Printed Circuit Board Assembly and Electronic Device Including the Same

Abstract

A printed circuit board assembly is disclosed, the printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an insert disposed between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first portion and a second portion, the second portion extending in a first direction from a part of the first portion and wherein the length of the second portion in a second direction perpendicular to the first direction is less than the length of the first portion in the second direction, and the direction of a first conductive pattern formed on the first portion and the direction of a second conductive pattern formed on the second portion are substantially perpendicular to each other. Additionally, various other embodiments determined by this document are feasible.

Description

Technical Field

[0001] Various embodiments of the present invention relate to a printed circuit board assembly and an electronic device including the same. Background Art

[0002] An electronic device such as a smartphone may include various electronic components to perform various functions. These electronic components may be mounted on a printed circuit board, and the printed circuit board may be disposed inside the electronic device.

[0003] The electronic components may be mounted on the printed circuit board by surface mount technology (SMT). During the process of mounting the electronic components on the printed circuit board by a reflow process or the like of the surface mount technology, the printed circuit board is in a high-temperature state, and in this high-temperature state, warping may occur. Since surface mounting between the printed circuit board and the electronic components may be defective in the warped state of the printed circuit board, a method of suppressing such warping or controlling the warping direction to appear in an expected direction is being considered.

[0004] Meanwhile, with the miniaturization and thinning of electronic devices, the high integration of electronic components is rapidly developing, and this trend even requires various changes in printed circuit boards. For example, a printed circuit board assembly (PCB assembly) that stacks the plurality of printed circuit boards by disposing inserts between the plurality of printed circuit boards is being developed. The printed circuit board assembly may include more electronic components in a limited mounting space of the electronic device.

[0005] Even in the printed circuit board assembly that stacks the plurality of printed circuit boards, warping may occur at high temperatures. In order to prevent defects caused by the warping phenomenon, designs and developments are being made so that the warping directions of the plurality of printed circuit boards are the same. Summary of the Invention

[0006] Technical Problem

[0007] In order to control the warping directions of the plurality of printed circuit boards included in the printed circuit board assembly to be similar or the same to each other, the printed circuit board may be designed by a method of adjusting the area ratio occupied by copper (Cu) in each layer of the printed circuit board.

[0008] Due to design limitations of the printed circuit board or the printed circuit board assembly, it may be difficult to adjust the area ratio occupied by copper in each layer. For example, in the protruding portion of the printed circuit board (where many non-wetting defects may occur), it is limited to control the warping direction only by adjusting the area ratio occupied by copper in each layer.

[0009] Various embodiments of the present invention may provide a printed circuit board assembly and an electronic device including the printed circuit board assembly, in which a conductive pattern formed in a protruding portion of at least one of a plurality of printed circuit boards included in the printed circuit board assembly is used to control a warping direction of the printed circuit board.

[0010] Solution to the problem

[0011] The printed circuit board assembly according to various embodiments of the present invention may include a first printed circuit board, a second printed circuit board stacked on the first printed circuit board, and an insert disposed between the first printed circuit board and the second printed circuit board. The second printed circuit board may include a first portion and a second portion, the second portion extending from a part of the first portion in a first direction and wherein a length of the second portion in a second direction perpendicular to the first direction is less than a length of the first portion in the second direction. A direction of a first conductive pattern formed in the first portion and a direction of a second conductive pattern formed in the second portion may be substantially perpendicular to each other.

[0012] In addition, an electronic device according to various embodiments of the present invention may include: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a part of a space formed between the first surface and the second surface; a printed circuit board assembly disposed inside the housing; and at least one electronic component mounted on the printed circuit board assembly. The printed circuit board assembly may include: a first printed circuit board; a second printed circuit board stacked on the first printed circuit board; and an insert disposed between the first printed circuit board and the second printed circuit board. The second printed circuit board may include a first portion and a second portion, the second portion extending from a part of the first portion in a third direction, wherein a length of the second portion in a fourth direction perpendicular to the third direction is less than a length of the first portion in the fourth direction. A direction of a first conductive pattern formed in the first portion and a direction of a second conductive pattern formed in the second portion may be substantially perpendicular to each other.

[0013] In addition, a printed circuit board according to various embodiments of the present invention may include a first portion and a second portion, the second portion extending from a part of the first portion in a first direction, wherein a length of the second portion in a second direction perpendicular to the first direction is less than a length of the first portion in the second direction. A direction of a first conductive pattern formed in the first portion and a direction of a second conductive pattern formed in the second portion may be substantially perpendicular to each other.

[0014] Advantageous effects of the invention

[0015] According to various embodiments of the present disclosure, by controlling the warping directions of a plurality of printed circuit boards included in a printed circuit board assembly to be similar or the same as each other, the mountability of electronic components and / or the reliability of the printed circuit board assembly or an electronic device including the printed circuit board assembly can be improved.

[0016] In addition, various effects determined directly or indirectly herein may be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0018] Figure 2 is a view showing an electronic device including a printed circuit board assembly according to an embodiment of the present invention.

[0019] Figure 3 is a cross-sectional view of an electronic device including a printed circuit board assembly according to an embodiment of the present invention.

[0020] Figure 4 is a view for explaining the warping directions of a plurality of printed circuit boards included in a printed circuit board assembly according to an embodiment of the present invention.

[0021] Figure 5 is a view for explaining a printed circuit board included in a printed circuit board assembly according to an embodiment of the present invention.

[0022] Figure 6 is a view for explaining the warping direction of a printed circuit board depending on the direction of a conductive pattern formed in a protrusion portion of the printed circuit board according to an embodiment of the present invention.

[0023] Figure 7 is a table showing the warping direction and warping magnitude of a printed circuit board depending on the direction of a conductive pattern formed in a protrusion portion of the printed circuit board according to an embodiment of the present invention.

[0024] Figure 8 is a graph showing the warping direction of a printed circuit board depending on the ratio of a conductive pattern formed in a protrusion portion of the printed circuit board and the ratio of a conductor included in the printed circuit board according to an embodiment of the present invention.

[0025] Figure 9 is a table showing the warping direction and warping magnitude of a printed circuit board depending on the ratio of a conductive pattern formed in a protrusion portion of the printed circuit board and the ratio of a conductor included in the printed circuit board according to an embodiment of the present invention.

[0026] Figure 10A table showing the warping direction and warping magnitude of a printed circuit board depending on the position of a layer on which a conductive pattern is formed of the printed circuit board according to an embodiment of the present invention.

[0027] In the description with reference to the drawings, the same or similar reference numerals may be used for the same or similar components. Detailed Description

[0028] Hereinafter, various embodiments of the present invention will be described with reference to the drawings. For convenience of description, the sizes of the components shown in the drawings may be exaggerated or reduced, and the present invention is not necessarily limited to what is shown.

[0029] Figure 1 A block diagram of an electronic device 101 in a network environment 100 according to various embodiments is shown. Referring to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection end 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection end 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single integrated component (e.g., the display module 160).

[0030] The processor 120 may run software (e.g., program 140) to control at least one other component (e.g., a hardware component or a software component) connected to the processor 120 of the electronic device 101, and may perform various data processing or computations. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0031] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. An artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., the server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more of them, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to the hardware structure.

[0032] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0034] The input module 150 may receive commands or data to be used by other components of the electronic device 101 (e.g., the processor 120) from the outside of the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0035] The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0036] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., to a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the intensity of a force caused by the touch.

