High-resistance bonding silver wire and its preparation method and application

Abstract

The present invention is applicable to the field of bonding wire technology and provides a high-resistance silver bonding wire and its preparation method and application. The high-resistance silver bonding wire comprises the following components in weight percentage: 1-5% palladium, 0.001-0.01% nickel, 0.0003-0.005% cerium, 0.0005-0.005% calcium, 0.0002-0.005% aluminum, 0.1-0.3% chromium, and 0.5-3% tin, with the remainder being silver and unavoidable impurities, with silver being not less than 91.5%. This application is mainly based on silver-based materials and doped with nickel, cerium, calcium, aluminum, chromium, and tin elements in specific proportions to form a diversified solid solution structure, which is conducive to the synergistic promotion effect between the various elements in the structure, thereby greatly improving the mechanical properties, processing properties, and chemical stability of the bonding silver wire, abandoning the traditional bonding wire that cannot do without the addition of gold elements to improve various performances, and greatly reducing costs.

Description

Technical Field

[0001] The present invention belongs to the technical field of bonding wires, and in particular relates to a high-resistance bonding silver wire and a preparation method and application thereof. Background Art

[0002] Gold bonding wire for semiconductor packaging is one of the basic materials in the packaging industry, and it determines the development level of integrated circuits. In recent years, due to the advancement of integrated circuit technology, the demand for integrated circuit integration has become increasingly higher, and the requirements for the chemical and mechanical properties of gold bonding wire materials have also become increasingly higher. Generally speaking, gold bonding wire is often required to have high electrical conductivity, excellent chemical stability and plasticity, and must also have specified tensile strength and elongation.

[0003] Furthermore, due to the high cost of gold bonding wire and the need to reduce circuit board size, research into high-resistance silver bonding wire is necessary. The goal is to replace resistor components on circuit boards and reduce circuit board size. Silver bonding wire is already widely used in LED packaging and IC packaging, reducing costs. However, the development of silver bonding wire has reached its limits. Due to the irrationality of doping elements, it is difficult to achieve both high resistance and excellent chemical stability and mechanical properties. Summary of the Invention

[0004] The embodiment of the present invention provides a high-resistance bonding silver wire, aiming to solve the problem that the development of existing bonding silver wires is limited by the irrationality of doping elements, making it difficult to obtain excellent chemical stability and mechanical properties while ensuring high resistance.

[0005] The embodiment of the present invention is implemented as follows: a high-resistance silver bonding wire includes the following components in weight percentage:

[0006] Palladium 1-5%, nickel 0.001-0.01%, cerium 0.0003-0.005%, calcium 0.0005-0.005%, aluminum 0.0002-0.005%, chromium 0.1-0.3%, tin 0.5-3%, and the remainder is silver and unavoidable impurities, with silver not less than 91.5%.

[0007] An embodiment of the present invention further provides a method for preparing the high-resistance silver bonding wire, comprising:

[0008] palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt;

[0009] The alloy melt is continuously fed into the crystallizer by a slow continuous casting method using a guide rod, and solidifies in the crystallizer to form continuous grains and obtain a silver alloy cast long-axis crystal busbar;

[0010] The silver alloy as-cast long-axis crystal busbar is subjected to wire drawing, and kept at a temperature of 400-420° C. for 20-30 minutes to obtain a silver alloy wire;

[0011] The silver alloy wire is annealed to obtain a high-resistance bonding silver wire.

[0012] An embodiment of the present invention further provides an application of the high-resistance silver bonding wire in the field of integrated circuit packaging technology.

