Circuit board packaging structure and manufacturing method thereof

Abstract

A circuit board packaging structure includes a packaging substrate, which comprises an inner circuit board, a first outer circuit board, and a second outer circuit board that are electrically connected. A first opening is provided through the first outer circuit board, and a second opening is provided through the second outer circuit board. A first circuit board is disposed within the first opening, and a second circuit board is disposed within the second opening. A third circuit board is disposed on the surface of the first outer circuit board, and a fourth circuit board is disposed on the surface of the second outer circuit board. All four circuit boards are electrically connected to the packaging substrate. The circuit board packaging structure provided by the present invention can embed more circuit boards and electronic components by forming at least three installation spaces on the packaging substrate, greatly improving the space utilization rate and reducing the size of the packaging structure. The present invention also provides a manufacturing method for the circuit board packaging structure.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board packaging, and particularly to a circuit board packaging structure and a manufacturing method thereof. Background Art

[0002] With the performance upgrade and multi-functionalization of electronic devices (such as adding camera mounting positions), the installation area of circuit boards in electronic devices is further compressed. Therefore, after circuit board packaging, it is necessary to meet both the requirements of being thin, light, short, and small, and the requirements of multi-functionalization.

[0003] However, most of the existing circuit board packaging structures are large in volume, low in wiring density, have a small number of installed electronic components, and low in space utilization rate, making it difficult to meet the above requirements. Summary of the Invention

[0004] In view of this, in order to overcome at least one of the above defects, it is necessary to provide a circuit board packaging structure.

[0005] It is also necessary to provide a method for manufacturing the above circuit board packaging structure.

[0006] The present invention provides a circuit board, including a packaging substrate, a first circuit board, a second circuit board, and a third circuit board. The packaging substrate includes an inner layer circuit board, at least one first outer layer circuit board, and at least one second outer layer circuit board that are electrically connected. The inner layer circuit board includes a substrate, a first inner layer circuit layer provided on one surface of the substrate, and a second inner layer circuit layer provided on the other surface of the substrate. At least one of the first outer layer circuit boards is provided on the surface of the first inner layer circuit layer, and at least one of the second outer layer circuit boards is provided on the surface of the second inner layer circuit layer. A first opening is provided through each of the first outer layer circuit boards, and a first opening and a second opening are provided through each of the second outer layer circuit boards. The first inner layer circuit layer is exposed through the first opening, and the second inner layer circuit layer is exposed through the second opening. The first circuit board is disposed in each of the first openings and is electrically connected to the first inner layer circuit layer. The second circuit board is disposed in each of the second openings and is electrically connected to the second inner layer circuit layer. The third circuit board is disposed on the outermost first outer layer circuit board and is electrically connected to the first outer layer circuit board. The fourth circuit board is disposed on the outermost second outer layer circuit board and is electrically connected to the second outer layer circuit board.

[0007] In an embodiment of the present application, an opening is provided in the inner circuit board. The opening is located between the first opening window and the second opening window and is in communication with the first opening window and the second opening window. The dimension of the opening along the extension direction of the circuit board is smaller than the dimensions of the first opening window and the second opening window. A first electronic component is provided on the first circuit board and / or the second circuit board, and the first electronic component is received in the opening.

[0008] In an embodiment of the present application, a second electronic component is provided on the third circuit board, and the second electronic component is received in the first opening window. A third electronic component is provided on the fourth circuit board, and the third electronic component is received in the second opening window.

[0009] In an embodiment of the present application, there are a plurality of the first opening windows, and the dimension of the plurality of the first opening windows along the extension direction of the circuit board increases in a direction away from the inner circuit board; and / or, there are a plurality of the second opening windows, and the dimension of the plurality of the second opening windows along the extension direction of the circuit board increases in a direction away from the inner circuit board.

[0010] In an embodiment of the present application, the package substrate further includes a plurality of through holes and a conductive layer provided on the inner wall of each through hole. Each through hole penetrates through the inner circuit board, all the first outer circuit boards, and all the second outer circuit boards, and the inner circuit board, the first outer circuit boards, and the second outer circuit boards are electrically connected through the conductive layer.

[0011] In an embodiment of the present application, a third insulating layer is provided in the through hole with the conductive layer.

[0012] In an embodiment of the present application, the plurality of through holes are arranged around the first opening window and the second opening window.

