Disk device and electronic device

Abstract

Embodiments of the present invention relate to a disk device and an electronic device. The disk device includes a housing, a disk-shaped recording medium, a magnetic head, an internal wireless communication device, and internal components. The housing has a storage space provided therein. The recording medium is stored in the storage space and has a recording layer. The magnetic head is stored in the storage space and is configured to read and write information with respect to the recording medium. The internal wireless communication device performs at least one of the following operations: generating an electrical signal of information written by the magnetic head to the recording medium corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and generating light, a magnetic field, or an electric field corresponding to the electrical signal of information read by the magnetic head from the recording medium toward the external wireless communication device. The internal components are stored in the storage space, are electrically connected to the magnetic head, and communicate with external components outside the housing through the internal wireless communication device and the external wireless communication device.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2021-45082 (filing date: March 18, 2021), and the present application incorporates the entire contents of the basic application by reference. Technical Field

[0002] Embodiments of the present invention relate to a disk device and an electronic device. Background Art

[0003] In a disk device such as a hard disk drive, the housing is sealed. Therefore, in order to communicate between the inside and outside of the housing, a through hole is provided in the housing, and a connector is mounted on a substrate that hermetically blocks the through hole. For example, a component outside the housing communicates with a component inside the housing through the connector.

[0004] For example, when the storage capacity of the disk device increases, there is a tendency that the number of terminals of the connector also increases. As the number of terminals increases, the connector, substrate, and through hole become larger, and the sealing of the housing may be damaged. Summary of the invention

[0005] Embodiments of the present invention provide a disk device capable of communicating between the inside and outside of a casing without using a connector, and an electronic device including the disk device.

[0006] A disk device according to one embodiment includes a housing, a disk-shaped recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing is provided with a storage space inside. The recording medium is stored in the storage space and has a recording layer. The magnetic head is stored in the storage space and is configured to read and write information relative to the recording medium. The internal wireless communication device performs at least one of the following operations: generating an electrical signal of information written to the recording medium by the magnetic head corresponding to light, magnetic field, or electric field generated by an external wireless communication device; and generating light, magnetic field, or electric field corresponding to the electrical signal of information read from the recording medium by the magnetic head toward the external wireless communication device. The internal component is stored in the storage space, electrically connected to the magnetic head, and communicates with an external component outside the housing through the internal wireless communication device and the external wireless communication device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is an exemplary perspective view showing a hard disk drive (HDD) according to the first embodiment.

[0008] Figure 2 This is an exemplary perspective view showing an exploded view of the HDD according to the first embodiment.

[0009] Figure 3The HDD of the first embodiment is decomposed and Figure 2 Illustrative perspective views showing different orientations.

[0010] Figure 4 This is an exemplary block diagram showing the configuration of the HDD according to the first embodiment.

[0011] Figure 5 It is along Figure 3 An exemplary cross-sectional view schematically showing a portion of the HDD according to the first embodiment taken along line F5-F5.

[0012] Figure 6 This is an exemplary block diagram showing a partial configuration of the HDD according to the first embodiment.

[0013] Figure 7 This is an exemplary cross-sectional view schematically showing a part of the HDD according to the second embodiment.

[0014] Figure 8 This is an exemplary cross-sectional view schematically showing a part of the HDD according to the third embodiment.

[0015] Fig. 9 This is an exemplary block diagram showing the configuration of a HDD according to the third embodiment.

[0016] Fig.10 This is an exemplary perspective view showing an exploded view of a HDD according to a fourth embodiment.

[0017] Fig.11 This is an exemplary block diagram showing the structure of a HDD according to the fourth embodiment.

[0018] Fig.12 This is an exemplary cross-sectional view schematically showing a part of the HDD according to the fourth embodiment.

[0019] Fig.13 This is an exemplary cross-sectional view schematically showing another part of the HDD according to the fourth embodiment.

[0020] Fig.14 This is an exemplary cross-sectional view schematically showing a part of the HDD according to the fifth embodiment. DETAILED DESCRIPTION

[0021] (First embodiment)

[0022] Below, refer to Figures 1 to 6The first embodiment is described. In addition, in this specification, the constituent elements of the embodiment and the description of the element are sometimes recorded by multiple expressions. The constituent elements and their descriptions are examples and are not limited by the expressions in this specification. Even if the names are different from the constituent elements in this specification, the constituent elements can be identified. In addition, the constituent elements can also be described by expressions different from those in this specification.

[0023] Figure 1 1 is an illustrative perspective view showing a hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is mounted on, for example, an electronic device 1 and constitutes a part of the electronic device 1. In other words, the electronic device 1 includes the HDD 10.

[0024] The HDD 10 is an example of a disk device and may also be called a storage device or a magnetic disk device. The electronic device 1 is, for example, a personal computer, a supercomputer, a server, a television receiver, or various computers such as a game machine, or a device such as an external HDD (external hard drive).

[0025] Figure 2 1 is an exemplary perspective view showing an exploded view of the HDD 10 according to the first embodiment. Figure 2 As shown, HDD 10 includes a housing 11, a plurality of magnetic disks 12, a spindle motor 13, a clamp spring 14, a plurality of magnetic heads 15, an actuator assembly 16, a voice coil motor (VCM) 17, a ramp loading mechanism 18, and a flexible printed circuit board (FPC) 19. The magnetic disk 12 is an example of a recording medium. The spindle motor 13 is an example of a motor.

[0026] The housing 11 includes a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container, and includes a bottom wall 25 and a side wall 26. The bottom wall 25 is an example of a first wall. The bottom wall 25 is formed in a substantially rectangular (quadrilateral) plate shape. The side wall 26 protrudes from the outer edge of the bottom wall 25. The bottom wall 25 and the side wall 26 are made of a metal material such as an aluminum alloy and are integrally formed.

[0027] The inner cover 22 and the outer cover 23 are made of metal materials such as aluminum alloy. The inner cover 22 is attached to the end of the side wall 26 by screws, for example. The outer cover 23 covers the inner cover 22 and is fixed to the end of the side wall 26 in an airtight manner by welding, for example.

[0028] A storage space S is provided inside the housing 11. The storage space S is formed (defined, partitioned) by the base 21 and the inner cover 22. The housing 11 of this embodiment hermetically seals the storage space S to prevent or reduce gas movement between the storage space S and the outside of the housing 11.

[0029] The storage space S inside the housing 11 stores the magnetic disk 12, the spindle motor 13, the clamp spring 14, the magnetic head 15, the actuator assembly 16, the voice coil motor 17, the ramp loading mechanism 18 and the FPC 19. The storage space S and the magnetic disk 12, the spindle motor 13, the clamp spring 14, the magnetic head 15, the actuator assembly 16, the voice coil motor 17, the ramp loading mechanism 18 and the FPC 19 stored therein are covered by the bottom wall 25 and the side wall 26 of the base 21 and the inner cover 22.

[0030] The inner cover 22 is provided with a vent 22a. Furthermore, the outer cover 23 is provided with a vent 23a. After the components are installed inside the base 21 and the inner cover 22 and the outer cover 23 are installed on the base 21, the air in the storage space S is exhausted from the vents 22a and 23a. Furthermore, the storage space S is filled with a gas different from the air.

[0031] The gas filled into the storage space S is, for example, a low-density gas having a density lower than that of air, an inert gas with low reactivity, etc. For example, helium is filled into the storage space S. In addition, other fluids may be filled into the storage space S. In addition, the storage space S may also be maintained at a vacuum, a low pressure close to a vacuum, or a negative pressure lower than the atmospheric pressure.

[0032] The vent 23a of the outer cover 23 is blocked by a seal 28. The seal 28 is made of, for example, metal or synthetic resin. The seal 28 hermetically seals the vent 23a to prevent the gas filled in the storage space S from leaking from the vent 23a.

[0033] The magnetic disk 12 is, for example, a disk having a magnetic recording layer provided on at least one of the upper surface and the lower surface. The diameter of the magnetic disk 12 is, for example, 3.5 inches, but the invention is not limited to this example.

[0034] The spindle motor 13 supports and rotates the plurality of magnetic disks 12 stacked at intervals. The clamp spring 14 holds the plurality of magnetic disks 12 to the hub of the spindle motor 13 .

[0035] The magnetic head 15 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 15 writes information on the magnetic disk 12. The magnetic head 15 is supported by an actuator assembly 16.

[0036] The actuator assembly 16 is rotatably supported on the support shaft 31, and the support shaft 31 is arranged at a position separated from the magnetic disk 12. The VCM 17 rotates the actuator assembly 16 and arranges it at a desired position. When the actuator assembly 16 is rotated by the VCM 17 and the magnetic head 15 moves to the outermost periphery of the magnetic disk 12, the ramp loading mechanism 18 keeps the magnetic head 15 at the unloading position separated from the magnetic disk 12.

[0037] The actuator assembly 16 has an actuator block 35, a plurality of arms 36, and a plurality of head gimbal assemblies 37. The head gimbal assemblies 37 can also be referred to as head gimbal assemblies (HGAs).

[0038] The actuator block 35 is rotatably supported on the support shaft 31 via a bearing, for example. A plurality of arms 36 protrude from the actuator block 35 in a direction substantially orthogonal to the support shaft 31. Alternatively, the actuator assembly 16 may be divided so that a plurality of arms 36 protrude from each of the plurality of actuator blocks 35.

[0039] The plurality of arms 36 are arranged at intervals in the direction in which the support shaft 31 extends. Each of the arms 36 is formed in a plate shape that can enter a gap between adjacent magnetic disks 12. The plurality of arms 36 extend substantially in parallel.

[0040] The actuator block 35 and the plurality of arms 36 are integrally formed of, for example, aluminum. In addition, the materials of the actuator block 35 and the arms 36 are not limited to this example.

[0041] The voice coil of the VCM 17 is provided on the protrusion protruding from the actuator block 35. The VCM 17 includes a pair of yokes, a voice coil disposed between the yokes, and a magnet provided on the yokes.

