Display module and preparation method thereof

Abstract

The present invention discloses a display module and a preparation method thereof. The display module includes a first surface, a second surface and a side surface; the display module includes a display substrate, an external driving circuit and a back binding structure. The external driving circuit is arranged on the side of the display substrate away from the first surface. The back binding structure includes a first metal trace on the display substrate, a second metal trace of the external driving circuit and a conductive layer. The conductive layer is located on the first surface, the second surface and the side surface. The conductive layer includes a plurality of conductive traces arranged at intervals. The two ends of the conductive trace are electrically connected to the first metal trace and the second metal trace respectively. Since the conductive trace can directly connect the display substrate and the external driving circuit without connecting the external driving circuit to the conductive trace through a secondary bonding process, the process is reduced, which is conducive to reducing costs. In addition, it is not affected by the high temperature and high pressure bonding conditions, which is conducive to improving the yield.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a preparation method thereof. Background Art

[0002] In order to achieve an extremely narrow bottom bezel, the back side binding is generally performed by leading the front electrode of the display panel to the back side of the display panel through a via or a conductive trace. The conductive wire needs to be bonded to the front electrode once, and then the external drive circuit is bonded to the back side of the display panel for a second time through anisotropic conductive glue or ultrasonic bonding. The process is complicated, and this solution has high requirements on the thickness of the display panel or display module as well as the temperature and pressure resistance, which is difficult to achieve in actual process production. Summary of the invention

[0003] The embodiment of the present invention provides a display module and a preparation method thereof, so as to solve the technical problems that the back-side binding of the existing display module has a complicated process and has high requirements on the thickness and temperature and pressure resistance of the display module.

[0004] To solve the above problems, the technical solution provided by the present invention is as follows:

[0005] The present invention provides a display module, comprising a first surface, a second surface and a side surface connecting the first surface and the second surface; the display module comprises:

[0006] A display substrate, wherein the first surface is a display surface of the display substrate;

[0007] an external driving circuit, disposed on a side of the display substrate away from the first surface, the second surface being a side surface of the external driving circuit away from the display substrate; and

[0008] A back binding structure is used to connect the display substrate and the external driving circuit, the back binding structure includes a first metal trace, a second metal trace and a conductive layer, the first metal trace is located on the first surface, the second metal trace is located on the second surface, the conductive layer is located on the first surface, the second surface and the side surface, the conductive layer includes a plurality of conductive traces arranged at intervals, and the two ends of the conductive trace are electrically connected to the first metal trace and the second metal trace respectively.

[0009] According to the display module provided by the present invention, the conductive trace covers part or all of the first metal trace on a side surface away from the first surface, and the conductive trace covers part or all of the second metal trace on a side surface away from the second surface.

[0010] According to the display module provided by the present invention, the back binding structure further includes a buffer layer, and the buffer layer is arranged between the side surface and the conductive layer.

[0011] According to the display module provided by the present invention, the material of the buffer layer is an insulating material, and the material of the buffer layer includes at least one of epoxy resin, silicone and acrylic resin.

[0012] According to the display module provided by the present invention, the display module also includes a third surface and a fourth surface, the third surface connects the first surface and the side, the fourth surface connects the second surface and the side, chamfers or rounded corners are formed between the third surface and the first surface, and between the fourth surface and the second surface, and the conductive trace extends from the first surface through the third surface to the side, and extends from the side through the fourth surface to the second surface.

[0013] According to the display module provided by the present invention, the spacing between two adjacent first metal wirings is equal to the spacing between two adjacent second metal wirings, and the spacing between two adjacent first metal wirings is equal to the spacing between two adjacent conductive wirings.

[0014] According to the display module provided by the present invention, the material of the conductive layer includes one of conductive silver paste, copper, aluminum and carbon-based materials.

[0015] According to the display module provided by the present invention, the display substrate comprises:

[0016] A display panel, wherein the first surface is a display surface of the display panel;

[0017] A supporting layer, disposed on a side of the display panel away from the first surface;

[0018] A static dissipation layer is disposed on a side of the support layer away from the first surface;

[0019] The external driving circuit is arranged on a side of the static dissipative layer away from the first surface, and a double-sided adhesive layer is arranged between the static dissipative layer and the external driving circuit for adhering the static dissipative layer and the external driving circuit.

