Wafer leveling device, control method and storage medium

Abstract

A wafer leveling device, a control method, and a storage medium, the device includes a wafer platform, multiple tubes, a wafer fixing mechanism, an exhaust system, and a drive system. By utilizing the wafer fixing mechanism, the wafer can be fixed on the wafer platform to facilitate subsequent operations to level the wafer surface; by utilizing the exhaust system, the air on the lower side of the wafer platform is extracted, so that an air pressure difference is formed between the upper and lower sides of the wafer platform, so that the atmospheric pressure on the upper side of the wafer platform presses the wafer tightly onto the wafer platform, thereby leveling the raised part of the wafer; by utilizing the drive system, the multiple tubes are driven to move vertically in the tube hole, so that the concave part of the wafer can be lifted up by the tube, thereby leveling the wafer. Therefore, by utilizing the wafer leveling device of the embodiment of the present invention, the concave and convex parts of the wafer surface can be leveled, which is beneficial to the processing and packaging of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of wafer packaging technology, and in particular to a wafer leveling device, a control method and a storage medium. Background Art

[0002] Packaging is an essential link in the integrated circuit industry chain. Specifically, it involves processing tested wafers into independent chips, protecting the circuits from the surrounding environment. Its main functions include protecting the chip, enhancing heat dissipation, enabling electrical and physical connections, and distributing power and signals. It connects the internal and external circuits of the chip and serves as a bridge between integrated circuits and external systems. Wafer-level packaging involves packaging the chip while it is still on the wafer. A protective layer can be bonded to the top or bottom of the wafer, then the circuits are connected and the wafer is cut into individual chips. When the lithography equipment performs photolithography on the wafer, strict requirements are placed on the wafer's placement and flatness. This is especially true when achieving nanoscale or even smaller chip interconnections in the future, where wafer flatness requirements will be even more stringent. Therefore, the uneven wafer surface caused by wafer warping poses a major challenge to existing packaging processes, making packaging more difficult. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a wafer leveling device that solves the problem of uneven wafer surface caused by warping and deformation during wafer packaging.

[0004] The present invention also provides a control method and a storage medium for a wafer leveling device.

[0005] A wafer leveling device according to an embodiment of the first aspect of the present invention includes:

[0006] A wafer platform is provided with a plurality of column holes, wherein the plurality of column holes are perpendicular to the upper surface of the wafer platform;

[0007] a plurality of tube pillars corresponding one to one with the plurality of tube pillar holes, the plurality of tube pillars being all located on the lower side of the wafer platform, and one end of each of the tube pillars being disposed in the corresponding tube pillar hole;

[0008] A wafer fixing mechanism, used for fixing the wafer on the upper surface of the wafer platform;

[0009] an exhaust system, used to make the wafer closely attached to the upper surface of the wafer platform;

[0010] The driving system is used to adjust the position of each pipe string in the corresponding pipe string hole along the axial direction of the pipe string hole.

[0011] The wafer leveling device according to the embodiment of the present invention has at least the following beneficial effects:

[0012] By utilizing a wafer fixing mechanism, the wafer can be fixed on the wafer platform to facilitate subsequent operations to flatten the wafer surface; by utilizing an exhaust system, the air on the lower side of the wafer platform is extracted, so that an air pressure difference is formed on the upper and lower sides of the wafer platform, so that the atmospheric pressure on the upper side of the wafer platform presses the wafer tightly onto the wafer platform, thereby flattening the raised portion of the wafer; by utilizing a drive system, multiple tubes are driven to move vertically in the tube hole, so that the concave portion of the wafer can be lifted up by the tube, thereby flattening the wafer. Therefore, by utilizing the wafer flattening device of an embodiment of the present invention, the concave and convex portions of the wafer surface can be flattened, which is beneficial to the processing and packaging of the wafer.

[0013] According to some embodiments of the present invention, the plurality of pipe columns are hollow pipe columns, one end of each of the hollow pipe columns is disposed in the corresponding pipe column hole, and the gas extraction system is respectively connected to the other ends of the plurality of hollow pipe columns.

