculated based on the actual signal generated by the sensing element 4, the preset signal, and the relationship between the actual signal and the deformation Δd of the first substrate 41, thereby calculating the acceleration of the inertial element 3. For example, when the preset signal generated by the sensing element 4 is a preset distance signal between the center of the first substrate 41 and the center of the second substrate 43, and the actual signal is a signal representing the actual distance between the center of the first substrate 41 and the center of the second substrate 43, the deformation Δd of the first substrate 41 is the difference between the actual distance signal and the preset distance signal. Similarly, when the preset signal and the actual signal are current signals, voltage signals, or capacitance signals, the deformation Δd of the first substrate 41 can be calculated based on the relationship between the current signal, voltage signal, or capacitance signal and the deformation Δd of the first substrate 41, and the acceleration of the acceleration sensor and its components can be calculated using the aforementioned acceleration formula.

[0093] According to other embodiments of the present application, see Figure 5 , Figure 5 4 is a flowchart of the steps for processing the side of the first substrate 41 facing away from the second substrate 43 in some embodiments of the present application. Figure 5 As shown, the steps for processing the side of the first substrate 41 facing away from the second substrate 43 are as follows.

[0094] S251 : placing an etchant on a side of the first substrate 41 facing away from the second substrate 43 .

[0095] S252: After the etching agent reacts with the first substrate 41, the remaining etching agent and the portion of the first substrate 41 that has been corroded and peeled off are removed.

[0096] S253 : Grinding a surface of the first substrate 41 facing away from the second substrate 43 until the thickness of the first substrate 41 is less than or equal to a thickness threshold.

[0097] In some embodiments, the side of the first substrate 41 facing away from the second substrate 43 can be made of glass, and the etchant can be hydrofluoric acid. In this way, the etchant can chemically react with the side of the first substrate 41 facing away from the second substrate 43 to reduce the thickness of the first substrate 41.

[0098] When the corrosive agent reacts with the side of the first substrate 41 facing away from the second substrate 43, the degree of reaction between the corrosive agent and the first substrate 41 can be controlled by controlling the amount of corrosive agent applied, the concentration of the corrosive agent, or the reaction time between the corrosive agent and the first substrate 41, so that the first substrate 41 after being corroded by the corrosive agent can be close to the thickness threshold, thereby preventing the corrosive agent from completely corroding through the first substrate 41.

[0099] After the etchant has been corroded for a predetermined period of time, the etchant and the surface portion of the first substrate 41 that has been corroded and peeled off are promptly removed. This can prevent the reaction products from adhering to the surface of the first substrate 41 and affecting the contact between the first substrate 41 and the inertial element 3, thereby affecting the preset pressure or actual pressure applied by the inertial element 3 to the sensing element 4, resulting in inaccurate acceleration measurement.

[0100] After quickly reducing the thickness of the first substrate 41 by etching, the thickness of the first substrate 41 is further reduced by grinding, a fine and easy-to-control processing size method. This not only allows the thickness of the first substrate 41 to be accurately controlled within a suitable size range that is less than or equal to a thickness threshold, but also increases the flatness of the side of the first substrate 41 facing away from the second substrate 43, thereby increasing the thickness accuracy of the first substrate 41, reducing the flatness error of the first substrate 41, improving the quality of the acceleration sensor, and enhancing the accuracy of the acceleration sensor in measuring acceleration.

[0101] The technical solution of the embodiment of the present application improves the thinning efficiency of the first substrate 41 by etching the surface facing away from the second substrate 43. Since the etching process is performed simultaneously on the entire surface, the thickness of the first substrate 41 can be improved, allowing the thickness of the first substrate 41 to quickly reach the desired thickness. In addition, when the surface material of the first substrate 41 is removed by etching, compared with other processing methods, less force is applied to the first substrate 41, thus avoiding defects such as deformation or fracture of the first substrate 41 when removing a large amount of material from the first substrate 41. After the etching process, by grinding the surface of the first substrate 41 facing away from the second substrate 43, not only can the thickness of the first substrate 41 be relatively accurately controlled, but the flatness of the exposed surface of the first substrate 41 after etching can also be improved, ensuring that the force direction of the first substrate 41 during use is basically consistent with the requirements, and reducing the possibility of damage to the first substrate 41. For example, if the exposed surface of the first substrate 41 after etching is uneven, the inertial element 3 may abut against a protruding portion of the first substrate 41, which is likely to cause damage to the first substrate 41.

[0102] In other embodiments, processing the side of the first substrate 41 facing away from the second substrate 43 may further include directly grinding the side of the first substrate 41 facing away from the second substrate 43 until the thickness of the first substrate 41 is less than or equal to a thickness threshold.

[0103] According to some other embodiments of the present application, the thickness threshold is 3 mm.

[0104] If the thickness of the first substrate 41 is greater than 3 mm, the stiffness coefficient of the first substrate 41 will increase due to the greater thickness of the first substrate 41, and the sensitivity of the first substrate 41 to actual pressure will decrease. Furthermore, even if the inertial member 3 abuts against the first substrate 41, the first substrate 41 cannot produce a more obvious actual deformation based on the actual pressure, resulting in the inductive member 4 being unable to quickly generate an actual signal, which is not conducive to improving the sensitivity of the acceleration sensor.

[0105] In the technical solution of the embodiment of the present application, by setting the thickness of the first substrate 41 to be less than or equal to 3 mm, the stiffness coefficient of the first substrate 41 can be made smaller and the sensitivity to actual pressure can be made higher, thereby making it easier for the first substrate 41 to produce faster and greater actual deformation under the actual pressure of the inertial member 3. The sensing member 4 can quickly generate an actual signal with a larger value based on the actual deformation of the first substrate 41, which is convenient for obtaining the specific deformation amount of the actual deformation of the first substrate 41 according to the actual signal, and then quickly obtaining the acceleration of the inertial member 3 according to the deformation amount, which is more conducive to improving the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0106] According to other embodiments of the present application, see Figures 6 to 8 ,in, Figure 6 This is a flowchart of the steps of processing the first substrate 41 in some embodiments of the present application. Figure 7 In accordance with Figure 6 An exploded schematic diagram of the first substrate 41 processed in the steps of Figure 8 Schematic diagram of the first substrate 411 and the first conductive layer 412. Figure 6 and Figure 7 As shown, the steps of processing the first substrate 41 are as follows.