[0020] The present invention provides a method for preparing a display module, comprising the following steps:

[0021] A display substrate and an external driving circuit are provided, wherein the display surface of the display substrate is the first surface of the display module, the surface of the external driving circuit on the side away from the display substrate is the second surface of the display module, the side surface of the display module connects the first surface and the second surface, and the first metal trace of the back binding structure is formed on the first surface;

[0022] The external driving circuit is attached to a side of the display substrate away from the first surface, and the second metal wiring of the back binding structure is formed on the second surface;

[0023] cutting the display substrate and the external driving circuit along a cutting line to form the side surface; and

[0024] A conductive layer is formed on the side surface, wherein the conductive layer includes a plurality of conductive traces arranged at intervals, and two ends of the conductive traces are electrically connected to the first metal trace and the second metal trace respectively.

[0025] According to the method for preparing a display module provided by the present invention, the conductive traces are formed by patterning the conductive layer using one of a laser etching process, an aerosol printing process, an inkjet printing process, a dispensing process and a pad printing process.

[0026] The beneficial effects of the present invention are as follows: the display module and preparation method thereof provided by the present invention, by setting a conductive layer on the side of the display module, the conductive layer includes a plurality of conductive traces arranged at intervals, and the two ends of the conductive traces directly connect the first metal trace and the second metal trace through a single bonding process. Since the first metal trace is located on the first surface of the display substrate and the second metal trace is located on the second surface of the external drive circuit, and the second surface is the side surface of the external drive circuit away from the display substrate, the conductive trace can directly connect the display substrate and the external drive circuit without connecting the external drive circuit to the conductive trace through a secondary bonding process, thereby reducing the number of steps and being beneficial to reducing costs. In addition, compared with the prior art, the display module in the present invention is not affected by high temperature and high pressure bonding conditions, which is beneficial to improving the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 is a schematic diagram of a first cross-sectional structure of a display module provided by an embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of the three-dimensional structure of a display module provided by an embodiment of the present invention;

[0030] Figure 3 is a schematic diagram of a second cross-sectional structure of a display module provided by an embodiment of the present invention;

[0031] Figure 4 is a schematic diagram of a third cross-sectional structure of a display module provided by an embodiment of the present invention;

[0032] Figure 5 is a schematic diagram of a fourth cross-sectional structure of a display module provided by an embodiment of the present invention;

[0033] Figure 6 is a schematic diagram of a fifth cross-sectional structure of a display module provided by an embodiment of the present invention;

[0034] Figure 7 is a flow chart of a method for preparing a display module provided by an embodiment of the present invention;

[0035] Fig. 8A ˉ Fig. 8E It is a schematic diagram of the process structure of a method for preparing a display module provided by an embodiment of the present invention.

[0036] Description of reference numerals:

[0037] 1. Display module; 1a. First surface; 1b. Second surface; 1c. Side surface; 1d. Third surface; 1e. Fourth surface;

[0038] 10. Display substrate; 101. Display panel; 102. Support layer; 103. Static dissipation layer; 104. Double-sided adhesive layer;

[0039] 20. External driving circuit; 201. Driving chip; 202. Flexible printed circuit board;

[0040] 30. Back binding structure; 301. First metal wiring; 302. Second metal wiring; 303. Conductive layer; 3031. Conductive wiring; 304. Buffer layer. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device.

[0042] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a first cross-sectional structure of a display module provided by an embodiment of the present invention, Figure 2 Schematic diagram of the three-dimensional structure of a display module provided by an embodiment of the present invention. An embodiment of the present invention provides a display module 1, comprising a first surface 1a, a second surface 1b and a side surface 1c connecting the first surface 1a and the second surface 1b.

[0043] The display module 1 includes a display substrate 10, an external driving circuit 20 and a back binding structure 30. The external driving circuit 20 is arranged on the side of the display substrate 10 away from the first surface 1a. The back binding structure 30 is used to connect the display substrate 10 and the external driving circuit 20. The back binding structure 30 includes a first metal trace 301, a second metal trace 302 and a conductive layer 303. The first metal trace 301 is located on the first surface 1a, the second metal trace 302 is located on the second surface 1b, and the conductive layer 303 is located on the first surface 1a, the second surface 1b and the side 1c. The conductive layer 303 includes a plurality of conductive traces 3031 arranged at intervals, and the two ends of the conductive trace 3031 are electrically connected to the first metal trace 301 and the second metal trace 302 respectively.

