Motor drive device and manufacturing method thereof

Abstract

Provided are a motor drive device and a manufacturing method thereof that achieves reduced mis-installation during manufacturing. The motor drive device comprises: a substrate (10); a first mounting area (one of A1 and B) for mounting a first circuit component (one of 31 and 32); a second mounting area (the other of A1 and B) for mounting a second circuit component (the other of 31 and 32); a first pair of connection points (one of 11 and 12 and 21 and 14) for connecting a first connection wiring component (41) to the substrate so that at least a portion of the first connection wiring component (41) constituting a first path for supplying current to the first circuit component overlaps with the second mounting area; and a second pair of connection points (the other of 11 and 12 and 21 and 14) for connecting a second connection wiring component (41) to the substrate so that at least a portion of the second connection wiring component (41) constituting a second path for supplying current to the second circuit component overlaps with the first mounting area.

Description

Technical Field

[0001] The present invention relates to a motor drive device for driving a motor and a method for manufacturing the same. Background Art

[0002] The motor drive device that drives the motor generally has a circuit substrate on which electronic components are mounted. In this case, different circuits (circuit components) are sometimes used depending on the type of motor (for example, for output) (for example, see Japanese Patent Application Publication No. 2018-136144). Here, by configuring any one of the components for large current and small current on a common substrate, circuits for large current and small current can be appropriately produced. Thus, components can be appropriately selected on a common production line, installed on a common substrate, and different circuits can be produced.

[0003] However, when selecting different components and installing them on a common substrate, there is a risk of misselecting the component or misplacing it. This is particularly true in mass production, where production lines are running at high speeds, increasing the likelihood of misplacing components. Such misplacing results in production losses and is undesirable. Summary of the Invention

[0004] An object of the present invention is to provide a motor drive device and a method for manufacturing the same, which can reduce the risk of incorrect assembly during manufacturing.

[0005] The motor drive device involved in the embodiment of the present invention comprises: a substrate; a first mounting area on the substrate, which is used to mount a first circuit component; a second mounting area on the substrate, which is used to mount a second circuit component; a first pair of connection points, which are used to connect the first connecting wiring component to the substrate so that at least a portion of the first connecting wiring component constituting a first path for supplying current to the first circuit component overlaps with the second mounting area; and a second pair of connection points, which are used to connect the second connecting wiring component to the substrate so that at least a portion of the second connecting wiring component constituting a second path for supplying current to the second circuit component overlaps with the first mounting area.

[0006] The manufacturing method of the motor drive device involved in the embodiment of the present invention comprises: a preparation step of preparing a printed circuit board, the printed circuit board having: a first mounting area for mounting a first circuit component; a second mounting area for mounting a second circuit component; a first pair of connection points on the substrate, which, by being connected to each other, constitute a part of a first path for supplying current to the first circuit component; and a second pair of connection points on the substrate, which, by being connected to each other, constitute a part of a second path for supplying current to the second circuit component; an installation step of mounting the first circuit component in the first mounting area or mounting the second circuit component in the second mounting area; and a connection step of connecting the first pair of connection points by a first connecting wiring component that at least partially overlaps with the second mounting area when the first circuit component is installed by the installation step, and connecting the second pair of connection points by a second connecting wiring component that at least partially overlaps with the first mounting area when the second circuit component is installed by the installation step.

[0007] According to the present invention, it is possible to provide a motor drive device and a method for manufacturing the same, which can reduce the occurrence of incorrect assembly during manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a diagram showing a printed circuit board for the motor drive device according to the embodiment.

[0009] Figure 2 This diagram shows a motor drive circuit for large current.

[0010] Figure 3 This diagram shows a motor drive circuit for low current.

[0011] Figure 4 This is a perspective view of the connection wiring component. DETAILED DESCRIPTION

[0012] Hereinafter, a motor drive device and a method for manufacturing the same according to an embodiment will be described in detail with reference to the drawings.

[0013] The motor drive device is a device that outputs current for driving the motor and includes various circuits for driving and controlling the motor. For example, the motor drive device can include either of the following motor drive circuits 20a and 20b depending on whether the motor being driven is high-output or low-output.

[0014] Figure 1 A printed circuit board 10 for a motor drive device according to an embodiment is shown. Figure 2 、 Figure 3A high-output motor drive circuit 20 a and a low-output motor drive circuit 20 b are respectively shown, which are manufactured using the printed circuit board 10 .