[0107] S211 : Disposing a first conductive layer 412 on the first substrate 411 .

[0108] S212 : fabricating a first electrode pattern on the first conductive layer 412 .

[0109] S213 : coating a first alignment layer 413 on the first conductive layer 412 , and performing rubbing alignment on the first alignment layer 413 .

[0110] After processing the first substrate 41, the following Figure 8The first substrate 411 and the first conductive layer 412 are shown. The first substrate 411 includes a first main portion 4110 and a first protrusion 4111. The first electrode pattern includes a first main electrode 4120, a first electrode terminal 4121, and a second electrode terminal 4122. The first main electrode 4120 is disposed on the first main portion 4110, and the first and second electrode terminals 4121 and 4122 are disposed on the first protrusion 4111. The first electrode terminal 4121 is connected to the first main electrode 4120, while the second electrode terminal 4122 is disconnected from the first main electrode 4120. For example, the first protrusion 4111 is located at the edge of the plate-shaped first main portion 4110 and is integrally formed with the first main portion 4110. The overall shape of the first substrate 411 can be cut and formed before the first conductive layer 412 is plated on the first substrate 411, or after the first alignment layer 413 is applied. Both the first and second electrode terminals 4121 and 4122 can be processed into strip-shaped structures. The first electrode terminal 4121 is connected to the first main electrode 4120, which means that the first electrode terminal 4121 and the first main electrode 4120 are connected as a whole so that current can flow therebetween. The second electrode terminal 4122 is disconnected from the first main electrode 4120, which means that a gap exists between the second electrode terminal 4122 and the first main electrode 4120, so that current cannot flow directly therebetween.

[0111] like Figure 9 As shown, the steps of disposing the first conductive layer 412 on the first substrate 411 are as follows.

[0112] S2111 : Cleaning the first substrate 411 to remove dust, organic matter, etc. on the surface of the first substrate 411 .

[0113] S2112: Plating a first conductive layer 412 on any surface of the first substrate 411; wherein the first substrate 411 may be made of glass, and the first conductive layer 412 may be an indium tin oxide layer.

[0114] like Figure 10 As shown, the steps of making the first electrode pattern on the first conductive layer 412 are as follows.

[0115] S2121: Clean the first substrate 411 coated with the first conductive layer 412 with degreasing liquid, deionized water, and ultrasonic waves in sequence.

[0116] S2122: Evenly apply photoresist on the side of the first conductive layer 412 facing away from the first substrate 411; wherein the viscosity of the photoresist is between 15 mPa·s and 25 mPa·s, the flow rate of the photoresist is maintained between 8 ml / min and 10 ml / min, and during coating, the distance between the supporting wheel and the coating wheel is between 0.3 mm and 0.5 mm.

[0117] S2123: Leveling and curing the photoresist; wherein, the leveling temperature is between 20°C and 90°C, the leveling time is between 8 seconds and 15 seconds, and the curing temperature is between 30°C and 100°C, and the curing time is between 8 seconds and 15 seconds.

[0118] S2124: Exposure to form a first electrode pattern on the first conductive layer 412; during exposure, the type of the mask is a dry plate, a film, a chrome plate, or an iron oxide plate, and when the mask is a dry plate, the energy range of the lamp light intensity is between 80 mJ / cm2 and 160 mJ / cm2, when the mask type is a film, the energy range of the lamp light intensity is between 80 mJ / cm2 and 170 mJ / cm2, and when the mask type is a chrome plate or an iron oxide plate, the energy range of the lamp light intensity is between 60 mJ / cm2 and 140 mJ / cm2.

[0119] S2125: Use a developer to remove the photoresist of the exposed portion to expose a portion of the first conductive layer 412; wherein the developing speed is 2.4 m / min to 2.8 m / min, the developer display temperature is 23° C. to 27° C., and the developer flow rate is 30 L / min to 40 L / min.

[0120] S2126: Curing the photoresist in the unexposed portion; wherein the curing temperature is between 30° C. and 110° C., and the curing time is between 8 seconds and 15 seconds.

[0121] S2127: Etching the exposed first conductive layer 412 with an etching solution, and removing the unexposed portion of the photoresist with a stripping solution; wherein the etching solution flow rate is between 60 liters / minute and 100 liters / minute; and the stripping solution flow rate is between 60 liters / minute and 100 liters / minute.

[0122] S2128: Use ultrasonic dry cleaning to remove the remaining photoresist and other impurities on the first conductive layer 412, where the other impurities include etching solution, stripping solution, etc.

[0123] like Figure 11 As shown, the steps of coating the first alignment layer 413 on the first conductive layer 412 and performing rubbing alignment on the first alignment layer 413 are as follows.

[0124] S2131: coating an alignment layer liquid on the first conductive layer 412. The alignment layer liquid may be polyamic acid.

[0125] S2132: curing the alignment layer liquid, including pre-curing at 70°C to 150°C and main curing at 5°C to 230°C, wherein the pre-curing time is 18 seconds to 22 seconds and the main curing time is 20 seconds to 50 seconds, to obtain the first alignment layer 413.

[0126] S2133: rubbing the first alignment layer 413 with a texturing device to form textures on the surface of the first alignment layer 413.

