Adsorption device and adsorption method

Abstract

The present application discloses an adsorption device and an adsorption method. The adsorption device includes: an adsorption platform for adsorbing a flexible film; a lifting assembly that moves relative to the adsorption platform to drive the flexible film to move towards the adsorption platform; and a pressure providing assembly that is arranged relative to the adsorption platform and applies a pressure towards the adsorption platform to the flexible film, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform. By the above method, the present application can reduce the probability of the flexible film wrinkling.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing, and particularly relates to an adsorption device and an adsorption method. Background Art

[0002] A wafer often contains a large number of chips. Currently, generally one side of the wafer needs to be fixedly arranged on a flexible film, and then the wafer is divided into individual chips by means such as laser cutting, and then the individual chips are applied to the subsequent packaging process.

[0003] In order to ensure the yield of the packaged product, after the wafer is divided into individual chips, the surface of the individual chips needs to be detected. Since the flexible film carrying the wafer has a certain flexibility, the individual chips after cutting will conform to the shape of the flexible film below them. During the detection process, if the flexible film wrinkles, it may cause deviation in the detection results of the individual chips above it. Summary of the Invention

[0004] This application provides an adsorption device and an adsorption method, so that the flexible film can be adsorbed flatly by the adsorption platform to reduce the probability of the flexible film wrinkling.

[0005] To solve the above technical problems, a technical solution adopted by this application is: to provide an adsorption device, including: an adsorption platform for adsorbing the flexible film; a lifting component that moves relative to the adsorption platform to drive the flexible film to move towards the adsorption platform; a pressure providing component that is arranged relative to the adsorption platform and applies a pressure towards the adsorption platform to the flexible film, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform.

[0006] To solve the above technical problems, another technical solution adopted by this application is: to provide an adsorption method, including: providing the adsorption device described in any of the above embodiments, fixing the flexible film on the lifting component; controlling the lifting component to move towards the adsorption platform, and controlling the pressure providing component to apply a pressure towards the adsorption platform to the flexible film, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform.

[0007] Distinct from the prior art, the beneficial effects of the present application are as follows: The adsorption device provided by the present application includes an adsorption platform, a lifting assembly, and a pressure providing assembly. Among them, the lifting assembly can drive the flexible film to move towards the adsorption platform, and the pressure providing assembly is arranged relative to the adsorption platform and can apply a pressure towards the adsorption platform to the flexible film, so that the flexible film is in a tensioned state when moving towards the adsorption platform and being adsorbed by the adsorption platform, thereby enabling the flexible film to be adsorbed flatly by the adsorption platform and reducing the probability of the flexible film wrinkling; and when a semiconductor device is arranged on the flexible film, this adsorption method can reduce the probability of deviation in the detection result of the semiconductor device located above it, thereby improving the hourly output (WHP) of the machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings, where:

[0009] Figure 1 is a schematic structural diagram of an embodiment of the adsorption device of the present application;

[0010] Figure 2 is Figure 1 a top view schematic diagram of an embodiment of the adsorption platform and the lifting assembly in

[0011] Figure 3 is a schematic structural diagram of another embodiment of the adsorption device of the present application;

[0012] Figure 4 is a schematic flowchart of an embodiment of the adsorption method of the present application;

[0013] Figure 5 is Figure 4 a schematic structural diagram of an embodiment before step S101 in DETAILED DESCRIPTION OF THE EMBODIMENTS

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0015] Please refer to Figure 1 , Figure 1The figure is a schematic structural diagram of an embodiment of the adsorption device of the present application. The adsorption device includes an adsorption platform 10, a lifting assembly 12, and a pressure providing assembly 14.

[0016] Specifically, the adsorption platform 10 is used to adsorb the flexible film 20, and the flexible film 20 is used to carry semiconductor devices (such as chips, etc.). Please refer to Figure 2 , Figure 2 which is Figure 1 a top view schematic diagram of an embodiment of the adsorption platform and the lifting assembly in

[0017] The lifting assembly 12 can move relative to the adsorption platform 10 in the vertical direction, and is used to fix the flexible film 20 and drive the flexible film 20 to move towards the adsorption platform 10; that is, before the flexible film 20 is adsorbed by the adsorption platform 10, there is a gap between the flexible film 20 and the adsorption platform 10.

