CPU cooling module installation status detection methods, systems, devices, and media

Abstract

This invention proposes a method, system, device, and medium for detecting the installation status of a CPU heatsink module. The method includes: detecting whether the pin impedance of each CPU on the motherboard is abnormal using a CPLD; if an abnormality is found, immediately shutting off the main power supply to the motherboard; activating a CPU heatsink module abnormality alert mechanism; and marking the pins with abnormal impedance using the CPLD. This invention determines whether the heatsink module is improperly installed by detecting whether the pin impedance of each CPU on the motherboard is abnormal. Upon confirming an abnormality, it provides an abnormality alert and an abnormality marker, ensuring that operators can promptly troubleshoot the problem, thereby improving troubleshooting efficiency.

Description

Technical Field

[0001] This invention relates to the field of computer technology, and more specifically to a method, system, device, and medium for detecting the installation status of a CPU heat dissipation module. Background Technology

[0002] Currently, in order to meet the requirements of high-speed computing and high-stability operation of server systems, in addition to the selection of the hardware CPU processor, the heat sink module used to handle CPU heat dissipation also plays a crucial role.

[0003] When installing a heatsink module onto the CPU, it's crucial to apply a graphite-based thermal paste or install thermal pads at the contact surfaces to achieve optimal heat transfer efficiency, ensuring high-performance and cost-effective CPU operation. Therefore, standard installation procedures must be followed to guarantee precise installation. However, since current heatsink modules are installed manually, improper installation still occurs. For example, negligence during manual installation can lead to incomplete installation, resulting in a high probability of CPU failure. Furthermore, due to significant blind spots on the heatsink module, failure to apply thermal paste or remove protective covers from thermal pads during manual installation can result in poor CPU cooling, potentially causing a significant increase in system power consumption, unexpected shutdowns, and component burnout. Since each motherboard in a server system typically has a maximum of two CPUs, in situations with a large number of CPUs, the lack of warning and protection features in the heatsink module can lead to malfunctions and significant safety hazards in the server system. Summary of the Invention

[0004] To address the above problems, the present invention aims to provide a method, system, device, and medium for detecting the installation status of a CPU heat dissipation module.

[0005] To achieve the above objectives, this invention provides the following technical solution: a method for detecting the installation status of a CPU heat dissipation module, comprising:

[0006] The CPLD is used to detect whether the pin impedance of each CPU on the motherboard is abnormal.

[0007] If any abnormality is detected, immediately turn off the main power supply to the motherboard;

[0008] Activate the CPU cooling module malfunction alert mechanism;

[0009] Pins with abnormal impedance are identified using a CPLD.

[0010] Furthermore, the step of detecting whether the pin impedance of each CPU on the motherboard is abnormal via CPLD includes: acquiring the pin impedance value of each CPU on the motherboard via CPLD;

[0011] Determine whether the collected pin impedance values ​​are all less than the preset impedance threshold;

[0012] If yes, the server system boots up normally; if not, there is an abnormality in the pin impedance.

[0013] Furthermore, the step of shutting off the main power supply to the motherboard includes:

[0014] By setting PS_ON in the BIOS options to Disable using CPLD, the server system can be prevented from booting.

[0015] Furthermore, the mechanism for activating the CPU cooling module abnormality alert includes:

[0016] Send a pin impedance abnormality notification command to the BMC to activate the CPU heat dissipation module abnormality reminder function and control the preset red warning light and UID light on the motherboard to keep them constantly lit.

[0017] Furthermore, the identification of pins with impedance abnormalities via CPLD includes:

[0018] Send a pin impedance abnormality confirmation command to the CPLD, and mark the pin with abnormal impedance according to the command.

[0019] Furthermore, when there is an abnormality in the pin impedance, the value of the DET_CPU_BPRC instruction is set to 1.

[0020] Accordingly, the present invention also discloses a CPU heat dissipation module installation status detection system, including: a detection unit, used to detect whether the pin impedance of each CPU on the motherboard is abnormal through a CPLD;

[0021] The power control unit is used to shut down the main power supply to the motherboard.

[0022] The alert unit is used to activate the CPU cooling module abnormality alert mechanism;

[0023] The identification unit is used to identify pins with abnormal impedance via a CPLD.

[0024] Furthermore, the detection unit is specifically used for:

[0025] The pin impedance values ​​of each CPU on the motherboard are acquired using a CPLD.