[0127] The technical solution of the embodiment of the present application can make the first substrate 41 a plate with a conductive function. When the first substrate 41 is a plate with a conductive function, as the first substrate 41 rapidly produces a large degree of actual deformation under the action of actual pressure, the sensing element 4 can quickly generate a large-value actual voltage signal or actual current signal, and output the actual voltage signal or actual current signal to the outside through the first electrode terminal 4121, so as to quickly obtain the specific deformation amount of the actual deformation of the first substrate 41 based on the actual voltage signal or actual current signal, and then quickly obtain the acceleration of the inertial element 3 based on the deformation amount. Because the actual voltage signal or actual current signal is a specific quantized value, the corresponding acceleration value obtained based on the actual voltage signal or actual current signal has a higher accuracy, which further improves the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application.

[0128] According to other embodiments of the present application, processing the second substrate 43 includes: setting a second conductive layer 432 on the second base 431; making a second electrode pattern on the second conductive layer 432; coating a second orientation layer 433 on the second conductive layer 432, and rubbing and orienting the second orientation layer 433; wherein the second base 431 includes a second main body 4310 and a second convex portion 4311, the second electrode pattern includes a second main electrode 4320 and a third electrode terminal 4321, the second main electrode 4320 is set on the main body, and the third electrode terminal 4321 is set on the second convex portion 4311 and is connected to the second main electrode 4320.

[0129] The steps for processing the second substrate 43 are basically the same as those for processing the first substrate 41. The parts of processing the second substrate 43 that are the same as those of processing the first substrate 41 will not be repeated here. Only the parts that are different from those of processing the first substrate 41 will be described below.

[0130] The steps for processing the second substrate 43 differ from those for processing the first substrate 41 in the process of forming the second electrode pattern on the second conductive layer 432. Specifically, the steps for processing the second substrate 43 differ in two aspects: first, during the processing of the second substrate 43, the developer removes the unexposed portions of the photoresist, exposing a portion of the second conductive layer 432; second, after etching the exposed second conductive layer 432 with an etchant, the stripper removes the exposed portions of the photoresist. These steps allow the polarity of the second substrate 43 to be opposite to that of the first substrate 41.

[0131] In addition, the processing step of the second substrate 43 further includes: spraying spacers on the alignment layer to ensure a gap between the first substrate 41 and the second substrate 43 when connecting the first substrate 41 and the second substrate 43 .

[0132] The processed second substrate 43 is as follows Figure 12 As shown, the third electrode terminal 4321 can be processed into a strip structure according to the shape on the mask. The connection between the third electrode terminal 4321 and the second main electrode 4320 can mean that the third electrode terminal 4321 and the second main electrode 4320 are connected as a whole so that current can flow directly.

[0133] The above solution enables the second substrate 43 to also function as a conductive plate. When both the first substrate 41 and the second substrate 43 are conductive plates, connecting the second electrode terminal 4122 of the first substrate 41 to the third electrode terminal 4321 of the second substrate 43 allows the inductive element 4 to function as a capacitor. When the inductive element 4 functions as a capacitor, the preset signal generated by the inductive element 4 can be a preset capacitance signal, and the actual signal generated can be an actual capacitance signal. The process of deriving acceleration based on the preset capacitance signal and the actual capacitance signal is as follows.

[0134] Based on the capacitance formula C=εS / d, ε is the dielectric constant of air, which is a constant after the induction element 4 is formed, and S is the surface area of ​​the opposite surface of the first substrate 41 or the second substrate 43, which is also a constant after the induction element 4 is formed.

[0135] When the first substrate 41 in the sensing element 4 has a preset deformation amount H1, based on C0=εS / d0, when the preset capacitance signal C0 generated by the sensing element 4 can be measured, the preset distance d0 between the center of the first substrate 41 and the center of the second substrate 43 is calculated as d0=εS / C0.

[0136] When the first substrate 41 in the sensing element 4 has an actual deformation amount X1+Δd, based on C1=εS / d1, and when the actual capacitance signal C1 generated by the sensing element 4 can be measured, the actual distance d1 between the center of the first substrate 41 and the center of the second substrate 43 is calculated as d1=εS / C1.

[0137] Since the actual distance between the center of the first substrate 41 and the center of the second substrate 43 changes with the deformation of the first substrate 41, the deformation amount Δd of the first substrate 41 compared with the preset state can be obtained by calculating the difference between the actual distance d1 and the preset distance d0. The calculation formula is: Δd = d0 - d 1＝εS / C0-εS / C1=εS(C1-C0) / C1+C0. Based on the deformation Δd and the aforementioned acceleration calculation formula a=(K'-K)Δd / m, the relationship between the acceleration of the inertial element 3 and the capacitance of the inductive element 4 is calculated as: a=εS(K'-K)(C1-C0) / C1+C0m.

[0138] According to the above acceleration calculation formula, when K, K', m, ε and S are all constant values ​​and the preset capacitance signal C0 can be measured in advance, the acceleration a of the acceleration sensor as the component moves can be obtained by measuring the actual capacitance signal C1 of the sensing element 4 at any moment.

[0139] It should be noted that when the inductive element 4 is used as a capacitor, the size of the first protrusion 4111 on the first substrate 411 can be larger than the size of the second protrusion 4311 on the second substrate 431. In this way, after the first substrate 41 and the second substrate 43 are connected, at least part of the first electrode terminal 4121 and the second electrode terminal 4122 can be exposed from the second protrusion 4311, so that the first electrode terminal 4121 and the second electrode terminal 4122 can be connected to other circuits to output a preset capacitance signal and an actual capacitance signal.

[0140] In the technical solution of the embodiment of the present application, when the sensing element 4 is used as a capacitor, as the first substrate 41 rapidly produces a large degree of actual deformation under the action of actual pressure, the sensing element 4 can quickly output an actual capacitance signal with a large value based on the distance between the first substrate 41 and the second substrate 43, and output the actual capacitance signal to the outside of the acceleration sensor through the first electrode terminal 4121 and the second electrode terminal 4122, so as to facilitate obtaining the acceleration of the inertial element 3 based on the actual capacitance signal, thereby improving the sensitivity and accuracy of the acceleration sensor of the embodiment of the present application.