[0014] According to some embodiments of the present invention, the gas extraction system includes a plurality of first gas extraction devices, and the plurality of first gas extraction devices are respectively connected to the other ends of the plurality of hollow tube columns in a one-to-one correspondence.

[0015] According to some embodiments of the present invention, the first air extraction device is a vacuum pump or a blower.

[0016] According to some embodiments of the present invention, the drive system adopts a motor drive system.

[0017] According to some embodiments of the present invention, the plurality of pipe columns are all solid pipe columns, and the gas extraction system includes:

[0018] An air pumping box is provided on the lower side of the wafer platform, the air pumping box is connected to the upper side of the wafer platform through a plurality of the tube column holes, each of the tube columns is located in the air pumping box and the bottom surface of each of the tube columns extends to the outside of the air pumping box;

[0019] The second air extraction device is connected to the air extraction box, and the second air extraction device is used to extract the air in the air extraction box.

[0020] According to some embodiments of the present invention, the drive system includes:

[0021] A hydraulic box is provided on the lower side of the air extraction box, wherein a plurality of communication holes corresponding to the plurality of pipe strings are opened on the upper surface of the hydraulic box, and the bottom surface of each pipe string is provided in the hydraulic box through the communication hole;

[0022] A plurality of locking mechanisms are provided on the plurality of communicating holes in a one-to-one correspondence, and each locking mechanism is used to adjust the locking or loosening of each pipe string in the communicating hole;

[0023] The hydraulic pushing mechanism is arranged in the hydraulic box, and the hydraulic box is used to push the liquid in the hydraulic box to drive the pipe string.

[0024] According to some embodiments of the present invention, the wafer fixing mechanism includes a plurality of fixing arms, which are spaced apart and distributed on the wafer platform. One end of each of the fixing arms is fixedly connected to the upper surface of the wafer platform, and the other end of each of the fixing arms is used to press each side edge of the wafer.

[0025] According to a control method for a wafer leveling device according to an embodiment of a second aspect of the present invention, the wafer leveling device includes a wafer platform, a plurality of tube pillars, a wafer fixing mechanism, an exhaust system, and a drive system; the wafer platform is provided with a plurality of tube pillar holes, and the plurality of tube pillar holes are all perpendicular to the upper surface of the wafer platform; a plurality of tube pillars corresponding to the plurality of tube pillar holes are all located on the lower side of the wafer platform, and one end of each tube pillar is disposed in the corresponding tube pillar hole; the wafer fixing mechanism is used to fix the wafer to the upper surface of the wafer platform;

[0026] The control method includes:

[0027] Controlling the exhaust system to start so that the wafer is closely attached to the wafer platform;

[0028] Acquiring flatness data of the wafer at any position on the wafer platform;

[0029] The driving system is controlled according to the leveling data to adjust the position of the pipe string in the corresponding pipe string hole along the axial direction of the pipe string hole.

[0030] The control method of the wafer leveling device according to the embodiment of the present invention has at least the following beneficial effects:

[0031] By executing the control method of the embodiment of the present invention on the wafer leveling device, the wafer leveling device can perform corresponding operations on the wafer, so that the protrusions or depressions generated at any position on the wafer become flat, thereby ultimately achieving the flattening of the entire wafer, which is beneficial to the processing and packaging of the wafer.

[0032] According to the computer-readable storage medium of the embodiment of the third aspect of the present invention, the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the control method of the wafer leveling device as described in the embodiment of the second aspect of the present invention.

[0033] The computer-readable storage medium according to the embodiment of the present invention has at least the following technical effects: by introducing the computer-readable storage medium of the embodiment of the present invention into a microprocessor chip or a processor, the microprocessor chip or the processor can perform operations on the wafer leveling device described in the embodiment of the first aspect of the present invention to realize the control method of the wafer leveling device described in the embodiment of the second aspect of the present invention.

[0034] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0036] Figure 1 is a schematic diagram of a partial structure of a wafer leveling device according to an embodiment of the present invention;

[0037] Figure 2 is a schematic diagram of a wafer leveling device according to an embodiment of the present invention;

[0038] Figure 3 for Figure 2 Implementation effect diagram;

[0039] Figure 4 Schematic diagram of the structure of the first air extraction device and the motor drive system according to an embodiment of the present invention;

[0040] Figure 5 for Figure 2 A schematic diagram of an improved implementation method;

[0041] Figure 6 is a schematic diagram of a wafer leveling device according to an embodiment of the present invention;

[0042] Figure 7 for Figure 5 Implementation effect diagram;

[0043] Figure 8 Flowchart of a control method for a wafer leveling device according to an embodiment of the present invention.

