Substrate processing apparatus and piping attachment / detachment fitting cleaning method

Abstract

A substrate processing apparatus and a piping attachment / detachment fitting cleaning method are provided. A substrate processing apparatus (100) includes a substrate processing unit (10) for processing a substrate (W), a piping (32) for circulating a processing liquid to the substrate processing unit (10), a piping attachment / detachment fitting (140) attachable to and detachable from the piping (32), an upstream-side connection portion (152) and a downstream-side connection portion (154) provided in the piping (32) upstream and downstream of the piping attachment / detachment fitting (140), respectively, and a cleaning unit (160) connectable to the upstream-side connection portion (152) and the downstream-side connection portion (154). The cleaning unit (160) supplies a chemical liquid to the piping attachment / detachment fitting (140) from the upstream-side connection portion (152) and recovers the chemical liquid from the downstream-side connection portion (154). The cleaning unit (160) supplies a cleaning liquid to the piping attachment / detachment fitting from the upstream-side connection portion (152) and recovers the cleaning liquid from the downstream-side connection portion (154).

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a method for cleaning piping and fittings. Background Technology

[0002] A substrate processing apparatus is known for processing substrates. This apparatus is suitable for manufacturing semiconductor substrates. Typically, the substrate processing apparatus uses a processing liquid such as a chemical solution to process the substrate.

[0003] The processing fluid flows through piping equipped with filters, valves, and flow meters to process the substrate. The filters are replaced periodically. It is known that, when replacing a filter, rinsing is performed after replacement to suppress the diffusion of particles from the newly installed filter into the entire device (Patent Document 1). Patent Document 1 describes a method where, after filter replacement, the filter and the tank connected to the circulation line are repeatedly filled with pure water and then drained, followed by rinsing with a chemical solution. In the filter cleaning method of Patent Document 1, after filter replacement, pure water and chemical solution are used to raise the liquid level in the tank storing the processing fluid connected to the filter, thereby filling the liquid to the top of the filter's interior and suppressing the diffusion of particles from the filter into the entire liquid processing device.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-103662 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in the filter cleaning method of Patent Document 1, after replacing the filter, the filter and the tank connected to the circulation line are filled with pure water and chemical solution, which requires a large amount of pure water and chemical solution.

[0009] The present invention addresses the aforementioned issues and aims to provide a substrate processing apparatus and a method for cleaning piping fittings that can effectively suppress the diffusion of particles after replacing piping fittings that are removable from the piping.

[0010] Solution for solving the problem

[0011] According to one aspect of the present invention, a substrate processing apparatus includes: a substrate processing unit for processing a substrate; a piping for allowing a processing liquid to flow to the substrate processing unit; a piping attachment / removal fitting for attaching and detaching from the piping; an upstream connection portion disposed in the piping upstream of the piping attachment / removal fitting; a downstream connection portion disposed in the piping downstream of the piping attachment / removal fitting; and a cleaning unit capable of being connected to both the upstream and downstream connections. The cleaning unit supplies a processing liquid to the piping attachment / removal fitting from one of the upstream and downstream connections and recovers the processing liquid from the other of the upstream and downstream connections. Furthermore, it supplies cleaning liquid to the piping attachment / removal fitting from one of the upstream and downstream connections and recovers the cleaning liquid from the other of the upstream and downstream connections.

[0012] In one embodiment, the aforementioned piping fittings include at least one of a filter and a valve.

[0013] In one embodiment, the upstream connection and the downstream connection include a three-way valve or a toggle valve.

[0014] In one embodiment, the cleaning unit supplies the chemical solution to the piping fitting from the upstream connection and recovers the chemical solution from the downstream connection. Furthermore, it supplies the cleaning fluid to the piping fitting from the upstream connection and recovers the cleaning fluid from the downstream connection.

[0015] In one embodiment, the cleaning unit supplies a first chemical solution to the piping fitting from one of the upstream connection and the downstream connection, and recovers the first chemical solution from the other of the upstream connection and the downstream connection. Furthermore, it supplies a second chemical solution to the piping fitting from one of the upstream connection and the downstream connection, and recovers the second chemical solution from the other of the upstream connection and the downstream connection.

[0016] In one embodiment, the cleaning unit includes additional piping connected to the upstream connection and the downstream connection.

[0017] In one embodiment, the cleaning unit further includes: a drug supply unit that supplies the drug to the additional piping; a cleaning fluid supply unit that supplies the cleaning fluid to the additional piping; and a pump disposed on the additional piping.

[0018] In one embodiment, the cleaning unit further includes a tank capable of storing the aforementioned medicinal solution and the aforementioned cleaning solution.

[0019] In one embodiment, the cleaning unit can be disconnected from both the upstream connection and the downstream connection.

[0020] In one embodiment, the treatment fluid flows through the additional piping.

[0021] In one embodiment, the piping includes: a drug solution piping for drug solution flow; and a cleaning solution piping for cleaning solution flow, wherein the upstream connection is located upstream of the cleaning solution piping, the downstream connection is located downstream of the cleaning solution piping, and the additional piping has a connection that connects the drug solution piping and one of the upstream connection and the downstream connection.

[0022] In one embodiment, a storage unit is further provided, which stores a formula for controlling the cleaning unit to clean the piping fittings using the cleaning fluid and the chemical solution.

[0023] In one embodiment, the storage unit stores different formulas depending on the different piping fittings.

[0024] According to another aspect of the present invention, a method for cleaning a piping fitting includes the following steps: replacing a piping fitting that is detachable from the piping through which the treatment fluid flows; after replacing the piping fitting, supplying a chemical solution to the piping fitting from one of an upstream connection and a downstream connection, and recovering the chemical solution from the other of the upstream and downstream connections; and after replacing the piping fitting, supplying a cleaning fluid to the piping fitting from one of the upstream and downstream connections, and recovering the cleaning fluid from the other of the upstream and downstream connections.

[0025] In one embodiment, the above-mentioned cleaning method for piping fittings further includes the following steps:

[0026] Before replacing the aforementioned piping fittings, cleaning fluid is supplied from one of the aforementioned upstream connection and the aforementioned downstream connection, and the cleaning fluid is recovered from the other of the aforementioned upstream connection and the aforementioned downstream connection.

[0027] Invention Effects

[0028] According to the present invention, the diffusion of particles after replacing fittings that are removable from the piping can be effectively suppressed. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0030] Figure 2 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of this embodiment.

[0031] Figure 3 This is a schematic diagram illustrating the piping structure in the substrate processing apparatus of this embodiment.

[0032] Figure 4 This is a block diagram of the substrate processing apparatus of this embodiment.

[0033] Figure 5 (a) to (c) are schematic diagrams used to illustrate the cleaning method for piping fittings in this embodiment.

[0034] Figure 6 (a) to (c) are schematic diagrams used to illustrate the cleaning method for piping fittings in this embodiment.

[0035] Figure 7 This is a flowchart of the cleaning method for piping fittings in this embodiment.

[0036] Figure 8 (a) to (c) are schematic diagrams used to illustrate the cleaning method for piping fittings in this embodiment.

[0037] Figure 9 This is a flowchart of the cleaning method for piping fittings in this embodiment.

[0038] Figure 10 (a) to (c) are schematic diagrams illustrating the cleaning method for the piping and fittings of the substrate processing apparatus installed in this embodiment.

[0039] Figure 11 This is a flowchart of the cleaning method for piping fittings in this embodiment.

[0040] Figure 12 This is a schematic diagram of the cleaning unit in the substrate processing apparatus of this embodiment.

[0041] Figure 13 This is a flowchart of the cleaning method for piping fittings in this embodiment.

[0042] Figure 14 This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0043] Figure 15 (a) and (b) are schematic diagrams used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0044] Figure 16This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0045] Figure 17 (a) and (b) are schematic diagrams used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0046] Figure 18 This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0047] Figure 19 This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0048] Figure 20 (a) and (b) are schematic diagrams used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0049] Figure 21 This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0050] In the picture:

[0051] 10—Substrate processing unit, 12—Cavity, 20—Substrate holding section, 30—Processing liquid supply section, 100—Substrate processing apparatus, 110—Processing liquid tank, 120—Processing liquid container, W—Substrate. Detailed Implementation

[0052] Hereinafter, embodiments of the substrate processing apparatus and the cleaning method for the piping and unloading fittings of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings, the same or equivalent parts are labeled with the same reference numerals and will not be described again. In addition, in this specification, for ease of understanding of the invention, mutually orthogonal X-axis, Y-axis, and Z-axis are sometimes described. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0053] First, refer to Figure 1 An embodiment of the substrate processing apparatus 100 of the present invention will be described. Figure 1 This is a schematic top view of the substrate processing apparatus 100 of this embodiment.

[0054] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by means of at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a portion of the film, and cleaning.

[0055] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is generally disk-shaped. Here, the substrate processing apparatus 100 processes the substrates W one by one.

[0056] like Figure 1 As shown, the substrate processing apparatus 100 includes multiple substrate processing units 10, a processing liquid tank 110, a processing liquid reservoir 120, multiple loading ports LP, an indexing robot IR, a central robot CR, and a control device 101. The control device 101 controls the loading ports LP, the indexing robot IR, and the central robot CR. The control device 101 includes a control unit 102 and a storage unit 104.

[0057] Multiple substrates W are stacked and accommodated at loading ports LP. A sorting robot IR transfers substrates W between loading ports LP and a central robot CR. The central robot CR transfers substrates W between the sorting robot IR and the substrate processing unit 10. The substrate processing unit 10 dispenses processing liquid into each substrate W to process it. The processing liquid includes chemical solutions, cleaning solutions, removal solutions, and / or water-resistant agents. A processing liquid tank 110 contains the processing liquid. Additionally, the processing liquid tank 110 can also contain gas.

[0058] Specifically, multiple substrate processing units 10 form multiple tower TWs arranged in a top-down manner around a central robot CR. Figure 1 The middle section consists of four towers (TW). Each tower (TW) includes multiple substrate processing units 10 stacked on top of each other. Figure 1 There are three substrate processing units 10 in the middle. The processing liquid tanks 120 correspond to multiple towers TW. The liquid in the processing liquid tank 110 is supplied to all the substrate processing units 10 in the tower TW corresponding to any one of the processing liquid tanks 120. In addition, the gas in the processing liquid tank 110 is supplied to all the substrate processing units 10 in the tower TW corresponding to any one of the processing liquid tanks 120.

[0059] In the substrate processing apparatus 100, a boundary wall BW is disposed between the area where the central robot CR and the substrate processing unit 10 are located and the area where the processing liquid tank 110 is located. The processing liquid tank 110 divides a portion of the space outside the boundary wall BW in the substrate processing apparatus 100.