[0042] The head gimbal assembly 37 is attached to the front end portion of the corresponding arm 36 and protrudes from the arm 36. Thus, a plurality of head gimbal assemblies 37 are arranged at intervals in the direction in which the support shaft 31 extends.

[0043] Each of the plurality of head gimbal assemblies 37 includes a base plate 41, a load beam 42, and a flexure 43. Furthermore, the magnetic head 15 is mounted on the head gimbal assemblies 37.

[0044] The substrate 41 and the load beam 42 are made of, for example, stainless steel. The materials of the substrate 41 and the load beam 42 are not limited to this example. The substrate 41 is formed in a plate shape and is attached to the front end of the arm 36. The load beam 42 is formed in a plate shape that is thinner than the substrate 41. The load beam 42 is attached to the front end of the substrate 41 and protrudes from the substrate 41.

[0045] The flexible member 43 is formed in a long and narrow strip shape. The shape of the flexible member 43 is not limited to this example. The flexible member 43 is a laminated plate having a metal plate (lining layer) such as stainless steel, an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting a plurality of wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.

[0046] A universal joint (elastic support portion) located above the load beam 42 and capable of displacement is provided at one end of the flexure 43. The magnetic head 15 is mounted on the universal joint. The other end of the flexure 43 is connected to the FPC 19. Thus, the FPC 19 is electrically connected to the magnetic head 15 via the wiring of the flexure 43.

[0047] Figure 3 The HDD 10 of the first embodiment is disassembled and Figure 2 The illustrative stereograms are shown in different directions. Figure 3 As shown, the HDD 10 further includes a printed circuit board (PCB) 50 . The PCB 50 is an example of an external component. The PCB 50 is disposed outside the bottom wall 25 of the base 21 .

[0048] PCB 50 has a printed wiring board (PWB) 51. PWB 51 is a rigid substrate such as a glass epoxy substrate, a multilayer substrate, a built-up substrate, etc. PWB 51 is an example of a first substrate and a second substrate. In addition, the first substrate and the second substrate may also be other substrates such as FPC.

[0049] The PWB 51 is mounted on the outside of the bottom wall 25. In other words, the PWB 51 is mounted on the housing 11 outside the housing 11. The PWB 51 is mounted on the bottom wall 25 by, for example, screw-fastening with a screw or snap-fitting with a hook.

[0050] Figure 4 1 is an exemplary block diagram showing the structure of the HDD 10 according to the first embodiment. Figure 4 As shown, the PCB 50 has an interface (I / F) connector 52 , a controller 53 , a servo controller 54 , a relay connector 55 , and a wireless communication unit 56 .

[0051] The I / F connector 52, the controller 53, the servo controller 54, the relay connector 55, and the wireless communication unit 56 are mounted on the PWB 51. In addition, various memories such as RAM, ROM, and buffer memory, coils, capacitors, and other electronic components are mounted on the PWB 51.

[0052] The I / F connector 52 is a connector conforming to an interface standard such as Serial ATA, and is connected to the I / F connector 1a of the electronic device 1. Thus, the PWB 51 is electrically connected to the processor 1b of the electronic device 1. The processor 1b is, for example, a CPU (Central Processing Unit) and controls the entire electronic device 1.

[0053] The HDD 10 receives power supply from the electronic device 1 through the I / F connector 52, and receives access commands (control signals) such as write commands and read commands, and various data. In addition, the HDD 10 sends various data to the electronic device 1 through the I / F connector 52. In this way, the PCB 50 performs wired communication with the electronic device 1 through the I / F connector 52. In addition, the HDD 10 can also perform wireless communication with the electronic device 1.

[0054] The controller 53 includes, for example, a read / write channel (RWC), a hard disk controller (HDC), and a processor. The controller 53 may be a single component or may be a collective name for the independent RWC, HDC, and processor. The controller 53 controls the entire HDD 10 .

[0055] The servo controller 54 drives the spindle motor 13 and the VCM 17 . The relay connector 55 is used, for example, to supply power to various components arranged in the storage space S. The wireless communication unit 56 transmits and receives data to and from components mounted on the FPC 19 .

[0056] The wireless communication unit 61, the preamplifier 62, and the relay connector 63 are mounted on the FPC 19. Therefore, the wireless communication unit 61, the preamplifier 62, and the relay connector 63 are accommodated in the accommodation space S. The preamplifier 62 is an example of an internal component.

[0057] The wireless communication unit 61 performs wireless communication with the wireless communication unit 56 outside the housing 11. The preamplifier 62 is electrically connected to the magnetic head 15. Alternatively, the preamplifier 62 may be mounted on the flexure 43.

[0058] When reading data, the preamplifier 62 amplifies and outputs an electrical signal (read signal) corresponding to data read by the magnetic head 15 from the magnetic disk 12. The wireless communication unit 61 supplies the read signal amplified by the preamplifier 62 to the RWC of the controller 53 through the wireless communication unit 56.

[0059] Furthermore, the preamplifier 62 amplifies an electric signal (write signal) corresponding to data to be written, which is supplied from the RWC of the controller 53 through the wireless communication units 56 and 61 , and supplies the signal to the magnetic head 15 .

[0060] As described above, the preamplifier 62 communicates (transmits and receives data) with the controller 53 of the PCB 50 outside the housing 11 through the wireless communication units 56 and 61. In addition, the communication in this embodiment means the transmission and reception of information between independent elements. Therefore, the preamplifier 62 does not need to perform various controls such as signal conversion for communication. The preamplifier 62 and the PCB 50 only need to be in a relationship where when one side outputs a signal, the other side is input with a signal corresponding to the signal.

[0061] The relay connector 63 is supplied with power via the relay connector 55 of the PWB 51. In the present embodiment, the magnetic head 15, the wireless communication unit 61 of the FPC 19, and the preamplifier 62 are operated by the power supplied via the relay connector 63.

[0062] In the controller 53 of the PCB 50 , the HDC performs, for example, control of data transmission and reception with the electronic device 1 through the I / F connector 52 , control of the buffer memory, and error correction processing of read data.

[0063] The RWC of the controller 53 modulates the data to be written supplied from the HDC, for example, and supplies it to the preamplifier 62 via the wireless communication units 56 and 61. Furthermore, the RWC demodulates the signal read from the magnetic disk 12 and supplied from the preamplifier 62 via the wireless communication units 56 and 61, and outputs it to the HDC as digital data.

[0064] The processor of the controller 53 is, for example, a CPU. The processor controls the entire HDD 10 according to, for example, firmware pre-stored in the ROM and the disk 12. For example, the processor loads the firmware of the ROM and the disk 12 into the RAM, and controls the magnetic head 15, the servo controller 54, the wireless communication units 56 and 61, the preamplifier 62, the RWC, the HDC, and other components according to the loaded firmware.

[0065] The HDD 10 further includes a wired connection portion 70. The wired connection portion 70 is an example of a connection portion. The wired connection portion 70 electrically connects the magnetic head 15, the FPC 19, the wireless communication portion 61, and the preamplifier 62 in the storage space S to the PCB 50 outside the housing 11. The wired connection portion 70 includes two relay connectors 71 and 72. The relay connector 71 is an example of a first connector. The relay connector 72 is an example of a second connector.

[0066] The housing 11 has a relay substrate 75. The relay substrate 75 is an example of a second wall. The relay substrate 75 is mounted on the base 21 of the housing 11. The relay connectors 71 and 72 are provided on the relay substrate 75. The relay connectors 71 and 72 are electrically connected to each other by, for example, a conductor penetrating the relay substrate 75.

[0067] The relay connector 71 is located outside the housing 11. The relay connector 71 is connected to the relay connector 55 of the PCB 50. In other words, the relay connector 71 is electrically connected to the PCB 50.

[0068] The relay connector 72 is located in the storage space S. The relay connector 72 is connected to the relay connector 63 of the FPC 19 . Thus, the relay connector 72 is electrically connected to the preamplifier 62 and the magnetic head 15 through the FPC 19 .

[0069] The FPC 19, the wireless communication unit 61 and the preamplifier 62 mounted on the FPC 19, and the magnetic head 15 mounted on the flexible member 43 receive power supply from the electronic device 1 through the relay connectors 55, 63, 71, 72, and the I / F connector 52. In other words, power is supplied from the PCB 50 to the magnetic head 15, the FPC 19, and the wireless communication unit 61 through the relay connectors 71, 72.

[0070] The relay connectors 55 , 63 , 71 , and 72 have a plurality of pins (terminals) and wiring for power supply (power supply) and ground (Ground). The relay connectors 55 , 63 , 71 , and 72 may also have a plurality of pins and wiring for power supply, ground, and control of the VCM 17 .

[0071] As described above, the relay connectors 55, 63, 71, 72 of this embodiment are used to supply power to various components arranged in the storage space S inside the housing 11. In addition, the relay connectors 55, 63, 71, 72 may also be provided with pins and wiring for data communication between the components mounted on the FPC 19 and the PCB 50.

[0072] like Figure 3 As shown, the HDD 10 further includes a relay FPC 65. The relay FPC 65 extends across the storage space S and the outside of the housing 11 through a hole located near the spindle motor 13 and penetrating the bottom wall 25 of the base 21. The hole is sealed with, for example, synthetic resin.

[0073] The relay FPC 65 electrically connects, for example, the servo controller 54 of the PCB 50 and the spindle motor 13. The spindle motor 13 receives a drive signal from the servo controller 54 via the relay FPC 65, and receives power from the PCB 50.

[0074] Hereinafter, the structure of the HDD 10 according to the present embodiment will be described in detail. Figure 5 It is along Figure 3 The F5-F5 line of FIG. 1 schematically shows an exemplary cross-sectional view of a portion of the HDD 10 according to the first embodiment. Figure 5 As shown, the bottom wall 25 of the base 21 has an inner surface 25 a and an outer surface 25 b .

[0075] The inner surface 25a faces the inside of the housing 11. The inner surface 25a forms (defines, partitions) a part of the storage space S inside the housing 11. In other words, the inner surface 25a faces the storage space S. The inner surface 25a faces various components such as the FPC 19 arranged in the storage space S.