[0013] In an embodiment of the present application, the aperture of the through hole is 75 μm - 100 μm.

[0014] The present invention also provides a manufacturing method of a circuit board package structure, including the following steps:

[0015] Provided is a packaged substrate, including an inner circuit board, at least one first outer circuit board, and at least one second outer circuit board that are electrically connected. The inner circuit board includes a substrate, a first inner circuit layer disposed on one surface of the substrate, and a second inner circuit layer disposed on the other surface of the substrate. At least one of the first outer circuit boards is disposed on the surface of the first inner circuit layer, and at least one of the second outer circuit boards is disposed on the surface of the second inner circuit layer. A first opening is formed through each of the first outer circuit boards, and the first inner circuit layer is exposed through the first opening. A second opening is formed through each of the second outer circuit boards, and the second inner circuit layer is exposed through the second opening.

[0016] A first circuit board is disposed within each of the first openings, and the first circuit board is electrically connected to the first inner circuit layer.

[0017] A second circuit board is disposed within each of the second openings, and the second circuit board is electrically connected to the second inner circuit layer.

[0018] A third circuit board is disposed on the outermost first outer circuit board, and the third circuit board is electrically connected to the first outer circuit board.

[0019] And, a fourth circuit board is disposed on the outermost second outer circuit board, and the fourth circuit board is electrically connected to the second outer circuit board, obtaining the circuit board packaging structure.

[0020] In an embodiment of the present application, the method further includes:

[0021] An opening is formed on the inner circuit board, the opening is located between the first opening and the second opening and is in communication with the first opening and the second opening. Wherein, the dimension of the opening along the extending direction of the circuit board packaging structure is smaller than the dimensions of the first opening and the second opening. A first electronic component is disposed on the first circuit board and / or the second circuit board, and the first electronic component is received within the opening.

[0022] In an embodiment of the present application, the method further includes:

[0023] A plurality of through holes are formed in the packaged substrate, the plurality of through holes are disposed around the first opening and the second opening, and each of the through holes penetrates through the inner circuit board, the first outer circuit board, and the second outer circuit board.

[0024] A conductive layer is formed on the inner wall of each of the through holes, and the inner circuit board, the first outer circuit board, and the second outer circuit board are electrically connected through the conductive layer.

[0025] And, a third insulating layer is disposed within the via hole having the conductive layer.

[0026] Compared with the prior art, through the structural design of the packaging substrate, the present invention forms at least three circuit board mounting spaces, can stack more layers of circuit boards, and at the same time embed more electronic components. Without changing the total area of the packaging substrate, the wiring area of the packaging substrate is increased by more than 50%, greatly improving the space utilization rate of the overall circuit board packaging structure and facilitating the reduction of the size of the circuit board packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic cross-sectional view of a double-sided copper clad laminate provided by an embodiment of the present application.

[0028] Figure 2 It is Figure 1 A schematic cross-sectional view after forming a via hole on the double-sided copper clad laminate shown.

[0029] Figure 3 It is Figure 2 A schematic cross-sectional view after circuit production on the double-sided copper clad laminate shown.

[0030] Figure 4 It is Figure 3 A schematic cross-sectional view after fitting insulating films on both surfaces of the mounting area shown.

[0031] Figure 5 It is Figure 4 A schematic cross-sectional view after laminating a first single-sided copper clad laminate and a second single-sided copper clad laminate on the surfaces of the inner layer circuit board and the insulating film shown.

[0032] Figure 6 It is Figure 5 A schematic cross-sectional view after forming a via hole in the non-mounting area shown.

[0033] Figure 7 It is Figure 6 A schematic cross-sectional structure view after forming a conductive layer and a third insulating layer in the via hole shown.

[0034] Figure 8 It is Figure 7 A schematic cross-sectional structure view after circuit production on the third copper foil layer and the fourth copper foil layer shown to form a first outer layer circuit layer and a second outer layer circuit layer respectively.

[0035] Figure 9 It is Figure 8 A schematic cross-sectional structure view after forming a plurality of blind holes at the edge of the insulating film shown.

[0036] Figure 10 It is Figure 9 A schematic cross-sectional structure view after window opening at the insulating film shown.

[0037] Figure 11 To form a cross-sectional structure schematic diagram after forming an opening at the substrate corresponding to the window opening shown. Figure 10 The cross-sectional structure schematic diagram after forming an opening at the substrate corresponding to the window opening shown.