[0013] The high-resistance bonding silver wire provided by the embodiment of the present invention is based on a large amount of research to determine the types of doping elements of the silver-based material and the ratio of each doping element. It is mainly based on silver-based material, and doped with nickel, cerium, calcium, aluminum, chromium, and tin elements in specific proportions to form a diversified solid solution structure, which is conducive to the synergistic promotion effect between the various elements in the structure, thereby greatly improving the mechanical properties, processing properties and chemical stability of the bonding silver wire, abandoning the traditional bonding wire that cannot do without the addition of gold elements to improve various performances, and greatly reducing the cost. At the same time, it has been verified that the bonding silver wire obtained by this application has high resistance, and its mechanical properties and chemical stability are superior to those of bonding gold wires of the same specifications. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0015] In order to solve the problem that the development of existing bonding silver wires is limited by the irrationality of doping elements, making it difficult to obtain excellent chemical stability and mechanical properties while ensuring high resistance, the embodiment of the present invention provides a high-resistance bonding silver wire. Through a large amount of research, the types of doping elements of silver-based materials and the ratio of each doping element are determined. Silver-based materials are mainly used, and nickel, cerium, calcium, aluminum, chromium, and tin elements are doped in specific proportions to form a diversified solid solution structure, which is conducive to the synergistic promotion effect between the various elements in the structure, thereby greatly improving the mechanical properties, processing properties and chemical stability of the bonding silver wire, abandoning the traditional bonding wire that cannot do without the addition of gold elements to improve various performances, and greatly reducing costs. At the same time, it has been verified that the bonding silver wire obtained by the present application has high resistance, and its mechanical properties and chemical stability are superior to those of bonding gold wires of the same specifications.

[0016] Specifically, the high-resistance silver bonding wire includes the following components in percentage by weight:

[0017] Palladium 1-5%, nickel 0.001-0.01%, cerium 0.0003-0.005%, calcium 0.0005-0.005%, aluminum 0.0002-0.005%, chromium 0.1-0.3%, tin 0.5-3%, and the remainder is silver and unavoidable impurities, with silver not less than 91.5%.

[0018] In a preferred embodiment of the present application, the high-resistance silver bonding wire comprises the following components in weight percentage:

[0019] Palladium 2-4%, nickel 0.003-0.007%, cerium 0.0015-0.0035%, calcium 0.0015-0.0035%, aluminum 0.0025-0.0035%, chromium 0.15-0.25%, tin 1.5-2.5%, and the remainder is silver and unavoidable impurities, with silver not less than 91.5%.

[0020] In another preferred embodiment of the present application, the high-resistance silver bonding wire comprises the following components in weight percentage:

[0021] Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.2%, tin 2%, the balance being silver and unavoidable impurities, with silver not less than 91.5%.

[0022] During the early research and development of this invention, a large amount of research was conducted to determine the types of doping elements in the silver-based material and the ratios of each doping element. The composite addition of multiple elements is mainly to improve the mechanical properties, processing performance and chemical stability of the bonding silver wire, but the types and ratios of elements directly affect all aspects of the performance of the bonding silver wire.

[0023] An embodiment of the present invention further provides a method for preparing a high-resistance bonding silver wire, comprising:

[0024] palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt;

[0025] The alloy melt is continuously fed into the crystallizer by a slow continuous casting method using a guide rod, and solidifies in the crystallizer to form continuous grains and obtain a silver alloy cast long-axis crystal busbar;

[0026] The silver alloy as-cast long-axis crystal busbar is subjected to wire drawing, and kept at a temperature of 400-420° C. for 20-30 minutes to obtain a silver alloy wire;

[0027] The silver alloy wire is annealed to obtain a high-resistance bonding silver wire.

[0028] The vacuum melting treatment conditions are as follows: the vacuum degree is 10 -5Pa, temperature is 1250-1300℃.

[0029] The continuous casting method and conditions are as follows: the speed is controlled at 30-35 mm / min, and the cooling water temperature is controlled at 20-30°C.

[0030] Wherein, the annealing treatment condition is: temperature is 500-550℃.

[0031] In addition, the present application only optimizes and adjusts the parameters of the existing bonding silver wire preparation process. The specific process means can refer to the existing technology. For example, the wire drawing process can be carried out using conventional wire drawing equipment. Specifically, the present application optimizes and adjusts the process parameter conditions of vacuum melting treatment and continuous casting, which is conducive to the formation of continuous grains in the alloy melt in the crystallizer, thereby obtaining long-axis crystals. The process parameter conditions of vacuum melting treatment and continuous casting need to be strictly controlled, otherwise it will affect the internal structure of the cast long-axis crystal mother bar of the silver alloy, resulting in insufficient performance of the bonding silver wire prepared subsequently. In particular, when the continuous casting speed should not be higher than 35mm / min and the melting temperature is initially selected in the range of 1100-1200℃, the performance of the bonding silver wire obtained has a significant downward trend.