[0037] The audio module 170 may convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or a headset of an external electronic device (e.g., the electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] The sensor module 176 may detect an operating state of the electronic device 101 (e.g., power or temperature) or an environmental state outside the electronic device 101 (e.g., a state of a user), and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface 177 may support one or more specific protocols for directly (e.g., wired) or wirelessly connecting the electronic device 101 to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0040] The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be recognized by the user via his sense of touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] The camera module 180 may capture a still image or a moving image. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable storage battery, or a fuel cell.

[0045] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). Each of these communication modules may communicate with an external electronic device via a first network 198 (e.g., a short-range communication network, such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or these various types of communication modules may be implemented as multiple separate components (e.g., multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 196.

[0046] The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies (e.g., New Radio (NR) access technology). The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 may support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transfer rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), a loss coverage for implementing mMTC (e.g., 164 dB or less), or a U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round-trip of 1 ms or less).

[0047] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna, and the antenna may include a radiating element formed of a conductive material or a conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)) or formed on the substrate. According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme to be used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Subsequently, a signal or power may be transmitted or received between the communication module 190 and an external electronic device via the at least one selected antenna. According to an embodiment, additional components (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0048] According to various embodiments, the antenna module 197 may form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the plurality of antennas are disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high-frequency band.

[0049] At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., a bus, a general-purpose input / output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0050] According to an embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic devices 102 or 104 may be a device of the same type as the electronic device 101 or a device of a different type from the electronic device 101. According to an embodiment, all or some of the operations running on the electronic device 101 may be run on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 is to automatically execute a function or service or is to execute a function or service in response to a request from a user or another device, the electronic device 101 may request one or more of the external electronic devices to execute at least part of the function or service instead of running the function or service, or in addition to running the function or service, the electronic device 101 may also request one or more of the external electronic devices to execute at least part of the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service or execute additional functions or additional services related to the request and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least part of a reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0051] Figure 2 FIG. is a diagram showing an electronic device including a printed circuit board assembly according to an embodiment of the present invention. Figure 3 FIG. is a cross-sectional view of an electronic device including a printed circuit board assembly according to an embodiment of the present invention.

[0052] Referring to Figure 2 and Figure 3 , the electronic device 200 (e.g., Figure 1The electronic device 101) may include a housing 210, a printed circuit board assembly 230 disposed within the housing 210, and at least one electronic component 250 mounted on the printed circuit board assembly 230. However, the structure of the electronic device 200 is not limited thereto. According to various embodiments, in addition to the above components, the electronic device 200 may further include at least one other component. Due to the Figure 2 and Figure 3 of the electronic device 200 (e.g., Figure 1 of the electronic device 101) at least one of the components is the same as or similar to Figure 1 at least one of the components of the electronic device 101, repeated descriptions will be omitted hereinafter.

[0053] According to various embodiments, the housing 210 may include a first surface (or front surface) facing a first direction (e.g., the Z-axis direction), a second surface (or rear surface) facing a second direction opposite to the first direction (e.g., the -Z-axis direction), and side surfaces surrounding at least a portion of the space formed between the first surface and the second surface. In another embodiment (not shown), the housing 210 may refer to a structure forming a part of the first surface, the second surface, and the side surfaces.

[0054] According to various embodiments, at least a portion of the first surface may be formed of a substantially transparent front plate 211. The second surface may be formed of a substantially opaque rear plate 212. The front plate 211 may include, for example, a glass plate or a polymer plate including various coatings. The rear plate 212 may be formed of, for example, coated glass or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surfaces may be formed of a side border structure (or side member) (e.g., Figure 3 of the support member 220) coupled to the front plate 211 and the rear plate 212 and including metal and / or polymer. In some embodiments, the rear plate 212 and the side border structure may be integrally formed and may include the same material (e.g., a metal material such as aluminum).

[0055] The printed circuit board assembly 230 may include a plurality of printed circuit boards 231 and 232 (at least one electronic component 250 is mounted on the printed circuit boards 231 and 232) and an insert 233 disposed between the plurality of printed circuit boards. For convenience of description, Figure 3 a state is shown in which the plurality of printed circuit boards 231 and 232 include a first printed circuit board 231 and a second printed circuit board 232, but the present invention is not limited thereto and may further include at least one other printed circuit board. In the following description, the first printed circuit board 231 and the second printed circuit board 232 may be referred to as a main printed circuit board (main PCB) and a slave printed circuit board (slave PCB), respectively.

[0056] The first printed circuit board 231 and the second printed circuit board 232 may be stacked, and the insert 233 is interposed therebetween.

[0057] According to an embodiment, the first printed circuit board 231 may be disposed between the front plate 211 and the rear plate 212, and at least one electronic component 250 may be mounted on at least one surface of the first printed circuit board 231. In one example, an electronic component 250 having a relatively large weight (such as a processor 251 (e.g., an application processor (AP), a communication processor (CP), and / or Figure 1 the processor 120) or a memory (e.g., Figure 1 the universal flash storage (UFS) and / or the memory 130 in

[0058] According to an embodiment, the second printed circuit board 232 may be disposed between the first printed circuit board 231 and the rear plate 212, and at least one electronic component 250 may be mounted on at least one surface of the second printed circuit board 232. The second printed circuit board 232 may include a first portion 201 and a second portion 203 extending in a direction 205 from a part of the first portion 201. According to an embodiment, the width (w2) 207a of the second portion 203 extending from a part of the first portion 201 in a direction 207 perpendicular to the direction 205 may be smaller than the width (w1) 209a of the first portion 201 in the same direction 209. That is, the first portion 201 represents the main part (or central part) in the overall shape of the second printed circuit board 232, and the second portion 203 represents the protruding part (projecting part) in the overall shape of the second printed circuit board 232. In the following description, the first portion 201 may be referred to as the main part, and the second portion 203 may be referred to as the protruding part. Since the second printed circuit board 232 has the protruding part 203, the second printed circuit board 232 may be arranged adjacent to another component (e.g., Figure 1 the camera module 270 and / or the camera) of the electronic device 200. Accordingly, components may be more effectively arranged in the internal space of the electronic device 200.

[0059] According to an embodiment, the second printed circuit board 232 may have a warping direction similar to or the same as that of the first printed circuit board 231 at room temperature and high temperature. For example, by using a conductive pattern formed in the protruding part 203 of the second printed circuit board 232 (where multiple non-wetting defects may occur), the warping direction of the second printed circuit board 232 may be controlled in a direction similar to or the same as the warping direction of the first printed circuit board 231. According to an embodiment, the warping direction of the second printed circuit board 232 may be controlled by using at least one of the direction of the conductive pattern formed in the protruding part 203 of the second printed circuit board 232, the ratio (or size) of the conductive pattern, or the position of the layer of the printed circuit board on which the conductive pattern is formed. A method or structure for controlling the warping direction of the second printed circuit board 232 will be described in detail with reference to Figures 5 to 10 later.

[0060] According to various embodiments, not limited to the illustrated embodiments, the position of the second portion 203 may be changed according to various embodiments. According to an embodiment, at least a part of the first printed circuit board 231 may be formed as a part (protruding part) protruding from the overall shape of the first printed circuit board 231 similar to or the same as the second portion 203. According to various embodiments, the protruding parts formed on the first printed circuit board 231 and the second printed circuit board 232 may be formed and arranged in the electronic device 200 to be similar to or the same as each other.

