Chip fork distance-adjustable chip conveying device

Abstract

The application discloses a wafer conveying device with adjustable wafer fork spacing, comprising a motor, a first guide rail, a second guide rail, a plurality of push blocks, a plurality of sliding members and a plurality of wafer forks. The first guide rail and the second guide rail both extend along the vertical direction. The motor is used to drive one of the first guide rail and the second guide rail to move along the first horizontal direction to approach or move away from each other. The wafer forks are connected to the sliding members one by one. The sliding members and the push blocks are alternately arranged from top to bottom and successively abut each other. Except for one located at the lowest position, the sliding members and the push blocks are respectively arranged on the second guide rail and the first guide rail in a slideable manner. The push block is wedge-shaped with a gradually changing thickness along the first horizontal direction, so that the push block can abut the sliding member at different thickness positions to adjust the spacing between the adjacent two sliding members. The wafer conveying device provided by the application can realize the adjustment of the wafer fork spacing, and can transport multiple wafer pieces of various spacing specifications, thereby improving the wafer conveying efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, in particular to a film conveying device with adjustable film fork spacing. Background Art

[0002] With the widespread application of semiconductor technology in modern life, the demand for chips has increased year by year. The semiconductor industry is a high-tech industry with a high degree of automation and high added value. Improving the efficiency of each link in the chip forming process is considered the most effective way to increase production capacity.

[0003] During the wafer production process, wafers need to be transported (transferred), such as taking and placing wafers from semiconductor wafer standard cassettes and semiconductor equipment workpiece racks. In order to improve the efficiency of loading and unloading, many devices in the semiconductor industry require wafer transfer devices to have the function of simultaneously transporting more than two wafers. However, there are many specifications of semiconductor wafer standard cassettes and equipment workpiece racks, so there are many situations for the spacing between wafers to be transferred. The fork spacing of the transfer device in the related art is usually not adjustable, resulting in the transfer device being unable to adapt to cassettes or workpiece racks of different specifications. When the fork spacing is not suitable, it is impossible to transfer multiple wafers at the same time, and only single wafer transfer can be performed, resulting in low transfer efficiency, which in turn leads to reduced wafer production efficiency. Summary of the Invention

[0004] In order to at least address the above-mentioned deficiencies to a certain extent, the present invention provides a film conveying device with adjustable film fork spacing.

[0005] The present invention provides a film transmission device with adjustable film fork spacing, comprising a motor, a first guide rail, a second guide rail, a plurality of push blocks, a plurality of sliding members and a plurality of film forks, the first guide rail and the second guide rail both extending in a vertical direction, the motor being used to drive either the first guide rail or the second guide rail to move closer to or away from the other; the plurality of push blocks are arranged on the first guide rail in sequence from top to bottom, the plurality of sliding members are arranged on the second guide rail in sequence from top to bottom, the plurality of film forks are connected to the plurality of sliding members in a one-to-one correspondence, the plurality of sliding members and the plurality of push blocks are alternately arranged from top to bottom and mutually abut against each other up and down in sequence, and the plurality of sliding members and the plurality of push blocks, except for the one located at the lowest position, can be slid up and down on the second guide rail and the first guide rail respectively, the push block is a wedge-shaped wedge whose thickness gradually changes along the first horizontal direction, so that the push block can adjust the spacing between two adjacent sliding members by abutting against the sliding member at different thickness positions.

[0006] Optionally, the motor is transmission-connected to the first guide rail, and is used to drive the first guide rail to approach or move away from the second guide rail along the first horizontal direction.

[0007] Optionally, it further includes a screw and a slider, the output end of the motor is connected to the screw so as to drive the screw to rotate, the slider is threadedly connected to the screw, and the slider is connected to the first guide rail or the second guide rail.

[0008] Optionally, the one located at the lowest position is one of the several push blocks, which is fixedly connected to the first guide rail; or, the one located at the lowest position is one of the several sliding members, which is fixedly connected to the second guide rail.

[0009] Optionally, the sliding member includes a roller, and the roller is arranged to be rollable along the surface of the push block.

[0010] Optionally, the thickness of the push block gradually increases in a direction away from the second guide rail.

[0011] Optionally, at least one of the upper surface and the lower surface of the push block is a slope.

[0012] Optionally, the lower surface of the push block is a plane, and the upper surface of the push block is an inclined surface.

[0013] Optionally, the spacing between adjacent forks is the same.

[0014] Optionally, the adjustable distance between two adjacent forks ranges from 5 mm to 11 mm.

