Display panel and display device

Abstract

The present application provides a display panel and a display device, wherein the display panel includes a functional area, a packaging area surrounding the functional area, and a display area surrounding the packaging area; the display panel includes at least one winding, and the winding is arranged in the display area; the winding includes a first routing portion and a second routing portion extending in the same direction and separated by the functional area and the packaging area, and a winding portion connecting the first routing portion and the second routing portion; the first routing portion and the second routing portion are arranged in the same layer, the winding portion and the first routing portion are arranged in different layers, and the projection of the winding portion in the thickness direction of the display panel falls within the projection of other metal layers in the display panel that are arranged in different layers from the winding portion in the thickness direction of the display panel. The present application arranges the winding portion in the display area, narrowing the border width of the functional area, and at the same time, the winding portion of the present application is arranged corresponding to other metal layers, improving the phenomenon of display unevenness (mura).

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In order to increase the screen-to-body ratio of mobile electronic terminals (especially mobile phones), the prior art usually sets a hole-punch area in the display screen to set functional components such as cameras in the display area. However, after setting the hole-punch area, a border area usually needs to be set at the edge of the hole-punch area to accommodate the winding portion and packaging structure of the data cable, resulting in a larger border area. For this reason, some technicians have proposed to set the winding portion of the data cable in the display area to reduce the border area of ​​the hole-punch area. However, after setting the winding portion of the data cable in the display area, the patterned structure of the metal layer where the data cable is located will be different in the position of the display area close to the hole-punch area and the position far away from the hole-punch area, and the difference will cause the display of the display panel to be uneven (mura). Summary of the invention

[0003] In view of this, the present application provides a new display panel and a display device, which are used to reduce the border area of ​​the hole area and improve the technical phenomenon of uneven display of the display panel.

[0004] The technical solutions provided by this application are as follows:

[0005] The present application provides a display panel, which includes a functional area, a packaging area surrounding the functional area, and a display area surrounding the packaging area; the display panel includes at least one winding, and the winding is arranged in the display area; the winding includes a first routing portion and a second routing portion extending in the same direction and separated by the functional area and the packaging area, and a winding portion connecting the first routing portion and the second routing portion; the first routing portion and the second routing portion are arranged in the same layer, the winding portion and the first routing portion are arranged in a different layer, and the projection of the winding portion in the thickness direction of the display panel falls within the projection of other metal layers in the display panel that are arranged in a different layer from the winding portion in the thickness direction of the display panel.

[0006] Furthermore, the display panel also includes: a substrate; a driving circuit layer, arranged on one side of the substrate; a first metal layer, arranged on the side of the driving circuit layer facing away from the substrate; and a second metal layer, arranged on the side of the first metal layer facing away from the substrate; wherein the winding portion is arranged on the first metal layer, and the orthographic projection of the winding portion on the substrate falls within the orthographic projection of the driving circuit layer and the second metal layer on the substrate.

[0007] Furthermore, the winding portion includes a first connecting line extending along a first direction and a second connecting line extending along a second direction, the first connecting line and the second connecting line are connected end to end at two ends thereof respectively to the first routing portion and the second routing portion, the orthographic projection of the first connecting line on the substrate falls within the orthographic projection of the driving circuit layer on the substrate, and the orthographic projection of the second connecting line on the substrate falls within the orthographic projection of the second metal layer on the substrate

[0008] Furthermore, the display panel further comprises a reset signal line, the reset signal line is arranged in the driving circuit layer, and the orthographic projection of the first connecting line on the substrate falls within the orthographic projection of the reset signal line on the substrate.

[0009] Furthermore, the display panel also includes a power signal line, and the power signal line is arranged in the second metal layer, and the orthographic projection of the second connection line on the substrate falls within the orthographic projection of the power signal line on the substrate. Further, the reset signal line includes a first reset signal line and a second reset signal line, and in the display area, the display panel also includes a plurality of light-emitting devices and a plurality of driving thin film transistors arranged in the driving circuit layer, the first reset signal line is electrically connected to the gate of the driving thin film transistor, and the second reset signal line is electrically connected to the anode of the light-emitting device. Further, in the display area, the driving circuit layer includes the gate and source-drain layer of the driving thin film transistor, the first reset signal line is arranged in the same layer as the gate of the driving thin film transistor, and the second reset signal line is arranged in the same layer as the source-drain layer.

[0010] Further, an orthographic projection of the first connecting line on the substrate falls within an orthographic projection of the first reset signal line on the substrate.

[0011] Furthermore, in the display area, the display panel also includes a pixel definition layer, the pixel definition layer includes a first pixel definition layer and a second pixel definition layer which are stacked, the first pixel definition layer is arranged on the anode of the light-emitting device, the second pixel definition layer is arranged on the side of the first pixel definition layer facing away from the substrate, and the first pixel definition layer is black; a plurality of pixel openings are provided on the pixel definition layer, the pixel openings penetrate the second pixel definition layer and at least part of the first pixel definition layer to expose the anode, each of the light-emitting devices includes a light-emitting structure, the light-emitting structure is arranged in the corresponding pixel opening and located on the corresponding anode.

[0012] Furthermore, the winding portion is connected to the first routing portion and the second routing portion through a via hole, and the via hole is located at the junction of the display area and the packaging area.

[0013] Furthermore, the display area includes a pixel light-emitting area and a transition area, the transition area is arranged between the pixel light-emitting area and the packaging area, and the via hole is located in the transition area.

