Bonding equipment

Abstract

The present invention discloses a bonding device for bonding or debonding a circuit board. The bonding device includes a vacuum suction head and a hot pressing head. The vacuum suction head is configured to adsorb a non-bonding area of ​​the circuit board. One side of the vacuum suction head has a first lower side wall, a first upper side wall, and a first connecting surface adjacent to the first lower side wall and the first upper side wall. The hot pressing head is adjacent to the vacuum suction head and is configured to hot press the bonding area of ​​the circuit board. The side of the hot pressing head close to the vacuum suction head has a second lower side wall, a second upper side wall, and a second connecting surface adjacent to the second lower side wall and the second upper side wall. The second connecting surface at least partially overlaps with the first connecting surface, and the height of the second lower side wall is greater than the height of the first lower side wall.

Description

Technical Field

[0001] The present disclosure relates to a bonding device. Background Art

[0002] Generally speaking, a chip on film (COF) can be bonded to a substrate by thermal compression, so that pins of the substrate can be electrically connected to the bonding area of ​​the COF.

[0003] Conventional bonding equipment has a vacuum head with a heating function. When in use, the bonding area of ​​the chip-on-chip film can be adsorbed and moved to the top of the substrate. Then the vacuum head moves downward to electrically connect the chip-on-chip film to the pins of the substrate through heat pressing. However, the vacuum head must be in a heated state to have the heat pressing function, so it can only adsorb the bonding area of ​​the chip-on-chip film. But for products with a small bonding area, the relative position and alignment accuracy with the vacuum head are very high. In addition, since the chip-on-chip film is soft, the non-bonding area of ​​the chip-on-chip film will warp due to material properties or gravity, and when the vacuum head approaches the substrate, the non-bonding area of ​​the chip-on-chip film will contact the substrate and cause interference, which is not conducive to the stability of adsorption and heat pressing. Summary of the invention

[0004] A technical aspect of the present disclosure is a bonding device for bonding or debonding circuit boards.

[0005] According to some embodiments of the present disclosure, a bonding device includes a vacuum suction head and a hot pressing head. The vacuum suction head is configured to adsorb a non-bonding area of ​​a circuit board. One side of the vacuum suction head has a first lower side wall, a first upper side wall, and a first connecting surface adjacent to the first lower side wall and the first upper side wall. The hot pressing head is adjacent to the vacuum suction head and is configured to hot press the bonding area of ​​the circuit board. The side of the hot pressing head close to the vacuum suction head has a second lower side wall, a second upper side wall, and a second connecting surface adjacent to the second lower side wall and the second upper side wall. The second connecting surface at least partially overlaps with the first connecting surface, and the height of the second lower side wall is greater than the height of the first lower side wall.

[0006] In some embodiments, the distance between the bottom end of the first upper side wall and the bottom surface of the vacuum head is greater than or equal to the distance between the top end of the first lower side wall and the bottom surface of the vacuum head.

[0007] In some embodiments, a horizontal distance between the first upper sidewall and the first lower sidewall is greater than a horizontal distance between the second upper sidewall and the second lower sidewall.

[0008] In some embodiments, the angle between the first connecting surface and the horizontal plane is less than or equal to the angle between the second connecting surface and the horizontal plane.

[0009] In some embodiments, the thermal compression head has a thermal compression surface, and an edge of the thermal compression surface away from the vacuum suction head is aligned with an edge of the circuit board.

[0010] In some embodiments, the hot pressing head has a third side wall facing away from the second upper side wall and the second lower side wall, and the second lower side wall and the third side wall each have a chamfer at a connection with the hot pressing surface.

[0011] In some embodiments, the first connecting surface of the vacuum suction head is an inclined surface, and the first upper side wall, the first connecting surface and the first lower side wall define a wedge-shaped structure.

[0012] In some embodiments, the first connection surface of the vacuum head is a horizontal surface, and the first upper sidewall, the first connection surface, and the first lower sidewall define a stepped structure.

[0013] In some embodiments, the second connection surface of the thermal compression head is an inclined surface, and the second upper sidewall, the second connection surface and the second lower sidewall define a wedge-shaped structure.

[0014] In some embodiments, the second connection surface of the thermal compression head is a horizontal surface, and the second upper sidewall, the second connection surface, and the second lower sidewall define a stepped structure.