[0018] The pressure providing assembly 14 is arranged relative to the adsorption platform 10 and applies a pressure towards the adsorption platform 10 to the flexible film 20, so that the flexible film 20 is in a tensioned state during the moving adsorption process, and the surface of the flexible film 20 that is close to and about to be adsorbed by the adsorption platform 10 has no wrinkles, so that the flexible film 20 can be adsorbed by the adsorption platform 10 flatly; and when semiconductor devices are arranged on the flexible film 20, this adsorption method can reduce the probability of deviation in the detection results of the semiconductor devices located above it, and thus improve the machine hourly production (WHP).

[0019] Optionally, in this embodiment, as shown in Figure 1As shown, during the moving adsorption process, the flexible film 20 includes a first region 200 adsorbed by the adsorption platform 10 and a second region 202 not adsorbed by the adsorption platform 10; the tension force on the flexible film 20 adjacent to the second region 202 in the first region 200 is greater than the tension force on the flexible film 20 in the second region 200; wherein, the tension force includes the pressure provided by the above-mentioned pressure providing component 14. This design method can make the tension force on the flexible film 20 at the position close to the adsorption platform 10 and about to be adsorbed by the adsorption platform 10 greater than the tension force at the remaining positions not adsorbed by the adsorption platform 10. The part of the flexible film 20 close to the adsorption platform 10 and about to be adsorbed by the adsorption platform 10 is in a tension state, and there are no wrinkles on the surface of this part of the flexible film 20, so that this part of the flexible film 20 can be adsorbed by the adsorption platform 10 flatly. In one embodiment, please refer to Figure 1 and Figure 2 , the adsorption platform 10 includes at least one adsorption region 100, and the center of the adsorption region 100 coincides with the center of the adsorption platform 10. The adsorption device provided by the present application further includes a vacuum generating component 16, connected to the adsorption region 100, for providing a vacuum adsorption force to the adsorption region 100; at this time, the tension force on the flexible film 20 during the adsorption process is the sum of the vacuum adsorption force provided by the vacuum generating component 16 to the adsorption region 100 and the pressure provided by the pressure providing component 14. This design method can increase the tension force on the flexible film 20 during the moving adsorption process more flexibly, which is more conducive to keeping it in a tension state to improve the flat adsorption effect.

[0020] Optionally, the adsorption region 100 has through holes so that the vacuum adsorption force can act on the flexible film 20. At this time, the material of the adsorption platform 10 can be a porous ceramic or the like.

[0021] Another optionally, please continue to refer to Figure 1 and Figure 2 , the adsorption platform 10 includes a plurality of adsorption regions 100 arranged along the radial direction (i.e., Figure 1 the direction marked as X in the figure), and the center of each adsorption region 100 coincides with the center of the adsorption platform 10. For example, the adsorption platform 10 includes a circular adsorption region 100 located in the center and at least one annular adsorption region 100 located in the periphery; and for any two adjacent adsorption regions 100, the outer edge of the adsorption region 100 relatively close to the center of the adsorption platform 10 coincides with the inner edge of the adsorption region 100 relatively far from the center of the adsorption platform 10. Figure 1 and Figure 2Only four adsorption regions 100 are schematically shown, and are respectively labeled as a, b, c, and d; among them, the adsorption region labeled as a and located at the center of the adsorption platform 10 is circular, and the adsorption regions labeled as b, c, and d and located at the periphery of the adsorption platform 10 are circular rings. The outer edge of the adsorption region labeled as a coincides with the inner edge of the adsorption region labeled as b, the outer edge of the adsorption region labeled as b coincides with the inner edge of the adsorption region labeled as c, and the outer edge of the adsorption region labeled as c coincides with the inner edge of the adsorption region labeled as d. Of course, in other embodiments, the number of adsorption regions 100 divided by the adsorption platform 10 may also be other numbers, and the present application does not limit this.