[0060] Typically, the processing liquid tank 110 has a conditioning tank (reservoir) for conditioning the processing liquid. The processing liquid tank 110 may have a conditioning tank for one type of processing liquid or a conditioning tank for multiple types of processing liquids. In addition, the processing liquid tank 110 has a pump, nozzle, and / or filter for circulating the processing liquid.

[0061] Here, the processing liquid tank 110 has a first processing liquid tank 110A and a second processing liquid tank 110B. The first processing liquid tank 110A and the second processing liquid tank 110B are arranged opposite to each other.

[0062] The control device 101 controls various operations of the substrate processing device 100.

[0063] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 may have, for example, a central processing unit (CPU). Alternatively, the control unit 102 may also have a general-purpose arithmetic unit.

[0064] Storage unit 104 stores data and computer programs. The data includes formula data. The formula data includes information representing multiple formulas. Each formula specifies the processing content and steps for the substrate W.

[0065] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable medium. The control unit 102 executes the computer program stored in the storage unit 104, thereby performing board processing operations.

[0066] Next, refer to Figure 2 The substrate processing unit 10 in the substrate processing apparatus 100 of this embodiment will be described. Figure 2 This is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.

[0067] The substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30. The chamber 11 accommodates the substrate W. The substrate holding section 20 holds the substrate W.

[0068] The chamber 11 is generally box-shaped with an internal space. The chamber 11 houses the substrate W. Here, the substrate processing apparatus 100 is a monolithic type that processes substrates W one by one, and the substrates W are housed one by one in the chamber 11. The substrate W is housed in the chamber 11 and processed within the chamber 11. At least a portion of each of the substrate holding section 20 and the processing liquid supply section 30 is housed in the chamber 11.

[0069] The substrate holding portion 20 holds the substrate W. The substrate holding portion 20 holds the substrate W horizontally such that the upper surface (surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. Furthermore, the substrate holding portion 20 rotates the substrate W while holding it. For example, the upper surface Wa of the substrate W has a laminated structure with grooves formed therein. The substrate holding portion 20 rotates the substrate W while holding it.

[0070] For example, the substrate holding portion 20 may be a clamping type that holds the end of the substrate W. Alternatively, the substrate holding portion 20 may have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding portion 20 may also be a vacuum type. In this case, the substrate holding portion 20 holds the substrate W horizontally by adsorbing the central portion of the back surface Wb of the substrate W, which is a non-device forming surface, onto the upper surface. Alternatively, the substrate holding portion 20 may combine a clamping type and a vacuum type that causes multiple chuck pins to contact the peripheral end face of the substrate W.

[0071] For example, the substrate holding part 20 includes a rotating base 21, a chuck component 22, a shaft 23, an electric motor 24, and a housing 25. The chuck component 22 is disposed on the rotating base 21. The chuck component 22 holds the substrate W. Typically, multiple chuck components 22 are provided on the rotating base 21.

[0072] Shaft 23 is a hollow shaft. Shaft 23 extends vertically along the rotation axis Ax. A rotating base 21 is attached to the upper end of shaft 23. The substrate W is placed above the rotating base 21.

[0073] The rotating base 21 is disc-shaped and horizontally supports the substrate W. A shaft 23 extends downward from the center of the rotating base 21. An electric motor 24 imparts rotational force to the shaft 23. By rotating the shaft 23 in the rotational direction, the electric motor 24 causes the substrate W and the rotating base 21 to rotate around the rotation axis Ax. The housing 25 surrounds the shaft 23 and the electric motor 24.

[0074] The processing liquid supply unit 30 supplies processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is housed within the chamber 11.

[0075] The processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. The processing liquid may also include a chemical solution. The chemical solution contains hydrofluoric acid. For example, hydrofluoric acid can be heated to 40°C or higher and 70°C or lower, or to 50°C or higher and 60°C or lower. However, hydrofluoric acid may also not be heated. Additionally, the chemical solution may contain water or phosphoric acid.

[0076] Furthermore, the solution may also contain hydrogen peroxide. Additionally, the solution may contain SC1 (a mixture of ammonia and hydrogen peroxide), SC2 (a mixture of hydrochloric acid and hydrogen peroxide), or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0077] Alternatively, the treatment solution may also include so-called cleaning solutions (rinsing solutions). For example, the cleaning solution may also contain any of the following: deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid water at a dilution concentration (e.g., around 10 ppm to 100 ppm), or reduced water (hydrogen water).

[0078] The processing fluid supply unit 30 includes a piping 32, a nozzle 34, and a valve 36. The nozzle 34 dispenses processing fluid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the piping 32. Processing fluid is supplied to the piping 32 from a supply source. The valve 36 opens and closes the flow path within the piping 32. The nozzle 34 is preferably configured to be movable relative to the substrate W.

[0079] Valve 36 opens and closes the flow path within piping 32. Valve 36 regulates the opening degree of piping 32, thereby adjusting the flow rate of the treatment fluid supplied to piping 32. Specifically, valve 36 includes a valve body (not shown) with an internal valve seat, a valve core that opens and closes the valve seat, and an actuator (not shown) that moves the valve core between an open position and a closed position.

[0080] The nozzle 34 is also movable. The nozzle 34 can move horizontally and / or vertically via a moving mechanism controlled by the control unit 102. Furthermore, it should be noted that the moving mechanism has been omitted in this specification to avoid overly complex drawings.

[0081] The substrate processing unit 10 also includes a cup 80. The cup 80 collects the processing liquid that spills from the substrate W. The cup 80 moves up and down. For example, during the period when the processing liquid supply unit 30 supplies processing liquid to the substrate W, the cup 80 rises vertically upward to the side of the substrate W. In this case, the cup 80 collects the processing liquid that spills from the substrate W due to the rotation of the substrate W. In addition, when the period during which the processing liquid supply unit 30 supplies processing liquid to the substrate W ends, the cup 80 descends vertically downward from the side of the substrate W.

[0082] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30, and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36, and / or the cup 80.

[0083] The substrate processing apparatus 100 of this embodiment is suitable for fabricating semiconductor devices incorporating semiconductors. Typically, in a semiconductor device, a conductive layer and an insulating layer are stacked on a substrate. During the fabrication of a semiconductor device, the substrate processing apparatus 100 is suitable for cleaning and / or processing (e.g., etching, property modification, etc.) of the conductive layer and / or the insulating layer.

[0084] In addition, Figure 2In the substrate processing unit 10 shown, the processing liquid supply unit 30 can supply one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply unit 30 can also supply multiple types of processing liquids. For example, the processing liquid supply unit 30 can also sequentially supply multiple processing liquids with different uses to the substrate W. Alternatively, the processing liquid supply unit 30 can also simultaneously supply multiple processing liquids with different uses to the substrate W.

[0085] Next, refer to Figures 1-3 The piping structure of the substrate processing apparatus 100 of this embodiment will be described. Figure 3 This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus 100 of this embodiment. Furthermore, according to... Figure 1 and Figure 2 Understandably, the substrate processing apparatus 100 has multiple substrate processing units 10, and the substrate W is preferably obtained by processing with multiple processing liquids. However, to avoid overly complicated explanations, a scheme in which one processing liquid is supplied to one substrate processing unit 10 will be described here.

[0086] like Figure 3 As shown, the substrate processing apparatus 100 includes a modulation tank 112, a valve 113, a pump 114, a piping loading and unloading fitting 140, an upstream connection 152, a downstream connection 154, and a cleaning unit 160.

[0087] A conditioning tank 112 stores the processing solution. The processing solution is supplied to the substrate processing unit 10 to process the substrate W. Typically, the processing solution is a chemical solution. However, the processing solution can also be a cleaning solution. The processing solution is conditioning in the conditioning tank 112. Typically, the conditioning tank 112 is disposed within the processing solution tank 110.

[0088] Pipeline 32 connects modulation tank 112 and substrate processing unit 10. Pipeline 32 is equipped with valve 113, pump 114, piping loading and unloading fitting 140, upstream connection 152, downstream connection 154 and valve 36.

[0089] The processing liquid tank 110 has a housing 111. Typically, the housing 111 houses a conditioning tank 112, a valve 113, a pump 114, piping fittings 140, an upstream connection 152, and a downstream connection 154.

[0090] The processing fluid tank 120 has a housing 121. Typically, the valve 36 is housed in the housing 121.

[0091] Piping 32 extends from the processing liquid tank 110 through the processing liquid reservoir 120 to the substrate processing unit 10. After the processing liquid is prepared in the modulation tank 112, it flows from the modulation tank 112 to the substrate processing unit 10 through piping 32. For example, piping 32 is formed of resin.

[0092] Piping fitting 140 is installed on piping 32. Piping fitting 140 is detachable from piping 32. When piping fitting 140 is installed on piping 32, the treatment fluid flows within piping fitting 140. On the other hand, piping fitting 140 can be removed from piping 32. Therefore, when piping fitting 140 deteriorates, it is replaced.

[0093] The piping fitting 140 is formed of resin. Typically, the piping fitting 140 is formed by resin molding. In one example, the piping fitting 140 is made by cutting the resin molded material using a metal tool. Alternatively, the piping fitting 140 may also be formed of metal.

[0094] The piping connection fitting 140 can also be a valve. The valve can be a single valve or a multi-valve. In this case, the piping connection fitting 140 can be used to open and close the flow path within the piping 32. The piping connection fitting 140 adjusts the opening degree of the piping 32, thereby adjusting the flow rate of the treatment fluid supplied to the piping 32. Specifically, the valve 36 includes a valve body (not shown) with an internal valve seat, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0095] The piping fitting 140 can also be a filter. In this case, the piping fitting 140 filters the treatment fluid flowing within the piping 32.

[0096] The upstream connection 152 is located upstream of the piping 32 relative to the piping fitting 140. The upstream connection 152 has three openings. For example, the upstream connection 152 may include a three-way valve or a toggle valve. Alternatively, the upstream connection 152 may also include a three-way pipe and a valve.

[0097] The upstream connection 152 can switch the flow of liquid flowing through two of the three openings. For example, the upstream connection 152 can also switch the flow of liquid flowing through two of the three openings to the flow of liquid flowing through the other two openings. Alternatively, the upstream connection 152 can also cut off the flow of liquid flowing through two openings.

[0098] Typically, in piping 32, no other components are installed between the upstream connection 152 and the piping fitting 140. For example, the distance between the upstream connection 152 and the piping fitting 140 can be more than 1 cm and less than 100 cm, or it can be more than 5 cm and less than 50 cm.