[0044] Figure Number:

[0045] Wafer 100;

[0046] Wafer platform 200;

[0047] Tube string 300; hollow tube string 310; solid tube string 320;

[0048] First air extraction device 410; motor drive system 420; nut 421; screw rod 422; motor device 423; movable base 430;

[0049] Air pumping box 510; second air pumping device 520; hydraulic box 530; locking mechanism 540; hydraulic pushing mechanism 550;

[0050] Fixed arm 600. DETAILED DESCRIPTION

[0051] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0052] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientation or positional relationship indicated by up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0053] In the description of the present invention, "a plurality" refers to more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features, or implicitly indicating the order of the indicated technical features.

[0054] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0055] Reference Figure 1 As shown, a wafer leveling device according to an embodiment of the present invention includes a wafer platform 200, a plurality of tube pillars 300, a wafer fixing mechanism, an exhaust system, and a drive system. The wafer platform 200 is provided with a plurality of tube pillar holes, and the plurality of tube pillar holes are all perpendicular to the upper surface of the wafer platform 200; a plurality of tube pillars 300 corresponding to the plurality of tube pillar holes are all located on the lower side of the wafer platform 200, and one end of each tube pillar 300 is set in the corresponding tube pillar hole; the wafer fixing mechanism is used to fix the wafer 100 on the upper surface of the wafer platform 200; the exhaust system is used to make the wafer 100 tightly attached to the upper surface of the wafer platform 200; and the drive system is used to adjust the position of each tube pillar 300 in the corresponding tube pillar hole along the axial direction of the tube pillar hole.

[0056] Reference Figure 1As shown, the wafer platform 200 can be a rectangular plate or other regular graphic plate, etc., and the wafer platform 200 is provided with column holes that pass through the surfaces of both sides of the platform. The column holes are arranged relatively closely and are arranged in a circular shape as a whole to cover the entire surface of the wafer 100. The wafer 100 is aligned with the column holes on the wafer platform 200 and fixed by a wafer fixing mechanism. A plurality of columns 300 are provided on the lower side of the wafer platform 200. The columns 300 can be rectangular columns or circular columns, etc. The plurality of columns 300 are parallel and close to each other, and one end of the plurality of columns 300 is vertically arranged in a plurality of column holes corresponding to each other. Exhaust system ( Figure 1 The drive system (not shown) is used to adjust the vertical movement of the pipe column 300 in the pipe column hole so that the upper end of the pipe column 300 can adjust the surface of the wafer 100.

[0057] By utilizing a wafer fixing mechanism, the wafer 100 can be fixed on the wafer platform 200, so as to facilitate subsequent operations to flatten the surface of the wafer 100; by utilizing an exhaust system, the air on the lower side of the wafer platform 200 is extracted, so that an air pressure difference is formed between the upper and lower sides of the wafer platform 200, so that the atmospheric pressure on the upper side of the wafer platform 200 presses the wafer 100 tightly onto the wafer platform 200, thereby flattening the raised portion of the wafer 100; by utilizing a drive system, the multiple tube pillars 300 are driven to move vertically in the tube pillar holes, so that the concave portion of the wafer 100 can be lifted by the tube pillars 300, thereby flattening the wafer 100. Therefore, by utilizing the wafer flattening device of the embodiment of the present invention, the concave and convex portions of the surface of the wafer 100 can be flattened, which is beneficial to the processing and packaging of the wafer 100.

[0058] In some embodiments, as Figure 2 and Figure 3 As shown, the plurality of pipe strings 300 all adopt hollow pipe strings 310 , one end of each hollow pipe string 310 is disposed in a corresponding pipe string hole, and the gas extraction system is connected to the other end of each of the plurality of hollow pipe strings 310 .