[0044] The first surface 1a is the display surface of the display substrate 10, that is, the first surface 1a is the front side of the display module 1. The second surface 1b is the side surface of the external driving circuit 20 away from the display substrate 10, that is, the second surface 1b is the back side of the display module 1.

[0045] It can be understood that the external driving circuit 20 of the present invention is arranged on the back side of the display substrate 10, the second metal trace 302 is arranged on the side of the external driving circuit 20 away from the display substrate 10, and the conductive trace 3031 of the conductive layer 303 arranged on the side 1c is connected to the first metal trace 301 and the second metal trace 302 through a single bonding process. Compared with the prior art, since the conductive trace 3031 in the present invention can directly connect the display substrate 10 and the external driving circuit 20, there is no need to connect the external driving circuit 20 with the conductive trace 3031 through a secondary bonding process, the process is reduced, which is beneficial to reducing costs; in addition, the display module 1 in the present invention is not affected by the high temperature and high pressure bonding conditions, which is beneficial to improving the yield.

[0046] It can be understood that the external driving circuit 20 includes a driving chip 201 and a flexible printed circuit board 202 bound and connected to the driving chip 201, the driving chip 201 can be a flip chip film, the flexible printed circuit board 202 and the driving chip 201 are used to provide external signals, the first metal trace 301 is the electrode of the display substrate 10, the second metal trace 302 is the pad of the external driving circuit 20, the first metal trace 301 and the second metal trace 302 are attached in reverse, and the external signal provided by the external driving circuit 20 is transmitted to the driving circuit layer of the display substrate 10 through the second metal trace 302, the conductive trace 3031 and the first metal trace 301 to drive the light-emitting device layer of the display substrate 10 to emit light, thereby realizing picture display.

[0047] The conductive trace 3031 covers part or all of the side surface of the first metal trace 301 away from the first surface 1a, and the conductive trace 3031 covers part or all of the side surface of the second metal trace 302 away from the second surface 1b. Compared with the side cross-section fit between the conductive trace 3031 and the first metal trace 301 and the second metal trace 302, the overlapping area between the conductive trace 3031 and the first metal trace 301 and the second metal trace 302 in the embodiment of the present invention is greatly improved, which is beneficial to reducing impedance, and the overlapping area can be designed according to actual needs.

[0048] Since the conductive layer 303 is formed after the display substrate 10 is cut, the side surface 1c of the display substrate 10 is prone to burrs and unevenness caused by the cutting process. The burrs may pierce the conductive layer 303 and have an adverse effect on the conductive performance of the conductive layer 303. In view of this, please refer to Figure 3 , Figure 3 is a schematic diagram of a second cross-sectional structure of a display module provided by an embodiment of the present invention, Figure 3 and Figure 1 The difference is that the back binding structure 30 also includes a buffer layer 304, and the buffer layer 304 is arranged between the side 1c and the conductive layer 303 to cover the burrs, so that the side 1c is smoothed, and the conductivity of the conductive layer 303 is prevented from being reduced due to the burrs.

[0049] Specifically, the material of the buffer layer 304 is an insulating material, and the material of the buffer layer 304 includes at least one of epoxy resin, silicone, and acrylic resin.

[0050] Specifically, the thickness of the buffer layer 304 is in the range of 10 micrometers to 20 micrometers. The thickness of the buffer layer 304 is relatively small so as to minimize the impact on the frame size of the display module 1.

[0051] In one embodiment, see Figure 4 , Figure 4 is a schematic diagram of a third cross-sectional structure of a display module provided by an embodiment of the present invention, Figure 4 and Figure 1 The difference is that the buffer layer 304 covers the corner area of ​​the display substrate 10 and the external driving circuit 20. Specifically, the buffer layer 304 covers the side 1c and a portion of the first surface 1a and a portion of the second surface 1b. The buffer layer 304 is in contact with the side sections of the first metal trace 301 and the second metal trace 302. Due to the presence of the buffer layer 304 in the corner area, the conductive trace 3031 can be prevented from being broken at the corner area, thereby further improving the reliability of the electrical connection.

