Electronic device and computing system

Abstract

An embodiment of the present application provides an electronic device and a computing system. The electronic device includes: a housing, a heating component, and a heat dissipation component. The housing has a receiving cavity in which a cooling medium is accommodated, and the cooling medium has a liquid level; the heating component and the heat dissipation component are both disposed in the receiving cavity, the heating component is completely immersed in the cooling medium, and at least a part of the heat dissipation component is immersed in the cooling medium; the heat dissipation component is used for dissipating heat from the heating component, and a capillary structure is disposed on at least a part of the heat dissipation component located in the cooling medium. Thus, on the one hand, the capillary structure can promote the generation of more bubbles during the boiling of the cooling medium, maximize the heat dissipation effect of evaporative cooling, and enhance the boiling performance of the heat dissipation component; on the other hand, it can also reduce the amount of liquid working medium under the condition of improving the heat dissipation effect, solving the problem of high cooling cost of existing electronic devices.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of liquid cooling for electronic devices, and particularly to an electronic device and a computing system. Background Art

[0002] With the development of electronic technology, the power of data processors such as CPUs continues to increase, the integration and thermal density of electronic devices are getting higher and higher, and the requirements for heat dissipation are also getting higher and higher. The traditional air-cooling method can no longer solve the heat dissipation problem brought by such a high heat flux density.

[0003] Liquid cooling is gradually introduced. In related technologies, an electronic device includes a housing, a circuit board, a heat-generating component, and a radiator, etc. The housing has a cavity for accommodating the circuit board, the heat-generating component, and the radiator. The heat-generating component is disposed on the circuit board, the radiator is disposed on the heat-generating component, and a liquid working medium is also accommodated in the cavity. The liquid working medium is used to immerse the heat-generating component and the radiator to absorb the heat of the heat-generating component and start boiling heat transfer when reaching the boiling point of the liquid working medium, so as to take out the heat.

[0004] However, in the setting method in related technologies, the heat dissipation effect of the radiator on the heat-generating component is poor. Summary of the Invention

[0005] The embodiments of the present application provide an electronic device and a computing system. On the one hand, the setting of the capillary structure can prompt more bubbles to be generated during the boiling process of the cooling medium, maximize the heat dissipation effect of evaporative cooling, and strengthen the boiling performance of the heat dissipation component; on the other hand, the heat dissipation component is partially immersed in the cooling medium, which can reduce the amount of the liquid working medium while improving the heat dissipation effect, and solves the problem of high cooling cost of existing electronic devices.

[0006] In a first aspect, the embodiments of the present application provide an electronic device, including: a housing, a heat-generating component, and a heat dissipation component. The housing has an accommodation cavity, and a cooling medium is accommodated in the accommodation cavity. The cooling medium has a liquid level; the heat-generating component and the heat dissipation component are both disposed in the accommodation cavity. The heat-generating component is completely immersed in the cooling medium, and the heat dissipation component is partially immersed in the cooling medium. The heat dissipation component is used to dissipate heat from the heat-generating component; a capillary structure is disposed on at least a part of the heat dissipation component located in the cooling medium.

[0007] The electronic device provided by the embodiment of the present application includes a housing, the housing has a housing cavity, the heating element and the heat dissipation component are both arranged in the housing cavity, and the housing cavity can protect the heating element and the heat dissipation component, thereby avoiding the problem of the heating element and the heat dissipation component being contaminated by external impurities, and ensuring the heat dissipation effect of the heat dissipation component; in addition, it is also convenient to accommodate the cooling medium. By immersing the heating element in the cooling medium, the cooling medium absorbs the heat on the heating element, causing the cooling medium to undergo a phase change, and the cooling medium evaporates from a liquid state to a gaseous state, thereby taking away the heat on the heating element, and improving the heat dissipation capacity of the electronic device.

[0008] By including a heat dissipation component, the heat dissipation component dissipates the heat on the heating element, so that the temperature of the heating element is reduced, thereby ensuring that the temperature of the heating element is maintained within a predetermined range; by partially immersing the heat dissipation component in a cooling medium, the amount of cooling medium used can be minimized while improving the heat dissipation effect, thereby reducing the cooling cost of the electronic equipment.

[0009] By providing a capillary structure on at least part of the heat dissipation component located in the cooling medium, the effective heat dissipation surface area of ​​the heat dissipation component is increased, and the micro-nano structure is processed to increase the number of vaporization cores, thereby enabling the cooling medium to generate more bubbles during the boiling process, thereby maximizing the heat dissipation effect of evaporative cooling and enhancing the boiling performance of the heat dissipation component; at the same time, the capillary structure can also increase the heat exchange area of ​​the heating element, thereby further improving the liquid cooling heat dissipation effect of the heating element.

[0010] In a possible implementation, it also includes an injection member, which is arranged in the accommodating cavity and is located above the liquid surface; the injection member has an injection end, and the injection end is directed toward the heat dissipation component; the injection member receives the liquid cooling medium and sprays the liquid cooling medium toward the heat dissipation component through the injection end.

[0011] By setting up the injection piece, it is convenient to spray the liquid cooling medium delivered to the accommodating cavity, the injection point is more concentrated, and the injection effect is better; in addition, since the injection piece is located above the liquid surface of the cooling medium, the surface of the heating element and the heat dissipation component can be washed by the liquid cooling medium sprayed by the injection piece. On the one hand, the gas generated near the heating element and the heat dissipation component can be easily separated from the liquid cooling medium; on the other hand, the replenishment speed of the liquid cooling medium near the heating element and the heat dissipation component can be increased, so that the heat generated by the heating element and the heat dissipation component can be quickly and timely absorbed, thereby improving the single-point heat dissipation capacity, wherein the single-point heat dissipation capacity refers to the heat dissipation capacity of the area on the heating element and the heat dissipation component that cooperates with the injection piece.

[0012] In addition, by spraying a liquid cooling medium through a spraying member to wash the surfaces of the heat-generating member and the heat dissipation assembly, the heat dissipation requirements of the heat-generating member and the heat dissipation assembly can be met, greatly reducing the amount of the cooling medium used, thereby reducing the cooling cost of the heat-generating member and the heat dissipation assembly.

[0013] In a possible implementation manner, the heat dissipation assembly includes a heat dissipation substrate and a plurality of heat dissipation fins disposed on the heat dissipation substrate;

[0014] The capillary structure includes a first capillary structure, and the first capillary structure is disposed on the plate surface of the heat dissipation substrate between two adjacent heat dissipation fins and on the outer wall surfaces of the heat dissipation fins;

[0015] The first capillary structure and the heat dissipation substrate are all immersed in the cooling medium.

[0016] By providing the heat dissipation substrate and the heat dissipation fins, both the heat dissipation substrate and the heat dissipation fins can take away the heat on the heat-generating member, thereby ensuring the heat dissipation capacity of the electronic device.