[0076] The outer surface 25b is located on the opposite side of the inner surface 25a and faces the outside of the housing 11. The outer surface 25b faces the PCB 50 at a distance. In addition, the outer surface 25b and the PCB 50 may also contact each other.

[0077] The bottom wall 25 is provided with an insertion hole 81 and a plurality of through holes 82. The insertion hole 81 is an example of a second through hole. The through hole 82 is an example of a first through hole. The insertion hole 81 and the through hole 82 penetrate the bottom wall 25 and open on the inner surface 25a and the outer surface 25b. In other words, the insertion hole 81 and the through hole 82 connect the storage space S with the outside of the housing 11.

[0078] The opening area (cross-sectional area) of the insertion hole 81 is larger than the opening area of ​​the through hole 82. The insertion hole 81 is, for example, a substantially quadrilateral hole. The through hole 82 is, for example, a substantially circular hole. In addition, the opening areas and shapes of the insertion hole 81 and the through hole 82 are not limited to this example.

[0079] The relay substrate 75 is a substantially quadrilateral plate made of an insulator such as synthetic resin or ceramics, for example. The relay substrate 75 is not limited to this example. The relay substrate 75 has an inner surface 75a and an outer surface 75b.

[0080] The inner surface 75a is a substantially flat surface facing the inside of the housing 11. The inner surface 75a forms (defines, partitions) a part of the storage space S inside the housing 11. The inner surface 75a faces a component such as the FPC 19 arranged in the storage space S.

[0081] The outer surface 75b is a substantially flat surface located on the opposite side of the inner surface 75a and facing the outside of the housing 11. The area of ​​the outer surface 75b is larger than the opening area of ​​the insertion hole 81. The outer surface 75b covers the insertion hole 81 from the inside of the housing 11. A portion of the outer surface 75b faces the inner surface 25a of the bottom wall 25. Another portion of the outer surface 75b is exposed to the outside of the housing 11 through the insertion hole 81, and faces the inner surface 51a of the PWB 51 through the insertion hole 81.

[0082] For example, the adhesive 85 is provided between the inner surface 25a of the bottom wall 25 and the outer surface 75b of the relay substrate 75 facing each other. The adhesive 85 fixes the inner surface 25a of the bottom wall 25 and the outer surface 75b of the relay substrate 75 to each other. The adhesive 85 is mixed with a metal filler, for example, and can suppress the passage of gas through the adhesive 85.

[0083] The adhesive 85 is provided along the edge of the insertion hole 81, and closes the gap between the inner surface 25a of the bottom wall 25 and the outer surface 75b of the relay substrate 75 over the entire circumference. Thus, the relay substrate 75 closes the insertion hole 81 airtightly. Alternatively, the relay substrate 75 may be fixed to the bottom wall 25 by other methods such as soldering.

[0084] The relay connectors 71 and 72 each have, for example, a plurality of pins (terminals). The number of pins and the size of the relay connectors 71 and 72 are set according to, for example, the amount of power and the amount of data transmitted by the wired connection unit 70 .

[0085] In this embodiment, the wired connection part 70 is used for power supply and does not transmit read signals and write signals corresponding to data. Therefore, the number and size of pins of the relay connectors 71 and 72 are reduced. In addition, the wired connection part 70 can also be used for data transmission.

[0086] The pins (terminals) of the relay connector 71 are provided, for example, on the outer surface 75b of the relay substrate 75. In addition, the relay connector 71 may include, for example, a plug or a socket protruding from the outer surface 75b.

[0087] Pins (terminals) of the relay connector 72 are provided on the inner surface 75a of the relay substrate 75. In this way, the wired connection portion 70 is provided on the relay substrate 75. In addition, the relay connector 72 may have, for example, a plug or a socket protruding from the inner surface 75a.

[0088] In the relay substrate 75, the relay connector 71 provided on the outer surface 75b and the relay connector 72 provided on the inner surface 75a are electrically connected through a conductor such as a through hole (via) penetrating the relay substrate 75. Thus, the relay connector 71 and the relay connector 72 are electrically connected to each other. The conductor electrically connects the relay connector 71 and the relay connector 72 while keeping the seal of the insertion hole 81 of the relay substrate 75.

[0089] The FPC 19 has, for example, a conductor layer, an insulating layer, and an adhesive layer stacked on each other, and is elastically deformable. The conductor layer is made of, for example, a conductive metal such as copper, and the insulating layer is made of, for example, an insulating synthetic resin such as polyimide.

[0090] like Figure 2 As shown, the FPC 19 has a first end 19a and a second end 19b. The first end 19a is attached to the actuator block 35 by, for example, screws. The first end 19a is electrically connected to the flexure 43. The second end 19b is attached to the bottom wall 25 by, for example, screws.

[0091] like Figure 5As shown, the second end 19b of the FPC 19 extends substantially along the inner surface 25a of the bottom wall 25. The second end 19b has an outer surface 19c. The outer surface 19c faces the inner surface 25a of the bottom wall 25 and the inner surface 75a of the relay substrate 75. In addition, the outer surface 19c may also partially contact the inner surface 25a of the bottom wall 25.

[0092] The PWB 51 has an inner surface 51a and an outer surface 51b. The inner surface 51a is an example of the first surface. The outer surface 51b is an example of the second surface. The inner surface 51a faces the outer surface 25b of the bottom wall 25 and the outer surface 75b of the relay substrate 75 at a distance. The inner surface 51a covers the insertion hole 81 and the plurality of through holes 82. The outer surface 51b is located on the opposite side of the first surface.

[0093] The PWB 51 is provided with a recessed portion 51c recessed from the inner surface 51a. The recessed portion 51c is provided, for example, at a portion of the inner surface 51a facing the plurality of through holes 82. The recessed portion 51c is not limited to this example.

[0094] The relay connectors 55 and 63 of the PWB 51 and the FPC 19 have structures corresponding to the relay connectors 71 and 72 of the wired connection portion 70. The relay connectors 55 and 63 each have, for example, an insulating base and a plurality of pins (terminals) attached to the base.

[0095] For example, one end of the pin of the relay connector 55 is soldered to an electrode provided on the inner surface 51a of the PWB 51. Thus, the relay connector 55 is mounted on the PWB 51. In this way, the relay connector 55 is provided on the PWB 51 and protrudes from the inner surface 51a. The relay connector 55 is connected to the relay connector 71 of the wired connection part 70. Thus, the relay connector 71 is connected to the PWB 51.

[0096] For example, one end of the pin of the relay connector 63 is soldered to an electrode provided on the outer surface 19c of the FPC 19. Thus, the relay connector 63 is mounted on the FPC 19. In this way, the relay connector 63 is provided on the FPC 19 and protrudes from the outer surface 19c. The relay connector 63 is connected to the relay connector 72 of the wired connection portion 70. Thus, the relay connector 72 is connected to the FPC 19.

[0097] The FPC 19 and the PWB 51 are electrically connected to each other through the wired connection portion 70 while the seal of the through hole 81 by the relay substrate 75 is maintained. However, for example, fine holes may exist in the relay substrate 75 made of synthetic resin. For example, the relay substrate 75 only needs to seal the through hole 81 airtightly to such an extent that the leakage of the gas filled in the storage space S during the service life of the HDD 10 is contained within a predetermined range.

[0098] The housing 11 further includes a plurality of sealing materials 91 . The sealing material 91 is an example of a first sealing material. The sealing material 91 is made of, for example, transparent or semi-transparent glass or synthetic resin. Therefore, light can pass through the sealing material 91 .

[0099] The sealing material 91 hermetically seals the corresponding through hole 82. For example, the sealing material 91 is made by filling the inside of a substantially cylindrical metal tube 92. When the sealing material 91 and the metal tube 92 are embedded in the through hole 82, the metal tube 92 is welded to the bottom wall 25. Thus, the sealing material 91 can seal the through hole 82. In addition, the sealing material 91 is not limited to this example. For example, the sealing material 91 can be directly filled in the through hole 82, or an adhesive can be sealed between the sealing material 91 and the through hole 82.

[0100] Instead of the sealing material 91 of this embodiment, a cap-shaped sealing material 91 may be attached to the inner surface 25a and the outer surface 25b of the bottom wall 25 to hermetically seal the through hole 82. That is, the sealing material 91 may be located outside the through hole 82.

[0101] Figure 6 FIG. 1 is an exemplary block diagram showing a part of the structure of the HDD 10 according to the first embodiment. Figure 6 As shown, in this embodiment, the wireless communication unit 56 provided in the PWB 51 includes, for example, a light source 56a, a light receiving element 56b, and a conversion IC 56c. The light source 56a and the light receiving element 56b are examples of external wireless communication devices. In addition, the wireless communication unit 56 may also be an example of an external wireless communication device. Furthermore, the conversion IC 56c may also be an example of an external component.

[0102] The light source 56a, the light receiving element 56b, and the conversion IC 56c are mounted separately from each other on the PWB 51. Alternatively, the light source 56a, the light receiving element 56b, and the conversion IC 56c may be formed integrally.

[0103] like Figure 5 As shown, the light source 56a and the light receiving element 56b of the wireless communication unit 56 are located outside the housing 11 and are located in the recess 51c of the PWB 51 and mounted on the PWB 51. In other words, at least a part of the light source 56a and the light receiving element 56b is accommodated in the recess 51c.

[0104] The light source 56a is, for example, a laser diode (LD). In addition, the light source 56a may also be other light sources such as a light emitting diode (LED). For example, the light source 56a is partially embedded in the PWB 51. In other words, the light source 56a is formed integrally with the PWB 51. In addition, the light source 56a is not limited to this example. The light source 56a emits a laser (light) L corresponding to the input drive signal (electrical signal) toward the sealing material 91 of the corresponding through hole 82. The light source 56a may be in contact with the sealing material 91 or may be separated from the sealing material 91.