[0015] Printed circuit board 10 is a common substrate that can be used in the manufacture of either motor drive circuit 20a or 20b. As will be described later, depending on whether a high-current or low-current circuit is being manufactured, either a high-current component (here, current sensor 31) or a low-current component (here, shunt resistor element 32) is selected and mounted on printed circuit board 10, thereby enabling the manufacture of either motor drive circuit 20a or 20b.

[0016] like Figure 1 As shown, the printed circuit board 10 is a board having mounting areas A ( A1 , A2 ), B, and C ( C1 to C4 ) and connection points 11 to 18 , 21 , and 22 .

[0017] The printed circuit board 10 includes electrical components, wiring, etc. in addition to the mounting areas A, B, and C and the connection points 11 to 18, 21, and 22, but these are omitted for ease of understanding. For example, the printed circuit board 10 includes wiring and electrical components connected to the connection points 11 to 18, 21, and 22.

[0018] The mounting areas A (A1, A2), B, and C (C1 to C4) are visually identified and displayed on the printed circuit board 10. Specifically, the mounting areas A1, A2, B, and C1 to C4 may be distinguished from their surroundings by, for example, adding a different shade or color to their boundaries or to the areas themselves.

[0019] like Figure 2 、 Figure 3 As shown, mounting areas A1 and A2 are used to mount components for large currents (here, current sensor 31), while mounting area B is used to mount components for small currents (here, shunt resistor element 32). One or the other of mounting areas A1 and B corresponds to the first mounting area and the second mounting area.

[0020] Specifically, depending on whether the motor drive circuit 20 is for high current or low current, either the current sensor 31 or the shunt resistor element 32 is selected and mounted on the printed circuit board 10. Here, two current sensors 31 for high current are mounted in mounting areas A1 and A2, while one shunt resistor element 32 for low current is mounted in mounting area B.

[0021] Mounting areas C1 to C4 are used to mount electrolytic capacitors 33. Different numbers of electrolytic capacitors 33 are mounted here, for high current and low current use. For high current use, four electrolytic capacitors 33 are mounted in all mounting areas C1 to C4. For low current use, only one electrolytic capacitor 33 is mounted in mounting area C1.

[0022] The shapes and sizes of mounting areas A, B, and C correspond to the shapes of the current sensor 31, shunt resistor element 32, and electrolytic capacitor 33 to be mounted when viewed from above the printed circuit board 10. This facilitates secure mounting of these electrical components. Furthermore, mounting areas A, B, and C may be given different shades or colors to distinguish them from one another. This further facilitates secure mounting of these electrical components.

[0023] Connection points 11-18, 21, and 22 consist of conductive bodies connected to the ends of connection wiring members 41 and 42. By appropriately selecting two of these connection points 11-18, 21, and 22 and connecting one end of each connection wiring member 41 or 42 to the other, a current path connecting the two connection points can be formed. Connection points 11-18, 21, and 22 have connection holes (not shown) for insertion of the connection portion 45 of the connection wiring member 41 or 42, described later.

[0024] like Figure 2 As shown, in the large current circuit, a connection wiring component 41 (one or the other of the first connection wiring component and the second connection wiring component) is arranged between connection points 11 and 12, and three connection wiring components 42 are arranged between connection points 13 and 14, between 15 and 16, and between 17 and 18. Figure 3 As shown, in the circuit for low current, one connection wiring member 41 is arranged between the connection points 21 and 14 , and two connection wiring members 42 are arranged between the connection points 22 and 16 , and between the connection points 17 and 18 .

[0025] The pair of connection points 11, 12 and the pair of connection points 21, 14 correspond to one or the other of the first pair of connection points and the second pair of connection points, and either one of these is selected to connect to the connection wiring member 41. By connecting the connection wiring member 41 to the pair of connection points 11, 12 or the pair of connection points 21, 14, a path for supplying current to the current sensor 31 in the mounting area A1 or the shunt resistor element 32 in the mounting area B is formed.

[0026] Furthermore, the intervals (distances) between the pair of connection points 11 and 12 and between the pair of connection points 21 and 14 are substantially the same so that the connection wiring member 41 , which is the same component, can be connected.

[0027] The pair of connection points 11 and 12 straddle the mounting area B. Therefore, when the pair of connection points 11 and 12 are connected using the connection wiring member 41, the connection wiring member 41 is arranged to at least partially overlap the mounting area B, making it impossible to mount the shunt resistor element 32 in the mounting area B. As a result, simultaneous mounting of the shunt resistor element 32 in the mounting area B (mounting of a low-current component) and the connection of the pair of connection points 11 and 12 to the connection wiring member 41 (connection for high current) is prevented.