[0052] For further information, see Figure 5 , Figure 5 is a schematic diagram of a fourth cross-sectional structure of a display module provided by an embodiment of the present invention, Figure 5 and Figure 1 The difference is that the display module 1 also includes a third surface 1d and a fourth surface 1e, the third surface 1d connects the first surface 1a and the side 1c, the fourth surface 1e connects the second surface 1b and the side 1c, chamfers or fillets are formed between the third surface 1d and the first surface 1a, and between the fourth surface 1e and the second surface 1b, the conductive trace 3031 extends from the first surface 1a through the third surface 1d to the side 1c, and extends from the side 1c through the fourth surface 1e to the second surface 1b. It can be understood that the present invention can further avoid the conductive trace 3031 from being broken at the corner area by setting the corner area as a chamfer or fillet, thereby further improving the reliability of the electrical connection.

[0053] It should be noted that the specific dimensions of the chamfers or fillets can be flexibly set and are not limited here.

[0054] The first metal routing 301 and the second metal routing 302 are arranged in a one-to-one correspondence, and the conductive routing 3031 is arranged in correspondence with the corresponding first metal routing 301 and the second metal routing 302. Specifically, the spacing between two adjacent first metal routings 301 is equal to the spacing between two adjacent second metal routings 302, and the spacing between two adjacent first metal routings 301 is equal to the spacing between two adjacent conductive routings 3031.

[0055] The conductive layer 303 is made of a material with strong conductive properties. Specifically, the material of the conductive layer 303 includes one of conductive silver paste, copper, aluminum and carbon-based materials.

[0056] In one embodiment, see Figure 6 , Figure 6 is a fifth cross-sectional structural schematic diagram of a display module provided by an embodiment of the present invention, Figure 6 and Figure 1 The difference is that the side section of the first metal wiring 301 away from the display area is located on the same plane as the side surface 1c, and the side section of the second metal wiring 302 away from the display area is located on the same plane as the side surface 1c, which can further reduce the lower frame of the display module 1.

[0057] Please refer again Figure 1 , Figure 3 to Figure 6 The display substrate 10 includes a display panel 101, a support layer 102 and a static dissipative layer 103. The first surface 1a is the display surface of the display panel 101. The support layer 102 is arranged on the side of the display panel 101 away from the first surface 1a. The static dissipative layer 103 is arranged on the side of the support layer 102 away from the first surface 1a. The external driving circuit 20 is arranged on the side of the static dissipative layer 103 away from the first surface 1a. A double-sided adhesive layer 104 is also arranged between the static dissipative layer 103 and the external driving circuit 20 for bonding the static dissipative layer 103 and the external driving circuit 20.

[0058] The display panel 101 may be an organic light emitting diode display panel, a liquid crystal display panel, a quantum dot light emitting diode display panel, a micro light emitting diode display panel, etc., and the present invention does not make specific limitations here. Taking the display panel 101 as an organic light emitting diode display panel as an example, the display panel 101 may include a substrate, a driving circuit layer and a light emitting device layer, the driving circuit layer is arranged on the substrate, and the light emitting device layer is arranged on the driving circuit layer. The first metal wiring 301 is arranged on the same layer as the driving circuit layer, and the driving circuit layer includes a plurality of signal wirings, and the plurality of signal wirings include a plurality of data lines and a plurality of scan lines, each of the data lines is connected to the corresponding first metal wiring 301 to transmit the data signal to the data line; each of the scan lines is connected to the corresponding second metal wiring 302 to transmit the scan signal to the scan line.

[0059] Of course, the display module 1 further includes film layers such as a packaging layer, a touch layer and a cover plate, which are prior arts and will not be described in detail here.

[0060] Specifically, the support layer 102 is used to support the display panel 101 , the static dissipative layer 103 plays the role of heat dissipation, buffering, and static dissipation, and the double-sided adhesive layer 104 may be an optical adhesive layer.

[0061] See also Figure 7 , Figure 8A to Figure 8E , Figure 7 is a flow chart of a method for preparing a display module provided by an embodiment of the present invention, Figure 8A to Figure 8E 1 is a schematic diagram of a process structure of a method for preparing a display module provided by an embodiment of the present invention. The present invention provides a method for preparing a display module 1, comprising the following steps:

[0062] Step S1: Provide a display substrate 10 and an external driving circuit 20, wherein the display surface of the display substrate 10 is the first surface 1a of the display module 1, the side surface of the external driving circuit 20 facing away from the display substrate 10 is the second surface 1b of the display module 1, the side surface 1c of the display module 1 connects the first surface 1a and the second surface 1b, and the first metal trace 301 of the back binding structure 30 is formed on the first surface 1a.