[0105] The light receiving element 56b is, for example, a photodiode or a phototransistor. In addition, the light receiving element 56b is not limited to this example. The light receiving element 56b is, for example, mounted on the bottom surface 51d of the recess 51c. The bottom surface 51d is provided on the PWB 51, forming (prescribing, dividing) a portion of the recess 51c, and facing the outer surface 25b of the bottom wall 25 at a distance. The light receiving surface of the light receiving element 56b faces the sealing material 91 of another corresponding through hole 82. The light receiving element 56b may be in contact with the sealing material 91 or may be separated from the sealing material 91. The light receiving element 56b outputs an output signal (electrical signal) corresponding to the light L incident on the light receiving surface.

[0106] The conversion IC 56c outputs a drive signal (electrical signal) corresponding to the write signal (electrical signal) input from the controller 53 to the light source 56a. Furthermore, the conversion IC 56c outputs a read signal (electrical signal) corresponding to the output signal (electrical signal) of the light receiving element 56b to the controller 53. The conversion IC 56c may also be multiplexed.

[0107] The light source 56a and the light receiving element 56b may each include a conversion IC 56c. In this case, a write signal is input to the light source 56a as a drive signal, and the light receiving element 56b outputs an output signal as a read signal.

[0108] As described above, the wireless communication unit 56 converts the light L (optical signal) into an electrical signal and converts the electrical signal into an optical signal. Thus, the wireless communication unit 56 can perform wireless communication using an optical signal without using an electrical connection. The wireless communication unit 56 is not limited to this example.

[0109] like Figure 6 As shown, in this embodiment, the wireless communication unit 61 includes, for example, a light source 61a, a light receiving element 61b, and a conversion IC 61c. The light source 61a and the light receiving element 61b are examples of internal wireless communication devices. In addition, the wireless communication unit 61 can also be an example of an internal wireless communication device. Furthermore, the conversion IC 61c can also be an example of an internal component.

[0110] The light source 61a, the light receiving element 61b and the conversion IC 61c are mounted separately from each other on the outer surface 19c of the FPC 19. In other words, the light source 61a, the light receiving element 61b and the conversion IC 61c are electrically connected to the FPC 19. Alternatively, the light source 61a, the light receiving element 61b and the conversion IC 61c may be formed integrally.

[0111] like Figure 5 As shown, the light source 61a is, for example, an LD. In addition, the light source 61a may also be another light source such as an LED. The light source 61a emits a laser (light) L corresponding to the input drive signal (electrical signal) toward the sealing material 91 of the corresponding through hole 82. The light source 61a may be in contact with the sealing material 91 or may be separated from the sealing material 91.

[0112] The light source 61a of the wireless communication unit 61 faces the light receiving element 56b of the wireless communication unit 56 via the sealing material 91 of the corresponding through hole 82. The light source 61a emits light L to the light receiving surface of the light receiving element 56b of the wireless communication unit 56 through the sealing material 91 of the corresponding through hole 82, for example.

[0113] The light source 61a and the light receiving element 56b may not face each other. For example, the light receiving element 56b may be separated from the optical axis of the light source 61a. In this case, the light L emitted from the light source 61a may be incident on the light receiving element 56b by, for example, reflection, refraction or diffraction.

[0114] The light receiving element 61b is, for example, a photodiode or a phototransistor. In addition, the light receiving element 61b is not limited to this example. The light receiving surface of the light receiving element 61b faces the sealing material 91 of the corresponding other through hole 82. The light receiving element 61b can be in contact with the sealing material 91 or separated from the sealing material 91.

[0115] The light receiving element 61b of the wireless communication unit 61 faces the light source 56a of the wireless communication unit 56 via the sealing material 91 of the corresponding through hole 82. The light receiving element 61b outputs an output signal (electrical signal) corresponding to the light L emitted from the light source 56a and incident on the light receiving surface through the sealing material 91 of the corresponding through hole 82, for example.

[0116] The light source 56a and the light receiving element 61b may not face each other. For example, the light receiving element 61b may be separated from the optical axis of the light source 56a. In this case, the light L emitted from the light source 56a may be incident on the light receiving element 61b by, for example, reflection, refraction or diffraction.

[0117] In this embodiment, the total number of light sources 56a and light receiving elements 56b included in the wireless communication unit 56, the total number of light sources 61a and light receiving elements 61b included in the wireless communication unit 61, and the number of the plurality of through holes 82 are equal to each other. However, the number of light sources 56a, 61a, light receiving elements 56b, 61b, and through holes 82 is not limited to this example. For example, the plurality of light sources 56a, 61a and the plurality of light receiving elements 56b, 61b may face each other through one through hole 82.

[0118] Figure 6 The conversion IC 61c shown outputs a drive signal (electric signal) corresponding to the read signal (electric signal) input from the preamplifier 62 to the light source 61a. Furthermore, the conversion IC 61c outputs a write signal (electric signal) corresponding to the output signal (electric signal) of the light receiving element 61b to the preamplifier 62. The conversion IC 56c can also be multiplexed.

[0119] The light source 61a and the light receiving element 61b may each include a conversion IC 61c. In this case, a read signal is input to the light source 61a as a drive signal, and the light receiving element 61b outputs an output signal as a write signal.

[0120] As described above, the wireless communication unit 61 converts an optical signal into an electrical signal, and converts an electrical signal into an optical signal. Thus, the wireless communication unit 61 can perform wireless communication using an optical signal without using an electrical connection. For example, the conversion IC 56c of the wireless communication unit 56 and the conversion IC 61c of the wireless communication unit 61 perform wireless communication via the light sources 56a, 61a and the light receiving elements 56b, 61b. In addition, the wireless communication unit 61 is not limited to this example.

[0121] The wireless communication units 56 and 61 in this embodiment perform wireless communication with each other through light L. For example, the conversion ICs 56c and 61c of the wireless communication units 56 and 61 perform signal conversion and generation based on a common communication method. Furthermore, the light sources 56a and 61a of the wireless communication units 56 and 61 emit light L of a frequency that can be detected by the light receiving elements 56b and 61b. In addition, the light L is not limited to visible light, and may also be infrared light or ultraviolet light.

[0122] like Figure 5 As shown, the HDD 10 further includes a first light shielding sheet 95 and a second light shielding sheet 96. The first light shielding sheet 95 is an example of a light shielding member. The first light shielding sheet 95 is, for example, a polymer sheet called a heat transfer sheet or a heat sink. The first light shielding sheet 95 is not limited to this example.

[0123] The first light shielding sheet 95 is located between the PWB 51 and the bottom wall 25 of the housing 11. The first light shielding sheet 95 has an inner surface 95a and an outer surface 95b. The inner surface 95a and the outer surface 95b are surfaces of the first light shielding sheet 95 having adhesiveness.

[0124] The inner surface 95a faces the outer surface 25b of the bottom wall 25 and is detachably attached to the outer surface 25b. The outer surface 95b is located on the opposite side of the inner surface 95a. The outer surface 95b faces the PCB 50 and is detachably attached to the PCB 50. The outer surface 95b is attached to the inner surface 51a of the PWB 51, for example. The outer surface 95b can also be attached to various components included in the PCB 50 and mounted on the PWB 51.

[0125] The first light shielding sheet 95 can be elastically deformed according to the shapes of the outer surface 25b of the bottom wall 25 and the inner surface 51a of the PWB 51. Therefore, even if the outer surface 25b of the bottom wall 25 has unevenness, the first light shielding sheet 95 can suppress the generation of a gap between the inner surface 95a and the outer surface 25b. Furthermore, even if the inner surface 51a of the PWB 51 has unevenness, the first light shielding sheet 95 can suppress the generation of a gap between the outer surface 95b and the inner surface 51a.

[0126] The first light shielding sheet 95 is provided with a through hole 95c. The through hole 95c penetrates the first light shielding sheet 95 and opens on the inner surface 95a and the outer surface 95b. The through hole 95c communicates with the plurality of through holes 82 of the bottom wall 25 and the recess 51c of the PWB 51.

[0127] The light source 56a and the light receiving element 56b of the wireless communication unit 56 are located inside the through hole 95c. In other words, the first light shielding sheet 95 surrounds the light source 56a and the light receiving element 56b of the wireless communication unit 56 in the direction along the outer surface 25b of the bottom wall 25.

[0128] The first light shielding sheet 95 is opaque and has black, white or other colors, or is translucent. The first light shielding sheet 95 blocks light in the gap between the bottom wall 25 and the PCB 50. Therefore, the first light shielding sheet 95 prevents the light outside the housing 11 from being incident on the light receiving element 56b of the wireless communication unit 56, and prevents the light outside the housing 11 from being incident on the light receiving element 61b of the wireless communication unit 61 through the sealing material 91 of the through hole 82.

[0129] The thermal conductivity of the first light shielding sheet 95 is higher than that of the PWB 51. Therefore, the first light shielding sheet 95 can transfer heat between the PCB 50 and the base 21 of the housing 11. For example, the first light shielding sheet 95 is attached to the controller 53 of the PCB 50 to cool the controller 53.

[0130] In this embodiment, the size of the outer surface 95b of the first light shielding sheet 95 is substantially equal to the size of the inner surface 51a of the PWB 51. In addition, the first light shielding sheet 95 is not limited to this example. For example, the first light shielding sheet 95 may also be a frame-shaped sheet provided along the edge of the recess 51c of the PWB 51.

[0131] The second light shielding sheet 96 is located between the inner surface 25a of the bottom wall 25 and the outer surface 19c of the FPC 19. The second light shielding sheet 96 has adhesiveness and is detachably attached to the inner surface 25a and the outer surface 19c.

[0132] The second light shielding sheet 96 is formed in a frame shape, for example, and surrounds the light source 61a and the light receiving element 61b of the wireless communication unit 61. The second light shielding sheet 96 is opaque and has black, white or other colors, or is translucent. The second light shielding sheet 96 blocks light in the gap between the bottom wall 25 and the FPC 19. Therefore, the second light shielding sheet 96 can prevent the light of the storage space S from being incident on the light receiving element 61b of the wireless communication unit 61, and prevent the light of the storage space S from being incident on the light receiving element 56b of the wireless communication unit 56 through the sealing material 91 of the through hole 82.