[0017] By providing the first capillary structure, the first capillary structure covers the plate surface of the heat dissipation substrate between two adjacent heat dissipation fins, which not only increases the effective heat dissipation surface area of the heat dissipation substrate, but also performs micro-nano structure treatment, realizing an increase in the number of vaporization nuclei, enabling the cooling medium to generate more bubbles during the boiling process, improving the heat dissipation effect of evaporation cooling, and strengthening the boiling performance of the heat dissipation substrate; at the same time, providing the first capillary structure can also increase the heat exchange area of the heat-generating member, further improving the liquid cooling heat dissipation effect of the heat-generating member.

[0018] In addition, by immersing the first capillary structure entirely in the cooling medium, the capillary force can be used to adsorb the cooling medium. When the heat-generating member generates heat, the working liquid near the heat-generating member is heated and vaporized to form a gaseous working medium; the gaseous working medium can flow in the accommodation cavity, be precooled and liquefied in the area far from the heat-generating member, release heat, and under the action of the capillary force, flow back to the area near the heat-generating member through the capillary structure and be vaporized again, and so on, taking away the heat of the heat-generating member.

[0019] In a possible implementation manner, the capillary structure further includes a second capillary structure, and the second capillary structure is disposed between two adjacent heat dissipation fins.

[0020] By providing the second capillary structure, the second capillary structure is disposed between two adjacent heat dissipation fins, increasing the effective heat dissipation surface area of the heat dissipation fins, realizing an increase in the number of vaporization nuclei, enabling the cooling medium to generate more bubbles during the boiling process, and improving the heat dissipation effect of evaporation cooling.

[0021] In a possible implementation, the multiple heat dissipation fins include a first heat dissipation fin; at least a part of the first heat dissipation fin is located above the liquid surface, and the remaining part of the first heat dissipation fin is immersed in the cooling medium.

[0022] By including the first heat dissipation fin, in this way, the arrangement of the heat dissipation fins can be made more diverse, increasing the flexibility of the heat dissipation fin arrangement, and the heat on the heat generating component can be taken away from different directions to adapt to different application scenarios.

[0023] In a possible implementation, the distance between the plate surface of the heat dissipation substrate located in the cooling medium and the liquid surface ranges from 0 to 5 mm.

[0024] In a possible implementation, the multiple heat dissipation fins further include a second heat dissipation fin, and the second heat dissipation fin and the first heat dissipation fin are located on different sides of the heat dissipation substrate respectively.

[0025] By further including the second heat dissipation fin and combining the second heat dissipation fin with the first heat dissipation fin, the arrangement of the heat dissipation fins is made more diverse, increasing the flexibility of the heat dissipation fin arrangement, and the heat on the heat generating component can be taken away from different directions to adapt to different application scenarios, further improving the heat dissipation capacity of the electronic device.

[0026] In a possible implementation, the heat generating component and the heat dissipation fin are located on different sides of the heat dissipation substrate.

[0027] In a possible implementation, the heat dissipation substrate is a metal plate or a VC heat pipe, and the heat dissipation fin is integrally formed with the heat dissipation substrate.

[0028] By setting the heat dissipation fin to be integrally formed with the heat dissipation substrate, not only the stability and reliability of the installation of the heat dissipation fin and the heat dissipation substrate can be ensured, but also the pressure between the heat dissipation fin and the heat dissipation substrate can be ensured to be uniform and stable.

[0029] In a possible implementation, both the first capillary structure and the second capillary structure are formed by sintering metal powder;

[0030] The first capillary structure is one or more of copper powder, nickel powder, copper mesh, and / or the first capillary structure is foam porous metal;

[0031] and / or the second capillary structure is one or more of copper powder, nickel powder, copper mesh, and / or the second capillary structure is foam porous metal.

[0032] The first capillary structure and the second capillary structure are formed by sintering metal powder. Sintering is a process that allows powder particles to bond with each other, increases the strength of the sintered body, and transforms the aggregate of powder particles into an aggregate of grains. The strength of the capillary structure after sintering is higher.

[0033] In a possible implementation, the first capillary structure is one or more of a cylindrical shape, a rectangular column shape, and a diamond shape;

[0034] And / or, the second capillary structure is one or more of a cylindrical shape, a rectangular column shape, and a diamond shape.

[0035] In a possible implementation, the shell is provided with an exhaust port, and the exhaust port is located above the liquid surface;

[0036] The exhaust port is used to connect the accommodating cavity with a cooling medium distribution device outside the electronic equipment.

[0037] By providing an exhaust port, the exhaust port connects the accommodating cavity with the cooling medium distribution device outside the electronic device. The heat generated by the heating element causes the cooling medium to change its phase, and the cooling medium changes from liquid to gas. The gaseous cooling medium and part of the liquid cooling medium enter the external cooling medium distribution device from the exhaust port under the action of the pressure difference, so that the cooling medium takes away the heat generated by the heating element to be heated, thereby improving the heat dissipation capacity of the electronic device.

[0038] In one possible implementation, a liquid inlet is provided on the shell, and the liquid inlet is located above the liquid surface; the liquid inlet is used to connect the accommodating chamber and the cooling medium distribution device; and the accommodating chamber, the exhaust port, the cooling medium distribution device and the liquid inlet constitute a circulating gas-liquid conversion circuit.

[0039] By providing a liquid inlet, the liquid inlet connects the accommodating chamber and the cooling medium distribution device. After the gaseous cooling medium and part of the liquid cooling medium enter the cooling medium distribution device from the exhaust port under the action of the pressure difference, the gaseous cooling medium is condensed into liquid cooling medium again under the action of the condenser and the pump in the cooling medium distribution device, and is re-delivered to the accommodating chamber through the liquid inlet by the pump, thereby forming a reciprocating gas-liquid conversion circuit, so that the heat dissipation of the heating element can be carried out continuously, thereby ensuring the heat dissipation effect to the greatest extent.

[0040] In one possible implementation, there are multiple injection members, and the multiple injection members are arranged at intervals in the accommodating cavity; or, the electronic device may further include an injection pipe, and the multiple injection members are arranged at intervals on the injection pipe, and the multiple injection members are all connected to the injection pipe; and the injection ends of the multiple injection members are all facing the heat dissipation component.

[0041] By providing a plurality of spraying members, the liquid cooling medium can be sprayed from different directions, greatly increasing the scouring area of the surfaces of the heat generating member and the heat dissipation assembly; in addition, the replenishment rate of the liquid cooling medium near the heat generating member and the heat dissipation assembly is also greatly increased, so that the heat generated by the heat generating member and the heat dissipation assembly can be absorbed quickly and in a timely manner.

[0042] By further including a spraying pipeline, the spraying member is communicated with the spraying pipeline, and the liquid cooling medium can be accommodated in the spraying pipeline, which facilitates the spraying member to spray the liquid cooling medium transported to the accommodating cavity; in addition, the spraying pipeline can play a role in guiding and restricting the liquid cooling medium transported to the accommodating cavity.

[0043] In a possible implementation manner, a circuit board is further included, the circuit board is arranged in the accommodating cavity, and the whole circuit board is immersed in the cooling medium; the circuit board is located on a side of the heat generating member away from the heat dissipation assembly, and the heat generating member is arranged on the circuit board.