[0014] Furthermore, the winding portion is arranged in a position of the display area close to the packaging area. In the display area, the display panel also includes a plurality of pixel units, and the number of the winding portions arranged in a single pixel unit close to the packaging area is 1, 2, 3 or 4.

[0015] Furthermore, the winding portion is arranged in a position of the display area close to the packaging area, and in the display area, the display panel also includes a plurality of pixel units, and the number of the first connecting lines arranged in a single pixel unit close to the packaging area is 1, 2, 3 or 4, and the number of the second connecting lines arranged in a single pixel unit close to the packaging area is 1, 2, 3 or 4.

[0016] Further, the number of the first connection lines arranged in a single pixel unit close to the encapsulation area is one, and the number of the second connection lines arranged in a single pixel unit close to the encapsulation area is two.

[0017] Furthermore, the display panel also includes conventional data lines and conventional scan lines, the conventional data lines are arranged in the second metal layer, and the conventional scan lines are arranged on the same layer as the gate in the driving circuit layer; the windings are data windings and / or scan windings, the first routing portion and the second routing portion of the data winding are arranged on the same layer as the conventional data lines, and the first routing portion and the second routing portion of the scan winding are arranged on the same layer as the conventional scan lines.

[0018] Furthermore, the display panel includes at least one data winding and at least one scan winding, and the area where the winding portion of the scan winding is located is located on a side of the area where the winding portion of the data winding is located close to the packaging area.

[0019] Furthermore, the display panel also includes: an inorganic layer, arranged on one side of the substrate, and at least arranged in the packaging area; and a packaging base, arranged on the side of the inorganic layer facing away from the substrate, located in the packaging area, and surrounding the functional area; wherein the packaging base is made of metal material, and a plurality of grooves are provided on the packaging base, which surround the functional areas in sequence, each of the grooves passes through the packaging base, and the plurality of grooves separate the packaging base into a plurality of protrusions, and the protrusions form an undercut structure at the grooves.

[0020] Furthermore, the packaging substrate is a Ti-Al-Ti stacked structure, each of the grooves penetrates the Ti-Al-Ti stacked structure in the stacking direction of the Ti-Al-Ti stacked structure to separate it into a plurality of Ti-Al-Ti stacked protrusions, and the Al layer in each of the Ti-Al-Ti stacked protrusions is retracted at the groove compared to the Ti layer facing away from the substrate to form the undercut structure.

[0021] Furthermore, the packaging substrate further comprises a padding layer, wherein the padding layer is disposed between the inorganic layer and the Ti—Al—Ti laminated structure, and a material of the padding layer is different from a material of the Ti—Al—Ti laminated structure.

[0022] The present application also provides a display device, which includes a housing and the above-mentioned display panel, wherein the display panel is accommodated in the housing.

[0023] The beneficial effects of this application are:

[0024] The present application achieves the purpose of narrowing the border width of the functional area by arranging the winding in the display area. At the same time, the present application arranges the winding portion to correspond to other metal layers. In this way, in terms of the visible viewing angle of the display panel, even if the winding portion is arranged in the display area, it will not cause the patterned structure of the metal layer in the display area to be different between the position close to the functional area and the position far from the functional area, thereby effectively improving the display unevenness (mura) phenomenon caused by the winding portion being arranged in the display area in the prior art.

[0025] Furthermore, the present application sets the winding part corresponding to the reset signal line and the power signal line, and the reset signal line and the power signal line are both connected to constant signals, thereby reducing the interference of the winding part on other signals.

[0026] Furthermore, the present application further improves the phenomenon of display unevenness (mura) by dividing the pixel definition layer into two stacked layers and making the first pixel definition layer a black pixel definition layer.

[0027] Furthermore, the present application arranges a packaging substrate of a metal material on the inorganic layer, arranges a groove on the packaging substrate, and forms an undercut structure at the groove. In this way, when the light-emitting device is subsequently prepared, the evaporated organic functional layer will be disconnected at the undercut structure to prevent water and oxygen from entering the display area from the functional area along the organic functional layer; at the same time, when the packaging material is subsequently deposited to achieve the packaging of the functional area, compared with the prior art in which the packaging material directly contacts the organic matter, the packaging material of the present application directly contacts the inorganic and metal materials, which can avoid the invasion of water and oxygen in the organic matter and enhance the water and oxygen resistance of the packaging structure, thereby effectively improving the packaging effect and improving the phenomenon of black rings easily appearing around the holes due to the invasion of water and oxygen.

[0028] Furthermore, the present application can effectively increase the thickness of the packaging substrate, that is, increase the thickness of the protrusion, by adding the padding layer between the inorganic layer and the metal laminate structure. Since the packaging effect of the packaging structure is also related to the length of the water and oxygen invasion path, when the thickness of the protrusion increases, the number of the protrusions can be appropriately reduced without affecting the packaging effect, and then the width of the packaging area can be appropriately reduced to achieve the purpose of narrowing the border width of the functional area. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 Schematic diagram of a top view of a display panel in an embodiment of the present application.

[0031] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the display panel along AA is shown in FIG.

[0032] Figure 3 yes Figure 2 A schematic diagram of the film layer structure of the display area of ​​the display panel is shown in FIG.

[0033] Figure 4 yes Figure 3 A plan view schematically showing the winding of a display panel is shown in FIG.

[0034] Figure 5 yes Figure 3 Another plan view schematically showing the winding of the display panel is shown in FIG.