[0026] Determine whether the collected pin impedance values ​​are all less than the preset impedance threshold;

[0027] If yes, the server system boots up normally; if not, there is an abnormality in the pin impedance.

[0028] Furthermore, the power control unit is specifically used for:

[0029] By setting PS_ON in the BIOS options to Disable using CPLD, the server system can be prevented from booting.

[0030] Furthermore, the reminder unit is specifically used for:

[0031] Send a pin impedance abnormality notification command to the BMC to activate the CPU heat dissipation module abnormality reminder function and control the preset red warning light and UID light on the motherboard to keep them constantly lit.

[0032] Furthermore, the identification unit is specifically used for:

[0033] Send a pin impedance abnormality confirmation command to the CPLD, and mark the pin with abnormal impedance according to the command.

[0034] Accordingly, this invention discloses a CPU heat dissipation module installation status detection device, comprising:

[0035] Memory, used to store the CPU heat dissipation module installation status detection program;

[0036] A processor is configured to implement the steps of the CPU heat dissipation module installation status detection method as described in any of the above descriptions when executing the CPU heat dissipation module installation status detection program.

[0037] Accordingly, the present invention discloses a readable storage medium storing a CPU heat dissipation module installation status detection program, wherein when the CPU heat dissipation module installation status detection program is executed by a processor, it implements the steps of the CPU heat dissipation module installation status detection method described in any of the above descriptions.

[0038] Compared with the prior art, the advantages of this invention are as follows:

[0039] 1. This invention monitors the impedance of the CPU boundary pins after the CPU and heatsink modules are correctly assembled on each motherboard. When an abnormal connection of the CPU heatsink module occurs, a warning mechanism is activated to alert the system. This is indicated by the inability to power on the system, a constantly lit red warning light near each CPU processor on the motherboard, and a constantly lit startup UID light. This notifies the operator and simultaneously sends feedback to the CPLD for anomaly identification, achieving programmable, intelligent, and comprehensive protection. Using the method provided by this invention improves the performance, protection, security, and reliability of the CPU processor and heatsink module.

[0040] 2. This invention can promptly detect CPU cooling module malfunctions caused by improper installation by personnel, thus improving troubleshooting efficiency.

[0041] Therefore, it is evident that the present invention has outstanding substantive features and significant progress compared with the prior art, and the beneficial effects of its implementation are also obvious. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0043] Appendix Figure 1 This is a flowchart illustrating a specific embodiment of the present invention.

[0044] Appendix Figure 2 This is a system structure diagram of a specific embodiment of the present invention.

[0045] In the diagram, 1 is the detection unit; 2 is the power control unit; 3 is the reminder unit; and 4 is the identification unit. Detailed Implementation

[0046] The core of this invention is to provide a method for detecting the installation status of a CPU heatsink module. In existing technologies, although standard installation procedures must be followed when installing heatsink modules to ensure accurate installation, improper installation still occurs due to the current manual installation process. For example, negligence during manual disassembly and assembly can lead to incomplete installation on the first attempt, causing a high probability of CPU processor failure. Furthermore, due to large blind spots on the heatsink module where thermal paste and thermal pads adhere, failure to apply thermal paste or remove the protective film from the thermal pads during manual operation can result in poor heat dissipation during CPU operation. In severe cases, this can lead to a significant increase in system power consumption, unexpected shutdowns, and damage to related components.

[0047] The CPU cooling module installation status detection method provided by this invention first uses a CPLD to detect whether the pin impedance of each CPU on the motherboard is abnormal. If an abnormality is found, the main power supply to the motherboard is immediately turned off, and the CPU cooling module abnormality alert mechanism is activated. Then, the pin with abnormal impedance is marked using the CPLD. Therefore, this invention can promptly detect CPU cooling module abnormalities caused by improper installation, improving troubleshooting efficiency.

[0048] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] Example 1:

[0050] like Figure 1 As shown, this embodiment provides a method for detecting the installation status of a CPU heat dissipation module, including the following steps:

[0051] S1: Detect whether the pin impedance of each CPU on the motherboard is abnormal using the CPLD. If yes, proceed to step S2; otherwise, proceed to step S3.