[0044] By providing the circuit board with the heat generating member arranged thereon, on the one hand, the circuit board can play an assembling role for the heat generating member; on the other hand, the circuit board supplies power to the heat generating member and the heat dissipation assembly, so as to maintain the normal operation of the heat generating member and the heat dissipation assembly.

[0045] In a possible implementation manner, there are a plurality of the heat generating members and a plurality of the heat dissipation assemblies, the plurality of heat generating members are arranged on the circuit board at intervals, and the plurality of heat dissipation assemblies are arranged in one-to-one correspondence with the plurality of heat generating assemblies.

[0046] By providing a plurality of heat dissipation assemblies and using them in cooperation, the arrangement mode of the heat dissipation assemblies is more diverse, increasing the flexibility of the arrangement of the heat dissipation assemblies, and the heat on the heat generating member can be taken away from different directions so as to adapt to different application scenarios and further improve the heat dissipation capacity of the electronic device.

[0047] In a possible implementation manner, the electronic device is a server, and the material of the cooling medium includes silicone oil or fluoride.

[0048] Second aspect, an embodiment of the present application provides a computing system, including: a liquid inlet pipeline, an exhaust pipeline, a cooling medium distribution device, and at least one electronic device as described above; one end of the exhaust pipeline communicates with the accommodation cavity of the electronic device through the exhaust port of the electronic device, and the other end of the exhaust pipeline communicates with the input end of the cooling medium distribution device; one end of the liquid inlet pipeline communicates with the output end of the cooling medium distribution device, and the other end of the liquid inlet pipeline communicates with the accommodation cavity of the electronic device through the liquid inlet of the electronic device; the cooling medium distribution device has a cavity, and the cooling medium distribution device cools the vaporized cooling medium in the accommodation cavity, transports it to the cavity through the exhaust pipeline and the input end, condenses it into a liquid cooling medium, and transports the liquid cooling medium to the accommodation cavity through the output end and the liquid inlet pipeline.

[0049] The computing system provided by the embodiment of the present application includes a cooling medium distribution device and communicates with the accommodation cavity through a liquid inlet pipeline and an exhaust pipeline. On the one hand, it can not only ensure the recycling of the cooling medium, so that the cooling medium can better absorb the heat on the heating element to improve the performance of the heating element; on the other hand, it can control the speed of transporting the liquid cooling medium into the accommodation cavity, so that the liquid level height of the cooling medium is a predetermined height, effectively controlling the capacity of the cooling medium and avoiding the problem of high cost caused by excessive cooling medium.

[0050] In a possible implementation manner, the computing system further includes a condenser, a pump, and an electrical connector; the condenser and the pump are both arranged in the cavity, the condenser and the pump are electrically connected, and the electrical connector is located between the electronic device and the computing system; the condenser is configured to cool the vaporized cooling medium transported to the cavity and condense it into a liquid cooling medium; the pump is configured to transport the liquid cooling medium to the accommodation cavity through the liquid inlet pipeline; the electrical connector is electrically connected to the circuit board of the electronic device, and the electrical connector is configured to supply power to the circuit board; and / or, the electrical connector is electrically connected to the pump, and the electrical connector is configured to supply power to the pump.

[0051] By including a condenser, the condenser can cool the vaporized cooling medium delivered into the cavity and condense it into a liquid cooling medium, thus ensuring the recycling of the cooling medium. By providing a pump, the pump can deliver the liquid cooling medium into the accommodating cavity through the liquid inlet pipeline, which is simple to operate and does not require manual labor. Additionally, the speed of delivering the liquid cooling medium into the accommodating cavity can be controlled by the pump, so that the liquid level height of the cooling medium is a predetermined height, thereby achieving the purpose of effectively controlling the capacity of the cooling medium. By including an electrical connector, the electrical connector can supply power to the pump and the circuit board, thus maintaining the normal operation of the pump and the circuit board.

[0052] In a possible implementation, the computing system further includes a cabinet; there is one electronic device, and the electronic device is arranged in the cabinet; or, there are multiple electronic devices, and the multiple electronic devices are stacked in the cabinet; the cooling medium distribution device is located outside the cabinet. By including the cabinet, the cabinet can accommodate, place, and protect the electronic devices.

[0053] The computing system provided by the embodiment of the present application is provided with the above-mentioned electronic device. The electronic device includes a heat dissipation component, and the heat dissipation component is used for dissipating heat from the heat generating component. The heat dissipation component can take away the heat on the heat generating component, thereby further improving the heat dissipation ability of the electronic device. By partially immersing the heat dissipation component in the cooling medium, in this way, under the condition of improving the heat dissipation effect, the amount of the cooling medium can be reduced to the greatest extent, thereby reducing the cooling cost of the electronic device. By providing a capillary structure on at least part of the heat dissipation component located in the cooling medium, in this way, both the effective heat dissipation surface area of the heat dissipation component is increased, and the micro-nano structure is processed, realizing the increase in the number of vaporization cores, promoting the cooling medium to generate more bubbles during the boiling process, and maximizing the heat dissipation effect of evaporative cooling and strengthening the boiling performance of the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 Schematic diagram of the structure of an electronic device in the related art Figure 1 ;

[0055] Figure 2 Schematic diagram of the structure of the electronic device provided by Embodiment 1 of the present application Figure 1 ;

[0056] Figure 3 Schematic diagram of the structure of the electronic device provided by Embodiment 1 of the present application Figure 2 ;

[0057] Figure 4 Schematic diagram of the structure of the heat dissipation component, the first capillary structure, and the second capillary structure in the electronic device provided by Embodiment 1 of the present applicationFigure 1 ;

[0058] Figure 5 Top view schematic of the heat dissipation component, the first capillary structure, and the second capillary structure in the electronic device provided in the first embodiment of the present application Figure 1 ;

[0059] Figure 6 Structural schematic of the heat dissipation component, the first capillary structure, and the second capillary structure in the electronic device provided in the first embodiment of the present application Figure 2 ;

[0060] Figure 7 Top view schematic of the heat dissipation component, the first capillary structure, and the second capillary structure in the electronic device provided in the first embodiment of the present application Figure 2 ;

[0061] Figure 8 Structural schematic of the heat dissipation component, the first capillary structure, and the second capillary structure in the electronic device provided in the embodiment of the present application Figure 3 ;

[0062] Figure 9 Top view schematic of the heat dissipation component, the first capillary structure, and the second capillary structure in the electronic device provided in the first embodiment of the present application Figure 3 ;

[0063] Figure 10 Structural schematic diagram of the connection between the electronic device and the cooling medium distribution device in the computing system provided in the second embodiment of the present application;

[0064] Figure 11 Installation structural schematic diagram of the electronic device in the computing system provided in the second embodiment of the present application.