[0035] Figure 6 yes Figure 3A plan view showing the wiring of the display panel and the reset signal line is shown in FIG.

[0036] Figure 7 yes Figure 3 A schematic plan view of the packaging area of ​​a display panel is shown in FIG.

[0037] Description of reference numerals:

[0038]

[0039]

[0040]

[0041] Specific embodiments

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0043] See also Figure 1 and Figure 2 The present application provides a display panel 100, which includes a functional area 101, a packaging area 102 surrounding the functional area 101, and a display area 103 surrounding the functional area 101. The display area 103 is used to display images, and the functional area 101 can be located in any area of ​​the display panel 100, for example, the functional area 101 can be located in the middle area or edge area of ​​the display panel 100. The functional area 101 is provided with a through hole, which runs through each film layer of the display panel 100. Functional elements such as an earpiece, a camera, and various sensors can be placed in the through hole to realize functions such as an under-screen camera and an under-screen fingerprint, thereby improving the screen-to-body ratio of the display panel 100. The packaging area 102 is located between the functional area 101 and the display area 103, and is mainly used to set a packaging structure to avoid affecting the packaging effectiveness of the display panel 100 due to the setting of the functional area 101.

[0044] The display panel 100 also includes an inorganic layer 20 arranged on one side of the substrate 10, a first stack 30 arranged on a side of the inorganic layer 20 away from the substrate 10, a driving circuit layer arranged in the first stack 30, a second stack 40 arranged on a side of the first stack 30 away from the substrate 10, and a packaging base 50 arranged on a side of the inorganic layer 20 away from the substrate 10.

[0045] Optionally, the substrate 10 may be a rigid substrate or a flexible substrate; when the substrate 10 is a rigid substrate, it may include a rigid substrate such as a glass substrate; when the substrate 10 is a flexible substrate, it may include a flexible substrate such as a polyimide (PI) film, an ultra-thin glass film, etc. A flexible display panel may be manufactured using a flexible substrate as the substrate 10 to achieve special properties such as bending and curling of the display panel 100. In this embodiment, the substrate 10 uses a PI film and includes a stacked first substrate 11 and a second substrate 12.

[0046] The inorganic layer 20 is coated on the substrate 10, specifically, the inorganic layer 20 is coated on the second substrate 12. The material of the inorganic layer 20 may include inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON). The inorganic layer 20 can further prevent undesirable impurities or pollutants (such as moisture, oxygen, etc.) from diffusing from the substrate 10 to the internal devices of the display panel 100, and can also provide a flat top surface.

[0047] The first stack 30 and the second stack 40 are arranged in the display area 103, and extend from the display area 103 to part of the packaging area 102. In this embodiment, the first stack 30 includes an insulating layer stacked on the inorganic layer 20. The number of layers of the insulating layer and the function of each layer can be changed according to the metal film layer of the display area and actual needs, that is, the structure of the first stack 30 is designed according to the specific structure and needs of the driving circuit layer, which will be described in detail later. The second stack 40 includes a planarization layer stacked on the insulating layer. Similarly, the number of layers of the planarization layer and the function of each planarization layer can be changed according to the metal film layer of the display area and actual needs, which will be described in detail later.

[0048] The display panel 100 includes at least one winding, and the winding is arranged in the display area 103. The winding includes a first wiring portion and a second wiring portion extending in the same direction and separated by the functional area 101 and the packaging area 102, and a winding portion connecting the first wiring portion and the second wiring portion; the first wiring portion and the second wiring portion are arranged in the same layer, the winding portion and the first wiring portion are arranged in a different layer, and the projection of the winding portion in the thickness direction of the display panel falls within the projection of other metal layers in the display panel 100 that are arranged in a different layer from the winding portion in the thickness direction of the display panel 100.

[0049] The winding can be a data winding or a scan winding, or can include both a data winding and a scan winding, wherein the first routing portion and the second routing portion of the data winding are arranged on the same layer as a conventional data line, and the first routing portion and the second routing portion of the scan winding are arranged on the same layer as a conventional scan line.

[0050] For the sake of clarity, this embodiment is described by taking the winding as a data winding, and specifically describing mainly the film layer structure of the display panel 100 in the display area 103 .

[0051] See also Figures 3 to 6 In this embodiment, in the display area 103, the display panel 100 further includes a first metal layer 907 disposed on the side of the aforementioned driving circuit layer facing away from the substrate 10 and a second metal layer 908 disposed on the side of the first metal layer 907 facing away from the substrate 10. The display panel 100 further includes a plurality of data lines 80 and a reset signal line 909 disposed on one side of the substrate 10, wherein the reset signal line 909 is disposed on the reset signal line in the aforementioned driving circuit layer. The plurality of data lines 80 include a plurality of conventional data lines 81 and at least one data winding line 82, wherein the conventional data lines 81 and the data winding line 82 are disposed in the display area 103. The data winding line 82 includes a first routing portion 821 and a second routing portion 822 extending in the same direction and separated by the packaging area 102, and a winding portion 823 connecting the first routing portion 821 and the second routing portion 822. The extending direction of the conventional data line 81 is the same as the extending direction of the first routing portion 821 and the second routing portion 822. The conventional data line 81, the first routing portion 821 and the second routing portion 822 are provided on the second metal layer 908, and the winding portion 823 is provided on the first metal layer 907 and is located in the display area 103 near the packaging area 102. The orthographic projection of the winding portion 823 on the substrate 10 falls within the orthographic projection of the second metal layer 908 and the reset signal line 909 on the substrate 10.