[0052] In this step, the specific judgment process includes: First, acquiring the pin impedance values ​​of each CPU on the motherboard using a CPLD. Then, determining whether the acquired pin impedance values ​​are all less than a preset impedance threshold;

[0053] If yes, the pin impedance is normal; if not, the pin impedance is abnormal.

[0054] It should be noted that in this method, in order to determine the impedance threshold, the CPU processor of the motherboard to be tested needs to be determined in advance. After the heat dissipation module is correctly assembled by applying thermal paste or adding thermal pads, the impedance threshold of the CPU boundary pins is determined by measurement, and the measured impedance threshold is collected into the database for the determination of pin impedance anomalies.

[0055] S2: The server system booted up normally, and the test is complete.

[0056] In this step, after confirming that the pin impedance is normal, the value of the DET_CPU_BPRC instruction is first set to 0, that is, there is no need to start the CPU heat dissipation module abnormality reminder mechanism, and then the normal boot-up of the server system is performed.

[0057] S3: Immediately turn off the main power supply to the motherboard.

[0058] Specifically, when there is an abnormal pin impedance, the value of the DET_CPU_BPRC instruction is set to 1. Then, the PS_ON option in the BIOS is set to Disable via the CPLD, preventing the server system from booting.

[0059] S4: Activate the CPU cooling module abnormality alert mechanism.

[0060] Specifically, it sends a pin impedance abnormality notification command to the BMC, activates the CPU heat dissipation module abnormality reminder function, and controls the preset red warning light and UID light on the motherboard to remain constantly lit.

[0061] It is particularly important to note that, given the numerous motherboards and CPUs in a server system, quickly identifying the faulty CPU cooling module is crucial. Therefore, a red warning light is pre-installed on each CPU. When an abnormality is detected in a motherboard's CPU cooling module, its red warning light will remain constantly lit. Combined with the programmable control design of the CPLD, this further narrows down the scope of the fault and enhances troubleshooting efficiency.

[0062] S5: Identify pins with abnormal impedance using a CPLD.

[0063] First, a pin impedance abnormality confirmation command (BPR_FA command) is sent to the CPLD. Then, the pin with the impedance abnormality is marked according to the command. This fault mark can only be removed after the operator has resolved the CPU heat dissipation module malfunction. This serves as the final checkpoint for fault removal to ensure the normal operation of the equipment.

[0064] This embodiment provides a method for detecting the installation status of a CPU heatsink module. By monitoring the impedance of the CPU boundary pins after the CPU and heatsink module are correctly assembled on each motherboard, when an abnormal connection of the CPU heatsink module occurs, a warning mechanism for CPU heatsink module abnormalities is promptly activated. This is indicated by the inability to power on the system, a constantly lit red warning light near each CPU processor on the motherboard, and a constantly lit startup UID light. This notifies the operator and simultaneously provides feedback to the CPLD for abnormal identification, achieving programmable, intelligent, and comprehensive protection. Using this method can improve the performance, protection, security, and reliability of the CPU processor and heatsink module.

[0065] Example 2:

[0066] Based on Example 1, such as Figure 2 As shown, the present invention also discloses a CPU heat dissipation module installation status detection system, including: a detection unit 1, a power control unit 2, a reminder unit 3, and an identification unit 4.

[0067] Detection unit 1 is used to detect whether the pin impedance of each CPU on the motherboard is abnormal via CPLD. Specifically, detection unit 1 is used to: collect the pin impedance value of each CPU on the motherboard via CPLD; determine whether the collected pin impedance values ​​are all less than a preset impedance threshold; if so, the server system boots up normally; if not, the pin impedance is abnormal.

[0068] Power control unit 2 is used to shut down the main power supply to the motherboard. Specifically, power control unit 2 is used to disable the PS_ON option in the BIOS via the CPLD, preventing the server system from booting.

[0069] The reminder unit 3 is used to activate the CPU cooling module abnormality reminder mechanism. Specifically, the reminder unit 3 is used to: send a pin impedance abnormality notification command to the BMC, activate the CPU cooling module abnormality reminder function, and control the preset red warning light and UID light on the motherboard to remain constantly lit.

[0070] Identification unit 4 is used to identify pins with abnormal impedance via the CPLD. Specifically, identification unit 4 is used to: send a pin impedance abnormality confirmation command to the CPLD, and identify the pin with abnormal impedance according to the command.