[0038] Figure 12 To form a cross-sectional structure schematic diagram after encapsulating the first circuit board and the second circuit board at the window opening shown. Figure 11 The cross-sectional structure schematic diagram after encapsulating the first circuit board and the second circuit board at the window opening shown.

[0039] Figure 13 To form a cross-sectional structure schematic diagram of a circuit board package structure after disposing a third circuit board and a fourth circuit board on the surfaces of the first outer-layer circuit board and the second outer-layer circuit board shown. Figure 12 The cross-sectional structure schematic diagram of a circuit board package structure after disposing a third circuit board and a fourth circuit board on the surfaces of the first outer-layer circuit board and the second outer-layer circuit board shown.

[0040] Figure 14 The cross-sectional structure schematic diagram of a circuit board package structure provided by another embodiment of the present application.

[0041] Main component symbol description

[0042]

[0043]

[0044] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific embodiments

[0045] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

[0047] Some embodiments of the present invention will be described in detail below with reference to the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0048] Please refer to Figures 1 to 9 , a manufacturing method of a circuit board according to an embodiment of the present invention, which includes the following steps:

[0049] Step S1, please refer to Figure 1, a double-sided copper clad laminate 1 is provided. The double-sided copper clad laminate 1 includes a substrate 11 and a first copper foil layer 12 and a second copper foil layer 13 disposed on opposite surfaces of the substrate 11. The double-sided copper clad laminate 1 includes an installation area A for installing electronic components and a non-installation area B located outside the installation area A.

[0050] In one embodiment, the material of the substrate 11 is an insulating resin. Specifically, the material of the substrate 11 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

[0051] Step S2, please refer to Figure 2 , a plurality of vias 14 are formed in the installation area A, and the first copper foil layer 12 and the second copper foil layer 13 are electrically connected through the vias 14.

[0052] Among them, the vias 14 can be formed by punching or laser drilling followed by electroplating a conductive metal.

[0053] Step S3, please refer to Figure 3 , circuit patterns are made on the first copper foil layer 12 and the second copper foil layer 13 to form a first inner layer circuit layer 15 and a second inner layer circuit layer 16 respectively, and an inner layer circuit board 10 is obtained.

[0054] In one embodiment, both the first inner layer circuit layer 15 and the second inner layer circuit layer 16 are made by the subtractive process. Specifically, the circuit layers can be obtained through processes such as laminating a film, exposure, development, etching, and stripping the film.

[0055] Step S4, please refer to Figure 4 , insulating films 17 are adhered to two surfaces of the inner layer circuit board 10 corresponding to the installation area A, and the insulating films 17 cover the first inner layer circuit layer 15 and the second inner layer circuit layer 16.

[0056] In one embodiment, the material of the insulating film 17 can be PI, and the thickness of the insulating film 17 is about 30 μm.

[0057] Step S5, please refer to Figure 5 , a first single-sided copper clad laminate 2 and a second single-sided copper clad laminate 3 are respectively laminated on two surfaces of the inner layer circuit board 10 corresponding to the non-installation area B and on two surfaces of the two insulating films 17 to obtain an intermediate 90.

[0058] In one embodiment, the first single-sided copper clad laminate 2 includes a first insulating layer 21 and a third copper plating layer 22 disposed on the surface of the first insulating layer 21. The second single-sided copper clad laminate 3 includes a second insulating layer 31 and a fourth copper plating layer 32 disposed on the surface of the second insulating layer 31.

[0059] Step S6, please refer to Figure 6 , a plurality of through holes 4 are formed in a portion of the intermediate body 90 corresponding to the non-mounting area B, and the through holes 4 penetrate through the first single-sided copper clad laminate 2, the inner layer circuit board 10, and the second single-sided copper clad laminate 3.

[0060] In one embodiment, the through holes 4 are formed by laser drilling.

[0061] In one embodiment, the aperture of the through holes 4 is 75μm - 100μm. For ordinary mechanical drilling, the minimum aperture is above 175μm, which greatly occupies the effective wiring area of the circuit board and is not conducive to improving the overall wiring density and space utilization rate of the circuit board. However, by laser drilling, the aperture of the through holes 4 can be greatly reduced, which is beneficial to improving the overall wiring density and space utilization rate of the circuit board.