[0052] Specifically, in this embodiment, the reset signal line 909 is disposed between the inorganic layer 20 and the second stacked layer 40 , and the first metal layer 907 and the second metal layer 908 are disposed in the second stacked layer 40 .

[0053] In this embodiment, the purpose of narrowing the border width of the functional area 101 is achieved by setting the winding portion 823 of the data winding 82 of the data line 80 in the display area 103. At the same time, the present application is set so that the orthographic projection of the winding portion 823 on the substrate 10 falls within the orthographic projection of the second metal layer 908 and the reset signal line 909 on the substrate 10. In this way, in the visible viewing angle of the display panel 100, even if the winding portion 823 is set in the display area 103, it will not cause the patterned structure of the metal layer where the data line 81 is located to be different between the position of the display area 103 close to the functional area 101 and the position far away from the functional area 101, thereby effectively improving the display unevenness (mura) phenomenon caused by the winding portion 823 being set in the display area 103 in the prior art.

[0054] Preferably, the connection point between the winding portion 823 and the first routing portion 821 and the second routing portion 822 is located at the junction of the display area 103 and the packaging area 102. Specifically, in the display area 103, an insulating layer is provided between the first metal layer 907 and the second metal layer 908, and a via 401 is provided on the insulating layer. The via 401 is located at the junction of the display area 103 and the packaging area 102, and the winding portion 823 is connected to the first routing portion 821 and the second routing portion 822 through the via 401.

[0055] Specifically, in this embodiment, the display area 103 includes a pixel light-emitting area 1031 and a transition area 1032, and the transition area 1032 is provided between the pixel light-emitting area 1031 and the encapsulation area 102. The pixel light-emitting area 1031 refers to the area where the light-emitting structure in the display area 103 is located. The structure in the transition area 1032 is used to transition between the encapsulation structure of the encapsulation area 102 and the structure in the pixel light-emitting area 1031. It can be understood that the width of the transition area 1032 is very small, which can basically be equivalent to the junction position of the display area 103 and the encapsulation area 102.

[0056] Preferably, the connection point between the winding portion 823 and the first routing portion 821 and the second routing portion 822 is located in the transition area 1032, that is, the via 401 is located in the transition area 1032. Figure 5It is understandable that in other embodiments, the via hole 401 may also be located in the pixel light emitting area 1031 .

[0057] Preferably, the winding portion 823 includes a first connecting line 8231 extending along a first direction and a second connecting line 8232 extending along a second direction, and the first connecting line 8231 and the second connecting line 8232 are connected end to end to the first routing portion 821 and the second routing portion 822 respectively. Figures 4 to 6 In this embodiment, the winding portion 823 includes two sections of first connecting wires 8231 extending along the first direction and one section of second connecting wires 8232 extending along the second direction, the two sections of the first connecting wires 8231 respectively connect the first routing portion 821 and the second routing portion 822, and the second connecting wire 8232 connects the two sections of the first connecting wires 8231. The orthographic projection of the first connecting wire 8231 on the substrate 10 falls within the orthographic projection of the reset signal line 909 on the substrate 10; the orthographic projection of the second connecting wire 8232 on the substrate 10 falls within the orthographic projection of the second metal layer 908 on the substrate 10.

[0058] In this embodiment, from the use state of the display panel 100, the first direction is horizontal and the second direction is vertical. That is, the horizontal part of the winding part 823 is arranged directly above the reset signal line 909, and the vertical part of the winding part 823 is hidden under the second metal layer 908.

[0059] Since the lateral part of the reset signal line 909 is of fixed design, it is only necessary to set the winding part 823 accordingly. At the same time, since the reset signal line 909 is connected to a constant signal, when the first connecting line 8231 is set just above the reset signal line 909, its interference with other signals can be reduced.

[0060] Preferably, the second metal layer 908 further includes a power signal line 9081, and the orthographic projection of the second connection line 8232 on the substrate 10 falls within the orthographic projection of the power signal line 9081 on the substrate 10. Since the power signal line 9081 is connected to a constant signal, when the second connection line 8232 is hidden under the power signal line 9081, its interference with other signals can be reduced.

[0061] Further, in the display area 103, the display panel 100 further includes a plurality of pixel units arranged in an array. The winding portion 823 is arranged at a position of the display area 103 close to the encapsulation area 102. The number of the winding portions 823 arranged in a single pixel unit close to the encapsulation area 102 is 1, 2, 3 or 4. Specifically, the number of the first connection lines 8231 arranged in a single pixel unit close to the encapsulation area 102 is 1, 2, 3 or 4, and the number of the second connection lines 8232 arranged in a single pixel unit close to the encapsulation area 102 is 1, 2, 3 or 4.

[0062] It can be understood that the number of the winding parts 823 in a single pixel unit can be changed according to actual design requirements. When the plane space of the display area 103 around the functional area 101 is large enough, it is preferred to set one winding part 823 in a single pixel unit to reduce the interference of the winding part 823 on other signal lines; when the plane space of the display area 103 around the functional area 101 is limited, it is preferred to set at least two winding parts 823 in a single pixel unit to give priority to functional design. That is, the area of ​​the area in the display area 103 for setting the winding part 823 can be designed and changed according to actual conditions.