[0065] Explanation of reference numerals:

[0066] 100 - Electronic device; 110 - Housing; 111 - Accommodation cavity;

[0067] 112 - Exhaust port; 113 - Liquid inlet; 120 - Heat generating component;

[0068] 130 - Heat dissipation component; 131 - Heat dissipation substrate; 132 - Heat dissipation fins;

[0069] 1321 - First heat dissipation fin; 1322 - Second heat dissipation fin; 140 - First capillary structure;

[0070] 150 - Second capillary structure; 160 - Injection part; 170 - Injection pipeline;

[0071] 180 - Circuit board; 190 - Cooling medium; 191 - Gas state;

[0072] 200 - Computing system; 210 - Liquid inlet pipeline; 220 - Exhaust pipeline;

[0073] 230 - Cooling medium distribution device; 231 - Cavity; 232 - Condenser;

[0074] 233 - Pump; 240 - Cabinet. Detailed implementation manners

[0075] The terms used in the implementation manners part of this application are only for explaining the specific embodiments of this application, rather than aiming to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0076] An electronic device includes a housing, a circuit board, a heat - generating component, and a radiator, etc. The radiator is a cold plate that is sealed and can accommodate the flow of a cooling medium. Usually, it is attached to a heat - generating chip through a thermal interface material to take away the heat of the chip. The working principle is as follows: The heat generated by the chip causes the cooling medium to undergo a phase change. The cooling medium changes from a liquid state to a gaseous state. The phase changes involved here include: Two - phase heat dissipation: It refers to the same working medium changing from a liquid state to a gaseous state, absorbing a large amount of heat, and constructing a heat dissipation method using the phase change between gas and liquid. In addition, it also includes boiling heat transfer: Boiling is a violent evaporation process in which a large number of bubbles are formed, grow, and move to change the working medium from a liquid state to a gaseous state. Boiling heat transfer is a heat transfer process accompanied by liquid - gas phase change. The electronic device can be selected as a device with computing power, such as a server.

[0077] The following introduces and explains the technical solutions related to this application:

[0078] In the first related technology, as Figure 1 shown, a partially - immersed liquid - cooled server cooling system is disclosed, including: a housing 110a, a heat - dissipating component 130a, etc. The housing 110a has a closed accommodation cavity 111a. The accommodation cavity 111a contains a cooling medium 140a. The cooling medium 140a completely immerses the circuit board 150a, the heat - generating component 120a, and the heat - dissipating component 130a, and performs boiling heat transfer on the surface of the heat - dissipating component 130a. The gas generated by the liquid - gas phase change takes away the heat of the heat - generating component 120a.

[0079] However, in the related technology, on the one hand, the circuit board 150a, the heat - generating component 120a, and the heat - dissipating component 130a are all immersed in the cooling medium 140a, so the amount of the cooling medium 140a used is excessive and the cooling cost is high; on the other hand, only relying on the surface of the heat - dissipating component 130a for boiling heat transfer, the boiling heat - transfer area is limited, and the heat - dissipation capacity of the heat - generating component 120a is restricted.

[0080] In a second related technology, an outdoor immersion liquid-cooled natural heat dissipation server is disclosed. The server includes: a PCB main board, a VC heat pipe, and a flow guiding fin. A plurality of electronic components are arranged on the PCB main board. Among them, the PCB main board is immersed in the refrigerant inside the chassis housing. In order to strengthen boiling heat transfer, a submersible pump is used to drive the fluid to flow in the working medium to enhance heat transfer. However, the introduction of the submersible pump device may easily cause the heat dissipation system to fail when the submersible pump malfunctions, and also greatly increases the heat dissipation cost.

[0081] In a third related technology, a surface-enhanced boiling heat dissipation structure is disclosed. The heat dissipation structure includes a boiling microstructure. Among them, the boiling microstructure is a protrusion to increase the number of vaporization nuclei on the upper surface of the chip. However, in this technology, the protrusion structures are evenly distributed, each protrusion structure is the same, and all are immersed in the liquid working medium, and there is only a boiling heat transfer effect, but the heat transfer capacity is limited.

[0082] In a fourth related technology, a heat dissipation structure is disclosed. By adding copper pillars and welding a copper mesh on the upper surface of the chip to increase the number of vaporization nuclei and strengthen boiling heat transfer. However, in this technology, there is also only a boiling heat transfer effect, but the heat transfer capacity is limited.

[0083] Based on this, an embodiment of the present application provides an electronic device 100, which includes a housing 110. The housing 110 has a receiving cavity 111. A heating element 120 and a heat dissipation component 130 are both arranged in the receiving cavity 111. The receiving cavity 111 can protect the heating element 120 and the heat dissipation component 130, thereby avoiding the problem that the heating element 120 and the heat dissipation component 130 are contaminated by external impurities, and ensuring the heat dissipation effect of the heat dissipation component 130; in addition, it is also convenient to accommodate the cooling medium 190. By completely immersing the heating element 120 in the cooling medium 190, the cooling medium 190 absorbs the heat on the heating element 120, causing the cooling medium 190 to undergo a phase change. The cooling medium 190 evaporates from a liquid state to a gaseous state 191, thereby taking away the heat on the heating element 120 and improving the heat dissipation capacity of the electronic device.

[0084] By including the heat dissipation component 130, in this way, the heat dissipation component 130 can take away the heat on the heating element 120, thereby further improving the heat dissipation capacity of the electronic device; by partially immersing the heat dissipation component 130 in the cooling medium 190, in this way, under the condition of improving the heat dissipation effect, the amount of the cooling medium 190 can be minimized to the greatest extent, thereby reducing the cooling cost of the electronic device.

[0085] By providing a capillary structure on at least a portion of the heat dissipation component 130 located in the cooling medium 190, the effective heat dissipation surface area of ​​the heat dissipation component 130 is increased, and the micro-nano structure is processed to increase the number of vaporization cores, so that the cooling medium can generate more bubbles during the boiling process, thereby maximizing the heat dissipation effect of evaporative cooling and enhancing the boiling performance of the heat dissipation component 130; at the same time, the capillary structure can also increase the heat exchange area of ​​the heating element 120, thereby further improving the liquid cooling heat dissipation effect of the heating element 120.

[0086] The specific structure of the electronic device is described in detail below with reference to the accompanying drawings.

[0087] Reference Figure 2 and Figure 3 As shown, an embodiment of the present application provides an electronic device 100, which may include: a housing 110, a heating element 120 and a heat dissipation assembly 130. The electronic device 100 may be any one of a computing device, a storage device or a communication device, wherein the computing device may be a server.

[0088] The heating element 120 is a general term for various types of heating components. The heating element 120 can be: a circuit board 180, a resistor, a central processing unit, a graphics processing unit, a heat sink, a capacitor, a power supply, a memory and other devices. In addition, the number of the heating element 120 can be one or more, and there is no specific limitation here.

[0089] The housing 110 has a housing cavity 111, and the heating element 120 and the heat dissipation assembly 130 are both arranged in the housing cavity 111. The housing cavity 111 can protect the heating element 120 and the heat dissipation assembly 130, thereby preventing the heating element 120 and the heat dissipation assembly 130 from being contaminated by external impurities, and ensuring the heat dissipation effect of the heat dissipation assembly 130. In addition, the shape of the housing 110 is not specifically limited, and the shape of the housing 110 includes but is not limited to square, circular, elliptical, diamond and other structures.