[0141] According to other embodiments of the present application, after connecting the edges of the first substrate 41 and the second substrate 42, the method further includes: placing a dielectric 42 in the accommodating cavity and sealing the accommodating cavity. The dielectric constant of the dielectric 42 is greater than or equal to 1 Farad / meter.

[0142] In the aforementioned process of connecting the first substrate 41 and the second substrate 43, a frame adhesive having an opening can be provided on the first orientation layer 413 of the first substrate 41, and the side of the second substrate 43 on which the second orientation layer 433 is provided is connected to the first substrate 41 through the frame adhesive. Thereafter, the medium 42 is placed into the accommodating cavity along the opening, and then an adhesive is filled in the opening to seal the accommodating cavity.

[0143] Based on the foregoing statements, and in combination with the formula of the capacitance C = εS / d, it can be seen that the actual capacitance value C generated by the inductor 4 is positively correlated with the dielectric constant value ε of the medium 42, so when the dielectric constant is greater than 1 F / m, and the distance d between the central part of the first substrate 41 and the central part of the second substrate 43 is the same, the inductor 4 can output a larger actual capacitance signal, and thus is more sensitive to changes in distance, which is conducive to improving the sensitivity of the acceleration sensor.

[0144] For example, it is assumed that the area of the first substrate 41 and the second substrate 43 is 4 × 10 -4 square meters, and the actual pressure reduces the distance between the first substrate 41 and the second substrate 43 from 4 × 10 -4 meters to 2 × 10 -4 meters; when the dielectric constant of the medium 42 is equal to 1 F / m, the actual capacitance signal C generated by the inductor 4 is 2 F; when the dielectric constant of the medium 42 is equal to 10 F / m, the actual capacitance signal C generated by the inductor 4 is 20 F. It can be seen that when the dielectric constant of the medium 42 is greater, even if the deformation amount of the inductor 4 is small, the inductor 4 can still generate a larger actual capacitance signal, thereby enabling the acceleration sensor in the embodiment of the present application to have a better detection effect in the case of a smaller change in acceleration.

[0145] According to some embodiments of the present application, the medium 42 includes at least one of liquid crystal, ester oil, or mineral oil.

[0146] The medium 42 can be one of liquid crystal, ester oil, or mineral oil, or a combination of any two of liquid crystal, ester oil, or mineral oil, or a mixture of liquid crystal, ester oil, or mineral oil.

[0147] In some possible embodiments, when the first substrate 41 and the second substrate 43 are both provided as polar plates, and the medium 42 is provided as liquid crystal, the inductor 4 can be a liquid crystal box. When the inductor 4 is provided as a liquid crystal box, the acceleration sensor is easier to process due to the mature processing technology of the liquid crystal box.

[0148] It should be noted that when the inductor 4 is provided as a liquid crystal box, the grooves formed by rubbing and orienting the first orientation layer 413 can be parallel to the grooves formed by rubbing and orienting the second orientation layer 433, so as to arrange the liquid crystal molecules in a certain direction and angle.

[0149] In the technical solution of the embodiment of the present application, because the dipole moment, polarity, and dielectric constant of liquid crystal, ester oil, and mineral oil are all large, when the medium 42 includes liquid crystal, ester oil, and mineral oil, the ability of the inductor 4 to store electric charge can be increased, and the sensitivity and accuracy of the acceleration sensor prepared in the embodiment of the present application can be improved.

[0150] According to other embodiments of the present application, see Figure 13 and Figure 14 As shown, Figure 13 This is a flowchart of the steps for processing the inertia member 3 in some embodiments of the present application. Figure 14 In some embodiments of this application, Figure 13 The structural diagram of the inertial part 3 processed by the steps of FIG. Figure 13 As shown, the processing of the inertia member 3 includes the following steps.

[0151] S31 : processing one end of the first columnar body to form a force applying portion 32 .

[0152] S32 : Processing the other end of the first columnar body to form a guide portion 31 .

[0153] The first columnar body is a columnar blank used to process the inertial part 3. The first columnar body can be made of materials such as iron, copper or stainless steel. In this way, the inertial part 3 formed by processing the first columnar body can have sufficient mass to generate a large inertial force when the acceleration sensor has acceleration, which is conducive to causing the first substrate 41 to quickly produce a large degree of actual deformation. The first columnar body can be a cylindrical structure, a prismatic structure, or other irregular columnar structures; optionally, the cross-sectional shape of the first columnar body in at least one direction is the same as or similar to the cross-sectional shape of the shell 1 perpendicular to the axial direction, so that the first columnar body can be installed in the shell 1 with less material removed, and the processing of the inertial part 3 is more time-saving and labor-saving. When processing the first columnar body to obtain the inertial part 3, the specific processing technology may include turning, milling or grinding.

[0154] In some embodiments, the processed inertial member 3 is as follows: Figure 14 As shown, the area of ​​the end surface of the force-applying portion 32 away from the guide portion 31 is smaller than the area of ​​the end surface of the first substrate 41 .

[0155] For example, in some feasible embodiments, when the housing 1 is a hollow cylinder, the first cylindrical body is a cylindrical body, and both the guide portion 31 and the force-applying portion 32 can be machined into cylindrical structures arranged along the axis of the first cylindrical body. The diameter of the guide portion 31 can be adapted to or smaller than the dimensions of the inner cavity of the housing 1, and the diameter of the force-applying portion 32 can range from one-third to one-half the diameter of the guide portion 52. Adapting the diameter of the guide portion 31 to the dimensions of the inner cavity of the housing 1 means that the circumference of the guide portion 31 contacts the wall of the inner cavity, thereby guiding the inertial member 3 as it moves toward the first substrate 41 and allowing the force-applying portion 32 to abut the center portion of the first substrate 41. When the diameter of the force-applying portion 32 ranges from one-third to one-half the diameter of the guide portion 52, the pressure applied by the force-applying portion 32 to the first substrate 41 can be increased while ensuring that the first substrate 41 is not damaged by excessive impact pressure from the inertial member 3.