[0099] The upstream connection 152 has two openings connected to the piping 32. One of the two openings of the upstream connection 152 is located upstream of the piping 32, and the other is located downstream of the piping 32. Additionally, the remaining opening of the upstream connection 152 is located at a point separate from the piping 32. This remaining opening of the upstream connection 152 can be connected to other piping outside the piping 32.

[0100] The downstream connection 154 is located downstream of the piping 32 relative to the piping fitting 140. The downstream connection 154 has three openings. Typically, the downstream connection 154 has the same structure as the upstream connection 152.

[0101] Typically, in piping 32, no other components are installed between piping fitting 140 and downstream connection 154. For example, the distance between piping fitting 140 and downstream connection 154 can be more than 1 cm and less than 100 cm, or it can be more than 5 cm and less than 50 cm.

[0102] The downstream connection 154 has two openings connected to the piping 32. One of the two openings of the downstream connection 154 is located upstream of the piping 32, and the other is located downstream of the piping 32. Additionally, the remaining opening of the downstream connection 154 is located at a point separate from the piping 32. This remaining opening of the downstream connection 154 can be connected to other piping outside the piping 32.

[0103] The substrate processing apparatus 100 of this embodiment includes a cleaning unit 160. The cleaning unit 160 cleans the piping and unloading fittings 140. The cleaning unit 160 is connected to the upstream connection portion 152 and the downstream connection portion 154, and cleans the piping and unloading fittings 140. In the substrate processing apparatus 100, the cleaning unit 160 can be configured to be movable. Alternatively, the cleaning unit 160 can also be provided within the substrate processing apparatus 100. For example, the cleaning unit 160 can also be provided within the processing liquid tank 110 and / or the processing liquid reservoir 120.

[0104] The cleaning unit 160 includes a chemical supply unit 162a, a cleaning fluid supply unit 162b, an additional piping 164, a valve 166a, and a pump 166b.

[0105] The solution supply unit 162a supplies the solution. The solution supplied from the solution supply unit 162a may be the same as or different from the processing solution supplied to the substrate W in the substrate processing unit 10.

[0106] The chemical solution supplied from the chemical supply unit 162a removes particles adhering to the piping fitting 140. For example, the chemical solution preferably removes resin components from the piping fitting 140.

[0107] In this case, alkaline or organic solutions are suitable as the solution. For example, ammonia, isopropyl alcohol (IPA), hydrogen peroxide, or ozone water can be used as the solution for removing resin particles.

[0108] Additionally, the solution supplied from the solution supply unit 162a can also remove metal particles from the piping fitting 140. For example, it is preferable to use the solution to remove metal particles that have adhered to the piping fitting 140 from the tooling used during its manufacture.

[0109] In this case, an acidic solution is suitable as the solution. For example, hydrochloric acid or hydrofluoric acid can also be used as a solution for removing metal components.

[0110] The cleaning solution supply unit 162b supplies cleaning solution. The cleaning solution supplied from the cleaning solution supply unit 162b may be the same as or different from the processing solution supplied to the substrate W in the substrate processing unit 10. The cleaning solution supply unit 162b contains deionized water (DIW).

[0111] The additional piping 164 includes a first piping 164a and a second piping 164b. One end of the first piping 164a can be connected to either the drug supply unit 162a or the cleaning solution supply unit 162b. The other end of the first piping 164a can be connected to either the upstream connection unit 152 or the downstream connection unit 154. One end of the second piping 164b can be connected to the other of the upstream connection unit 152 and the downstream connection unit 154. The other end of the second piping 164b is connected to a drain pipe.

[0112] Valve 166a is installed in additional piping 164. Specifically, valve 166a is installed in at least one of first piping 164a and second piping 164b. Valve 166a opens and closes the flow path within additional piping 164. Valve 166a regulates the opening degree of additional piping 164, adjusting the flow rate of the treatment fluid supplied in additional piping 164. Specifically, valve 166a includes a valve body (not shown) with an internal valve seat, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0113] Pump 166b is installed in the supplementary piping 164. Specifically, pump 166b is installed in at least one of the first piping 164a and the second piping 164b. Alternatively, pump 166b can be positioned upstream or downstream of valve 166a. Pump 166b delivers the treatment fluid from the supplementary piping 164.

[0114] Next, refer to Figures 1-4The substrate processing apparatus 100 of this embodiment will be described. Figure 4 This is a block diagram of the substrate processing apparatus 100.

[0115] like Figure 4 As shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexing robot IR, the central robot CR, the substrate holding unit 20, the processing fluid supply unit 30, the piping loading / unloading fitting 140, and the cleaning unit 160. Specifically, the control device 101 controls the indexing robot IR, the central robot CR, the substrate holding unit 20, the processing fluid supply unit 30, the piping loading / unloading fitting 140, and the cleaning unit 160 by sending control signals to them.

[0116] More specifically, the control unit 102 controls the indexing robot IR and uses the indexing robot IR to transfer the substrate W.

[0117] The control unit 102 controls the central robot CR, which handles the transfer of substrates W. For example, the central robot CR receives unprocessed substrates W and moves them into any one of the multiple substrate processing units 10. Alternatively, the central robot CR receives processed substrates W from the substrate processing unit 10 and moves them out.

[0118] The control unit 102 controls the substrate holding unit 20, controlling the start of rotation of the substrate W, the change of rotation speed, and the stop of rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 24 of the substrate holding unit 20.

[0119] When the piping fitting 140 is actuated, the control unit 102 controls the operation of the piping fitting 140. For example, the control unit 102 can control the piping fitting 140 to switch its operation. Specifically, when the piping fitting 140 is an actuated valve, the control unit 102 controls the piping fitting 140 to be in an open state, thereby allowing liquid to pass through the piping fitting 140. Alternatively, the control unit 102 controls the piping fitting 140 to be in a closed state, thereby stopping the flow of liquid within the piping fitting 140.

[0120] Furthermore, the control unit 102 can control valve 166a, switching its state between open and closed. The control unit 102 also controls pump 166b to deliver liquid to the additional piping 142. Specifically, the control unit 102 controls valve 166a and pump 166b, opening valve 166a and driving pump 166b, thereby allowing the flow of the medicine or cleaning fluid towards the piping fitting 140 within the additional piping 164. Conversely, the control unit 102 can also close valve 166a and stop pump 166b, thereby stopping the flow of the medicine or cleaning fluid towards the piping fitting 140 within the additional piping 164.

[0121] Furthermore, the control unit 102 preferably controls the flow of liquid through the upstream connection 152 and the downstream connection 154. More specifically, the control unit 102 preferably switches the opening connecting the upstream connection 152 and the downstream connection 154.

[0122] As described above, the storage unit 104 can store multiple recipe data. These multiple recipes can specify the cleaning treatment content and procedures for the piping fittings 140.

[0123] The substrate processing apparatus 100 of this embodiment is suitable for forming semiconductor elements. For example, the substrate processing apparatus 100 is suitable for processing a substrate W that is used as a semiconductor element in a stacked structure. The semiconductor element is a so-called 3D structured memory (storage device). As an example, the substrate W is suitable for use as a NAND flash memory.

[0124] Next, refer to Figures 1-6 The cleaning method for the piping fitting 140 in this embodiment will be described. Figure 5 (a)~ Figure 6 (c) is a schematic diagram for explaining the cleaning method of the piping fitting 140 in this embodiment. Here, as a piping fitting, the cleaning method of the piping fitting 140 when the old piping fitting 140a is removed from the piping 32 and the new piping fitting 140 is installed on the piping 32 will be described.

[0125] like Figure 5 As shown in (a), a pipe fitting 140a is installed on pipe 32. For example, pipe fitting 140a is a valve or filter.

[0126] The upstream connection 152 is located upstream of the pipe fitting 140a in the piping 32, and the downstream connection 154 is located downstream of the pipe fitting 140a in the piping 32. Furthermore, the processing fluid flows through the piping 32 with the pipe fitting 140a installed until it is replaced. Therefore, the substrate processing unit 10 can process the substrate W using the processing fluid flowing in the piping 32. On the other hand, before replacing the pipe fitting 140a, the valve 113 is closed to stop the flow of the processing fluid.

[0127] like Figure 5 As shown in (b), the piping fitting 140a is removed from the piping 32 and the new piping fitting 140 is installed on the piping 32.

[0128] like Figure 5 As shown in (c), a first piping 164a of the cleaning unit 160 is connected to the upstream connection 152. Here, one end of the first piping 164a is connected to the liquid supply unit 162a, and the other end is connected to the upstream connection 152. A valve 166a and a pump 166b are installed on the first piping 164a. The upstream connection 152 is switched to connect the first piping 164a and the piping fitting 140.

[0129] Additionally, a second conduit 164b of the cleaning unit 160 is connected to the downstream connection 154. One end of the second conduit 164b is connected to the downstream connection 154. The other end of the second conduit 164b is connected to the drain pipe. The downstream connection 154 is switched to connect the conduit fitting 140 and the second conduit 164b.

[0130] like Figure 6 As shown in (a), valve 166a is opened and pump 166b is driven, thereby supplying the medicine from the medicine supply unit 162a to the pipe fitting 140. The medicine supplied from the medicine supply unit 162a flows through the first pipe 164a, pipe 32, pipe fitting 140, pipe 32, and the second pipe 164b to the drain pipe. Thus, the pipe fitting 140 can be cleaned with medicine using the portion between the upstream connection 152 and the downstream connection 154 in pipe 32. Afterwards, valve 166a is closed, and pump 166b is stopped, thereby stopping the flow of medicine.

[0131] like Figure 6 As shown in (b), the connection object of one end of the first pipe 164a is changed from the drug supply unit 162a to the cleaning fluid supply unit 162b.

[0132] like Figure 6As shown in (c), valve 166a is opened, and pump 166b is driven, thereby allowing cleaning fluid to flow from cleaning fluid supply unit 162b through first pipe 164a, pipe 32, pipe fitting 140, pipe 32, and second pipe 164b to the drain pipe. This allows the pipe fitting 140 to be cleaned with cleaning fluid using the portion between the upstream connection 152 and the downstream connection 154 in pipe 32. Afterwards, valve 166a is closed, and pump 166b is stopped, thereby stopping the flow of cleaning fluid.

[0133] As described above, the piping fitting 140 can be flushed efficiently. Typically, after flushing the piping fitting 140, the upstream connection 152 switches to connect the modulation tank 112 and the piping fitting 140, and the downstream connection 154 switches to connect the piping fitting 140 and the valve 36. Thus, the treatment fluid from the modulation tank 112 flows through the piping fitting 140 and then through the piping 32 to the substrate processing unit 10. In the substrate processing unit 10, the substrate W is treated with the treatment fluid.