[0061] The electronic component 250 may include at least one of, for example, a processor 251, a memory, a PMIC, and / or an interface. The processor 251 may control at least one other component of the electronic device 200 and may perform various data processing or operations. The processor 251 may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and a communication processor. The memory may store various data used by at least one component of the electronic device 200. The memory may include, for example, a volatile memory or a non-volatile memory. The PMIC may manage power supplied to the electronic device 200. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0062] According to an embodiment, the electronic device 200 may further include at least one of a camera module 270, a display 290, and a support member 220 (e.g., a bracket).

[0063] The camera module 270 may capture still images and moving images. The camera module 270 may include a first camera device disposed on a first surface of the housing 210, a second camera device disposed on a second surface of the housing 210, and / or a flash. The camera device may include one or more lenses, an image sensor, and / or an image signal processor. The flash may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on at least one surface of the housing 210.

[0064] In various embodiments, the camera module 270 may be disposed inside the housing 210, where a lens of the camera module 270 is exposed to at least a portion of a first surface (front surface) of the electronic device 200. For example, the camera module 270 may include a punch hole camera disposed inside a hole or a recess (not shown) formed in a rear surface of the display 290. In various embodiments, the camera module 270 may be disposed inside the housing 210, where a lens of the camera module 270 is exposed to at least a portion of a second surface (rear surface) of the electronic device 200. For example, the camera module 270 may be disposed on or functionally connected to a printed circuit board assembly 230.

[0065] The display 290 may display various contents (e.g., text, images, videos, icons, or symbols, etc.) to the user. The display 290 may be exposed through most of, for example, the front plate 211. In some embodiments, at least a portion of the display 290 may be exposed through the front plate 211 that forms a partial area of the first surface (or front surface) and the side surface of the housing 210. According to an embodiment, the display 290 may be coupled or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus.

[0066] The support member 220 may be disposed inside the electronic device 200 and connected to or integrally formed with the side border structure. The support member 220 may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The display 290 may be coupled to one surface of the support member 220 and the printed circuit board assembly 230 may be coupled to the other surface of the support member 220.

[0067] Figure 4 is a diagram for explaining the warping direction of a plurality of printed circuit boards included in a printed circuit board assembly according to an embodiment of the present invention.

[0068] Referring to Figure 4 , the printed circuit board assembly 230 may include a main printed circuit board 231, a slave printed circuit board 232, and an insert 233. The main printed circuit board 231 and the slave printed circuit board 232 may be stacked and the insert 233 may be interposed therebetween. For example, the insert 233 may be stacked on the slave printed circuit board 232, and the main printed circuit board 231 may be stacked on the insert 233.

[0069] Due to the difference in balance of the conductive patterns of each layer included in the main printed circuit board 231, in a high temperature state, the main printed circuit board 231 may warp convexly in the rear direction (e.g., the direction facing the insert 233). According to an embodiment, in the main printed circuit board 231, the size of the area of the conductive pattern formed on the layer from the center of the main printed circuit board 231 to the rear surface (the surface facing the insert 233) of the main printed circuit board 231 may be larger than the size of the area of the conductive pattern formed on the layer from the center of the main printed circuit board 231 to the front surface (the surface opposite to the rear surface) of the main printed circuit board 231. For example, in the main printed circuit board 231, the size of the area of the conductive pattern formed on the rear surface of the main printed circuit board 231 may be larger than the size of the area of the conductive pattern formed on the front surface of the main printed circuit board 231. Therefore, as Figure 4 shown, in a high temperature state, the warping direction of the main printed circuit board 231 may be a smiling direction that warps convexly in the direction of the layer where the area of the conductive pattern is formed larger (e.g., the rear direction).

[0070] To prevent SMD process failures between the main printed circuit board 231 and the slave printed circuit board 232, the warpage directions of the main printed circuit board 231 and the slave printed circuit board 232 can be controlled to be in similar or the same direction. For example, as Figure 4 shown, when the warpage direction of the main printed circuit board 231 is in the smiling direction at a high temperature state, even the warpage direction of the slave printed circuit board 232 can be controlled to be in the smiling direction.

[0071] According to an embodiment, by using at least one of the direction of the conductive pattern formed in the protruding portion 203 of the slave printed circuit board 232, the ratio (or size) of the conductive pattern, or the position of the layer on the slave printed circuit board 232 where the conductive pattern is formed, the warpage direction of the slave printed circuit board 232 can be controlled to be in the smiling direction. Here, the protruding portion 203 of the slave printed circuit board 232 is a portion extending from a part of the main portion (or central portion) 201 of the slave printed circuit board 232, and the width (w2) 207a of the protruding portion 203 extending from a part of the main portion 201 in a direction 207 (e.g., the short axis direction of the slave printed circuit board 232) perpendicular to the direction 205 (e.g., the long axis direction of the slave printed circuit board 232) can be smaller than the width (w1) 209a of the main portion 201 in the same direction 209 (e.g., the short axis direction of the slave printed circuit board 232).

[0072] Figure 5 is a diagram for explaining a printed circuit board included in a printed circuit board assembly according to an embodiment of the present invention.

[0073] The printed circuit board assembly 230 may include a plurality of printed circuit boards, for example, a main printed circuit board (e.g., Figure 4 the main printed circuit board 231) and a slave printed circuit board (e.g., Figure 4 the slave printed circuit board 232). Figure 5 The printed circuit board 500 shown in Figure 4 may be any one or two or more of the plurality of printed circuit boards. For example, the printed circuit board 500 may be at least one of the main printed circuit board (e.g., Figure 4 the main printed circuit board 231) or the slave printed circuit board (e.g., Figures 2 to 4At least one of the components of the printed circuit board assembly 230 is the same or similar, so the repeated description is omitted below. In the above description, it has been described that the warping direction of the printed circuit board 232 is controlled to be similar to or the same as the warping direction of the main printed circuit board 231 by using the conductive pattern formed in the protruding portion of the printed circuit board 232, but the present invention is not limited thereto. According to various embodiments, the warping directions of the plurality of printed circuit boards can be controlled to be in similar or the same direction by using the conductive pattern formed in the protruding portion of at least one of the plurality of printed circuit boards (for example, the main printed circuit board 231 and / or the secondary printed circuit board 232).

[0074] Referring to Figure 5 , the printed circuit board 500 may include a first portion 510 (for example, Figure 2 the first portion 201) and a second portion 530 (for example, Figure 2 the second portion 203). The first portion 510 is a portion that occupies most of the area of the printed circuit board 500 and may be referred to as the main portion (or central portion). The second portion 530 is a portion that extends from a part of the first portion 510 and may be referred to as the protruding portion.

[0075] The sum of the length (l1) 501a of the first portion 510 and the length (l2) 501b of the second portion 530 may correspond to the length (l) 501 of the printed circuit board 500. Here, the length 501 of the printed circuit board 500 may represent the length in the long axis direction (for example, the X-axis) of the printed circuit board 500. In the following description, the long axis direction of the printed circuit board 500 may be referred to as the length 501 direction.

[0076] The first portion 510 may have a width (w1) 503a corresponding to the width (w) 503 of the printed circuit board 500, and the second portion 530 may have a width (w2) 503b smaller than the width 503 of the printed circuit board 500. Here, the width 503 of the printed circuit board 500 may represent the length in the short axis direction (for example, the Y-axis) of the printed circuit board 500. In the following description, the short axis direction of the printed circuit board 500 may be referred to as the width 503 direction.