[0032] The present application also provides an application of the high-resistance silver bonding wire in the field of integrated circuit packaging technology.

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the high-resistance bonding silver wire of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0034] In addition, it should be noted that the numerical values ​​given in the following examples are as accurate as possible, but those skilled in the art understand that due to unavoidable measurement errors and experimental operation problems, each number should be understood as an approximate number rather than an absolutely accurate value.

[0035] Example 1

[0036] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0037] Palladium 1%, nickel 0.001%, cerium 0.0003%, calcium 0.0005%, aluminum 0.0002%, chromium 0.1%, tin 0.5%, silver 98.2%, and the rest are unavoidable impurities.

[0038] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0039] Example 2

[0040] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0041] Palladium 2%, nickel 0.003%, cerium 0.0015%, calcium 0.0015%, aluminum 0.0025%, chromium 0.15%, tin 1.5%, silver 96.3%, and the rest are unavoidable impurities.

[0042] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0043] Example 3

[0044] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0045] Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.2%, tin 2%, silver 94.7%, and the rest are unavoidable impurities.

[0046] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0047] Example 4

[0048] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0049] Palladium 4%, nickel 0.007%, cerium 0.0035%, calcium 0.0035%, aluminum 0.0035%, chromium 0.25%, tin 2.5%, silver 93.2%, and the rest are unavoidable impurities.

[0050] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0051] Example 5

[0052] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0053] Palladium 5%, nickel 0.01%, cerium 0.005%, calcium 0.005%, aluminum 0.005%, chromium 0.3%, tin 3%, silver 91.6%, and the rest are unavoidable impurities.

[0054] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0055] The wire specification of the bonding silver wires prepared in Examples 1-5 is φ0.02 mm, and the wire arc length is 2 mm. The resistivity, bonding thrust, and mechanical properties (tensile strength, elongation) of each bonding silver wire sample were tested. The test results are shown in Table 1.

[0056] Table 1

[0057]

[0058] In addition, the present application conducted research on doping elements and related process optimization during the early research and development process, as shown in the following comparative examples 1-5.

[0059] Comparative Example 1

[0060] In this comparative example, the bonding silver wire includes the following components in percentage by weight:

[0061] Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, tin 2%, silver 94.9%, and the rest are unavoidable impurities.

[0062] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0063] Comparative Example 2

[0064] In this comparative example, the bonding silver wire includes the following components in percentage by weight:

[0065] Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.4%, tin 2%, silver 94.5%, and the rest are unavoidable impurities.

[0066] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0067] Comparative Example 3

[0068] In this comparative example, the bonding silver wire includes the following components in percentage by weight:

[0069] Palladium 3%, nickel 0.015%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.2%, tin 2%, silver 94.69%, and the rest are unavoidable impurities.

[0070] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain an alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, and a temperature of 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter a crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0071] Comparative Example 4

[0072] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0073] Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.2%, tin 2%, silver 94.7%, and the rest are unavoidable impurities.

[0074] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, the temperature is 1150°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter the crystallizer, where it solidifies into continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 30 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0075] Comparative Example 5

[0076] In this embodiment, the silver bonding wire includes the following components in weight percentage:

[0077] Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.2%, tin 2%, silver 94.7%, and the rest are unavoidable impurities.

[0078] Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted to obtain alloy melt; the vacuum smelting treatment conditions are: vacuum degree of 10 -5 Pa, the temperature is 1250°C. A slow continuous casting method using a guide rod is used to continuously allow the alloy melt to enter the crystallizer, where it solidifies to form continuous grains, producing a cast silver alloy long-axis crystal busbar. The continuous casting method is performed at a controlled speed of 40 mm / min and a cooling water temperature of 25°C. The cast silver alloy long-axis crystal busbar is subjected to a wire drawing process and maintained at 410°C for 25 minutes to produce a silver alloy wire. The silver alloy wire is then annealed at 500°C to produce a high-resistance bonding silver wire.

[0079] The bonding silver wires prepared in Comparative Examples 1-5 have a wire specification of φ0.02 mm and a wire arc length of 2 mm. The test results of their mechanical properties and corrosion resistance (using a 0.05 mol / L sodium sulfide corrosion solution, placing the sample in it for 30 minutes and observing the surface corrosion and discoloration) are shown in Table 2 below.