[0134] According to the cleaning method for the piping fitting 140 of this embodiment, the upstream connecting portion 152 and the downstream connecting portion 154 around the piping fitting 140 are connected to the cleaning unit 160, and the piping fitting 140 is cleaned with a chemical solution and a cleaning fluid. Therefore, even when the piping fitting 140 is replaced, the amount of chemical solution and cleaning fluid used for rinsing the piping fitting 140 can be reduced, and the rinsing time can be shortened. Moreover, according to this embodiment, the piping fitting 140 can be cleaned with a liquid different from the treatment fluid that flows through the piping 32 on which the piping fitting 140 is installed.

[0135] In addition, Figure 6 In (a), the first pipe 164a is connected to the upstream side connection 152 located upstream of the pipe fitting 140, and the second pipe 164b is connected to the downstream side connection 154 located downstream of the pipe fitting 140. However, this embodiment is not limited to this. Alternatively, the first pipe 164a may be connected to the downstream side connection 154, and the second pipe 164b may be connected to the upstream side connection 152. In this case, the medicine supplied from the medicine supply unit 162a flows in the order of the first pipe 164a, the downstream side connection 154, the pipe 32 including the pipe fitting 140, the upstream side connection 152, and the second pipe 164b. Similarly, the medicine supplied from the cleaning fluid supply unit 162b flows in the order of the first pipe 164a, the downstream side connection 154, the pipe 32 including the pipe fitting 140, the upstream side connection 152, and the second pipe 164b.

[0136] In this way, the cleaning unit 160 can supply liquid from the liquid supply unit 162a to one of the upstream side connection 152 located upstream of the piping connection fitting 140 and the downstream side connection 154 located downstream of the piping connection fitting 140, and recover the liquid from the other of the upstream side connection 152 and the downstream side connection 154. Similarly, the cleaning unit 160 can also supply cleaning fluid from the cleaning fluid supply unit 162b to one of the upstream side connection 152 located upstream of the piping connection fitting 140 and the downstream side connection 154 located downstream of the piping connection fitting 140, and recover the cleaning fluid from the other of the upstream side connection 152 and the downstream side connection 154.

[0137] However, when the piping fitting 140 is a filter with a specific construction, it may sometimes allow liquid to flow from one direction, but not from the opposite direction. Furthermore, even when cleaning the piping fitting 140 with liquid flowing in the opposite direction to the flow of the treatment liquid, it may not be sufficient to remove all particles. Therefore, it is preferable that the direction of liquid flow when cleaning the piping fitting 140 using the cleaning unit 160 is the same as the direction of the treatment liquid from the conditioning tank 112 flowing through the piping fitting 140.

[0138] Next, refer to Figures 1 to 7 (mainly) Figures 5-7 The cleaning method for the piping fitting 140 in this embodiment will be described. Figure 7 This is a flowchart of the cleaning method for the piping fittings 140 in this embodiment.

[0139] like Figure 7 As shown, in step Se, the pipe fitting 140 installed on the pipe 32 is replaced. Specifically, the pipe fitting 140a installed on the pipe 32 is removed from the pipe 32, and the pipe fitting 140 is reinstalled on the pipe 32.

[0140] In step Sa, the cleaning unit 160 is installed on the piping 32. Specifically, a first piping 164a of the cleaning unit 160 is connected to the upstream connection 152. Here, one end of the first piping 164a is connected to the drug supply unit 162a, and the other end of the first piping 164a is connected to the upstream connection 152. Additionally, a second piping 164b of the cleaning unit 160 is connected to the downstream connection 154. Here, one end of the second piping 164b is connected to the downstream connection 154, and the other end of the second piping 164b is connected to the drain pipe.

[0141] In step Sc, a chemical solution is supplied to the piping fitting 140. The cleaning unit 160 supplies the chemical solution to the upstream connection 152 located upstream of the piping fitting 140, so that the chemical solution passes through the piping fitting 140, and the cleaning unit 160 recovers the chemical solution from the downstream connection 154.

[0142] In step Sr, cleaning fluid is supplied to the piping connection fitting 140. The cleaning fluid is supplied to the upstream connection 152 located upstream of the piping connection fitting 140 through the cleaning unit 160. The cleaning fluid passes through the piping connection fitting 140, and the cleaning unit 160 recovers the cleaning fluid from the downstream connection 154.

[0143] As described above, the cleaning of the piping fitting 140 is completed. According to this embodiment, the cleaning unit 160 can supply chemical solution and cleaning fluid to the piping fitting 140 via the upstream connection 152 and the downstream connection 154, and recover the chemical solution and cleaning fluid that have passed through the piping fitting 140. Therefore, the piping fitting 140 can be cleaned effectively.

[0144] When the substrate W is processed in the substrate processing apparatus 100, the processing liquid from the modulation tank 112 flows in the piping connection fitting 140. Therefore, it is preferable to clean the piping connection fitting 140 with a cleaning liquid before disconnecting it from the piping 32. For example, the cleaning unit 160 may also clean the piping connection fitting 140 with a cleaning liquid before disconnecting it from the piping 32.

[0145] Next, refer to Figure 8 The cleaning method for the piping assembly 140a removed from the substrate processing apparatus 100 of this embodiment will be described. Figure 8 (a) to (b) are schematic diagrams illustrating the cleaning method for the piping assembly 140a removed from the substrate processing apparatus 100 of this embodiment.

[0146] like Figure 8 As shown in (a), a pipe fitting 140a is installed on the pipe 32 before replacement. The upstream connection 152 is located on the upstream side of the pipe 32 relative to the pipe fitting 140a, and the downstream connection 154 is located on the downstream side of the pipe 32 relative to the pipe fitting 140a.

[0147] like Figure 8As shown in (b), the first pipe 164a of the cleaning unit 160 is connected to the upstream connection 152 located upstream of the pipe fitting 140a, and the second pipe 164b of the cleaning unit 160 is connected to the downstream connection 154 located downstream of the pipe fitting 140a. Here, a cleaning fluid supply unit 162b is connected to one end of the first pipe 164a, and the upstream connection 152 is connected to the other end of the first pipe 164a.

[0148] Then, valve 166a is opened and pump 166b is driven to allow the cleaning fluid to flow in the order of first pipe 164a, pipe fitting 140a, and second pipe 164b. Typically, the cleaning fluid is DIW. In this way, the pipe fitting 140a can be cleaned with the cleaning fluid from cleaning unit 160.

[0149] like Figure 8 As shown in (c), the piping fitting 140a is removed from piping 32 and a new piping fitting 140 is installed on piping 32.

[0150] In this embodiment, the piping fitting 140a is cleaned using the cleaning unit 160 before being removed. Therefore, the piping fitting 140a can be easily replaced.

[0151] Next, refer to Figures 1-9 (mainly) Figure 8 and Figure 9 The cleaning method for the piping assembly 140 in the substrate processing apparatus 100 of this embodiment will be described. Figure 9 This is a flowchart of the cleaning method for the piping fittings 140 in this embodiment.

[0152] like Figure 9 As shown, in step Sa, the cleaning unit 160 is assembled on the piping 32, which is equipped with the piping installation fitting 140a. Specifically, a first piping 164a of the cleaning unit 160 is connected to the upstream connection 152. One end of the first piping 164a is connected to the liquid supply unit 162a, and the other end is connected to the upstream connection 152. A valve 166a and a pump 166b are installed on the first piping 164a. Furthermore, a second piping 164b of the cleaning unit 160 is connected to the downstream connection 154. One end of the second piping 164b is connected to the downstream connection 154.

[0153] In step Sw, cleaning fluid is supplied to the piping connection fitting 140a. The cleaning unit 160 supplies cleaning fluid from the cleaning fluid supply unit 162b to the upstream connection 152 located upstream of the piping connection fitting 140a, and recovers cleaning fluid from the downstream connection 154.

[0154] In step Se, the piping fitting 140 of piping 32 is replaced. Specifically, the piping fitting 140a installed on piping 32 is removed from piping 32, and a new piping fitting 140 is installed on piping 32.

[0155] In step Sc, a cleaning solution is supplied to the piping connection fitting 140. The cleaning unit 160 supplies the cleaning solution from the cleaning solution supply unit 162a to the upstream connection part 152 located upstream of the piping connection fitting 140, and recovers the cleaning solution from the downstream connection part 154.

[0156] In step Sr, cleaning fluid is supplied to the piping connection fitting 140. The cleaning unit 160 supplies cleaning fluid from the cleaning fluid supply unit 162b to the upstream connection 152 located upstream of the piping connection fitting 140, and recovers cleaning fluid from the downstream connection 154.

[0157] According to this embodiment, before removing the piping fitting 140a from the piping 32, the piping fitting 140a is cleaned with cleaning fluid using the cleaning unit 160. Therefore, when removing the piping fitting 140a from the piping 32, the piping fitting 140a can be handled easily.

[0158] In addition, the cleaning unit 160 can be used to clean the piping fitting 140 before installing the new piping fitting 140 onto the piping 32.

[0159] Next, refer to Figure 10 The cleaning method for the piping fittings 140 installed in the substrate processing apparatus 100 of this embodiment will be described. Figure 10 (a) to (c) are schematic diagrams illustrating the cleaning method of the piping fitting 140 installed in the substrate processing apparatus 100 of this embodiment.

[0160] like Figure 10 As shown in (a), the piping connection fitting 140 is assembled into the cleaning unit 160 before being installed onto the piping 32. Specifically, the piping connection fitting 140 connects to a first piping 164a and a second piping 164b of the cleaning unit 160. One end of the first piping 164a is connected to the liquid supply unit 162a, and the other end of the first piping 164a is connected to one end of the piping connection fitting 140. Additionally, one end of the second piping 164b is connected to the other end of the piping connection fitting 140. The other end of the second piping 164b is connected to the drain pipe.

[0161] like Figure 10As shown in (b), valve 166a is opened and pump 166b is driven, allowing the liquid medicine to flow from the liquid medicine supply unit 162a through the first pipe 164a, the pipe fitting 140, and the second pipe 164b to the drain pipe. This cleans the pipe fitting 140 with the liquid medicine. Afterwards, valve 166a is closed, pump 166b is stopped, and the flow of the liquid medicine ceases.