[0022] Optionally, as Figure 1 shown, in the radial direction away from the center of the adsorption platform 10, the widths of the adsorption regions 100 are the same; or, in the radial direction away from the center of the adsorption platform 10, the widths of the adsorption regions 100 gradually decrease. Among them, when the adsorption region 100 is circular (such as the adsorption region labeled as a in Figure 1 ), the width of the adsorption region 100 is the diameter of the circle; when the adsorption region 100 is a circular ring (such as the adsorption regions labeled as b, c, and d in Figure 1 ), the width of the adsorption region 100 is the width of the circular ring (that is, the difference between the outer diameter and the inner diameter of the circular ring). The above design method can enable the flexible film 20 to be adsorbed in sub-regions and in stages during the adsorption process, so as to more effectively reduce the probability of the flexible film 20 wrinkling.

[0023] Furthermore, each adsorption region 100 may be provided with a through hole (not shown in the figure). The adsorption device further includes a plurality of vacuum generating components 16. One vacuum generating component 16 corresponds to one adsorption region 100 (that is, one vacuum generating component 16 is communicated with the through hole of one adsorption region 100) and is used to provide a vacuum adsorption force to the corresponding adsorption region 100. For example, Figure 1 and Figure 2 schematically show four adsorption regions 100, and the number of corresponding vacuum generating components 16 is also four, which are respectively labeled as a1, b1, c1, and d1. Optionally, each vacuum generating component 16 includes a vacuum pump 160, a vacuum tube 162, and a vacuum suction nozzle 164; among them, the vacuum tube 162 is connected between the vacuum pump 160 and the vacuum suction nozzle 164, and the vacuum suction nozzle 164 is attached to the side of the corresponding adsorption region 100 facing away from the flexible film 20. Of course, in other embodiments, a plurality of vacuum generating components 16 may also share one vacuum pump. At this time, corresponding control switches may be provided on each vacuum tube 162. By controlling the on / off of the corresponding control switches, it is possible to control whether the corresponding vacuum generating component 16 generates a vacuum adsorption force. In some embodiments, the control switch may be a solenoid valve switch.

[0024] Among them, the magnitude of the vacuum adsorption force exerted by each adsorption region 100 remains unchanged during the moving adsorption process, and the vacuum adsorption force of the adsorption region 100 that first contacts the flexible film 20 is greater than that of the adsorption region 100 that later contacts the flexible film 20. Generally speaking, the edge of the flexible film 20 is fixed to the lifting assembly 12, and under the action of gravity, the middle region of the flexible film 20 will contact the adsorption platform 10 earlier than the peripheral region. And setting a relatively large vacuum adsorption force for the adsorption region 100 where the flexible film 20 first contacts the adsorption platform 10 can keep the flexible film 20 in a tension state during the adsorption process to reduce the probability of the flexible film 20 wrinkling; and in the case where part of the flexible film 20 has been adsorbed by the adsorption region 100, if the vacuum adsorption force of the adsorption region 100 that later adsorbs the flexible film 20 is small, it will not affect the adsorption effect much, and this method can reduce energy consumption.

[0025] For example, as Figure 1 shown, the adsorption platform 10 includes four adsorption regions respectively marked as a, b, c, and d, and the vacuum generating component corresponding to the adsorption region marked as a is the vacuum generating component marked as a1, the vacuum generating component corresponding to the adsorption region marked as b is the vacuum generating component marked as b1, the vacuum generating component corresponding to the adsorption region marked as c is the vacuum generating component marked as c1, and the vacuum generating component corresponding to the adsorption region marked as d is the vacuum generating component marked as d1. The flexible film 20 contacts the four adsorption regions 100 marked as a, b, c, and d in sequence, and then the four vacuum generating components marked as a1, b1, c1, and d1 can be turned on simultaneously, but the vacuum adsorption forces they generate decrease in sequence.

[0026] Alternatively, during the moving adsorption process, the vacuum generating component 16 corresponding to the adsorption region 100 that first contacts the flexible film 20 is turned on earlier than the vacuum generating component 16 corresponding to the adsorption region 100 that later contacts the flexible film 20. This design method can make the adsorption region 100 that contacts and adsorbs the flexible film 20 fit closely with the flexible film 20, and the gas between the two can be discharged through the remaining adsorption regions 100 that do not contact the flexible film 20 to reduce the probability of the flexible film 20 wrinkling.