[0028] The pair of connection points 21 and 14 straddle mounting area A1. Therefore, when the connection wiring member 41 is used to connect the pair of connection points 21 and 14, the connection wiring member 41 at least partially overlaps with mounting area A1, making it impossible to mount the current sensor 31 in mounting area A1. This prevents the current sensor 31 from being incorrectly mounted in mounting area A1 (mounting a high-current component) and simultaneously connected to the pair of connection points 21 and 14 via the connection wiring member 41 (connecting a low-current component).

[0029] Here, the connection points 13 and 14 , 15 and 16 , 17 and 18 , and 22 and 16 have substantially the same intervals (distances) so that the connection wiring members 42 , which are the same components, can be connected.

[0030] In addition, Figure 3 In the embodiment, two connection wiring members 42 are used to connect connection points 22 and 18 via connection points 16 and 17. However, a single connection wiring member 42 may be used to directly connect connection points 22 and 18 across mounting area A2. In this case, the distance between connection points 22 and 16 does not need to be substantially the same as that between connection points 15 and 16.

[0031] The connection points 14 and 16 are also used in common when mounting either the high-current or low-current components. As a result, the number of connection points is reduced, making it easy to reduce incorrect mounting and reduce the mounting area.

[0032] Figure 4 4 is a perspective view of the connection wiring components 41 and 42. Figure 4 As shown, the connection wiring members 41 and 42 are each formed by bending an elongated flat plate and have a connection portion 45, a connecting portion 46, and a horizontal conductor portion 47. The connection wiring members 41 and 42 are not limited to flat plates and may be formed by bending wires or round rods.

[0033] Connecting portions 45 are disposed at both ends of connecting wiring members 41 and 42 and connected to any of connection points 11 to 18, 21, and 22. Connecting portions 45 can be inserted into connection holes of connection points 11 to 18, 21, and 22 and connected using solder or the like.

[0034] Horizontal conductor portion 47 is connected to connecting portion 45 via connecting portion 46 and is arranged substantially parallel to the main surface of printed circuit board 10 during installation. The length L of horizontal conductor portion 47 varies depending on which of connection wiring members 41 and 42 it is used for. Length L of horizontal conductor portion 47 of connection wiring member 41 is longer than length L of horizontal conductor portion 47 of connection wiring member 42. Connection wiring member 41 has a length corresponding to the distances between connection points 11 and 12, and between connection points 21 and 14. Connection wiring member 42 has a length corresponding to the distances between connection points 13 and 14, between connection points 15 and 16, between connection points 17 and 18, and between connection points 22 and 16.

[0035] The current sensor 31 can be constructed using a roughly cylindrical core (magnetic core) and a Hall effect IC placed in a gap formed within the core. Specifically, the current sensor 31 has a roughly cylindrical shape with an axis roughly parallel to the main surface of the printed circuit board 10. The horizontal conductor portion 47 of the wiring member 42 passes through the interior of this cylinder. Specifically, when the current sensor 31 and wiring member 42 are mounted, they appear to overlap in plan view when viewed perpendicular to the main surface of the printed circuit board 10, but do not overlap in three dimensions. This allows the wiring member 42 to be installed after the current sensor 31 is mounted without interfering with the current sensor.

[0036] The current sensor 31 detects the current flowing through the horizontal conductor 47 of the connection wiring member 42 in the core. The core receives the magnetic field generated by the current flowing through the horizontal conductor 47, and the Hall IC converts the magnetic field into a voltage, thereby detecting the current flowing through the horizontal conductor 47.

[0037] The shunt resistor element 32 has a substantially rectangular parallelepiped shape, includes a shunt resistor (low resistance) for current detection, and detects current using a voltage drop between both ends of the shunt resistor.

[0038] Here, a single shunt resistor element 32 is used to detect the currents of two phases. Therefore, the shunt resistor element 32 has two detection elements corresponding to each phase. However, a shunt resistor element having a single detection element can also be used, in which case two shunt resistor elements are installed.

[0039] Thus, the replacement of the current sensing element for high and low currents takes into account the strengths and weaknesses of the current sensor 31 and the shunt resistor 32. The shunt resistor 32 offers better detection accuracy and responsiveness than the current sensor 31, but generates more heat. Therefore, different components are selected based on the output current, serving as the shunt resistor 32 for low currents and the current sensor 31 for high currents.