[0059] Reference Figure 2 and Figure 3As shown, the side wall of each tube column 300 is tightly attached to the inner wall of the tube column hole without any gap. The upper end of each tube column 300 needs to be tightly attached to the lower surface of the wafer 100. The lower end of each tube column 300 is connected to an exhaust system, which can be specifically exhausted by a first exhaust device 410. By turning on the exhaust system, the air in each hollow tube column 310 is extracted. According to the principle of atmospheric pressure and air pressure difference, it can be understood that the upper end of each tube column 300 can tightly adsorb the lower surface of the wafer 100. Then turn on the drive system to adjust the up and down movement of each tube column 300, so that each position on the surface of the wafer 100 can be adjusted to a relatively horizontal and flat surface. The wafer flattening effect diagram can be referred to. Figure 3 .

[0060] It is understandable that Figure 2 and Figure 3 Only part of the pipe string 300 is shown. The actual pipe string 300 is compact and small in diameter. Figure 1 , the position of each unevenness on the wafer 100 can be adjusted to the greatest extent. Figure 2 and Figure 3 Only one first air extraction device 410 is shown connected to the lower end of one pipe column 300 . In fact, the lower end of each pipe column 300 can be extracted by the first air extraction device 410 , which is simply not shown in the figure.

[0061] In some embodiments, the gas extraction system includes a plurality of first gas extraction devices 410 , and the plurality of first gas extraction devices 410 are respectively connected to the other ends of the plurality of hollow tube columns 310 in a one-to-one correspondence.

[0062] It is understandable that for Figure 2 and Figure 3 The lower end of each of the multiple tube columns 300 can be connected to a first exhaust device 410, so as to facilitate independent control of each tube column 300 to further accurately adjust the uneven areas on the wafer 100.

[0063] In some embodiments, the first exhaust device 410 is a vacuum pump or a blower.

[0064] A vacuum pump is a device or equipment that uses mechanical, physical, chemical, or physicochemical methods to evacuate a container to create a vacuum. In simple terms, a vacuum pump is a device that uses various methods to improve, create, and maintain a vacuum in a closed space. Advantages of vacuum pumps include: high pumping speeds over a wide pressure range; excellent rotor geometric symmetry, resulting in low vibration and smooth operation; clearances between the rotors and between the rotor and the housing, eliminating the need for lubrication and minimizing friction losses, significantly reducing drive power and enabling higher speeds; eliminating the need for oil seals and lubrication within the pump chamber, reducing oil vapor contamination of the vacuum system; and lacking compression and an exhaust valve within the pump chamber. The pump has a simple, compact structure and is insensitive to dust and water vapor in the pumped gas.

[0065] The blower is mainly composed of the following six parts: motor, air filter, blower body, air chamber, base (also oil tank), and oil drip nozzle. The blower relies on the eccentric operation of the rotor offset in the cylinder, and the volume change between the blades in the rotor slot causes the air to be sucked in, compressed, and expelled. During operation, the pressure difference of the blower is used to automatically send lubricant to the oil drip nozzle and drip into the cylinder to reduce friction and noise, while keeping the gas in the cylinder from flowing back. This type of blower is also called a sliding vane blower. The advantages of the blower are: it has dual functions of blowing and suction, one machine can be used for both suction and blowing; the blower has a stable structure, safe operation, low mechanical friction, and a long service life; the impeller of the blower has no friction when it is running, and does not need to be lubricated regularly, and the exhausted gas is clean and harmless. Therefore, the first exhaust device 410 of the embodiment of the present invention uses a vacuum pump or a blower, which can well realize the extraction of air from each hollow pipe column 310.

[0066] In some embodiments, as Figures 2 to 5 As shown, the drive system adopts a motor drive system 420.

[0067] refer to Figure 2 or Figure 3 The motor drive system 420 can be connected to the side of the pipe string 300, and the pipe string 300 can be moved up and down using the principle of motor drive. Figure 4 , Figure 4 The specific structure of the motor drive system 420 is shown. The motor drive system 420 includes: a nut 421, a screw rod 422, and a motor device 423. The nut 421 is connected to the pipe string 300; the screw rod 422 is threadedly connected to the nut 421; and the motor device 423 is used to drive the screw rod 422 to rotate about the axis. The motor drives the screw rod 422 to rotate about the axis, so that the nut 421 moves along the screw rod 422, thereby driving the pipe string 300 to move up and down. It is understandable that multiple motor drive systems 420 can be provided, each corresponding to a plurality of pipe strings 300, so that the pipe string 300 that needs to be adjusted can be moved.