[0133] Hereinafter, an example of the operation of the HDD 10 of the present embodiment will be described. For example, in the write operation, Figure 4 The processor 1b of the electronic device 1 inputs a write command and write target data to the controller 53 via the I / F connectors 1a and 52. The RWC of the controller 53 inputs a write signal corresponding to the write target data to the conversion IC 56c of the wireless communication unit 56 based on the write command.

[0134] Figure 6 The conversion IC 56c converts the input write signal into a drive signal and outputs it to the light source 56a. The light source 56a emits the laser (light) L corresponding to the drive signal through the sealing material 91 of the through hole 82 toward the light receiving element 61b of the wireless communication unit 61. In other words, the light source 56a of the wireless communication unit 56 generates light L corresponding to the electrical signal (write signal) of the information written by the magnetic head 15 to the magnetic disk 12 toward the light receiving element 61b of the wireless communication unit 61. The light source 56a irradiates the light L to the light receiving element 61b through the sealing material 91 of the through hole 82.

[0135] When the light L is incident on the light receiving element 61b of the wireless communication unit 61, the light receiving element 61b outputs an output signal corresponding to the light L to the conversion IC 61c. The conversion IC 61c converts (restores) the output signal into a write signal and outputs it to the preamplifier 62. In this way, the light L generated by the light source 56a of the wireless communication unit 56 is irradiated to the light receiving element 61b of the wireless communication unit 61 through the sealing material 91 of the through hole 82. The light receiving element 61b generates an electrical signal (write signal) of information written to the magnetic disk 12 by the magnetic head 15 corresponding to the light L.

[0136] The preamplifier 62 amplifies the write signal and outputs the amplified write signal to the magnetic head 15 . The magnetic head 15 writes the write target data included in the write signal into the storage layer of the magnetic disk 12 .

[0137] and then, Figure 4 The controller 53 controls various components such as the VCM 17 based on the write command. For example, the servo controller 54 controls the VCM 17 based on the control from the controller 53. The servo controller 54 outputs signals to the VCM 17 through the relay connectors 55, 72, 71, and 63. In addition, the servo controller 54 can also output signals to the VCM 17 through the wireless communication units 56 and 61.

[0138] On the other hand, in the read operation, the processor 1b of the electronic device 1 inputs a read command to the controller 53 via the I / F connectors 1a and 52. The controller 53 causes the magnetic head 15 to read data from the storage layer of the magnetic disk 12 based on the read command.

[0139] When the magnetic head 15 reads the data to be read, the preamplifier 62 amplifies the read signal corresponding to the read data and outputs it to the conversion IC 61 c of the wireless communication unit 61 . Figure 6 The conversion IC 61c converts the input read signal into a drive signal and outputs it to the light source 61a. The light source 61a emits the laser (light) L corresponding to the drive signal through the sealing material 91 of the through hole 82 toward the light receiving element 56b of the wireless communication unit 56. In other words, the light source 61a of the wireless communication unit 61 generates light L corresponding to the electrical signal (read signal) of the information read from the magnetic disk 12 by the magnetic head 15 toward the light receiving element 56b of the wireless communication unit 56. The light source 61a irradiates the light L to the light receiving element 56b through the sealing material 91 of the through hole 82.

[0140] When the light L is incident on the light receiving element 56b of the wireless communication unit 56, the light receiving element 56b outputs an output signal corresponding to the light L to the conversion IC 56c. The conversion IC 56c converts (restores) the output signal into a read signal and outputs it to the controller 53. In this way, the light L generated by the light source 61a of the wireless communication unit 61 is irradiated from the light source 61a of the wireless communication unit 61 to the light receiving element 56b of the wireless communication unit 56 through the sealing material 91 of the through hole 82. The light receiving element 56b generates an electrical signal (read signal) of the information read from the magnetic head 15 from the magnetic disk 12 corresponding to the light L.

[0141] The RWC of the controller 53 demodulates the read signal, and outputs the data to be read contained in the read signal to the electronic device 1 through the I / F connectors 1a and 52. Thus, the electronic device 1 acquires the data read from the magnetic disk 12.

[0142] In the above operation of the HDD 10, data transmission and reception between the FPC 19 inside the housing 11 and the PCB 50 outside the housing 11 is performed by wireless communication using light L between the wireless communication units 56 and 61. On the other hand, power supply to the magnetic head 15, VCM 17 and FPC 19 inside the housing 11 is performed through the relay connectors 55, 63, 71, and 72. Therefore, in the relay connectors 55, 63, 71, and 72, pins for power supply are provided, but pins for data transmission and reception can be omitted.

[0143] The relay connectors 55, 63, 71, 72 may also be provided with pins for data transmission and reception. In this case, data transmission and reception between the FPC 19 and the PWB 51 may be partially performed by wireless communication between the wireless communication units 56, 61, and partially performed by wired communication through the relay connectors 55, 63, 71, 72. For example, less data transmission and reception may be performed by wired communication through the relay connectors 55, 63, 71, 72.

[0144] In the electronic device 1 of the first embodiment described above, the light source 61a and the light receiving element 61b are stored in the storage space S. The light source 61a and the light receiving element 61b perform at least one of the following operations: generating an electrical signal (write signal) of information written by the magnetic head 15 to the magnetic disk 12 corresponding to the light L generated by the light source 56a; and generating light L corresponding to the electrical signal (read signal) of information read from the magnetic head 15 from the magnetic disk 12 toward the light receiving element 56b. The preamplifier 62 is stored in the storage space S, electrically connected to the magnetic head 15, and communicates with the PCB 50 outside the housing 11 through the light sources 56a, 61a and the light receiving elements 56b, 61b. Conventionally, for example, the relay connectors 71, 72 provided on the relay substrate 75 transmit and receive the write signal and the read signal between the preamplifier 62 and the PCB 50. The relay substrate 75 and the relay connectors 71, 72 may be enlarged as the capacity of the write signal and the read signal increases. When the relay substrate 75 is enlarged, there is a possibility that the gas in the storage space S leaks through the pores of the relay substrate 75, the adhesive 85 between the housing 11 and the relay substrate 75, the positioning accuracy between the relay connectors 71, 72 and the relay connectors 55, 63 is reduced, and the design cost for newly designing a large relay substrate 75 and relay connectors 71, 72 is increased. On the other hand, the HDD 10 of the present embodiment communicates the write signal and the read signal between the preamplifier 62 and the PCB 50 via the light L. That is, the HDD 10 can communicate between the inside and the outside of the housing 11 without passing through the relay connectors 71, 72. As a result, the HDD 10, for example, does not need to provide pins (terminals) for communication of the write signal and the read signal in the relay connectors 71, 72. Therefore, the HDD 10, for example, can miniaturize or omit the relay substrate 75 and the relay connectors 71, 72, and can suppress the gas leakage in the storage space S. Furthermore, the HDD 10 can suppress the reduction of the positioning accuracy between the components and the increase of the design cost.

[0145] The light source 56a and the light receiving element 56b are located outside the housing 11, and perform at least one of the following actions: generating an electrical signal (read signal) corresponding to the light L generated by the light source 61a; and generating light L corresponding to the electrical signal (write signal) of the information written by the magnetic head 15 to the magnetic disk 12 toward the light receiving element 61b. The PCB 50 has a PWB 51. The PWB 51 is mounted on the housing 11 outside the housing 11, and is mounted with the light source 56a and the light receiving element 56b. That is, the light source 61a and the light receiving element 61b do not communicate with an external device different from the HDD 10, but are mounted on the housing 11 and communicate with the light source 56a and the light receiving element 56b included in the HDD 10. As a result, for example, there is no need to set the light source 56a and the light receiving element 56b in the electronic device 1 equipped with the HDD 10, and the HDD 10 can be mounted on the electronic device 1 in the same way as a general HDD.

[0146] The housing 11 has a bottom wall 25 covering the storage space S. The PWB 51 has an inner surface 51a facing the bottom wall 25, and is provided with a recessed portion 51c recessed from the inner surface 51a. The light source 56a and the light receiving element 56b are located in the recessed portion 51c and mounted on the PWB 51. Thus, the portion around the recessed portion 51c in the PWB 51 surrounds the light source 56a and the light receiving element 56b, so that the light receiving element 56b can be prevented from receiving light as noise from the outside of the HDD 10.

[0147] The housing 11 has a bottom wall 25 covering the storage space S, and is provided with a through hole 82 penetrating the bottom wall 25. The light source 61a and the light receiving element 61b generate at least one of an electrical signal corresponding to the light L irradiated from the light source 56a through the through hole 82, and irradiate the light L to the light receiving element 56b through the through hole 82. In this way, the light sources 56a, 61a and the light receiving elements 56b, 61b communicate write signals and read signals between the inside and outside of the housing 11 via the light L. As a result, the HDD 10, for example, does not need to provide pins (terminals) for communication of write signals and read signals in the relay connectors 71, 72. Therefore, the HDD 10 can, for example, suppress gas leakage in the storage space S. Furthermore, the HDD 10 can suppress the reduction in positioning accuracy between components and the increase in design costs. In addition, communication via light can generally increase the transmission speed compared to communication via electrical signals. Therefore, the wireless communication units 56 and 61 can reduce the number of light sources 56 a and 61 a and the number of through holes 82 , and can suppress leakage of gas in the storage space S through the through holes 82 .

[0148] The first light shielding sheet 95 is located between the PWB 51 and the housing 11, and surrounds the light source 56a and the light receiving element 56b to block light. The first light shielding sheet 95 surrounds the light source 56a and the light receiving element 56b, and thus can prevent the light receiving element 56b from receiving light as noise from outside the HDD 10.

[0149] The housing 11 has a transparent or translucent sealing material 91 that seals the through hole 82. The light source 61a and the light receiving element 61b perform at least one of generating an electrical signal corresponding to the light L irradiated from the light source 56a through the sealing material 91 and irradiating the light L to the light receiving element 56b through the sealing material 91. Thus, the HDD 10 of the present embodiment can suppress leakage of gas in the storage space S through the through hole 82.