[0063] Specifically, in this embodiment, the number of the first connection line 8231 set in the single pixel unit close to the encapsulation area 102 is 1, and the number of the second connection line 8232 set in the single pixel unit close to the encapsulation area 102 is 2. Figure 5 and Figure 6 shown.

[0064] Furthermore, in this embodiment, in the display area 103, the display panel 100 further includes a plurality of thin film transistors 90 disposed on the inorganic layer 20 and a plurality of light emitting devices 70 disposed on the second stack 40. The film layer structure of the plurality of thin film transistors 90 together constitutes a driving circuit layer.

[0065] Each of the thin film transistors 90 includes a semiconductor 91, a gate 92, a source 93 and a drain 94. The semiconductor 91 includes a channel region 911 and a source region 912 and a drain region 913 located on both sides of the channel region 911. In the same thin film transistor 90, the gate 92 is arranged corresponding to the channel region 911, the source 93 is electrically connected to the source region 912, and the drain is electrically connected to the drain region 913.

[0066] It can be understood that the type and function of the thin film transistor 90 can be designed differently according to actual needs. For example, in the present embodiment, the plurality of thin film transistors 90 include at least one first thin film transistor T1, one second thin film transistor T2 and one third thin film transistor T3. The first thin film transistor T1 adopts a double top gate structure and is electrically connected to the light emitting device 70; the second thin film transistor T2 adopts a top gate + bottom gate structure, and the source of the second thin film transistor T2 is electrically connected to the drain of the first thin film transistor T1; the third thin film transistor T3 adopts a single top gate structure, and the third thin film transistor T3 is electrically connected to the data line.

[0067] In order to set the above-mentioned thin film transistor 90, in this embodiment, the driving circuit layer of the display panel 100 includes a first active layer 901, a second active layer 902, a first gate layer 903, a second gate layer 904, a third gate layer 905 and a source-drain layer 906. Specifically, the first active layer 901 is provided on the inorganic layer 20, and the semiconductor of the first thin film transistor T1 and the semiconductor of the third thin film transistor T3 are both located in the first active layer 901; the first gate layer 903 and the second gate layer 904 are sequentially provided on the side of the first active layer 901 facing away from the inorganic layer 20, the first gate and the second gate of the first thin film transistor T1 are respectively located in the first gate layer 903 and the second gate layer 904, the bottom gate of the second thin film transistor T2 is located in the second gate layer 904, and the top gate of the third thin film transistor T3 is located in the first gate layer 903; The second active layer 902 is arranged on the side of the second gate layer 904 facing away from the inorganic layer 20, and the semiconductor of the second thin film transistor T2 is located in the second active layer 902; the third gate layer 905 is arranged on the side of the second active layer 902 facing away from the inorganic layer 20, and the top gate of the second thin film transistor T2 is located in the third gate layer 905; the source and drain layer 906 is arranged on the side of the third gate layer 905 facing away from the inorganic layer 20, and the source and drain of the first thin film transistor T1, the source and drain of the second thin film transistor T2, and the source and drain of the third thin film transistor T3 are all located in the source and drain layer 906.

[0068] The film structure of the first stacked layer 30 is arranged correspondingly according to the film structure of the plurality of thin film transistors 90, i.e., the aforementioned driving circuit layer. To correspond to the structural arrangement of the thin film transistors 90 described above, in this embodiment, the first stacked layer 30 includes a first gate insulating layer 31, a second gate insulating layer 32, a first interlayer insulating layer 33, a third gate insulating layer 34, and a second interlayer insulating layer 35 which are sequentially stacked on the inorganic layer 20. Specifically, the first gate insulating layer 31 is arranged on the inorganic layer 20 and separates the first gate layer 903 and the first active layer 901; the second gate insulating layer 32 is arranged on the first gate insulating layer 31 and separates the second gate layer 904 and the first gate layer 903; the first interlayer insulating layer 33 is arranged on the second gate insulating layer 32 and separates the second active layer 902 and the second gate layer 904; the third gate insulating layer 34 is arranged on the first interlayer insulating layer 33 and separates the third gate layer 905 and the second active layer 902; the second interlayer insulating layer 35 is arranged on the third gate insulating layer 34 and separates the source-drain layer 906 and the third gate layer 905.

[0069] In order to correspond to the structural arrangement of the data line 80, in this embodiment, the second stack 40 includes a first flat layer 41, an insulating layer 42, and a second flat layer 43. Specifically, the first flat layer 41 is arranged on the side of the second interlayer insulating layer 35 of the first stack 30 facing away from the substrate 10 and is separated from the first metal layer 907 and the source-drain electrode layer 906; the insulating layer 42 is arranged on the side of the first flat layer 41 facing away from the substrate 10 and is separated from the second metal layer 908 and the first metal layer 907; the second flat layer 43 is arranged on the side of the insulating layer 42 facing away from the substrate 10 and covers the second metal layer 908. The insulating layer 42 can be organic or inorganic, and the via 401 penetrates the insulating layer 42.

[0070] Each of the light-emitting devices 70 includes an anode 71, a light-emitting structure 72 and a cathode (not shown). The anode 71 is electrically connected to the corresponding first thin film transistor T1, and the light-emitting structure 72 is disposed on the corresponding anode 71. Specifically, the display panel 100 includes an anode layer 701 and a pixel definition layer 702. The anode layer 701 is disposed on the side of the second flat layer 43 of the second stack 40 that faces away from the substrate 10. The pixel definition layer 702 is disposed on the side of the second flat layer 43 and the anode layer 701 that faces away from the substrate 10. A plurality of pixel openings 7020 are provided on the pixel definition layer 702, and the light-emitting structure 72 is disposed in the corresponding pixel openings 7020.