[0040] Here, if Figure 2As shown, when the connection wiring member 41 is connected between the connection points 11 and 12 for high current, the horizontal conductor portion 47 of the connection wiring member 41 at least partially overlaps with the mounting area B, making it impossible to mount the shunt resistor element 32 for low current in this mounting area B. In other words, it is impossible to simultaneously connect the connection wiring member 41 for high current and mount the shunt resistor element 32 for low current. As a result, this prevents erroneous mounting, where the connection wiring member 41 for high current and the mounting of the shunt resistor element 32 for low current are performed simultaneously.

[0041] In addition, if Figure 3 As shown, when the wiring member 41 is connected between the connection points 21 and 14 for low current, the horizontal conductor portion 47 of the wiring member 41 at least partially overlaps with the mounting area A1, making it impossible to mount the current sensor 31 for high current in the mounting area A1. In other words, it is impossible to simultaneously connect the wiring member 41 for low current and mount the current sensor 31 for high current in the mounting area A1. This prevents erroneous mounting, where the wiring member 41 for low current is connected and the current sensor 31 for high current is mounted simultaneously.

[0042] (Method for manufacturing a motor drive device)

[0043] The electric motor drive device can be manufactured through the following steps.

[0044] First, prepare Figure 1 The printed circuit board 10 is shown (preparation step). Next, a selection is made from the printed circuit board 10 to manufacture either a large current or a small current motor drive circuit 20. Based on this selection, electrical components are mounted (mounting step) and connections are made between connection points (connection step).

[0045] (1) When a large current is selected, components are arranged as follows.

[0046] Current sensor 31: Installation areas A1 and A2

[0047] Electrolytic capacitor 33: mounting areas C1 to C4

[0048] Connecting wiring component 41: between connection points 11 and 12

[0049] Connection wiring component 42: connection points 13, 14, 15, 16, 17, 18

[0050] Furthermore, components (shunt resistor element 32 , connection wiring members 41 , 42 ) are not mounted on the mounting region B and the connection points 21 , 22 .

[0051] (2) When a small current is selected, components are arranged as follows.

[0052] Shunt resistor element 32: mounting area B

[0053] Electrolytic capacitor 33: mounting area C1

[0054] Connection wiring component 41: between connection points 21 and 14

[0055] Connection wiring component 42: connection points 22, 16, 17, and 18

[0056] Furthermore, components (current sensor 31 , electrolytic capacitor 33 , connection wiring members 41 , 42 ) are not mounted on mounting areas A1 , A2 , C2 to C4 and connection points 11 , 12 , 13 , and 15 .

[0057] By assembling the motor drive circuit 20 produced as described above, a motor drive device can be manufactured.

[0058] Thus, in this embodiment, by selecting and arranging components for high and low currents on the printed circuit board 10, it is possible to manufacture motor drive circuits 20 for both high and low currents. This allows for the commonality of the printed circuit board 10, reducing manufacturing costs. Furthermore, by using commonality for the connecting wiring components 41 and 42, manufacturing costs can also be reduced.

[0059] By overlapping the placement of the high-current electrical component (current sensor 31) and the low-current connection wiring component 41, expansion of the substrate area and incorrect mounting are prevented. Furthermore, by overlapping the placement of the low-current electrical component (shunt resistor element 32) and the high-current connection wiring component 41, expansion of the substrate area and incorrect mounting are prevented.

[0060] [Technical Concepts Obtained from Implementation Methods]

[0061] The technical ideas that can be grasped from the above-mentioned embodiments are described below.

[0062] The motor drive device of the [1] embodiment includes: a substrate (printed substrate 10); a first mounting area (one of mounting areas A1 and B) on the substrate, which is used to mount a first circuit component (one of the current sensor 31 and the shunt resistor element 32); a second mounting area (the other of mounting areas A1 and B) on the substrate, which is used to mount a second circuit component (the other of the current sensor 31 and the shunt resistor element 32); a first pair of connection points (one of connection points 11 and 12 and connection points 21 and 14) for connecting the first connection wiring component to the substrate so that at least a portion of a first connection wiring component 41 constituting a first path for supplying current to the first circuit component overlaps with the second mounting area; and a second pair of connection points (the other of connection points 11 and 12 and connection points 21 and 14) for connecting the second connection wiring component to the substrate so that at least a portion of a second connection wiring component 41 constituting a second path for supplying current to the second circuit component overlaps with the first mounting area.

[0063] This prevents both erroneous installation of the first circuit component and connection of the second connection wiring component, and erroneous installation of the second circuit component and connection of the first connection wiring component.