[0027] Optionally, during the moving adsorption process, in the radial direction away from the center of the adsorption platform 10, the vacuum generating components 16 corresponding to multiple adsorption regions 100 are turned on in sequence. For example, as Figure 1As shown, in the radial direction away from the center of the adsorption platform 10, the flexible film 20 sequentially contacts four adsorption regions 100 labeled a, b, c, and d. Then, the vacuum generating components labeled a1, b1, c1, and d1 can be sequentially activated, and the magnitudes of the vacuum adsorption forces generated by all the activated vacuum generating sub-components 16 can be the same. This design method can enable the central region of the flexible film 20 to contact the adsorption platform 10 preferentially, and the gas between the flexible film 20 and the adsorption platform 10 can be more easily discharged from both sides during the contact process, so that the flexible film 20 can be adsorbed more flatly.

[0028] Alternatively, the vacuum adsorption force applied by each adsorption region 100 during the moving adsorption process can be variable. Specifically, for the same adsorption region 100, during the moving adsorption process, before the current adsorption region 100 contacts the flexible film 20, the vacuum adsorption force of the current adsorption region 100 increases; and after the adsorption region 100 contacts the flexible film 20, the vacuum adsorption force of the current adsorption region 100 decreases. Optionally, the increasing method can be gradual increase (for example, linear increase or curve increase) or step increase; the decreasing method can be gradual decrease (for example, linear decrease or curve decrease) or step decrease. This design method can, while reducing energy consumption, ensure that the vacuum adsorption force given by the adsorption region 100 at the position of the flexible film 20 to be adsorbed is always greater than the vacuum adsorption force given by the adsorption regions 100 at other positions, so that the flexible film 20 can better maintain a taut state.

[0029] In another embodiment, please continue to refer to Figure 1 , the above-mentioned pressure providing component 14 includes a jetting sub-component 140 and a gas supply sub-component (not shown in the figure). The jetting sub-component 140 includes a jetting head 1400, and the jetting head 1400 faces the adsorption platform 10; of course, the jetting sub-component 140 may also include a jetting pipe communicated with the jetting head 1400. The gas supply sub-component is connected to the jetting sub-component 140 and is used to supply gas to the jetting sub-component 140. Optionally, the gas supply sub-component may include a gas source and a gas pump, and the gas pump can communicate the gas source and the jetting pipe to pump the gas in the gas source into the jetting pipe. In some embodiments, the gas source can be high-purity nitrogen or an inert gas.

[0030] Optionally, as Figure 1As shown, the number of jet heads 1400 is one, and the jet center of the jet head 1400 coincides with the center of the adsorption platform 10. Generally speaking, under the action of gravity, the center of the flexible film 20 will approach the adsorption platform 10 relative to the edge of the flexible film 20. This design method can enable the central region of the flexible film 20 to come into contact with the adsorption platform 10 first, and the gas between the flexible film 20 and the adsorption platform 10 during the contact process can be more easily discharged from both side edges, so that the flexible film 20 can be adsorbed more flatly. In addition, during the movement and adsorption process of the flexible film 20, as the flexible film 20 approaches the adsorption platform 10, if the jet force of the jet head 1400 (i.e., the intensity of the ejected gas) remains unchanged, the pressure exerted by the gas on the flexible film 20 will decrease. In order to ensure that the flexible film 20 is always in a tensioned state, the jet force of the jet head 1400 can be set to be adjustable. For example, the closer the flexible film 20 is to the adsorption platform, the greater the jet force of the jet head 1400.