[0071] This embodiment provides a CPU heatsink module installation status detection system. By detecting and monitoring the CPU boundary pin impedance after proper assembly of the CPU and heatsink module on each motherboard, when an abnormal CPU heatsink module connection is detected, a timely warning mechanism is activated. This is indicated by the system failing to power on, a constantly lit red warning light near each CPU processor on the motherboard, and a constantly lit startup UID light. The system then notifies the operator and simultaneously sends feedback to the CPLD for anomaly identification. This system can improve the performance, protection, safety, and reliability of CPU processors and heatsink modules.

[0072] Example 3:

[0073] This embodiment discloses a CPU heat dissipation module installation status detection device, including a processor and a memory; wherein, when the processor executes the CPU heat dissipation module installation status detection program stored in the memory, it performs the following steps:

[0074] 1. Use the CPLD to detect whether the pin impedance of each CPU on the motherboard is abnormal. If yes, proceed to step 2; if no, proceed to step 3.

[0075] 2. The server system boots up normally; the test is complete.

[0076] 3. Immediately turn off the main power supply to the motherboard.

[0077] 4. Enable the CPU cooling module abnormality alert mechanism.

[0078] 5. Use a CPLD to identify pins with abnormal impedance.

[0079] Furthermore, the CPU heat dissipation module installation status detection device in this embodiment may also include:

[0080] The input interface is used to acquire the CPU cooling module installation status detection program imported from the outside and save the acquired CPU cooling module installation status detection program to the memory. It can also be used to acquire various instructions and parameters transmitted from external terminal devices and transmit them to the processor so that the processor can perform corresponding processing using these instructions and parameters. In this embodiment, the input interface may specifically include, but is not limited to, a USB interface, a serial interface, a voice input interface, a fingerprint input interface, a hard disk read interface, etc.

[0081] An output interface is used to output various data generated by the processor to connected terminal devices, so that other terminal devices connected to the output interface can obtain the various data generated by the processor. In this embodiment, the output interface may include, but is not limited to, a USB interface, a serial interface, etc.

[0082] A communication unit is used to establish a remote communication connection between the CPU cooling module installation status detection device and an external server, so that the CPU cooling module installation status detection device can mount the image file to the external server. In this embodiment, the communication unit may include, but is not limited to, a remote communication unit based on wireless communication technology or wired communication technology.

[0083] The keyboard is used to acquire various parameter data or commands input by the user through real-time keystrokes.

[0084] The monitor is used to display relevant information in real time regarding the process of locating a short circuit in the server's power supply line.

[0085] A mouse can be used to assist users in inputting data and simplifying user operations.

[0086] This embodiment provides a CPU heatsink module installation status detection device. By detecting whether the pin impedance of each CPU on the motherboard is abnormal, it can determine whether the heatsink module is improperly installed. Upon confirming an anomaly, it provides an anomaly alert and label, ensuring that operators can promptly troubleshoot the problem, thereby improving troubleshooting efficiency.

[0087] Example 4:

[0088] This embodiment also discloses a readable storage medium, which includes random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable hard disk, CD-ROM, or any other form of storage medium known in the art. The readable storage medium stores a CPU heat dissipation module installation status detection program, which, when executed by the processor, performs the following steps:

[0089] 1. Use the CPLD to detect whether the pin impedance of each CPU on the motherboard is abnormal. If yes, proceed to step 2; if no, proceed to step 3.

[0090] 2. The server system boots up normally; the test is complete.

[0091] 3. Immediately turn off the main power supply to the motherboard.

[0092] 4. Enable the CPU cooling module abnormality alert mechanism.

[0093] 5. Use a CPLD to identify pins with abnormal impedance.

[0094] This embodiment provides a readable storage medium that detects abnormalities in the pin impedance of each CPU on the motherboard to determine if the heat dissipation module is improperly installed. Upon confirming an anomaly, it provides an alert and flag, ensuring timely troubleshooting by operators and improving troubleshooting efficiency.

[0095] In summary, this invention can promptly detect CPU cooling module malfunctions caused by improper installation, thus improving troubleshooting efficiency.

[0096] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The methods disclosed in the embodiments are described simply because they correspond to the systems disclosed in the embodiments; relevant details can be found in the method section.

[0097] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0098] In the embodiments provided by this invention, it should be understood that the disclosed systems, methods, and approaches can be implemented in other ways. For example, the system embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between systems or units may be electrical, mechanical, or other forms.