[0068] It is understood that in some embodiments, Figure 5 As shown, the motor drive system 420 is placed on the moving platform, and the position of the moving platform on the horizontal plane is adjusted by electronic control, so that the up and down movement of multiple pipe strings 300 can be adjusted by using one motor drive system 420.

[0069] It is understandable that Figures 2 to 5 They are all two-dimensional schematic diagrams at a certain perspective. In practice, the first exhaust device 410 and the motor drive system 420 can be placed in a variety of spatial ways, and the realization of their corresponding functions does not interfere with each other in space. The final flattening effect diagram can be referred to Figure 3 .

[0070] In some embodiments, as Figure 6 and Figure 7 As shown, multiple tube columns 300 all use solid tube columns 320, and the exhaust system includes: an exhaust box 510 and a second exhaust device 520. The exhaust box 510 is disposed on the lower side of the wafer platform 200 and is connected to the upper side of the wafer platform 200 through multiple tube column holes. Each tube column 300 is located in the exhaust box 510, and the bottom surface of each tube column 300 extends to the outside of the exhaust box 510; the second exhaust device 520 is connected to the exhaust box 510 and is used to extract air from the exhaust box 510.

[0071] refer to Figure 6 As shown, the vacuum box 510 is a rectangular box. It is understandable that the vacuum box 510 can also be a box of other regular shapes. The vacuum box 510 is not provided with an upper surface and is covered by the wafer platform 200. Each tube column 300 is set in the vacuum box 510, and the upper end of each tube column 300 is set in the tube column hole. The lower end of each tube column 300 passes through the bottom of the vacuum box 510 and is sealed therewith. The diameter of the tube column 300 is slightly smaller than the diameter of the tube column hole, so that the vacuum box 510 is connected to the outside atmosphere through the tube column hole on the wafer platform 200. One side of the vacuum box 510 is connected to the second vacuum device 520. After the second vacuum device 520 is turned on, the air in the vacuum box 510 can be exhausted. According to the principle of atmospheric pressure and pressure difference, the wafer 100 can be closely attached to the upper surface of the wafer platform 200. Then start the drive system to adjust the up and down movement of each column 300, so that each position on the surface of the wafer 100 can be adjusted to a relatively horizontal level. The wafer leveling effect diagram can be referred to Figure 7 It is understood that since the gas is not extracted through the pipe column 300 , the pipe column 300 needs to be a solid pipe column 320 .

[0072] In some embodiments, as Figure 6 and Figure 7As shown, the drive system includes: a hydraulic box 530, multiple locking mechanisms 540, and a hydraulic pushing mechanism 550. The hydraulic box 530 is arranged on the lower side of the vacuum box 510. The upper surface of the hydraulic box 530 is provided with multiple communication holes corresponding to the multiple pipe strings 300. The bottom surface of each pipe string 300 is set in the hydraulic box 530 through the communication hole; multiple locking mechanisms 540 are arranged on the multiple communication holes in a one-to-one correspondence. Each locking mechanism 540 is used to adjust the locking or loosening of each pipe string 300 in the communication hole; the hydraulic pushing mechanism 550 is arranged in the hydraulic box 530, and the hydraulic box 530 is used to push the liquid in the hydraulic box 530 to drive the pipe strings 300.