[0031] Another alternative is, as Figure 3 shown, Figure 3 is a schematic structural diagram of another embodiment of the adsorption device of the present application. The number of jet heads 1400 can also be multiple, and at least one jet center of the jet head 1400 faces the central region of the adsorption platform 10, at least one jet center of the jet head 1400 faces the non-central region of the adsorption platform 10, and the jet force of the jet head 1400 facing the central region of the adsorption platform 10 is greater than the jet force of the jet head 1400 facing the non-central region of the adsorption platform 10. For example, Figure 3 schematically shows three jet heads 1400, and the jet center of one of the jet heads 1400 coincides with the center of the adsorption area 100 marked as a; the jet centers of the other two jet heads 1400 are symmetrically arranged about the center of the adsorption platform 10 and can face the adsorption areas 100 marked as b or c or d. This design method can enable the central region of the flexible film 20 to come into contact with the adsorption platform 10 first, and the gas between the flexible film 20 and the adsorption platform 10 during the contact process can be more easily discharged from both sides, so that the flexible film 20 can be adsorbed more flatly.

[0032] Of course, in other embodiments, the multiple jet heads 1400 may operate in other ways. Specifically, at least one corresponding jet head 1400 is provided for each adsorption area 100; for each jet head 1400, during the moving adsorption process, before the current adsorption area 100 contacts the flexible film 20, the jet force of the jet head 1400 corresponding to the current adsorption area 100 increases; and after the current adsorption area 100 contacts the flexible film 20, the jet force of the jet head 1400 corresponding to the current adsorption area 100 decreases. Optionally, the increasing manner may be gradual increase (e.g., linear increase or curve increase) or step increase; the decreasing manner may be gradual decrease (e.g., linear decrease or curve decrease) or step decrease. This design method can reduce energy consumption while ensuring that the pressure exerted by the jet head 1400 at the position of the flexible film 20 to be adsorbed is always greater than the pressure exerted by the jet heads 1400 at other positions, so that the flexible film 20 can be better kept in a tensioned state.

[0033] In the above embodiment, the pressure providing component 14 applies a pressure towards the adsorption platform 10 to the flexible film 20 by jetting gas. Of course, in other embodiments, when the flexible film 20 is doped with magnet particles, the pressure providing component 14 can apply a pressure towards the adsorption platform 10 to the flexible film 20 by repulsive magnetic force, and at this time the pressure providing component 14 can be a magnetic force generating component.

[0034] In yet another embodiment, as Figure 1 shown, the adsorption device provided by the present application further includes: a controller 18, coupled to the lifting component 12, the vacuum generating component 16, and the pressure providing component 14, and controlling the operations of the lifting component 12, the pressure providing component 14, and the vacuum generating component 16, so that the flexible film 20 is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform 10. Herein, the above-mentioned coupling means that the controller 18 and the vacuum generating component 16 (or the lifting component 12, or the pressure providing component 14) can be connected through signal transmission means such as wireless or wired; preferably, the controller 18 can be coupled to the vacuum pump 160 in the vacuum generating component 16, or to the control switch located on the vacuum tube 162 in the vacuum generating component 16, and it is relatively easy to control whether the vacuum generating component 16 works and / or the sequence of working time by controlling the start and stop of the vacuum pump 160 or the on and off of the control switch.

[0035] Further, on this basis, the adsorption device provided by the present application may further include a plurality of sensors (not shown in the figure), which are respectively coupled to the controller 18; the plurality of sensors are arranged at different positions in the radial direction of the adsorption platform 10, and the sensors can obtain the distance information between different positions of the flexible film 20 and the corresponding positions of the adsorption platform 10 and feed it back to the controller 18. For example, at least one sensor is provided for each vacuum generating component 16 corresponding to its corresponding adsorption area 100; when the sensing signal between a partial area of the flexible film 20 and the adsorption area 100 at the corresponding position sensed by the sensor reaches a predetermined value, a feedback signal is sent to the controller 18, so that the controller 18 controls the corresponding vacuum generating component 16 to generate a vacuum adsorption force and / or control the magnitude of the vacuum adsorption force according to the feedback signal. The above design method can further improve the automation degree of the adsorption device.

[0036] Optionally, the sensor is a distance sensor, the corresponding sensing signal is the distance information between a partial area of the flexible film 20 and the adsorption area 100 at the corresponding position, and the corresponding predetermined value can be 0; in some embodiments, the distance sensor can be an infrared ranging sensor. Optionally, the sensor can be a pressure sensor, and at least one pressure sensor can be arranged in each adsorption area 100, and the corresponding sensing signal is the pressure information between a partial area of the flexible film 20 and the adsorption area 100 at the corresponding position.