[0071] Preferably, in this embodiment, the pixel definition layer 702 includes a first pixel definition layer 7021 and a second pixel definition layer 7022 which are stacked, the first pixel definition layer 7021 is arranged between the second pixel definition layer 7022 and the second flat layer 43, and the first pixel definition layer 7021 is black to further improve the uneven display phenomenon.

[0072] In order to protect the light-emitting device 70 and prevent the light-emitting device 70 from failing due to water and oxygen intrusion, the display panel 100 further includes an encapsulation layer (not shown), which covers the light-emitting device 70. The encapsulation layer may be encapsulated by thin film, for example, the encapsulation layer may be a laminated structure formed by sequentially stacking three layers of thin film, a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, or a laminated structure of more layers. The material of the organic encapsulation layer includes one or more organic materials such as epoxy and acrylic, and the organic encapsulation layer may be coated on the first inorganic encapsulation layer by one of the coating processes such as inkjet printing (IJP) and spraying.

[0073] Furthermore, in this embodiment, based on functional division, the reset signal line 909 includes a first reset signal line and a second reset signal line, the first reset signal line is electrically connected to the gate of the driving thin film transistor, and is used to reset the potential of the gate of the driving thin film transistor, and the second reset signal line is electrically connected to the anode of the light-emitting device, and is used to reset the potential of the anode of the light-emitting device.

[0074] Specifically, in this embodiment, the first reset signal line is disposed in the same layer as the top gate of the driving thin film transistor (i.e., the first thin film transistor T1), and the second reset signal line is disposed in the same layer as the source-drain electrode layer 906. In this embodiment, the orthographic projection of the first connecting line 8231 on the substrate 10 falls within the orthographic projection of the first reset signal line on the substrate 10.

[0075] Furthermore, in this embodiment, the first metal layer 907 may also include a first lead connecting the thin film transistor 90 and the light emitting device 70 , a second lead connecting the thin film transistor 90 and the data line, and the like.

[0076] It can be understood that in other embodiments, when the winding is a scan winding, the winding portion of the scan winding can be arranged in a manner substantially the same as the winding portion 823 of the aforementioned data winding 82, except that: first, the first routing portion and the second routing portion of the scan winding and the conventional scanning line are arranged on the same layer as the gate of the thin film transistor, such as the conventional scanning line can be arranged in the aforementioned first gate layer 903 and the third gate layer 905; second, because the extension directions of the conventional scanning line and the conventional data line are perpendicular, the winding portion of the scan winding includes a first connecting line extending in a first direction and two second connecting lines extending in a second direction, the two second connecting lines respectively connecting the first routing portion and the second routing portion, and the first connecting line connects the two second connecting lines.

[0077] It can be understood that in other embodiments, the winding may also include the aforementioned data winding 82 and scan winding at the same time. When the winding includes the data winding 82 and the scan winding at the same time, the winding portion of the scan winding and the winding portion of the data winding may be arranged in partitions, and the two do not overlap / interlace with each other. Specifically, the area where the winding portion of the scan winding is located may be located on one side of the area where the winding portion 823 of the data winding is located, close to the packaging area 102.

[0078] In addition, in the prior art, the frame package of the hole-digging area is formed by depositing a packaging material on a packaging substrate, and the packaging substrate is an undercut structure formed by etching a substrate and an inorganic layer on the substrate. Since the substrate generally adopts a flexible substrate such as a polyimide (PI) film, an ultra-thin glass film, etc., the packaging material of the packaging structure is in direct contact with organic matter, and the water and oxygen resistance is insufficient. After water and oxygen invade, black rings are easily formed around the hole. Therefore, in order to improve the water and oxygen resistance of the frame package of the hole-digging area of ​​the existing display device, the present application further designs the packaging area 102 of the display panel 100 on the basis of the above.

[0079] The film structure of the display panel 100 in the packaging area 102 will be described in detail below.

[0080] See also Figure 2 and Figure 7 , the packaging substrate 50 is located in the packaging area. Specifically, in the packaging area, the packaging substrate 50 is provided with a plurality of grooves 501 which surround the functional area 101 in sequence, each of the grooves 501 passes through the packaging substrate 50, and the plurality of grooves 501 separate the packaging substrate 50 into a plurality of protrusions 502, and the protrusions 502 form undercut structures 503 at the grooves 501.

[0081] In the present application, a packaging substrate 50 made of a metal material is arranged on the inorganic layer 20, a groove 501 is arranged on the packaging substrate 50, and an undercut structure 503 is formed at the groove 501. In this way, when the light-emitting device is subsequently prepared, the evaporated organic functional layer will be disconnected at the undercut structure 503 to prevent water and oxygen from entering the display area 103 from the functional area 101 along the organic functional layer; at the same time, when the packaging material (not shown) is subsequently deposited to realize the packaging of the functional area 101, compared with the prior art in which the packaging material directly contacts the organic matter, the packaging material of the present application directly contacts the inorganic matter and the metal material, which can prevent the invasion of water and oxygen in the organic matter and enhance the water and oxygen resistance of the packaging structure, thereby effectively improving the packaging effect and improving the phenomenon that black rings are easily formed around the holes due to the invasion of water and oxygen.