[0062] Step S7, please refer to Figure 7 , a conductive layer 5 is formed on the inner wall of the through hole 4 and a third insulating layer 6 is formed in the through hole 4 in which the conductive layer 5 is formed.

[0063] In one embodiment, the material of the third insulating layer 6 can be an insulating resin. Specifically, the material of the third insulating layer 6 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

[0064] In one embodiment, the conductive layer 5 is formed on the inner wall of the through hole 4 by electroplating.

[0065] By filling the through hole 4 with an insulating resin, the overall strength of the circuit board can be enhanced, and at the same time, the thickness of the conductive layer 5 can be reduced.

[0066] In one embodiment, copper plating layers may further be formed at both ends of the third insulating layer 6 by electroplating. The copper plating layers are used for electrically connecting to the third circuit board 70 and the fourth circuit board 80 to be subsequently installed, facilitating the subsequent installation of the circuit boards.

[0067] In one embodiment, the through holes 4 are arranged around the installation area A. By distributing the through holes 4 around the installation area A, since the conductive layer 5 is provided in the through holes 4, on the one hand, the conductive layer 5 plays a role in electrical connection, and on the other hand, it can also play an electromagnetic shielding role for the functional electronic components to be subsequently installed in the installation area A.

[0068] Step S8, please refer to Figure 8 , perform circuit manufacturing on the third copper foil layer 22 and the fourth copper foil layer 32 to respectively form a first outer layer circuit layer 23 and a second outer layer circuit layer 33. Among them, the first inner layer circuit layer 15, the second inner layer circuit layer 16, the first outer layer circuit layer 23, and the second outer layer circuit layer 33 are electrically connected through the conductive layer 5.

[0069] Among them, the first insulating layer 21 and the first outer layer circuit layer 23 constitute the first outer layer circuit board 20, and the second insulating layer 31 and the second outer layer circuit layer 33 constitute the second outer layer circuit board 30.

[0070] In one embodiment, both the first outer layer circuit layer 23 and the second outer layer circuit layer 33 are obtained by a subtractive process. Specifically, the circuit layer can be obtained through processes such as laminating, exposure, development, etching, and stripping.

[0071] Step S9, please refer to Figure 9 And Figure 10 , a plurality of blind holes 7 are formed in the intermediate body 90. The plurality of blind holes 7 are arranged around the periphery of each insulating film 17, and penetrate through the first insulating layer 21 and the first outer layer circuit layer 23 above one insulating film 17, and penetrate through the second insulating layer 31 and the second outer layer circuit layer 33 above the other insulating film 17. Then, one insulating film 17 and the first insulating layer 21 and the first outer layer circuit layer 33 above the insulating film 17 are removed to form a first opening 8, and the cover is opened to remove the other insulating film 17 and the second insulating layer 31 and the second outer layer circuit layer 33 above the insulating film 17 to form a second opening 9 (i.e., the cover opening step).

[0072] Among them, the first inner layer circuit layer 15 is exposed by the first opening 8, and the second inner layer circuit layer 16 is exposed by the second opening.

[0073] In one embodiment, the center distance of the blind holes 7 is less than 15 μm, and the cover is opened by UV laser, and the opening depth is approximately 1.0 mm.

[0074] Step S10, please refer to Figure 11, an opening 18 is formed on the substrate 11. The opening 18 is located between the first opening window 8 and the second opening window 9. The first opening window 8 and the second opening window 9 are communicated through the opening 18, and along the extending direction of the circuit board, the size of the opening 18 is smaller than the sizes of the first opening window 8 and the second opening window 9, obtaining the package substrate 40.

[0075] Step S11, please refer to Figure 12 , provide a first circuit board 50 and a second circuit board 60, dispose the first circuit board 50 in the first opening window 8, and the first circuit board 50 is electrically connected to the first inner layer circuit layer 15, dispose the second circuit board 60 in the second opening window 9, and the second circuit board 60 is electrically connected to the second inner layer circuit layer 16.

[0076] Wherein, a first electronic component 51 is installed on the first circuit board 50 or the second circuit board 60, and the first electronic component 51 is accommodated in the opening 18.

[0077] In an embodiment, the first electronic component 51 is installed on the first circuit board 50.

[0078] In an embodiment, both the first circuit board 50 and the second circuit board 60 can be main logic boards (MLD).