[0015] The wafer transfer device with adjustable fork spacing provided by the present invention enables infinitely adjustable fork spacing, thereby adapting to wafer devices of varying specifications and enabling multi-wafer transfer of wafers with various spacing specifications. This improves wafer transfer efficiency, thereby contributing to improved semiconductor wafer production efficiency. Furthermore, the wafer transfer device with adjustable fork spacing provided by the present invention has a simple and reliable structure, low cost, and a simple manufacturing process.

[0016] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0018] Figure 1 It is a structural schematic diagram of a film conveying device with adjustable film fork spacing in an embodiment of the present invention.

[0019] Figure 2It is a front view of a film conveying device with adjustable film fork spacing in an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the working of the film conveying device with adjustable film fork spacing in an embodiment of the present invention. Figure 1 .

[0021] Figure 4 This is a schematic diagram of the working of the film conveying device with adjustable film fork spacing in an embodiment of the present invention. Figure 2 .

[0022] Reference numerals:

[0023] The film conveying device 100, the motor 1, the first guide rail 2, the second guide rail 3, the push block 4, the sliding member 5, the film fork 6, the screw 71, and the slider 72. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] In order to improve the wafer transfer efficiency and thus improve the production efficiency of semiconductor wafers, the present invention proposes a wafer transfer device with adjustable fork spacing. The wafer transfer device can realize stepless adjustment of the fork spacing, so that it can adapt to wafer devices of different specifications and can transfer multiple wafers of various spacing specifications. It has a simple and reliable structure, low cost, and a simple manufacturing process.

[0026] like Figure 1 and Figure 2 As shown, the film conveying device 100 with adjustable film fork spacing provided in an embodiment of the present invention includes a motor 1, a first guide rail 2, a second guide rail 3, a plurality of push blocks 4, a plurality of sliding members 5 and a plurality of film forks 6.

[0027] The first guide rail 2 and the second guide rail 3 both extend in the vertical direction. The motor 1 is used to drive either the first guide rail 2 or the second guide rail 3 to move in the first horizontal direction to move closer to or away from the other. It can be understood that the first horizontal direction is perpendicular to the vertical direction.

[0028] A plurality of push blocks 4 are slidably disposed on the first guide rail 2 in an up-and-down manner, i.e., the push blocks 4 are slidably disposed on the first guide rail 2 along the length direction of the first guide rail 2. A plurality of slide members 5 are slidably disposed on the second guide rail 3 in an up-and-down manner, i.e., the slide members 5 are slidably disposed on the second guide rail 3 along the length direction of the second guide rail 3.

[0029] Several push blocks 4 and several sliding members 5 are arranged alternately in the vertical direction and abut against each other in sequence, with a single sliding member 5 located at the highest position. Push blocks 4 are wedge-shaped, with thickness gradually varying along a first horizontal direction. Here, "thickness of push block 4" refers to the vertical dimension of push block 4. It will be understood that the spacing between sliding members 5 is related to the thickness of push block 4. When sliding members 5 abut against push blocks 4 of different thicknesses, the spacing between sliding members 5 also varies.

[0030] Several forks 6 are connected to several slides 5 in a one-to-one correspondence. The forks 6 are horizontally arranged to receive wafers, and each fork 6 can receive one wafer. Several forks 6 work together to realize the transmission of multiple wafers. The forks 6 are connected to the corresponding slides 5 and move with the movement of the slides 5 in the vertical direction. The spacing of the slides 5 determines the spacing of the forks 6. The spacing of the slides 5 is adjustable, so that the spacing of the forks 6 is adjustable. As the relative position relationship between the first guide rail 2 and the second guide rail 3 in the first horizontal direction changes, the slides 5 slide relatively along the surface of the push block 4. Since the thickness of the push block 4 changes along the first horizontal direction, the spacing between adjacent slides 5 is adjustable, thereby making the spacing of the forks 6 adjustable. Moreover, since the thickness of the push block 4 gradually changes, the spacing of the slides 5 and the spacing of the forks 6 can be "steplessly adjusted", that is, the spacing can change continuously.

[0031] It should be noted that when the sliding member 5 slides relatively along the surface of the push block 4 and the spacing of the sliding member 5 changes, at least part of the sliding member 5 slides along the second guide rail 3 to achieve adaptive adjustment, and at least part of the push block 4 slides along the first guide rail 2 to achieve adaptive adjustment.

[0032] exist Figure 1-Figure 2 In the illustrated embodiment, the motor 1 is connected to the first guide rail 2 and is used to drive the first guide rail 2 to move closer to or away from the second guide rail 3 along a first horizontal direction.