[0156] In the technical solution of the embodiment of the present application, by machining the end surface area of ​​the force-applying portion 32 away from the guide portion 31 to be smaller than the end surface area of ​​the first substrate 41, the inertial member 3 can be brought into contact with the center of the first substrate 41 through the force-applying portion 32, thereby increasing the pressure applied by the inertial member 3 to the first substrate 41, allowing the first substrate 41 to receive a greater actual pressure, quickly generating a more significant actual deformation, and thus enabling the sensing member 4 to quickly generate a more significant actual signal, thereby improving the sensitivity and accuracy of the acceleration sensor of the embodiment of the present application. In addition, when the inertial member 3 moves toward the first substrate 41, the guide portion 31 can contact the housing 1 to guide the inertial member 3, reducing the possibility of the inertial member 3 vibrating within the housing 1 and shifting in position or direction relative to the first substrate 41.

[0157] According to other embodiments of the present application, see Figure 15 and Figure 16 , Figure 15 This is a flowchart of the steps for processing the housing 1 in some embodiments of the present application. Figure 16 In some embodiments of this application, Figure 15 Schematic diagram of the shell 1 processed by the steps. Figure 15 and Figure 16 As shown, processing the housing 1 includes the following steps.

[0158] S11: The second columnar body is processed to remove material to form an annular side wall 11. The space within the annular shape of the side wall 11 is configured as an inner cavity.

[0159] The second column is a cylindrical blank used to machine the side wall 11 of the housing 1. When machining the second column, rough machining can be performed along the axis of the second column to remove part of the material in the middle of the second column, so that the second column forms an annular side wall 11 with an inner cavity.

[0160] The inner cavity is the chamber that accommodates the sensing element 4, the inertial element 3, and the elastic element 2. To ensure smooth installation of the sensing element 4, the inertial element 3, and the elastic element 2 within the cavity and to reduce the resistance to the movement of the inertial element 3 within the cavity, the inner cavity of the housing 1 can be subjected to finishing processes such as grinding and polishing after rough machining. Grinding and polishing the inner cavity can reduce the roughness of the inner cavity surface and make the inner cavity wall smooth. When the inner cavity wall has a smooth structure, when the acceleration sensor experiences acceleration due to component movement, the frictional resistance between the inertial element 3 and the cavity wall when moving toward the sensing element 4 is reduced, thereby increasing the actual pressure exerted by the inertial element 3 on the sensing element 4.

[0161] The term "ring" generally refers to a closed ring structure, which can be a circular ring structure, a square ring structure, or a polygonal ring structure. This application does not specifically limit the ring structure of the side wall 11. When the ring is a circular ring, the second columnar body can be quickly machined by turning to quickly form a circular ring structure.

[0162] S12: Processing the first cover member 12.

[0163] S13: Processing the second cover part 13.

[0164] The first and second covering members 12, 13 are used to seal the inner cavity. During fabrication, multiple fixing holes can be machined into the areas where they assemble with the sidewall 11. Fixing members, such as screws, can also be fabricated to accommodate these holes. Correspondingly, multiple mounting holes can be machined into both end faces of the sidewall 11 to accommodate the fixing members.

[0165] See Figure 17 , Figure 17 This is a flowchart of the steps of assembling the housing 1, the inductive element 4, the inertial element 3 and the elastic element 2 in some embodiments of the present application. Figure 17 As shown, the steps of assembling the housing 1 , the inductive element 4 , the inertial element 3 and the elastic element 2 are as follows.

[0166] S41 : Assemble the first covering member 12 on one end of the side wall 11 .

[0167] When the first covering member 12 is covered on one end of the side wall 11 , one end of the fixing member can be passed through the fixing hole on the first covering member 12 and fixed in the mounting hole at one end of the side wall 11 to fix the first covering member 12 to the side wall 11 .

[0168] S42 : Assemble the sensing component 4 in the inner cavity so that the second substrate 43 abuts against the first covering component 12 .

[0169] When the sensing part 4 is assembled in the inner cavity and the second substrate 43 is abutted against the first covering part 12, the position of the sensing part 4 in the inner cavity can be limited by the first covering part 12. In this way, when the inertial part 3 abuts against the sensing part 4, the sensing part 4 will not move toward the first covering part 12 under the abutting action of the inertial part 3. The inertial part 3 can also abut against the first substrate 41 with a smaller thickness, which is beneficial to improving the sensitivity of the first substrate 41 to deformation and the sensitivity of the sensing part 4 to generating actual signals.

[0170] S43 : assembling the inertial element 3 in the inner cavity so that the force-applying portion 32 contacts the middle portion of the first substrate 41 .

[0171] When the force applying portion 32 is brought into contact with the middle portion of the first substrate 41 , the force applying portion 32 can apply a greater pressure to the first substrate 41 , so that the first substrate 41 fully receives the actual pressure.

[0172] S44 : Assemble the elastic member 2 in the inner cavity so that one end of the elastic member 2 abuts against the guide portion 31 .

[0173] Before assembling the elastic member 2, a first positioning groove can be machined on the side of the guide portion 31 facing away from the force-applying portion 32. When assembling the elastic member 2, one end of the elastic member 2 can be fixed to the first positioning groove. This prevents the end of the elastic member 2 from sliding on the guide portion 31, allowing the elastic member 2 to abut the inertial member 3. When the acceleration sensor experiences acceleration due to component movement, the inertial member 3 can abut the middle portion of the first substrate 41, minimizing the likelihood of the inertial member 3 abutting other components (e.g., the housing 1). This allows the inertial force of the inertial member 3 and the elastic force of the elastic member 2 to be almost entirely used to deform the first substrate 41, thereby improving the sensitivity of the acceleration sensor.