[0077] The second portion 530 may extend from a part of the first portion 510. For example, the second portion 530 may extend from a part of the first portion 510 in the length 501 direction. In this case, the length (or width) (w2) 503b of the second portion 530 in the width 503 direction may be smaller than the length (or width) (w1) 503a of the first portion 510 in the width 530 direction.

[0078] The warping direction of the printed circuit board 500 can be controlled using at least one of the direction of the conductive pattern 531 formed in the second portion 530 of the printed circuit board 500, the ratio (or size) of the conductive pattern 531, or the position of the layer of the printed circuit board 500 on which the conductive pattern 531 is formed. According to an embodiment, the first conductive pattern 511 formed in the first portion 510 and / or the second conductive pattern 531 formed in the second portion 530 may form a ground region of the printed circuit board 500. For example, the first conductive pattern 511 and / or the second conductive pattern 531 may be formed on the ground layer of the printed circuit board 500.

[0079] According to an embodiment, the direction of the second conductive pattern 531 may be different from the direction of the first conductive pattern 511. In an example, the direction of the first conductive pattern 511 and the direction of the second conductive pattern 531 may be substantially perpendicular to each other. As Figure 5 shown, the direction of the first conductive pattern 511 may be the width 503 direction, and the direction of the second conductive pattern 531 may be the length 501 direction. In another example, the direction of the second conductive pattern 531 may be a direction inclined at a predetermined angle with respect to the direction of the first conductive pattern 511. According to an embodiment, the direction of the second conductive pattern 531 may be substantially the same as the direction along which the second portion 530 extends from a portion of the first portion 510 (e.g., the length 501 direction). For example, when the second portion 530 extends from a portion of the first portion 510 in a first direction (e.g., the -X axis direction), the direction of the second conductive pattern 531 may be the first direction (-X axis direction). In this case, the direction of the first conductive pattern 511 may be a second direction different from the first direction, for example, a direction substantially perpendicular to the first direction (e.g., the Y axis direction).

[0080] According to an embodiment, the ratio of the width of the second conductive pattern 531 (e.g., the length of the second conductive pattern 531 in the width 503 direction) to the length of the second portion 530 in a direction perpendicular to the direction along which the second portion 530 extends from a portion of the first portion 510 (e.g., the length 501 direction) (e.g., the width 503 direction) (e.g., the length (or width) (w2) 503b of the second portion 530 in the width 503 direction) may be less than a specified size (e.g., 5%). Since the elastic modulus increases as the width of the second conductive pattern 531 decreases, the warping direction of the printed circuit board 500 can be easily controlled. For example, the warping direction of the printed circuit board 500 can be easily controlled to a smile direction in a high-temperature state of the printed circuit board 500.

[0081] According to an embodiment, the ratio of the area occupied by conductors (e.g., the first conductive pattern 511 and the second conductive pattern 531) included in the printed circuit board 500 to the entire area of the printed circuit board 500 (e.g., the area including the first part 510 and the second part 530) may be included within a specified range (e.g., 50% to 75%). The coefficient of thermal expansion of a conductor (e.g., copper) increases in proportion to its volume, but the mismatch with an insulating layer (e.g., a prepreg (PPG) layer) may increase at high temperatures.

[0082] According to an embodiment, the ratio of the area occupied by conductors included in the printed circuit board 500 to the entire area of the printed circuit board 500 may be included within a specified range (e.g., 50% to 75%), and the ratio of the width of the second conductive pattern 531 to the length (or width) (w2) 503b of the second part 530 in the width 503 direction may be less than a specified dimension (e.g., 5%). For example, in a state where the area occupied by conductors on the printed circuit board 500 is specified, as the width of the second conductive pattern 531 decreases, the second conductive pattern 531 may be arranged more densely in the second part 530.

[0083] According to an embodiment, the printed circuit board 500 may include a plurality of layers. The plurality of layers may include a plurality of conductive layers (e.g., copper foil layers) serving as signal lines and / or ground regions, and a plurality of insulating layers arranged between the conductive layers. According to an embodiment, the first conductive pattern 511 and / or the second conductive pattern 531 may form a ground region of the printed circuit board 500. For example, the first conductive pattern 511 and / or the second conductive pattern 531 may be formed on a ground layer among the plurality of layers. The first conductive pattern 511 and / or the second conductive pattern 531 may be formed on a conductive layer (ground layer) serving as a ground region among the plurality of conductive layers except for the region where signal lines are arranged.

[0084] According to an embodiment, when the printed circuit board 500 includes the plurality of layers, the first conductive pattern 511 and the second conductive pattern 531 may be formed on at least one layer among the plurality of layers that is separated from the center of the printed circuit board 500 by a specified distance or more. In one example, the first conductive pattern 511 and the second conductive pattern 531 may be formed on the outermost layer of the printed circuit board 500. Since the moment effect increases as the first conductive pattern 511 and the second conductive pattern 531 move away from the center of the printed circuit board 500, the warping direction of the printed circuit board 500 can be easily controlled.

[0085] Figure 5Illustrated is a state in which the printed circuit board 500 includes a second portion 530, but the present invention is not limited thereto. According to various embodiments, the printed circuit board 500 may include a plurality of second portions 530. When the printed circuit board 500 includes a plurality of second portions 530, at least one of the plurality of second portions 530 may extend from a part of the first portion 510 in a first direction (e.g., the -X axis direction), and at least another one may extend from another part of the first portion 510 in a second direction different from the first direction (e.g., the X axis direction). The direction in which the second portion 530 extends and / or the number of the second portions 530 may vary.

[0086] According to an embodiment, when the printed circuit board 500 includes the plurality of second portions 530, the directions of the conductive patterns 531 formed in the plurality of second portions 530 may be the same as each other. In this case, the direction of the conductive pattern 531 formed in the plurality of second portions 530 may be different from the direction of the conductive pattern 511 formed in the first portion 510. In an example, when the direction of the conductive pattern 511 formed in the first portion 510 is the width 503 direction, the direction of the conductive pattern 531 formed in the plurality of second portions 530 may be the length 501 direction.

[0087] According to an embodiment, when the printed circuit board 500 includes the plurality of second portions 530, the direction of the conductive pattern 531 formed in the plurality of second portions 530 may be substantially the same as the direction in which each of the plurality of second portions 530 extends from a part of the first portion 510. For example, the direction of the conductive pattern 531 formed in the second portion 530 extending from a part of the first portion 510 in a first direction (e.g., the -X axis direction) may be the first direction (e.g., the -X axis direction), and the direction of the conductive pattern 531 formed in the second portion 530 extending from another part of the first portion 510 in a second direction (e.g., the Y axis direction) may be the second direction (e.g., the Y axis direction). In this case, the direction of the conductive pattern 531 formed in any one of the plurality of second portions 530 may be a direction substantially the same as the direction of the conductive pattern 511 formed in the first portion 510. According to an embodiment, the direction of the conductive pattern 531 formed in the second portion 530 may be set to be inclined at a predetermined angle with respect to the direction of the conductive pattern 511 formed in the first portion 510, where the direction of the conductive pattern 531 formed in any one of the plurality of second portions 530 is not the same as the direction of the conductive pattern 511 formed in the first portion 510.