[0090] It should be noted that the accommodating chamber 111 is a closed chamber with good sealing properties to ensure that the gaseous cooling medium 190 and the liquid cooling medium 190 will not leak, and under the action of the internal and external pressure difference of the shell 110, the gaseous cooling medium 190 can be discharged from the accommodating chamber 111.

[0091] The accommodating cavity 111 contains a cooling medium 190 having a liquid surface. The material of the cooling medium 190 may include silicone oil or fluoride, or may include other materials with cooling characteristics. It is understandable that the cooling medium 190 has a low boiling point and is non-conductive.

[0092] The heating element 120 is completely immersed in the cooling medium 190, and the heat dissipation component 130 is partially immersed in the cooling medium 190. In this way, when the heating element 120 transfers heat to the heat dissipation component 130, the heat dissipation component 130 increases the heat dissipation area through the heat dissipation substrate 131 and the heat dissipation fins 132, and transfers the heat to the cooling medium 190. The cooling medium 190 is heated and evaporated into a gas state 191, thereby taking away the heat, so as to ensure that the temperature of the heating element 120 is maintained within a predetermined range, and further ensure the normal working state of the heating element 120.

[0093] By partially immersing the heat dissipation component 130 in the cooling medium 190, in this way, under the condition of improving the heat dissipation effect, the amount of the cooling medium 190 can be reduced to the greatest extent, so that the cooling cost of the electronic device 100 can be reduced.

[0094] It can be understood that immersion means that a part of the heat dissipation component 130 is wrapped by the liquid cooling medium 190, and the other part of the heat dissipation component 130 is not wrapped by the liquid cooling medium 190 and is exposed above the liquid level of the cooling medium 190.

[0095] In addition, it should be noted that the connection relationship between the heat dissipation component 130 and the heating element 120 is not further limited.

[0096] For example: One implementable way is that the heat dissipation component 130 is arranged on the heating element 120, and the heat dissipation component 130 and the heating element 120 are partially in contact; another implementable way is that the heat dissipation component 130 is arranged on the heating element 120, and the heat dissipation component 130 is in full contact with the heating element 120; still another implementable way is that the heat dissipation component 130 is not in contact with the heating element 120. For example, the heat dissipation component 130 can be attached to the surface of the heating element 120 through a thermal interface material and can transfer heat in contact with the heating element 120.

[0097] Among them, in the embodiments of the present application, the connection relationship between the heat dissipation component 130 and the heating element 120 includes but is not limited to the above three ways. As long as the heat dissipation function of the heat dissipation component 130 for the heating element 120 can be ensured, it belongs to the protection scope of the present application.

[0098] A capillary structure is arranged on at least part of the heat dissipation component 130 located in the cooling medium 190. In this way, not only the effective heat dissipation surface area of the heat dissipation component 130 is increased, but also the micro-nano structure is processed, the number of vaporization cores is increased, so that more bubbles can be generated during the boiling process of the cooling medium 190, and the heat dissipation effect of evaporation cooling is improved to the greatest extent, and the boiling performance of the heat dissipation component 130 is strengthened; at the same time, the arrangement of the capillary structure can also increase the heat exchange area of the heating element 120, thereby further improving the liquid cooling heat dissipation effect of the heating element 120.

[0099] In one possible implementation, with reference to Figure 2 and Figure 3 as shown, it may further include a spraying member 160 disposed in the accommodating cavity 111, above the liquid level; the spraying member 160 has a spraying end facing the heat dissipation assembly 130; the spraying member 160 receives the liquid cooling medium 190 and sprays the liquid cooling medium 190 towards the heat dissipation assembly 130 through the spraying end.

[0100] By providing the spraying member 160, it is convenient to spray the liquid cooling medium 190 transported into the accommodating cavity 111, the spraying points are more concentrated, and the spraying effect is better; in addition, since the spraying member 160 is above the liquid level of the cooling medium 190, the surfaces of the heating member 120 and the heat dissipation assembly 130 can be flushed by the liquid cooling medium 190 ejected by the spraying member 160. On the one hand, it can make the gas generated near the heating member 120 and the heat dissipation assembly 130 easily separate from the liquid cooling medium 190; on the other hand, it can improve the replenishment speed of the liquid cooling medium 190 near the heating member 120 and the heat dissipation assembly 130, so as to quickly and timely absorb the heat generated by the heating member 120 and the heat dissipation assembly 130, thereby improving the single-point heat dissipation capacity, where the single-point heat dissipation capacity refers to the heat dissipation capacity at the area on the heating member 120 and the heat dissipation assembly 130 that cooperates with the spraying member 160.

[0101] In addition, by spraying the liquid cooling medium 190 through the spraying member 160 to flush the surfaces of the heating member 120 and the heat dissipation assembly 130, the heat dissipation requirements of the heating member 120 and the heat dissipation assembly 130 can be met, the consumption of the cooling medium 190 can be greatly reduced, and thus the cooling cost of the heating member 120 and the heat dissipation assembly 130 can be reduced.

[0102] In one possible implementation, continue to refer to Figure 2 and Figure 3 as shown, there may be multiple spraying members 160, and the multiple spraying members 160 are spaced apart in the accommodating cavity 111, capable of spraying the liquid cooling medium 190 from different orientations, greatly increasing the flushing area of the surfaces of the heating member 120 and the heat dissipation assembly 130; in addition, it also greatly improves the replenishment speed of the liquid cooling medium 190 near the heating member 120 and the heat dissipation assembly 130, so as to quickly and timely absorb the heat generated by the heating member 120 and the heat dissipation assembly 130.

[0103] Alternatively, with reference to Figure 2 and Figure 3 as shown, it may further include a spraying pipeline 170, and multiple spraying members 160 are spaced apart on the spraying pipeline 170, and the multiple spraying members 160 are all communicated with the spraying pipeline 170; and the spraying ends of the multiple spraying members 160 all face the heat dissipation assembly 130.

[0104] By further including a spray pipe 170, the spray member 160 is communicated with the spray pipe 170, and the liquid cooling medium 190 can be accommodated in the spray pipe 170, so that it is convenient for the spray member 160 to spray the liquid cooling medium 190 conveyed into the accommodating cavity 111; in addition, the spray pipe 170 can play a role in guiding and restricting the liquid cooling medium 190 conveyed into the accommodating cavity 111.

[0105] In a feasible implementation manner, referring to Figure 2 and Figure 3 as shown, the heat dissipation component 130 may include a heat dissipation substrate 131 and a plurality of heat dissipation fins 132 disposed on the heat dissipation substrate 131.

[0106] Wherein, the heat dissipation substrate 131 includes two plate surfaces in the thickness direction, a plurality of heat dissipation fins 132 are disposed on one of the plate surfaces of the heat dissipation substrate 131, and the heating element 120 is disposed on the other plate surface of the heat dissipation substrate 131, that is, the heating element 120 and the heat dissipation fins 132 are located on different sides of the heat dissipation substrate 131. With this arrangement, the heat dissipation fins 132 can directly dissipate the heat of the heating element 120 through the heat dissipation substrate 131, and the heat dissipation effect is the best.