[0079] Step S12, please refer to Figure 13 , provide a third circuit board 70 and a fourth circuit board 80, dispose the third circuit board 70 on the surface of the first outer layer circuit layer 23, and the third circuit board 70 is electrically connected to the first outer layer circuit layer 23, dispose the fourth circuit board 80 on the surface of the second outer layer circuit layer 33, and the fourth circuit board 80 is electrically connected to the second outer layer circuit layer 33, obtaining the circuit board packaging structure 100.

[0080] Wherein, the third circuit board 70 covers the first opening window 8, a second electronic component 71 is installed on the third circuit board 70, and the second electronic component 71 is accommodated in the first opening window 8.

[0081] The fourth circuit board 80 covers the second opening window 9, a third electronic component 81 is installed on the fourth circuit board 80, and the third electronic component 81 is accommodated in the second opening window 9.

[0082] In an embodiment, the third circuit board 70 can be a radio frequency (RF) board, and the fourth circuit board 80 can be an MLD board.

[0083] It can be understood that, based on the manufacturing method of the circuit board packaging structure 100 provided in the above embodiments of the present application, by increasing the number of stacked first outer circuit boards 20, a plurality of first openings 8 can be designed on one side of the substrate 11, and the dimensions of the plurality of first openings 8 in the circuit board extending direction gradually increase in the direction away from the substrate 11. That is, through the design of the dimensions of the plurality of first openings 8, the multilayer first outer circuit boards 20 can form a multilayer stepped structure. Similarly, by the above method of increasing the stacked second outer circuit boards 30, a plurality of second openings 9 can be prepared, so that the multilayer second outer circuit boards 30 form a stepped structure through the structural design of the second openings 9. Through the above structural design, the number of inner buried circuit boards and electronic components can be increased, and the density of functional circuit boards and functional electronic components in the circuit board packaging structure can be improved.

[0084] The manufacturing method of the circuit board packaging structure provided by the present invention can stack more circuit boards and bury more electronic components by forming at least three installation spaces on the packaging substrate 40. Without changing the total area of the packaging substrate 40, the wiring area of the packaging substrate 40 is increased by more than 50%, greatly improving the overall space utilization rate of the circuit board, which is beneficial to reducing the size of the circuit board and making it develop towards thin, light, short and small.

[0085] Please refer to Figure 13 , an embodiment of the present application further provides a circuit board packaging structure 100, which includes a packaging substrate 40, a first circuit board 50, a second circuit board 60, a third circuit board 70, and a fourth circuit board 80. The packaging substrate 40 includes an inner layer circuit board 10, at least one first outer layer circuit board 20, and at least one second outer layer circuit board 30 that are electrically connected. The inner layer circuit board 10 includes a substrate 11 and a first inner layer circuit layer 15 and a second inner layer circuit layer 16 provided on opposite surfaces of the substrate 11. At least one of the first outer layer circuit boards 20 is provided on the surface of the first inner layer circuit layer 15, and at least one of the second outer layer circuit boards 30 is provided on the surface of the second inner layer circuit layer 16. A first opening 8 is provided through each of the first outer layer circuit boards 20, and a second opening 9 is provided through each of the second outer layer circuit boards 30. The first circuit board 50 is disposed in each of the first openings 8, the second circuit board 60 is disposed in each of the second openings 9, the third circuit board 70 is disposed on the outermost first outer layer circuit board 20, and the fourth circuit board 80 is disposed on the surface of the outermost second outer layer circuit board 30. The first circuit board 50, the second circuit board 60, the third circuit board 70, and the fourth circuit board 80 are all electrically connected to the packaging substrate 40.

[0086] The inner circuit board 10 further includes a plurality of vias 14 which penetrate through the substrate 11 and are electrically connected to the first inner circuit layer 15 and the second inner circuit layer 16.

[0087] In one embodiment, the via 14 is located between the first opening 8 and the second opening 9, facilitating the electrical connection between the first circuit board 50 and the second circuit board 60 and the inner circuit board 10.

[0088] The first outer circuit board 20 includes a first insulating layer 21 and a first outer circuit layer 23 formed on the first insulating layer 21, wherein the first insulating layer 21 covers the first inner circuit layer 15 and the area of the substrate 11 except the first inner circuit layer 15.

[0089] The second outer circuit board 30 includes a second insulating layer 31 and a second outer circuit layer 33 formed on the second insulating layer 31, wherein the second insulating layer 31 covers the second inner circuit layer 16 and the area of the substrate 11 except the second inner circuit layer 16.