[0088] As described above, according to various embodiments, a printed circuit board assembly (e.g., printed circuit board assembly 230) may include a first printed circuit board (e.g., main printed circuit board 231), a second printed circuit board (e.g., slave printed circuit board 232 or printed circuit board 500) stacked with the first printed circuit board, and an insert (e.g., insert 233) disposed between the first printed circuit board and the second printed circuit board. The second printed circuit board may include a first portion (e.g., main portion 201 or first portion 510) and a second portion (e.g., protrusion portion 203 or second portion 530), the second portion extending from a part of the first portion in a first direction (e.g., direction 205 or length 501 direction), and wherein the length of the second portion in a second direction (e.g., direction 207 or 209 or width 503 direction) perpendicular to the first direction (e.g., width (w2) 207a or width (w2) 503b) is less than the length of the first portion in the second direction (e.g., width (w1) 209a or width (w1) 503a). The direction of a first conductive pattern (e.g., first conductive pattern 511) formed in the first portion and the direction of a second conductive pattern (e.g., second conductive pattern 531) formed in the second portion may be substantially perpendicular to each other.

[0089] According to various embodiments, the first conductive pattern and the second conductive pattern may be formed on a ground layer of the second printed circuit board.

[0090] According to various embodiments, the first printed circuit board may include a first surface facing the second printed circuit board and a second surface facing the first surface. The size of the area occupied by a conductor formed from the center of the first printed circuit board to the first surface of the first printed circuit board may be greater than the size of the area occupied by a conductor formed from the center of the first printed circuit board to the second surface of the first printed circuit board.

[0091] According to various embodiments, the direction of the first conductive pattern may be the second direction, and the direction of the second conductive pattern may be the first direction.

[0092] According to various embodiments, the ratio of the area occupied by a conductor included in the second printed circuit board to the entire area of the second printed circuit board may be included within a specified range. The ratio of the length of the second conductive pattern in the second direction to the length of the second portion in the second direction may be less than a specified size.

[0093] According to various embodiments, the second printed circuit board may include a plurality of layers. The first conductive pattern and the second conductive pattern may be formed on at least one layer among the plurality of layers that is separated from the center of the second printed circuit board by a specified distance or more.

[0094] According to various embodiments, the at least one layer may be spaced apart from the first printed circuit board by a greater distance than at least another one of the plurality of layers.

[0095] According to various embodiments, the first printed circuit board may include a first surface facing the second printed circuit board and a second surface facing the first surface, and the weight of at least one electronic component mounted on the first surface may be greater than the weight of at least one electronic component mounted on the second surface.

[0096] According to various embodiments, the direction of the first conductive pattern may be the short-axis direction of the second printed circuit board, and the direction of the second conductive pattern may be the long-axis direction of the second printed circuit board.

[0097] As described above, according to various embodiments, an electronic device (e.g., electronic device 101 or electronic device 200) may include: a housing (e.g., housing 210) including a first surface (e.g., front plate 211) facing a first direction, a second surface (e.g., rear plate 212) facing a second direction opposite to the first direction, and side surfaces surrounding at least a portion of a space formed between the first surface and the second surface; a printed circuit board assembly (e.g., printed circuit board assembly 230) disposed inside the housing; and at least one electronic component (e.g., electronic component 250 or processor 251) mounted on the printed circuit board assembly. The printed circuit board assembly may include a first printed circuit board (e.g., main printed circuit board 231), a second printed circuit board (e.g., slave printed circuit board 232 or printed circuit board 500) stacked with the first printed circuit board, and an insert (e.g., insert 233) disposed between the first printed circuit board and the second printed circuit board. The second printed circuit board may include a first portion (e.g., main portion 201 or first portion 510) and a second portion (e.g., protrusion portion 203 or second portion 530) that extends from a part of the first portion in a third direction (e.g., direction 205 or length 501 direction), and wherein a length (e.g., width (w2) 207a or width (w2) 503b) in a fourth direction (e.g., direction 207 or 209 or width 503 direction) perpendicular to the third direction is less than a length (e.g., width (w1) 209a or width (w1) 503a) of the first portion in the fourth direction. Directions of a first conductive pattern (e.g., first conductive pattern 511) formed in the first portion and a second conductive pattern (e.g., second conductive pattern 531) formed in the second portion may be substantially perpendicular to each other.

[0098] According to various embodiments, the first conductive pattern and the second conductive pattern may be formed on a ground layer of the second printed circuit board.

[0099] According to various embodiments, the first printed circuit board may include a third surface facing the second printed circuit board and a fourth surface facing the third surface. The size of the area occupied by the conductor formed from the center of the first printed circuit board to the third surface of the first printed circuit board may be greater than the size of the area occupied by the conductor formed from the center of the first printed circuit board to the fourth surface of the first printed circuit board.

[0100] According to various embodiments, the direction of the first conductive pattern may be the fourth direction, and the direction of the second conductive pattern may be the third direction.

[0101] According to various embodiments, the ratio of the area occupied by the conductor included in the second printed circuit board to the entire area of the second printed circuit board may be included within a specified range. The ratio of the length of the second conductive pattern in the fourth direction to the length of the second portion in the fourth direction may be less than a specified size.

[0102] According to various embodiments, the second printed circuit board may include a plurality of layers. The first conductive pattern and the second conductive pattern may be formed on at least one of the plurality of layers that is separated from the center of the second printed circuit board by a specified distance or more.

[0103] According to various embodiments, the spacing distance of the at least one layer from the first printed circuit board may be greater than that of at least another one of the plurality of layers.

[0104] According to various embodiments, the first printed circuit board may include a first surface facing the second printed circuit board and a second surface facing the first surface, and the weight of at least one electronic component mounted on the first surface may be greater than the weight of at least one electronic component mounted on the second surface.

[0105] According to various embodiments, the direction of the first conductive pattern may be the minor axis direction of the second printed circuit board, and the direction of the second conductive pattern may be the major axis direction of the second printed circuit board.

[0106] As described above, according to various embodiments, a printed circuit board (e.g., from printed circuit board 232 or printed circuit board 500) may include a first portion (e.g., main portion 201 or first portion 510) and a second portion (e.g., protrusion portion 203 or second portion 530), the second portion extending from a part of the first portion in a first direction (e.g., direction 205 or length 501 direction), and wherein the length (e.g., width (w2) 207a or width (w2) 503b) of the second portion in a second direction (e.g., direction 207 or 209 or width 503 direction) perpendicular to the first direction is less than the length (e.g., width (w1) 209a or width (w1) 503a) of the first portion in the second direction. The direction of a first conductive pattern (e.g., first conductive pattern 511) formed in the first portion and the direction of a second conductive pattern (e.g., second conductive pattern 531) formed in the second portion may be substantially perpendicular to each other.

[0107] According to various embodiments, the first conductive pattern and the second conductive pattern may be formed on a ground layer of the printed circuit board.

[0108] According to various embodiments, the direction of the first conductive pattern may be the second direction, and the direction of the second conductive pattern may be the first direction.

[0109] According to various embodiments, the ratio of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board may be included within a specified range, and the ratio of the length of the second conductive pattern in the second direction to the length of the second portion in the second direction may be less than a specified size.

[0110] According to various embodiments, the printed circuit board may include a plurality of layers. The first conductive pattern and the second conductive pattern may be formed on at least one layer among the plurality of layers that is separated from the center of the printed circuit board by a specified distance or more.