[0107] Through the above manner, the setting of the heat dissipation component 130 is more flexible. Both the heat dissipation substrate 131 and the heat dissipation fins 132 can dissipate the heat on the heating element 120. In addition, the assembly relationship and assembly position between the heat dissipation substrate 131 and the heat dissipation fins 132 are not specifically limited. As long as the heat dissipation substrate 131 is completely immersed in the cooling medium 190 and the heat dissipation fins 132 are partially immersed in the cooling medium 190 and dissipate the heat of the heating element 120, it belongs to the protection scope of the present application.

[0108] Referring to Figures 4 to 9 as shown, the capillary structure may include a first capillary structure 140 and a second capillary structure 150. Wherein, the capillary structure can promote the cooling medium 190 to generate more bubbles during the boiling process, thereby maximizing the heat dissipation effect of evaporation cooling and strengthening the boiling performance of the heat dissipation component.

[0109] Wherein, in the embodiments of the present application, the distribution manner of the first capillary structure 140 and the second capillary structure 150 is not specifically limited. Exemplarily, only the first capillary structure 140 may be provided, or only the second capillary structure 150 may be provided, or both the first capillary structure 140 and the second capillary structure 150 may be provided simultaneously. Among them, multiple setting manners may be as follows:

[0110] The first feasible implementation manner is: referring to Figure 4 andFigure 5 As shown, the first capillary structure 140 is disposed on the surface of the heat dissipation substrate between two adjacent heat dissipation fins 132, and the second capillary structure 150 is disposed on the outer wall surface of the heat dissipation fin 132.

[0111] The second implementable way is as follows: Refer to Figure 6 and Figure 7 As shown, the first capillary structure 140 is disposed on the surface of the heat dissipation substrate between two adjacent heat dissipation fins 132, and the second capillary structure 150 is disposed between two adjacent heat dissipation fins 132.

[0112] The third implementable way is as follows: Refer to Figure 8 and Figure 9 As shown, the first capillary structure 140 can be disposed on the surface of the heat dissipation substrate between two adjacent heat dissipation fins 132. Among them, a part of the second capillary structure 150 is disposed on the outer wall surface of the heat dissipation fin 132, and another part of the second capillary structure 150 is disposed between two adjacent heat dissipation fins 132.

[0113] It should be noted that in this embodiment, the setting methods of the first capillary structure 140 and the second capillary structure 150 include but are not limited to the above methods.

[0114] By setting the first capillary structure 140 and the second capillary structure 150, in this way, not only the effective heat dissipation surface area of the heat dissipation substrate 131 is increased, but also the micro-nano structure is processed, realizing the increase in the number of vaporization nuclei, so as to promote the cooling medium 190 to generate more bubbles during the boiling process, improve the heat dissipation effect of evaporation cooling, and strengthen the boiling performance of the heat dissipation substrate 131; at the same time, setting the first capillary structure 140 and the second capillary structure 150 can also increase the heat exchange area of the heating element 120, and further improve the liquid cooling heat dissipation effect of the heating element 120.

[0115] In an implementable way, both the first capillary structure 140 and the second capillary structure 150 are formed by sintering metal powder. Among them, sintering belongs to a process, which makes the powder particles bond with each other, increases the strength of the sintered body, turns the aggregate of powder particles into an aggregate of crystal grains, and the strength of the sintered capillary structure is higher.

[0116] Among them, the first capillary structure 140 can be one or more of copper powder, nickel powder, copper mesh, or the first capillary structure 140 can be foam porous metal. Similarly, the second capillary structure 150 can be one or more of copper powder, nickel powder, copper mesh, or the second capillary structure 150 can be foam porous metal. This application embodiment does not make further limitations on this.

[0117] In addition, the mesh number and number of layers of the first capillary structure 140 and the second capillary structure 150 are not specifically limited. During sintering, the heat dissipation substrate 131 is placed in an environment filled with a protective gas for high-temperature sintering. The sintering temperature can be 900 - 1000 °C, and the mesh number of the copper powder can be selected from 100 - 300 meshes. Among them, the protective gas can be an inert gas, such as nitrogen.

[0118] In an implementable manner, the plurality of heat dissipation fins 132 may include a first heat dissipation fin 1321. The setting position of the first heat dissipation fin 1321 is not limited. Exemplarily, referring to Figure 2 As shown, the cooling medium 190 in the accommodation cavity 111 has a liquid level. At least a part of the first heat dissipation fin 1321 is located above the liquid level, and the remaining part of the first heat dissipation fin 1321 is immersed in the cooling medium 190. In this way, the arrangement manner of the heat dissipation fins 132 can be made more diverse, increasing the flexibility of the setting of the heat dissipation fins 132, and the heat on the heating element 120 can be taken away from different directions to adapt to different application scenarios.

[0119] It can be understood that the liquid level referred to in the embodiments of the present application specifically refers to the liquid level when the cooling medium 190 is in a static state, that is, this liquid level is parallel to the plate surface of the heat dissipation substrate 131.

[0120] In an implementable manner, referring to Figure 2 and Figure 3 As shown, the entire heat dissipation substrate 131 is immersed in the cooling medium 190, and part of the heat dissipation fins 132 is immersed in the cooling medium 190. With this setting, the other part of the heat dissipation fins 132 is exposed above the liquid level of the cooling medium 190, which can ensure the heat dissipation capacity of the electronic device 100. At the same time, under the condition of improving the heat dissipation effect, the amount of the cooling medium 190 can be minimized to the greatest extent, thereby reducing the cooling cost of the electronic device 100.

[0121] In a possible implementable manner, referring to Figure 2 As shown, the plurality of heat dissipation fins 132 may further include a second heat dissipation fin 1322. The second heat dissipation fin 1322 and the first heat dissipation fin 1321 are located on different sides of the heat dissipation substrate 131 respectively. It can be understood that the second heat dissipation fin 1322 may be located on the opposite side of the first heat dissipation fin 1321, or the second heat dissipation fin 1322 may be located adjacent to the first heat dissipation fin 1321 (specifically referring to Figure 2 As shown), in the embodiments of the present application, specifically, the case where the second heat dissipation fin 1322 is located adjacent to the first heat dissipation fin 1321 is taken as an example for illustration.

[0122] By further including a second heat dissipation fin 1322, the second heat dissipation fin 1322 is used in combination with the first heat dissipation fin 1321, making the arrangement of the heat dissipation fins 132 more diverse, increasing the flexibility of the setting of the heat dissipation fins 132, and being able to take away the heat on the heating element 120 from different directions so as to adapt to different application scenarios and further improve the heat dissipation capacity of the electronic device 100.

[0123] In an implementable manner, the heat dissipation substrate 131 can be a metal plate or a VC heat pipe, and the heat dissipation fin 132 and the heat dissipation substrate 131 can be integrally formed by machining or etching. With the above settings, not only the stability and reliability of the installation of the heat dissipation fin 132 and the heat dissipation substrate 131 can be ensured, but also the pressure between the heat dissipation fin 132 and the heat dissipation substrate 131 can be evenly and stably maintained.

[0124] In an implementable manner, the shapes of the first capillary structure 140 and the second capillary structure 150 are not further limited.