[0082] Specifically, experiments have proved that when a display device (such as a mobile phone) using the packaging structure in the prior art is placed at a temperature of 85°C and a humidity of 85% when not in operation, a black ring (i.e., the hole-black ring phenomenon) appears around the functional area 101 after about 120 hours. The display device using the packaging structure of the present application can effectively improve the packaging effect and avoid the hole-black ring phenomenon.

[0083] Preferably, in this embodiment, the package substrate 50 includes a metal stacked structure 51, and the metal stacked structure 51 is a Ti-Al-Ti stacked structure. Each of the grooves 501 penetrates the Ti-Al-Ti stacked structure in the stacking direction of the Ti-Al-Ti stacked structure to separate it into a plurality of Ti-Al-Ti stacked protrusions. The Al layer in each of the Ti-Al-Ti stacked protrusions is retracted at the groove 501 compared to the Ti layer facing away from the substrate 10 to form the undercut structure 503. The metal stacked structure 51 can be obtained by the same process as one / some metal layers in the display area 103 to simplify the process. Specifically, in this embodiment, the metal stacked structure 51 is made of the same material as the second metal layer 908 and is obtained by the same process.

[0084] Preferably, the encapsulation substrate 50 further includes a padding layer 52, and the padding layer 52 is disposed between the inorganic layer 20 and the metal stacked structure 51. The material of the padding layer 52 is different from the material of the metal stacked structure 51. The padding layer 52 can be obtained by the same process as a certain metal layer / layers in the display area 103 to simplify the process. Specifically, in the present embodiment, the padding layer 52 is made of the same material as the gate layer of one of the thin film transistors and is obtained by the same process. Specifically, in the present embodiment, the padding layer 52 is made of the same process as the first gate layer 903 and the second gate layer 904.

[0085] The present application can effectively increase the thickness of the packaging substrate 50, that is, increase the thickness of the protrusion 502, by adding the padding layer 52 between the inorganic layer 20 and the metal laminated structure 51. Since the packaging effect of the packaging structure is also related to the length of the water and oxygen invasion path, when the thickness of the protrusion 502 is increased, the number of the protrusion 502 can be appropriately reduced without affecting the packaging effect, and then the width of the packaging area can be appropriately reduced to achieve the purpose of narrowing the border width of the functional area 101.

[0086] Experiments have shown that in order to ensure the packaging effect, when using the packaging substrate in the prior art, the width of the packaging substrate (the distance from the first protrusion close to the display area to the hole area) needs to be approximately 265um; and when using the packaging substrate 50 of the present application, the width W of the packaging substrate 50 only needs to be 221um, which can effectively narrow the border width of the functional area 101.

[0087] Specifically, in this embodiment, the encapsulation area includes a first encapsulation area 1021 surrounding the functional area 101 and a second encapsulation area 1022 surrounding the first encapsulation area 1021, and a retaining wall 60 is provided between the second encapsulation area 1022 and the first encapsulation area 1021. That is, the retaining wall 60 is provided around the functional area 101 to define the first encapsulation area 1021 between the retaining wall 60 and the functional area, and to define the second encapsulation area 1022 between the retaining wall 60 and the display area 103. The retaining wall 60 is used to assist in the production of the encapsulation structure in the first encapsulation area 1021 and the second encapsulation area 1022. In this embodiment, six protrusions 502 are provided in the first encapsulation area 1021, and the width W1 of each protrusion 502 in the first encapsulation area 1021 is 5 microns, and the width W2 of each groove 501 is 15μm. One protrusion 502 is provided in the second encapsulation area 1022.

[0088] Based on the same application concept, the present application also provides a display device. The display device includes a housing (not shown) and a display panel 100 of the aforementioned embodiment, the housing is formed with a receiving cavity, and the display panel 100 is assembled in the receiving cavity. The display device can be a wearable device, such as a smart bracelet, a smart watch, or a virtual reality (VR) device, or a mobile phone, an e-book, an e-newspaper, a television, or a personal portable computer, or a bendable and foldable flexible OLED display or lighting device. The embodiment of the present application does not specifically limit the specific form of the electronic device.

[0089] In summary, although the present application has been disclosed as above with preferred embodiments, it can be understood that various embodiments can be combined arbitrarily, but the above preferred embodiments are not used to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. A display panel, characterized in that: The display panel includes a functional area, a packaging area surrounding the functional area, and a display area surrounding the packaging area; the display panel includes at least one winding, and the winding is arranged in the display area; the winding includes a first routing portion and a second routing portion extending in the same direction and separated by the functional area and the packaging area, and a winding portion connecting the first routing portion and the second routing portion; the first routing portion and the second routing portion are arranged in the same layer, the winding portion and the first routing portion are arranged in a different layer, and the projection of the winding portion in the thickness direction of the display panel falls within the projection of other metal layers in the display panel that are arranged in a different layer from the winding portion in the thickness direction of the display panel; the display panel also includes a substrate, a driving circuit layer arranged on one side of the substrate, and a driving circuit layer arranged on the driving circuit layer. A first metal layer is provided on the side of the driving circuit layer facing away from the substrate, and a second metal layer is provided on the side of the first metal layer facing away from the substrate, the winding portion is provided on the first metal layer, and the orthographic projection of the winding portion on the substrate falls within the orthographic projection of the driving circuit layer and the second metal layer on the substrate; the display panel also includes a conventional data line and a conventional scanning line, the conventional data line is provided on the second metal layer, and the conventional scanning line is provided on the same layer as the gate in the driving circuit layer; the winding is a data winding and / or a scan winding, the first routing portion and the second routing portion of the data winding are provided on the same layer as the conventional data line, and the first routing portion and the second routing portion of the scan winding are provided on the same layer as the conventional scanning line.