[0111] According to various embodiments, the spacing distance of the at least one layer from another printed circuit board may be greater than that of at least another layer among the plurality of layers.

[0112] According to various embodiments, the first printed circuit board may include a first surface facing the second printed circuit board and a second surface facing the first surface, and the weight of at least one electronic component mounted on the first surface may be greater than the weight of at least one electronic component mounted on the second surface.

[0113] According to various embodiments, the direction of the first conductive pattern may be the short axis direction of the second printed circuit board, and the direction of the second conductive pattern may be the long axis direction of the second printed circuit board.

[0114] Figure 6It is a diagram for explaining the warping direction of a printed circuit board depending on the direction of a conductive pattern formed in a protruding portion of the printed circuit board according to an embodiment of the present invention. Figure 7 It is a table showing the warping direction and warping magnitude of a printed circuit board depending on the direction of a conductive pattern formed in a protruding portion of the printed circuit board according to an embodiment of the present invention.

[0115] Referring to Figure 6 and Figure 7 a printed circuit board (e.g., printed circuit board 500) may include a main portion 610 (e.g., Figure 5 the first portion 510 of Figure 5 ) and a protruding portion 630 (e.g., Figure 5 the second portion 530 of Figure 5 ). The main portion 610 may be a portion that occupies most of the area of the printed circuit board, and the protruding portion 630 may be a portion extending from a part of the main portion 610. The length (or width) of the protruding portion 630 in a direction substantially perpendicular to the direction in which it extends from a part of the main portion 610 (e.g., Figure 5 the second width (w2) 503b of Figure 5 ) may be less than the length (or width) of the main portion 610 in the substantially same direction (e.g., Figure 5 the first width (w1) 503a of ).

[0116] As in Figure 6 the first state 601, when the direction of the conductive pattern 631 formed in the protruding portion 630 is different from the direction of the conductive pattern 611 formed in the main portion 610, the printed circuit board may have a warping direction in the smiling direction in a high-temperature state. In one example, as shown by the second data 720 included in Figure 7 the table 700, when the direction of the conductive pattern 631 in the protruding portion 630 is the long-axis direction (e.g., the direction in which the protruding portion 630 extends from a part of the main portion 610), and the direction of the conductive pattern 611 in the main unit 610 is the short-axis direction of the printed circuit board (e.g., the direction perpendicular to the direction in which the protruding portion 630 extends from a part of the main unit 610), the warping direction of the printed circuit board (e.g., the printed circuit board) in a high-temperature state may be the smiling direction and the warping magnitude may be about 335 μm.

[0117] Conversely, as in Figure 6 the second state 602, when the direction of the conductive pattern 631 formed in the protruding portion 630 is substantially the same as the direction of the conductive pattern 611 formed in the main portion 610, the printed circuit board may have a warping direction in the crying direction (the direction opposite to the smiling direction) in a high-temperature state. In one example, as in Figure 7As shown by the third data 730 included in Table 700, when the direction of the conductive pattern 631 in the protruding portion 630 is the same short-axis direction as the direction of the conductive pattern 611 in the main portion 610, the warping direction of the printed circuit board can be the weeping direction in a high-temperature state, and the warping size can be approximately 245 μm. In another example, as Figure 7 shown by the first data 710 included in Table 700, even when the direction of the conductive pattern 631 in the protruding portion 630 is the same long-axis direction as the direction of the conductive pattern 611 in the main portion 610, the warping direction of the printed circuit board can be the weeping direction in a high-temperature state, and the warping size can be approximately 73 μm.

[0118] Therefore, the direction of the conductive pattern 631 formed in the protruding portion 630 of the printed circuit board can be designed to be substantially different (e.g., in the vertical direction) from the direction of the conductive pattern 611 formed in the main portion 610 of the printed circuit board, where the printed circuit board can have a warping direction of the smiling direction in a high-temperature state.

[0119] Figure 8 is a graph showing the warping direction of a printed circuit board depending on the ratio of the conductive pattern formed in the protruding portion of the printed circuit board and the ratio of the conductor included in the printed circuit board according to an embodiment of the present invention, Figure 9 is a table showing the warping direction and warping size of a printed circuit board depending on the ratio of the conductive pattern formed in the protruding portion of the printed circuit board and the ratio of the conductor included in the printed circuit board according to an embodiment of the present invention.

[0120] Referring to Figure 8 and Figure 9 , a printed circuit board (e.g., printed circuit board 500) can include a main portion (e.g., Figure 5 the first portion 510) and a protruding portion (e.g., Figure 5 the second portion 530), the protruding portion extending from a part of the main portion, and where the length (or width) of the protruding portion in a direction perpendicular to the direction in which it extends from a part of the main portion (e.g., Figure 5 the second width (w2) 503b) is less than the length (or width) of the main portion in the same direction (e.g., Figure 5 the first width (w1) 503a).

[0121] As Figure 8As shown in the curve graph 800, since the coefficient of thermal expansion of a conductor (e.g., copper) increases proportionally to the volume, as the ratio 801 of the area occupied by the conductors (e.g., conductive patterns) included in the printed circuit board to the entire area of the printed circuit board increases, it becomes easier to control the warping direction of the printed circuit board in a high-temperature state. However, at high temperatures, the mismatch between the coefficient of thermal expansion of the conductor and / or the coefficient of thermal expansion of the insulating layer may increase. Therefore, the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board can be included within a specified range.

[0122] In addition, since the elastic modulus increases as the ratio 803 of the width of the conductive pattern (e.g., the second conductive pattern 531) formed in the protruding portion to the width of the protruding portion (e.g., the length of the protruding portion in the direction perpendicular to the direction in which the protruding portion extends from a part of the main portion (e.g., Figure 5 the first width (w1) 503b)) of the protruding portion decreases, it is possible to easily control the warping direction of the printed circuit board in a high-temperature state.

[0123] However, as Figure 8 shown in the curve graph 800, based on a threshold 805 (which represents the relationship between the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board and the ratio 803 of the width of the conductive pattern formed in the protruding portion to the width of the protruding portion), it can be designed such that the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board is included within a specified range (e.g., 50% to 75%), and even when the ratio 803 of the width of the conductive pattern formed in the protruding portion to the width of the protruding portion is less than a specified size (e.g., 5%). In one example, as in the first data 811 in the curve graph 800 and the first data 910 included in the corresponding Figure 8 table 900 in Figure 9 when the first condition (e.g., 50%) is satisfied (where the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board is included within a specified range (e.g., 50% to 75%)) and the second condition (e.g., 3%) is satisfied (where the ratio 803 of the width of the conductive pattern formed in the protruding portion to the width of the protruding portion is less than the specified dimension (e.g., 5%)), the warping direction of the printed circuit board (e.g., from the printed circuit board) in a high-temperature state can be the smiling direction (or smiling mode) 810, and the warping size can be approximately 23 μm.