[0015] In the above-mentioned embodiment of the present disclosure, since the bonding equipment includes a vacuum suction head and a hot pressing head, the vacuum suction head can be used to adsorb the non-bonding area of ​​the circuit board, and the hot pressing head can be used to hot press the bonding area of ​​the circuit board. The area of ​​the non-bonding area is larger than that of the bonding area, so that a larger vacuum suction head can be used to adsorb stably, and the suction position of the vacuum suction head can be closer to the bonding area, reducing the sagging of the bonding area due to weight, thereby avoiding warpage caused by gravity factors, and reducing the alignment error of the vacuum suction head. In the process of the vacuum suction head approaching the substrate, the circuit board can be prevented from contacting the substrate to cause interference, which is beneficial to the stability of adsorption and hot pressing. In addition, since the volume of the part of the hot pressing head away from the circuit board can be increased, the hot pressing end can be reduced without making the heated volume too small, which can avoid the heat energy dissipation too fast and the hot pressing temperature cannot be maintained. During operation, the vacuum suction head and the hot pressing head can move toward the substrate together, which can avoid interference / collision between the vacuum suction head and the hot pressing head due to factors such as tolerance. When the vacuum suction head approaches the substrate to a predetermined position, it stops, and the hot pressing head can further descend to hot press the bonding area of ​​the circuit board so that the bonding area is electrically connected to the substrate. Since the height of the second lower side wall of the thermal pressing head is greater than the height of the first lower side wall of the vacuum suction head, it can be ensured that when the thermal pressing head heats the joining area of ​​the circuit board, the overlapping parts of the thermal pressing head and the vacuum suction head will not contact each other to cause mechanical interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] When read together with the accompanying drawings, the aspects of the present disclosure can be best understood from the following embodiments. Note that according to standard practice in this industry, various features are not drawn to scale. In fact, the size of various features may be arbitrarily increased or reduced for clarity of discussion.

[0017] Figure 1 A side view of a bonding device according to an embodiment of the present disclosure is shown.

[0018] Figure 2 Draw Figure 1 Schematic diagram of the bonding equipment when the circuit board is adsorbed but not yet hot pressed.

[0019] Figure 3 Draw Figure 2 Schematic diagram of the bonding equipment when hot pressing the circuit board.

[0020] Figure 4 A schematic diagram is shown of a bonding device heat-pressing a circuit board according to another embodiment of the present disclosure.

[0021] Figure 5 A schematic diagram is shown of a bonding device heat-pressing a circuit board according to another embodiment of the present disclosure.

[0022] Wherein, the reference numerals are:

[0023] 100, 100a, 100b: bonding equipment

[0024] 110,110a,110b: Vacuum suction head

[0025] 112: first lower side wall

[0026] 114: first upper side wall

[0027] 116: first connection surface

[0028] 117: Bottom surface

[0029] 120,120a,120b:Hot pressing head

[0030] 121: Hot pressing surface

[0031] 122: Second lower side wall

[0032] 124: Second upper side wall

[0033] 126: Second connection surface

[0034] 128: Third side wall

[0035] 210: Circuit board

[0036] 212: Junction area

[0037] 214: Non-joining area

[0038] 216: Conductive pin

[0039] 220: Light emitting module

[0040] 222:Substrate

[0041] 224: Light Source

[0042] 226: Conductive pin

[0043] 228: Molded layer

[0044] C: Chamfer

[0045] D: Direction

[0046] E1, E2: Edge

[0047] L: Dashed line

[0048] X1: Height (distance)

[0049] X2: Distance

[0050] X3: Height (distance)

[0051] Y1,Y2: horizontal distance

[0052] θ1,θ2: Angle DETAILED DESCRIPTION

[0053] The following disclosed embodiments provide many different embodiments, or examples, for implementing the different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present invention. Of course, these examples are only examples and are not intended to be limiting. In addition, the present invention may repeat element symbols and / or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not itself specify the relationship between the various embodiments and / or configurations discussed.