[0174] S45 : Assemble the second covering member 13 to the other end of the side wall 11 so that the other end of the elastic member 2 abuts against the second covering member 13 .

[0175] Before assembling the second cover member 13, a second positioning groove can be formed on the side of the second cover member 13 facing the guide portion 31. When assembling the second cover member 13, the second positioning groove on the second cover member 13 can be used to secure the other end of the elastic member 2 and compress the elastic member 2. This prevents the elastic member 2 from freely moving between the second cover member 13 and the inertial member 3 and deflecting in direction, thereby preventing it from constantly contacting the second cover member 13 and the inertial member 3 during use. Furthermore, the elastic force of the elastic member 2 is ensured to always be directed directly toward the inertial member 3, thereby improving the sensitivity of the acceleration sensor and ensuring that the acceleration sensor maintains reliable accuracy during use.

[0176] The assembly scheme of the embodiment of the present application can limit the position of the sensing member 4 in the inner cavity by the first covering member 12, and limit the position of the force-applying portion 32 against the first substrate 41, the direction in which the inertia member 3 abuts the sensing member 4, and the direction in which the elastic member 2 abuts the inertia member 3 by the side wall 11, so that the inertia member 3 abuts the middle part of the first substrate 41 along the thickness direction of the first substrate 41 through the force-applying portion 32, and at the same time limit the elastic force direction of the elastic member 2 after being installed in the cavity to also be along the thickness direction of the first substrate 41. In this way, when the component generates an applied force parallel to the thickness direction of the first substrate 41, When the speed is low, the direction of the resultant force generated by the inertial force of the inertial member 3 and the elastic force of the elastic member 2 is parallel to the thickness direction of the first substrate 41. When the resultant force acts on the first substrate 41 as an actual pressure, the first substrate 41 can quickly produce a large degree of actual deformation under the action of the actual pressure, thereby enabling the sensing member 4 to quickly generate a more obvious actual signal, making it convenient to quickly obtain the specific deformation amount of the actual deformation of the first substrate 41 according to the actual signal, and then quickly obtain the acceleration of the inertial member 3 according to the deformation amount, so that the sensitivity and accuracy of the acceleration sensor of the embodiment of the present application are improved.

[0177] According to other embodiments of the present application, processing the shell 1 also includes: processing a plurality of guide grooves 110 extending along the busbar direction of the side wall 11 on the inner surface of the side wall 11; assembling the inertial member 3 in the inner cavity includes: making at least a portion of the guide portion 31 located in the guide groove 110.

[0178] The guide groove 110 is a structure for guiding the inertial member 3. The guide groove 110 can be processed into a V shape or a U shape. The groove surface of the guide groove 110 can be polished to a smooth structure to reduce the friction resistance of the guide groove 110 to the guide portion 31.

[0179] In the embodiment of the present application, a guide groove 110 is machined on the cavity wall, and at least a portion of the guide portion 31 is located in the guide groove 110, so that at least a portion of the guide portion 31 can move toward the first substrate 41 within the guide groove 110. During the movement of the guide portion 31, at least a portion of the guide portion 31 is restricted by the groove wall of the guide groove 110, so as to reduce the possibility of rotation or directional deviation of the inertial member 3 when moving toward the first substrate 41, improve the accuracy of the force-applying portion 32 abutting against the middle part of the first substrate 41, and thereby improve the sensitivity and accuracy of the actual deformation of the first substrate 41 under the abutment of the force-applying portion 32.

[0180] In some embodiments of the present application, the shape and size of the guide portion 31 can also be processed to be incompatible with the size or shape of the inner cavity in the shell 1, thereby reducing the contact area between the inertial member 3 and the inner wall of the shell 1 and reducing the resistance of the inertial member 3 when moving under acceleration.

[0181] For example, in some embodiments of the present application, the guide portion 31 is a cylindrical structure; before assembling the inertial member 3 in the inner cavity, the method further includes: processing a plurality of groups of protrusions 311 linearly arranged along the busbar direction of the guide portion 52 on the circumference of the guide portion 31; assembling the inertial member 3 in the inner cavity includes: assembling at least part of the protrusions 311 corresponding to the plurality of guide grooves 110.

[0182] The protrusion 311 is a component that is assembled in the guide groove 110 and moves in the guide groove 110. The protrusion 311 can be processed into a plurality of long strips extending along the generatrix direction of the guide portion 52, or can be processed into a plurality of convex points linearly arranged along the generatrix direction of the guide portion 52.

[0183] In a feasible embodiment, three long strip-shaped protrusions 311 can be processed on the guide portion 31, facing the three guide grooves 110 in different directions, and three guide grooves 110 facing the axis of the side wall 11 can be processed on the inner wall of the side wall 11, and at least part of the protrusion 311 can be assembled in the guide groove 110.

[0184] The protrusion 311 and the guide portion 31 may be integrally formed or welded, which is not limited in this embodiment of the present application.

[0185] In the embodiment of the present application, a plurality of protrusions 311 are machined on the circumference of the guide portion 31, and at least a portion of the protrusions 311 are assembled into the guide groove 110. Thus, even if the shape and size of the guide portion 31 are machined to be mismatched with the size or shape of the inner cavity of the housing 1, the inertial member 3 is supported in the middle of the inner cavity by the contact between the protrusions 311 and the guide groove 110. The protrusions 311 can move within the guide groove 110, and during the movement of the protrusions 311, the groove walls of the guide groove 110 restrict the protrusions 311, thereby limiting the movement of the inertial member 3 and reducing the possibility of rotation or directional deviation of the inertial member 3 when moving toward the first substrate 41.