[0162] like Figure 10 As shown in (c), the connection point of one end of the first pipe 164a is changed from the drug supply unit 162a to the cleaning fluid supply unit 162b. Then, valve 166a is opened and pump 166b is driven, allowing the cleaning fluid to flow from the cleaning fluid supply unit 162b through the first pipe 164a, pipe fitting 140, and second pipe 164b to the drain pipe. This cleans the pipe fitting 140 with the cleaning fluid. Afterward, valve 166a is closed and pump 166b is stopped, stopping the flow of the cleaning fluid.

[0163] According to this embodiment, the cleaning unit 160 can be used to clean the piping fittings 140 installed before the piping 32. Therefore, the rinsing time after the piping fittings 140 are installed on the piping 32 can be shortened.

[0164] Furthermore, preferably, when the piping fitting 140 is assembled into the cleaning unit 160, the direction of flow of the liquid medicine and / or treatment fluid in the piping fitting 140 is the same as the direction of flow of the treatment fluid from the mixing tank 112 in the piping fitting 140 when the piping fitting 140 is installed in the piping 32. This allows for effective cleaning of the piping fitting 140.

[0165] Next, refer to Figures 1 to 11 (mainly) Figure 10 and Figure 11 The cleaning method for the piping fitting 140 in this embodiment will be described. Figure 11 This is a flowchart of the cleaning method for the piping fittings 140 in this embodiment.

[0166] like Figure 11 As shown, in step Sba, the piping connection fitting 140, installed before piping 32, is assembled into the cleaning unit 160. Specifically, the piping connection fitting 140 connects to a first piping 164a and a second piping 164b of the cleaning unit 160. Here, one end of the first piping 164a is connected to the liquid supply unit 162a, and the other end of the first piping 164a is connected to one end of the piping connection fitting 140. Additionally, one end of the second piping 164b is connected to the other end of the piping connection fitting 140. The other end of the second piping 164b is connected to a drain pipe.

[0167] In step Sbc, valve 166a is opened and pump 166b is driven to supply the chemical solution to the piping fitting 140. This allows the piping fitting 140 to be cleaned with the chemical solution. Afterwards, valve 166a is closed and pump 166b is stopped, thus ceasing the supply of the chemical solution.

[0168] In step Sbr, the connection point of one end of the first pipe 164a is changed from the chemical supply unit 162a to the cleaning fluid supply unit 162b. Then, valve 166a is opened and pump 166b is driven to supply cleaning fluid to the pipe fitting 140. This allows the pipe fitting 140 to be cleaned with cleaning fluid. Afterward, valve 166a is closed and pump 166b is stopped, thus stopping the supply of cleaning fluid.

[0169] The piping fittings 140 installed before piping 32 can also be cleaned in the same manner as described above. This reduces the flushing time after the piping fittings 140 are installed on piping 32.

[0170] As described above, the storage unit 104 can also store formula data for cleaning the pipe fitting 140 installed before the piping 32. Therefore, the control unit 102 can clean the pipe fitting 140 with a chemical solution and a cleaning solution after the pipe fitting 140 is assembled into the cleaning unit 160.

[0171] In addition, in reference Figures 3 to 11 In the above description, the cleaning unit 160 supplies the chemical solution and cleaning fluid to the piping connection fitting 140 once each, but this embodiment is not limited to this. The cleaning unit 160 may also supply the chemical solution and cleaning fluid to the piping connection fitting 140 multiple times. In this case, it is preferable that the cleaning unit 160 supplies the chemical solution and cleaning fluid to the piping connection fitting 140 alternately. Moreover, it is preferable to use different types of chemical solutions.

[0172] Next, refer to Figure 12 The cleaning unit 160 in the substrate processing apparatus 100 of this embodiment will be described. Figure 12 This is a schematic diagram of the cleaning unit 160 in the substrate processing apparatus 100 of this embodiment. Figure 12 The cleaning unit 160 shown, except for the medicine supply unit 162a which includes a first medicine supply unit 162a1 and a second medicine supply unit 162a2, has the same features as... Figure 3 The cleaning unit 160 shown has the same structure, and repeated descriptions are omitted to avoid redundancy.

[0173] like Figure 12As shown, the liquid supply unit 162a includes a first liquid supply unit 162a1 and a second liquid supply unit 162a2. The first liquid supply unit 162a1 is used to remove the metal components from the piping fitting 140. The second liquid supply unit 162a2 is used to remove the resin components from the piping fitting 140.

[0174] The drug solution supplied from the first drug solution supply unit 162a1 is acidic. For example, the drug solution supplied from the first drug solution supply unit 162a1 is hydrochloric acid or hydrofluoric acid. In this specification, the drug solution supplied from the first drug solution supply unit 162a1 is sometimes referred to as the first drug solution.

[0175] The solution supplied from the second solution supply unit 162a2 is alkaline. Alternatively, the solution supplied from the second solution supply unit 162a2 may be organic. For example, the solution supplied from the second solution supply unit 162a2 may be ammonia, isopropyl alcohol (IPA), hydrogen peroxide, or ozone. In this specification, the solution supplied from the second solution supply unit 162a2 may sometimes be referred to as the second solution.

[0176] Next, refer to Figures 1 to 13 (mainly) Figure 12 and Figure 13 The cleaning method for the piping fitting 140 in this embodiment will be described. Figure 13 This is a flowchart of the cleaning method for the piping fittings 140 in this embodiment. Figure 13 The flowchart shown, besides indicating the points where the chemical solution and cleaning fluid are alternately supplied to the piping fitting 140 twice, also includes... Figure 9 The flowcharts shown are identical; to avoid redundancy, repeated explanations are omitted.

[0177] like Figure 13 As shown, in step Sa, the cleaning unit 160 is assembled on the piping 32, which is equipped with the piping loading and unloading fitting 140a.

[0178] In step Sw, cleaning fluid is supplied to the piping connection fitting 140a. The cleaning unit 160 supplies cleaning fluid from the cleaning fluid supply unit 162b to the upstream connection 152 located upstream of the piping connection fitting 140a, and recovers the cleaning fluid from the downstream connection 154.

[0179] In step Se, the pipe fitting 140 installed on the pipe 32 is replaced. Specifically, the pipe fitting 140a installed on the pipe 32 is removed from the pipe 32, and a new pipe fitting 140 is installed on the pipe 32.

[0180] In step Sc1, a chemical solution is supplied to the piping fitting 140. Here, an acidic first chemical solution is supplied to the piping fitting 140 from the first chemical solution supply unit 162a1 via the additional pipe 164. This removes metallic components from the piping fitting 140. For example, the first chemical solution supply unit 162a1 supplies hydrochloric acid or hydrofluoric acid as the first chemical solution. The cleaning unit 160 supplies the first chemical solution to the upstream connection 152 located upstream of the piping fitting 140 and recovers the first chemical solution from the downstream connection 154.

[0181] In step Sr1, cleaning fluid is supplied to the piping connection fitting 140. For example, the cleaning unit 160 supplies cleaning fluid to the upstream connection 152 located upstream of the piping connection fitting 140 and recovers cleaning fluid from the downstream connection 154.

[0182] In step Sc2, a chemical solution is supplied to the pipe fitting 140. Here, an alkaline or organic second chemical solution is supplied to the pipe fitting 140 from the second chemical solution supply unit 162a2 via the additional pipe 164. This removes resin components from the pipe fitting 140. For example, the second chemical solution supply unit 162a2 supplies ammonia, isopropyl alcohol (IPA), hydrogen peroxide, or ozone water as the alkaline or organic second chemical solution. For example, the cleaning unit 160 supplies the second chemical solution to the upstream connection 152 located upstream of the pipe fitting 140 and recovers the second chemical solution from the downstream connection 154.

[0183] In step Sr2, cleaning fluid is supplied to the piping connection fitting 140. For example, the cleaning unit 160 supplies cleaning fluid to the upstream connection 152 located upstream of the piping connection fitting 140 and recovers cleaning fluid from the downstream connection 154.

[0184] The cleaning of the piping fitting 140 is thus completed. According to this embodiment, the cleaning unit 160 can supply two kinds of chemical solutions and cleaning fluid to the piping fitting 140 via the upstream connection 152 and the downstream connection 154, and recover the chemical solutions and cleaning fluid from the piping fitting 140. Therefore, even if particles of both metal and resin components are generated from the piping fitting 140, the piping fitting 140 can be effectively cleaned.

[0185] Next, refer to Figure 14 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 14 This is a schematic diagram used to explain the piping structure in the substrate processing apparatus 100 of this embodiment.

[0186] like Figure 14As shown, the processing liquid in the modulation tank 112 flows through pipe 32a. Pipe 32a extends from the modulation tank 112 to a common pipe 32s. The cleaning liquid flows through pipe 32b. Pipe 32b extends to the common pipe 32s. The common pipe 32s is connected to pipes 32a, 32b, and 32. Pipe 32 extends from the common pipe 32s to the substrate processing unit 10.

[0187] Therefore, the processing liquid in the modulation tank 112 passes through the common pipe 32s from the pipe 32a, and is then supplied to the substrate W through the nozzle 34 via the pipe 32. Additionally, the cleaning liquid passes through the common pipe 32s from the pipe 32b, and is then supplied to the substrate W through the nozzle 34 via the pipe 32.

[0188] The processing liquid tank 110 includes a housing 111, a conditioning tank 112, a valve 113, a pump 114, a temperature control device 115, an electric valve 116, a flow meter 117, a filter 142a, an upstream connection 152a, and a downstream connection 154a. The valve 113, pump 114, temperature control device 115, upstream connection 152a, filter 142a, and downstream connection 154a are arranged in this order on the piping 32a.

[0189] Valve 113 opens and closes the flow path within pipe 32a. Valve 113 regulates the opening degree of pipe 32a, adjusting the flow rate of the treatment fluid supplied to pipe 32a. Specifically, valve 113 includes a valve body (not shown) with an internal valve seat, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0190] Pump 114 delivers the processing fluid to piping 32a. Temperature control device 115 heats the processing fluid flowing in piping 32a. The temperature of the processing fluid can be adjusted by the temperature control device 115.

[0191] Filter 142a filters the treatment fluid flowing in piping 32a. Filter 142a is an example of piping fitting 140.

[0192] In piping 32a, an upstream connection 152a is installed on the upstream side of filter 142a, and a downstream connection 154a is installed on the downstream side of filter 142a.

[0193] Pipe 32a extends from the conditioning tank 112 of the processing liquid tank 110 to the common pipe 32s of the processing liquid tank 120. Additionally, pipe 32a connects to pipe 32c between the processing liquid tank 110 and the processing liquid tank 120. Furthermore, although not shown here, pipe 32a branches between the processing liquid tank 110 and the processing liquid tank 120 to other tower TWs or other substrate processing units 10. Pipe 32c extends to the conditioning tank 112 within the processing liquid tank 110. An electric valve 116 and a flow meter 117 are mounted on pipe 32c. Pipe 32c is the circulation path for the processing liquid.