[0037] In yet another embodiment, please continue to refer to Figure 1 and Figure 2 , the lifting assembly 12 in the adsorption device provided by the present application includes a fixed platform 120, a plurality of moving members 122 and a driving member 124. Among them, the fixed platform 120 is disposed around the outer periphery of the side surface of the adsorption platform 10 and is fixedly connected to the side surface of the adsorption platform 10; the material of the fixed platform 120 can be a hard material such as metal. The plurality of moving members 122 are arranged at intervals on the outer periphery of the adsorption platform 10 and penetrate through the fixed platform 120. Among them, the flexible film 20 is fixed on the moving members 122 to move along with the movement of the moving members 122. The driving member 124 is connected to the moving members 122 to drive the moving members 122 to drive the flexible film 20 to move, and the driving member 124 can be a motor or the like. The structural design of the above lifting assembly 12 is relatively simple and easy to implement.

[0038] Optionally, as Figure 2As shown, a plurality of moving members 122 form a plurality of moving member groups 126, and each moving member group 126 includes at least two moving members 122; and the plurality of moving member groups 126 can be arranged at equal intervals on the outer periphery of the side surface of the adsorption platform 10, so that the forces exerted by the plurality of moving members 122 on the flexible film 20 are relatively balanced, so that the flexible film 20 can be adsorbed by the adsorption platform 10 more flatly. In addition, each moving member group 126 can be correspondingly connected to a driving member 124; alternatively, all the moving member groups 126 can also share a driving member 124, and the driving member 124 can be coupled to Figure 1 the controller 18 in, and the start and stop of the driving member 124 are controlled by the controller 18 to accurately control the position of the moving member 122.

[0039] In addition, please refer to again Figure 1 , the moving member 122 can be a moving rod. The adsorption device provided in the present application may further include a fixing member 11 for fixedly connecting with the edge of the flexible film 20; and a recess (not shown in the figure) is provided on one side of the fixing member 11 facing the moving member 122, and the end of the moving member 122 can be inserted into the recess of the fixing member 11, so that the moving member 122 drives the fixing member 11 to move, and then drives the flexible film 20 to move. Optionally, the orthographic projection of the fixing member 11 on the adsorption platform 10 can be annular, and the flexible film 20 can be fixedly connected with the side of the fixing member 11 facing the adsorption platform 10 through an adhesive layer or the like.

[0040] The working process of the above adsorption device will be further described from the perspective of the method. Please refer to Figure 1 and Figure 4 , Figure 4 is a schematic flowchart of an implementation manner of the adsorption method of the present application. The adsorption method includes:

[0041] S101: Provide an adsorption device and fix the flexible film 20 on the lifting assembly 12.

[0042] Specifically, in an application scenario, semiconductor devices can be carried on the flexible film 20, and the semiconductor devices can be chips or the like. Please refer to Figure 5 , Figure 5 is Figure 4Schematic structural diagram of a previous embodiment before step S101. Before the above step S101, it includes: A. Fix both ends of the flexible film 20 to the fixing member 11, and fixedly connect the non-functional surface 220 side of the wafer 22 to the flexible film 20 through an adhesive member or the like; wherein, the wafer 22 includes a plurality of chips 222, and at this time, circuits can be pre-laid on the surface of the wafer 22; B. Use a process such as laser cutting to cut the wafer 22 into individual chips 222. At this time, through or non-through grooves 224 are provided between adjacent chips 222, and the grooves 224 do not penetrate the flexible film 20. Of course, in other application scenarios, semiconductor devices may not be carried on the flexible film 20, and semiconductor devices can be provided on the surface of the flexible film 20 after performing the subsequent step S102.

[0043] Further, the specific implementation process of the above step S101 can be: the driving member 124 in the lifting assembly 12 drives the moving member 122 to rise to the first position; the robotic arm transports the flexible film 20 above the moving member 122 away from the adsorption platform 10, and aligns the fixing member 11 fixedly connected to the flexible film 20 with the moving member 122. The end of the moving member 122 is inserted into the depression on the side of the fixing member 11 facing the adsorption platform 10 (as Figure 1 shown).