[0186] According to other embodiments of the present application, the guide portion 31 is a prismatic structure; assembling the inertial member 3 in the inner cavity includes: assembling at least a portion of the side edges of the prismatic structure in the guide groove 110 .

[0187] The guide portion 31 can be processed into a triangular prism structure, a rectangular parallelepiped structure, a hexagonal prism structure, etc. The embodiment of the present application does not specifically limit the specific structure of the guide portion 31.

[0188] After the guide portion 31 is processed into a prismatic structure, the side edges of the prismatic structure can also be processed to reduce the sharpness of the side edges. When at least part of the side edges are assembled in the guide groove 110, the side edges will not scratch the inner wall of the guide groove 110, thereby reducing the friction resistance between the guide groove 110 and the inertial member 3 when the inertial member 3 moves toward the sensing member 4.

[0189] In this embodiment, the inertial element 3 is fabricated into a prismatic structure, and at least a portion of the lateral edges of the prismatic structure are assembled into guide grooves 110. If the shape and size of the guide portion 31 are not compatible with the size or shape of the inner cavity of the housing 1, the contact between the lateral edges and the guide grooves 110 supports the inertial element 3 in the center of the inner cavity. The lateral edges are able to move within the guide grooves 110. During this movement, the lateral edges are restrained by the walls of the guide grooves 110, thereby reducing the possibility of rotation or directional deviation of the inertial element 3 as it moves toward the first substrate 41. This improves the precision of the force-applying portion 32's contact with the center portion of the first substrate 41, as well as the sensitivity and accuracy of the actual deformation of the first substrate 41 caused by the force-applying portion 32. Furthermore, fabricating the guide portion 31 into a prismatic structure results in a regular shape for easier manufacturing. Guidance is provided by the interaction between the lateral edges of the prismatic structure and the guide grooves 110, eliminating the need for additional guide structure processing steps, improving the manufacturing efficiency of the inertial element 3 and reducing manufacturing costs.

[0190] According to other embodiments of the present application, before assembling the housing 1, the inductive element 4, the inertial element 3, and the elastic element 2, the following steps are further included: processing the third column into a ring-shaped structure to obtain a positioning element 5; fixing the positioning element 5 to the middle portion of the first substrate 41 facing away from the second substrate 43; when assembling the inertial element 3 in the inner cavity, the contact position of the force-applying portion 32 on the first substrate 41 is within the range of the positioning element 5. The position and structure of the positioning element 5 are shown in FIG. Figure 18 shown.

[0191] The third column is a cylindrical blank used to manufacture the positioning member 5. The third column can be made of materials such as glass, quartz, and organic polymers. Since the side of the first substrate 41 facing away from the second substrate 42 can also be made of glass, the positioning member 5, which is made of the same material as the side of the first substrate 41 facing away from the second substrate 42, can be easily fixed to the center portion of the first substrate 41.

[0192] The positioning member 5 guides the inertial member 3 so that the inertial member 3 can abut against the middle portion of the first substrate 41. When the positioning member 5 is fixed to the middle portion of the side of the first substrate 41 facing away from the second substrate 43, for example, the positioning member 5 can be bonded to the middle portion of the first substrate 41 using an adhesive.

[0193] The technical solution of the embodiment of the present application processes the positioning member 5 and assembles the positioning member 5 in the middle portion of the side of the first substrate 41 facing away from the second substrate 43, so that the positioning member 5 can restrict the force-applying portion 32 when the inertial member 3 moves toward the first substrate 41, reducing the possibility of the force-applying portion 32 moving in other directions, improving the accuracy of the force-applying portion 32 abutting the middle portion of the first substrate 41, and thereby improving the sensitivity of the first substrate 41 to quickly generate a large degree of actual deformation under the abutment of the force-applying portion 32. At the same time, since the annular structure is a relatively conventional structure, processing the positioning member 5 into an annular structure can also reduce the processing difficulty of the acceleration sensor and improve the processing efficiency of the acceleration sensor.

[0194] See Figure 18 An acceleration sensor manufactured using the method in one embodiment of the present application includes a shell 1 and an elastic member 2, an inertial member 3, and a sensing member 4 assembled in sequence in the shell 1 along the axial direction of the shell 1. The inertial member 3 may include a guide portion 31 and a force-applying portion 32. The sensing member 4 may include a first substrate 41 having a first conductive layer 412 and a second substrate 43 having a second conductive layer 432. The thickness of the first substrate 41 is less than that of the second substrate 43. The edges of the first substrate 41 and the second substrate 43 are connected to form a receiving cavity between the first substrate 41 and the second substrate 43. Liquid crystal is loaded into the receiving cavity to make the sensing member 4 a liquid crystal box. When assembling the elastic member 2, the inertial member 3, and the sensing member 4, the force-applying portion 32 of the inertial member 3 is made to abut against the middle portion of the first substrate 41.

[0195] When the acceleration sensor of the embodiment of the present application has acceleration as the component moves, the first substrate 41 can quickly produce a large actual deformation under the action of the elastic force of the elastic member 2 and the inertial force of the inertial member 3. This is because, when there is a accommodating cavity between the first substrate 41 and the second substrate 43, the middle part of the first substrate 41 is not supported by the second substrate 43 relative to the edge part. Therefore, when the inertial member 3 abuts the middle part of the first substrate 41, the middle part of the first substrate 41 is more likely to produce faster and larger deformation under the actual pressure of the inertial member 3 due to the lack of support. degree of deformation; further, when the thickness of the first substrate 41 is small, its stiffness coefficient is smaller, making the first substrate 41 more sensitive to actual pressure and more likely to produce faster and greater actual deformation under the actual pressure of the inertial member 3; further, when the inertial member 3 abuts the middle part of the first substrate 41, the possibility of the inertial member 3 abutting other components outside the first substrate 41 (such as the shell 1) is smaller, so that the first substrate 41 can almost completely accept the elastic force and inertial force, and quickly produce a large actual deformation under the action of the elastic force and inertial force. On the basis that the first substrate 41 can quickly produce a large degree of actual deformation, the sensing member 4 can quickly generate a large value of actual capacitance signal based on the distance between the first substrate 41 and the second substrate 43 after the actual deformation of the first substrate 41, so as to facilitate the acquisition of the acceleration of the inertial member 3 based on the actual capacitance signal, thereby improving the sensitivity and accuracy of the acceleration sensor in the embodiment of the present application.