[0073] refer to Figure 6 As shown, the hydraulic box 530 is a rectangular box, which is arranged on the lower side of the air extraction box 510, and a groove is provided between the air extraction box 510 and the hydraulic box 530. The upper surface of the air extraction box 510 is provided with a plurality of connecting holes, and each connecting hole is provided with a locking mechanism 540. Under the premise that the air extraction system is set up, the bottom end of each pipe string 300 will pass through each connecting hole, be arranged between each locking mechanism 540, and be located inside the hydraulic box 530. A hydraulic pushing mechanism 550 is provided on one side of the hydraulic box 530. An appropriate amount of liquid is placed inside the hydraulic box 530, and each opening of each pipe string 300 is locked by each locking mechanism 540 to make the upper surface of the hydraulic box 530 sealed. It is understandable that when a certain pipe column 300 needs to be adjusted, the corresponding locking mechanism 540 is loosened by electronic control, and the liquid in the hydraulic box 530 is compressed by the hydraulic pushing mechanism 550. The pressure generated by the liquid will push the pipe column 300 upward, thereby achieving the adjustment of the pipe column 300. Figure 7 .

[0074] It should be noted that when the liquid in the hydraulic box 530 is squeezed, a small amount of the liquid will flow into the groove on the upper side of the hydraulic box 530 through the gap created by the loosening of the locking mechanism 540, thereby not affecting the upper side of the exhaust system. It is understandable that the depression or protrusion of the wafer 100 is very small, so it is possible to ensure through precise calculation that the distance that the bottom end of the pipe column 300 extends into the hydraulic box 530, that is, the distance that the pipe column 300 can be adjusted and moved by hydraulic drive, is sufficient to meet the requirements of the flattening effect. It is understandable that in some cases in some embodiments, the liquid in the hydraulic box 530 can be replaced with gas, so that the movement of the pipe column 300 is achieved by air pressure drive.

[0075] In some embodiments, as Figure 1As shown, the wafer fixing mechanism includes a plurality of fixing arms 600, which are spaced apart and distributed on the wafer platform 200. One end of each fixing arm 600 is fixedly connected to the upper surface of the wafer platform 200, and the other end of each fixing arm 600 is used to press each side edge of the wafer 100.

[0076] It is understandable that by providing a plurality of fixed arms 600 , the movement of the wafer 100 on the wafer platform 200 is restricted, ensuring that the wafer 100 is always located on the upper side of the column hole, thereby ensuring subsequent leveling operations.

[0077] Reference Figure 8 As shown, a control method for a wafer leveling device according to an embodiment of the present invention is provided. The wafer leveling device includes a wafer platform 200, a plurality of tube pillars 300, a wafer fixing mechanism, an exhaust system, and a drive system. The wafer platform 200 is provided with a plurality of tube pillar holes, and the plurality of tube pillar holes are all perpendicular to the upper surface of the wafer platform 200. The plurality of tube pillars 300 corresponding to the plurality of tube pillar holes are all located on the lower side of the wafer platform 200, and one end of each tube pillar 300 is disposed in the corresponding tube pillar hole. The wafer fixing mechanism is used to fix the wafer 100 on the upper surface of the wafer platform 200.

[0078] Control methods include:

[0079] Controlling the exhaust system to start so that the wafer 100 is closely attached to the wafer platform 200;

[0080] Acquiring flatness data of the wafer 100 at any position on the wafer platform 200;

[0081] The driving system is controlled according to the leveling data to adjust the position of the pipe string 300 in the corresponding pipe string hole along the axial direction of the pipe string hole.

[0082] It should be noted that the control method of the wafer leveling device in the embodiment of the present invention corresponds to the wafer leveling device in the embodiment of the present invention. Please refer to the above content for the specific structure of the wafer leveling device, which will not be repeated here.

[0083] By executing the control method of the embodiment of the present invention on the wafer leveling device, the wafer leveling device can perform corresponding operations on the wafer 100. Specifically, the exhaust system is first activated to flatten the protrusions on the surface of the wafer 100, and then the drive system is activated to flatten the depressions on the surface of the wafer 100. Therefore, by adjusting each unevenness on the wafer 100, the protrusions or depressions generated at any position on the wafer 100 are flattened, thereby ultimately achieving the flattening of the entire wafer 100, which is beneficial for the processing and packaging of the wafer 100.

[0084] A computer-readable storage medium according to an embodiment of the present invention stores computer-executable instructions, which are used to enable a computer to execute a control method for a wafer leveling device according to an embodiment of the second aspect of the present invention.

[0085] It can be understood that by introducing the computer-readable storage medium of an embodiment of the present invention into a microprocessor chip or processor, the microprocessor chip or processor can perform operations on the wafer leveling device of the first embodiment of the present invention to implement the control method of the wafer leveling device of the second embodiment of the present invention.