[0044] S102: Control the lifting assembly 12 to move towards the adsorption platform 10, and control the pressure providing assembly 14 to apply a pressure towards the adsorption platform 10 to the flexible film 20, so that the flexible film 20 is tensioned during the moving adsorption process and is flatly adsorbed by the adsorption platform 10.

[0045] Specifically, as Figure 1 shown, during the moving adsorption process, the flexible film 20 includes a first region 200 already adsorbed by the adsorption platform 10 and a second region 202 not adsorbed by the adsorption platform 10; the tension force received by the flexible film 20 in the first region 200 adjacent to the second region 202 is greater than the tension force received by the flexible film 20 in the first region 200; wherein, the tension force includes the pressure provided by the above pressure providing assembly 14. This design method can make the tension force received by the flexible film 20 at the position close to the adsorption platform 10 and about to be adsorbed by the adsorption platform 10 greater than that at the remaining positions not adsorbed by the adsorption platform 10. A part of the flexible film 20 close to the adsorption platform 10 and about to be adsorbed by the adsorption platform 10 is in a tensioned state, and the surface of this part of the flexible film 20 has no wrinkles, so that this part of the flexible film 20 can be flatly adsorbed by the adsorption platform 10.

[0046] In one embodiment, the adsorption device further includes a vacuum generating assembly 16 disposed below the adsorption platform 10 and providing a vacuum adsorption force to the adsorption area, and a controller 18. The tension force is the sum of the pressure and the vacuum adsorption force. The controller 18 is coupled to the lifting assembly 12, the pressure providing assembly 14, and the vacuum generating assembly 16. The above adsorption method further includes: controlling the operations of the lifting assembly 12, the pressure providing assembly 14, and the vacuum generating assembly 16 by the controller 18, so that the flexible film 20 is tensioned during the moving adsorption process and is flatly adsorbed by the adsorption platform 10.

[0047] For example, when the pressure providing assembly 14 includes a jet head 1400, the jet head 1400 can be made to eject gas; and when the moving member 122 is in the first position, under the action of the gas pressure, the flexible film 20 is tensioned, and at this time, there may be no contact between the lowest point of the flexible film 20 and the adsorption platform 10.

[0048] Another example is as Figure 1 shown in, the adsorption platform 10 includes a plurality of adsorption areas 100 arranged radially, and the adsorption device further includes a plurality of vacuum generating assemblies 16. One vacuum generating assembly 16 is connected to one adsorption area 100 for providing a vacuum adsorption force to the corresponding adsorption area 100; at this time, the above adsorption method further includes: during the moving adsorption process, sequentially turning on the vacuum generating assemblies 16, wherein the vacuum generating assembly 16 corresponding to the adsorption area 100 that first contacts the flexible film 20 is turned on earlier than the vacuum generating assembly 16 corresponding to the adsorption area 100 that later contacts the flexible film 20. That is, only when the flexible film 20 contacts a certain adsorption area 100, the vacuum generating assembly 16 corresponding to that adsorption area 100 is turned on.

[0049] Optionally, the pressure providing assembly 14 includes a jet head 1400, and the jet center of the jet head 1400 coincides with the center of the adsorption platform 10; during the moving adsorption process, in the radial direction away from the center of the adsorption platform 10, the vacuum generating assemblies 16 corresponding to the plurality of adsorption areas 100 are sequentially turned on.

[0050] The above are only embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. An adsorption device, characterized in that, Comprising: An adsorption platform for adsorbing a flexible film, on one side of the flexible film away from the adsorption platform, a chip is carried, the chip is formed by cutting a wafer carried on the flexible film, a through groove is provided between adjacent chips, and the shape of the chip is consistent with that of the flexible film below it; a lifting assembly that moves relative to the adsorption platform to drive the flexible film to move towards the adsorption platform; A pressure providing assembly that is arranged relative to the adsorption platform and applies a pressure towards the adsorption platform to the flexible film, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform; Wherein, relative to the two side regions of the flexible film, the central region of the flexible film is configured to come into contact with the adsorption platform preferentially, so that the gas between the flexible film and the adsorption platform is discharged from the two side regions; and during the moving adsorption process of the flexible film, the tension force received at the position where the flexible film is close to and about to be adsorbed by the adsorption platform is greater than the tension force at the positions where the flexible film is not adsorbed by the adsorption platform.