2. The display panel according to claim 1, characterized in that: The winding portion includes a first connecting line extending along a first direction and a second connecting line extending along a second direction, and the first connecting line and the second connecting line are connected end to end at both ends to the first routing portion and the second routing portion respectively, and the orthographic projection of the first connecting line on the substrate falls within the orthographic projection of the driving circuit layer on the substrate, and the orthographic projection of the second connecting line on the substrate falls within the orthographic projection of the second metal layer on the substrate.

3. The display panel according to claim 2, characterized in that: The display panel further includes a reset signal line, which is disposed in the driving circuit layer, and the orthographic projection of the first connecting line on the substrate falls within the orthographic projection of the reset signal line on the substrate.

4. The display panel according to claim 3, characterized in that: The display panel further includes a power signal line, which is disposed on the second metal layer, and the orthographic projection of the second connecting line on the substrate falls within the orthographic projection of the power signal line on the substrate.

5. The display panel according to claim 3, characterized in that: The reset signal line includes a first reset signal line and a second reset signal line. In the display area, the display panel also includes a plurality of light-emitting devices and a plurality of driving thin film transistors arranged in the driving circuit layer. The first reset signal line is electrically connected to the gate of the driving thin film transistor, and the second reset signal line is electrically connected to the anode of the light-emitting device.

6. The display panel according to claim 5, characterized in that: In the display area, the driving circuit layer includes the gate and source-drain electrode layers of the driving thin film transistor, the first reset signal line is arranged in the same layer as the gate of the driving thin film transistor, and the second reset signal line is arranged in the same layer as the source-drain electrode layer.

7. The display panel according to claim 6, characterized in that: The orthographic projection of the first connection line on the substrate falls within the orthographic projection of the first reset signal line on the substrate.

8. The display panel according to claim 5, characterized in that: In the display area, the display panel also includes a pixel definition layer, the pixel definition layer includes a first pixel definition layer and a second pixel definition layer which are stacked, the first pixel definition layer is arranged on the anode of the light-emitting device, the second pixel definition layer is arranged on the side of the first pixel definition layer facing away from the substrate, and the first pixel definition layer is black; a plurality of pixel openings are provided on the pixel definition layer, the pixel openings penetrate the second pixel definition layer and at least part of the first pixel definition layer to expose the anode, each of the light-emitting devices includes a light-emitting structure, the light-emitting structure is arranged in the corresponding pixel opening and located on the corresponding anode.

9. The display panel according to claim 1, characterized in that: The winding portion is connected to the first routing portion and the second routing portion through a via hole, and the via hole is located at the junction of the display area and the packaging area.

10. The display panel according to claim 9, characterized in that: The display area includes a pixel light-emitting area and a transition area, the transition area is arranged between the pixel light-emitting area and the packaging area, and the via hole is located in the transition area.

11. The display panel according to claim 1, characterized in that: The winding portion is arranged in the display area close to the packaging area. In the display area, the display panel also includes a plurality of pixel units. The number of the winding portions arranged in a single pixel unit close to the packaging area is 1, 2, 3 or 4.

12. The display panel according to claim 2, characterized in that: The winding portion is arranged in a position of the display area close to the packaging area. In the display area, the display panel also includes a plurality of pixel units. The number of the first connecting lines arranged in a single pixel unit close to the packaging area is 1, 2, 3 or 4, and the number of the second connecting lines arranged in a single pixel unit close to the packaging area is 1, 2, 3 or 4.

13. The display panel according to claim 12, characterized in that: The number of the first connection lines arranged in a single pixel unit close to the encapsulation area is one, and the number of the second connection lines arranged in a single pixel unit close to the encapsulation area is two.

14. The display panel according to claim 1, characterized in that: The display panel includes at least one data winding and at least one scan winding, and the winding portion of the scan winding is located on a side of the winding portion of the data winding close to the packaging area.

15. The display panel according to claim 1, characterized in that: The display panel further includes: an inorganic layer, disposed on one side of the substrate and at least disposed in the packaging area; and A packaging substrate, disposed on a side of the inorganic layer facing away from the substrate, located in the packaging area, and surrounding the functional area; The packaging substrate is made of metal material and is provided with a plurality of grooves which surround the functional areas in sequence. Each groove runs through the packaging substrate. The plurality of grooves separate the packaging substrate into a plurality of protrusions which form undercut structures at the grooves.

16. The display panel according to claim 15, characterized in that: The packaging substrate is a Ti-Al-Ti stacked structure, each of the grooves penetrates the Ti-Al-Ti stacked structure in the stacking direction of the Ti-Al-Ti stacked structure to separate it into a plurality of Ti-Al-Ti stacked protrusions, and the Al layer in each of the Ti-Al-Ti stacked protrusions is retracted at the groove compared to the Ti layer facing away from the substrate to form the undercut structure.

17. The display panel according to claim 16, characterized in that: The packaging substrate further includes a padding layer, which is disposed between the inorganic layer and the Ti—Al—Ti stacked structure, and the material of the padding layer is different from that of the Ti—Al—Ti stacked structure.

18. A display device, characterized in that: The display device comprises a housing and a display panel as described in any one of claims 1 to 17, wherein the display panel is accommodated in the housing.

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