[0194] For example, when the processing liquid in the conditioning tank 112 is heated to a certain temperature using the temperature control device 115, the processing liquid flowing from the conditioning tank 112 to the piping 32a is preferably circulated by passing through the piping 32c back to the conditioning tank 112.

[0195] The processing liquid tank 120 includes a common piping 32s, a valve 36, a housing 121, valves 122a and 122b, an electric valve 123a and 123b, a flow meter 124a and 124b, a valve 129, an upstream connection 152b and 152c, and a downstream connection 154b. Valve 36, valve 122a, valve 122b, electric valve 123a and 123b, flow meter 124a and 124b, valve 129, upstream connection 152b, upstream connection 152c, and downstream connection 154b are housed within the housing 121. Valve 122a, electric valve 123a, flow meter 124a, and upstream connection 152b are mounted on piping 32a.

[0196] The cleaning fluid flows in pipe 32b. Pipe 32b is sequentially equipped with an upstream connection 152r, a filter 142r, a downstream connection 154r, a flow meter 124b, an electric valve 123b, an upstream connection 152c, and a valve 122b. The filter 142r is an example of a pipe fitting 140.

[0197] Treatment fluid and cleaning fluid flow in piping 32. A valve 36 and a downstream connection 154b are installed in piping 32.

[0198] The common piping 32s is connected to the drain pipe via valve 129. Therefore, by opening valve 129, the processing fluid or cleaning fluid flowing through the common piping 32s can be discarded.

[0199] Here, a cleaning unit 160 is installed on the filter 142r. In addition to the chemical supply unit 162a, the cleaning fluid supply unit 162b, the additional piping 164, the valve 166a, and the pump 166b, the cleaning unit 160 also includes a filter 166c and a tank 168.

[0200] Specifically, a first piping 164a of the cleaning unit 160 is connected to an upstream connection 152r located upstream of the filter 142r, and a second piping 164b of the cleaning unit 160 is connected to a downstream connection 154r located downstream of the filter 142r. In addition to the valve 166a and the pump 166b, a filter 166c is also installed on the first piping 164a.

[0201] The medicine supply unit 162a includes a first medicine supply unit 162a1, a second medicine supply unit 162a2, and a third medicine supply unit 162a3. The medicines supplied from the first medicine supply unit 162a1 to the third medicine supply unit 162a3 are different from each other.

[0202] The first liquid supply unit 162a1 supplies liquid medicine to the tank 168. Specifically, the first liquid supply unit 162a1 supplies liquid medicine to the tank 168 via a common pipe 164m and a third pipe 164c. A valve 167a1 is installed between the first liquid supply unit 162a1 and the common pipe 164m. A valve 167c is installed on the third pipe 164c.

[0203] The second liquid supply unit 162a2 and the third liquid supply unit 162a3 have the same structure as the first liquid supply unit 162a1.

[0204] The cleaning fluid supply unit 162b supplies cleaning fluid to the tank 168. Specifically, the cleaning fluid supply unit 162b supplies cleaning fluid to the tank 168 via a common pipe 164m and a third pipe 164c. A valve 167b is installed between the cleaning fluid supply unit 162b and the common pipe 164m.

[0205] Tank 168 stores the medicinal solution or cleaning solution. One end of the first pipe 164a is located in tank 168, and the other end of the first pipe 164a is located in the upstream connection 152r. One end of the second pipe 164b is located in the downstream connection 154r, and the other end of the second pipe 164b is located in tank 168. Therefore, the filter 142r can be cleaned using the medicinal solution or cleaning solution stored in tank 168. The medicinal solution and cleaning solution can be circulated in filter 142a through tank 168. Therefore, the consumption of medicinal solution and cleaning solution when cleaning filter 142r can be suppressed.

[0206] Tank 168 is connected to a drain pipe. A valve 169a is installed on the piping between tank 168 and the drain pipe. By closing valve 169a, the medicine or cleaning solution can be stored in tank 168. Conversely, by opening valve 169a, the medicine or cleaning solution stored in tank 168 can be discarded.

[0207] A particle counter 170 may also be installed in the additional piping 164. Here, the particle counter 170 is installed in a sampling piping branching off from the second piping 164b. The particle counter 170 can be used to determine the number of particles in the drug solution and / or cleaning solution flowing in the additional piping 164.

[0208] When the number of particles in the drug solution and cleaning solution can be measured, the control unit 102 ( Figure 1 The liquid supplied to the piping fitting 140 can also be switched based on the measurement results of the particle counter 170. For example, the control unit 102 can also switch the opening and closing of valves 167a1 to 167c based on the measurement results of the particle counter 170. In addition, the liquid stored in the storage unit 104 ( Figure 1 Multiple formulations can also use the measurement results of the particle counter 170 as parameters to specify the cleaning treatment content and steps of the piping fittings 140.

[0209] In addition, Figure 14 In this case, a cleaning unit 160 is installed on the filter 142r, but the cleaning unit 160 can also be installed on the filter 142a. The cleaning unit 160 is connected to the upstream connection part 152a and the downstream connection part 154a, and is able to clean the filter 142a.

[0210] Alternatively, the cleaning unit 160 can also be installed on valves 122a and 36. The cleaning unit 160, connected to the upstream connection 152b and the downstream connection 154b, is capable of cleaning valves 122a and 36. Valves 122a and 36 are examples of piping fittings 140.

[0211] Similarly, the cleaning unit 160 can also be installed for valves 122b and 36. The cleaning unit 160, connected to the upstream connection 152c and the downstream connection 154b, is capable of cleaning valves 122b and 36. Valves 122b and 36 are examples of piping fittings 140.

[0212] As described above, storage unit 104 ( Figure 1 The storage unit 104 can also store formula data for cleaning the piping fitting 140. Preferably, the storage unit 104 stores different formulas depending on the type of piping fitting 140. For example, the storage unit 104 preferably stores different formulas for cleaning filter 142a and filter 142r. Therefore, the control unit 102 can effectively clean the piping fitting 140 according to its type.

[0213] As described above, pipes 32a and 32c are connected, allowing the processing liquid to circulate in the modulation tank 112, pipes 32a and 32c at a predetermined temperature. In such a substrate processing apparatus 100, when the filter 142a is replaced, particles adhering to the filter 142a circulate with the processing liquid in the modulation tank 112, pipes 32a and 32c, sometimes degrading the properties of the substrate W during processing. However, according to this embodiment, the newly replaced filter 142a can be efficiently cleaned using the cleaning unit 160, thus suppressing defects caused by particles.

[0214] Furthermore, when processing the substrate W, only cleaning fluid flows through the piping 32b. Therefore, even if the filter 142r installed in the piping 32b is only rinsed with cleaning fluid, the particles cannot be sufficiently removed, and the rinsing time may be prolonged. In contrast, according to this embodiment, the cleaning unit 160 can supply cleaning fluid to the filter 142r installed in the piping 32b, thus enabling the filter 142r to be cleaned appropriately.

[0215] Furthermore, when the filter 142r is flushed using the cleaning fluid flowing through pipe 32b, the waste cleaning fluid flows through the common pipe 32s and valve 129 to the drain pipe, raising concerns about particulate matter flowing into the common pipe 32s. In contrast, according to this embodiment, the cleaning unit 160 prevents the liquid used for flushing the filter 142r installed in pipe 32b from flowing into the common pipe 32s, thus maintaining the cleanliness of the common pipe 32s.

[0216] Furthermore, when the piping structure of the substrate processing apparatus 100 is complex, if particles attached to the filter 142r diffuse into the piping, it is difficult to thoroughly rinse the piping after the particles have diffused. In contrast, according to this embodiment, the filter 142r installed in the piping 32b is selectively cleaned by the cleaning unit 160, thereby suppressing the diffusion of particles into the piping of the substrate processing apparatus 100.

[0217] In addition, Figure 14 In the substrate processing apparatus 100 shown, the cleaning unit 160 recycles the chemical solution or cleaning fluid. However, if the piping fitting 140 is cleaned with the chemical solution or cleaning fluid, many particles sometimes flow out of the piping fitting 140. Therefore, the chemical solution or cleaning fluid may also be discarded.

[0218] Next, refer to Figure 15 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 15 (a) and Figure 15 (b) is a schematic diagram illustrating the piping structure of the cleaning unit 160 in the substrate processing apparatus 100 of this embodiment.

[0219] like Figure 15 As shown in (a), the cleaning unit 160 does not have a tank 168; instead, the first piping 164a is directly connected to the common piping 164m. This allows for the supply of medicine or cleaning fluid from the first medicine supply unit 162a1 to the third medicine supply unit 162a3 or the cleaning fluid supply unit 162b to the filter 142r. In this case, even if many particles flow out of the filter 142r, the filter 142r can be cleaned efficiently because the medicine or cleaning fluid is discarded.

[0220] Or, such as Figure 15 As shown in (b), even when the cleaning unit 160 has a tank 168, the second piping 164b can be branched midway into a piping connected to the drain pipe, and a valve 169b is installed on this piping. Thus, the medicinal or cleaning solution flowing in the second piping 164b can be selectively discarded.

[0221] For example, when cleaning the piping fitting 140 with a chemical solution or cleaning fluid, many particles may flow out of the fitting 140 immediately after the initial cleaning. In this case, the chemical solution or cleaning fluid initially used for cleaning can be selectively discarded, and the solution or cleaning fluid reused after a predetermined period can be recycled, thereby enabling efficient cleaning of the piping fitting 140.

[0222] In addition, after referring to Figures 3 to 15 In the above description, the cleaning unit 160 cleans the piping assembly 140 using the chemical solution and cleaning solution supplied from the chemical solution supply unit 162a and the cleaning solution supply unit 162b, respectively. However, this embodiment is not limited to this. The cleaning unit 160 may also clean the piping assembly 140 using the chemical solution and cleaning solution that can be supplied to the substrate processing unit 10.

[0223] Next, refer to Figure 16 and Figure 17 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 16 This is a schematic diagram used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0224] like Figure 16 As shown, the processing liquid in the mixing tank 112 flows in pipe 32a. Here, the processing liquid is a pharmaceutical solution. In this specification, pipe 32a is sometimes referred to as a pharmaceutical solution pipe. Pipe 32a extends from the mixing tank 112 to a common pipe 32s. The cleaning liquid flows in pipe 32b. Pipe 32b extends to the common pipe 32s. The common pipe 32s is connected to pipes 32a, 32b, and 32. Pipe 32 extends from the common pipe 32s to the substrate processing unit 10.