2. The adsorption device according to claim 1, wherein The adsorption platform includes at least one adsorption region, and the center of the adsorption region coincides with the center of the adsorption platform; The adsorption device further includes a vacuum generating assembly connected to the adsorption region; wherein, the tension force is the sum of the vacuum adsorption force provided by the vacuum generating assembly to the adsorption region and the pressure.

3. The adsorption device according to claim 2, wherein The adsorption platform includes a plurality of the adsorption regions arranged radially; The adsorption device includes a plurality of the vacuum generating assemblies, and one vacuum generating assembly is connected to one adsorption region to provide a vacuum adsorption force to the corresponding adsorption region.

4. The adsorption device according to claim 2, wherein The pressure providing assembly includes: An air jet sub-assembly including an air jet head that faces the adsorption platform; An air supply sub-assembly connected to the air jet sub-assembly for supplying gas to the air jet sub-assembly.

5. The adsorption device according to claim 4, wherein The number of the air jet heads is one, and the jet center of the air jet head coincides with the center of the adsorption platform.

6. The adsorption device according to claim 4, wherein The number of the air jet heads is multiple, and at least one jet center of the air jet heads faces the central region of the adsorption platform, and at least one jet center of the air jet heads faces the non-central region of the adsorption platform.

7. The adsorption device according to any one of claims 2-6, characterized in that, Further comprising: A controller coupled to the lifting assembly, the pressure providing assembly and the vacuum generating assembly, and controlling the operation of the lifting assembly, the pressure providing assembly and the vacuum generating assembly, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform.

8. The adsorption device according to claim 7, characterized in that, Further comprising: A plurality of sensors, and the sensors are arranged at different positions in the radial direction of the adsorption platform; The sensors can acquire the distance information between different positions of the flexible film and the corresponding positions of the adsorption platform and feedback it to the controller.

9. The adsorption device according to claim 1, characterized in that, The lifting assembly includes: A fixed platform, which is disposed around the periphery of the adsorption platform and fixedly connected to the side surface of the adsorption platform; A plurality of moving members, which are spaced apart from each other on the periphery of the adsorption platform and penetrate through the fixed platform. The flexible film is fixed on the moving members to move along with the movement of the moving members; A driving member, which is connected to the moving members to drive the moving members to drive the flexible film to move.

10. The adsorption device according to any one of claims 1-6, wherein During the moving adsorption process, the flexible film includes a first region adsorbed by the adsorption platform and a second region not adsorbed by the adsorption platform; The tension force on the flexible film in the first region adjacent to the second region is greater than the tension force on the flexible film in the second region; wherein the tension force includes the pressure.

11. An adsorption method, characterized in that, It includes: Providing the adsorption device as claimed in claim 1, and fixing the flexible film on the lifting assembly; Controlling the lifting assembly to move towards the adsorption platform, and controlling the pressure providing assembly to apply a pressure towards the adsorption platform to the flexible film, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform.

12. The adsorption method according to claim 11, wherein The method further includes: During the moving adsorption process, the flexible film includes a first region adsorbed by the adsorption platform and a second region not adsorbed by the adsorption platform; the tension force on the flexible film in the first region adjacent to the second region is greater than the tension force on the flexible film in the second region.

13. The adsorption method according to claim 12, wherein The adsorption platform includes at least one adsorption region. The adsorption device further includes a vacuum generating assembly and a controller disposed below the adsorption platform and providing a vacuum adsorption force to the adsorption region. The tension force is the sum of the pressure and the vacuum adsorption force. The controller is coupled to the lifting assembly, the pressure providing assembly and the vacuum generating assembly. The method further includes: Controlling the operation of the lifting assembly, the pressure providing assembly and the vacuum generating assembly through the controller, so that the flexible film is tensioned during the moving adsorption process and is adsorbed flatly by the adsorption platform.

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