[0063] Specifically, the display substrate 10 includes a display panel 101, a supporting layer 102 and a static dissipation layer 103. The external driving circuit 20 includes a driving chip 201 and a flexible printed circuit board 202 bound and connected to the driving chip 201. The driving chip 201 can be a flip chip film. The flexible circuit board and the driving chip 201 are used to provide external signals. The external signals are transmitted to the driving circuit layer of the display substrate 10 through the second metal trace 302, the conductive trace 3031 and the first metal trace 301 to drive the light-emitting device layer of the display substrate 10 to emit light, thereby realizing picture display.

[0064] The step S1 comprises:

[0065] Providing a display substrate 10;

[0066] attaching the support layer 102 to a side of the display substrate 10 away from the first surface 1a; and

[0067] The static dissipation layer 103 is formed on a side of the support layer 102 away from the first surface 1 a .

[0068] Step S2: attaching the external driving circuit 20 to the side of the display substrate 10 away from the first surface 1 a , and forming the second metal trace 302 of the back binding structure 30 on the second surface 1 b .

[0069] Specifically, see Fig. 8A , the step S2 comprises:

[0070] forming the double-sided adhesive layer 104 on a side of the static dissipative layer 103 away from the first surface 1a; and

[0071] The external driving circuit 20 is attached to a side of the double-sided adhesive layer 104 away from the first surface 1 a .

[0072] Specifically, the first metal wiring 301 and the second metal wiring 302 are reversely attached.

[0073] Step S3: cutting the display substrate 10 and the external driving circuit 20 along a cutting line to form the side surface 1c.

[0074] Specifically, see Figure 8B The display substrate 10 and the external driving circuit 20 can be cut to a desired size along a cutting line by laser cutting or a knife wheel cutting process to expose the first metal wiring 301 and the second metal wiring 302 .

[0075] Step S4: forming a conductive layer 303 on the side surface 1c, wherein the conductive layer 303 comprises a plurality of conductive traces 3031 arranged at intervals, and two ends of the conductive traces 3031 are electrically connected to the first metal trace 301 and the second metal trace 302 respectively.

[0076] Specifically, see Figure 8C , Fig.8D and Fig. 8E , the step S4 further comprises the following steps:

[0077] forming a buffer layer 304 on the side surface 1c;

[0078] forming the conductive layer 303 on the buffer layer 304; and

[0079] The conductive layer 303 is patterned to form a plurality of conductive traces 3031 .

[0080] Specifically, the buffer layer 304 can be formed by a coating process. The buffer layer 304 is made of an insulating material with good fluidity. Optionally, the material of the buffer layer 304 includes at least one of epoxy resin, silicone, and acrylic resin.

[0081] The conductive traces 3031 can be formed by patterning the conductive layer 303 using one of the processes selected from the group consisting of laser etching, aerosol printing, inkjet printing, dispensing and pad printing. Compared with the yellow light process, the etching alkali solution used in the yellow light process can be prevented from corroding part of the material of the display module 1.

[0082] It can be understood that the display module 1 in the present invention is formed by laminating and stacking the display panel 101, the support layer 102, the static dissipation layer 103, the double-sided adhesive layer 104, the external driving circuit 20, the first metal wiring 301 and the second metal wiring 302. After the stacked layer is cut, the conductive layer 303 connecting the first metal wiring 301 and the second metal wiring 302 is formed. Only one bonding process is required for the conductive layer 303 and the first metal wiring 301 and the second metal wiring 302, and no secondary bonding process is required for the external driving circuit 20. Therefore, the process steps can be reduced, which is beneficial to reducing costs. In addition, since there is no need to use anisotropic conductive adhesive, the display module 1 in the present invention is not affected by high temperature and high pressure bonding conditions, which is beneficial to improving the yield.

[0083] The beneficial effects are as follows: the display module and the preparation method thereof provided by the embodiments of the present invention, by setting a conductive layer on the side of the display module, the conductive layer includes a plurality of conductive traces arranged at intervals, and the two ends of the conductive traces directly connect the first metal trace and the second metal trace through a single bonding process. Since the first metal trace is located on the first surface of the display substrate and the second metal trace is located on the second surface of the external drive circuit, and the second surface is the side surface of the external drive circuit away from the display substrate, the conductive trace can directly connect the display substrate and the external drive circuit without connecting the external drive circuit to the conductive trace through a secondary bonding process, thereby reducing the process steps and helping to reduce costs. In addition, compared with the prior art, the display module in the present invention is not affected by the high temperature and high pressure bonding conditions, which is helpful to improve the yield.