[0054] Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the accompanying drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0055] Figure 1 A side view of a bonding device 100 according to an embodiment of the present disclosure is shown. Figure 2 Draw Figure 1Schematic diagram of the bonding device 100 when the circuit board 210 is adsorbed but not yet hot pressed. Figure 1 and Figure 2 The bonding device 100 includes a vacuum head 110 and a hot pressing head 120, which can be used to bond or debond a circuit board 210. The vacuum head 110 is configured to adsorb a non-bonding area 214 of the circuit board 210. The side of the vacuum head 110 close to the hot pressing head 120 has a first lower side wall 112, a first upper side wall 114 and a first connecting surface 116, and the first connecting surface 116 is adjacent to the first lower side wall 112 and the first upper side wall 114. The hot pressing head 120 is adjacent to the vacuum head 110, and the hot pressing head 120 is configured to hot press the bonding area 212 of the circuit board 210. The side of the hot pressing head 120 close to the vacuum head 110 has a second lower side wall 122, a second upper side wall 124 and a second connecting surface 126, and the second connecting surface 126 is adjacent to the second lower side wall 122 and the second upper side wall 124. The second connection surface 126 at least partially overlaps with the first connection surface 116. In other words, the second connection surface 126 overlaps with the orthographic projection of the first connection surface 116 on the circuit board 210. In addition, the first lower side wall 112 of the vacuum suction head 110 has a height X1, and the second lower side wall 122 of the thermal compression head 120 has a height X3, and the height X3 of the second lower side wall 122 is greater than the height X1 of the first lower side wall 112.

[0056] In the present embodiment, the circuit board 210 may be a chip on film (COF), but is not limited thereto. The circuit board 210 has a bonding area 212 and a non-bonding area 214, and the bonding area 212 has a conductive pin 216. The hot pressing head 120 may bond the conductive pin 216 of the circuit board 210 to the conductive pin 226 of the light emitting module 220, so that the circuit board 210 is electrically connected to the light source 224. The conductive pin 226 of the light emitting module 220 may be electrically connected to a plurality of light sources 224, such as light emitting diodes, but is not limited thereto. In addition, the light emitting module 220 also has a molding layer 228 (Molding layer) covering the light source 224 to provide protection.

[0057] In the following description, steps in the operation of the bonding apparatus 100 will be described.

[0058] See also Figure 2 Since the bonding device 100 includes a vacuum suction head 110 and a hot pressing head 120, the vacuum suction head 110 can firstly absorb the non-bonding area 214 of the circuit board 210 before hot pressing, and the hot pressing surface 121 of the hot pressing head 120 is located above the bonding area 212 of the circuit board 210 and separated from the bonding area 212 by a distance. Then, the vacuum suction head 110 and the hot pressing head 120 can move together in the direction D, so that the circuit board 210 moves toward the direction D with the vacuum suction head 110 to approach the light emitting module 220.

[0059] Since the non-joining area 214 of the circuit board 210 is larger than the joining area 212, it can be stably adsorbed by a larger vacuum head 110, thereby avoiding warpage caused by gravity and reducing the alignment error of the vacuum head 110. In addition, when the vacuum head 110 approaches the substrate 222 of the light-emitting module 220, it can avoid interference between the circuit board 210 and the substrate 222, which is beneficial to the stability of adsorption and subsequent hot pressing.

[0060] In this embodiment, the hot pressing surface 121 of the hot pressing head 120 is aligned with the edge E1 of the vacuum suction head 110 and the edge E2 of the circuit board 210. Figure 2 This configuration can prevent the adhesive (not shown, such as anisotropic conductive film) under the conductive pin 216 from adhering to the hot pressing head 120 during subsequent hot pressing. In addition, the hot pressing head 120 has a third side wall 128 facing away from the second upper side wall 124 and the second lower side wall 122, and the second lower side wall 122 and the third side wall 128 each have a chamfer C at the connection with the hot pressing surface 121.

[0061] Figure 3 Draw Figure 2 Schematic diagram of the bonding device 100 when hot pressing the circuit board 210. Figure 2 and Figure 3 , the vacuum head 110 and the hot pressing head 120 can be moved together in the direction D to a predetermined position above the substrate 222 to avoid interference / collision between the vacuum head 110 and the hot pressing head 120 due to factors such as tolerance. The above-mentioned effect of avoiding mutual interference between the vacuum head 110 and the hot pressing head 120 exists regardless of whether a flexible circuit board 210 or a rigid circuit board 210 is used. Then, when the vacuum head 110 approaches the substrate 222 to the aforementioned predetermined position, it stops, and the hot pressing head 120 can further descend to hot press the bonding area 212 of the circuit board 210, so that the conductive pins 216 of the bonding area 212 are electrically connected to the conductive pins 226 on the substrate 222. In some embodiments, the conductive pins 216 of the circuit board 210 can be first covered by an anisotropic conductive film (ACF) and hot pressed to the conductive pins 226 on the substrate 222 by the hot pressing head 120, but it is not intended to limit the present disclosure. In some embodiments, the heat pressing head 120 may also be used with a buffer material (not shown) to heat press the bonding area where the circuit board and the substrate are bonded together again to ensure electrical connection.