[0150] The wired connection part 70 electrically connects the PCB 50 and the preamplifier 62. The housing 11 has a bottom wall 25 that covers the storage space S and is provided with an insertion hole 81, and a relay substrate 75 that blocks the insertion hole 81. The wired connection part 70 has: a relay connector 71, which is provided on the relay substrate 75, is located outside the housing 11, and is electrically connected to the PCB 50; and a relay connector 72, which is provided on the relay substrate 75, is located in the storage space S, and is electrically connected to the relay connector 71. The preamplifier 62 is electrically connected to the relay connector 72, and power is supplied from the PCB 50 through the relay connector 71 and the relay connector 72. As a result, the preamplifier 62 can be supplied with stable power through the relay connectors 71 and 72. On the other hand, the relay connectors 71 and 72 do not need to have pins (terminals) for transmitting read signals and write signals. Therefore, the relay connectors 71, 72 and the relay substrate 75 can be prevented from being enlarged, and the HDD 10 can prevent gas leakage in the storage space S.

[0151] The first embodiment can also be described by other expressions as follows. The wireless communication unit 61 is stored in the storage space S. The wireless communication unit 61 generates at least one of a write signal corresponding to the light L generated by the wireless communication unit 56 and a light L corresponding to the read signal toward the wireless communication unit 56. The preamplifier 62 is stored in the storage space S, electrically connected to the magnetic head 15, and communicates with the PCB 50 outside the housing 11 through the wireless communication units 56 and 61. In addition, the conversion IC 61c is stored in the storage space S, electrically connected to the magnetic head 15, and communicates with the conversion IC 56c outside the housing 11 through the light sources 56a and 61a and the light receiving elements 56b and 61b.

[0152] (Second embodiment)

[0153] Below, refer to Figure 7The second embodiment is described. In the following description of the multiple embodiments, the components having the same functions as the components of the first embodiment are sometimes given the same symbols as the components already described, and the description is omitted. In addition, the multiple components given the same symbols are not limited to having all the same functions and properties, and may also have different functions and properties according to each embodiment.

[0154] Figure 7 2 is an exemplary cross-sectional view schematically showing a portion of the HDD 10 according to the second embodiment. Figure 7 As shown, the HDD 10 according to the second embodiment includes a photocoupler 100. The photocoupler 100 is an example of a communication unit.

[0155] The photocoupler 100 includes light sources 56a, 61a, light receiving elements 56b, 61b, a plurality of conductive members 101, and a housing 102. The light sources 56a, 61a of the photocoupler 100 are, for example, LEDs. Alternatively, the light sources 56a, 61a may be LDs as in the first embodiment.

[0156] The conductive component 101 is made of a metal such as copper. The plurality of conductive components 101 are connected to the corresponding light sources 56a, 61a or light receiving elements 56b, 61b. For example, one end of each conductive component 101 is connected to one of the light sources 56a, 61a and the light receiving elements 56b, 61b. The other end of the conductive component 101 is a terminal of the photocoupler 100.

[0157] The housing 102 is made of an insulating material such as synthetic resin, for example. The housing 102 is formed in a box shape, and a space 102a is provided inside. The space 102a is sealed airtightly, for example.

[0158] The light sources 56a, 61a and the light receiving elements 56b, 61b are accommodated in the space 102a. Therefore, the housing 102 covers the light sources 56a, 61a and the light receiving elements 56b, 61b. The housing 102 is, for example, black and blocks light. Therefore, the housing 102 prevents external light from entering the light receiving elements 56b, 61b.

[0159] In the space 102a, the light sources 56a and 61a and the light receiving elements 56b and 61b are separated from each other. The light source 56a and the light receiving element 61b face each other at a distance in the space 102a. Furthermore, the light receiving element 56b and the light source 61a face each other at a distance in the space 102a.

[0160] In the second embodiment, the conversion IC 56 c may be incorporated into the photocoupler 100 , mounted on the PWB 51 , or omitted. In addition, the conversion IC 61 c may be incorporated into the photocoupler 100 , mounted on the FPC 19 , or omitted.

[0161] The conductive member 101 is formed integrally with the housing 102 by, for example, insert molding, and is provided across the inside and outside of the housing 102. Therefore, the housing 102 holds the conductive member 101.

[0162] The housing 102 indirectly holds the light sources 56a, 61a and the light receiving elements 56b, 61b by holding the conductive member 101. That is, the housing 102 holds the light sources 56a, 61a and the light receiving elements 56b, 61b at positions separated from each other.

[0163] In the second embodiment, a storage hole 105 is provided on the bottom wall 25 instead of the through hole 82. The storage hole 105 is an example of a fourth through hole. The storage hole 105 penetrates the bottom wall 25 and opens on the inner surface 25a and the outer surface 25b. In other words, the storage hole 105 connects the storage space S with the outside of the housing 11.

[0164] At least a portion of the photocoupler 100 is disposed inside the storage hole 105. In the present embodiment, the housing 102 of the photocoupler 100 is disposed inside the storage hole 105. In addition, the photocoupler 100 is not limited to this example. For example, the housing 102 may be located outside the storage hole 105, and the conductive component 101 may pass through the storage hole 105.

[0165] The cross-sectional area of ​​the storage hole 105 expands or narrows from the inner surface 25a toward the outer surface 25b. Therefore, the inner peripheral surface 105a of the storage hole 105 can support the housing 102. In addition, the storage hole 105 is not limited to this example.

[0166] The HDD 10 further includes a sealing material 108. The sealing material 108 is filled between the housing 102 and the inner peripheral surface 105a of the storage hole 105. Thus, the sealing material 108 seals the gap between the housing 102 and the inner peripheral surface 105a of the storage hole 105 in an airtight manner.

[0167] The conductive member 101 connected to the light source 56a and the conductive member 101 connected to the light receiving element 56b are electrically connected to the PWB 51. For example, the conductive member 101 is connected to an electrode provided on the PWB 51 by soldering.

[0168] The conductive member 101 connected to the light source 61a and the conductive member 101 connected to the light receiving element 61b are electrically connected to the FPC 19. For example, the conductive member 101 is connected to an electrode provided on the FPC 19 by soldering.

[0169] In the second embodiment, similar to the first embodiment, the preamplifier 62 of the storage space S and the controller 53 of the PCB 50 outside the housing 11 perform wireless communication through the light sources 56a, 61a and the light receiving elements 56b, 61b. The FPC 19 of the storage space S and the PCB 50 outside the housing 11 are electrically connected to a photocoupler 100. However, inside the photocoupler 100, the light source 56a and the light receiving element 56b of the wireless communication unit 56 are separated from the light source 61a and the light receiving element 61b of the wireless communication unit 61, and communication is performed using optical signals instead of electrical signals.

[0170] In the electronic device 1 of the second embodiment described above, the photocoupler 100 has a light source 61a and a light receiving element 61b, a light source 56a and a light receiving element 56b, and a housing 102. The housing 102 holds the light sources 56a, 61a and the light receiving elements 56b, 61b at mutually separated positions and covers the light sources 56a, 61a and the light receiving elements 56b, 61b. The housing 11 has a bottom wall 25 covering the storage space S, and is provided with a storage hole 105 penetrating the bottom wall 25. At least a portion of the photocoupler 100 is arranged in the storage hole 105. Thus, the preamplifier 62 and the PCB 50 can communicate through the photocoupler 100. Furthermore, the housing 102 covers the light source 61a and the light receiving element 61b and the light source 56a and the light receiving element 56b, so that noise can be suppressed from being mixed in the communication between the light source 61a and the light receiving element 61b and the light source 56a and the light receiving element 56b.

[0171] The preamplifier 62 and the PCB 50 communicate with each other via the photocoupler 100. The photocoupler 100 is a common component. Therefore, the HDD 10 can suppress an increase in cost.

[0172] (Third embodiment)

[0173] Below, refer to Figure 8 as well as Fig. 9 A third embodiment will be described. Figure 8 This is an exemplary cross-sectional view schematically showing a part of the HDD 10 according to the third embodiment. Fig. 9 1 is an exemplary block diagram showing the structure of the HDD 10 according to the third embodiment. Fig. 9 As shown, in the third embodiment, the wireless communication unit 56 is not mounted on the PWB 51 but is mounted on the electronic device 1 .

[0174] The electronic device 1 of the third embodiment includes an HDD 10, a wireless communication unit 56, an I / F connector 1a, and a processor 1b other than the HDD 10. Therefore, the electronic device 1 includes a light source 56a, a light receiving element 56b, and a conversion IC 56c. The processor 1b is an example of an external component in the third embodiment.

[0175] like Figure 8 As shown, the PWB 51 of the third embodiment is provided with an exposure opening 111 instead of the recess 51c. The exposure opening 111 is an example of a fifth through hole. The exposure opening 111 penetrates the PWB 51 and opens on the inner surface 51a and the outer surface 51b of the PWB 51.

[0176] In the direction along the outer surface 25b of the bottom wall 25, the plurality of through holes 82 are located inside the exposure opening 111. Therefore, the exposure opening 111 exposes a portion of the outer surface 25b, the plurality of through holes 82 opened on the outer surface 25b, and the plurality of sealing materials 91. In the third embodiment, the through hole 95c of the first light shielding sheet 95 is connected to the exposure opening 111.

[0177] The light source 56a, the light receiving element 56b and the conversion IC 56c of the third embodiment are mounted on, for example, a substrate 1c of the electronic device 1. The substrate 1c may be, for example, a motherboard of the electronic device 1 or a substrate of an expansion card mounted on the electronic device 1.

[0178] The light source 56a of the wireless communication unit 56 faces the light receiving element 61b of the wireless communication unit 61 via the exposure opening 111 and the sealing material 91 of the corresponding through hole 82. The light source 56a emits light L to the light receiving surface of the light receiving element 61b of the wireless communication unit 61 through the exposure opening 111 and the sealing material 91 of the corresponding through hole 82, for example.

[0179] The light receiving element 56b of the wireless communication unit 56 faces the light source 61a of the wireless communication unit 61 across the exposure opening 111 and the sealing material 91 of the corresponding through hole 82. The light receiving element 56b outputs an electrical signal corresponding to the light L emitted from the light source 61a and incident on the light receiving surface through the exposure opening 111 and the sealing material 91 of the corresponding through hole 82, for example.