[0090] The circuit board package structure 100 further includes an opening 18 provided in the inner circuit board 10. The opening 18 is located between the first opening 8 and the second opening 9 and communicates with the first opening 8 and the second opening 9. A first electronic component 51 is provided on the first circuit board 50 and / or the second circuit board 60, and the first electronic component 51 is received in the opening 18.

[0091] In one embodiment, the first electronic component 51 is provided on the first circuit board 50.

[0092] A second electronic component 71 is provided on the third circuit board 70, and the second electronic component 71 is received in the first opening 8.

[0093] A third electronic component 81 is provided on the fourth circuit board 80, and the third electronic component 81 is received in the second opening 9.

[0094] In one embodiment, there is one first opening 8 and one second opening 9. Therefore, the circuit board package structure 100 has at least three installation spaces, namely the first opening 8, the second opening 9 and the opening 18, capable of installing a first circuit board 50, a second circuit board 60, a third circuit board 70 and a fourth circuit board 80.

[0095] Please refer to Figure 14, in other embodiments, there may also be multiple first openings 8, and the dimension of the multiple first openings 8 along the extending direction of the circuit board packaging structure 200 increases in the direction away from the substrate 11; similarly, there may also be multiple second openings 9, and the dimension of the multiple second openings 9 along the extending direction of the circuit board packaging structure 200 increases in the direction away from the substrate 11. That is to say, the multi-layer first outer circuit boards 20 form a multi-layer stepped structure corresponding to the installation area A, and the multi-layer second outer circuit boards 30 can also form a multi-layer stepped structure corresponding to the installation area A, thereby increasing the number of buried functional circuit boards and electronic components, thus improving the overall wiring density of the circuit board packaging structure and being conducive to reducing the size of the circuit board packaging structure.

[0096] In one embodiment, the packaging substrate 40 further forms a plurality of through holes 4 at the non-installation area B and a conductive layer 5 disposed on the inner wall of the through hole 4. Each through hole 4 penetrates through the inner circuit board 10, all the first outer circuit boards 20, and all the second outer circuit boards 30, and the inner circuit board 10, all the first outer circuit boards 20, and all the second outer circuit boards 30 are electrically connected through the conductive layer 5.

[0097] In one embodiment, a third insulating layer 6 is provided in the through hole 4 formed with the conductive layer 5.

[0098] In one embodiment, the plurality of through holes 4 are arranged around the first opening 8 and the second opening 9, that is, the plurality of through holes 4 are located around the installation area A. At this time, the conductive layer 5 in the through hole 4 can, on the one hand, play a role in electrical connection, and on the other hand, can also play an electromagnetic shielding role for the functional circuit boards and electronic components in the installation area A.

[0099] In one embodiment, the aperture of the through hole is 75μm - 100μm. The minimum aperture of ordinary mechanical drilling is more than 175μm, which greatly occupies the effective wiring area of the circuit board and is not conducive to improving the overall wiring density and space utilization rate of the circuit board. By laser drilling, the aperture of the through hole can be greatly reduced, which is conducive to improving the overall wiring density and space utilization rate of the circuit board.

[0100] Compared with the prior art, the present invention designs the structure of the packaging substrate 40 to form at least three installation spaces, namely the first opening 8, the second opening 9, and the opening 18, and buries the circuit boards of electronic components with different functions into the packaging substrate 40, thereby making full use of the space of the packaging substrate 40, being able to stack more layers of circuit boards, and at the same time burying more electronic components. Without changing the total area of the packaging substrate, the wiring functional area of the packaging substrate is increased by more than 50%, greatly improving the space utilization rate of the overall circuit board packaging structure and being conducive to reducing the size of the circuit board packaging structure.