[0062] The vacuum suction head 110 does not only absorb the larger non-joining area 214 of the circuit board 210 to avoid warpage. The suction position of the vacuum suction head 110 is also closer to the joining area 212 of the circuit board 210, so the sagging of the joining area 212 due to weight can be effectively reduced (the fulcrum is closer to the joining area 212). In addition, the vacuum suction head 110 can be closer to the joining area 212 because the vacuum suction head 110 is separated from the hot pressing head 120, so that the volume of the part of the hot pressing head 120 away from the circuit board 210 (such as the upper half) can be increased. In this way, even if the hot pressing end of the hot pressing head 120 (such as the part close to the hot pressing surface 121) is reduced, the heated volume will not be too small, which can prevent the heat energy from dissipating too quickly and the hot pressing temperature from being unable to be maintained. Since the hot pressing end of the hot pressing head 120 can be reduced, the vacuum suction head 110 can be closer to the joining area 212. In addition, the vacuum suction head 110 and the thermal compression head 120 can be used for the flexible circuit board 210 with chip on film, and can also be used for thinned rigid circuit boards to solve the warping problem.

[0063] Back to Figure 1 Since the height X3 of the second lower side wall 122 of the hot pressing head 120 is greater than the height X1 of the first lower side wall 112 of the vacuum suction head 110, it can be ensured that when the hot pressing head 120 heats the bonding area 212 of the circuit board 210, the overlapping parts of the hot pressing head 120 and the vacuum suction head 110 will not contact each other and cause mechanical interference. In this embodiment, the distance X2 between the bottom end of the first upper side wall 114 of the vacuum head 110 and the bottom surface 117 of the vacuum head 110 is greater than the distance X1 between the top end of the first lower side wall 112 of the vacuum head 110 and the bottom surface 117 of the vacuum head 110, the angle θ1 between the first connecting surface 116 and the horizontal plane is less than or equal to the angle θ2 between the second connecting surface 126 and the horizontal plane, and the horizontal distance Y1 between the first upper side wall 114 and the first lower side wall 112 is greater than the horizontal distance Y2 between the second upper side wall 124 and the second lower side wall 122. All of the above designs can further prevent the hot pressing head 120 from contacting the vacuum head 110 when moving downward for hot pressing. Figure 1 In the embodiment, the angles θ1 and θ2 may be acute angles. In other embodiments, the angles θ1 and θ2 may be zero, such as Figure 5 The structure is shown.

[0064] In this embodiment, the first connection surface 116 of the vacuum suction head 110 is an inclined surface, and the first upper side wall 114, the first connection surface 116 and the first lower side wall 112 define a wedge-shaped structure. The second connection surface 126 of the hot pressing head 120 is an inclined surface, and the second upper side wall 124, the second connection surface 126 and the second lower side wall 122 define a wedge-shaped structure. In this way, the vacuum suction head 110 has a structure that is narrow at the top and wide at the bottom, which is conducive to adsorbing the non-joining area 214 of the circuit board 210 (see Figure 3), and the hot pressing head 120 has a structure that is wide at the top and narrow at the bottom, which is conducive to providing a sufficiently high and uniform temperature to the hot pressing surface 121 to heat press the bonding area 212 of the circuit board 210 (see Figure 3 ).

[0065] It should be understood that the connection relationship, materials and functions of the components described above will not be repeated, and will be described first. In the following description, other types of bonding equipment will be described.

[0066] Figure 4 FIG. 2 is a schematic diagram of a bonding device 100a according to another embodiment of the present disclosure when hot pressing a circuit board 210. The bonding device 100a includes a vacuum suction head 110a and a hot pressing head 120a. Figure 3 The difference between the embodiments is that the vacuum head 110a and the hot pressing head 120a are detachably connected to each other. For example, the first lower side wall 112 and the first upper side wall 114 of the vacuum head 110a are in contact with the second lower side wall 122 and the second upper side wall 124 of the hot pressing head 120a respectively, so that the vacuum head 110a and the hot pressing head 120a can be close together.