[0180] Hereinafter, an example of the operation of the HDD 10 according to the third embodiment will be described. For example, in a write operation, Fig. 9 The processor 1 b of the electronic device 1 inputs the write signal to the conversion IC 56 c of the wireless communication unit 56 .

[0181] The conversion IC 56c converts the input write signal into a drive signal and outputs it to the light source 56a. The light source 56a emits the laser (light) L corresponding to the drive signal through the exposure port 111 and the sealing material 91 of the through hole 82 toward the light receiving element 61b of the wireless communication unit 61. In other words, the light source 56a of the wireless communication unit 56 generates light L corresponding to the electrical signal (write signal) of the information written by the magnetic head 15 to the magnetic disk 12 through the exposure port 111 toward the light receiving element 61b of the wireless communication unit 61.

[0182] When the light L is incident on the light receiving element 61b of the wireless communication unit 61, the light receiving element 61b outputs an output signal corresponding to the light L to the conversion IC 61c. The conversion IC 61c converts (restores) the output signal into a write signal and outputs it to the preamplifier 62. In this way, the light receiving element 61b of the wireless communication unit 61 generates an electrical signal (write signal) of information written to the magnetic disk 12 by the magnetic head 15, corresponding to the light L generated by the light source 56a of the wireless communication unit 56 and passing through the exposure port 111.

[0183] The preamplifier 62 amplifies the write signal and outputs the amplified write signal to the magnetic head 15 . The magnetic head 15 writes the write target data included in the write signal into the storage layer of the magnetic disk 12 .

[0184] On the other hand, in the read operation, when the magnetic head 15 reads the data of the read object, the preamplifier 62 amplifies the read signal corresponding to the read data and outputs it to the conversion IC 61c of the wireless communication unit 61. The conversion IC 61c converts the input read signal into a drive signal and outputs it to the light source 61a. The light source 61a emits a laser (light) L corresponding to the drive signal toward the light receiving element 56b of the wireless communication unit 56 through the exposed opening 111 and the sealing material 91 of the through hole 82. In other words, the light source 61a of the wireless communication unit 61 generates light L corresponding to the electrical signal (read signal) of the information read from the magnetic disk 12 by the magnetic head 15 toward the light receiving element 56b of the wireless communication unit 56 through the exposed opening 111.

[0185] When the light L is incident on the light receiving element 56b of the wireless communication unit 56, the light receiving element 56b outputs an output signal corresponding to the light L to the conversion IC 56c. The conversion IC 56c converts (restores) the output signal into a read signal and outputs it to the processor 1b. In this way, the light receiving element 56b of the wireless communication unit 56 generates an electrical signal (read signal) of the information read from the magnetic disk 12 by the magnetic head 15, corresponding to the light L generated by the light source 61a of the wireless communication unit 61 and passing through the exposure port 111.

[0186] The processor 1b demodulates the read signal to acquire the data read from the magnetic disk 12. In addition, a controller of the wireless communication unit 56 may be provided between the processor 1b and the wireless communication unit 56.

[0187] In the electronic device 1 of the third embodiment described above, the PWB 51 is mounted on the housing 11 outside the housing 11 and is electrically connected to the processor 1b. The housing 11 has a bottom wall 25 covering the storage space S. The PWB 51 has an inner surface 51a facing the bottom wall 25 and an outer surface 51b located on the opposite side of the inner surface 51a, and is provided with an exposure port 111 opened on the inner surface 51a and the outer surface 51b. The light source 61a and the light receiving element 61b perform at least one of the following actions: generating an electrical signal (read signal) corresponding to the light L generated by the light source 56a and passing through the exposure port 111; and generating light L toward the light receiving element 56b through the exposure port 111. Thus, it is possible to prevent the PWB 51 from blocking the light L used in the communication between the light source 61a and the light receiving element 61b and the light source 56a and the light receiving element 56b.

[0188] The electronic device 1 includes the HDD 10 , the light source 56 a , the light receiving element 56 b , and the processor 1 b . Thus, the electronic device 1 can communicate directly with the light source 61 a and the light receiving element 61 b ​​, for example, without passing through the PWB 51 of the HDD 10 .

[0189] (Fourth embodiment)

[0190] Below, refer to Figures 10 to 13 A fourth embodiment will be described. Fig.10 This is an exemplary perspective view showing an exploded view of a HDD 10 according to a fourth embodiment. Fig.11 This is an exemplary block diagram showing the configuration of a HDD 10 according to the fourth embodiment.

[0191] like Fig.10 As shown, the HDD 10 of the fourth embodiment omits the relay FPC 65 of the first embodiment. Fig.11 As shown, in the HDD 10 of the fourth embodiment, the FPC 19 is used instead of the relay FPC 65 to electrically connect the spindle motor 13 and the servo controller 54 .

[0192] Fig.12 This is an exemplary cross-sectional view schematically showing a part of the HDD 10 according to the fourth embodiment. Fig.13 This is an exemplary cross-sectional view schematically showing another part of the HDD 10 according to the fourth embodiment.

[0193] The FPC 19 of the fourth embodiment is branched into three strands, for example. Fig.12As shown, the FPC 19 of the fourth embodiment further includes a third end portion 121 and a fourth end portion 122 . The third end portion 121 is electrically connected to the spindle motor 13 .

[0194] In the bottom wall 25 of the fourth embodiment, an insertion hole 125 is provided instead of the insertion hole 81. The insertion hole 125 is an example of a third through hole. The insertion hole 125 penetrates the bottom wall 25 and opens on the inner surface 25a and the outer surface 25b. The insertion hole 125 is formed in a slit shape, for example. The insertion hole 125 is located near the spindle motor 13, for example, and is separated from the through hole 82. In addition, the position of the insertion hole 125 is not limited to this example.

[0195] The fourth end portion 122 of the FPC 19 is provided through the insertion hole 125. That is, a portion of the fourth end portion 122 passes through the insertion hole 125. The other portion of the fourth end portion 122 is located between the bottom wall 25 and the PWB 51 outside the housing 11.

[0196] The fourth end portion 122 has an inner surface 122a and an outer surface 122b. The inner surface 122a faces the outer surface 25b of the bottom wall 25. The inner surface 122a is fixed to the outer surface 25b by, for example, an adhesive. The outer surface 122b is located on the opposite side of the inner surface 122a. The outer surface 122b faces the inner surface 51a of the PWB 51 at a distance.

[0197] The HDD 10 of the fourth embodiment has connectors 127 and 128 instead of the relay connectors 55, 63, 71, and 72. The connector 127 is provided on the outer surface 122b of the fourth end portion 122. The connector 128 is provided on the inner surface 51a of the PWB 51. The connectors 127 and 128 are connected to each other. Thus, the FPC 19 is electrically connected to the PCB 50 through the connectors 127 and 128.

[0198] In the fourth embodiment, the FPC 19 is supplied with power from the PCB 50 via the connectors 127 and 128 . The spindle motor 13 is supplied with power from the PCB 50 via the FPC 19 and the connectors 127 and 128 .

[0199] The HDD 10 of the fourth embodiment further has Fig.12 The sealing material 131 and Fig.13 The power storage device 132 is an example of an internal power source. The sealing material 131 is an example of a second sealing material. The power storage device 132 is an example of an internal power source.

[0200] like Fig.12As shown, the sealing material 131 fills the gap between the fourth end 122 of the FPC 19 and the inner surface of the insertion hole 125. Thus, the sealing material 131 hermetically seals the insertion hole 125. Furthermore, the sealing material 131 may also bond the inner surface 122a of the fourth end 122 to the outer surface 25b of the bottom wall 25.

[0201] like Fig.13 As shown, the power storage device 132 is mounted on the FPC 19 in the storage space S. The power storage device 132 is located, for example, between the fourth end 122 and the first end 19a and the second end 19b. The position of the power storage device 132 is not limited to this example.

[0202] The power storage device 132 is, for example, a capacitor. Alternatively, the power storage device 132 may be another power source such as a secondary battery. The power storage device 132 is supplied with power from the PCB 50 via the FPC 19 and the connectors 127 and 128. The power storage device 132 stores the supplied power (charge).

[0203] The power storage device 132 supplies the stored power to at least one of the magnetic head 15, the light source 61a, and the preamplifier 62. For example, the power storage device 132 supplies power to the light source 61a. The power that the power storage device 132 can supply to the light source 61a is greater than the power that the PCB 50 can supply to the spindle motor 13.

[0204] The power storage device 132 may also determine whether to supply power to the light source 61a. For example, when the power used by the light source 61a exceeds the power supplied to the light source 61a through the FPC 19 and the connectors 127 and 128, the power storage device 132 may supply the stored power to the light source 61a.

[0205] The power storage device 132 may be omitted. In this case, the magnetic head 15 , the light source 61 a , and the preamplifier 62 are supplied with power from the PCB 50 via the FPC 19 and the connectors 127 , 128 .

[0206] In the electronic device 1 of the fourth embodiment described above, the spindle motor 13 is stored in the storage space S to rotate the magnetic disk 12. The FPC 19 is provided through the insertion hole 125 provided in the housing 11, and is electrically connected to the magnetic head 15, the light source 61a, the PCB 50, and the spindle motor 13, and supplies power from the PCB 50. The spindle motor 13 is supplied with power from the PCB 50 through the FPC 19. Thus, the HDD 10 of this embodiment can supply power to the magnetic head 15, the light source 61a, and the spindle motor 13 at the same time through the FPC 19. Therefore, the housing 11 does not need to separately provide, for example, a through hole for supplying power to the magnetic head 15 and the light source 61a, and another through hole for supplying power to the spindle motor 13, and can suppress gas leakage in the storage space S. Furthermore, the sealing material 131 seals the insertion hole 125. Thus, the HDD 10 can suppress gas leakage in the storage space S through the insertion hole 125. Furthermore, since the HDD 10 does not require the relay connectors 55 , 63 , 71 , and 72 , the space around the light source 61 a and the light receiving element 61 b ​​can be expanded, and the HDD 10 can be easily assembled. Thus, the manufacturing yield of the HDD 10 is improved.