[0125] Exemplarily: the shape of the first capillary structure 140 can be cylindrical, can be rectangular columnar, can be rhombic, or the first capillary structure 140 can also be other shapes, which are not limited in the embodiments of the present application.

[0126] Similarly, the shape of the second capillary structure 150 can be cylindrical, can be rectangular columnar, can be rhombic, or the second capillary structure 150 can also be other shapes, which are not limited in the embodiments of the present application.

[0127] In an implementable manner, referring to Figure 2 and Figure 3 as shown, an exhaust port 112 can be opened on the housing 110, and the exhaust port 112 is located above the liquid level; the exhaust port 112 is used to connect the accommodation cavity 111 with a cooling medium distribution device 230 outside the electronic device 100.

[0128] By providing the exhaust port 112, the exhaust port 112 connects the accommodation cavity 111 with the cooling medium distribution device 230 outside the electronic device 100. The heat generated by the heating element 120 causes the cooling medium 190 to change its phase state, and the cooling medium 190 changes from a liquid state to a gaseous state 191. The gaseous cooling medium 191 and part of the liquid cooling medium 190 enter the cooling medium distribution device 230 from the exhaust port 112 under the action of a pressure difference. Thus, the cooling medium 190 takes away the heat generated by the heating element 120 to be heated, improving the heat dissipation capacity of the electronic device 100.

[0129] In an implementable manner, referring to Figure 2 and Figure 3As shown, a liquid inlet 113 may be provided on the housing 110. The liquid inlet 113 is located above the liquid level. The liquid inlet 113 is used to connect the accommodation cavity 111 and the external cooling medium distribution device 230. And the accommodation cavity 111, the exhaust port 112, the cooling medium distribution device 230 and the liquid inlet 113 form a circulating gas-liquid conversion loop.

[0130] By providing the liquid inlet 113 which connects the accommodation cavity 111 and the cooling medium distribution device 230, the gaseous cooling medium 191 and part of the liquid cooling medium 190 enter the external cooling medium distribution device 230 from the exhaust port 112 under the action of the pressure difference. Under the action of the condenser 232 and the pump 233 of the cooling medium distribution device 230, the gaseous cooling medium 191 is condensed into the liquid cooling medium 190 again, and is re-transported to the accommodation cavity 111 through the pump 233 via the liquid inlet 113, thereby forming a reciprocating gas-liquid conversion loop, enabling the heat dissipation of the heating element 120 to continue continuously, and ensuring the heat dissipation effect to the greatest extent.

[0131] In a possible implementation, referring to Figure 2 and Figure 3 as shown, a circuit board 180 may further be included. The circuit board 180 is disposed in the accommodation cavity 111 and is completely immersed in the cooling medium 190. The circuit board 180 is located on the side of the heating element 120 away from the heat dissipation assembly 130, and the heating element 120 is disposed on the circuit board 180.

[0132] By providing the circuit board 180 with the heating element 120 disposed on it, on the one hand, the circuit board 180 can play an assembling role for the heating element 120; on the other hand, the circuit board 180 supplies power to the heating element 120 and the heat dissipation assembly 130, thereby maintaining the normal operation of the heating element 120 and the heat dissipation assembly 130.

[0133] In a possible implementation, referring to Figure 3 as shown, there may be multiple heating elements 120 and multiple heat dissipation assemblies 130. The multiple heating elements 120 are arranged at intervals on the circuit board 180, and the multiple heat dissipation assemblies 130 are correspondingly arranged on the multiple heating elements 120 one by one.

[0134] By providing multiple heat dissipation assemblies 130 and using them in cooperation, the arrangement mode of the heat dissipation assemblies 130 is more diverse, increasing the flexibility of the setting of the heat dissipation assemblies 130, and being able to take away the heat on the heating element 120 from different directions to adapt to different application scenarios, and further improving the heat dissipation ability of the electronic device 100.

[0135] Referring to Figure 10As shown in the figure, an embodiment of the present application further provides a computing system 200, which may include: a liquid inlet pipeline 210, an exhaust pipeline 220, a cooling medium distribution device 230, and at least one electronic device 100.

[0136] The exhaust pipeline 220 may be located between the electronic device 100 and the cooling medium distribution device 230. The exhaust pipeline 220 may also be located at other positions, as long as the connection between the electronic device 100 and the cooling medium distribution device 230 can be achieved, and no special limitation is made here. One end of the exhaust pipeline 220 communicates with the accommodation cavity 111 of the electronic device 100 through the exhaust port 112 of the electronic device 100, and the other end of the exhaust pipeline 220 communicates with the input end of the cooling medium distribution device 230.

[0137] The liquid inlet pipeline 210 may be located between the electronic device 100 and the cooling medium distribution device 230. The liquid inlet pipeline 210 may also be located at other positions, as long as the connection between the electronic device 100 and the cooling medium distribution device 230 can be achieved, and no special limitation is made here. One end of the liquid inlet pipeline 210 communicates with the output end of the cooling medium distribution device 230, and the other end of the liquid inlet pipeline 210 communicates with the accommodation cavity 111 of the electronic device 100 through the liquid inlet port 113 of the electronic device 100.

[0138] The cooling medium distribution device 230 has a cavity 231. The cooling medium distribution device 230 may be configured to cool the vaporized cooling medium 190 in the accommodation cavity 111, transport it to the cavity 231 through the exhaust pipeline 220 and the input end, condense it into a liquid cooling medium 190, and transport the liquid cooling medium 190 to the accommodation cavity 111 through the output end and the liquid inlet pipeline 210.

[0139] In the computing system 200 provided by the embodiment of the present application, through the cooling medium distribution device 230, the liquid inlet pipeline 210 and the exhaust pipeline 220 are communicated with the accommodation cavity 111. Thus, on the one hand, it can not only ensure the recycling of the cooling medium 190, so that the cooling medium 190 can better absorb the heat on the heating element 120 to improve the performance of the heating element 120; on the other hand, by controlling the speed of transporting the liquid cooling medium 190 into the accommodation cavity 111, the liquid level height of the cooling medium 190 can be made a predetermined height, effectively controlling the capacity of the cooling medium 190 and avoiding the problem of high cost caused by excessive cooling medium 190.

[0140] In addition, since the computing system 200 includes the above-mentioned electronic device 100, the computing system 200 has the features and effects of the above-mentioned electronic device 100. The electronic device 100 includes a heat dissipation component 130, and the heat dissipation component 130 is in contact with at least part of the heat generating component 120. In this way, the heat dissipation component 130 can take away the heat on the heat generating component 120, thereby further improving the heat dissipation ability of the electronic device 100; by partially immersing the heat dissipation component 130 in the cooling medium 190, under the condition of improving the heat dissipation effect, the amount of the cooling medium 190 can be minimized to the greatest extent, thereby reducing the cooling cost of the electronic device 100.

[0141] In a possible implementation, referring to Figure 10 as shown, the computing system 200 may further include a condenser 232, a pump 233, and an electrical connector.

[0142] Among them, the condenser 232 and the pump 233 are both arranged in the cavity 231, the condenser 232 and the pump 233 are electrically connected, and the electrical connector is located between the electronic device 100 and the computing system 200.