[0124] On the contrary, when either the first condition or the second condition is not satisfied, the warping direction of the printed circuit board in a high-temperature state can be the crying direction (or crying mode) 830. In one example, as inFigure 8 the second data 831 and the third data 832 of the curve graph 800 and the second data 920 and the third data 930 included in the Figure 9 table 900 as described above, when the first condition is satisfied but the second condition is not satisfied, the warping direction of the printed circuit board in the high-temperature state can be the crying direction 830. As Figure 8 the second data 831 of the curve graph 800 and the Figure 9 corresponding second data 920 included in the table 900 as described above, when the first condition (for example, 50%) (where the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board is included within a specified range (for example, 50% to 75%)) is satisfied, but the second condition (for example, 5%) (where the ratio 803 of the width of the conductive pattern formed in the protruding portion to the width of the protruding portion is less than a specified size (for example, 5%)) is not satisfied, the warping direction of the printed circuit board in the high-temperature state can be the crying direction 830 and the warping size can be approximately 68 μm. In addition, as in Figure 8 the third data 832 of the curve graph 800 and the Figure 9 corresponding third data 930 included in the table 900 as described above, when the first condition (for example, 50%) (where the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board is included within a specified range (for example, 50% to 75%)) is satisfied, but the second condition (for example, 8%) (where the ratio 803 of the width of the conductive pattern formed in the protruding portion to the width of the protruding portion is less than a specified size (for example, 5%)) is not satisfied, the warping direction of the printed circuit board in the high-temperature state can be the crying direction 830 and the warping size can be approximately 31 μm. In another example, as in Figure 8 the fourth data 833 of the curve graph 800 and the Figure 9 corresponding fourth data 940 included in the table 900 as described above, even when the second condition is satisfied but the first condition is not satisfied, the warping direction of the printed circuit board in the high-temperature state can also be the crying direction 830. As in Figure 8 the fourth data 833 of the curve graph 800 and the Figure 9 corresponding fourth data 940 included in the table 900 as described above, when the second condition (for example, 3%) (where the ratio 803 of the width of the conductive pattern formed in the protruding portion to the width of the protruding portion is less than a specified size (for example, 5%)) is satisfied, but the first condition (for example, 25%) (where the ratio 801 of the area occupied by the conductors included in the printed circuit board to the entire area of the printed circuit board is within the specified range (for example, 50% to 75%)) is not satisfied, the warping direction of the printed circuit board in the high-temperature state can be the crying direction 830 and the warping size can be approximately 31 μm.

[0125] Figure 10 It is a table showing the warping direction and warping magnitude of a printed circuit board depending on the position of the layer on which a conductive pattern is formed according to an embodiment of the present invention.

[0126] A printed circuit board (e.g., printed circuit board 500) may include a main portion (e.g., Figure 5 the first portion 510), and a protrusion portion (e.g., Figure 5 the second portion 530), which extends from a part of the main portion, and wherein the length (or width) of the protrusion portion in a direction perpendicular to the direction in which it extends from a part of the main portion (e.g., Figure 5 the second width (w2) 503b) is less than the length (or width) of the main portion in the same direction (e.g., Figure 5 the first width (w1) 503a). Further, as described above, the warping direction of the printed circuit board in a high-temperature state can be controlled to a smiling direction by a method of designing the direction of the conductive pattern formed in the protrusion portion substantially differently (e.g., in a perpendicular direction) from the direction of the conductive pattern formed in the main portion, and a method of designing to satisfy a first condition (wherein the ratio of the area occupied by the conductor included in the printed circuit board to the entire area of the printed circuit board is within a specified range) and a second condition (wherein the ratio of the width of the conductive pattern formed in the protrusion portion to the width of the protrusion portion is less than a specified size) (by a control method of the ratio (or size) of the conductive pattern of the printed circuit board).

[0127] Referring to Figure 10 , the printed circuit board may include a plurality of layers. The plurality of layers may include a plurality of conductive layers (e.g., copper foil layers) serving as signal lines or ground regions, and a plurality of insulating layers disposed between the conductive layers. According to an embodiment, the first conductive pattern formed in the main portion and the second conductive pattern formed in the protrusion portion may form a ground region of the printed circuit board. For example, the first conductive pattern and the second conductive pattern may be formed on a ground layer among the plurality of layers. The first conductive pattern and / or the second conductive pattern may be formed on a conductive layer (ground layer) serving as a ground region except for the region where signal lines are disposed among the plurality of conductive layers. Further, when the printed circuit board includes the plurality of layers, as the first conductive pattern and the second conductive pattern move away from the center of the printed circuit board, the moment effect increases, and thus the warping direction of the printed circuit board can be easily controlled.

[0128] Figure 10 Shows the results of measuring the warping magnitude of a printed circuit board according to the area of the conductor disposed on the layer. Comparing Figure 10The first data 1010 and the second data 1020 included in the first table 1001 can check that the warpage size increases as the difference in the conductive area between the layers of the printed circuit board increases. The first data 1010 shows the result in a state where the area of the conductors in the first to fourth layers among the layers included in the printed circuit board is about 80% and the area of the conductors in the fifth to eighth layers is about 60%. When the printed circuit board changes from the room temperature state to the high temperature state, the warpage size is about 1037 μm (397.5 - (-639.5)). In addition, the second data 1020 shows the result in a state where the area of the conductors in the first to fourth layers among the layers included in the printed circuit board is about 80% and the area of the conductors in the fifth to eighth layers is about 40%. When the printed circuit board changes from the room temperature state to the high temperature state, the warpage size is about 2371.6 μm (2370.6 - 199.0). That is, based on the first data 1010 and the second data 1020, it can be checked that in a state where the sizes of the areas of the conductors formed in some layers (for example, the first to fourth layers) of the printed circuit board are similar or the same, when the size of the area of the conductors formed in other layers (for example, the fifth to eighth layers) has a greater difference from the size of the area of the conductors formed in the said some layers, even the warpage size is large. Therefore, in the present invention, when the printed circuit board is a sub-printed circuit board, by applying the above first conductive pattern and second conductive pattern to the layers (for example, the fifth to eighth layers) located away from the main printed circuit board among the layers included in the sub-printed circuit board, the sub-printed circuit board can be controlled to warp in a direction similar to or the same as the warpage direction of the main printed circuit board.

[0129] Similarly, comparing those included in Figure 10The third data 1030 and the fourth data 1040 in the second table 1003 can detect that as the difference in the conductor area between the layers of the printed circuit board increases, the warpage size increases. The third data 1030 shows the results in a state where the area of the conductors included in the first to fourth layers among the layers of the printed circuit board is about 80%, the area of the conductors included in the fifth and sixth layers is about 40%, and the area of the conductors included in the seventh and eighth layers is about 80%. When the printed circuit board changes from the room temperature state to the high temperature state, the warpage size is about 68.9 μm (29.5 - (-39.4)). In addition, the fourth data 1040 shows the results in a state where the area of the conductors included in the first to fourth layers among the layers of the printed circuit board is about 80%, the area of the conductors included in the fifth and sixth layers is about 80%, and the area of the conductors included in the seventh and eighth layers is about 40%. When the printed circuit board changes from the room temperature state to the high temperature state, the warpage size is about 733.8 μm (321.8 - (-412.0)). That is, based on the third data 1030 and the fourth data 1040, it can be detected that in a state where the sizes of the areas of the conductors formed in some layers (e.g., the first to fourth layers) of the printed circuit board are similar or the same, when the size of the area of the conductors formed in the layers (e.g., the seventh and eighth layers) farther from the some layers than the layers (e.g., the fifth and sixth layers) positioned closer to the some layers has a greater difference from the size of the area of the conductors formed in the some layers, even the warpage size is large. Therefore, in the present invention, when the printed circuit board is a sub-printed circuit board, by applying the above first conductive pattern and second conductive pattern to the layers (e.g., the seventh and eighth layers) far from the main printed circuit board among the layers included in the printed circuit board, the sub-printed circuit board can be controlled to warp in a direction similar or the same as the warpage direction of the main printed circuit board.