[0033] Specifically, if Figure 1 and Figure 2 As shown, the film transmission device 100 also includes a screw-slider mechanism, which includes a screw 71 and a slider 72. The screw-slider mechanism and the motor 1 are both located on the side of the first guide rail 2 away from the second guide rail 3. The output end of the motor 1 is connected to the screw 71. The slider 72 is threadedly connected to the screw 71 and moves along the first horizontal direction as the screw 71 rotates. The slider 72 is connected to the first guide rail 2 to drive the movement thereof. The torque output by the motor 1 drives the screw 71 to rotate forward or reverse, pushing the slider 72 along the first horizontal direction to push the first guide rail 2 toward the second guide rail 3 or drive the first guide rail 2 away from the second guide rail 3.

[0034] In other alternative embodiments, the motor 1 may also be connected to the second guide rail 3 to drive the second guide rail 3 along the first horizontal direction toward or away from the first guide rail 2. In these embodiments, the slider 72 is connected to the second guide rail 3 to drive it to move.

[0035] Preferred Figure 1 and Figure 2 The solution in the illustrated embodiment enables the fork 6 to move only in the vertical direction without moving in the horizontal direction.

[0036] exist Figure 1-Figure 2 In the illustrated embodiment, the bottom push block 4 is located below the bottom sliding member 5 , and the bottom push block 4 is fixed relative to the first guide rail 2 .

[0037] Specifically, if Figure 1 and Figure 2 As shown, the film transmission device 100 includes four push blocks 4 and four slides 5. The four push blocks 4 and the four slides 5 are arranged alternately in the vertical direction and abut against each other in sequence. The bottom push block 4 is located below the bottom slide 5, and the slide 5 abuts against the upper surface of the push block 4 and is slidably arranged along the upper surface. The bottom push block 4 is fixed relative to the first guide rail 2. When adjusting the spacing, the other three push blocks 4 except the bottom push block 4 slide along the first guide rail 2, and the four slides 5 slide along the second guide rail 3.

[0038] In other alternative embodiments, the bottom sliding member 5 can also be located below the bottom pushing block 4, and the bottom sliding member 5 is relatively fixed to the second guide rail 3. That is, when adjusting the spacing, the remaining three sliding members 5 except the bottom sliding member 5 slide along the second guide rail 3, and the pushing blocks 4 (which can be three) all slide along the first guide rail 2.

[0039] In some optional embodiments, the sliding member 5 is a sliding block, and there is sliding friction between the sliding member 5 and the push block 4 .

[0040] In some preferred embodiments, in order to reduce friction resistance, as Figure 1 and Figure 2 As shown, the sliding member 5 includes a roller that is rollably disposed along the surface of the push block 4, i.e., rolling friction occurs between the roller and the push block 4. The inclusion of a roller in the sliding member 5 can also effectively reduce the generation of fine particles due to frictional contact, making it more suitable for the semiconductor industry's precision requirements for environmental particle control.

[0041] exist Figure 1-Figure 2In the embodiment shown, the thickness of the push block 4 gradually increases in the direction away from the second guide rail 3, in other words, the thickness of the push block 4 gradually decreases in the direction approaching the second guide rail 3, which makes the spacing between the sliding members 5 and the spacing between the blade forks 6 increase when the motor 1 drives the first guide rail 2 to approach the second guide rail 3, and the spacing between the sliding members 5 and the spacing between the blade forks 6 decrease when the motor 1 drives the first guide rail 2 to move away from the second guide rail 3.

[0042] Of course, in other alternative embodiments, the thickness of the push block 4 can gradually decrease in the direction away from the second guide rail 3, which makes the spacing between the blade forks 6 decrease when the motor 1 drives the first guide rail 2 to approach the second guide rail 3, and the spacing between the blade forks 6 increase when the motor 1 drives the first guide rail 2 to move away from the second guide rail 3.

[0043] The push block 4 is wedge-shaped, the sliding members 5 abut against the lower surface of the upper adjacent push block 4 and abut against the upper surface of the lower adjacent push block 4, and the sliding members 5 slide along the upper surface and the lower surface at the same time. At least one of the upper surface and the lower surface of the push block 4 is inclined, so that the thickness of the push block 4 gradually changes in the first horizontal direction, wherein the inclined surface refers to a surface having an included angle with the vertical direction.

[0044] As an example, in the embodiment shown in Figure 1 and Figure 2 , the lower surface of the push block 4 is a flat surface, the upper surface of the push block 4 is an inclined surface, and the lower surface and the upper surface of the push block 4 form a sharp corner in front of the push block 4. Of course, in other embodiments, the upper and lower surfaces of the push block 4 can both be inclined surfaces, and the upper surface and the lower surface have an included angle.

[0045] Preferably, the spacing between adjacent blade forks 6 is the same, that is, regardless of the change in the spacing between the blade forks 6, the spacing between the blade forks 6 is the same as each other, so that the wafer conveying device 100 can be applied to the standard wafer box and workpiece rack commonly used on the market.