[0067] With this configuration, the vacuum suction head 110a can be used to suction the non-bonding area 214 of the circuit board 210, and the heat pressing head 120a can be used to heat press the bonding area 212 of the circuit board 210. During the movement of the vacuum suction head 110a and the heat pressing head 120a or when the heat pressing head 120a is heat pressing, the vacuum suction head 110a can firmly suction the circuit board 210 to prevent the circuit board 210 from warping due to gravity and contacting the substrate 222 of the light emitting module 220.

[0068] Figure 5 FIG. 2 is a schematic diagram of a bonding device 100b according to another embodiment of the present disclosure when hot pressing a circuit board 210. The bonding device 100b includes a vacuum suction head 110b and a hot pressing head 120b. Figure 3 The difference between the embodiments is that the distance X2 between the bottom end of the first upper side wall 114 of the vacuum head 110b and the bottom surface 117 of the vacuum head 110b is equal to the distance X1 between the top end of the first lower side wall 112 of the vacuum head 110b and the bottom surface 117 of the vacuum head 110b. In addition, the first connecting surface 116 of the vacuum head 110b is a horizontal plane, and the first upper side wall 114, the first connecting surface 116 and the first lower side wall 112 define a stepped structure. The second connecting surface 126 of the hot pressing head 120b is a horizontal plane, and the second upper side wall 124, the second connecting surface 126 and the second lower side wall 122 define a stepped structure.

[0069] With this configuration, the vacuum suction head 110b can be used to suction the non-bonding area 214 of the circuit board 210, and the heat pressing head 120b can be used to heat press the bonding area 212 of the circuit board 210. During the movement of the vacuum suction head 110b and the heat pressing head 120b or during the heat pressing of the heat pressing head 120b, the vacuum suction head 110b can firmly suction the circuit board 210 to prevent the circuit board 210 from warping due to gravity and contacting the substrate 222 of the light emitting module 220.

[0070] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also appreciate that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present disclosure.

Claims

1. A bonding device, characterized in that: For joining or de-joining a circuit board, comprising: a vacuum suction head configured to suck the non-joining area of ​​the circuit board, wherein one side of the vacuum suction head has a first lower side wall, a first upper side wall, and a first connecting surface adjacent to the first lower side wall and the first upper side wall; and A heat pressing head is adjacent to the vacuum suction head and is configured to heat press the bonding area of ​​the circuit board. The heat pressing head has a second lower side wall, a second upper side wall and a second connecting surface adjacent to the second lower side wall and the second upper side wall on a side close to the vacuum suction head, wherein the second connecting surface at least partially overlaps with the first connecting surface, and the height of the second lower side wall is greater than the height of the first lower side wall.

2. The bonding device according to claim 1, characterized in that The distance between the bottom end of the first upper side wall and a bottom surface of the vacuum suction head is greater than or equal to the distance between the top end of the first lower side wall and the bottom surface of the vacuum suction head.

3. The bonding device according to claim 1, characterized in that A horizontal distance between the first upper side wall and the first lower side wall is greater than a horizontal distance between the second upper side wall and the second lower side wall.

4. The bonding device according to claim 1, characterized in that The included angle between the first connecting surface and the horizontal plane is less than or equal to the included angle between the second connecting surface and the horizontal plane.

5. The bonding device according to claim 1, characterized in that The heat pressing head has a heat pressing surface, and the edge of the heat pressing surface away from the vacuum suction head is aligned with the edge of the circuit board.

6. The joining device according to claim 5, characterized in that The hot pressing head has a third side wall facing away from the second upper side wall and the second lower side wall, and the second lower side wall and the third side wall each have a chamfer at a connection with the hot pressing surface.

7. The joining device according to claim 1, characterized in that The first connecting surface of the vacuum suction head is an inclined surface, and the first upper side wall, the first connecting surface and the first lower side wall define a wedge-shaped structure.

8. The joining device according to claim 1, characterized in that The first connection surface of the vacuum suction head is a horizontal surface, and the first upper side wall, the first connection surface and the first lower side wall define a stepped structure.

9. The bonding device according to claim 1, characterized in that The second connecting surface of the thermal compression head is an inclined surface, and the second upper side wall, the second connecting surface and the second lower side wall define a wedge-shaped structure.

10. The bonding device according to claim 1, characterized in that The second connection surface of the thermal compression head is a horizontal surface, and the second upper side wall, the second connection surface and the second lower side wall define a stepped structure.

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