[0130] Therefore, when the printed circuit board includes the plurality of layers, in order to easily control the warpage direction of the printed circuit board, the position of the layer of the printed circuit board on which the conductive pattern (e.g., the first conductive pattern formed in the main part and the second conductive pattern formed in the protruding part) is formed can be formed on at least one layer (e.g., the outermost layer) separated from the center of the printed circuit board by a specified distance or more.

[0131] The electronic device according to various embodiments can be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the above-described electronic devices.

[0132] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a singular noun corresponding to a term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in the corresponding one of the plurality of phrases. As used herein, terms such as "first" and "second" or "1st" and "2nd" may be used to simply distinguish a corresponding component from another component, and do not limit the component in other respects (e.g., importance or order). It will be understood that, in the case where the term "operatively" or "communicatively" is used or where the term "operatively" or "communicatively" is not used, if one element (e.g., a first element) is referred to as "coupled with another element (e.g., a second element)", "coupled to another element (e.g., a second element)", "connected with another element (e.g., a second element)", or "connected to another element (e.g., a second element)", it means that the one element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0133] As used in connection with the various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic", "logic block", "portion", or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0134] The various embodiments described herein can be implemented as software (e.g., program 140) including one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium with or without using one or more other components and run the at least one instruction. This enables the machine to operate to perform at least one function according to the at least one instruction invoked. The one or more instructions can include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Herein, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being stored temporarily in the storage medium.

[0135] According to an embodiment, a method according to various embodiments of the present disclosure can be included and provided in a computer program product. The computer program product can be traded between a seller and a purchaser as a product. The computer program product can be published in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or can be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or can be directly distributed (e.g., downloaded or uploaded) between two user devices (e.g., smart phones). If it is published online, at least part of the computer program product can be generated temporarily, or at least part of the computer program product can be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an application store's server, or a forwarding server).

[0136] According to various embodiments, each of the above components (e.g., modules or programs) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed the one or more functions before integration. According to various embodiments, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. A printed circuit board assembly, comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board and including a plurality of layers; and an insert disposed between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes: a first portion including a first conductive pattern; and a second portion protruding in a first direction from a part of the first portion and including a second conductive pattern, wherein the direction of the first conductive pattern of the parallel lines formed in the first portion is substantially perpendicular to the direction of the second conductive pattern of the parallel lines formed in the second portion, and wherein the first conductive pattern is formed on a ground layer which is one layer of the second printed circuit board.

2. The printed circuit board assembly according to claim 1, wherein the direction of the first conductive pattern is a second direction different from the first direction.

3. The printed circuit board assembly according to claim 2, wherein the first printed circuit board includes a first surface facing the second printed circuit board and a second surface facing the first surface, and the size of the area occupied by the conductor formed from the center of the first printed circuit board to the first surface of the first printed circuit board is larger than the size of the area occupied by the conductor formed from the center of the first printed circuit board to the second surface of the first printed circuit board.

4. The printed circuit board assembly according to claim 2, wherein the direction of the second conductive pattern is the first direction, and the second direction of the first conductive pattern is perpendicular to the first direction.

5. The printed circuit board assembly according to claim 4, wherein the ratio of the area occupied by the conductor included in the second printed circuit board to the entire area of the second printed circuit board is included in the range of 50% to 75%, and the ratio of the length of the second conductive pattern in the second direction perpendicular to the first direction to the length of the second portion in the second direction perpendicular to the first direction is less than 5%.

6. The printed circuit board assembly according to claim 2, wherein the second conductive pattern is formed on the ground layer of the second printed circuit board.

7. The printed circuit board assembly according to claim 2, wherein the first conductive pattern and the second conductive pattern are formed in the outermost layer among the plurality of layers of the second printed circuit board, and the outermost layer has a greater spacing distance from the first printed circuit board compared to at least another layer among the plurality of layers.

8. An electronic device, comprising: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a part of the space formed between the first surface and the second surface; a printed circuit board assembly disposed inside the housing; and at least one electronic component mounted on the printed circuit board assembly, wherein the printed circuit board assembly includes: a first printed circuit board; A second printed circuit board stacked with the first printed circuit board and including a plurality of layers; and An insert disposed between the first printed circuit board and the second printed circuit board, Wherein the second printed circuit board includes: A first portion including a first conductive pattern; and A second portion protruding in a third direction from a part of the first portion and including a second conductive pattern, Wherein the direction of the first conductive pattern of the parallel lines formed in the first portion is substantially perpendicular to the direction of the second conductive pattern of the parallel lines formed in the second portion, and Wherein the first conductive pattern is formed on a ground layer which is one layer of the second printed circuit board.

9. The electronic device according to claim 8, wherein the direction of the first conductive pattern is a fourth direction different from the third direction.

10. The electronic device according to claim 9, wherein the first printed circuit board includes a third surface facing the second printed circuit board and a fourth surface facing the third surface, and The size of the area occupied by the conductor formed from the center of the first printed circuit board to the third surface of the first printed circuit board is larger than the size of the area occupied by the conductor formed from the center of the first printed circuit board to the fourth surface of the first printed circuit board.

11. The electronic device according to claim 9, wherein the direction of the second conductive pattern is the third direction, and The fourth direction of the first conductive pattern is perpendicular to the third direction.

12. The electronic device according to claim 11, wherein the ratio of the area occupied by the conductor included in the second printed circuit board to the entire area of the second printed circuit board is in the range of 50% to 75%, and the ratio of the length of the second conductive pattern in the fourth direction perpendicular to the third direction to the length of the second portion in the fourth direction perpendicular to the third direction is less than 5%.

13. The electronic device according to claim 9, wherein the second conductive pattern is formed on the ground layer of the second printed circuit board.

14. The electronic device according to claim 9, wherein the first conductive pattern and the second conductive pattern are formed in the outermost layer among the plurality of layers of the second printed circuit board, and the outermost layer has a greater spacing distance from the first printed circuit board compared to at least another one of the plurality of layers.

15. A printed circuit board, Comprising: A first portion including a first conductive pattern; And A second portion protruding in a first direction from a part of the first portion and including a second conductive pattern, Wherein the direction of the first conductive pattern of the parallel lines formed in the first portion is substantially perpendicular to the direction of the second conductive pattern of the parallel lines formed in the second portion, and Wherein the first conductive pattern and the second conductive pattern are formed on a ground layer to form a ground area of the printed circuit board, and the ground layer is one layer of the printed circuit board.

16. The printed circuit board according to claim 15, wherein the direction of the first conductive pattern is a second direction different from the first direction.

17. The printed circuit board according to claim 16, wherein the direction of the second conductive pattern is the first direction, and the second direction of the first conductive pattern is perpendicular to the first direction.

18. The printed circuit board according to claim 17, wherein the ratio of the area occupied by the conductor included in the printed circuit board to the entire area of the printed circuit board is included in the range of 50% to 75%, and the ratio of the length of the second conductive pattern in the second direction perpendicular to the first direction to the length of the second portion in the second direction perpendicular to the first direction is less than 5%.

19. The printed circuit board according to claim 16, wherein the first conductive pattern and the second conductive pattern are formed in the outermost layer among the plurality of layers of the printed circuit board, and the outermost layer has a greater spacing distance from another printed circuit board compared to at least another layer among the plurality of layers.

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