[0046] Optionally, the adjustable spacing range between adjacent blade forks 6 is 5-11 mm, that is, the spacing between the blade forks 6 can be adjusted steplessly between 5-11 mm.

[0047] The working principle of the wafer conveying device with adjustable blade fork spacing is described below as an example of the embodiment shown in Figure 3 and Figure 4 . It should be noted that Figure 1 and Figure 2 , the working principle of the wafer conveying device with adjustable blade fork spacing is described below as an example of the embodiment shown in Figure 3 and Figure 4 As an example only, three push blocks 4 and corresponding three slides 5 and a fork 6 are shown in a simple structure, which can represent Figure 1 and Figure 2 The embodiment with four push blocks 4 and corresponding four slide members 5 and forks 6 may also represent other embodiments with a greater number of push blocks 4 and forks 6.

[0048] like Figure 3 As shown, the sliding member 5 abuts against the bottom of the upper surface of the corresponding push block 4. At this time, the distance between adjacent forks 6 is set to d. The motor 1 drives the screw 71 to rotate, and then the slider 72 pushes the first guide rail 2 toward the second guide rail 3. As the first guide rail 2 approaches the second guide rail 3, the sliding member 5 rolls along the upper surface of the push block 4 and reaches Figure 4 The position shown. Taking the bottommost sliding member 5 as an example, it slides upward relative to the upper surface of the bottommost push block 4 and rises a height h in the vertical direction along the second guide rail 3. The height h is related to the moving distance of the first guide rail 2. The bottommost sliding member 5 moves upward while pushing the middle push block 4 to rise. The middle push block 4 slides upward along the first guide rail 2 by a height h. At the same time, the middle sliding member 5 slides along the upper surface of the middle push block 4. The height it rises relative to the middle push block 4 is h. The middle sliding member 5 rises relative to the bottom sliding member 5 by h. Therefore, the distance between the bottom fork 6 and the middle fork 6 becomes (d+h). Similarly, the top sliding member 5 rises relative to the middle sliding member 5 by h. Therefore, the distance between the top fork 6 and the middle fork 6 becomes (d+h).

[0049] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A film conveying device with adjustable film fork spacing, characterized in that: The invention comprises a motor, a first guide rail, a second guide rail, a screw, a slider, a plurality of push blocks, a plurality of sliding members, and a plurality of forks, wherein the first guide rail and the second guide rail both extend in a vertical direction, and the motor is used to drive either the first guide rail or the second guide rail to move in a first horizontal direction to move closer to or away from the other; The plurality of push blocks are sequentially arranged on the first guide rail from top to bottom, the plurality of sliding members are sequentially arranged on the second guide rail from top to bottom, the plurality of forks are connected to the plurality of sliding members in a one-to-one correspondence, the plurality of sliding members and the plurality of push blocks are alternately arranged from top to bottom and abut against each other in sequence, the plurality of sliding members and the plurality of push blocks, except for the one located at the lowest position, are slidably arranged on the second guide rail and the first guide rail respectively, the push block is wedge-shaped with a thickness gradually changing along the first horizontal direction, so that the push block can adjust the distance between two adjacent sliding members by abutting against the sliding member at different thickness positions; The motor is drivingly connected to the first guide rail, and is used to drive the first guide rail toward or away from the second guide rail along the first horizontal direction; The output end of the motor is connected to the screw so as to drive the screw to rotate. The slider is threadedly connected to the screw, and the slider is connected to the first guide rail or the second guide rail.

2. The film conveying device with adjustable film fork spacing according to claim 1, characterized in that: The one located at the lowest position is one of the several push blocks, which is fixedly connected to the first guide rail; or the one located at the lowest position is one of the several sliding members, which is fixedly connected to the second guide rail.

3. The film conveying device with adjustable film fork spacing according to any one of claims 1-2, characterized in that: The sliding member includes a roller which is rollably arranged along the surface of the push block.

4. The film conveying device with adjustable film fork spacing according to claim 1, characterized in that: The thickness of the push block gradually increases in a direction away from the second guide rail.

5. The film conveying device with adjustable film fork spacing according to claim 1 or 4, characterized in that: At least one of the upper surface and the lower surface of the push block is an inclined surface.

6. The film conveying device with adjustable film fork spacing according to claim 5, characterized in that: The lower surface of the pushing block is a plane, and the upper surface of the pushing block is an inclined surface.

7. The film conveying device with adjustable film fork spacing according to claim 1, characterized in that: The distances between adjacent forks are the same.

8. The film conveying device with adjustable film fork spacing according to claim 1, characterized in that: The adjustable distance between two adjacent forks ranges from 5 mm to 11 mm.

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