[0099] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0100] In addition, the functional modules in the various embodiments of the present invention can be integrated into one processing unit, or each module can exist physically separately, or two or more modules can be integrated into one unit.

[0101] Similarly, in the various embodiments of the present invention, each processing unit can be integrated into a functional module, or each processing unit can exist physically, or two or more processing units can be integrated into a functional module.

[0102] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0103] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0104] The CPU heat dissipation module installation status detection method, system, device, and readable storage medium provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make several improvements and modifications to this invention without departing from the principles of this invention, and these improvements and modifications also fall within the protection scope of the claims of this invention.

Claims

1. A method for detecting the installation status of a CPU heat dissipation module, characterized in that, include: The CPLD is used to detect whether the pin impedance of each CPU on the motherboard is abnormal. If any abnormality is detected, immediately turn off the main power supply to the motherboard; Activate the CPU cooling module malfunction alert mechanism; Pins with abnormal impedance are identified using a CPLD; The method of detecting whether the pin impedance of each CPU on the motherboard is abnormal via CPLD includes: The pin impedance values ​​of each CPU on the motherboard are acquired using a CPLD. Determine whether the collected pin impedance values ​​are all less than the preset impedance threshold; If yes, the server system boots up normally; if not, there is an abnormality in the pin impedance. The process of shutting down the main power supply to the motherboard includes: By setting PS_ON in the BIOS option to Disable using CPLD, the server system cannot be booted. To determine the impedance threshold, the CPU processor of the motherboard to be tested needs to be determined in advance. After the heat dissipation module is correctly assembled by applying thermal paste or installing thermal pads, the impedance threshold of the CPU boundary pins is determined by measurement, and the measured impedance threshold is collected into a database for the determination of pin impedance anomalies. The abnormal activation alert mechanism for the CPU cooling module includes: Send a pin impedance abnormality notification command to the BMC to activate the CPU heat dissipation module abnormality reminder function and control the preset red warning light and UID light on the motherboard to keep them constantly lit.

2. The CPU heat dissipation module installation status detection method according to claim 1, characterized in that, The identification of pins with impedance abnormalities via CPLD includes: Send a pin impedance abnormality confirmation command to the CPLD, and mark the pin with abnormal impedance according to the command.

3. The CPU heat dissipation module installation status detection method according to claim 1, characterized in that, When there is an abnormality in the pin impedance, the value of the DET_CPU_BPRC instruction will be set to 1.

4. A CPU heat dissipation module installation status detection system, characterized in that, include: The detection unit is used to detect whether the pin impedance of each CPU on the motherboard is abnormal via the CPLD. The power control unit is used to shut down the main power supply to the motherboard. The alert unit is used to activate the CPU cooling module abnormality alert mechanism; The identification unit is used to identify pins with abnormal impedance via the CPLD; The detection unit is specifically used for: The pin impedance values ​​of each CPU on the motherboard are acquired using a CPLD. Determine whether the collected pin impedance values ​​are all less than the preset impedance threshold; If so, the server system boots up normally; If not, then there is an abnormality in the pin impedance; The process of shutting down the main power supply to the motherboard includes: By setting PS_ON in the BIOS option to Disable using CPLD, the server system cannot be booted. To determine the impedance threshold, the CPU processor of the motherboard to be tested needs to be determined in advance. After the heat dissipation module is correctly assembled by applying thermal paste or installing thermal pads, the impedance threshold of the CPU boundary pins is determined by measurement, and the measured impedance threshold is collected into a database for the determination of pin impedance anomalies. The abnormal activation alert mechanism for the CPU cooling module includes: Send a pin impedance abnormality notification command to the BMC to activate the CPU heat dissipation module abnormality reminder function and control the preset red warning light and UID light on the motherboard to keep them constantly lit.

5. A CPU heat dissipation module installation status detection device, characterized in that, include: Memory, used to store the CPU heat dissipation module installation status detection program; A processor, configured to perform the CPU heat dissipation module installation status detection method as described in any one of claims 1 to 3 when executing the CPU heat dissipation module installation status detection program.

6. A readable storage medium, characterized in that: The readable storage medium stores a CPU heat dissipation module installation status detection program, which, when executed by a processor, implements the steps of the CPU heat dissipation module installation status detection method as described in any one of claims 1 to 3.

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