[0196] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for preparing an acceleration sensor, characterized in that: The method comprises: Processing the housing, processing the sensing component and processing the inertia component, and assembling the housing, the sensing component, the inertia component and the elastic component; wherein processing the sensing component includes: processing a first substrate; processing a second substrate; The first substrate and the second substrate are arranged opposite to each other along a first direction, and edges of the first substrate and the second substrate are connected so that the edge portion of the first substrate is supported by the second substrate, and a receiving cavity is formed between the first substrate and the second substrate so that the middle portion of the first substrate is unsupported, the inertial member is located in the inner cavity, and the force-applying portion of the inertial member abuts the middle portion of the first substrate; wherein the first direction is parallel to the thickness direction of the first substrate; and a surface of the first substrate facing away from the second substrate is processed to reduce the thickness of the first substrate; The processing of the inertial member includes: processing one end of the first columnar body to form a force-applying portion, and processing the other end of the first columnar body to form a guide portion; wherein the end surface area of ​​the force-applying portion away from the guide portion is smaller than the end surface area of ​​the first substrate; One end of the first columnar body is processed to form a force-applying portion, wherein an end surface area of ​​the force-applying portion away from the guide portion is smaller than an end surface area of ​​the first substrate; the second columnar body is processed to remove material to form an annular side wall, and the space within the annular shape of the side wall is configured as an inner cavity; Processing the first covering part and processing the second covering part; assembling the shell, the sensing part, the inertia part and the elastic part includes: assembling the first covering part to one end of the side wall; assembling the sensing part to the inner cavity so that the second substrate abuts the first covering part; assembling the inertia part to the inner cavity so that the force-applying part abuts the middle part of the first substrate; assembling the elastic part to the inner cavity so that one end of the elastic part abuts the guide part, and the diameter of the force-applying part ranges from one third to one half of the diameter of the guide part; processing a plurality of guide grooves extending along the busbar direction of the side wall on the inner surface of the side wall, with at least part of the guide part located in the guide groove; assembling the second covering part to the other end of the side wall so that the other end of the elastic part abuts the second covering part.

2. The method according to claim 1, characterized in that Processing a side of the first substrate facing away from the second substrate includes: disposing an etchant on a side of the first substrate facing away from the second substrate; After the etchant reacts with the first substrate, removing the remaining etchant and the corroded and peeled portion of the first substrate; A surface of the first substrate facing away from the second substrate is ground until a thickness of the first substrate is less than or equal to a thickness threshold.

3. The method according to claim 2, characterized in that The thickness threshold is 3 mm.

4. The method according to claim 1, wherein Processing the first substrate includes: providing a first conductive layer on the first substrate; forming a first electrode pattern on the first conductive layer; coating a first alignment layer on the first conductive layer, and performing rubbing alignment on the first alignment layer; The first substrate includes a first main body and a first convex portion, and the first electrode pattern includes a first electrode terminal, a second electrode terminal and a first main electrode, wherein the first main electrode is arranged on the first main body, the first electrode terminal and the second electrode terminal are arranged on the first convex portion, the first electrode terminal is connected to the first main electrode, and the second electrode terminal is disconnected from the first main electrode.

5. The method according to claim 4, characterized in that Processing the second substrate includes: providing a second conductive layer on the second substrate; forming a second electrode pattern on the second conductive layer; coating a second alignment layer on the second conductive layer, and performing rubbing alignment on the second alignment layer; The second substrate includes a second main body and a second convex portion, the second electrode pattern includes a second main electrode and a third electrode terminal, the second main electrode is arranged on the second main body, and the third electrode terminal is arranged on the second convex portion and connected to the second main electrode.

6. The method according to claim 5, characterized in that After connecting the edges of the first substrate and the second substrate, the method further includes: Filling the medium into the accommodating cavity and sealing the accommodating cavity; Wherein, the dielectric constant of the medium is greater than or equal to 1 Farad / meter.

7. The method according to claim 6, characterized in that The medium includes at least one of liquid crystal, ester oil or mineral oil.

8. The method according to claim 1, characterized in that Processing the shell further includes: A plurality of guide grooves extending along the generatrix direction of the side wall are machined on the inner surface of the side wall; Assembling the inertial member in the inner cavity includes: At least a portion of the guide portion is located in the guide groove.

9. The method according to claim 8, characterized in that The guide portion is a cylindrical structure; Before assembling the inertial member in the inner cavity, the method further comprises: Processing a plurality of groups of protrusions linearly arranged along the generatrix direction of the guide portion on the peripheral surface of the guide portion; Assembling the inertial member in the inner cavity includes: At least a portion of the protrusion is assembled in the guide groove.

10. The method according to claim 8, characterized in that The guide portion is a prismatic structure; Assembling the inertial member in the inner cavity includes: At least a portion of the side edges of the prism structure are assembled in the guide groove.

11. The method according to claim 1, wherein Before assembling the housing, the sensing element, the inertia element, and the elastic element, the method further includes: Processing the third column into a ring-shaped structure to obtain a positioning piece; The positioning member is fixed to the middle portion of the first substrate on a side facing away from the second substrate; when the inertial member is assembled in the inner cavity, the contact position of the force-applying portion on the first substrate is located within the enclosed range of the positioning member.

Images