[0225] The treatment liquid tank 110 includes a housing 111, a mixing tank 112, a valve 113, a pump 114, an electric valve 116, a flow meter 117, a filter 142a, an upstream connection 152a, and a downstream connection 154a. The mixing tank 112 mixes the treatment liquid.

[0226] Pipe 32a connects the modulation tank 112 and the common pipe 32s. A valve 113, a pump 114, an upstream connection 152a, a filter 142a, and a downstream connection 154a are sequentially arranged on pipe 32a.

[0227] Pipe 32a extends from the conditioning tank 112 of the treatment fluid tank 110 to the common pipe 32s of the treatment fluid tank 120. Additionally, pipe 32a is connected to pipe 32c between the treatment fluid tank 110 and the treatment fluid tank 120. Pipe 32c extends to the conditioning tank 112 within the treatment fluid tank 110. An electric valve 116 and a flow meter 117 are installed on pipe 32c. Pipe 32c serves as the circulation path for the treatment fluid.

[0228] The processing fluid tank 120 includes a common piping 32s, a valve 36, a housing 121, a valve 122a, and a valve 122r. Valve 36, valve 122a, and valve 122r are housed in the housing 121. Valve 122a is mounted on piping 32a.

[0229] The cleaning fluid flows in pipe 32b. Pipe 32b is sequentially provided with an upstream connection 152r, a filter 142r, a downstream connection 154r, and a valve 122r.

[0230] The substrate processing apparatus 100 of this embodiment includes an upstream connection portion 152a, a downstream connection portion 154a, an upstream connection portion 152r, and a downstream connection portion 154r. At least one of the upstream connection portion 152a and the downstream connection portion 154a installed in the pipe 32a is preferably connected to the pipe 32b. Furthermore, at least one of the upstream connection portion 152r and the downstream connection portion 154r installed in the pipe 32b is preferably connected to the pipe 32a.

[0231] Figure 17 (a) is a schematic diagram illustrating the piping structure in the substrate processing apparatus 100 of this embodiment. Figure 17 As shown in (a), the upstream connection 152r installed on the pipe 32b is connected to the pipe 32a.

[0232] The substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 has an additional piping 164. The additional piping 164 includes: a first piping 164p connecting the upstream side connection portion 152a and the upstream side connection portion 152r; and a second piping 164q connecting the downstream side connection portion 154r and the modulation tank 112.

[0233] The treatment liquid flowing in pipe 32a can be supplied as a pharmaceutical solution to the upstream connection 152r via the first pipe 164p. Additionally, the treatment liquid flowing in a portion of the filter 142r in pipe 32b can be returned to the conditioning tank 112 via the second pipe 164q.

[0234] In this way, the cleaning unit 160 supplies the treatment liquid as a chemical solution to the upstream connection 152r located upstream of the filter 142r via the first pipe 164p, so that the treatment liquid passes through the filter 142r, and the cleaning unit 160 can recover the treatment liquid from the downstream connection 154r via the second pipe 164q.

[0235] Figure 17 (b) is a schematic diagram illustrating the piping structure in the substrate processing apparatus 100 of this embodiment. Figure 17 As shown in (b), the substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 includes an additional piping 164. The additional piping 164 includes a first piping 164f connecting the upstream connection portion 152r and the upstream connection portion 152a, and a second piping 164g connecting the downstream connection portion 154a and the drain pipe. Here, the upstream connection portion 152a installed on the piping 32a communicates with the piping 32b.

[0236] The substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 has a first pipe 164f connecting the upstream side connection portion 152r and the upstream side connection portion 152a, and a second pipe 164g connecting the downstream side connection portion 154a and the drain pipe.

[0237] The cleaning fluid flowing in the pipe 32b can be supplied to the upstream connection 152a via the first pipe 164f. Additionally, the treatment fluid flowing in the filter 142a portion of the pipe 32a can be directed to the drain pipe via the second pipe 164g.

[0238] In this way, the cleaning unit 160 supplies cleaning fluid to the upstream connection 152a located upstream of the filter 142a via the first pipe 164f, so that the cleaning fluid passes through the filter 142a, and the cleaning unit 160 can recover the cleaning fluid from the downstream connection 154a via the second pipe 164g.

[0239] In addition, Figure 17 In the substrate processing apparatus 100 shown in (a), a chemical solution is supplied to the filter 142r using an upstream connection 152a located upstream of the filter 142a. Figure 17In the substrate processing apparatus 100 shown in (b), cleaning fluid is supplied to the filter 142a using the upstream side connection 152r located upstream of the filter 142r, but this embodiment is not limited to this. The piping assembly 140 can also be cleaned using a connection different from the upstream side connection 152 and the downstream side connection 154.

[0240] Next, refer to Figure 18 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 18 This is a schematic diagram used to explain the piping structure in the substrate processing apparatus 100 of this embodiment. Figure 18 The substrate processing apparatus 100 shown also includes a temperature control device 115 and a connection part 156 installed in the piping 32a, and the first piping 164p is connected to the connection part 156, having a connection with... Figure 16 The substrate processing apparatus 100 shown has the same structure, and repeated descriptions are omitted to avoid redundancy.

[0241] like Figure 18 As shown, in the substrate processing apparatus 100, in addition to valve 113, pump 114, filter 142a, upstream connection 152a, and downstream connection 154a, a temperature control device 115 and a connection 156 are also installed in the piping 32a. The connection 156 is disposed between pump 114 and temperature control device 115. The connection 156 has the same structure as the upstream connection 152a or the downstream connection 154a.

[0242] Here, the cleaning unit 160 has a first pipe 164p connecting the connecting part 156 and the upstream connecting part 152r, and a second pipe 164q connecting the downstream connecting part 154r and the modulation tank 112.

[0243] The treatment liquid flowing in the pipe 32a can be supplied as a chemical solution to the upstream connection 152r via the first pipe 164p. Additionally, the treatment liquid flowing in the filter 142r section of the pipe 32b can be directed to the conditioning tank 112 via the second pipe 164q.

[0244] In this way, the cleaning unit 160 supplies the treatment liquid as a chemical solution to the upstream connection 152r located upstream of the filter 142r through the first pipe 164p, so that the treatment liquid passes through the filter 142r, and the cleaning unit 160 can recover the treatment liquid from the downstream connection 154r through the second pipe 164q.

[0245] Next, refer to Figure 19 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 19This is a schematic diagram used to explain the piping structure in the substrate processing apparatus 100 of this embodiment. Figure 19 The substrate processing apparatus 100 shown includes a connecting portion 156, but omits the cleaning unit 160, and has a connection with... Figure 14 The substrate processing apparatus 100 shown has the same structure, and repeated descriptions are omitted to avoid redundancy.

[0246] like Figure 19 As shown, the processing liquid in the modulation tank 112 flows in pipe 32a. Pipe 32a extends from the modulation tank 112 to a common pipe 32s. The cleaning liquid flows in pipe 32b. Pipe 32b extends to the common pipe 32s. The common pipe 32s is connected to pipes 32a, 32b, and 32. Pipe 32 extends from the common pipe 32s to the substrate processing unit 10.

[0247] Therefore, the processing liquid in the modulation tank 112 is supplied to the substrate W from the nozzle 34 via the nozzle 32 after passing through the common pipe 32s from the pipe 32a. In addition, the cleaning liquid is supplied to the substrate W from the nozzle 34 via the nozzle 32 after passing through the common pipe 32s from the pipe 32b.

[0248] A valve 113, a pump 114, a connection 156, a temperature control device 115, an upstream connection 152a, a filter 142a, and a downstream connection 154 are sequentially arranged in piping 32a.

[0249] The cleaning fluid flows in pipe 32b. Pipe 32b is sequentially provided with an upstream connection 152r, a filter 142r, a downstream connection 154r, a flow meter 124b, an electric valve 123b, an upstream connection 152c, and a valve 122r.

[0250] When a treatment solution is supplied to the piping fitting 140 via the cleaning unit 160 and used to clean the piping fitting 140, it is preferable to circulate the treatment solution in the preparation tank 112. However, when cleaning the piping fitting 140 with the treatment solution begins, the amount of particles in the treatment solution may sometimes increase. In this case, it is preferable that the treatment solution can circulate in the preparation tank 112 and can be partially discarded.

[0251] Next, refer to Figure 20 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 20 (a) and (b) are schematic diagrams used to illustrate the piping structure in the substrate processing apparatus of this embodiment.

[0252] like Figure 20As shown in (a), the substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 has a first pipe 164p connecting the connecting portion 156 and the upstream connecting portion 152r, and a second pipe 164q connecting the downstream connecting portion 154r and the modulation tank 112.

[0253] The treatment liquid flowing in pipe 32a can be supplied as a pharmaceutical solution to the upstream connection 152r via the first pipe 164p. Additionally, the treatment liquid flowing in a portion of the filter 142r in pipe 32b can be directed to the conditioning tank 112 via the second pipe 164q.

[0254] In this way, the cleaning unit 160 supplies the treatment liquid as a chemical solution to the upstream connection 152r located upstream of the filter 142r via the first pipe 164p, so that the treatment liquid passes through the filter 142r, and the cleaning unit 160 can recover the treatment liquid from the downstream connection 154r via the second pipe 164q.

[0255] Furthermore, a valve 166d is installed on the second pipe 164q, and a valve 166e is installed on the pipe branching off from the second pipe 164q and connected to the drain pipe. Therefore, the treatment liquid that passes through the second pipe 164q and returns to the conditioning tank 112 can be selectively discarded via valve 166e.

[0256] In addition, such as Figure 20 As shown in (b), the cleaning unit 160 has a first pipe 164p connecting the connecting portion 156 and the upstream connecting portion 152r, and a second pipe 164q connecting the downstream connecting portion 154r and the modulation tank 112. Furthermore, in Figure 20 In (b), with Figure 20 Unlike (a), connection 156 is located between temperature control device 115 and upstream connection 152a. Therefore, the processing liquid flowing in pipe 32a can be heated to a higher temperature and supplied to upstream connection 152r via the first pipe 164p. In addition, the processing liquid flowing in part of filter 142r in pipe 32b can be flowed to conditioning tank 112 via the second pipe 164q.

[0257] Next, refer to Figure 21 The piping structure in the substrate processing apparatus 100 of this embodiment will be described. Figure 21 This is a schematic diagram used to explain the piping structure in the substrate processing apparatus 100 of this embodiment.