[0084] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A display module, characterized in that: The display module comprises a first surface, a second surface and a side surface connecting the first surface and the second surface; the display module comprises: A display substrate, wherein the first surface is a display surface of the display substrate; an external driving circuit, disposed on a side of the display substrate away from the first surface, the second surface being a side surface of the external driving circuit away from the display substrate; and a back binding structure, used to connect the display substrate and the external driving circuit, the back binding structure comprising a first metal trace, a second metal trace and a conductive layer, the first metal trace is located on the first surface, the second metal trace is located on the second surface, the conductive layer is located on the first surface, the second surface and the side surface, the conductive layer comprises a plurality of conductive traces arranged at intervals, and two ends of the conductive trace are electrically connected to the first metal trace and the second metal trace respectively; The external driving circuit includes a flexible printed circuit board and a driving chip, the flexible printed circuit board is arranged on the side of the display substrate away from the first surface, the driving chip and the second metal trace are located on the side of the flexible printed circuit board away from the first surface, the conductive trace is at least attached to the side of the second metal trace away from the flexible printed circuit board, and the second metal trace is a pad of the external driving circuit.

2. The display module according to claim 1, characterized in that: The conductive trace covers part or all of a side surface of the first metal trace away from the first surface, and the conductive trace covers part or all of a side surface of the second metal trace away from the second surface.

3. The display module according to claim 1, characterized in that: The back-binding structure further includes a buffer layer, and the buffer layer is arranged between the side surface and the conductive layer.

4. The display module according to claim 3, characterized in that: The material of the buffer layer is an insulating material, and the material of the buffer layer includes at least one of epoxy resin, silicone, and acrylic resin.

5. The display module according to any one of claims 1 to 4, characterized in that: The display module also includes a third surface and a fourth surface, the third surface connects the first surface and the side surface, the fourth surface connects the second surface and the side surface, chamfers or rounded corners are formed between the third surface and the first surface, and between the fourth surface and the second surface, and the conductive trace extends from the first surface through the third surface to the side surface, and extends from the side surface through the fourth surface to the second surface.

6. The display module according to claim 1, characterized in that: The spacing between two adjacent first metal traces is equal to the spacing between two adjacent second metal traces, and the spacing between two adjacent first metal traces is equal to the spacing between two adjacent conductive traces.

7. The display module according to claim 1, characterized in that: The material of the conductive layer includes one of conductive silver paste, copper, aluminum and carbon-based materials.

8. The display module according to claim 1, characterized in that: The display substrate comprises: A display panel, wherein the first surface is a display surface of the display panel; a supporting layer, disposed on a side of the display panel away from the first surface; and A static dissipation layer is disposed on a side of the support layer away from the first surface; The external driving circuit is arranged on a side of the static dissipative layer away from the first surface, and a double-sided adhesive layer is arranged between the static dissipative layer and the external driving circuit for adhering the static dissipative layer and the external driving circuit.

9. A method for preparing a display module, characterized in that: The following steps are involved: A display substrate and an external driving circuit are provided, wherein the display surface of the display substrate is the first surface of the display module, the surface of the external driving circuit on the side away from the display substrate is the second surface of the display module, the side surface of the display module connects the first surface and the second surface, and the first metal trace of the back binding structure is formed on the first surface; The external driving circuit is attached to a side of the display substrate away from the first surface, and the second metal wiring of the back binding structure is formed on the second surface; Cutting the display substrate and the external driving circuit along a cutting line to form the side surface; as well as forming a conductive layer on the first surface, the second surface and the side surface, wherein the conductive layer comprises a plurality of conductive traces arranged at intervals, and two ends of the conductive traces are electrically connected to the first metal trace and the second metal trace respectively; The external driving circuit includes a flexible printed circuit board and a driving chip, the flexible printed circuit board is arranged on the side of the display substrate away from the first surface, the driving chip and the second metal trace are located on the side of the flexible printed circuit board away from the first surface, the conductive trace is at least attached to the side of the second metal trace away from the flexible printed circuit board, and the second metal trace is a pad of the external driving circuit.

10. The method for preparing a display module according to claim 9, characterized in that: The conductive traces are formed by patterning the conductive layer using one of a laser etching process, an aerosol printing process, an inkjet printing process, a dispensing process, and a pad printing process.

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