[0143] The condenser 232 is configured to cool the vaporized cooling medium 190 transported into the cavity 231 and condense it into a liquid cooling medium 190, thereby ensuring the recycling of the cooling medium 190.

[0144] The pump 233 is configured to transport the liquid cooling medium 190 to the accommodation cavity 111 through the liquid inlet pipeline 210, which is simple to operate and does not require manual labor. In addition, the speed of transporting the liquid cooling medium 190 into the accommodation cavity 111 can be controlled by the pump 233, so that the liquid level height of the cooling medium 190 is a predetermined height, thereby achieving the purpose of effectively controlling the capacity of the cooling medium 190.

[0145] The electrical connector is electrically connected to the circuit board 180 of the electronic device 100. The electrical connector is configured to supply power to the circuit board 180. The electrical connector is electrically connected to the pump 233. The electrical connector is configured to supply power to the pump 233, so as to maintain the normal operation of the pump 233 and the circuit board 180.

[0146] In a possible implementation, referring to Figure 11 as shown, the computing system 200 may further include a cabinet 240.

[0147] Among them, there may be one electronic device 100, and the electronic device 100 is arranged in the cabinet 240; or, there may be multiple electronic devices 100, and the multiple electronic devices 100 are stacked in the cabinet 240; the cooling medium distribution device 230 is located outside the cabinet 240. By including the cabinet 240, the cabinet 240 can accommodate, place, and protect the electronic device 100.

[0148] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0149] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims, and above-mentioned drawings of the embodiments of the present application are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence.

[0150] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them. Although the technical solutions of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, comprising: a housing, a heating element and a heat dissipation component, the housing has a receiving cavity, a cooling medium is accommodated in the receiving cavity, and the cooling medium has a liquid level; the heating element and the heat dissipation component are both arranged in the receiving cavity, the heating element is completely immersed in the cooling medium, and the heat dissipation component is partially immersed in the cooling medium, and the heat dissipation component is used for dissipating heat from the heating element; a capillary structure is arranged on at least part of the heat dissipation component located in the cooling medium; an exhaust port is formed on the housing, and the exhaust port is located above the liquid level; the exhaust port is used to communicate the receiving cavity with a cooling medium distribution device outside the electronic device; a liquid inlet is formed on the housing, and the liquid inlet is located above the liquid level; the liquid inlet is used to communicate the receiving cavity and the cooling medium distribution device; and the receiving cavity, the exhaust port, the cooling medium distribution device and the liquid inlet form a circulating gas-liquid conversion loop.

2. The electronic device according to claim 1, characterized in that, further comprising a spraying member, the spraying member is arranged in the receiving cavity and is located above the liquid level; the spraying member has a spraying end, and the spraying end faces the heat dissipation component; the spraying member receives the liquid cooling medium and sprays the cooling medium to the heat dissipation component through the spraying end.

3. The electronic device according to claim 2, characterized in that, the heat dissipation component includes a heat dissipation substrate and a plurality of heat dissipation fins arranged on the heat dissipation substrate, and the capillary structure includes a first capillary structure; the first capillary structure is arranged on the plate surface of the heat dissipation substrate between two adjacent heat dissipation fins and on the outer wall surface of the heat dissipation fins; the first capillary structure and the heat dissipation substrate are both completely immersed in the cooling medium.

4. The electronic device according to claim 3, characterized in that, the capillary structure further includes a second capillary structure, and the second capillary structure is arranged between two adjacent heat dissipation fins.

5. The electronic device according to claim 4, characterized in that, the plurality of heat dissipation fins include first heat dissipation fins; at least part of the first heat dissipation fins are located above the liquid level, and the rest of the first heat dissipation fins are immersed in the cooling medium.

6. The electronic device according to claim 5, characterized in that, the distance between the plate surface of the heat dissipation substrate located in the cooling medium and the liquid level ranges from 0 to 5 mm.

7. The electronic device according to claim 6, characterized in that, the plurality of heat dissipation fins further include second heat dissipation fins, and the second heat dissipation fins and the first heat dissipation fins are respectively located on different sides of the heat dissipation substrate.

8. The electronic device according to any one of claims 3-7, characterized in that, the heating element and the heat dissipation fins are located on different sides of the heat dissipation substrate.

9. The electronic device according to any one of claims 3-7, characterized in that, the heat dissipation substrate is a metal plate or a VC heat pipe; the heat dissipation fins and the heat dissipation substrate are integrally formed by machining or etching.

10. The electronic device according to any one of claims 2-7, characterized in that, there are a plurality of the ejection members, and the plurality of ejection members are arranged at intervals in the accommodation cavity; or, the electronic device further includes an ejection pipeline, and the plurality of ejection members are arranged at intervals on the ejection pipeline, and the plurality of ejection members are all communicated with the ejection pipeline; and the ejection ends of the plurality of ejection members all face the heat dissipation component.

11. The electronic device according to any one of claims 1-7, characterized in that, it further includes a circuit board, the circuit board is arranged in the accommodation cavity, and the whole circuit board is immersed in the cooling medium; the circuit board is located on a side of the heating element away from the heat dissipation component, and the heating element is arranged on the circuit board.

12. The electronic device according to claim 11, characterized in that, there are a plurality of the heating elements, and there are a plurality of the heat dissipation components. The plurality of heating elements are arranged at intervals on the circuit board, and the plurality of heat dissipation components are arranged in one-to-one correspondence with the plurality of heating components.

13. The electronic device according to any one of claims 1-7, characterized in that, the material of the cooling medium includes silicone oil or fluoride.

14. A computing system, characterized in that, it includes: a liquid inlet pipeline, an exhaust pipeline, a cooling medium distribution device, and at least one electronic device according to any one of claims 1-13; one end of the exhaust pipeline is communicated with the accommodation cavity of the electronic device through the exhaust port of the electronic device, and the other end of the exhaust pipeline is communicated with the input end of the cooling medium distribution device; one end of the liquid inlet pipeline is communicated with the output end of the cooling medium distribution device, and the other end of the liquid inlet pipeline is communicated with the accommodation cavity of the electronic device through the liquid inlet port of the electronic device; the cooling medium distribution device has a cavity. The cooling medium distribution device cools the vaporized cooling medium in the accommodation cavity, transports it to the cavity through the exhaust pipeline and the input end, condenses it into a liquid cooling medium, and transports the liquid cooling medium to the accommodation cavity through the output end and the liquid inlet pipeline.

15. The computing system according to claim 14, characterized in that, the computing system further includes a condenser and a pump; the condenser and the pump are both arranged in the cavity, and the condenser and the pump are electrically connected; the condenser is configured to cool the vaporized cooling medium transported to the cavity and condense it into a liquid cooling medium; the pump is configured to transport the liquid cooling medium to the accommodation cavity through the liquid inlet pipeline.

16. The computing system according to claim 15, characterized in that, the computing system further includes a cabinet; there is one electronic device, and the electronic device is arranged in the cabinet; or, there are a plurality of electronic devices, and the plurality of electronic devices are stacked in the cabinet; the cooling medium distribution device is located outside the cabinet.

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