[0064] [2] The first mounting area and the second mounting area are each visually identified and displayed on the substrate. This improves the quality of mounting of the first circuit component or the second circuit component.

[0065] [3] The spacing between the first pair of connection points is substantially the same as the spacing between the second pair of connection points. This allows connections to be made using components of the same shape, improving manufacturing efficiency. That is, the first and second connection wiring components can be the same component.

[0066] [4] One of the first and second circuit components is a component for high current, and the other is a component for low current. This allows circuits for high and low currents to be fabricated using the same substrate.

[0067] [5] The first circuit component and the second circuit component are components for current detection. This allows the same substrate to be used to handle different current ranges.

[0068] [6] The method for manufacturing a motor drive device includes a preparation step, an installation step, and a connection step.

[0069] In the preparation step, a printed circuit board is prepared. The printed circuit board has a first mounting area for mounting a first circuit component, a second mounting area for mounting a second circuit component, a first pair of connection points on the board that, when connected, form a portion of a first path for supplying current to the first circuit component, and a second pair of connection points on the board that, when connected, form a portion of a second path for supplying current to the second circuit component.

[0070] In the mounting step, the first circuit component is mounted in the first mounting area, or the second circuit component is mounted in the second mounting area.

[0071] In the connection process, when the first circuit component is installed through the installation process, the first pair of connection points are connected through a first connecting wiring component that at least partially overlaps with the second installation area. When the second circuit component is installed through the installation process, the second pair of connection points are connected through a second connecting wiring component that at least partially overlaps with the first installation area.

[0072] This makes it possible to reduce erroneous mounting when selecting and mounting the first circuit component or the second circuit component using a common printed circuit board.

Claims

1. A motor drive device, characterized in that: The motor drive device comprises: substrate; A first mounting area on the substrate, which is used to mount a first circuit component; a second mounting area on the substrate, for mounting a second circuit component; a first pair of connection points for connecting a first connection wiring member to the substrate so that at least a portion of the first connection wiring member constituting a first path for supplying current to the first circuit member overlaps with the second mounting area; as well as a second pair of connection points for connecting a second connection wiring member to the substrate so that at least a portion of the second connection wiring member constituting a second path for supplying current to the second circuit member overlaps with the first mounting area; The first pair of connection points and the second pair of connection points are arranged outside the first installation area and the second installation area, When the first connection wiring member is connected to the first pair of connection points, the first connection wiring member overlapping the second mounting area hinders the mounting of the second circuit member to the second mounting area. When the second connection wiring member is connected to the second pair of connection points, the second connection wiring member overlapping the first mounting area hinders the mounting of the first circuit component to the first mounting area.

2. The motor drive device according to claim 1, wherein: The first mounting area and the second mounting area are respectively identified and displayed on the substrate in a visually recognizable manner.

3. The motor drive device according to claim 1 or 2, characterized in that: The interval between the first pair of connection points is substantially the same as the interval between the second pair of connection points.

4. The motor drive device according to claim 3, wherein: The first connection wiring member and the second connection wiring member are the same member.

5. The motor drive device according to claim 1 or 2, characterized in that: One of the first circuit component and the second circuit component is a component for large current, The other of the first circuit component and the second circuit component is a component for low current.

6. The motor drive device according to claim 1 or 2, characterized in that: The first circuit component and the second circuit component are components for current detection.

7. A method for manufacturing a motor drive device, characterized in that: The manufacturing method comprises: A preparation step of preparing a printed circuit board having: a first mounting area for mounting a first circuit component; a second mounting area for mounting a second circuit component; a first pair of connection points on the board that, when connected to each other, constitute a portion of a first path for supplying current to the first circuit component; and a second pair of connection points on the board that, when connected to each other, constitute a portion of a second path for supplying current to the second circuit component. an installation step of installing the first circuit component in the first installation area or installing the second circuit component in the second installation area; as well as a connecting step, in which, when the first circuit component is mounted in the mounting step, the first pair of connection points are connected by a first connecting wiring member at least partially overlapping the second mounting area; and in which, when the second circuit component is mounted in the mounting step, the second pair of connection points are connected by a second connecting wiring member at least partially overlapping the first mounting area. The first pair of connection points and the second pair of connection points are arranged outside the first installation area and the second installation area, When the first connection wiring member is connected to the first pair of connection points, the first connection wiring member overlapping the second mounting area hinders the mounting of the second circuit member to the second mounting area. When the second connection wiring member is connected to the second pair of connection points, the second connection wiring member overlapping the first mounting area hinders the mounting of the first circuit component to the first mounting area.

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