Claims

1. A circuit board packaging structure, characterized in that Comprising: A packaged substrate, including an electrically connected inner circuit board, at least one first outer circuit board, and at least one second outer circuit board. The inner circuit board includes a substrate, a first inner circuit layer disposed on one surface of the substrate, and a second inner circuit layer disposed on the other surface of the substrate. At least one of the first outer circuit boards is disposed on the surface of the first inner circuit layer, and at least one of the second outer circuit boards is disposed on the surface of the second inner circuit layer. A first opening is provided through each of the first outer circuit boards, and the first inner circuit layer is exposed through the first opening. A second opening is provided through each of the second outer circuit boards, and the second inner circuit layer is exposed through the second opening; A first circuit board disposed within each of the first openings and electrically connected to the first inner circuit layer; A second circuit board disposed within each of the second openings and electrically connected to the second inner circuit layer; A third circuit board disposed on the outermost first outer circuit board and electrically connected to the first outer circuit board. A second electronic component is provided on the third circuit board, and the second electronic component is received within the first opening; And A fourth circuit board disposed on the outermost second outer circuit board and electrically connected to the second outer circuit board. A third electronic component is provided on the fourth circuit board, and the third electronic component is received within the second opening. An opening is provided in the inner circuit board. The opening is located between the first opening and the second opening and is in communication with the first opening and the second opening. The dimension of the opening along the extending direction of the circuit board packaging structure is smaller than the dimensions of the first opening and the second opening. A first electronic component is provided on the first circuit board and / or the second circuit board, and the first electronic component is received within the opening.

2. The circuit board packaging structure according to claim 1, characterized in that, The first opening is plural, and the dimension of the plural first openings along the extending direction of the circuit board increases in a direction away from the inner circuit board; and / or The second opening is plural, and the dimension of the plural second openings along the extending direction of the circuit board increases in a direction away from the inner circuit board.

3. The circuit board packaging structure according to claim 1, wherein, The packaged substrate further includes a plurality of through holes and a conductive layer disposed on the inner wall of the through holes. Each of the through holes penetrates through the inner circuit board, all the first outer circuit boards, and all the second outer circuit boards, and the inner circuit board, the first outer circuit boards, and the second outer circuit boards are electrically connected through the conductive layer.

4. The circuit board packaging structure according to claim 3, wherein A third insulating layer is provided within the through hole with the conductive layer.

5. The circuit board packaging structure according to claim 3, characterized in that The plurality of through holes are disposed around the first opening and the second opening.

6. The circuit board packaging structure according to claim 3, characterized in that, The aperture of the through hole is 75μm - 100μm.

7. A manufacturing method of a circuit board packaging structure, characterized in that, Including the following steps: Provided is a packaging substrate, comprising an inner circuit board, at least one first outer circuit board and at least one second outer circuit board which are electrically connected. The inner circuit board includes a substrate, a first inner circuit layer disposed on one surface of the substrate, and a second inner circuit layer disposed on the other surface of the substrate. At least one of the first outer circuit boards is disposed on the surface of the first inner circuit layer, and at least one of the second outer circuit boards is disposed on the surface of the second inner circuit layer. A first opening is formed through each of the first outer circuit boards, and the first inner circuit layer is exposed through the first opening. A second opening is formed through each of the second outer circuit boards, and the second inner circuit layer is exposed through the second opening; An opening is formed in the inner circuit board, the opening is located between the first opening and the second opening and is communicated with the first opening and the second opening, and the dimension of the opening along the extending direction of the circuit board packaging structure is smaller than the dimensions of the first opening and the second opening; A first circuit board is disposed in each of the first openings, and the first circuit board is electrically connected to the first inner circuit layer; A second circuit board is disposed in each of the second openings, and the second circuit board is electrically connected to the second inner circuit layer. Wherein, a first electronic component is disposed on the first circuit board and / or the second circuit board, and the first electronic component is received in the opening; A third circuit board is disposed on the outermost first outer circuit board, the third circuit board is electrically connected to the first outer circuit board, and a second electronic component is disposed on the third circuit board, and the second electronic component is received in the first opening; and A fourth circuit board is disposed on the outermost second outer circuit board, the fourth circuit board is electrically connected to the second outer circuit board, and a third electronic component is disposed on the fourth circuit board, and the third electronic component is received in the second opening, thereby obtaining the circuit board packaging structure.

8. The manufacturing method of the circuit board packaging structure according to claim 7, characterized in that, The method further includes: A plurality of through holes are formed in the packaging substrate, the plurality of through holes are arranged around the first opening and the second opening, and each of the through holes penetrates through the inner circuit board, the first outer circuit board and the second outer circuit board; A conductive layer is formed on the inner wall of each of the through holes, and the inner circuit board, the first outer circuit board and the second outer circuit board are electrically connected through the conductive layer; and A third insulating layer is disposed in the through holes with the conductive layer.

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