[0258] like Figure 21As shown, in the substrate processing apparatus 100, the additional piping 164 of the cleaning unit 160 has a branched structure. Specifically, the additional piping 164 includes piping 164s, piping 164t, piping 164u, piping 164v, piping 164w, and piping 164x.

[0259] Pipe 164s is connected to connector 156. One end of pipe 164s is connected to connector 156, and the other end of pipe 164s is connected to one end of pipe 164t and pipe 164u. Therefore, pipe 164s branches with pipe 164t and pipe 164u at branch point 164y.

[0260] The other end of pipe 164t is connected to upstream connection 152a. The other end of pipe 164u is connected to upstream connection 152r.

[0261] One end of the 164V piping is connected to the downstream connection 154a.

[0262] One end of pipe 164w is connected to the downstream connection 154r. The other end of pipe 164w is connected to the other end of pipe 164v and one end of pipe 164x. The other end of pipe 164x is connected to the modulation tank 112.

[0263] Therefore, the treatment liquid flowing out of the conditioning tank 112 passes through pipe 32a, and after passing through valve 113, pump 114, and temperature control device 115, it separates from pipe 32a at connection 156 and flows in pipe 164s. If the treatment liquid flowing in pipe 164s enters pipe 164t at branch point 164y, it flows in the order of upstream connection 152a, filter 142a, downstream connection 154a, and pipe 164v, and returns to the conditioning tank 112 via pipe 164x. Alternatively, if the treatment liquid flowing in pipe 164s enters pipe 164u at branch point 164y, it flows in the order of upstream connection 152r, filter 142r, downstream connection 154r, and pipe 164w, and returns to the conditioning tank 112 via pipe 164x.

[0264] As shown above, by adding a branched pipe 164, it is possible to clean both filter 142a and filter 142r simultaneously.

[0265] Furthermore, a valve 166e is installed on the pipe branching from pipe 164x and connected to the drain pipe. Therefore, the treatment liquid that passes through pipe 164x and returns to the conditioning tank 112 can be selectively discarded via valve 166e.

[0266] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described above, and can be implemented in various ways without departing from its spirit. Furthermore, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the above embodiments. For example, several constituent elements may be deleted from all the constituent elements shown in the embodiments. Moreover, constituent elements from different embodiments may be appropriately combined. For ease of understanding, the accompanying drawings are schematically shown with each constituent element as the main body; the thickness, length, number, spacing, etc., of each constituent element shown may sometimes differ from the actual dimensions depending on the drawing. Furthermore, the material, shape, size, etc., of each constituent element shown in the above embodiments are examples and are not particularly limited; various modifications can be made without substantially departing from the effects of the present invention.

[0267] Industrial availability

[0268] This invention relates to a cleaning method for substrate processing apparatus and piping assembly / disassembly fittings.

Claims

1. A substrate processing apparatus characterized by comprising: Possessing: a substrate processing unit for processing a substrate; a storage tank for storing a processing liquid; a pipe connected to the storage tank and allowing the processing liquid to flow to the substrate processing unit; a pipe attachment / detachment fitting capable of being attached to and detached from the pipe; an upstream side connection portion provided in the pipe upstream of the pipe attachment / detachment fitting and between the storage tank and the pipe attachment / detachment fitting; a downstream side connection portion provided in the pipe downstream of the pipe attachment / detachment fitting; a cleaning unit capable of being connected to the upstream side connection portion and the downstream side connection portion; a nozzle connected to the pipe and discharging the processing liquid toward the substrate processing unit; an upstream valve that opens and closes the pipe between the storage tank and the upstream side connection portion; and a downstream valve that opens and closes the pipe between the downstream side connection portion and the nozzle, the cleaning unit possesses: a first pipe connected to the upstream side connection portion; a second pipe connected to the downstream side connection portion; a chemical liquid supply portion connected to one of the first pipe and the second pipe; a cleaning liquid supply portion connected to one of the first pipe and the second pipe; and a pump connected to one of the first pipe and the second pipe, the upstream side connection portion has an opening connected to the pipe and located on the upstream side of the pipe, an opening connected to the pipe and located on the downstream side of the pipe, and an opening connected to the first pipe, the downstream side connection portion has an opening connected to the pipe and located on the upstream side of the pipe, an opening connected to the pipe and located on the downstream side of the pipe, and an opening connected to the second pipe, in the case of the cleaning unit, a chemical liquid is supplied from one of the upstream side connection portion and the downstream side connection portion to the pipe attachment / detachment fitting, and the chemical liquid is recovered from the other of the upstream side connection portion and the downstream side connection portion, and a cleaning liquid is supplied from one of the upstream side connection portion and the downstream side connection portion to the pipe attachment / detachment fitting, and the cleaning liquid is recovered from the other of the upstream side connection portion and the downstream side connection portion.

2. The substrate processing apparatus according to claim 1, wherein the pipe attachment / detachment fitting includes at least one of a filter and a valve.

3. The substrate processing apparatus according to claim 1 or 2, wherein the upstream side connection portion and the downstream side connection portion include a three-way valve or a flap valve.

4. The substrate processing apparatus according to claim 1 or 2, wherein in the case of the cleaning unit, the chemical liquid is supplied from the upstream side connection portion to the pipe attachment / detachment fitting, and the chemical liquid is recovered from the downstream side connection portion, and the cleaning liquid is supplied from the upstream side connection portion to the pipe attachment / detachment fitting, and the cleaning liquid is recovered from the downstream side connection portion.

5. The substrate processing apparatus according to claim 1 or 2, wherein in the case of the cleaning unit, The first chemical liquid is supplied to the pipe attachment / detachment fitting from one of the upstream-side connecting portion and the downstream-side connecting portion, and the first chemical liquid is recovered from the other of the upstream-side connecting portion and the downstream-side connecting portion, and The second chemical liquid is supplied to the pipe attachment / detachment fitting from one of the upstream-side connecting portion and the downstream-side connecting portion, and the second chemical liquid is recovered from the other of the upstream-side connecting portion and the downstream-side connecting portion.

6. The substrate processing apparatus according to claim 1 or 2, wherein The cleaning unit includes an additional pipe connected to the upstream-side connecting portion and the downstream-side connecting portion.

7. The substrate processing apparatus according to claim 6, wherein The cleaning unit further includes: a chemical liquid supply portion that supplies the chemical liquid to the additional pipe; a cleaning liquid supply portion that supplies the cleaning liquid to the additional pipe; and a pump provided in the additional pipe.

8. The substrate processing apparatus according to claim 7, wherein The cleaning unit further includes a tank capable of storing the chemical liquid and the cleaning liquid.

9. The substrate processing apparatus according to claim 1 or 2, wherein The cleaning unit is capable of being cut off from the upstream-side connecting portion and the downstream-side connecting portion.

10. The substrate processing apparatus according to claim 6, wherein The processing liquid flows in the additional pipe.

11. The substrate processing apparatus according to claim 10, wherein The pipe includes: a chemical liquid pipe through which a chemical liquid flows; and a cleaning liquid pipe through which a cleaning liquid flows, the upstream-side connecting portion is provided upstream of the cleaning liquid pipe, the downstream-side connecting portion is provided downstream of the cleaning liquid pipe, the additional pipe has a pipe that communicates the chemical liquid pipe and one of the upstream-side connecting portion and the downstream-side connecting portion.

12. The substrate processing apparatus according to claim 1 or 2, further comprising a storage portion that stores a recipe for controlling cleaning of the pipe attachment / detachment fitting by the cleaning unit using the cleaning liquid and the chemical liquid.

13. The substrate processing apparatus according to claim 12, wherein The storage portion stores recipes that differ depending on the pipe attachment / detachment fitting.

14. A method of cleaning a pipe attachment / detachment fitting in a substrate processing apparatus, the substrate processing apparatus including: a substrate processing unit for processing a substrate; a storage tank that stores a processing liquid; a pipe connected to the storage tank and through which the processing liquid flows to the substrate processing unit; the pipe attachment / detachment fitting that is attachable to and detachable from the pipe; an upstream-side connecting portion provided in the pipe upstream of the pipe attachment / detachment fitting and between the storage tank and the pipe attachment / detachment fitting; a downstream-side connecting portion provided in the pipe downstream of the pipe attachment / detachment fitting; a cleaning unit capable of being connected to the upstream-side connecting portion and the downstream-side connecting portion; a nozzle connected to the pipe and that discharges the processing liquid toward the substrate processing unit. ​ an upstream valve that opens and closes the pipe between the storage tank and the upstream-side connection portion, a downstream valve that opens and closes the pipe between the downstream-side connection portion and the nozzle, the cleaning method of the pipe attachment / detachment fitting is characterized by the cleaning unit includes: a first pipe connected to the upstream-side connection portion; a second pipe connected to the downstream-side connection portion; a chemical liquid supply portion connected to one of the first pipe and the second pipe; a cleaning liquid supply portion connected to one of the first pipe and the second pipe; and a pump connected to one of the first pipe and the second pipe, the cleaning method of the pipe attachment / detachment fitting includes the steps of: replacing a pipe attachment / detachment fitting that can be attached to and detached from a pipe through which a processing liquid flows in a state in which the upstream valve is closed, one end of the pipe being connected to a storage tank that stores the processing liquid and the other end being connected to a nozzle that supplies the processing liquid to a substrate processing unit; after replacing the pipe attachment / detachment fitting, supplying a chemical liquid to the pipe attachment / detachment fitting from one of an upstream-side connection portion provided upstream of the pipe attachment / detachment fitting and between the storage tank and the pipe attachment / detachment fitting and a downstream-side connection portion provided downstream of the pipe attachment / detachment fitting in a state in which the upstream valve is closed, and recovering the chemical liquid from the other of the upstream-side connection portion and the downstream-side connection portion; and after replacing the pipe attachment / detachment fitting, supplying a cleaning liquid to the pipe attachment / detachment fitting from one of the upstream-side connection portion and the downstream-side connection portion in a state in which the upstream valve is closed, and recovering the cleaning liquid from the other of the upstream-side connection portion and the downstream-side connection portion, the step of recovering the chemical liquid is performed in a state in which the processing liquid does not flow from the storage tank to the upstream-side connection portion, the step of recovering the cleaning liquid is performed in a state in which the processing liquid does not flow from the storage tank to the upstream-side connection portion.

15. The method of cleaning a pipe fitting according to claim 14, wherein the cleaning method of the pipe attachment / detachment fitting further includes the steps of: before replacing the pipe attachment / detachment fitting, supplying a cleaning liquid from one of the upstream-side connection portion and the downstream-side connection portion, and recovering the cleaning liquid from the other of the upstream-side connection portion and the downstream-side connection portion.

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