[0080] Table 2

[0081]

[0082] In summary, it can be seen from Table 1 that Examples 1-5 of the present invention optimize the types of doping elements of silver-based materials and the ratios of various doping elements, mainly using silver-based materials, and doping nickel, cerium, calcium, aluminum, chromium, and tin elements in specific proportions to form a diversified solid solution structure, which is conducive to the synergistic promotion effect between the various elements in the structure, thereby greatly improving the mechanical properties, processing properties and chemical stability of the bonding silver wire, abandoning the traditional bonding wire that cannot do without the addition of gold elements to improve various performances, and greatly reducing the cost. At the same time, it has been verified that the bonding silver wire obtained in this application has high resistance, and its mechanical properties and chemical stability are superior to those of bonding gold wires of the same specifications.

[0083] In addition, it can be seen from Comparative Examples 1-3 that the type and ratio of elements directly affect the mechanical properties and chemical stability of the bonding silver wire. Among them, experiments have shown that the nickel element shall not be higher than 0.01%. In addition to having a significant impact on the mechanical properties of the bonding silver wire, the chromium element also directly affects its chemical stability and should not be higher than 0.3%.

[0084] In addition, it can be seen from Comparative Examples 4-5 that the present application optimizes and adjusts the process parameters of vacuum melting treatment and continuous casting, which is beneficial to the formation of continuous grains in the alloy melt in the crystallizer, thereby obtaining long-axis crystals. The process parameters of vacuum melting treatment and continuous casting need to be strictly controlled, otherwise it will affect the internal structure of the silver alloy cast long-axis crystal busbar, resulting in insufficient performance of the bonding silver wire prepared subsequently. In particular, when the continuous casting speed is not higher than 35mm / min and the melting temperature is initially selected in the range of 1100-1200℃, the performance of the bonding silver wire obtained has a significant downward trend.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-resistance silver bonding wire, characterized in that: The composition comprises the following components in weight percentage: 1-5% palladium, 0.001-0.01% nickel, 0.0003-0.005% cerium, 0.0005-0.005% calcium, 0.0002-0.005% aluminum, 0.1-0.3% chromium, 0.5-3% tin, and the remainder being silver and unavoidable impurities, with silver being not less than 91.5%. The method for preparing the high-resistance silver bonding wire comprises: Palladium, nickel, cerium, calcium, aluminum, chromium, tin and silver are mixed evenly and then vacuum smelted. The vacuum smelting conditions are as follows: vacuum degree is 10 -5 Pa, the temperature is 1250-1300℃, and the alloy melt is obtained; The alloy melt is continuously fed into the crystallizer by a slow continuous casting method using a guide rod. The continuous casting conditions are as follows: the speed is controlled at 30-35 mm / min, the cooling water temperature is controlled at 20-30° C., and the alloy melt solidifies in the crystallizer to form continuous grains and obtain a silver alloy cast long-axis crystal busbar. The silver alloy as-cast long-axis crystal busbar is subjected to wire drawing, and kept at a temperature of 400-420° C. for 20-30 minutes to obtain a silver alloy wire; The silver alloy wire is annealed to obtain a high-resistance bonding silver wire.

2. The high-resistance silver bonding wire according to claim 1, wherein The high-resistance silver bonding wire comprises the following components in weight percentage: Palladium 2-4%, nickel 0.003-0.007%, cerium 0.0015-0.0035%, calcium 0.0015-0.0035%, aluminum 0.0025-0.0035%, chromium 0.15-0.25%, tin 1.5-2.5%, and the remainder is silver and unavoidable impurities, with silver not less than 91.5%.

3. The high-resistance silver bonding wire according to claim 1, wherein The high-resistance silver bonding wire comprises the following components in weight percentage: Palladium 3%, nickel 0.005%, cerium 0.0025%, calcium 0.0025%, aluminum 0.003%, chromium 0.2%, tin 2%, the balance being silver and unavoidable impurities, with silver not less than 91.5%.

4. The high-resistance silver bonding wire according to claim 1, wherein The annealing treatment conditions in the preparation method are: a temperature of 500-550°C.

5. Use of the high-resistance silver bonding wire according to any one of claims 1 to 4 in the field of integrated circuit packaging technology.

Images