[0086] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0087] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A wafer leveling device, characterized in that: include: A wafer platform is provided with a plurality of column holes, wherein the plurality of column holes are perpendicular to the upper surface of the wafer platform; a plurality of tube pillars corresponding one to one with the plurality of tube pillar holes, the plurality of tube pillars being all located on the lower side of the wafer platform, and one end of each of the tube pillars being disposed in the corresponding tube pillar hole; A wafer fixing mechanism, used for fixing the wafer on the upper surface of the wafer platform; an exhaust system, used to make the wafer closely attached to the upper surface of the wafer platform; A drive system for adjusting the position of each pipe string in the corresponding pipe string hole along the axial direction of the pipe string hole; The plurality of pipe columns are all solid pipe columns, and the gas extraction system includes: An air pumping box is provided on the lower side of the wafer platform, the air pumping box is connected to the upper side of the wafer platform through a plurality of the tube column holes, each of the tube columns is located in the air pumping box and the bottom surface of each of the tube columns extends to the outside of the air pumping box; a second air extraction device, connected to the air extraction box, and used to extract air from the air extraction box; The drive system comprises: A hydraulic box is provided on the lower side of the air extraction box, wherein a plurality of communication holes corresponding to the plurality of pipe strings are opened on the upper surface of the hydraulic box, and the bottom surface of each pipe string is provided in the hydraulic box through the communication hole; a groove is provided between the upper side of the hydraulic box and the lower side of the air extraction box; A plurality of locking mechanisms are provided on the plurality of communicating holes in a one-to-one correspondence, and each of the locking mechanisms is used to adjust the locking or loosening of each pipe string in the communicating hole; A hydraulic pushing mechanism, disposed in the hydraulic box, the hydraulic box being used to push the liquid in the hydraulic box to drive the pipe string; The wafer fixing mechanism includes a plurality of fixing arms, which are spaced apart and distributed on the wafer platform. One end of each fixing arm is fixedly connected to the upper surface of the wafer platform, and the other end of each fixing arm is used to press each side edge of the wafer.

2. A control method for a wafer leveling device, characterized in that: The wafer leveling device includes a wafer platform, multiple tube pillars, a wafer fixing mechanism, an exhaust system, and a drive system; the wafer platform is provided with multiple tube pillar holes, and the multiple tube pillar holes are all perpendicular to the upper surface of the wafer platform; multiple tube pillars corresponding to the multiple tube pillar holes are all located on the lower side of the wafer platform, and one end of each tube pillar is disposed in the corresponding tube pillar hole; The wafer fixing mechanism is used to fix the wafer on the upper surface of the wafer platform; The plurality of pipe columns are all solid pipe columns; The air extraction system comprises: An air pumping box is provided on the lower side of the wafer platform, the air pumping box is connected to the upper side of the wafer platform through a plurality of the tube column holes, each of the tube columns is located in the air pumping box and the bottom surface of each of the tube columns extends to the outside of the air pumping box; a second air extraction device, connected to the air extraction box, and used to extract air from the air extraction box; The drive system comprises: A hydraulic box is provided on the lower side of the air extraction box, wherein a plurality of communication holes corresponding to the plurality of pipe strings are opened on the upper surface of the hydraulic box, and the bottom surface of each pipe string is provided in the hydraulic box through the communication hole; a groove is provided between the upper side of the hydraulic box and the lower side of the air extraction box; A plurality of locking mechanisms are provided on the plurality of communicating holes in a one-to-one correspondence, and each locking mechanism is used to adjust the locking or loosening of each pipe string in the communicating hole; A hydraulic pushing mechanism, disposed in the hydraulic box, the hydraulic box being used to push the liquid in the hydraulic box to drive the pipe string; The control method includes: Controlling the exhaust system to start so that the wafer is closely attached to the wafer platform; Acquiring flatness data of the wafer at any position on the wafer platform; The driving system is controlled according to the leveling data to adjust the position of the pipe string in the corresponding pipe string hole along the axial direction of the pipe string hole.

3. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the control method of the wafer leveling device according to claim 2.

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