[0207] The power storage device 132 is mounted on the FPC 19 in the storage space S, accumulates the power supplied from the PCB 50 through the FPC 19, and supplies the accumulated power to at least one of the magnetic head 15, the light source 61a, and the preamplifier 62. Thus, the power storage device 132 can supply power exceeding the power supplied from the PCB 50 through the FPC 19 to at least one of the magnetic head 15, the light source 61a, and the internal components. Therefore, even if the power used to operate the magnetic head 15, the light source 61a, and the preamplifier 62 is greater than the power used to operate the spindle motor 13, the magnetic head 15, the light source 61a, and the preamplifier 62 can be operated.

[0208] (Fifth embodiment)

[0209] Below, refer to Fig.14 A fifth embodiment will be described. Fig.14 1 is an exemplary cross-sectional view schematically showing a part of the HDD 10 according to the fifth embodiment. The fifth embodiment is a modified example of the fourth embodiment, and is substantially the same as the fourth embodiment except for the following description.

[0210] In the fifth embodiment, the second end 19 b can be omitted from the FPC 19 . The light source 61 a , the light receiving element 61 b ​​, and the conversion IC 61 c of the wireless communication unit 61 are mounted on the first end 19 a . Therefore, the light source 61 a and the light receiving element 61 b ​​rotate around the support shaft 31 together with the actuator block 35 .

[0211] In the fifth embodiment, the through hole 82 and the sealing material 91 are formed in a substantially arc shape extending around the support shaft 31. Therefore, the light source 61a and the light receiving element 61b face the corresponding through hole 82 and the sealing material 91 even when they rotate around the support shaft 31.

[0212] The light sources 56a and 61a of the fifth embodiment are, for example, LEDs. Therefore, the light L generated by the light sources 56a and 61a of the fifth embodiment is more easily diffused than the light L generated by the LD.

[0213] In the fifth embodiment, a plurality of recesses 51c are provided on the PWB 51. The light source 56a is located in one of the recesses 51c. The light receiving element 56b is located in another of the recesses 51c. Furthermore, a plurality of through holes 95c are provided on the first light shielding sheet 95. The through holes 95c are connected to the corresponding recesses 51c.

[0214] The light source 61a irradiates the light L to the light receiving element 56b through the sealing material 91 of the through hole 82. Since the light L generated by the light source 61a is diffused, it is easy to enter the light receiving surface of the light receiving element 56b even if the light source 61a rotates around the support shaft 31.

[0215] Light source 56a irradiates light L to light receiving element 61b through sealing material 91 of through hole 82. Light L generated by light source 56a is diffused, and thus easily enters the light receiving surface of light receiving element 61b even when light receiving element 61b rotates around support shaft 31.

[0216] The recessed portion 51c where the light source 56a is located is separated from the recessed portion 51c where the light receiving element 56b is located. Therefore, the recessed portion 51c can suppress the light L emitted from the light source 56a from being incident on the light receiving element 56b.

[0217] In the electronic device 1 of the fifth embodiment described above, the light source 61a and the light receiving element 61b are mounted on the portion of the FPC 19 that is mounted on the actuator assembly 16 that rotates around the support shaft 31. Thus, the HDD 10 can shorten the FPC 19.

[0218] In the above embodiment, the wireless communication units 56 and 61 use light L for wireless communication. However, the wireless communication units 56 and 61 are not limited to this example, and may use a magnetic field or an electric field for wireless communication. That is, the wireless communication unit 61 performs at least one of the following actions: generates an electrical signal corresponding to the light, magnetic field, or electric field generated by the wireless communication unit 56, which is the information written to the magnetic disk 12 by the magnetic head 15; and generates light, magnetic field, or electric field corresponding to the electrical signal of the information read from the magnetic disk 12 by the magnetic head 15 toward the wireless communication unit 56. In addition, the wireless communication unit 56 performs at least one of the following actions: generates an electrical signal corresponding to the light, magnetic field, or electric field generated by the wireless communication unit 61; and generates light, magnetic field, or electric field corresponding to the electrical signal of the information written to the magnetic disk 12 by the magnetic head 15 toward the wireless communication unit 61.

[0219] The wireless communication units 56 and 61, as so-called digital isolators, perform wireless communication between the PCB 50 or the processor 1b outside the housing 11 and the preamplifier 62 in the storage space S. Regardless of whether the wireless communication units 56 and 61 use light, magnetic field, or electric field, the HDD 10 can communicate between the inside and outside of the housing 11 without passing through the relay connectors 71 and 72. As a result, the HDD 10, for example, does not need to provide pins (terminals) for communication of write signals and read signals in the relay connectors 71 and 72. Therefore, the HDD 10, for example, can miniaturize or omit the relay substrate 75 and the relay connectors 71 and 72, thereby suppressing gas leakage in the storage space S. Furthermore, the HDD 10 can suppress a decrease in positioning accuracy between components and an increase in design costs.

[0220] Furthermore, in the above embodiment, the FPC 19 disposed inside the housing 11 is supplied with electric power by wire through the wired connection portion 70. However, the FPC 19 may be supplied with electric power by wireless power supply.

[0221] Furthermore, in the above embodiment, the wireless communication units 56 and 61 perform bidirectional wireless communication. However, the wireless communication units 56 and 61 may also perform unidirectional wireless communication. For example, the wireless communication unit 61 may omit the light receiving element 61b, and the wireless communication unit 56 may omit the light source 56a, thereby performing unidirectional wireless communication from the wireless communication unit 61 to the wireless communication unit 56, and the HDD 10 may be used as a storage device dedicated to readout.

[0222] According to at least one embodiment described above, the disk device includes a housing, a disk-shaped recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing is provided with a storage space inside. The recording medium is stored in the storage space and has a recording layer. The magnetic head is stored in the storage space and is configured to read and write information relative to the recording medium. The internal wireless communication device performs at least one of the following actions: an electrical signal of information written to the recording medium by the magnetic head corresponding to light, magnetic field, or electric field generated by an external wireless communication device; and light, magnetic field, or electric field corresponding to the electrical signal of information read from the recording medium by the magnetic head is generated toward the external wireless communication device. The internal component is stored in the storage space, electrically connected to the magnetic head, and communicates with an external component outside the housing through the internal wireless communication device and the external wireless communication device. For example, in order to transmit and receive write signals and read signals between the internal component and the external component, a relay substrate that carries a connector and blocks the through hole of the housing is sometimes provided in the disk device. The relay substrate and the connector may be enlarged as the capacity of the write signal and the read signal increases. When the relay substrate becomes larger, there may be leakage of gas in the storage space through the pores of the relay substrate, the bonding portion between the housing and the relay substrate, a decrease in the positioning accuracy between components including the connector, and an increase in the design cost for newly designing a large substrate and connector. On the other hand, the disk device of this embodiment is a device that communicates write signals and read signals between internal components and external components via light, a magnetic field, or an electric field. As a result, the disk device, for example, does not need to be provided with a connector (pin) for communicating write signals and read signals. Therefore, the disk device, for example, can suppress gas leakage in the storage space. Furthermore, the disk device can suppress a decrease in positioning accuracy between components and an increase in design costs.

[0223] In the above description, inhibition is defined as, for example, preventing a phenomenon, action, or influence from occurring, or reducing the extent of a phenomenon, action, or influence. In addition, in the above description, restriction is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a specified range and preventing movement or rotation beyond the specified range.

[0224] Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their variations are included in the scope and purpose of the invention, and are included in the invention described in the scope of the patent claim and the scope equivalent thereto.

Claims

1. A disc device, comprising: A housing having a storage space therein; A disc-shaped recording medium stored in the storage space and having a recording layer; A magnetic head stored in the storage space and configured to read and write information with respect to the recording medium; An internal wireless communication device that performs at least one of the following operations: generating an electrical signal of information written by the magnetic head to the recording medium corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and generating light, a magnetic field, or an electric field corresponding to the electrical signal of information read by the magnetic head from the recording medium toward the external wireless communication device; Internal components stored in the storage space, electrically connected to the magnetic head, and communicating with external components outside the housing through the internal wireless communication device and the external wireless communication device; The external wireless communication device located outside the housing and performing at least one of the following operations: generating an electrical signal corresponding to light, a magnetic field, or an electric field generated by the internal wireless communication device; and generating light, a magnetic field, or an electric field corresponding to the electrical signal of information written by the magnetic head to the recording medium toward the internal wireless communication device; and The external component mounted on the housing outside the housing and having a first substrate on which the external wireless communication device is mounted, and communicating with the internal components through the internal wireless communication device and the external wireless communication device, The housing has a first wall covering the storage space and is provided with a first through hole penetrating the first wall, The internal wireless communication device performs at least one of the following operations: generating an electrical signal corresponding to light irradiated through the first through hole from the external wireless communication device; and irradiating light through the first through hole toward the external wireless communication device.

2. The disc device according to claim 1, further comprising: A light shielding member located between the first substrate and the housing, surrounding the external wireless communication device, and blocking light.

3. The disc device according to claim 1, wherein The housing has a transparent or translucent first sealing material that seals the first through hole, The internal wireless communication device performs at least one of the following operations: generating an electrical signal corresponding to light irradiated through the first sealing material from the external wireless communication device; and irradiating light through the first sealing material toward the external wireless communication device.

4. The disc device according to claim 1, further comprising: A motor stored in the storage space and rotating the recording medium; A flexible printed wiring board provided through a third through hole provided in the housing, electrically connected to the magnetic head, the internal wireless communication device, the external component, and the motor, and supplying power from the external component; and A second sealing material that seals the third through hole, The motor is supplied with power from the external component through the flexible printed wiring board.

5. The disc device according to claim 1, further comprising: Internal power supply, which is installed on a flexible printed wiring board in the above storage space, accumulates the power supplied from the above external component through the above flexible printed wiring board, and supplies the accumulated power to at least one of the above magnetic head, the above internal wireless communication device, and the above internal component.

Images